LG KF510 Service Manual

Date: May, 2008 / Issue 1.0

Service Manual

Model : KF510

Service Manual

KF510

Internal Use Only

LGE Internal Use Only

- 3 -

* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KF510.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

S.J.CHOI 4/10 0.1

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1. INTRODUCTION .....................................7

1.1 Purpose .......................................................... 7

1.2 Regulatory Information.................................... 7

1.3 ABBREVIATION.............................................. 9

2. PERFORMANCE...................................11

2.1 H/W Features.................................................11

2.2 Technical specification...................................12

3. TECHNICAL BRIEF ..............................19

3.1 KF510 Functional Block diagram... ................19

3.2 Baseband Processor (BBP) Introduction .......20

3.3 Power management IC ..................................30

3.4 Power ON/OFF ..............................................36

3.5 SIM & uSD interface.......................................38

3.6 Memory ..........................................................40

3.7 LCD Display ...................................................41

3.8 Keypad Switching & Scanning .......................43

3.9 Keypad back-light illumination........................45

3.10 LCD back-light illumination...........................46

3.11 ALC ..............................................................48

3.12 Battery current consumption monitor ...........49

3.13 JTAG & ETM interface connector ................50

3.14 Audio............................................................51

3.15 Multi port switch ...........................................53

3.16 Charging circuit.............................................54

3.17 FM radio & BLUETOOTH.............................55

3.18 Touch PAD...................................................58

3.19 18pin Multi Media Interface connector .........60

3.20 General Description .....................................62

3.21 Receiver part................................................65

3.22 Transmitter part............................................66

3.23 RF synthesizer .............................................67

3.24 VCTCXO ......................................................67

3.25 Front End Module control.............................68

3.26 Power Amplifier Module ...............................69

3.27 Mode Selection ............................................70

3.28 PAM Schematic............................................70

4. PCB layout............................................71

4.1 Main & Sub PCB component placement........71

5. Trouble shooting..................................75

5.1 Trouble shooting test setup............................75

5.2 Power on Trouble...........................................76

5.3 Charging trouble.............................................80

5.4 LCD display trouble........................................83

5.5 Camera Trouble .............................................85

5.6 Receiver & Speaker trouble ...........................87

5.7 Microphone trouble ........................................90

5.8 Vibrator trouble...............................................92

5.9 Keypad back light trouble...............................94

5.10 SIM & uSD trouble .......................................96

5.11 Touch pad trouble ........................................99

5.12 Trouble Shooting of Receiver Part.............101

5.13 Trouble Shooting of Transmitter Part.........107

6. Download & S/W upgrade .....................115

6.1 S/W download setup ....................................115

6.2 Download program user guide.....................116

7. Block Diagram....................................121

8. CIRCUIT DIAGRAM ............................123

9. BGM PIN MAP.....................................131

10. PCB LAYOUT....................................133

11. RF Calibration...................................143

11.1 Test Equipment Setup................................143

11.2 Calibration Step..........................................143

12. Stand-alone Test ..............................148

12.1 Test Program Setting .................................148

12.2 Tx Test .......................................................150

12.3 Rx Test.......................................................151

13. ENGINEERING MODE......................152

14. EXPLODED VIEW & REPLACEMENT

PART LIST.........................................153

14.1 Exploded View ...........................................153

14.2 Replacement Parts.....................................155

14.3 Accessory.................................................. 175

Table Of Contents

- 6 -

LGE Internal Use Only

Only for training and service purposes

- 7 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the KF510.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges you’re your telecommunications

services. System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. LGE

does not warrant that this product is immune from the above case but will prevent unauthorized use of

common-carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure.

If these changes could reasonably be expected to affect the use of the KF600 or compatibility with the

network, the telephone company is required to give advanced written notice to the user, allowing the

user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KF510 must be performed only at the LGE or its authorized agents.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 8 -

1. INTRODUCTION

E. Notice of Radiated Emissions

The KF510 complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

An KF510 may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.

Following information is ESD handling: Service personnel should ground themselves by using a wrist

strap when exchange system boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective

packages until these are used. When returning system boards or parts such as EEPROM to the

factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 9 -

1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

- 10 -

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

- 11 -

2. GENERAL PERFORMANCE

2.1 H/W Feature

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-ion, 800mAh

AVG TCVR Current 255mA typ @PL5

Standby Current 1.8mA typ @PP9

Talk time 3 hours (GSM TX Level 5)

Standby time Over 350 hours (Paging Period: 9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM : -105dBm↓, DCS/PCS : -105dBm↓

TX output power EGSM : 32.5dBm (@PL 5)

DCS/PCS: 30/29.5dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 320 pixels, 2.2” QVGA, 265K color,TFT

Status Indicator Navi, Send, Call End, Back and etc.

Key are implemented by touchpad.

CLEAR, SEND, END/PWR, MP3, AF/Camera double action,

Volume Up, Volume Down, Lock

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Data Kit, Data CD

- 12 -

2. GENERAL PERFORMANCE

2.2 Technical specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x n MHz

RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

1Frequency Band

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)

RX: TX + 80MHz

2 Phase Error

RMS < 5 degrees

Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

12 19 dBm 3dB

4 Power Level DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

- 13 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

EGSM

8Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

- 15 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(26 MHz) tolerance

19 32.768KHz tolerance 30ppm

Standby

20 Power consumption

- Normal 2 mA(@PP9)

21 Talk Time

EGSM/Lvl 5 (Battery Capacity 800mA):180 min EGSM/Lvl10(Battery Capacity 800 mA):300min Under conditions, at least 300 hours:

1. Brand new and full 800mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off. At least 65 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Current

Fast Charge : < 500 mA Slow Charge: < 100 mA

Antenna Bar Number Power

7>-92 dBm ~

5 -97dBm ~ -93dBm

25 Antenna Display

4 -100dBm ~ -98dBm

2 -103dBm ~ -101dBm

1 -105dBm ~ -104dBm

0< -106 dBm

Off No Service

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 16 -

Item Description Specification

Battery Bar Number Voltage( 0.05V)

3 3.69V ~ 4.2V

26 Battery Indicator 2 3.53V ~ 3.69V

1 3.43V ~ 3.53V

0 3.30V ~ 3.43V

27 Low Voltage Warning

3.48V ↓ 0.05V (Call)

3.43V ↓ 0.05V (Standby)

28 Forced shut down Voltage 3.3 0.05 V

Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

30 Travel Charger Input: 100 ~ 240 V, 50/60Hz

Out put: 5.1V, 0.7A

LGE Internal Use Only

2. GENERAL PERFORMANCE

- 17 -

* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15% 4Origin Offset Suppression ≥ 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm 3dB 13 17dBm 3dB

6 27dBm 3dB 14 15dBm 3dB

7 27dBm 3dB 15 13dBm 3dB

8 27dBm 3dB 16 11dBm 5dB

9 25dBm 3dB 17 9dBm 5dB

10 23dBm 3dB 18 7dBm 5dB

11 21dBm 3dB 19 5dBm 5dB

5 Power Level 12 19dBm 3dB

DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm 3dB 8 14 dBm 3dB

1 26/25dBm 3dB 9 12 dBm 4dB

2 26/25dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

6 Output RF Spectrum GSM900/EGSM

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 18 -

Item Description Specification

6 Output RF Spectrum DCS1800/PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

7 Output RF Spectrum GSM900/EGSM

(due to switching transient) Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 --30

DCS1800/PCS1900

Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 -30

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.1 KF510 Functional Block diagram

The functional component arrangement is mentioned below diagram.

3. TECHNICAL BRIEF

Figure 2 KF510 Functional block diagram

- 20 -

3. TECHNICAL BRIEF

3.2 Baseband Processor (BBP) Introduction

3.2.1 General Description

S-GOLD3™ is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital

functionality of a cellular radio. Additionally S-GOLD3™ Provides multimedia extensions such as

camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and

mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

LGE Internal Use Only

Only for training and service purposes

Figure 3 Top level block diagram of the S-GOLD3™ (PMB8877)

- 21 -

3. TECHNICAL BRIEF

3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

LGE Internal Use Only

- 22 -

3. TECHNICAL BRIEF

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 1 Serial Synchronous SPI compatible interfaces in the controller domain

- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain

- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller supporting IrDA’s SIR standard (up to 115.2Kbps)

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)

3.2.3 External Devices connected to memory interface

Table 1. Memory interface

3.2.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF

ICs Periodically each TDMA frame.

Table 2. RF Interface Spec

.

LGE Internal Use Only

Only for training and service purposes

Device Name Maker Remark

NAND FLASH K5E1H12ACM-D075 Samsung Synchronous / A synchronous

SDRAM K5E1H12ACM-D075 Samsung Synchronous 133MHz

LCD IM220DBN8A LGIT 16bit access

CAMERA C3AA-M197B LGIT 8bit data Interface

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 FE2 FEM control

T_OUT2 PA_BAND TX RF band select

T_OUT3 FE1 FEM control

T_OUT4 Other operation -

T_OUT5 Other operation -

T_OUT6 PA MODE PAM Mode select

- 23 -

3. TECHNICAL BRIEF

3.2.5 USART Interface

KF510 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : MON used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3. USIF Interface Spec.

3.2.6 ADC channel

BBP ADC block is composed of 7 external ADC channel. This block operates charging process and

other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

LGE Internal Use Only

Resource Name Remark

USIF1

USIF1_TXD UART_TX Transmit Data

USIF1_RXD UART_RX Receive Data

USIF1_CTS USB_DP

USIF1_RTS USB_DM

USIF2

USIF2_TXD MON_TX Trace data tx

USIF2_RXD MON_RX Trace data rx

USIF2_CTS BT_CTS

USIF2_RTS BT_RTS.

USIF3

USIF3_TXD BT_TX BT Transmit tx

USIF3_RXD BT_RX BT Receive rx

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 REMOTE_ADC Remote Control

M3 JACK_TYPE Accessory type detect

M4 FB_KEY ALC Feedback Voltage

M5 BAND SELECTION 850,900 band selection

M6 N.C

M7 ICLD S-Gold H/W version detect

M8 VSUPPLY Battery supply voltage measure

M9 LOAD Current consumption measure

M10 N.C

3.2.7 GPIO map

Over a hundred allowable resources, KF510 is using as follows except dedicated to SIM and Memory.

KF600 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

Table 5 S-Gold3 GPIO pin Map

- 24 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 KP_IN(0)

KP_IN1 KP_IN(1)

KP_IN2 KP_IN(2)

KP_IN3 KP_IN(3)

KP_IN4 KP_IN(4)

KP_IN5 KP_IN(5)

KP_OUT5 KP_OUT(5)

KP_OUT0 KP_OUT(0)

KP_OUT1 KP_OUT(1)

KP_OUT2 KP_OUT(2)

KP_OUT3 KP_OUT(3)

USIF1

USIF1_RXD RXD UART, RS232 Data

USIF1_TXD TXD UART, RS232 Data

USIF1_RTS_N USB_DP USB Data

USIF1_CTS_N USB_DM USB Data

USIF2

USIF2 _RXD Not used

USIF2 _TXD Not used

USIF2_RTS_N BT_RTS Bluetooth RTS

USIF2_CTS_N BT_CTS Bluetooth CTS

USIF3

USIF3 _RXD BT_RXD Bluetooth RX

USIF3 _TXD BT_TXD Bluetooth TX

CLK

CLK32K CLK32k For FM Radio, BT CLK32K

GPIO_22 Not used

CAMERA I/F

CIF_D0 CIF_D(0) Camera DATA[0]

CIF_D1 CIF_D(1) Camera DATA[1]

CIF_D2 CIF_D(2) Camera DATA[2]

CIF_D3 CIF_D(3) Camera DATA[3]

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

CIF_D4 CIF_D(4) Camera DATA[4]

CIF_D5 CIF_D(5) Camera DATA[5]

CIF_D6 CIF_D(6) Camera DATA[6]

CIF_D7 CIF_D(7) Camera DATA[7]

CIF_PCLK CIF_PCLK Camera pixel clock

CIF_HSYNC CIF_HS Camera H sync

CIF_VSYNC CIF_VS Camera V sync

CLKOUT CIF_MCLK Camera main clock

CIF_PD CIF_PD Camera power down(active high)

CIF_RESET CIF_RESET Camera reset

LCD I/F

DIF_D0 DIF_D(0) LCD data[0]

DIF_D1 DIF_D(1) LCD data[1]

DIF_D2 DIF_D(2) LCD data[2]

DIF_D3 DIF_D(3) LCD data[3]

DIF_D4 DIF_D(4) LCD data[4]

DIF_D5 DIF_D(5) LCD data[5]

DIF_D6 DIF_D(6) LCD data[6]

DIF_D7 DIF_D(7) LCD data[7]

DIF_D8 DIF_D(8) LCD data[8]

DIF_CS1 DIF_MAIN_CS MAIN LCD chip select

DIF_CS2 DIF_SUB_CS SUB LCD chip select

DIF_CD DIF_CD Command Data switch

DIF_WR DIF_WR LCD Write

EINT7 HOOK_DETECT Ear-Mic hook detection

DIF_RESET1 DIF_RESET LCD Reset

GPIO_108 CAM_LDO_EN For CAM Core 1.8V, 2.8V LDO

I2C

I2C_SCL SCL For FM/BT/Amp/Camera

I2C_SDA SDA For FM/BT/Amp/Camera

PM_INT (EINT) PM_INT

SIM I/F

CC_IO SIM_IO SIM CARD I/O

CC_CLK SIM_CLK SIM CARD CLOCK

CC_RST SIM_RST SIM CARD RESET

I2S2

I2S2_CLK0 Not used

GPIO_102 _ WP Not used

I2S2_RX Not used

I2S2_TX Not used

I2S2_WA0 Not used

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

GPIO_103 Not used

External Memory

MMCI_CMD TF_CMD T-flash

MMCI_DAT[0] TF_DAT0 T-flash

MMCI_CLK TF_CLK T-flash

GPIO_109 USB_EOC USB End of charging detect (High: EOC, Low: charging)

IrDA

GPIO_110 RPWRON Remote power on detect (High: Remote, Low: Normal)

GPIO_109 SPK_RCV_SEL Audio pass select(high: Speaker, Low: Receiver)

I2S1

I2S1_CLK0 I2S1_CLK For Bluetooth

GPTU0_0 FLASH_EN For Camera Flash LED

I2S1_RX I2S1_RX For Bluetooth

I2S1_TX I2S1_TX For Bluetooth

I2S1_WA0 I2S1_WA For Bluetooth

External Memory

MMCI_DAT[1] TF_DAT1 T-flash

MMCI_DAT[2] TF_DAT2 T-flash

MMCI_DAT[3] TF_DAT3 T-flash

Audio I/F

EPN1 RCV_N For Receiver

EPP1 RCV_P For Receiver

EPPA1 BBP_SND_L For Speaker

EPREF Reference

EPPA2 BBP_SND_R For Speaker

MICN1 MIC1_N For Mic

MICP1 MIC1_P For Mic

MICN2 MIC2_N For Headset Mic

MICP2 MIC2_P For Headset Mic

VMICP VMICP Power for MIC

VMICN VMICN Power for MIC

ADC

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 REMOTE_ADC Remote Control

M3 JACK_TYPE Accessory type detect

M7 H/W VERSION S-Gold H/W version detect

M8 VSUPPLY Battery supply voltage measure

M9 I_MONITOR Current consumption measure

M10 N.C

Reference

VREF

IREF

JTAG I/F

TDO TDO JTAG

TDI TDI JTAG

TMS TMS JTAG

TCK TCK JTAG

TRST_n _TRST JTAG

RTCK RTCK JTAG

ETM I/F

TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell)

MON1 MON1 ETM

MON2 MON2 ETM

TRACESYNC TRACESYNC ETM

TRACECLK TRACECLK ETM

PIPESTAT[2] PIPESTAT2 ETM

PIPESTAT[1] PIPESTAT1 ETM

PIPESTAT[0] PIPESTAT0 ETM

TRACEPKT[0] TRACEPKT(0) ETM

TRACEPKT[1] TRACEPKT(1) ETM

TRACEPKT[2] TRACEPKT(2) ETM

TRACEPKT[3] TRACEPKT(3) ETM

TRACEPKT[4] TRACEPKT(4) ETM

TRACEPKT[5] TRACEPKT(5) ETM

TRACEPKT[6] TRACEPKT(6) ETM

TRACEPKT[7] TRACEPKT(7) ETM

Memory

MEM_AD[0] D(0)

MEM _AD[1] D(1)

MEM _AD[2] D(2)

MEM _AD[3] D(3)

MEM _AD[4] D(4)

MEM _AD[5] D(5)

MEM _AD[6] D(6)

MEM _AD[7] D(7)

MEM _AD[8] D(8)

MEM _AD[9] D(9)

MEM _AD[10] D(10)

MEM _AD[11] D(11)

MEM _AD[12] D(12)

MEM _AD[13] D(13)

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 28 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM _AD[14] D(14)

MEM _AD[15] D(15)

MEM _WR_n _WR

MEM _RD_n _RD

MEM _BC0_n _BC0

MEM _BC1_n _BC1

MEM _A[0] A(0)

MEM _A[1] A(1)

MEM _A[2] A(2)

MEM _A[3] A(3)

MEM _A[4] A(4)

MEM _A[5] A(5)

MEM _A[6] A(6)

MEM _A[7] A(7)

MEM _A[8] A(8)

MEM _A[9] A(9)

MEM _A[10] A(10)

MEM _A[11] A(11)

MEM _A[12] A(12)

MEM _A[13] A(13)

MEM _A[14] A(14)

MEM _A[15] A(15)

MEM _A[16] A(16)

MEM _A[17] A(17)

MEM _A[18] A(18)

MEM _A[19] A(19)

MEM _A[20] A(20)

MEM _A[21] A(21)

MEM _A[22] A(22)

MEM _A[23] A(23)

MEM _A[24] A(24)

MEM _CS0_n _FLASH1_CS INTEL NOR (64MB)

MEM _CS1_n _RAM_CS INTEL SDRAM (64MB)

MEM _CS2_n _FLASH2_CS Not used

MEM _CS3_n _CS3 Not used

MEM _ADV_n _ADV

MEM _RAS_n _RAS

MEM _CAS_n _CAS

MEM _WAIT_n _WAIT

MEM _SDCLKO SDCLKO For Burst mode

MEM _SDCLKI SDCLKI For Burst mode

- 29 -

3. TECHNICAL BRIEF

LGE Internal Use Only

MEM _BFCLKO BFCLKO For Burst mode

MEM _BFCLKI BFCLKI For Burst mode

MEM _CKE CKE

Memory

FCDP_RBn FCDP

TDMA I/F

T_OUT0 TXON_PA PAM

GPIO_44 VIB_EN

T_OUT2 PA_BAND PAM

T_OUT3 ANT_SW1

T_OUT4 ANT_SW2

T_OUT5 ANT_SW3

T_OUT6 MODE PAM

KP_OUT4 KP_OUT(4)

EINT7 JACK_DETECT

CC1CC3IO LCD_BACKLIGHT LCD Backlight control

GPIO_53 LCD_ID LCD ID check

GPIO_54 _FM_RESET

RF I/F

RF_STR0 RF_EN

CC1CC5IO SLIDE_DETECT Slide on/off detection

RF_DATA RF_DA

RF_CLK RF_CLK

System Port

AFC AFC

CLKOUT0[<=26MHz] Not used

F26M 26MHZ_MCLK 26M Main Clock

F32K to 32k crystal

OSC32K to 32k crystal

RESET_n _RESET

TRIG_OUT TRIG_OUT

RTC_OUT RTC_OUT

VCXO_EN VCXO_EN

DSP

GPIO_61 _BT_RESET

GPIO_62 SLED_BACKLIGHT Navi key LED Backlight Control

GPIO_63 _SIM_EN

- 30 -

3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-

GOLD baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

LGE Internal Use Only

Only for training and service purposes

- 31 -

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized

functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two

linear regulators

- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone

functions (e.g. organizer functions, games, MP3 decoding) possible.

- SDBB has high efficiency up to 95% and also a power save mode.

- Memory Interface is directly supported by the SDBB

- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the

linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase

the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up

withpower being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of

8 Ohm for usage in hands-free phones and for ringing

- 450 mW maximum output power

- adjustable gain

- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer

batteries

- Precharge current source with two current levels

- Constant current / constant voltage charging with 3 different termination voltages

- Programable charge current limitation for use with different batteries

- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage

charging phase

- Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

- Switch to supply USB pull-up resistor

- Mini-host pull down resistor functionality

- Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully

supports LED and Vibra Motor functionality

- no external components needed

- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM

dimming

- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation SM-

POWER offers several control functions

LGE Internal Use Only

LG KF510 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual