LG KF350 Service Manual

Service Manual

Date: October, 2008 / Issue 1.0

Service Manual

KF350

Model : KF350

LGE Internal Use Only

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* The information in this manual is subject to change without notice and should not be construed as a

commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KS360

Series.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

J.P.Kim Jul. 18. 2008 0.1 -

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LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

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1. INTRODUCTION ..........................7

1.1 Purpose ........................................... 7

1.2 Regulatory Information..................... 7

1.3 ABBREVIATION ............................... 9

2. PERFORMANCE ........................11

2.1 H/W Features ..................................11

2.2 Technical specification ....................12

3. TECHNICAL BRIEF ...................19

3.1 Baseband Processor (BBP)

Introduction......................................19

3.2 Power management IC ...................32

3.3 Power ON/OFF ...............................37

3.4 SIM & uSD interface........................38

3.5 Memory ...........................................40

3.6 LCD Display ....................................41

3.7 Keypad Switching & Scanning ........42

3.8 Keypad back-light illumination.........43

3.9 LCD back-light illumination..............44

3.10 ALC ...............................................46

3.11 JTAG & ETM interface connector..46

3.12 Audio .............................................47

3.13 Charging circuit .............................48

3.14 FM radio & BLUETOOTH..............49

3.15 18pin Multi Media Interface

connector.......................................52

3.16 General Description ......................55

3.17 Receiver part.................................57

3.18 Transmitter part.............................58

3.19 RF synthesizer ..............................59

3.20 DCXO............................................59

3.21 Front End Module control..............60

3.22 Power Amplifier Module ................61

3.23 Mode Selection .............................62

3.24 PAM Schematic .............................63

4. TROUBLE SHOOTING ..............64

4.1 Trouble shooting test setup.............64

4.2 Power on Trouble............................65

4.3 Charging trouble..............................68

4.4 LCD display trouble.........................70

4.5 Camera Troublez.............................72

4.6 Receiver & Speaker troublea ..........74

4.7 Microphone trouble .........................77

4.8 Vibrator trouble................................79

4.9 Keypad back light trouble................81

4.10 SIM & uSD trouble ........................83

4.11 Photo senser trouble .....................86

4.12 sideview LED trouble ....................87

4.13 Trouble shooting of Receiver part .88

4.14 Trouble shooting of Transmitter

part. ...............................................94

5. DOWNLOAD & S/W UPGRADE .103

6. BLOCK DIAGRAM ...................114

7. CIRCUIT DIAGRAM .................115

8. BGA PIN MAP ..........................123

9. PCB LAYOUT ...........................129

10. RF CALIBRATION..................143

10.1 Test Equipment Setup .................143

10.2 Calibration Step...........................143

11. STAND-ALONE TEST ............149

11.1 Test Program Setting...................149

11.2 Tx Test .........................................151

11.3 Rx Test.........................................152

12. EXPLODED VIEW & REPLACEMENT PART LIST .153

12.1 Exploded View.............................153

12.2 Replacement Parts......................155

12.3 Accessory....................................174

Table Of Contents

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LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the KF350.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KF350 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KF350 must be performed only at the LGE or its authorized agents. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

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1. INTRODUCTION

E. Notice of Radiated Emissions

The KF350 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An KF350 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

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LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

DCXO Digitally Controled Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

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2. GENERAL PERFORMANCE

2.1 H/W Feature

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-Polymer, 800mAh

AVG TCVR Current 270mA typ @PL5

Standby Current 2.3 mA typ @PP9

Talk time 3 hours (GSM TX Level 7)

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM : -105dBm↓, DCS/PCS: -105dBm↓

TX output power EGSM : 33dBm (@PL 5)

DCS/PCS: 30/29dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 320 pixels, 2” QVGA, 262K color

Status Indicator Hard icons. Key Pad

0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key, Menu Key, Clear Key, Back Key, Confirm Key, Send Key, Volume Key, PWR Key, Camera Key, Hot Key

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

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2. GENERAL PERFORMANCE

2.2 Technical specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

1Frequency Band

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810) RX: TX + 80MHz

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB 6 31 dBm 3dB 14 15 dBm 3dB 7 29 dBm 3dB 15 13 dBm 3dB 8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB 10 23 dBm 3dB 18 7 dBm 5dB 11 21 dBm 3dB 19 5 dBm 5dB 12 19 dBm 3dB

4 Power Level DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24 1,800 -27

7 Spurious Emissions Conduction, Emission Status

EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 2 -7 500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5 3,400 2 -10 4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB 15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3 0 33.7 7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(26 MHz) tolerance

19 32.768KHz tolerance 30ppm

Standby

20 Power consumption

- Normal 3 mA(@PP9)

21 Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min EGSM/Lvl12(Battery Capacity 800 mA):320min Under conditions, at least 300 hours:

1. Brand new and full 800mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off. At least 65 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Current

Fast Charge : < 400 mA Slow Charge: < 120 mA

Antenna Bar Number Power

7 >-92 dBm ~

7 → 5 -97dBm ~ -93dBm

25 Antenna Display

5 → 4 -100dBm ~ -98dBm 4 → 2 -103dBm ~ -101dBm 2 → 1 -105dBm ~ -104dBm 1 → 0< -106 dBm

Off No Service

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

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Item Description Specification

Battery Bar Number Voltage( 0.05V)

3 4.15V~4.25V

26 Battery Indicator 2 3.69V~3.79V

1 3.62V~3.72V

0 3.54V~3.64V

27 Low Voltage Warning

3.59V ↓ 0.05V (Call)

3.59V ↓ 0.05V (Standby)

28 Forced shut down Voltage 3.23 0.05 V

Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

30 Travel Charger Input: 150 ~ 240 V, 50/60Hz

Out put: 5.1, 0.4A

LGE Internal Use Only

2. GENERAL PERFORMANCE

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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15% 4Origin Offset Suppression ≥ 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm 3dB 13 17dBm 3dB 6 27dBm 3dB 14 15dBm 3dB 7 27dBm 3dB 15 13dBm 3dB 8 27dBm 3dB 16 11dBm 5dB

9 25dBm 3dB 17 9dBm 5dB 10 23dBm 3dB 18 7dBm 5dB 11 21dBm 3dB 19 5dBm 5dB

5 Power Level 12 19dBm 3dB

DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm 3dB 8 14 dBm 3dB

1 26/25dBm 3dB 9 12 dBm 4dB

2 26/25dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

6 Output RF Spectrum GSM900/EGSM

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5 200 -30 250 -33 400 -54

600 ~ <1,200 -60 1,200 ~ <1,800 -60 1,800 ~ <3,000 -63 3,000 ~ <6,000 -65

6,000 -71

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 18 -

Item Description Specification

6 Output RF Spectrum DCS1800, PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

7 Output RF Spectrum GSM900/EGSM

(due to switching transient) Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 --30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 -30

LGE Internal Use Only

3. TECHNICAL BRIEF

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3.1 Baseband Processor (BBP) Introduction

3. TECHNICAL BRIEF

Figure 1 Top level block diagram of the S-GOLD3TM (PMB8877)

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3. TECHNICAL BRIEF

3.1.1 General Description

S-GOLD3TMis a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD3TMProvides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding. S-GOLD3TMsupport multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

3.1.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

LGE Internal Use Only

Only for training and service purposes

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3. TECHNICAL BRIEF

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 3 USIF with autobaud detection, hardware flow control and integrated

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.1.3 External Devices connected to memory interface

Table 1. Memory interface

3.1.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs Periodically each TDMA frame. Table 2. RF Interface Spec.

LGE Internal Use Only

Only for training and service purposes

Device Name Maker Remark

FLASH K5E1G12ACA-D075 Samsung Synchronous / A synchronous

DDR K5E1G12ACA-D075 Samsung Synchronous 133MHz

LCD IM200DST2A LGIT 8bit access 2 times transmission

Melody IC Not Used S/W Infineon Software CODEC

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 Other function -

T_OUT2 PA_BAND TX RF band select

T_OUT3 ANT_SW1 FEM control

T_OUT4 ANT_SW2 FEM control

T_OUT5 ANT_SW3 FEM control

T_OUT6 MODE PAM Mode select

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3. TECHNICAL BRIEF

3.1.5 USIF Interface

KF350 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3. USIF Interface Spec.

3.1.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

LGE Internal Use Only

Resource Name Remark USIF1

USIF1_TXD TXD Transmit Data USIF1_RXD RXD Receive Data USIF1_CTS USB_DP USIF1_RTS USB_DM

USIF2

USIF2_TXD NC NC USIF2_RXD NC NC USIF2_CTS BT_CTS USIF2_RTS BT_RTS.

USIF3

USIF3_TXD BT_TX BT Transmit tx USIF3_RXD BT_RX BT Receive rx

ADC channel

Resource Interconnection Description M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 N.C M3 JACK_TYPE Accessory type detect M4 N.C M5 H/W VERSION S-Gold3 H/W version detect M6 N.C M7 N.C M8 VSUPPLY Battery supply voltage measure M9 N.C M10 N.C

3.1.7 GPIO map

Over a hundred allowable resources, KF350 is using as follows except dedicated to SIM and Memory. KF350 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

Table 5 S-Gold3 GPIO pin Map

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 KP_IN(0) KP_IN1 KP_IN(1) KP_IN2 KP_IN(2) KP_IN3 KP_IN(3) KP_IN4 KP_IN(4) KP_IN5 KP_IN(5) KP_OUT5 KP_OUT(5) KP_OUT0 KP_OUT(0) KP_OUT1 KP_OUT(1) KP_OUT2 KP_OUT(2) KP_OUT3 KP_OUT(3) USIF1 USIF1_RXD RXD UART, RS232 Data USIF1_TXD TXD UART, RS232 Data USIF1_RTS_N USB_DP USB Data USIF1_CTS_N USB_DM USB Data USIF2 USIF2 _RXD Not used USIF2 _TXD Not used USIF2_RTS_N BT_RTS Bluetooth RTS USIF2_CTS_N BT_CTS Bluetooth CTS USIF3 USIF3 _RXD BT_RXD Bluetooth RX USIF3 _TXD BT_TXD Bluetooth TX CLK CLK32K CLK32k For FM Radio, BT CLK32K GPIO_22 Not used

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

CAMERA I/F CIF_PCLK CAM_PCLK Camera pixel clock CIF_HSYNC CAM_HS Camera H sync CIF_VSYNC CAM_VS Camera V sync CLKOUT2 CAM_MCLK Camera main clock CIF_PD_GPIO CAM_PWDN Camera sensor power down CIF_RESET_GPIO CAM_RST Camera reset #Display_Interface CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5) Camera DATA[5] CIF_D6 CIF_D(6) Camera DATA[6] CIF_D7 CIF_D(7) Camera DATA[7] CIF_PCLK CIF_PCLK Camera pixel clock CIF_HSYNC CIF_HS Camera H sync CIF_VSYNC CIF_VS Camera V sync CLKOUT CIF_MCLK Camera main clock CIF_PD CIF_PD Camera power down(active high) CIF_RESET CIF_RESET Camera reset LCD I/F DIF_D0 DIF_D(0) LCD data[0] DIF_D1 DIF_D(1) LCD data[1] DIF_D2 DIF_D(2) LCD data[2] DIF_D3 DIF_D(3) LCD data[3] DIF_D4 DIF_D(4) LCD data[4] DIF_D5 DIF_D(5) LCD data[5] DIF_D6 DIF_D(6) LCD data[6] DIF_D7 DIF_D(7) LCD data[7] DIF_D8 DIF_D(8) LCD data[8] DIF_CS1 DIF_MAIN_CS MAIN LCD chip select DIF_CS2 DIF_SUB_CS SUB LCD chip select DIF_CD DIF_CD Command Data switch

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

DIF_WR DIF_WR LCD Write EINT7 HOOK_DETECT Ear-Mic hook detection DIF_RESET1 DIF_RESET LCD Reset GPIO_108 CAM_LDO_EN For CAM Core 1.8V, 2.8V LDO I2C I2C_SCL SCL For FM/BT/Amp/Camera I2C_SDA SDA For FM/BT/Amp/Camera PM_INT (EINT) PM_INT SIM I/F CC_IO SIM_IO SIM CARD I/O CC_CLK SIM_CLK SIM CARD CLOCK CC_RST SIM_RST SIM CARD RESET I2S2 I2S2_CLK0 Not used GPIO_102 _WP Not used I2S2_RX Not used I2S2_TX Not used I2S2_WA0 Not used GPIO_103 Not used External Memory MMCI_CMD TF_CMD T-flash MMCI_DAT[0] TF_DAT0 T-flash MMCI_CLK TF_CLK T-flash GPIO_109 USB_EOC USB End of charging detect

(High: EOC, Low: charging) IrDA GPIO_110 RPWRON Remote power on detect

(High: Remote, Low: Normal) GPIO_109 SPK_RCV_SEL Audio pass select

(high: Speaker, Low: Receiver) I2S1 I2S1_CLK0 I2S1_CLK For Bluetooth GPTU0_0 FLASH_EN For Camera Flash LED I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX For Bluetooth I2S1_WA0 I2S1_WA For Bluetooth

External Memory MMCI_DAT[1] TF_DAT1 T-flash MMCI_DAT[2] TF_DAT2 T-flash MMCI_DAT[3] TF_DAT3 T-flash Audio I/F EPN1 RCV_N For Receiver EPP1 RCV_P For Receiver EPPA1 BBP_SND_L For Speaker EPREF Reference EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic MICP1 MIC1_P For Mic MICN2 MIC2_N For Headset Mic MICP2 MIC2_P For Headset Mic VMICP VMICP Power for MIC VMICN VMICN Power for MIC ADC M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 REMOTE_ADC Remote Control M3 JACK_TYPE Accessory type detect M7 H/W VERSION S-Gold2 H/W version detect M8 VSUPPLY Battery supply voltage measure M9 I_MONITOR Current consumption measure M10 N.C Reference VREF IREF JTAG I/F TDO TDO JTAG TDI TDI JTAG TMS TMS JTAG TCK TCK JTAG TRST_n _TRST JTAG RTCK RTCK JTAG

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 28 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

ETM I/F TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell) MON1 MON1 ETM MON2 MON2 ETM TRACESYNC TRACESYNC ETM TRACECLK TRACECLK ETM PIPESTAT[2] PIPESTAT2 ETM PIPESTAT[1] PIPESTAT1 ETM PIPESTAT[0] PIPESTAT0 ETM TRACEPKT[0] TRACEPKT(0) ETM TRACEPKT[1] TRACEPKT(1) ETM TRACEPKT[2] TRACEPKT(2) ETM TRACEPKT[3] TRACEPKT(3) ETM TRACEPKT[4] TRACEPKT(4) ETM TRACEPKT[5] TRACEPKT(5) ETM TRACEPKT[6] TRACEPKT(6) ETM TRACEPKT[7] TRACEPKT(7) ETM Memory MEM_AD[0] D(0) MEM _AD[1] D(1) MEM _AD[2] D(2) MEM _AD[3] D(3) MEM _AD[4] D(4) MEM _AD[5] D(5) MEM _AD[6] D(6) MEM _AD[7] D(7) MEM _AD[8] D(8) MEM _AD[9] D(9) MEM _AD[10] D(10) MEM _AD[11] D(11) MEM _AD[12] D(12) MEM _AD[13] D(13) MEM _AD[14] D(14) MEM _AD[15] D(15) MEM _WR_n _WR

- 29 -

3. TECHNICAL BRIEF

LGE Internal Use Only

MEM _RD_n _RD MEM _BC0_n _BC0 MEM _BC1_n _BC1 MEM _A[0] A(0) MEM _A[1] A(1) MEM _A[2] A(2) MEM _A[3] A(3) MEM _A[4] A(4) MEM _A[5] A(5) MEM _A[6] A(6) MEM _A[7] A(7) MEM _A[8] A(8) MEM _A[9] A(9) MEM _A[10] A(10) MEM _A[11] A(11) MEM _A[12] A(12) MEM _A[13] A(13) MEM _A[14] A(14) MEM _A[15] A(15) MEM _A[16] A(16) MEM _A[17] A(17) MEM _A[18] A(18) MEM _A[19] A(19) MEM _A[20] A(20) MEM _A[21] A(21) MEM _A[22] A(22) MEM _A[23] A(23) MEM _A[24] A(24) MEM _CS0_n _FLASH1_CS INTEL NOR (64MB) MEM _CS1_n _RAM_CS INTEL SDRAM (64MB) MEM _CS2_n _FLASH2_CS Not used MEM _CS3_n _CS3 Not used MEM _ADV_n _ADV MEM _RAS_n _RAS MEM _CAS_n _CAS

- 30 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM _WAIT_n _WAIT MEM _SDCLKO SDCLKO For Burst mode MEM _SDCLKI SDCLKI For Burst mode MEM _BFCLKO BFCLKO For Burst mode MEM _BFCLKI BFCLKI For Burst mode MEM _CKE CKE Memory FCDP_RBn FCDP TDMA I/F T_OUT0 TXON_PA PAM GPIO_44 VIB_EN T_OUT2 PA_BAND PAM T_OUT3 ANT_SW1 T_OUT4 ANT_SW2 T_OUT5 ANT_SW3 T_OUT6 MODE PAM KP_OUT4 KP_OUT(4) EINT7 JACK_DETECT CC1CC3IO LCD_BACKLIGHT LCD Backlight control GPIO_53 LCD_ID LCD ID check GPIO_54 _FM_RESET RF I/F RF_STR0 RF_EN CC1CC5IO SLIDE_DETECT Folder on/off detection RF_DATA RF_DA RF_CLK RF_CLK System Port AFC AFC CLKOUT0 [<=26MHz] Not used F26M 26MHZ_MCLK 26M Main Clock F32K to 32k crystal OSC32K to 32k crystal RESET_n _RESET TRIG_OUT TRIG_OUT RTC_OUT RTC_OUT

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

VCXO_EN VCXO_EN DSP GPIO_61 _BT_RESET GPIO_62 SLED_BACKLIGHT Navi key LED Backlight Control GPIO_63 _SIM_EN