LG KF350 Service Manual

Service Manual

Date: October, 2008 / Issue 1.0

Service Manual

KF350

Model : KF350

LGE Internal Use Only

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* The information in this manual is subject to change without notice and should not be construed as a

commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KS360

Series.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

J.P.Kim Jul. 18. 2008 0.1 -

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LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

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1. INTRODUCTION ..........................7

1.1 Purpose ........................................... 7

1.2 Regulatory Information..................... 7

1.3 ABBREVIATION ............................... 9

2. PERFORMANCE ........................11

2.1 H/W Features ..................................11

2.2 Technical specification ....................12

3. TECHNICAL BRIEF ...................19

3.1 Baseband Processor (BBP)

Introduction......................................19

3.2 Power management IC ...................32

3.3 Power ON/OFF ...............................37

3.4 SIM & uSD interface........................38

3.5 Memory ...........................................40

3.6 LCD Display ....................................41

3.7 Keypad Switching & Scanning ........42

3.8 Keypad back-light illumination.........43

3.9 LCD back-light illumination..............44

3.10 ALC ...............................................46

3.11 JTAG & ETM interface connector..46

3.12 Audio .............................................47

3.13 Charging circuit .............................48

3.14 FM radio & BLUETOOTH..............49

3.15 18pin Multi Media Interface

connector.......................................52

3.16 General Description ......................55

3.17 Receiver part.................................57

3.18 Transmitter part.............................58

3.19 RF synthesizer ..............................59

3.20 DCXO............................................59

3.21 Front End Module control..............60

3.22 Power Amplifier Module ................61

3.23 Mode Selection .............................62

3.24 PAM Schematic .............................63

4. TROUBLE SHOOTING ..............64

4.1 Trouble shooting test setup.............64

4.2 Power on Trouble............................65

4.3 Charging trouble..............................68

4.4 LCD display trouble.........................70

4.5 Camera Troublez.............................72

4.6 Receiver & Speaker troublea ..........74

4.7 Microphone trouble .........................77

4.8 Vibrator trouble................................79

4.9 Keypad back light trouble................81

4.10 SIM & uSD trouble ........................83

4.11 Photo senser trouble .....................86

4.12 sideview LED trouble ....................87

4.13 Trouble shooting of Receiver part .88

4.14 Trouble shooting of Transmitter

part. ...............................................94

5. DOWNLOAD & S/W UPGRADE .103

6. BLOCK DIAGRAM ...................114

7. CIRCUIT DIAGRAM .................115

8. BGA PIN MAP ..........................123

9. PCB LAYOUT ...........................129

10. RF CALIBRATION..................143

10.1 Test Equipment Setup .................143

10.2 Calibration Step...........................143

11. STAND-ALONE TEST ............149

11.1 Test Program Setting...................149

11.2 Tx Test .........................................151

11.3 Rx Test.........................................152

12. EXPLODED VIEW & REPLACEMENT PART LIST .153

12.1 Exploded View.............................153

12.2 Replacement Parts......................155

12.3 Accessory....................................174

Table Of Contents

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LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the KF350.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KF350 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KF350 must be performed only at the LGE or its authorized agents. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

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1. INTRODUCTION

E. Notice of Radiated Emissions

The KF350 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An KF350 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

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1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

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LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

DCXO Digitally Controled Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

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2. GENERAL PERFORMANCE

2.1 H/W Feature

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-Polymer, 800mAh

AVG TCVR Current 270mA typ @PL5

Standby Current 2.3 mA typ @PP9

Talk time 3 hours (GSM TX Level 7)

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM : -105dBm↓, DCS/PCS: -105dBm↓

TX output power EGSM : 33dBm (@PL 5)

DCS/PCS: 30/29dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 320 pixels, 2” QVGA, 262K color

Status Indicator Hard icons. Key Pad

0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key, Menu Key, Clear Key, Back Key, Confirm Key, Send Key, Volume Key, PWR Key, Camera Key, Hot Key

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

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2. GENERAL PERFORMANCE

2.2 Technical specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

1Frequency Band

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810) RX: TX + 80MHz

2 Phase Error

RMS < 5 degrees Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB 6 31 dBm 3dB 14 15 dBm 3dB 7 29 dBm 3dB 15 13 dBm 3dB 8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB 10 23 dBm 3dB 18 7 dBm 5dB 11 21 dBm 3dB 19 5 dBm 5dB 12 19 dBm 3dB

4 Power Level DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24 1,800 -27

7 Spurious Emissions Conduction, Emission Status

EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 2 -7 500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5 3,400 2 -10 4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

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2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB 15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3 0 33.7 7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(26 MHz) tolerance

19 32.768KHz tolerance 30ppm

Standby

20 Power consumption

- Normal 3 mA(@PP9)

21 Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min EGSM/Lvl12(Battery Capacity 800 mA):320min Under conditions, at least 300 hours:

1. Brand new and full 800mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off. At least 65 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Current

Fast Charge : < 400 mA Slow Charge: < 120 mA

Antenna Bar Number Power

7 >-92 dBm ~

7 → 5 -97dBm ~ -93dBm

25 Antenna Display

5 → 4 -100dBm ~ -98dBm 4 → 2 -103dBm ~ -101dBm 2 → 1 -105dBm ~ -104dBm 1 → 0< -106 dBm

Off No Service

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

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Item Description Specification

Battery Bar Number Voltage( 0.05V)

3 4.15V~4.25V

26 Battery Indicator 2 3.69V~3.79V

1 3.62V~3.72V

0 3.54V~3.64V

27 Low Voltage Warning

3.59V ↓ 0.05V (Call)

3.59V ↓ 0.05V (Standby)

28 Forced shut down Voltage 3.23 0.05 V

Li-ion Battery

29 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

30 Travel Charger Input: 150 ~ 240 V, 50/60Hz

Out put: 5.1, 0.4A

LGE Internal Use Only

2. GENERAL PERFORMANCE

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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15% 4Origin Offset Suppression ≥ 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm 3dB 13 17dBm 3dB 6 27dBm 3dB 14 15dBm 3dB 7 27dBm 3dB 15 13dBm 3dB 8 27dBm 3dB 16 11dBm 5dB

9 25dBm 3dB 17 9dBm 5dB 10 23dBm 3dB 18 7dBm 5dB 11 21dBm 3dB 19 5dBm 5dB

5 Power Level 12 19dBm 3dB

DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm 3dB 8 14 dBm 3dB

1 26/25dBm 3dB 9 12 dBm 4dB

2 26/25dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

6 Output RF Spectrum GSM900/EGSM

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5 200 -30 250 -33 400 -54

600 ~ <1,200 -60 1,200 ~ <1,800 -60 1,800 ~ <3,000 -63 3,000 ~ <6,000 -65

6,000 -71

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 18 -

Item Description Specification

6 Output RF Spectrum DCS1800, PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

7 Output RF Spectrum GSM900/EGSM

(due to switching transient) Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 --30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 -30

LGE Internal Use Only

3. TECHNICAL BRIEF

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3.1 Baseband Processor (BBP) Introduction

3. TECHNICAL BRIEF

Figure 1 Top level block diagram of the S-GOLD3TM (PMB8877)

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3. TECHNICAL BRIEF

3.1.1 General Description

S-GOLD3TMis a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD3TMProvides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding. S-GOLD3TMsupport multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

3.1.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

LGE Internal Use Only

Only for training and service purposes

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3. TECHNICAL BRIEF

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 3 USIF with autobaud detection, hardware flow control and integrated

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.1.3 External Devices connected to memory interface

Table 1. Memory interface

3.1.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs Periodically each TDMA frame. Table 2. RF Interface Spec.

LGE Internal Use Only

Only for training and service purposes

Device Name Maker Remark

FLASH K5E1G12ACA-D075 Samsung Synchronous / A synchronous

DDR K5E1G12ACA-D075 Samsung Synchronous 133MHz

LCD IM200DST2A LGIT 8bit access 2 times transmission

Melody IC Not Used S/W Infineon Software CODEC

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 Other function -

T_OUT2 PA_BAND TX RF band select

T_OUT3 ANT_SW1 FEM control

T_OUT4 ANT_SW2 FEM control

T_OUT5 ANT_SW3 FEM control

T_OUT6 MODE PAM Mode select

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3. TECHNICAL BRIEF

3.1.5 USIF Interface

KF350 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3. USIF Interface Spec.

3.1.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

LGE Internal Use Only

Resource Name Remark USIF1

USIF1_TXD TXD Transmit Data USIF1_RXD RXD Receive Data USIF1_CTS USB_DP USIF1_RTS USB_DM

USIF2

USIF2_TXD NC NC USIF2_RXD NC NC USIF2_CTS BT_CTS USIF2_RTS BT_RTS.

USIF3

USIF3_TXD BT_TX BT Transmit tx USIF3_RXD BT_RX BT Receive rx

ADC channel

Resource Interconnection Description M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 N.C M3 JACK_TYPE Accessory type detect M4 N.C M5 H/W VERSION S-Gold3 H/W version detect M6 N.C M7 N.C M8 VSUPPLY Battery supply voltage measure M9 N.C M10 N.C

3.1.7 GPIO map

Over a hundred allowable resources, KF350 is using as follows except dedicated to SIM and Memory. KF350 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

Table 5 S-Gold3 GPIO pin Map

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3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN0 KP_IN(0) KP_IN1 KP_IN(1) KP_IN2 KP_IN(2) KP_IN3 KP_IN(3) KP_IN4 KP_IN(4) KP_IN5 KP_IN(5) KP_OUT5 KP_OUT(5) KP_OUT0 KP_OUT(0) KP_OUT1 KP_OUT(1) KP_OUT2 KP_OUT(2) KP_OUT3 KP_OUT(3) USIF1 USIF1_RXD RXD UART, RS232 Data USIF1_TXD TXD UART, RS232 Data USIF1_RTS_N USB_DP USB Data USIF1_CTS_N USB_DM USB Data USIF2 USIF2 _RXD Not used USIF2 _TXD Not used USIF2_RTS_N BT_RTS Bluetooth RTS USIF2_CTS_N BT_CTS Bluetooth CTS USIF3 USIF3 _RXD BT_RXD Bluetooth RX USIF3 _TXD BT_TXD Bluetooth TX CLK CLK32K CLK32k For FM Radio, BT CLK32K GPIO_22 Not used

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

CAMERA I/F CIF_PCLK CAM_PCLK Camera pixel clock CIF_HSYNC CAM_HS Camera H sync CIF_VSYNC CAM_VS Camera V sync CLKOUT2 CAM_MCLK Camera main clock CIF_PD_GPIO CAM_PWDN Camera sensor power down CIF_RESET_GPIO CAM_RST Camera reset #Display_Interface CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5) Camera DATA[5] CIF_D6 CIF_D(6) Camera DATA[6] CIF_D7 CIF_D(7) Camera DATA[7] CIF_PCLK CIF_PCLK Camera pixel clock CIF_HSYNC CIF_HS Camera H sync CIF_VSYNC CIF_VS Camera V sync CLKOUT CIF_MCLK Camera main clock CIF_PD CIF_PD Camera power down(active high) CIF_RESET CIF_RESET Camera reset LCD I/F DIF_D0 DIF_D(0) LCD data[0] DIF_D1 DIF_D(1) LCD data[1] DIF_D2 DIF_D(2) LCD data[2] DIF_D3 DIF_D(3) LCD data[3] DIF_D4 DIF_D(4) LCD data[4] DIF_D5 DIF_D(5) LCD data[5] DIF_D6 DIF_D(6) LCD data[6] DIF_D7 DIF_D(7) LCD data[7] DIF_D8 DIF_D(8) LCD data[8] DIF_CS1 DIF_MAIN_CS MAIN LCD chip select DIF_CS2 DIF_SUB_CS SUB LCD chip select DIF_CD DIF_CD Command Data switch

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

DIF_WR DIF_WR LCD Write EINT7 HOOK_DETECT Ear-Mic hook detection DIF_RESET1 DIF_RESET LCD Reset GPIO_108 CAM_LDO_EN For CAM Core 1.8V, 2.8V LDO I2C I2C_SCL SCL For FM/BT/Amp/Camera I2C_SDA SDA For FM/BT/Amp/Camera PM_INT (EINT) PM_INT SIM I/F CC_IO SIM_IO SIM CARD I/O CC_CLK SIM_CLK SIM CARD CLOCK CC_RST SIM_RST SIM CARD RESET I2S2 I2S2_CLK0 Not used GPIO_102 _WP Not used I2S2_RX Not used I2S2_TX Not used I2S2_WA0 Not used GPIO_103 Not used External Memory MMCI_CMD TF_CMD T-flash MMCI_DAT[0] TF_DAT0 T-flash MMCI_CLK TF_CLK T-flash GPIO_109 USB_EOC USB End of charging detect

(High: EOC, Low: charging) IrDA GPIO_110 RPWRON Remote power on detect

(High: Remote, Low: Normal) GPIO_109 SPK_RCV_SEL Audio pass select

(high: Speaker, Low: Receiver) I2S1 I2S1_CLK0 I2S1_CLK For Bluetooth GPTU0_0 FLASH_EN For Camera Flash LED I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX For Bluetooth I2S1_WA0 I2S1_WA For Bluetooth

External Memory MMCI_DAT[1] TF_DAT1 T-flash MMCI_DAT[2] TF_DAT2 T-flash MMCI_DAT[3] TF_DAT3 T-flash Audio I/F EPN1 RCV_N For Receiver EPP1 RCV_P For Receiver EPPA1 BBP_SND_L For Speaker EPREF Reference EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic MICP1 MIC1_P For Mic MICN2 MIC2_N For Headset Mic MICP2 MIC2_P For Headset Mic VMICP VMICP Power for MIC VMICN VMICN Power for MIC ADC M0 BAT_ID Battery temperature measure M1 RF_TEMP RF block temperature measure M2 REMOTE_ADC Remote Control M3 JACK_TYPE Accessory type detect M7 H/W VERSION S-Gold2 H/W version detect M8 VSUPPLY Battery supply voltage measure M9 I_MONITOR Current consumption measure M10 N.C Reference VREF IREF JTAG I/F TDO TDO JTAG TDI TDI JTAG TMS TMS JTAG TCK TCK JTAG TRST_n _TRST JTAG RTCK RTCK JTAG

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 28 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

ETM I/F TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell) MON1 MON1 ETM MON2 MON2 ETM TRACESYNC TRACESYNC ETM TRACECLK TRACECLK ETM PIPESTAT[2] PIPESTAT2 ETM PIPESTAT[1] PIPESTAT1 ETM PIPESTAT[0] PIPESTAT0 ETM TRACEPKT[0] TRACEPKT(0) ETM TRACEPKT[1] TRACEPKT(1) ETM TRACEPKT[2] TRACEPKT(2) ETM TRACEPKT[3] TRACEPKT(3) ETM TRACEPKT[4] TRACEPKT(4) ETM TRACEPKT[5] TRACEPKT(5) ETM TRACEPKT[6] TRACEPKT(6) ETM TRACEPKT[7] TRACEPKT(7) ETM Memory MEM_AD[0] D(0) MEM _AD[1] D(1) MEM _AD[2] D(2) MEM _AD[3] D(3) MEM _AD[4] D(4) MEM _AD[5] D(5) MEM _AD[6] D(6) MEM _AD[7] D(7) MEM _AD[8] D(8) MEM _AD[9] D(9) MEM _AD[10] D(10) MEM _AD[11] D(11) MEM _AD[12] D(12) MEM _AD[13] D(13) MEM _AD[14] D(14) MEM _AD[15] D(15) MEM _WR_n _WR

- 29 -

3. TECHNICAL BRIEF

LGE Internal Use Only

MEM _RD_n _RD MEM _BC0_n _BC0 MEM _BC1_n _BC1 MEM _A[0] A(0) MEM _A[1] A(1) MEM _A[2] A(2) MEM _A[3] A(3) MEM _A[4] A(4) MEM _A[5] A(5) MEM _A[6] A(6) MEM _A[7] A(7) MEM _A[8] A(8) MEM _A[9] A(9) MEM _A[10] A(10) MEM _A[11] A(11) MEM _A[12] A(12) MEM _A[13] A(13) MEM _A[14] A(14) MEM _A[15] A(15) MEM _A[16] A(16) MEM _A[17] A(17) MEM _A[18] A(18) MEM _A[19] A(19) MEM _A[20] A(20) MEM _A[21] A(21) MEM _A[22] A(22) MEM _A[23] A(23) MEM _A[24] A(24) MEM _CS0_n _FLASH1_CS INTEL NOR (64MB) MEM _CS1_n _RAM_CS INTEL SDRAM (64MB) MEM _CS2_n _FLASH2_CS Not used MEM _CS3_n _CS3 Not used MEM _ADV_n _ADV MEM _RAS_n _RAS MEM _CAS_n _CAS

- 30 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MEM _WAIT_n _WAIT MEM _SDCLKO SDCLKO For Burst mode MEM _SDCLKI SDCLKI For Burst mode MEM _BFCLKO BFCLKO For Burst mode MEM _BFCLKI BFCLKI For Burst mode MEM _CKE CKE Memory FCDP_RBn FCDP TDMA I/F T_OUT0 TXON_PA PAM GPIO_44 VIB_EN T_OUT2 PA_BAND PAM T_OUT3 ANT_SW1 T_OUT4 ANT_SW2 T_OUT5 ANT_SW3 T_OUT6 MODE PAM KP_OUT4 KP_OUT(4) EINT7 JACK_DETECT CC1CC3IO LCD_BACKLIGHT LCD Backlight control GPIO_53 LCD_ID LCD ID check GPIO_54 _FM_RESET RF I/F RF_STR0 RF_EN CC1CC5IO SLIDE_DETECT Folder on/off detection RF_DATA RF_DA RF_CLK RF_CLK System Port AFC AFC CLKOUT0 [<=26MHz] Not used F26M 26MHZ_MCLK 26M Main Clock F32K to 32k crystal OSC32K to 32k crystal RESET_n _RESET TRIG_OUT TRIG_OUT RTC_OUT RTC_OUT

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

VCXO_EN VCXO_EN DSP GPIO_61 _BT_RESET GPIO_62 SLED_BACKLIGHT Navi key LED Backlight Control GPIO_63 _SIM_EN

- 32 -

3. TECHNICAL BRIEF

3.2 Power management IC

3.2.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon SGOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

LGE Internal Use Only

Only for training and service purposes

- 33 -

3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g. organizer functions, games, MP3 decoding) possible.

- SDBB has high efficiency up to 95% and also a power save mode.

- Memory Interface is directly supported by the SDBB

- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

- 450 mW maximum output power

- adjustable gain

- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

- Precharge current source with two current levels

- Constant current / constant voltage charging with 3 different termination voltages

- Programable charge current limitation for use with different batteries

- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging phase

- Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

- Switch to supply USB pull-up resistor

- Mini-host pull down resistor functionality

- Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED and Vibra Motor functionality

- no external components needed

- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming

- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

LGE Internal Use Only

- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation SMPOWER offers several control functions

- Power-on Reset Generator with logic state machine

- I2C bus interface

- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN (wake-up by Bluetooth) inputs

- Programable interrupt channels to handle peripherals like SIM, MMC and USB

- Monitoring of charging functions

- Undervoltage Shut-Down

- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug system

- Overtemperature Shut-Down

- Overtemperature Warning

- Support of S-GOLD standby power-down concept

- Support of S-GOLD Power-Down Pad Tristate Function

Table 6. LDO Output Table of SM-Power

- 34 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO SD2 1V8_SD 1.8V 300mA Memory VAUX 2V9_VAF 2.9V 100mA Cam Auto Focus VIO 2V62_VIO 2.62V 100mA Peripherals VSIM 2V9_SIM 2.9V 70mA SIM card VMME 2V8_VMME 2.9V 150mA u-SD VUMTS 2V85_AMP 2.85V 110mA Headset AMP VUSB VUSB 3.1V 40mA Not used VLED VLED 2.9V 10mA Not used VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold VRF1 2V85_VRF 2.85V 150mA 2.85 V supply for SMARTi-PM

RF transceiver

VRF2 1V5_VRF 1,53V 100mA 1.5 V supply for SMARTi-PM

RF transceiver VRF3 2V65_VBT 2.7V 150mA Bluetooth VPLL 1V35_VPLL 1.35V 30mA S-GOLD3 PLL VRTC 2V11_RTC 2.11V 4mA Real Time Clock VAFC VAFC 2.65V 5mA Not used VVIB 2V8_VLCD 2.8V 140mA LCD

- 35 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Figure 3. SM-Power Circuit Diagram of KF350

Figure 4 SM-Power circuit diagram with charging part

PMIC

1V8_SD

CN201

G1

G2

1V35_VPLL

KEY_EN

B10

C9

FLASH_ON

VSS11

E8

E9

TXONPA

VSS12

R201

27K

R202

DNI

VBAT

2V62_VIO

1u

4.7KR203

2.2uC207

2.2uC208

C206

R205 4.7K

R204 4.7K

TP201

L1

A11

J4

A1

B4

B11

B9

A10

VIO

VPLL

VSD2

PUMS1

PUMS2

PUMS3

OUTPORT

VDDPLLIO

U202

PMB6821

VSS22G6VSS23

VSS13

F3

F4

VSS24

VSS14

VSS15

VSS16

VSS17

VSS18

VSS19

VSS20

VSS21

F5

F6

F7

F8

F9

G4

G5

G7

G3

K3

L3

POWER_ON

VSS25

G8

G9

WDOG

VSS26

K4

H5

PWRON

L4

ON_OFF1

VSS27

H6

ON_OFF2

L5

ON_OFF2

ON_OFF_OUT

VSS28

VSS29

H7

J5

J6

SDA

SPOWER_INT

RESOURCE_CTRL

SCL

SP_INT

J7

K6

K5

I2C_INT

I2C_CLK

I2C_DAT

RESOURCE_CRTL

VSS30

D9

2V62_VIO

R206 4.7K

VSS_SD1

H8

4.7KR207

L6

K7

BL1_PWM

VSS_SD2H4VSS_VREF

J8

BL2_PWM

C202

2.2u

BL3_PWM

VBAT

L7

K8

CH_CNTRL

CH_SOURCE

K9

L8

CHARGE_UC

VDD_CHARGE

VBAT

L9

SENSE_IN1

K10

SENSE_IN2

KDR331V

3

J9

A8

VDD_REF

VDDRF13_AFC

D201

C205 1u

0.1u

C209

VLED

VDDSIMVIB

L11

VSD1

VDDMME

VDDRF2

VDDUMTS

VUMTS

VDDSD1 SD1_FB

SD1_FBLSD2_FB

OVP_VCHG

2

OVP_VUSB

1

10uH

1V35_CORE2V5_VAUDB 1V5_VRF

L201

KDS160E

C11

VMME

C10

D10 D11

VRF2

E10

VRF3

E11

F10

VRF1

F11

VVIB

G11

G10

VSIM

H11

VAFC

H10

VRTC

H9 J11

K11 J10 L10

10u

C232

2V8_CAM_A

D202

2V85_CAM2V5_VAUDA

VBAT

FB202

C22810u

C230

C240

C239

2.2u

1u

10u C229

10u

C241 1u

2V11_RTC

2V85_VRF

2V9_SIM

C242

2.2u

C244

2.2u

2V65_VBT

2V9_VMME

1V8_SD

C246

C247

C248

C245

2.2u

2.2u22u

2.2u

C201

0.1u

A7

A5

VREFEX_M

VDD_MONO

VSS1

C6

D4

0.1uC210

C7

A6

VSS_MONO

MONO_OUTP

VSS3

VSS2

D5

D6

MONO_OUTN

VSS4

VSS5

VSS6

D7

D8

R208 100K

B8

E4

RTC_OUT ON_OFF2

KEY_BACKLIGHT

1u

C211

C8

A9

VREF

RREF

FLASH_SHINK

VSS7

VSS8

VSS9

VSS10

E5

E7

E6

VUSB

VBAT

C203

2.2u C204 2.2u

USB_OEn USB_DAT_VP USB_SE0_VM

TXON_PA

VBAT

2V9_VFM

FB201

BT_VCXO_EN

C225

C224

C223

1u

2.2u

C233

0.1u

C235

C234

10u

2.2u

C231

VBAT

B2

A2

DAT_VP

SE0_VM

B1

U_RCV U_PMIN U_VMIN

USB_DP USB_DM

PMRSTn

VCXO_EN

C236

2.2u 1u

RCV

C2

VPIN

D3

VMIN

C1

D+

D2

D-

PMRSTn

E3

RESET_N

D1

RESET2_N

E2

SLEEP1_N

E1

SLEEP2_N

F2

VAUDIOA

F1

VDDAUDIOA

G2

VDDAUDIOB

G1

VAUDIOB

H2

VAUX

H1

VDDAUX

J1

10uHL202

SU1_GATE

J2

D203

SU1_GND

KDS160E

H3

SU1_FB

J3

SU1_ISENSE

K1

VDDSD2

K2 L2

SD2_FBL

C238 C243

C237

2.2u

0.1u

B7

B5

A3

B6

C4

A4

B3

C3

C5

AC-

AC+

OE_N

VUSB

VDD_USB

SUSPEND

MONO_INP

MONO_INN

VBAT

2V62_VIO

100K

R219

100p C250

BAT_ID

C252 10p

C253 27p

C254 47p

C251

2.2u

CHG_EN

_EOC

R222

100K

_PPR

1

1KR218

2

3

2V62_VIO

100K

R220

VUSB_USB

VCHG

C257 1u

R223

OVP_VCHG

OVP_VUSB

R225

18K (1%)

R224

VBAT

C256

16K

1u

(1%)

ISL9221U204

13

PGND

1

VDC

2

VUSB

3

_PPR

4

_CHG

5

_EN

6

IMIN

10K (1%)

VDC_BYP

USB_BYP

IVDC

IUSB

12

11

BAT

10

9

8

GND

7

- 36 -

3. TECHNICAL BRIEF

3.2.2 Charging

SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external ACadapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.

1. Charging method : CC-CV

2. Charger detect voltage : 4.0 V

3. Charging time : 2h 40m

4. Charging current : 380 mA

5. CV voltage : 4.2 V

6. Cutoff current : 110 mA

7. Full charge indication current (icon stop current) : 110 mA

8. Recharge voltage : 4.16 V

9. Low battery alarm a. Idle : 3.43 V ~ 3.3 V b. Dedicated : 3.53 V ~ 3.3 V

10. Low battery alarm interval a. Idle : 3 min b. Dedicated : 1 min

11. Switch-off voltage : 3.3 V

12. Charging temperature adc range a. ~ -5˚C : low charging voltage operation (3.6 V ~ 3.9 V) b. -5 ~ 50˚C : standard charging (up to 4.2 V) c. 50˚C ~ : low charging voltage operation (3.6V ~ 3.9V)

LGE Internal Use Only

Only for training and service purposes

Figure 5 Battery Block Indication

4.2V~3.69V 3.69V~3.53V 3.53V~3.43V 3.43V~3.35V

- 37 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.3 Power ON/OFF

KF350 Power State : Defined 3cases as follow

] Power-ON : Power key detect (SM-Power’s ON port) ] Power-ON-charging : Charger detect.

Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 6). It might be triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won’t be set. To support Remote power on function for factory mass production, applied an analog switch as following figure. As monitoring the RPWRON and Key matrix KP_OUT(2) & KP_IN (0), KF350 system recognize whether remote power on or End-key pushed

Figure 7 Remote power on and End-key power on circuit

2V11_RTC

END_KEY

VA201

ICVN0505X150FR

R215

10K

(1%)

R217

100K

2

3

Q202 KTC4075E

1

END_KEY_IN

KEY_ROW0

KEY_COL2

RPWRON_EN

R214

3.3M

C249

2.2u

END_KEY_IN

Q201 2SC5663

R216

3.3M

R213

100K

Q203 2SC5663

PWRON

- 38 -

3. TECHNICAL BRIEF

3.4 SIM & uSD interface

KF350 supports 1.8V & 2.9V plug in SIM, SIM interface scheme is shown in (Figure 8). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold3) and the SIM power supply enabled by PMIC.

SIM Interface

SIM_CLK : SIM card reference clock SIM_RST : SIM card Async /sync reset SIM_IO : SIM card bidirectional reset

The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold3 is connected to the module using a dedicated eight-pin connector

LGE Internal Use Only

Only for training and service purposes

Figure 8 SIM & Micro SD Circuit

Micro SD Memory Card Detection Scheme

MMC_D(1) MMC_D(0)

MMC_CLK

MMC_CMD MMC_D(3) MMC_D(2)

MMC_DETECT

R329

100K

R330

R334

2V62_VIO

2V9_VMME

C312

100K

R333

100K

1u

C322 DNI

100K

R331

R332

47

R335

100K

C324 1000p

2V9_SIM

C316

SIM_RST SIM_CLK

SIM_IO

C313

DNI

10p

4.7K

R328

C315

C314

12

S301

20

14

15S513

S116S2

S3

S6

G1 G2

19

27p

0.1u

21

11

S7

G3

S8

10

T8

9

T7

8

T6

7

T5

6

T4

5

T3

4

T2

3

T1

2

S4

1

ST1

17

ST2

18

- 39 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Micro SD memory pad assign.

SD mode

Pin No. Name Type Description

1 DAT2 I/O Data bit [2]

2 CD/DAT3 I/O Data bit [3]

3 CMD I/O Command response

4 VDD Power Power supply

5 CLK I Clock

6 VSS Ground Power ground

7 DAT0 I/O Data bit [0]

8 DAT1 I/O Data bit [1]

LGE Internal Use Only

Only for training and service purposes

3.5 Memory

1Gbit Flash & 512Mbit DDRAM employed on KF350 with 8 & 16 bit parallel data bus thru ADD(0) ~

ADD(24). The 1Gbit Nand Flash memory with DDRAM stacked device family offers multiple high-

performance solutions.

3. TECHNICAL BRIEF

- 40 -

Figure 9 Flash memory & DDR RAM MCP circuit diagram

B7

E8

F6

B2

P9

N1

N10

DNU6

DNU7

_RED6_WE

R__B

E5

E6

P1

DNU8

U101

P2

DNU9

_WP

F5

P10

DNU10

DNU11

NC6G6NC7H5NC8

G5

NC1

NC2

H6

NC3B9NC4

NC9

NC10

N2

N9

NC5

VDD1 VDD2 VDD3 VDD4

VDDQ1 VDDQ2 VDDQ3

VSS1 VSS2 VSS3 VSS4

VSSQ1 VSSQ2 VSSQ3

VCC1 VCC2

VCCQ

VSS5 VSS6 VSS7

LDQS UDQS

NC11

TP101

ADD(16:28)

C125 0.1u

1V8_SD

10K

ADD(16) ADD(17) ADD(18) ADD(19) ADD(20) ADD(21) ADD(22) ADD(23) ADD(24) ADD(25) ADD(26) ADD(27) ADD(28)

C130

0.1u

R108

0.1u

C126

C127 0.1u

C131

0.1u

0.1uC128

1V8_SD

C132

0.1u

1V8_SD

C129 0.1u

LDQS UDQS

C7

A0

C8

A1

C9

A2

B8

A3

M9

A4

L9

A5

K9

A6

J9

A7

H7

A8

H8

A9

D9

A10

H9

A11

G7

A12

B4 G9 H2 M2

D2 F2 K2

C2 F9 G2 N4

E2 J2 L2

B6 N7

N6

B5 N5 N8

F3 J3

R106

3300

DATA(0:15)

ADD(0:15)

DATA(0) DATA(1) DATA(2) DATA(3) DATA(4) DATA(5) DATA(6) DATA(7) DATA(8) DATA(9) DATA(10) DATA(11) DATA(12) DATA(13) DATA(14) DATA(15)

_NAND_CS

SDCLKI ADD(16) ADD(17)

_RD

FCDP

_WR

_RAM_CS

SDCLKO

CKE

_WR ADD(29) ADD(30)

_RAS _CAS

_BC0 _BC1

TP102

TP103

ADD(0) ADD(1) ADD(2) ADD(3) ADD(4) ADD(5) ADD(6) ADD(7) ADD(8) ADD(9) ADD(10) ADD(11) ADD(12) ADD(13) ADD(14) ADD(15)

A9

A10

B10

A2

DNU1

DNU2

DNU3B1DNU4

B3

DQ0

C4

DQ1

C3

DQ2

D4

DQ3

D3

DQ4

E4

DQ5

E3

DQ6

F4

DQ7

J4

DQ8

K3

DQ9

K4

DQ10

L3

DQ11

L4

DQ12

M3

DQ13

M4

DQ14

N3

DQ15

E9

_CS

H4

CLK

G8

CKE

F8

_WED

D7

BA0

D8

BA1

E7

_RAS

F7

_CAS

G3

LDQM

H3

UDQM

J5

IO0

L5

IO1

J6

IO2

L6

IO3

J7

IO4

L7

IO5

J8

IO6

L8

IO7

K5

IO8

M5

IO9

K6

IO10

M6

IO11

K7

IO12

M7

IO13

K8

IO14

M8

IO15

DNU5

K5E1H12ACM-D075

ALE

CLE

_CE

_CK

D5

C5

C6

G4

- 41 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.6 LCD Display

LCD module include:

- Main LCD: 2.0” 240x320 QVGA, 262K color TFT

- Backlight : 5 piece of white LED

LCD FPC Interface Spec: Table 7. LCD FPC Interface Spec.

- 42 -

3. TECHNICAL BRIEF

3.7 Keypad Switching & Scanning

The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

LGE Internal Use Only

Only for training and service purposes

Figure 10 Key pad part key matrix

SEL

SEND

0

DOWN

*

SIDE KEY_VOL

VOL_UP

KEYPAD

12 3

LEFT

4

78

VOL_DOWN

UP

6

FAV

#

RIGHT

CONF

MENU

CAMERA

9

CLR

5

FAV

SW102

SW105

SW100

SW106

RIGHT

SEL

SW101

SW104 UP

CAMERA

*

SW103

SW109

LEFT

DOWN

SEND

SHARP

MENU

SW108

CONF

SW107

VOL_UP VOL_DOWN

CLR

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL5

KEY_ROW0

KEY_ROW5

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

KEY_COL0

END

VBAT

ON/END

END_KEY

END_KEY_IN

KEY_ROW0

100K

3

2

Q202 KTC4075E

1

KEY_COL2

END_KEY

VA201

ICVN0505X150FR

R215

10K

(1%)

R217

- 43 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.8 Keypad back-light illumination

There are 2 snow white color LEDs on Key FPCB for keypad illumination. Keypad Back-light is controlled by SM-Power Flash LED port which has constant current control function. The whole configuration of the SM-POWER Flash LED drivers is shown in below Figure11.

Figure 11 Keypad Back-light LEDs

ICVN0505X150FR

VA100

ICVN0505X150FR

VA101

LEWWS44-E

LD101

R101

47

R100

LD100

LEWWS44-E

VBAT

KEY_BACKLIGHT

- 44 -

3. TECHNICAL BRIEF

3.9 LCD back-light illumination

The AS3675 is a highly-integrated CMOS Power and Lighting Management Unit for operating with lithium-ion/polymer batteries. And AS3675 support 13 Current sinks, the RGB and white LEDs. The AS3675 is capable of driving up to three LEDs at a total of 500mA. The current sinks may be operated individually or in parallel for driving higher current LEDs. To maximize power efficiency, the charge pump operates in 1X, 1.5X, or 2X mode, where the mode of operation is automatically selected by comparing the forward voltage of each LED with the input voltage.

LGE Internal Use Only

Only for training and service purposes

Figure 12 LCD Back light unit and Flash LED charge pump IC

CHARGE PUMP

2.2u

C118

1u

C117

1V8_CAM

A2

VBAT

C4

C3

VSS

B2

VSS_CP

CURR31 CURR32

E3

CURR33

D3

CURR41

C1 E1

CURR42

D1

CURR43

E4

CURR6

DATA

A6

DCDC_FB

D6

DCDC_GATE

B5

DCDC_SNS

C6

A1

GPIO

D2

RGB1 RGB2

E2 C2

RGB3

E6

V2_5

VANA_GPI

U101

AS3675

B1

AUDIO_IN

C1_N

B3

C1_P

A4

A3

C2_N

B4

C2_P

CLK

B6

A5

CP_OUT

E5

CURR1

D5

CURR2

C5

CURR30

D4

1u

C112

1uC111

1u

C115

VBAT

1u

C113

2.2u

C116

AUDIO_IN

LED2 LED3

LED4 LED5 LED6

PHOTO_ADC_IN

SCL

MLED

MLED5

MLED1 MLED2 MLED3 MLED4

SDA

LED1

The AS3675 is controlled using serial interface pins CLK and DATA. The clock line CLK is never held Low by the AS3675(as the AS3675 does not use clock stretching of the bus)

• Fast Mode Capability(Maximum Clock Frequency is 400 kHZ)

• Write Formats

• Write Formats (-. Single-Byte Write , -. Page-Write)

• Read Formats (-. Current-Address Read -. Random-Read, - Sequential °©Read)

• DATA Input Delay and CLK Spike Filtering by Integrated RC address.

- 45 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Figure 13 I2C Serial data port control method

3.10 ALC

The automatic luminance control (ALC) circuit adjusts the LED dimming by changing the LED current automatically in response to the brightness of the surroundings. An external photodiode or similar luminance sensor must be connected for the ALC automatic control to function. The luminance sensor is connected to PD and must be set to increase the PD input current in response to increasing luminance of the surroundings. In the typical application circuit in section 13, the SM8152A VREF terminal is used and the luminance sensor photodiode is connected between PD and VREF

3.11 JTAG & ETM interface connector

In case of KF350 mass production, the JTAG & ETM interface connector will not be mount on board. That is only for developing and software debugging purpose.( It will not be mounted on mass production PCB)

- 46 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Figure 14 Average Iout vs Lux on photo sensor

Figure 15 JTAG & ETM(Embedded Trace Module) interface connector

2V62_VIO 1V8_SD

CN101

G1 G2

30

1 2

29

3

28

4

TRSTn

RTCK

EXTRSTn

TRIG_IN

TDI TMS TCK

TDO

5 6 7 8

9 10 11 12 13 14 15

G3 G4

27 26 25 24 23 22 21 20 19 18 17 16

TRACECLK TRACEPKT7 TRACEPKT6 TRACEPKT5 TRACEPKT4 TRACEPKT3 TRACEPKT2 TRACEPKT1 TRACEPKT0 PIPESTAT2 PIPESTAT1 PIPESTAT0 TRACESYNC

- 47 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.12 Audio

KF350 Audio signal flow diagram as following diagram.

3.12.1 Audio amplifier

Audio amplifier sub system IC is an audio power amplifier capable of delivering 1.2 W of continuous average power into a mono 8ßŸ load, 50mW per channel of continuous average power into stereo 32Ω ßŸ single-ended (SE) loads. The MAX9877 features a 32-step digital volume control and ten distinct output modes. The digital volume control, output modes (mono/SE/OCL) are programmed through a two-wire I2C interface that allows flexibility in routing and mixing audio channels.

Figure 16 Audio signal flow diagram

Figure 17 Audio amplifier PMIC

BT

+

FM

MAX

9877

MIC

BBP

PMB8877

SPK RCV

FM

Ear MIC

18pin/ IO

VBAT

2.2uC212

AUDIO_IN

BB_SND_R

BB_SND_L

FM_SND_R

FM_SND_L

C213 1u

C216 1000p

R210 20K

1KR209

C222 1u

EAR_P EAR_N

C221 1u

C217 1u

C219 1u C220 1u

R211 8.2

C215 1u

SDA SCL

8.2R212

1uC218

A3

A4

C1N

A5

C1P

D1

INA2

D2

INA1

U201

C1

MAX9877AEWP_TG45

INB2

C2

INB1

B2

BIAS

B3

SDA

C3

SCL

D4

RXIN+

B4

RXIN-

VSS

GND

D3

C5

B1

VDD

PVDD

PGND

C4

HPR

HPL

OUT+

OUT-

2.2uC214

A1

HSO_R

A2

HSO_L

D5

B5

C226 27p

SPK_RCV_P

SPK_RCV_N

C227 27p

- 48 -

3. TECHNICAL BRIEF

3.12.2 Microphone circuit

3.13 Charging circuit

ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other from a desktop cradle. The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively. Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used safely.

LGE Internal Use Only

Only for training and service purposes

G3

4

6

G4

OUT

1

5

PWR

MIC100

SPM0204LE5-QB

2

G1

G2

3

MAIN_MIC_P

VMIC_P

MAIN_MIC_N

Figure 18 Microphone circuit

Figure 19 Charging circuit

_EOC

CHG_EN

2V62_VIO

100K

R222

100K

R219

_PPR

VUSB_USB

2V62_VIO

VCHG

C257 1u

R223

10K (1%)

1

VDC

VUSB

_PPR

_CHG

_EN

IMIN

VDC_BYP

USB_BYP

2

3

4

5

6

100K

R220

ISL9221U204

PGND

BAT

IVDC

GND

IUSB

VBAT

13

12

OVP_VCHG

11

10

OVP_VUSB

9

8

7

R225

18K

(1%)

R224

16K (1%)

C256

1u

3.14 FM radio & BLUETOOTH

■ FM radio Simultaneous operation with Bluetooth

• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band

• Wide dynamic range AGC

• Soft mute and stereo blend

• Adjustment-free stereo decoder and AFC

• Autonomous search tuning function (up/down) with programmability (threshold setting)

• RDS demodulator

• Audio output available over Bluetooth audio interface or dedicated audio output

• Control of FM via Bluetooth HCI or I2C

• Adaptive filter to suppress narrow band interference in the FM channel

■ Bluetooth General Features

- Small outline by LTCC substrate built-in RF function and Resin mold

- Integrated top BPF for Bluetooth and FM radio

- Integrated RDS/RBDS demodulator and decoder

- Bluetooth® 2.1+EDR conformity

- Secure Simple Pairing (SSP)

- Encryption Pause Resume (EPR)

- Enhance Inquiry Response (EIR)

- Link Supervision Time Out (LSTO)

- Sniff Sub Rating (SSR)

- Erroneous Data (ED)

- Packet Boundary Flag (PBF)

- WLAN coexistence including 802.15.2 three-wire coexistence support

- UART Interface

- PCM Interface

- I2S Interface

- I2C Interface

- 49 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 50 -

3. TECHNICAL BRIEF

Bluetooth Radio

• Common TX/RX teminal simplifies external matching, eliminates external antenna switch

• No external trimming is required In production

• Bluetooth v2.1 + EDR Specification compliant

Bluetooth Transmitter

• +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB

• Class 1 and Class 2 support without the need for an external power amplifier or TX/RX switch.

Bluetooth Receiver

• Integrated channel filters

• Digital demodulator for improved sensitivity and co-channel rejection

• Real time digitized RSSI available on HCI interface

• Fast AGC for enhanced dynamic range

• Channel classification for AFH

LGE Internal Use Only

Only for training and service purposes

BLUETOOTH_FM_MODULE(TAIYO YUDEN)

TP407

2V62_VIO

TP406

2V65_VBT

TP405

TP404

TP403

VIO

13

35

VREGBT

34

VREG_CTL

XTALN

18

XTALP

19

C447 1000p

39

PGND1 PGND2

40 41

PGND3 PGND4

42

33

RESET

30

SLEEP_CLK

TM0

14

UART_CTS

11

UART_RTS

8 9

UART_RX

10

UART_TX

VAFL

16 15

VAFR

36

VBATT

37

VDDR3V

VDDTF

28

FM_ANT

32

GND1

1 5

GND2

7

GND3

12

GND4 GND5

20

GND6

31

21

GPIO017GPIO125GPIO222GPIO5

GPIO6

27

PCM_CLK_I2S_CLK

3

2

PCM_IN

PCM_OUT_I2S_OUT

38

4

PCM_SYNC_I2S_WSEWFNLBAXX

M1

A_GPIO423A_GPIO5

24

26

A_GPIO629A_GPIO7

BT_ANT

6

DNIR416

C450 1u

2V65_VBT

FB420

0.1u C446

VBAT

C4481000p

C449 1u

C451

1u

C452

TP402

TP401

ANT401

DUMMY1

DUMMY2

FEED

DNI

R408

C438 100p

R409

DNI

C460

1.5p

DNI

C442C441

DNI

BT_INT

DBB_INT

BT_LDO_EN

BT_CLK

CLK32K

FM_SND_L FM_SND_R

UART_BT_CTS

UART_BT_RTS UART_BT_Rx

UART_BT_Tx

BT_VCXO_EN

I2S1_Tx

I2S1_Rx

I2S1_WA0

I2S1_CLK

BT_RESETn

FM_ANT

Figure 20. Bluetooth / FM Radio Circuit Diagram

- 51 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Synthesiser

• Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter

• Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock

Audio

• Single-ended stereo analogue output

• 16-bit 48 kHz digital audio bit stream output

Baseband and Software

• Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet operation, including all medium rate packet types

• Logic for forward error correction, header error control, access code correlation. CRC, demodulation, encryption bit stream generation, whitening and transmit pulse shaping. Supports all Bluetooth v 2.0 + EDR features incl. ESCO and AFH

• Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air

Physical Interfaces

• Synchronous serial interface up to 4Mbits/s for system debugging

• UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode

• USB v1.1 interface

• I2C slave for FM

• Two audio PCM interfaces (input and output)

• Analogue stereo (output only)

Figure 21. Bluetooth / FM Radio Block Diagram

- 52 -

3. TECHNICAL BRIEF

3.15 18pin Multi Media Interface connector

Table 8. Multi media interface pin assign

LGE Internal Use Only

Only for training and service purposes

KF350 MMI

Pin Function Description

1 FM_ANT FM radio antenna / Audio ground

2 HS_MIC Headset microphone signal

3 JACK_TYPE Accessory type detect

4 HS_OUT_L Headset left sound

5 HS_OUT_R Headset Right sound

6 USB_DP / REMOTE_INT USB/ Remote control interrupt

7 USB_DM / REMOTE_ADC USB/ Remote control Key ADC

8 JACK_DETECT Headset detect (active low)

9 VBAT Battery voltage

10 VBAT Battery voltage

11 RPWRON Remote power on (active high. 2.8V)

12 VCHG Charger voltage

13 VCHG Charger voltage

14 DSR N.C.

15 VBUS_USB USB VBUS

16 TX UART TX data

17 RX UART RX data

18 GND Power GND

- 53 -

3. TECHNICAL BRIEF

LGE Internal Use Only

2 : Headset MIC

6 : USB+/Remote_INT/TXD

11 : R/ON

8 : JACK_D

16 : D/ TX

7 : USB-/Remote_ADC/RXD

4 : CTS/HSO_L

15 : VUSB

5 : RTS/HSO_R

3 : Jack type

14 : DSR

12,13 : CHG

9,10 : BATT

18PIN MULTIPORT RECEPTACEL

17 : D/ RX

VBAT

L104 100nH

C107 39p

VCHG

1u

UART_TX

C108

RPWR

DSR

L103 270nH

3 4 5 6 7

8 9

CN100

1

10 11 12 13 14 15 16 17 18

19

2

20

21

22

GU041-18P-E1000

VUSB_USB

UART_RX

24pC109

10p

C103

USB_DP

USB_DM

JACK_DETECT

RPWRON_EN

DSR

UART_TX

UART_RX

FM_ANT

HOOK_DETECT

JACK_TYPE

HSO_L

HSO_R

MAIN TO KEY CONNECTOR

DNI

R309

27p

C302

2V62_VIO

10p

C304

R310 DNI

2.2K

27p

C311

R308

L301

100nH

10KR305

FB305 1800

R301 1M

FB301 1800

R322 47

47

R302

1800FB303

2V62_VIO

R307

VUSB

R327 47

DNI

R314 36

VCHG

100nH

L302

C305

22n

2V5_VAUDB

220K

R303

FB304 1800

C306 27p

FB307 1800

1800FB306

47R325

27p

C310

ICVFP10181E301FR

FL301

GND1GND2

INOUT

22n

C303

2V62_VIO

1800FB302

36

37

38

39

44041

42

43

44

5 6 7 8 9

22 23

24

25

26

27

28

29

3

30

31

32

33

34

35110 11 12 13 14 15 16 17 18 19

2

20 21

CN301

GB042-44P-H10-E3000

R306 100K

2V5_VAUDB

C307 10u

OUT

1

5

VCC

3

VIN+

VIN-

4

4.7K

R311

NCS2200SQ2T2G

U301

2

GND

36R312

120p

C301

1.5K

R304

JACK_DETECT

USB_DP

USB_DM

JACK_TYPE

FLIP

KEY_BACKLIGHT

FM_ANT

RPWRON_EN

UART_RX

UART_TX

DSR

HSO_R

HSO_L

HOOK_DETECT

HS_MIC_N

HS_MIC_P

Figure 22. MMI 18Pin Connector circuit

- 54 -

3. TECHNICAL BRIEF

[ RF circuit Technical Brief ]

*RF Block Diagram

LGE Internal Use Only

Only for training and service purposes

Figure 23 KF350 RF part Block Diagram

- 55 -

3. TECHNICAL BRIEF

3.16 General Description

The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality. Further on a completely integrated SD-synthesizer with HSCSD and GPRS/EDGE capability, a digitally controlled reference oscillator with three outputs, a fully integrated quad-band RF oscillator and a three wire bus interface with all necessary control circuits complete the transceiver.

LGE Internal Use Only

Figure 24 RF transceiver PMB6272 SMARTi-PM functional block diagram

- 56 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

GSM900 DCS1800 PCS1900GSM850

C434

0.1u

6.8nH

L402

18nH

L400

10

R411

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

2V85_VRF

C443

NX3225SA

220n

VDDRX2V8

2035

VDDTX1V5

VDDTX2V8

38

VDDVCO2V8

17

15

VDDXO2V8

11

XO

XOX

12

2V85_VRF

RX2

27

28

RX2X

24

RX3

RX3X

25

22

RX4

RX4X

23

TX1

36

TX2

37

VBIAS

34

18

VCO_RC

VDDBIAS2V8

31

VDDDIG1V5

8

5

VDDDIG2V8

VDDLNA1V5

21

39

VDDMIX2V8

19

VDDRX1V5

3

B

BX

4

7

CLK

DA

6

EN

16

32

FE1

33

FE2

FSYS1

14

FSYS2

10

9

FSYS3

GND1

13

26

GND2

GND3

40

41

GND4

RX1

29

30

RX1X

PMB6272

U401

1

A

AX

2

0.1u

C436

2V85_VRF

C435

0.1u

C426

2.2p

220n

C425

C440

5.6nH

L403

2.2p

C423

2V85_VRF

1V5_VRF

4.7n

C432

1V5_VRF

R410

820

0.1u

C433

C439

1000p

47n

C437

C444

0.1u

C431

R412

10

2.2p

18nH

L401

C428

2.2p

C427

2.2p 2.2p

C430C429

1V5_VRF

2V85_VRF

C424

2.2p

I

IX

Q

QX

RF_CLK

RF_DA

RF_EN

BT_CLK

26MHZ_MCLK

HBAND_PAM_IN

LBAND_PAM_IN

Figure 25 RF transceiver PMB6272 SMARTi-PM schematic

- 57 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.17 Receiver part

The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band. Down conversion to baseband domain is performed by low/high band quadrature direct down conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing through the baseband ADC. The receive path is fully differential to suppress on-chip interferences. Several gain steps are implemented to cope with the dynamic range of the input signals. Depending on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable. Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to reduce the DC-offset at basebandoutput. A programmable gain correction can be applied to correct for front end- and receiver gain tolerances.

Figure 26 Receiver part block diagram

- 58 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.18 Transmitter part

The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates. The phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its associated VCO is divided by four or two, respectively, and connected via an output buffer to the appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900. The digital transmitter architecture is based on a polar modulation architecture, where the analog modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude information is fed into a digital multiplier for power ramping and level control. The ready processed amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog amplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining amplitude and phase information. The output of the amplitude modulator is connected to a single ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power control input VAPC and an optional bias control pin VBIAS for efficiency enhancement.

Figure 27 Transmitter part block diagram

- 59 -

3. TECHNICAL BRIEF

In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.

3.19 RF synthesizer

The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as SigmaDelta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically adjusted prior to each slot (OLGA©˜). To overcome the statistical spread of the loop filter element values an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and operates at double or four times transmit or receive frequency. To cover the wide frequency range the VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer startup.

3.20 DCXO

The SMARTiPM contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with three outputs for the system clock, one output for the GSM baseband and two additional for other subsystems (GPS, Bluetooth, etc.).The only external part of the oscillator is the crystal itself. The frequency tuning is performed along the selected subrange by programming the frequency control word (XO_TUNE) via the three wire bus (“3Wbus”)

LGE Internal Use Only

Figure 28 DCXO Schematic

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

NX3225SA

- 60 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.21 Front End Module control

Implemented in the S-Gold3 (FL400) are two outputs which are FE1, FE2 for direct control of front end modules with two logic input pins to select RX and TX mode as well as low and high band operation. FEM need 2V85_VRF supply.

MODE Tx 1GHz Tx 2GHz Rx 1GHz Rx 2GHz

VDD ON ON ON ON

VC1 ON OFF ON OFF VC2 ON ON OFF OFF

Figure 29 FEM schematic

VC1 (FE1)

VC2 (FE2)

GSM850 / 900_TX

GSM 1800 / 1900_ TX

GSM850 / 900_RX

GSM 1800 / 1900_ RX

ANT400

WFL-R-SMT10

G1 G2

ANT

G3

LHH

H

L

H

L

C406

RF-800SW400

G2

ANT

G1

100p

RF

C407 DNI

L406 100nH

11

2V85_VRF

C400 1000p

19

20

VC1

ANT

GSM850_RX1

GSM850_RX2

1

2

21

VC2

VDD

FL400

LMSP43QA-538

GSM900_RX1

GSM900_RX2

3

4

LMSP43QA-538(CMOS)

10

12

GND19GND2

GND3

GSM1800_RX1

GSM1800_RX2

5

6

7

16

18

GND413GND514GND6

GND722GND8

NC2 NC1

GSM1900_RX1

GSM1900_RX217GSM850_900_TX

GSM1800_1900_TX

8

15

100p

24 23

C402C401 100p

R402

100ohm

R403

100ohm

0.5p

C410

L404

6.8nH

FE1 FE2

C411

0.5p

- 61 -

3. TECHNICAL BRIEF

3.22 Power Amplifier Module

The TQM7M5005 is an extremely small (5x5x1.1mm3) multi-mode power amplifier module for GSM/EDGE applications. This module has been optimized for high EDGE efficiency and EDGE power class E2 operation while maintaining high GSM/GPRS efficiency. In EDGE mode, the Vramp pin provides a continuously variable bias control to minimize current consumption during backed-off power conditions. The module incorporates two highly integrated InGaP power amplifier die with a CMOS controller. The CMOS controller implements a fully integrated closed-loop power control within the module for GSM Operation. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The latter is set directly from the Vramp input from the DAC. The module has Tx enable, band select, mode (EDGE or GSM) inputs. Module construction is a low-profile over-molded land-grid array on laminate.

Table 10 PAM pin description

LGE Internal Use Only

- 62 -

3. TECHNICAL BRIEF

3.23 Mode Selection

Table 11 Mode Selection

MODE circuitry selects GMSK modulation (logic 0) or EDGE modulation (logic 1). VRAMP controls the output power for GMSK modulation and provides bias optimization for EDGE modulation depending on the state of MODE control.

LGE Internal Use Only

Only for training and service purposes

- 63 -

3. TECHNICAL BRIEF

3.24 PAM Schematic

LGE Internal Use Only

TQM7M5005(5x5)

C420

0.01u

VBAT

C410

0.5p

L405

3nH

C418 100p

6.8nH

L404

C403

33 uF

100p

C417 C412

100pC419

0.01u

GSM850_900_IN

10

GSM850_900_OUT2MODE_SELECT

15

PGND

TX_EN

6

4

VBATT

VRAMP

5

3

BS

13

BY_CAP1

BY_CAP2

9

DCS_PCS_IN

1

DCS_PCS_OUT

12

GND1

14

GND2

11

GND3

8

7

C404

TQM7M5005 U400

1u

47p

C416

27p

C405

C421 C422

1.5pDNI

C411

0.5p

10KR405

PA_BAND

PA_LEVEL

TXON_PA

HBAND_PAM_IN

LBAND_PAM_IN

PA_MODE

Figure 30 PAM schematic

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 64 -

4. TROUBLE SHOOTING

4.1 Trouble shooting test setup

Equipment setup

Power on all of test equipment

- Connect PIF-UNION JIG or dummy battery to the DUT for power up.

- Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.

- Follow trouble shooting procedure

LGE Internal Use Only

4. TROUBLE SHOOTING

- 65 -

4.2 Power on Trouble

Check Points

-Battery Voltage( Need to over 3.35V)

-Power-On Key detection (PWRON signal)

-Outputs of LDOs from PMIC

TP1

TP2

RPWRON_EN

R214

3.3M

C249

2.2u

R216

3.3M

Q201 2SC5663

2V11_RTC

R213

100K

PWRON

END_KEY_IN

Q203 2SC5663

EXTERNAL RESET

2V62_VIO

100K

R221

7

EXTRSTn

SPOWER_INT PM_INT

A1

6

B1

5

Y2

4

GND

U203

NC7WZ08L8X

VCC

Y1 B2 A2

2V11_RTC

8 1 2 3

C255

0.1u

PMRSTn_RESET

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 66 -

PMIC

1V8_SD

C234

KEY_EN

1u

C206

B10

TXONPA

FLASH_ON

VSS11

VSS12

F3

E9

R201

27K

R202

DNI

VBAT

2V62_VIO

4.7KR203

2.2uC207

2.2uC208

R205 4.7K

R204 4.7K

TP201

L1

A11

J4

A1

B4

B11

B9

A10

VIO

VPLL

VSD2

PUMS1

PUMS2

PUMS3

OUTPORT

VDDPLLIO

U202

PMB6821

VSS22G6VSS23

VSS13

VSS14

F4

F5

VSS24

VSS15

VSS16

VSS17

VSS18

VSS19

VSS20

VSS21

F6

F7

F8

F9

G4

G5

G7

G3

WDOG

K3

L3

WDOG

POWER_ON

VSS25

VSS26

G8

G9

K4

H5

PWRON

ON_OFF2

L4

ON_OFF1

ON_OFF2

VSS27

VSS28

H6

L5

H7

RESOURCE_CTRL

SP_INT

J5

K5

ON_OFF_OUT

RESOURCE_CRTL

VSS29

VSS30

J6

2V62_VIO

SDA

SPOWER_INT

SCL

J7

K6

I2C_INT

I2C_CLK

I2C_DAT

VSS_VREF

D9

R206 4.7K

VSS_SD1

H8

4.7KR207

L6

H4

K7

BL1_PWM

BL2_PWM

VSS_SD2

J8

BL3_PWM

C202

2.2u

VBAT

L7

CH_CNTRL

L8

K8

CH_SOURCE

VBAT

K9

L9

SENSE_IN1

CHARGE_UC

VDD_CHARGE

J9

K10

SENSE_IN2

KDR331V

3

D201

C205 1u

0.1u

C209

A8

L11

VLED

VDD_REF

VDDRF13_AFC

VDDSIMVIB

VDDUMTS

VSD1

VDDMME

VDDRF2

VUMTS

VDDSD1 SD1_FB

SD1_FBLSD2_FB

OVP_VCHG

2

OVP_VUSB

1

10uH L201

KDS160E

C11

VMME

C10

D10 D11

VRF2

E10

VRF3

E11

F10

VRF1

F11

VVIB

G11

G10

VSIM

H11

VAFC

H10

VRTC

H9 J11

FB202 K11 J10 L10

10u

C232

2V8_CAM_A

1V35_CORE2V5_VAUDB 1V5_VRF

D202

VBAT

C239

2.2u

2V11_RTC

2V85_CAM2V5_VAUDA

C22810u

C230

C240

C241

C242

1u

10u C229

10u

C201

0.1u

A7

A5

VREFEX_M

VSS1

C6

D4

0.1uC210

C7

A6

VSS_MONO

MONO_OUTP

MONO_OUTN

VSS3

VSS4

VSS2

D5

D6

R208 100K

B8

C8

VREF

RREF

VSS5

VSS6

VSS7

VSS8

E4

E5

D7

D8

RTC_OUT ON_OFF2

1V35_VPLL

KEY_BACKLIGHT

1u

C211

C9

A9

FLASH_SHINK

VSS9

VSS10

E7

E8

E6

VUSB

VBAT

C203

2.2u C204 2.2u

USB_OEn

USB_DAT_VP

USB_SE0_VM

TXON_PA

VBAT

2V9_VFM

FB201

BT_VCXO_EN

C223

C225

C224

2.2u

1u

2.2u

C233

0.1u

C235

10u

2.2u

C231

VBAT

B2

C3

A2

AC-

DAT_VP

SE0_VM

B1

U_RCV U_PMIN U_VMIN

USB_DP USB_DM

PMRSTn

VCXO_EN

KDS160E

C236

2.2u 1u

RCV

C2

VPIN

D3

VMIN

C1

D+

D2

D-

PMRSTn

E3

RESET_N

D1

RESET2_N

E2

SLEEP1_N

E1

SLEEP2_N

F2

VAUDIOA

F1

VDDAUDIOA

G2

VDDAUDIOB

G1

VAUDIOB

H2

VAUX

H1

VDDAUX

J1

10uHL202

SU1_GATE

J2

D203

SU1_GND

H3

SU1_FB

J3

SU1_ISENSE

K1

VDDSD2

K2 L2

SD2_FBL

C238 C243

C237

2.2u

0.1u

B7

B5

A3

B6

C4

A4

B3

C5

AC+

OE_N

VUSB

VDD_USB

SUSPEND

MONO_INP

MONO_INN

VDD_MONO

LDO Net name Output Voltage Output Current Usage

SD1 1V35_Core 1.35V 600mA Core & for LDO SD2 1V8 _SD 1.8V 300mA Memory VAUX 2V9_VAF 2.9V 100mA Cam Auto Focus VIO 2V62_VIO 2.62V 100mA Peripherals VSIM 2V9_SIM 2.9V 70mA SIM card VMME 2V8_VMME 2.9V 150mA u-SD VUMTS 2V85_AMP 2.85V 110mA Headset AMP VUSB VUSB 3.1V 40mA Not used VLED VLED 2.9V 10mA Not used VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold

VRF1 2V8 5_VRF 2.85V 150mA

VRF2 1V5 _VRF 1,53V 100mA

2.85 V supply for SMARTi-PM RF transceiver

1.5 V supply for SMARTi-PM

RF transceiver VRF3 2V6 5_VBT 2.7V 150mA Bluetooth VPLL 1V3 5_VPLL 1.35V 30mA S-GOLD3 PLL VRTC 2V11_RTC 2.11V 4mA Real Time Clock VAFC VAFC 2.65V 5mA Not used VVIB 2V8 _VLCD 2.8V 140mA LCD

2V9_SIM

2V85_VRF

2.2u

C244

2.2u

2V65_VBT

2V9_VMME

1V8_SD

C248

C247

C246

C245

2.2u22u

2.2u

LGE Internal Use Only

4. TROUBLE SHOOTING

- 67 -

START

Connect power

supply to the DUT

Vbat = over 3.35V

Yes

PWRON s ignal

Check 3 pin of Q201

Yes

_ RESET s ignal

Check 5 pin of U203

Yes

Check the all LDO s

output

Is it correct?

Yes

Is the 26MHz

clock From U401

signal correct?

Yes

No

U203 or replace it

U202 or replace it

No

Check the

RPWRON,

replace Q201

Check solder

Check solder X400, U401

or replace it

Check 3 pin of X400

Or Check 14 pin of U401

TP1

Q201

TP2

U203

U202

Replace main PCB

U401

X400

14pin of U401

3pin of X400

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 68 -

4.3 Charging trouble

Check Points

-Connection of TA (check TA voltage 4.8V)

-Charging Current Path component voltage drop

-Battery voltage

1 Charging method : CC-CV 2 Charger detect voltage : 4.0 V 3 Charging time : 2h 40m 4 Charging current : 380 mA 5 CV voltage : 4.2 V 6 Cutoff current : 110 mA 7 Full charge indication current (icon stop current) : 110 mA 8 Recharge voltage : 4.16 V

4.2V~3.69V 3.69V~3.53V

3.53V~3.43V 3.43V~3.35V

TP1

TP2

_EOC

CHG_EN

2V62_VIO

100K

R219

R222

100K

_PPR

2V62_VIO

100K

R220

VUSB_USB

VCHG

C257 1u

ISL9221U204

13

PGND

VDC_BYP

BAT

USB_BYP

IVDC

GND

IUSB

12

11

10

9

8

7

OVP_VCHG

OVP_VUSB

R225

18K

(1%)

R223

10K (1%)

1

VDC

2

VUSB

3

_PPR

4

_CHG

5

_EN

6

IMIN

R224

16K (1%)

VBAT

C256

1u

LGE Internal Use Only

4. TROUBLE SHOOTING

- 69 -

START

18pin IO(CN100)

Is soldered ?

Yes

Source pin

of U204 =

4.8V ?

Yes

Output pin

of U204 =4.2V?

Yes

Battery voltage

is over 3.4V?

Yes

No

Change other TA

No

Resolder the

CN100

The TA can be

broken

then retest

Check solder

U204 or replace it

Waiting until

battery

Vol tage goes up

to 3.4V

18pin IO(CN100)

U204

TP1: Source pin

U204

TP2: Output pin

Battery thermistor

value

is about 10K?

No

Yes

Charge is operating

Change the

Battery

retest

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 70 -

4.4 LCD display trouble

Check Points

-LCD assembly status ( LCD FPCB, Connector on FPCB)

-EMI filter soldering

-Connector combination

Charge Pump

Check signal flow via EMI

filter

Check the connection LCD FPCB Connector

MAIN TO LCD CONNECTOR

2V9_VFM

VBAT

2V11_RTC

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

ICVE10184E150R101FR

FL302

5

G110G2

1

INOUT_A1

INOUT_A2

2

3

INOUT_A3

INOUT_A4

4

VA310

ICVN0505X150FR

1u

C317

1

2

INOUT_A2

INOUT_A3

3

4

INOUT_A4

9

INOUT_B1

INOUT_B2

8

7

INOUT_B3

INOUT_B4

6

FL304

ICVE10184E150R101FR

G15G2

10

INOUT_A1

6 7 8 9

5

29

3

30

4

14 15 16 17 18 19

2

20 21 22 23 24 25 26 27 28

CN30

GB042-60S-

1

10 11 12 13

5G110

G2

1

INOUT_A1

INOUT_A2

2

INOUT_A3

3

INOUT_A4

4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

ICVE10184E150R101FR

FL306

C318

1uICVN0505X150FR

VA309

AUDIO_IN

_DIF_RESET

LCD_ID

DIF_VSYNC

VIB_EN

_LED_RESET

LED_CNT

DIF_D3

DIF_D2

DIF_D1

DIF_D0

DIF_D7

DIF_D6

DIF_D5

DIF_D4

DIF_CD

DIF_MAIN_CS

DIF_RD

_DIF_WR

LCD CONNECTOR

10K R106

1u

C119

2V9_VFM

5

6

7

8

9

23

24

25

26

27

28

29

3

30

31

32

33

34

35

4

1

10

11

12

13

14

15

16

17

18

19

2

20

21

22

CN104

GF032-35S-E2000

2V9_VFM

_DIF_RESET

DIF_MAIN_CS

DIF_CD

DIF_VSYNC

MLED5

MLED3 MLED2

MLED4

MLED1 MLED

DIF_RD

DIF_D0 DIF_D1 DIF_D2 DIF_D3 DIF_D4 DIF_D5 DIF_D6 DIF_D7

_DIF_WR

LCD_ID

LGE Internal Use Only

4. TROUBLE SHOOTING

- 71 -

START

Check LCD connector

combination then LCD test

with New LCD

Is LCD FPCB

normal?

Yes

Signal is normal on

DIF Signal

FL302, FL304, FL306

Yes

Assemble

No

Replace LCD FPCB

Check solder and

repair

Damaged filter

FL302, FL304, FL306

- 72 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.5 Camera Trouble

Check Points

- Connectors combination

- FPCB status

SUB TO CAMERA CONNECTOR

0.1u

C108

0.1u

C106

0.1u

C107

1V8_CAM2V85_CAM

TP101

TP100

100nH

L102

2V8_CAM_A

6 7 8 9

12 13

14

15

16

17

18

19

2

20

21

22

23

24

3 4 5

CN102

GB042-24S-H10-E3000

1

10 11

L101

100nH

CIF_MCLK

CIF_PCLK

CIF_D1 CIF_D0

CIF_RESET

CIF_PD

CIF_HSYNC

CIF_VSYNC

CIF_SDA

CIF_SCLCIF_D7 CIF_D6 CIF_D5 CIF_D4 CIF_D3 CIF_D2

Check the connector combination

- 73 -

4. TROUBLE SHOOTING

LGE Internal Use Only

START

Replace New

Camera module

Working properly?

Assemble

Yes

No

Check camera connector, 34pin main PCB connector combination then Camera test with equipped camera module

Replace Camera module

Yes

Replace

Main

PCB

LGE Internal Use Only

Only for training and service purposes

4.6 Receiver & Speaker trouble

Check Points

-Speaker contact

-Audio amp soldering

4. TROUBLE SHOOTING

- 74 -

VBAT

AUDIO_IN

BB_SND_R BB_SND_L

FM_SND_R

FM_SND_L

C216 1000p

R210 20K

02

60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

-H10-E3000

C319

2.2u

C222 1u

VBAT

1KR209

EAR_P EAR_N

C320

1u

C221 1u

2V85_CAM

FB309

C321

1u

C217 1u

C219 1u C220 1u

R211 8.2

C215 1u

1uC218

SDA SCL

8.2R212

SDA SCL

CIF_PD CIF_RESET CIF_SCL CIF_SDA

ICVE10184E070R101FR

9

INOUT_B1

8

INOUT_B2

7

INOUT_B3

6

INOUT_B4

FL307 ICVE10184E070R101FR

C213 1u

A4

A5

D1 D2

C1 C2

B2

B3 C3

D4 B4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

G15G2

10

C1N

C1P

INA2 INA1

INB2 INB1

BIAS

SDA SCL

RXIN+ RXIN-

2.2uC212

1

2

3

4

B1

A3

VSS

VDD

U201 MAX9877AEWP_TG45

GND

D3

9

8

7

6

FL305

10

G15G2

INOUT_B4

INOUT_A4

4

INOUT_B3

INOUT_A3

3

INOUT_B2

INOUT_A2

2

INOUT_B1

INOUT_A1

1

VBAT

PGND

C4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

C5

PVDD

2.2uC214

A1

HPR

A2

HPL

D5

OUT+

B5

OUT-

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

G110G2

5

ICVE10184E070R101FRFL303

6

7

8

9

C226 27p

HSO_R

HSO_L

C227 27p

CIF_PCLK CIF_MCLK CIF_HSYNC CIF_VSYNC

CIF_D0 CIF_D1 CIF_D2 CIF_D3

CIF_D4 CIF_D5 CIF_D6 CIF_D7

SPK_RCV_P

SPK_RCV_N

C323 47p

C325 27p

C326 47p

SPK_RCV_P

SPK_RCV_N

LGE Internal Use Only

4. TROUBLE SHOOTING

- 75 -

SPEAKER

SPK_RCV_P

SPK_RCV_N

CN101

1

2

C103

C102 DNIDNI

C226 C227

U201

C218

C217

Speaker contact

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 76 -

(

g

START

Check Speaker ’s

Contacts are clear.

Yes

Input Signal is

High(C217,C218

Output Signal is

High(C226,C227

Pin33,32 of sub

board

Connector

(CN103) is

h?

Hi

) ?

Yes

No

Resolder/Replace

Speaker

Replace Main Board

Replace Audio

U201).

AMP

Replace FPCB_LCD

Yes

C103,C102 of FPCB_Folder

are High?

Yes

Assemble

No

Replace

FPCB_Folder

LGE Internal Use Only

4. TROUBLE SHOOTING

- 77 -

4.7 Microphone trouble

Check Points

-Microphone hole

-Mic. Bias & signal line

2.2u

C330

VBAT

C3270.1u

0.1u C328

ICVL0505101V150FR

VA302

VUSB_USB

39

4

40

41

42

43

44

5 6

3

1 2

CN301

C329

27p

ICVL0505101V150FR

VA301

L305100nH

MAIN_MIC_P

MAIN_MIC_N

VMIC_P

VMIC_N

G3

4

6

G4

OUT

1

5

PWR

MIC100

SPM0204LE5-QB

2

G1

G2

3

MAIN_MIC_P

VMIC_P

MAIN_MIC_N

CN301

C329

C328 C327

MIC100

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 78 -

(

START

Check microphone sound

hole

Mic bias ON

(2.5V)when

call?

C329)

Yes

44pin connector (CN301)is good?

Yes

Check Signal C327,

C328 (2.5V)

Assemble

No

Check mic. Bias

line

Repair the 44pin

conn. (CN301)

Replace

microphone

(MIC100)

LGE Internal Use Only

4. TROUBLE SHOOTING

- 79 -

4.8 Vibrator trouble

Check Points

-Vibrator soldering

-IC is working correct

VIBRATOR

VOUT

U100 SUY98005LT1G

2

GND

VIN

1

3

C114

0.1u

R108

10

R109 100K

R107

1K

VIB

VIB_EN

C100

VB101

1

2

1u

VBAT

VIB

Check the driver IC(U100) of sub boarad

Check the vibrator solderin

g

PIN1

PIN3

- 80 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

START

C100 of FPCB_Folder

is high?

Pin1 of U100(VIB_EN)

is high?

Check

FPCB_Folder or

re

p

lace it

Check FPCB_LCD

or replace it

Yes

No

Check Vibrator sodering

Yes

Pin3 of U100(VIB) is

high?

Yes

No

Replace Vibrator

Assemble

- 81 -

4. TROUBLE SHOOTING

4.9 Keypad back light trouble

Check Points

-Signal path is connected well

LGE Internal Use Only

ICVN0505X150FR

VA100

ICVN0505X150FR

VA101

LEWWS44-E

LD101

R101

47

R100

LD100

LEWWS44-E

VBAT

KEY_BACKLIGHT

KEY TO MAIN CONNECTOR

9

34

35

36

37

38

39

4

40

41

42

43

44

5 6 7 8

2

20 21 22 23

24

25

26

27

28

29

3

30

31

32

33

CN101

GB042-44S-H10-E3000

1

10 11 12 13 14 15 16 17 18 19

VCHG VBAT

2V62_VIO

VUSB_USB

USB_DM

KEY_ROW2

KEY_ROW1

KEY_ROW0

KEY_COL5

MAIN_MIC_P

JACK_DETECT

RPWRON_EN

DSR

UART_TX

UART_RX

FLIP

KEY_BACKLIGHT

FM_ANT

HOOK_DETECT

JACK_TYPE

HSO_L

HSO_R

USB_DP

END_KEY

MAIN_MIC_N

VMIC_P

MAIN_MIC_N

KEY_COL3

KEY_COL2

KEY_COL1

KEY_COL0

KEY_ROW5

KEY_ROW4

KEY_ROW3

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 82 -

START

Check All of LEDs solder

Check TP1 is

2.62V?

Yes

No

Check U202 of main

board

44pin connector

(CN303) is good?

Yes

Replace KEY FPCB

Assemble

No

Replace 44pin

conn.

(CN101)

CN101

TP

LGE Internal Use Only

4. TROUBLE SHOOTING

- 83 -

4.10 SIM & uSD trouble

SIM Check Points

-Power is working

-Socket soldering

-Proper SIM is used

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 84 -

MMC_D(1) MMC_D(0)

MMC_CLK

MMC_CMD MMC_D(3) MMC_D(2)

MMC_DETECT

R329

100K

R330

R334

47

2V62_VIO

100K

R335

100K

R331

2V9_VMME

100K

R332

C324 1000p

100K

R333

START

C312 1u

C322 DNI

2V9_SIM

C313

DNI

SIM_RST SIM_CLK

SIM_IO

4.7K

R328

C314

21

12

11

S3

S7

G3

S8

10

T8

9

T7

8

T6

7

T5

6

T4

5

T3

4

T2

3

T1

2

S4

1

ST1

17

ST2

18

S301

20

14

15S513

S116S2

S6

0.1u

G1 G2

19

C315 27p

C316

10p

Check All of SIM card voltage

KF350 support

2.9V SIM only

6 pins are

soldered well?

Yes

Check Proper

SIM Card

Assemble

No

Yes

Resolder pin

Replace Main Board

LGE Internal Use Only

4. TROUBLE SHOOTING

- 85 -

uSD Check Points

-Power is working

-Socket soldering

-Card detect is working

MMC-DETECT PIN

Card insert Card Deject

MMC_DETECT SIGNAL

TP1 TP2

TP4

TP3

START

TF socket pins

are well soldered

Check proper

uSD?

Assemble

Resolder it

(check data line

TP 1~4 is 2.9V

Signal)

Replace Main Board

Yes

No

Check Micro SD card voltage

(2V8_VMME)

- 86 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.11 Photo senser trouble

Check Points

- photo senser soldering`

- FPCB_Folder Crack

NC1

2

3

NC2

4

NC3

NC4

5

6

OUT

1

VCC

APDS-9005-020U100

2V9_VFM

C101 DNI

R101

12K

PHOTO_ADC_IN

START

Pin6 of U100 is

high?

FPCB is Crack?

Resolder or

Replace photo

senser

Check and Replace

charge pump.

(U101)

Yes

No

Pin1 of photo senser(U100)

is high(2.9v)?

Yes

No

Check Fpcb_folder

and replace

Yes

U100(Photo senser)

Replace FPCB_Folder and

Assemble

CHARGE PUMP

2.2u

C118

1u

C117

1V8_CAM

A2

VBAT

C4

C3

VSS

B2

VSS_CP

CURR31 CURR32

E3

CURR33

D3

CURR41

C1 E1

CURR42

D1

CURR43

E4

CURR6

DATA

A6

DCDC_FB

D6

DCDC_GATE

B5

DCDC_SNS

C6

A1

GPIO

D2

RGB1 RGB2

E2 C2

RGB3

E6

V2_5

VANA_GPI

U101

AS3675

B1

AUDIO_IN

C1_N

B3

C1_P

A4

A3

C2_N

B4

C2_P

CLK

B6

A5

CP_OUT

E5

CURR1

D5

CURR2

C5

CURR30

D4

1u

C112

1uC111

1u

C115

VBAT

1u

C113

2.2u

C116

AUDIO_IN

LED2 LED3

LED4 LED5 LED6

PHOTO_ADC_IN

SCL

MLED

MLED5

MLED1 MLED2 MLED3 MLED4

SDA

LED1

- 87 -

4. TROUBLE SHOOTING

4.12 sideview LED trouble

Check Points

-Signal path is connected well

LGE Internal Use Only

LD102 LD103 LD104 LD105LD100

LD101

LED2LED1 LED3 LED4 LED5 LED6

MLED

CHARGE PUMP

2.2u

C118

1u

C117

1V8_CAM

A2

VBAT

C4

C3

VSS

B2

VSS_CP

CURR31 CURR32

E3

CURR33

D3

CURR41

C1 E1

CURR42

D1

CURR43

E4

CURR6

DATA

A6

DCDC_FB

D6

DCDC_GATE

B5

DCDC_SNS

C6

A1

GPIO

D2

RGB1

RGB2

E2 C2

RGB3

E6

V2_5

VANA_GPI

U101

AS3675

B1

AUDIO_IN

C1_N

B3

C1_P

A4

A3

C2_N

B4

C2_P

CLK

B6

A5

CP_OUT

E5

CURR1

D5

CURR2

C5

CURR30

D4

1u

C112

1uC111

1u

C115

VBAT

1u

C113

2.2u

C116

AUDIO_IN

LED2 LED3

LED4 LED5 LED6

PHOTO_ADC_IN

SCL

MLED

MLED5

MLED1 MLED2 MLED3 MLED4

SDA

LED1

START

Check TP1 is hlgh (2.62V)?

Check TP2 is

high?(2.62v)

Assemble

Check 22pin

connector and

FPCB Folder

Check and Replace

charge pump.

(U101)

Yes

No

Check All of LEDs solder

Yes

Sideview LED

- 88 -

4. TROUBLE SHOOTING

4.13 Trouble shooting of Receiver part

Checking Flow

LGE Internal Use Only

Only for training and service purposes

START

Check point

DCXO

Check point

PLL Control

Setup Test Equipment

Cell Power : -74 dBm

EGSM CH30

DCS CH699

Re-Download S/W & CAL

Check point RX I/Q Signal

Check point

Mobile SW & FEM

➀

➁

➃

➂

Checking Points Figure 1. Main PCB

- 89 -

4. TROUBLE SHOOTING

LGE Internal Use Only

4.13.1. Checking DCXO Circuit

Checking Points Checking Flow

DCXO Circuit Diagram Waveform

Figure 3. DCXO Cicuit

Figure 4. DCXO Waveform

Replace X400

No

Yes

DCXO Circuit is OK.

See next page to check

PLL Circuit.

TP1(C439) : 26MHz

Is the waveform

of TP1(C439) similar to Fig.6?

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

NX3225SA

15

VDDXO2V8

11

XO

XOX

12

16

FSYS1

14

FSYS2

GND1

13

C439

1000p

26MHZ_MCLK

TP1 (C439)

Figur2. DCXO

- 90 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4.13.2. Checking PLL Control signals

Checking Points Checking Flow

Figure 6. Transceiver Circuit Figure 7. PLL Control Waveform

Check U401

Yes

No

Yes

Control Signal is OK.

See next page to check

Mobile SW & FEM.

No

Yes

Check U401

TP1 (RF_EN)

TP3 (RF_CLK)

TP2 (RF_DATA)

U401

EN Signal(TP1) is OK ?

DA(Data,TP2) is Normal ?

CLK(Clock,TP3) is Normal ?

?

RF_EN(TP1)

RF_CLK(TP2)

RF_DATA(TP3)

C434

0.1u

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

NX3225SA

VDDRX2V8

2035

VDDTX1V5

VDDTX2V8

38

VDDVCO2V8

17

15

VDDXO2V8

11

XO

XOX

12

RX2

27

28

RX2X

24

RX3

RX3X

25

22

RX4

RX4X

23

TX1

36

TX2

37

VBIAS

34

18

VCO_RC

VDDBIAS2V8

31

VDDDIG1V5

8

5

VDDDIG2V8

VDDLNA1V5

21

39

VDDMIX2V8

19

VDDRX1V5

3

B

BX

4

7

CLK

DA

6

EN

16

32

FE1

33

FE2

FSYS1

14

FSYS2

10

9

FSYS3

GND1

13

26

GND2

GND3

40

41

GND4

RX1

29

30

RX1X

PMB6272

U401

1

A

AX

2

0.1u

C436C435

0.1u

R410

820

0.1u

C433

C439

1000p

47n

C437

I

IX

Q

QX

RF_CLK

RF_DA

RF_EN

BT_CLK

26MHZ_MCLK

Figure 5. Transceiver

RF Transceiver Circuit Diagram Waveform

TP

4.13.3 Checking Mobile SW & FEM

Mobile SW & FEM Circuit Diagram

Checking Points

LGE Internal Use Only

4. TROUBLE SHOOTING

- 91 -

Figure 8. Mobile SW & FEM Circuit

Figure 9. Mobile SW & FEM

Table 2. FEM RX Control Logic

VC1 (FE1)

GSM 1800 / 1900_ TX

L

LHH

VC2 (FE2)

GSM850 / 900_RX

GSM 1800 / 1900_ RX

H

LMSP43QA-538(CMOS)

L

GSM850 / 900_TX

C410

0.5p

100nH

L406

C407 DNI

6.8nH

L404

C411

0.5p

ANT

G1 G2 G3

ANT400

WFL-R-SMT10

2V85_VRF

C400 1000p

C406 100p

100ohm

R403

100ohm

R402

RF-800SW400

ANT

G1

G2

RF

15

GSM1800_RX1

5

6

GSM1800_RX2

GSM1900_RX1

7

8

GSM1900_RX217GSM850_900_TX

GSM850_RX1

1

2

GSM850_RX2

GSM900_RX1

3

4

GSM900_RX2

23

NC1

24

NC2

19

VC1

VC2

20

21

VDD

11

ANT

GND19GND2

10

12

GND3

GND413GND514GND6

16

18

GND722GND8

GSM1800_1900_TX

LMSP43QA-538

FL400

100p

C402C401

100p

FE1 FE2

SW401

TP3_R402 (FE1)

FL401

TP1

TP2

TP4_R403 (FE2)

TP5 ~ 8

EGSM/GSM850 DCS/PCS

FE1 ON OFF FE2 OFF OFF

TP1

TP4

TP3

TP1

TP9

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 92 -

Figure 10 Mobile SW Figure 11 FEM Control Signals

Check TP1 of SW400

with RF Cable and TP2 of C406

TP1 Signal same

as TP2?

Yes

Check TP3, TP4 of FL400 ?

Yes

Control Signal is

Yes

TP5~8 Signal is

Yes

Mobile SW & FEM is OK.

Check Antenna.

No

Replace Mobile SW

(SW400)

Replace U102

Replace FEM (U401)

FE1

FE2

LGE Internal Use Only

4. TROUBLE SHOOTING

- 93 -

4.13.4. Checking RX I/Q Signals

Figure 12. RX I/Q Circuit

Checking Flow

Checking Points

C434

0.1u

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

NX3225SA

VDDRX2V8

2035

VDDTX1V5

VDDTX2V8

38

VDDVCO2V8

17

15

VDDXO2V8

11

XO

XOX

12

RX2

27

28

RX2X

24

RX3

RX3X

25

22

RX4

RX4X

23

TX1

36

TX2

37

VBIAS

34

18

VCO_RC

VDDBIAS2V8

31

VDDDIG1V5

8

5

VDDDIG2V8

VDDLNA1V5

21

39

VDDMIX2V8

19

VDDRX1V5

3

B

BX

4

7

CLK

DA

6

EN

16

32

FE1

33

FE2

FSYS1

14

FSYS2

10

9

FSYS3

GND1

13

26

GND2

GND3

40

41

GND4

RX1

29

30

RX1X

PMB6272

U401

1

A

AX

2

C435

0.1u

R410

820

0.1u

C433

47n

C437

I

IX

Q

QX

RF_CLK

RF_DA

BT_CLK

Check RX I/Q signals(TP1~TP4)

Signals are

Normal?

Replace

Transceiver

PMB

6

272(U4

0

3

)

Yes

No

RX Part is OK.

Check Base Band Circuit

or

Re-Download S/W and Cal

U401

TP1(I)

TP2(IX) TP3(Q)

TP4(QX)

I

Q

RX

Figure 14. RX I/Q Waveform

Figure 13. RX I/Q

TP1(I)

TP2(IX)

TP3(Q)

TP4(QX)

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 94 -

4.14 Trouble shooting of Transmitter part.

Check point

DCXO

Check point

PLL Control

Setup Test Equipment

Cell Power : - 74dBm

EGSM CH30

DCS CH699

Check point

TX I/Q Signal

Re-Download S/W & RF

CAL

Check point

Transceiver

Check point

PAM Con trol

Check

FEM & Mobile

➃

➂➂

➄

➅

➁

➀

Checking Flow

Checking Points

Figure 15. Main PCB

Figure 16. Main PCB

4.14.1. Checking VCTCXO Circuit

See RX Part “1. Checking DCXO Circuit”

4.14.2. Checking PLL Control Signal

See RX Part “2. Checking PLL Control Signal”

LGE Internal Use Only

4. TROUBLE SHOOTING

- 95 -

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 96 -

4.14.3. Checking TX I/Q Signals

Check TX I/Q Signals(TP1~TP4)

Signals are

Normal ?

Replace

Transceiver

PMB6272(U401)

Yes

No

TX Part is OK.

Check Base Band Circuit

or

Re-Download S/W and Cal

I

Q

I

Q

U401

TX

TP1(I)

TP2(IX) TP3(Q)

TP4(QX)

Figure 17. TX I/Q

Checking Points

Figure 18. TX I/Q

Figure 19. TX I/Q Waveform

Checking Flow

C434

0.1u

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

NX3225SA

VDDRX2V8

2035

VDDTX1V5

VDDTX2V8

38

VDDVCO2V8

17

15

VDDXO2V8

11

XO

XOX

12

RX2

27

28

RX2X

24

RX3

RX3X

25

22

RX4

RX4X

23

TX1

36

TX2

37

VBIAS

34

18

VCO_RC

VDDBIAS2V8

31

VDDDIG1V5

8

5

VDDDIG2V8

VDDLNA1V5

21

39

VDDMIX2V8

19

VDDRX1V5

3

B

BX

4

7

CLK

DA

6

EN

16

32

FE1

33

FE2

FSYS1

14

FSYS2

10

9

FSYS3

GND1

13

26

GND2

GND3

40

41

GND4

RX1

29

30

RX1X

PMB6272

U401

1

A

AX

2

C435

0.1u

R410

820

0.1u

C433

47n

C437

I

IX

Q

QX

RF_CLK

RF_DA

BT_CLK

TP1(I)

TP2(IX)

TP3(Q)

TP4(QX)

4.14.4. Checking Transceiver Output Signals

LGE Internal Use Only

4. TROUBLE SHOOTING

- 97 -

MODE Transceiver Output

GMSK Fixed

8PSK Ramp Burst Control

Figure 20. Transceiver Output Circuit

Figure 21. Transceiver Output

Table 3. Transceiver Output Operation

Checking Points

C434

0.1u

10

R411

X400

26MHz

GND1

2

4

GND2

HOT1

1

3

HOT2

2V85_VRF

C443

NX3225SA

220n

VDDRX2V8

2035

VDDTX1V5

VDDTX2V8

38

VDDVCO2V8

17

15

VDDXO2V8

11

XO

XOX

12

RX2

27

28

RX2X

24

RX3

RX3X

25

22

RX4

RX4X

23

TX1

36

TX2

37

VBIAS

34

18

VCO_RC

VDDBIAS2V8

31

VDDDIG1V5

8

5

VDDDIG2V8

VDDLNA1V5

21

39

VDDMIX2V8

19

VDDRX1V5

3

B

BX

4

7

CLK

DA

6

EN

16

32

FE1

33

FE2

FSYS1

14

FSYS2

10

9

FSYS3

GND1

13

26

GND2

GND3

40

41

GND4

RX1

29

30

RX1X

PMB6272

U401

1

A

AX

2

220n

C440

1V5_VRF

R410

820

0.1u

C433

47n

C437

C444

0.1u

R412

10

BT_CLK

HBAND_PAM_IN

LBAND_PAM_IN

TP1(LBNAD_PAM_IN)

TP2(HBNAD_PAM_IN)

- 98 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

Signals are

Normal ?

Replace

PMB6272(U401)

Yes

N

Transceiver is OK.

See next page to check

PAM Control Circuit.

Check Output Signal

(TP1, TP2)

Checking Flow

Figure 22. Transceiver Output (GMSK)

Figure 23. Transceiver Output (8PSK)

LBAND_PAM_IN (MODE: GMSK) : TP1 LBAND_PAM_IN (MODE: 8PSK) : TP1

- 99 -

4. TROUBLE SHOOTING

LGE Internal Use Only

4.14.5. Checking PAM Control Signals

Table 4. PAM Mode Operation

Figure 25. Transceiver Output

MODE MODE PA_LEVEL TXON_PA GMSK LOW Ramp Burst Control HIGH 8PSK HIGH Control Amp bias HIGH

Figure 24. PAM Control Signals

Checking Points

TP2(TXON PA)

TP1(PA LEVEL)

TP3(PA_MODE)

10KR405

C416

C417 C412 100p

C418 100p

100p47p

TXON_PA

PA_LEVEL

PA_BAND

PA_MODE

HBAND_PAM_IN

TP2(TXON PA)

TP1(PA LE VEL)

TP3(PA MO DE)

- 100 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

Checking Flow

Signals are

Normal ?

Check

PMB8877(U102)

Yes

No

PAM Control Signal is

OK.

See next page to check

FEM & Mobile SW Circuit.

Check Control Signals

(TP1, TP2, TP3)

Figure 26. GSMK Control Signal Figure 27. 8PSK Control Signal

TP3(PA MODE) : C418 TP1(PA_LEVEL) : R405 TP2(TXON_PA) : C417

TP1(PA LEVEL

)

TP2(TXON PA

)

TP3(PA M ODE

)

TP1(PA LE VEL

)

TP2(TXON PA

)

TP3(PA M ODE

)

TP1(PA LE VEL

)

TP2(TXON PA

)

TP3(PA M ODE

)

TP3(PA MODE) : C418

TP1(PA_LEVEL) : R405

TP2(TXON_PA) : C417

- 101 -

4. TROUBLE SHOOTING

4.14.6. Checking FEM & Mobile SW

Checking Points

LGE Internal Use Only

Figure 28. Mobile SW & FEM Circuit

Figure 29 Mobile SW & FEM

VC1 (FE1)

GSM 1800 / 1900_ TX

L

LHH

VC2 (FE2)

GSM850 / 900_RX

GSM 1800 / 1900_ RX

H

LMSP43QA-538(CMOS)

L

GSM850 / 900_TX

C410

0.5p

100nH

L406

C407 DNI

6.8nH

L404

C411

0.5p

ANT

G1 G2 G3

ANT400

WFL-R-SMT10

2V85_VRF

C400 1000p

C406 100p

100ohm

R403

100ohm

R402

RF-800SW400

ANT

G1

G2

RF

15

GSM1800_RX1

5

6

GSM1800_RX2

GSM1900_RX1

7

8

GSM1900_RX217GSM850_900_TX

GSM850_RX1

1

2

GSM850_RX2

GSM900_RX1

3

4

GSM900_RX2

23

NC1

24

NC2

19

VC1

VC2

20

21

VDD

11

ANT

GND19GND2

10

12

GND3

GND413GND514GND6

16

18

GND722GND8

GSM1800_1900_TX

LMSP43QA-538

FL400

100p

C402C401

100p

FE1 FE2

SW401

TP3_R402 (FE1)

FL401

TP1

TP2

TP4_R403 (FE2)

TP5

Table 5. FEM TX Control Logic

EGSM/GSM850 DCS/PCS

FE1 ON OFF FE2 ON ON

TP6

TP5

TP2

TP1

TP3

TP4

TP5,6,7,8

LG KF350 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual