LG KF300 Service Manual

Service Manual
Service Manual
KF300
Model : KF300
Date: February, 2008 / Issue 1.0
1. INTRODUCTION ........................... 5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. SYSTEM SPECIFICATION............... 9
2.1 H/W Features.......................................... 9
2.2 Technical Specification ......................... 10
3. TECHNICAL BRIEF ....................... 15
3.1 Digital Main Processor(AD6900, U101). 15
3.2 Analog Main Processor(AD6855, U100) 18
3.3 Power Amplifier Module(SKY77318, U601)
.............................................................. 25
3.4 FEM (DGM1110M014, FL601) ............. 26
3.5 RTC(FC-135, X100).............................. 27
3.6 Crystal(26 MHz, X601).......................... 28
3.7 RF Tranceiver(AD6548, U602) ..............30
3.8 MEMORY(PF38F5060M0Y0BE, U202)..36
3.9 BT Module with integrated FM tuner
(EWFMLBAXX, U201) ...........................39
3.10 SIM Card Interface...............................41
3.11 Micro-SD Card Interface ......................42
3.12 LCD Interface.......................................43
3.13 Battery Charger Interface.....................46
3.14 Keypad Interface..................................47
3.15 Audio Interface.....................................49
3.16 Camera Interface
(2M Fixed Focus Camera) ...................56
3.17 KEY BACLKLIGHT LED Interface .......59
3.18 Vibrator Interface .................................60
4. TROUBLE SHOOTING ...................61
4.1 RF Component.......................................61
4.2 RX Trouble.............................................62
4.3 TX Trouble .............................................67
4.4 Power On Trouble..................................73
4.5 Charging Trouble ...................................75
4.6 Vibrator Trouble .....................................77
4.7 LCD Trouble...........................................79
4.8 Camera Trouble .....................................83
4.9 Speaker Trouble ....................................87
4.10 Earphone Trouble ................................89
4.11 Receiver Trouble..................................91
4.12 Microphone Trouble .............................93
4.13 SIM Card Interface Trouble..................95
4.14 KEY backlight Trouble .........................97
4.15 RTC Trouble ........................................99
4.16 Folder on/off Trouble..........................101
4.17 Micro SD Trouble ...............................103
4.18 Bluetooth Trouble...............................105
4.19 FM Radio Trouble ..............................107
5. DOWNLOAD.....................................109
5.1 Download .............................................109
6. BLOCK DIAGRAM ........................116
7. CIRCUIT DIAGRAM ......................117
8. BGA IC Pin Check ........................127
9. PCB LAYOUT................................133
10. ENGINEERING MODE ................139
10.1 BB Test [MENU 1]..............................140
10.2 RF Test [MENU 2]..............................142
10.3 MF mode [MENU 3] ...........................142
10.4 Trace option [MENU 4] ......................143
10.5 Call timer [MENU 5] ...........................143
10.6 Fact. Reset [MENU 6] ........................143
10.7 S/W version........................................143
11. STAND ALONE TEST .................144
11.1 Introduction ........................................144
11.2 Setting Method...................................144
11.3 Means of Test ....................................145
12. AUTO CALIBRATION .................147
12.1 Overview ............................................147
12.2 Equipment List ...................................147
12.3 Test Jig Operation..............................148
12.4 Procedure ..........................................149
12.5 AGC ...................................................151
12.6 APC....................................................151
12.7 ADC ...................................................151
13. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 153
13.1 Exploded View .................................. 153
13.2 Replacement Parts ............................155
13.3 Accessory ......................................... 168
Table Of Contents
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static matb which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
2. SYSTEM SPECIFICATION
2.1 H/W Features
2. SYSTEM SPECIFICATION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion Polymer, 3.7V 800mAh
Stand by TIME Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM850/EGSM: -109dBm, DCS/PCS: -109dBm
TX output power
GSM850, EGSM: 32.4dBm(Level 5), DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display
MAIN : TFT 240 × 320 pixel 262K Color
SUB : TFT 128 × 160 pixel 262K Color
Hard icons. Key Pad
Status Indicator
0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key Menu Key, Clear Key, Back Key, Confirm Key Send Key, Volume Key, PWR Key, Camera Key, Hot Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver 16Ø Speaker / 11x07 Receiver
Travel Adapter Yes
MIDI SW MIDI (Mono SPK)
Camera 2M
Bluetooth / FM Radio Bluetooth version 2.0 / 76~108MHz supported
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2. SYSTEM SPECIFICATION
2.2 Technical Specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM850
TX: 824 ~ 849MHz RX: 869 ~ 894MHz
EGSM
TX: 880 ~ 915MHz RX: 925 ~ 960MHz
DCS1800
1Frequency Band TX: 1710 ~ 1785MHz
RX: 1805 ~ 1880MHz
PCS1900
TX: 1850 ~ 1910MHz RX: 1930 ~ 1990MHz
2 Phase Error
RMS < 5 degrees Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM850/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS/PCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. SYSTEM SPECIFICATION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM850/EGSM
Offset from Carrier (kHz). Max. [dBc]
100 0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS/PCS
Offset from Carrier (kHz). Max. [dBc]
100 0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM850/EGSM
Offset from Carrier (kHz) Max. [dBm]
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. SYSTEM SPECIFICATION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS/PCS
Offset from Carrier (kHz) Max. [dBm]
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850/EGSM
8Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
DCS/PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
13 Receiving Response
1,000 0 -6
3,000 4 -6
3,400 4 -6
4,000 4 -9
*Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. SYSTEM SPECIFICATION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Distortion
-20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
≤2.5 ppm
(13 MHz) tolerance
19 32.768KHz tolerance ≤ 30 ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : Typ. 430 mA
21 Charge Current Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
Bar Number Power
7 -93~
7 → 5 -93 2
22 Antenna Display 5 → 4 -98 2
4 2-101 2
2 1-104 2
1 0-106 2
0 OFF ~-106
Battery Bar Number Voltage
3≤3.75 0.05 V
23 Battery Indicator 3 → 2 3.75 0.05 V
2 → 1 3.64 0.05 V
1 0 3.54 0.05 V
Item Description Specification
24
Low Voltage Warning ≤ 3.54 0.05V (Call)
(Blinking Bar) ≤ 3.4 0.05V (Standby)
25
Forced shut down
3.33 0.05V
Voltage
26 Sustain RTCwithout battery Over 50 hours
Li-Ion Battery
27 Battery Type
Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh
Switching-mode charger
28 Travel Charger Input: 100 ~ 350V, 50/60 Hz
Output: 5.1 V, 700 mA
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2. SYSTEM SPECIFICATION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1 Digital Main Processor(AD6900, U101)
The AD6900 is an advanced, low-power baseband processing solution from Analog Devices, and is part of the AD20msp500 SoftFone® chipset family. The AD6900 is intended for use in a wide variety of feature-rich phones with GSM/GPRS/EGPRS based system connectivity requirements. It is designed to interface easily to an application/OS processor, or to stand alone as a fully integrated and easy-to­use solution for mobile handset and wireless modem applications.
Figure. 3-1 AD6900 FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.1.1 Features of AD6900
Complete Single-Chip Programmable Digital Baseband Processor with four main subsystems
MCU Control Processor Subsystem:
32-bit ARM926EJ-S® MCU Control Processor 260 MHz operation at 1.5V dedicated caches, 16K bytes each, for instructions and data 4kB Instruction Tightly Coupled Memory (TCM) 2-Mbit On-chip System SRAM Ciphering coprocessor for GPRS supporting GEA1 and GEA2 encryption algorithms Kasumi cipher coprocessor for GEA3 encryption Dedicated multichannel DMA controller
DSP Subsystem:
Blackfin 16-bit fixed-point DSP Processor 260 MHz operation at 1.5V Memory:
L1 program space: 64 kB SRAM and 16 kB configurable as instruction cache or SRAML1 data space: Two banks of 16K bytes, each with 8K bytes of dedicated SRAM and an
additional 8K bytes that can be configured as either cache or SRAM
L2 space: 64KB SRAM Ciphering coprocessor (GEA1 and GEA2) Kasumi cipher coprocessor for GEA3 encryption Dedicated multichannel DMA controller
Peripherals Subsystem:
Shared on-chip peripherals and off-chip interfaces: Support for Burst-mode, Page-mode, and NAND Flash memory Support for SRAM, SDRAM, and PSRAM (cellular RAM) Full-Speed USB 2.0 Dual-Role Interface with OTG (On-The-Go) Host Mode or traditional Peripheral­only mode
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Applications Subsystem for Enhanced Multimedia:
Parallel Peripheral Interface (PPI) for 10-bit dedicated camera
sensor or video input interface (including ITU-656 and ITU-601 digital video)
Separate external bus interface for parallel LCD displays (or camera module inputs)
- reduces noise and loading on the
main EBUS interface
Dedicated multi-channel DMA controller
OTHER FEATURES
Real-Time Clock (RTC) with Alarm
Four General-Purpose Timers
Baseband Converter Interface
Compatible with Othello® radio subsystem
Highly configurable interrupt controller architecture
Programmable bus arbitration to optimize system performance
Supports 13 MHz and 26 MHz Input Clocks
Programmable Power Management and Clock Management
- Slow Clocking Scheme for Low Idle Mode Current
- Power Down modes
- Dynamic Core Voltage Scaling from 1.1 - 1.5V Independent I/O Voltage Domains On-chip support for EGPRS Data Services up to Class 10 Embedded Trace Macrocell for MCU Debug JTAG Interface for Test and In-Circuit Emulation of both the MCU and DSP Advanced features for security
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
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3.2 Analog Main Processor(AD6855, U100)
The AD6855 is a complete mixed-signal baseband processor that combines all of the data converters and power supply regulators required for a GSM 900 / GSM 850 / DCS 1800 / PCS 1900 mobile on a single device, including HSCSD, GPRS and EGPRS.
Figure. 3-2-1 AD6855 FUNCTIONAL BLOCK DIAGRAM
- 19 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.2.1 General Description
The AD6855 baseband transmit section supports the following mobile station GMSK modulation power classes:
GSM 900/850 power classes 4 and 5, DCS 1800 power classes 1 and 2, and PCS 1900 power classes 1 and 2.
The AD6855 baseband transmit section supports the following mobile station 8-PSK modulation power classes:
GSM 900/850 power classes E2 and E3, DCS 1800 power classes E2 and E3, and PCS 1900 power classes E2 and E3.
The AD6855 baseband receive section supports GMSK and 8-PSK applications. The AD6855 auxiliary section provides a voltage reference, an automatic frequency control DAC, an auxiliary ADC, and light controllers. The auxiliary ADC provides two channels for measuring temperature using discrete external devices placed in critical locations. The AD6855 audio section provides 8 kHz and 16 kHz sampling rates for voiceband data input and output and provides nine standard sample rates ranging from 8kHz to 48 kHz for personal audio output on two PCM Audio serial ports. The two Audio serial ports allow support for concurrency. The AD6855 power management section provides voltage regulators for digital and analog components, a battery charger, battery protection circuitry, and power supply activation logic. The AD6855 digital processor interface provides serial ports for control data, baseband transmit and receive data, and two for audio data.
- 20 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.2.2 Power Block
CSPORT interface, power management control interface and the circuit that generates power up RESET pulses (RESET2P8 and RESET1P8) for use by the DBB chip. All regulators except the USB interface regulator are powered from the main battery. The USB regulator is powered from USB VBUS. And the user presses KEYON which puts the AD6855 power management system into ACTIVATION state (see definitions below) and signals DBB software that it’s time to wake up and operate using the KEYOUT signal.
Figure. 3-2-2 AD6855 POWER BLOCK DIAGRAM
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-2-3 AD6855 KEYON/KEYOUT BLOCK DIAGRAM
Figure. 3-2-4 AD6855 RESET GENERATION BLOCK DIAGRAM
- 22 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Power On Reset Generator
The power-on reset signals (RESET1P8 and RESET2P8) are asserted based on the VCORE (if VAPPCFG = 0), VMEM, VEXT, and VPLL regulators. RESET1P8 and RESET2P8 are low when reset is enabled and high when reset is disabled. When the outputs of all four regulators reach their corresponding threshold voltages, reset will be disabled after a nominal reset period of 130ms. The outputs of all four regulators must remain at or above their corresponding threshold voltages for the duration of the reset period for reset to be disabled (pulled high). The nominal 130ms reset period is restarted whenever all four regulators reach their threshold voltages. The nominal reset period of 130ms can be extended by connecting an external capacitor to CRST. This capacitor is charged using a small current when reset is enabled. Once the capacitor reaches the threshold, reset is disabled. Reset will be enabled immediately if any one of the four regulators falls below their corresponding threshold voltages. In addition, reset will be enabled if VBAT falls below VRTC. The PWREN signal is the logical AND of all the state controls that enable or disable many of the regulators on the chip. If the regulators enabled by PWREN are disabled by PMT state controls described below then PWREN must go low. When PWREN goes low reset will be immediately enabled causing RESET1P8 and RESET2P8 to be pulled low. When reset is enabled, both RESET1P8 and RESET2P8 are actively pulled low. CRST is also actively pulled low when reset is enabled.
VABB Regulator Enable/Disable Logic Operation
The VABB regulator powers many on-chip analog circuits on the ABB. The VCXOEN signal, the VABBEn bit in the LDOControl1 Bit Positions ( Addr 0x35) register, and the AFCDACMode and AFCDACOn bits in the AuxControl1 Bit Positions ( Addr 0x13) register all particpate in controlling the VABB enable/disable. When the ABB power management system transitions from Off state, DDLO state, UVLO state, or Thermal Shutdown State to Power Key Activation, Charger Activation, USB Charger Activation, or Active State VABB will be enabled. During these state transitions ABBEn = 0 and AFCDACMode = 0, VRF is enabled. Once the ABB power management system is in Power Key Activation, Charger Activation, USB Charger Activation, Active-Standby or Active State the VABB regulator enable/disable is controlled by the information written to the VABBEn and AFCDACMode register bits by system software.
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Digital Baseband Core (VCORE)
The Digital Baseband Core regulator supplies the digital baseband processor (DBB) core. The voltage on VCORE is selectable using the VCOREControl register. The VCOREActive code selects the voltage on VCORE in high power mode and the VCOREStandby code selects the voltage on VCORE in low-power mode.
DBB Interface (VINT)
The DBB interface regulator supplies the DBB/ABB digital interfaces. The output voltage of the VINT regulator is nominal 1.8V.
Memory (VMEM)
The VMEM regulator supplies the external memory(s) and the interface to the external memory on the digital baseband processor. The output voltage of the Memory Interface regulator can be selected as
1.8V nominal or 2.8V nominal using the VMEMSEL terminal.
External Interface (VEXT)
The External Interface regulator supplies the Radio digital interface and the high voltage (>1.8V) interface between the digital baseband processor and various peripherals, such as the LED indicators and the LCD display.
SIM Interface (VSIM)
AD6855 is designed to support 3.0 V and 1.8 V SIMs exclusively (i.e. no 5 V SIMs). The SIM Interface regulator supplies the SIM interface circuitry on the digital processor and the SIM card. By default the SIM Interface regulator output is 2.85 V, which can be decreased to 1.8 V if a 1.8 V SIM is detected.
Real-Time Clock (VRTC)
The Real-Time Clock regulator supplies the Real-Time Clock module. The Real-Time Clock regulator is optimized for low ground current.
Baseband Analog (VABB)
The Baseband Analog regulator supplies the analog portions of the AD6855. Operation of the VABB regulator is controlled by the VABBEn bit in the LDOControl1 register. If VABBEn = 0, the VABB regultor will be disabled unless the AFCDAC is enabled or VCXOEN = 1. If VABBEn = 1 (the default state) VABB is enabled along with VCORE, VMEM, and VEXT. The Baseband Analog regulator is optimized for high ripple rejection and low noise. The output of the Baseband Analog regulator should not be used as a supply for any external components.
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Microphone (VMIC)
The Microphone regulator supplies the microphone interface circuitry. The Microphone regulator is optimized for extremely high ripple rejection up to 217 Hz and low noise.
VRF (VRF)
The VCXO regulator supplies the voltage controlled crystal oscillator (VCXO). The VCXO regulator is optimized for high ripple rejection and low noise.
USB Interface (VUSB)
The VUSB regulator supplies the USB transceiver located in the DBB. Digital Baseband PLL (VPLL) The VPLL regulator supplies the phase locked loop on the digital baseband (DBB).
General Purpose Regulator (VGP)
The General Purpose regulator is intended primarily to serve as a supply rail for camera modules. Its voltage is programmable by setting VGPSel[3:0] in theLDOControl2 Register. VGP is enabled by setting the VGPEn bit in LDOControl1 to 1.
Applications Regulator (VAPP)
The VAPP regulator is an adjustable regulator that uses an off chip pass device. It has two modes of operation selected by the state of the VAPPCFG terminal. If VAPPCFG is pulled low the VAPP regulator functions as a programmable voltage applications supply. In this mode, VAPP is enabled or disabled using the VAPPEn bit of LDOControl1.
3.3 Power Amplifier Module(SKY77318, U601)
3.3.1 Internal Block Diagram
3.3.2 General Description
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 ߟ input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Hetero-junction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current.
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-3-1 SKY77318 FUNCTIONAL BLOCK DIAGRAM
3.4 FEM (DGM1110M014, FL601)
The FEM is integrated of quadband RX SAWs, internal diplexer and ESD protection at Ant port to 8kV acc.
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3-4-2 FEM CIRCUIT DIAGRAM
Figure 3-4-1 Band SW Logic Table
2
1
ANT_SW1 ANT_SW2
GSM850/900 TX L H
DCS/PCS TX H H
GSM850/900 RX L L
DCS/PCS RX H L
GND6
20
2V75_VCXO
C632 39p
C628
0.1u
R612
10
GND5
19
GND4
18
GND3
16
GND2
11
GND1
9
VDD
12
VC2
13
VC1
14
DGM1110M014
C643
FL601
100p
GSM1800_1900_TX
C644
100p
GSM850_900_TX
GSM1900_RX2 GSM1900_RX1 GSM1800_RX2 GSM1800_RX1
GSM900_RX2 GSM900_RX1 GSM850_RX2
ANT
GSM850_RX1
17
15 10
8 7 6 5 4 3 2 1
ANT_SW ANT_SW
3.5 RTC(FC-135, X100)
The AD6900 supports a Real Time Clock function. A total of 25pF+/-10% capacitance to graound is required (including board trace capacitance) on each OSCIN and OSCOUT. RTC functionality allows the application software to implement standard clock, calendar, or organizer functions.
A 32KHz clock is required in AD6900 based systems to take advantage of power saving “slow clocking” mode. A combination of an oscillator circuit within the AD6900 IC and an external 32KHz crystal results in a stable 32kHz clock for use in the system. The purpose of this application note is to discuss the system issues that affect operation of the 32kHz oscillator circuit.
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-5-1 32.768KHz Crystal Basic Connections
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.6 Crystal(26 MHz, X601)
The AD6548 requires only an external low cost as the frequency reference. The circuitry to oscillate the crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of fixed offsets, and an integrated varactor for dynamic control. The oscillator is designed for use with a 26MHz crystal. The crystal is connected as shown in figure 3-3.
Figure. 3-6-1 Crystal Oscillator External Connection
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Dedicated control software ensures excellent frequency stability under all circumstances. The AD6548 reference oscillators provides a 26MHz 600mVpp (typical) output (REF_OP), for use as the baseband clock input.
The AD6548 integrates this frequency tuning range the tuning section comprises a switchable capacitor array for discrete steps and varactor for fine tuning. Contol of the tuning process is driven by software, whereby the frequency can be maintained accurately during reception gaps and initial frequency upon startup can be accurately estimated without the need for temperature sensors.
Figure. 3-6-2 Crystal Circuit Block Diagram
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.7 RF Tranceiver(AD6548, U602)
3.7.1 GENERAL DESCRIPTION
The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip, all radio and power management functions necessary to build the most compact GSM radio solution possible. The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad band applications the front end features four fully integrated programmable gain differential LNAs. The RF is then downconverted by quadrature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive path features automatic calibration and tracking to remove DC offsets.
Figure. 3-7-1 CIRCUIT DIAGRAM of RF Tranceiver
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3. TECHNICAL BRIEF
The transmitter features a translation-loop architecture for directly modulating baseband signals onto the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and including class 12.
3.7.2 FUNCTIONAL DESCRIPTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-7-2 RECEIVER CHAIN BLOCK DIAGRAM
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