Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This spec. sheet applies to LW45A Chassis applied TV all
models manufactured in TV factory
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15. In case of keeping module is in the circumstance of 0
°C, it should be placed in the circumstance of above 15
°C for 2 hours. In case of keeping module is in the circumstance of below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.
3. Main PCBA Adjustments
3.1. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
▪ W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel's W/B deviation
(2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity : 20 % ~ 80 %
4) Before White balance adjustment, Keep power on
status, don’t power off
* Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should
be within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during
5 Minutes.
2) In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
4.1.3. Equipment connection
Co lor Ana ly ze r
Pro be
DFT JIG
RRGB Cabl eS -23 2C
Patt er n G en erat or
Signal S ourc e
* If TV internal pattern is used, not needed
4.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDIDDATA
wb0000Begin White Balance adjustment
wb00ff
End White Balance adjustment
(internal pattern disappears )
1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration
before adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
* LED White balance table
If Model is Polaris Model, G-gain x is applied.
(1) Cool Mode
1) Purpose : Especially G-gain x adjust leads to the lu-
minance enhancement. Adjust the color temperature
to reduce the deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Adjust the G gain more than 172 ( If R
gain or G gain is more than 255 , G gain can adjust
less than 172 ) and change the others ( R/B Gain ).
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default
data) and decrease the others.
3)Adjustment mode : Two modes – Medium / Warm
4.1.6 Reference
(White Balance Adj. coordinate and color temperature)
1) Luminance: 204 Gray, 80IRE
2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
4.1.7. Reference
(White Balance Adj. coordinate and color temperature)
* The spec of color temperature and coordinate.
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at total
assembly line, consider x,y coordinates might be up to 0.007
than x,y target of each color temperature.
Cool9,300k°K X=0.274 (±0.03)
Medium8,000k°K X=0.290 (±0.03)
Warm6,500k°KX=0.318 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.278 (±0.03)
Y=0.298 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
- Inner pattern
for W/B adjust
- External white
pattern
(80IRE, 204gray)
Inner pattern
(204gray,80IRE)
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After nal inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by
mode.
7. GND and Hi-pot
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
2) Automatically detecting update le in USB Stick.
- If your downloaded program version in USB Stick is Low, it
didn't work. But your downloaded version is High, USB data
is automatically detecting.(Download Version High & Power
only mode, Set is automatically Download)
3) Show the message "Copying les from memory".
4) Updating is starting.
5) Updating Completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
10. Optional adjustments
10.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘►’ or ‘OK’
key at ‘ADC Calibration’
lGhkq|z{G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\GG G
\UGjGnGG G
]UGhGvGG G
^UGhkjGjGG ඖG
_UG~GiGG G
`UGXWGwG~iGG G
XWUG{GwGG G
XXUGlkpkGkVsGG G
XYUGzGiVjG
XZUG{GzGzG
X[UGlUpGhG
G
G G
→ Caution : Using ‘P-ONLY’ button of the Factory SVC remo-
con when turns TV on.
10.2. Manual White balance Adjustment
10.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface.(80°~
100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → White Bal-
ance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be xed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
JK102
PPJ243-21
COMPONENT
[RD1]E-LUG
6B
[RD1]C-SPRING
5B
[RD1]CONTACT
4B
[WH1]C-SPRING
5A
[WH1]E-LUG
6A
[RD3]E-LUG
6G
[RD3]C-SPRING
5G
[RD3]CONTACT
4G
[WH2]C-SPRING
5F
[RD2]C-SPRING
5E
[RD2]E-LUG-S
7E
[BL]C-SPRING
5D
[GN/YL]CONTACT
4C
[GN/YL]C-SPRING
5C
JP108
JP107
ROUT
LOUT
RIN
LIN
COMPONENT
ZD105
SD05
ZD106
SD05
COMPONENT
COMPONENT
ZD103
SD05
ZD104
SD05
COMPONENT
COMPONENT/AV_IN/OUT
COMPONENT
R145
75
COMPONENT
R146
75
COMMON_R
COMMON_B
CONTROL Key
IR & LED
+3.5V_ST
R126
10K
READY
R127
10K
B
LED_B
KEY1
KEY2
EEP_SCL
EEP_SDA
LED_MT45_270ohm
C
Q120
MMBT3904(NXP)
E
IR
+3.5V_ST
R122
100
R123
100
2013.10.18 CJLIM
LED current setting
R124-*2
R124
100
270
R124-*1
READY
680
R125
100
+3.5V_ST
R120
3.3K
C120
0.1uF
16V
LED_MT44_100ohm
LED_LB45_680ohm
R130
100
C125
4.7uF
10V
R121
3.3K
C122
READY
D124
5.6V
50V
100pF
20V
D126
C121
0.1uF
20V
D120
C123
READY
16V
50V
100pF
C124
1000pF
50V
20V
D127
C126
4.7uF
10V
D121
45A/450A
P120
12507WR-12L
1
JP120
2
JP121
3
JP122
20V
20V
D123
JP123
JP124
JP125
JP126
JP127
JP128
JP129
4
5
6
7
8
9
10
11
12
13
JP130
JP131
42A
P121
SMAW200-05
1
2
3
4
5
JK101
PPJ234-03
[GN/YL]E-LUG
6C
33A/4050
[YL]E-LUG
6E
[YL]O-SPRING
5E
[YL]CONTACT
4E
[WH2]O-SPRING
5D
[RD2]CONTACT
4C
[RD2]O-SPRING
5C
[RD2]E-LUG-S
7C
[WH1]O-SPRING
5B
[WH1]E-LUG-S
7B
[RD1]CONTACT
4A
[RD1]O-SPRING
5A
[RD1]E-LUG
6A
12.12.19. ESD(Add zenerDiode)
12.12.18 : ESD(Add to zener diode)
ZD101
JP101
SD05
ZD102
SD05
D103
20V
JP103
LIN
JP102
D102
20V
RIN
JP104
C103
D104
1000pF
20V
50V
LOUT
JP105
C105
D105
1000pF
20V
50V
ROUT
R101
75
R106
10K
R103
10K
C
B
E
Q101
MMBT3904(NXP)
C
B
E
Q103
MMBT3904(NXP)
R108
1K
R109
1K
R112
3.9K
R113
3.9K
R107
12K
R104
12K
R105
220K
R102
220K
To improve EMS S2a issue.
2013.11.27 by BJ.KIM
To improve EMS S2a issue.
2013.11.27 by BJ.KIM
C102
1000pF
50V
C101
1000pF
50V
C10 4
10u F
10V
C10 6
10u F
10V
AV_IN/OUT
COMMON_VIN
AUDIO_LIN
EMS Improve(12.12.28)
READY -> 1000PF
AUDIO_RIN
MNT_LOUT
MUTE_AOUT
POP NOISE
MNT_ROUT
MUTE_AOUT
POP NOISE
MODULE_HD
P101
10031HR-30
31
MODULE_FHD
LVDS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
JP110
READY
R110
10K
R111
10K
READY
C112
10uF
16V
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
+3.3V_M
PANEL_VCC
P102
10031HR-30
31
PANEL_VCC
JP111
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
INTERLACE MODE
Change Option Name.(22LN4300 -> 22LB)
22LB
-. TN FHD : PWM OUT(If not use : NC)
R100
-. IPS FHD : Interlace(If not use : GND)
0
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
RXA3+
RXA3RXACK+
RXACKRXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0RXB3+
RXB3RXBCK+
RXBCK-
RXB2+
RXB2RXB1+
RXB1RXB0+
RXB0-
MODULE_HD_18.5
P103
10031HR-30
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
PANEL_VCC
JP112
1
2
3
4
5
6
7
8
9
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1/LVDS
44A/45A/450A
INPUT1/LVDS
2013/08/21
1 8
Page 26
EAX65643103
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
JK201
SPG09-DB-010
6
1
11
7
2
12
8
3
13
9
4
14
10
5
1.RED
2.GRN
3.BLU
4.NC
5.ST-DET
7.GNC
8.B_GND
9.G_GND
10.R_GND
11.GND
12.SDA
13.HSYNC
14.VSYNC
15.SCL
16
SHILED
15
SIDE USB
SIDE_USB
3AU04S-305-ZC-(LG)
JK202
1234
USB DOWN STREAM
5
JP211
JP208
JP209
JP210
READY
ZD220
READY
ZD221
RGB
RED_GND
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
44A/45A/450A
INPUT2
2013/08/21
2 8
Page 27
EAX65643103
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
AUAMP_SDA
AUAMP_SCL
+3.3V_M
I2S_SDO
I2S_WS
I2S_SCK
R308
4.7K
R309
4.7K
R305100
R306100
20130914 cjlim
READY -> APPLY
+3.3V_M
To improve CST issue.(X5R -> X7R)
EAE31360401->EAE52158501
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
44A/45A/450A
AUDIO
2013/08/21
3 8
Page 28
TBD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
B1
B1
IF
NTSC
TU402
TDSS-H701F
NC_1
1
NC_2
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_3
6
NC_4
7
NC_5
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
A1
A1
NTSC
C408
0.1u F
+1.8V_M
READY
L402
BLM18PG121SN1D
NTSC
C409
10uF
10V
16V
A1
A1
MULTI_TUNER
TU401
TDJH-G101D
B1[+3.3V]
1
NC_1
2
IF_AGC
3
SCL
4
SDA
5
IF[P]
6
IF[N]
7
NC_2
8
NC_3
9
B1
B1
Near the pin
To set multi option for NTSC
2013.11.27 by BJ.KIM
R412-*1
R412
1K
PAL
C410
0.1uF
should be guarded by ground
16V
100
C405
0.1uF
16V
NTSC
+3.3V_TU
C404
22uF
6.3V
Close to the tuner
+3.3V_M
L401
BLM18PG121SN1D
+3.3V_TU
READY
R404
100K
READY
R403
100
READY
C401
0.1uF
IF_AGC
R413
PAL
R414
PAL
10
10
16V
C402
20pF
50V
NTSC
R413-*1
33
NTSC
R414-*1
33
To change the value from 0ohm to 33ohm at NTSC.
2013.11.27 by BJ.KIM
C403
20pF
50V
TUNER_RESET
R415 33
R416 33
+3.3V_TU
R407
1K
C406
20pF
50V
READY
C407
20pF
50V
READY
R408
1K
TUNER_SCL
TUNER_SDA
IF_P
IF_N
47
12
SHIELD
C414
1000pF
630V
SHIELD
C411
1000pF
630V
C413
1000pF
630V
READY
R401
R402
READY
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER
44A/45A/450A
TUNER & IR
2013/08/21
4 8
Page 29
TBD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C501 X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue
2013.11.27 by BJ.Kim
L502
1
2
3
4
ST 1.26V
DDR 1.8V
C503
22uF
6.3V
ST 3.3V
C504
10uF
10V
C501 X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue
2013.11.27 by BJ.Kim
Renesas
IC503
8
7
6
5
VCC
WP
SCL
SDA
+3.5V_ST
C573
22pF
READY
+3.3V_ST
C572
0.1uF
16V
C574
22pF
READY
BR24G256FJ-3
A0
A1
A2
GND
R569
4.7K
IC503-*1
1
2
3
4
Rohm
R577
4.7K
VCC
8
WP
7
SCL
6
SDA
5
IC503-*2
AT24C256C-SSHL-T
VCC
A0
8
1
WP
A1
7
2
SCL
A2
6
3
GND
SDA
4
5
Atmel
EEP_SCL
EEP_SDA
Add ROHM & ATMEL
+3.5V_ST
FLASH_WP
H/W RESET
SERIAL FLASH(8MB)
DO[IO1]
WP[IO2]
GND
W25Q64FVSSIG
CS
1
2
3
4
R581
10K
SPI_CZ
SPI_DO
R571
100
R572
100
R576
100
FLASH_WINBOND
IC502
8
7
6
5
2013.11.27 by BJ.KIM
+3.5V_ST
VCC
%HOLD[IO3]
CLK
DI[IO0]
C576
0.1uF
16V
READY
R574
100
R575
100
C575
0.1uF
16V
FLASH_MXIC
IC502-*1
MX25L6406EM2I-12G
CS
1
SO/SIO1
2
WP
3
GND
4
SPI_CLK
SPI_DI
VCC
8
HOLD
7
SCLK
6
SI/SIO0
5
R512
1M
X501
24MHz
C530
15pF
C531
15pF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN SOC
C532
0.1uF
+3.3V_ST
To add multi option for NTSC
R513,R514 : 0 ohm
2013.11.27 by BJ.KIM
C536,C537 : 390pF->33pF
13.01.14
C536,C537 : 33pF use only PAL(Not use NTSC)
2013.11.27 by BJ.KIM
C533
0.1uF
PAL
R513
100
+3.3V_ST
C534
0.1uF
PAL
C536
33pF
IF_P
READY
L521
100NH
READY
NTSC
R513-*1
0
C551
220pF
50V
XTALO40XTALI
AVDD3P3_DMPLL
NTSC
PAL
R514
100
R514-*1
0
C535
0.1uF
+3.3V_M
PAL
C537
33pF
Close to MSTAR
IF_N
R517
10K
IFAGC
+1.8V_M
R524
0
Close to MSTAR
IF_AGC
VSS
C542
0.1uF
C541
0.022uF
16V
VIFP44VIFM
AVDD3P3_DADC
GPIO56
GPIO6053GPIO61
AVDD_DDR
GPIO55/I2S_OUT_WS
GPIO58/I2S_OUT_SD
GPIO57/I2S_OUT_BCK
I2S_SCK
I2S_WS
I2S_SDO
TUNER_RESET
C543
0.1uF
VDDP
33
R52 033R52 1
TUNER_SCL
TUNER_SDA
LVA4P57LVA4M58LVA3P59LVA3M
VDDC_1
C544
0.1uF
+1.2V_VDDC
+3.3V_ST
RXA3+
RXA3+
LVACLKP
RXA3-
RXACK+
RXA3-
RXACK+
LVA2P64LVA2M
LVACLKM
AVDD_MOD_2
RXA2+
RXACK-
RXA2+
RXACK-
C545
0.1uF
+3.3V_ST
RXA2-
RXA2-
JP501
JP502
JP503
JP504
C560
0.1uF
VCC
IC504
APX803D29
RESET
3
2
1
GND
44A/45A/450A
MAIN SOC5 8
C562
4.7uF
10V
R561
10K
R562
470
C561
4.7uF
10V
R563
POWER_DET
R564
0
C563
62K
0.1uF
16V
HW_RESET
2013/08/21
Page 30
TBD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
INV_ON
PWM_DIM
BLU_CURRENT_CTL
18.5_AUO
R611-*4
2.7K
1%
18.5_AUO
R612-*4
33K
1%
READY
R601
10K
18.5_BOE
R611-*3
1.8K
1%
18.5_BOE
R612-*3
39K
1%
R603
10K
B
DRIVER
R608
100
18.5_CMI
18.5_CMI
READY
READY
C603
R609
100K
R611-*2
2.7K
R612-*2
36K
50V
100pF
FHD_22_HEESUNG/FHD_24
FHD_22_HEESUNG/FHD_24
Add BLU Current Option
2013.01.05
+5V_USB
R602
3K
C
Q601
MMBT3904(NXP)
E
READY
R610
100K
R611-*1
0
R612-*1
39K
VOUT
R604
1K
1%
DRIVER
R606
560K
1%
HD_24/FHD_22
R611
680
HD_24/FHD_22
R612
20K
DRIVER
R605
100K
1%
DRIVER
R607
27K
1%
DRIVER
C601
1000pF
50V
DRIVER
C602
1000pF
50V
BLU_ON
BOOST
R627
0
OVP
NC_1
PGND_1
PGND_2
PDIM
RISET
LS8
LS7
LS6
LS5
NC_2
EN
+19V
DT1641AS
1
2
3
4
5
6
7
8
9
10
11
12
DRIVER
C606
10uF
25V
DRIVER
IC601
DRIVER
C607
10uF
25V
25
THERMAL
24
23
22
21
20
19
18
17
16
15
14
13
[EP]GND
VIN
VREF
CS
NDRV
RSS
COMP
RT
LS1
LS2
LS3
LS4
LGND
DRIVER
R616
240K
DRIVER
R613
39K
1%
1%
DRIVER
C614
1uF
25V
DRIVER
R617
10K
DRIVER
R614
1.5K
DRIVER
L601
33UH
EMI Improve
0-> 3.3ohm(12.12.25)
3.3-> 5.6ohm(12.12.25)
1%
4700pF
DRIVER
R615
1%
1.5K
DRIVER
R620
5.6
DRIVER
C605
50V
1%
R618
DRIVER
DRIVER
C604
0.047uF
25V
0.1
DRIVER
D602
BR210
100V
D
DRIVER
Q602
AOD478
G
S
1%
VA600
VA601
READY
READY
READY
JP601
JP602
2CH/4CH
R621 0
READY
R625
0
READY
R626
0
1
2
3
4
5
6
7
P602
2CH/4CH
2CH/4CH
R622 0
R623 0
2CH/4CH
R624
0
2CH/4CH
11
12
13
VA602
READY
10
VA603
9
JP603
JP604
8
7
JP605
JP606
3
4
5
6
VA604
READY
READY
READY
JP607
1
2
05002H R-H 12J05
VA607
READY
VOUT
DRIVER
DRIVER
DRIVER
JP609
JP608
8CH
P601
C609
10uF
100V
C610
10uF
100V
C611
1uF
100V
DRIVER
C612
1uF
100V
DRIVER
C613
1uF
100V
VA606
VA605
12507WR-06L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED DRIVER
44A/45A/450A
LED_Driver
2013/08/21
6 8
Page 31
TBD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
19V TO ST3.3V DCDC CONVERTER
KJA-DC-1-0032
+19V
JK700
JP701
4
4
2
2
1
1
JP702
19V TO PANEL VCC(12V/5V) DCDC CONVERTER
R720
47K
C721
C720
0.1uF
10uF
25V
25V
19V TO USB 5V DCDC CONVERTER
2013.08.09
APPLY -> READY
DCM -> CCM
READY
R770
47K
+19V
C771
C770
10uF
0.1uF
25V
25V
+19V
AAM
IN
SW
GND
AAM
IN
SW
GND
IC702
MP2315GJ
1
2
NEW
3
3A
4
IC709
MP2315GJ
1
2
NEW
3
3A
4
C701
68uF
35V
+3.3V_M
8
7
6
5
8
7
6
5
C703
10uF
25V
READY
R710
10K
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
R701
47K
C704
0.1uF
25V
READY
R716
7.5K
20130528 cJ.LIM
R721
68
C722
0.1uF
50V
20130528 cJ.LIM
R772
68
C772
0.1uF
50V
AAM
IN
SW
GND
B
READY
R722
20K
READY
R773
20K
IC701
MP2315GJ
1
2
NEW
3
3A
4
READY
READY
C715
R711
0.1uF
33K
25V
READY
R713
5.6K
C
Q713
MMBT3904(NXP)
E
READY
READY
C724
0.47uF
16V
C723
0.1uF
25V
20130821
C777
1uF
10V
C773
0.1uF
25V
R723
4.7K
R771
20K
8
7
6
5
L720
10uH
L770
10uH
FB
VCC
EN/SYNC
BST
C725
10uF
16V
+3.3V_M
C774
10uF
10V
20130528 cJ.LIM
POWER_SW
C726
10uF
C775
10uF
S
16V
10V
R823
0
R703
68
C705
0.1uF
50V
G
D
Q712
AO3407A
READY
R724
33K
C727
0.1uF
25V
R774
33K
C776
0.1uF
25V
R702
100K
R704
20K
PANEL_12V
R72 5
43K
1%
PANEL_12V
R72 6
100 K
1%
PANEL_12V
R72 7
10K
1%
R77 5
47K
R77 6
33K
R77 7
15K
** 3.5V_ST -> 1.26V VDDC
L702
10uH
C706
0.1uF
25V
C707
C708
10uF
10uF
10V
10V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
C709
0.1uF
25V
R705
33K
R70 6
5.1 K
R70 7
R70 8
+3.5V_ST
+3.5V_ST
2013.08.07
5.6B->5V
5V
READY->APPLY
1%
27K
1%
10K
1%
ZD702
R744
10K
C740
10uF
10V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
V0 = 0.8*(1+(R2/R1))
AP7173-SPG-13 HF(DIODES)
IC704
IN
1
PG
2
VCC
3
EN
4
9
THERMAL
8
7
6
5
[EP]
OUT
FB
SS
GND
C746
560pF
50V
R741
4.7K
+1.2V_VDDC
OUT:1.26V
R1
1%
1%
R740
2.7K
C742
10uF
10V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
** 3.3V_M -> 1.8V_M
IC711
+3.3V_M
C743
10uF
R714
470
R715
470
D711
READY
+18V
C714
47uF
18V
25V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
10V
** +3.5V_ST -> 3.3V_M
+3.5V_ST
C750
0.1uF
16V
R750
10K
R747
10K
D802
BAT54C
R768
0
C
B
B
P_12V
PANEL_12V
R761
39K
PANEL_5V
R761-*1
75K
PANEL_12V
R762
39K
C
Q721
MMBT3904(NXP)
E
POWER_SW
P_12V
15V
ZD701
READY
PANEL_5V
R725-*1
47K
1%
PANEL_5V
R726-*1
33K
1%
PANEL_5V
R727-*1
15K
1%
+5V_USB
1%
1%
1%
5.6B
ZD700
READY
** Switch Panel-Vcc
PANEL_12V
R767
PANEL_5V
R767-*1
2K
24K
PANEL_ON
B
Q722
C
MMBT3904(NXP)
PANEL_12V
E
A2
A1
PANEL_5V
AP1117E18G-13
IN
3
C744
0.1uF
16V
C753
R748
4.7uF
33K
10V
R749
2.2K
C
Q711
MMBT3904(NXP)
E
C760
4.7uF
25V
C760 X5R(EAE58111501) -> X7R(EAE62772301)
To improve CST Issue.
2013.11.27 by BJ.KIM
PANEL_5V
R762-*1
12K
ADJ/GND
1
2
OUT
C745
10uF
10V
Q710
AO3435
D
S
G
BOOST_EN
FET Multi_DMP2130L_DIODE
Q720-*1
DMP2130L
FET Multi_A03407A_AOS
Q720
AO3407A
S
G
+1.8V_M
+3.3V_M
C754
10uF
10V
X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.
2013.11.27 by BJ.KIM
FET Multi_PMV48XP_NXP
Q720-*2
PMV48XP
D
S
D
S
G
D
C761
0.1uF
16V
G
FET Multi_A03407B_AOS
Q720-*3
AO3407B
D
S
G
READY
R766
R765
4.7K
3.3K
PANEL_VCC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
44A/45A/450A
2013/08/21
7 8POWER
Page 32
TBD
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
44A/45A/450A
+19V
BOOST
C802
10uF
25V
BOOST
R802
BOOST_EN
12.05.17 To improve audible noise
C1103 2200pF->47pF
C1105 47pF->OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BOOST-UP
44A/45A/450A
DC BOOST UP
2013/08/21
8 8
Page 33
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