Embedded &
Industrial Computing
Hardware Platforms for Embedded and Industrial Computing
LEC-2530
V0.3 Preliminary
>>
User's Manual
Publication date:2014-07-07
About
About
Overview
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of interest topics or important messages. Below is a
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NOTE: This check mark indicates that
there is a note of interest and is something
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while using the product.
Online Resources
The listed websites are links to the on-line product
information and technical support.
Resource Website
Lanner http://www.lannerinc.com
Product Resources
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indicates that there is a caution or
warning and it is something that could
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Acknowledgement
Intel, Pentium and Celeron are registered trademarks of
Intel Corp.
Microsoft Windows and MS-DOS are registered trademarks
of Microsoft Corp.
All other product names or trademarks are properties of
their respective owners.
Compliances and Certification
CE Certication
This product has passed the CE test for environmental
specifications. Test conditions for passing included the
equipment being operated within an industrial enclosure.
In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly
recommend the use of CE-compliant industrial enclosure
products.
FCC Class A Certication
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required
to correct the interference at his own expense.
Copyright and Trademarks
This document is copyrighted, © 2014. All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.
No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original
manufacturer assumes no responsibility for its use, nor for
any infringements upon the rights of third parties that
may result from such use.
Embedded and Industrial Computing
2
TTaTTable of Contentsbeable of Contents
Chapter 1: Introduction 4
System Specications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Optional Power Cords. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Optional Mounting Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Optional Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chapter 2: System Components 6
System Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Front Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Rear Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chapter 3: Board Layout 10
External Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Internal Connectors and Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Internal Connectors and Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Connectors and Jumpers List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Chapter 4: Hardware Setup 18
Preparing the Hardware Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Installing the System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Installing the Wireless Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Installing the 3G SIM Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Installing the Hard Disk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Installing the CompactFlash Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Appendix C: Terms and Conditions 21
Warranty Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
RMA Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
3
Chapter 1
Chapter 1:
Introduction
Introduction
Thank you for choosing the LEC-2530. The LEC-2530
features Intel Atom E3825 processor. It has dual LAN
, HDMI and VGA as well as audio connectors for high
demand of Internet and multimedia applications. In
addition, its fanless design reduces maintenance effort
and contributes to its longevity.
The following list highlights the capabilities of the LEC2530 system:
HDMI and VGA video output powered by Intel HD •
Graphics
Dual 10/100/1000 Mbps LAN •
Five USB (four USB 2.0 ports and one USB 3.0 port) and •
one Digital Input/Output connector (2 digital inputs
and 2 digital outputs)
Storage support of 2.5" SATA HDD/SSD and •
CompactFlash
Four serial ports (two in RS232 and two in •
RS232/422/485 supporting hardware auto-flow
control) with DB-9 connectors
Audio input and output through Mic-in and Line-out •
jack (provided by Realtek ALC 886 HD Audio)
Two Mini-PCIe sockets for 3G Internet and Wi-Fi •
connections (one comes with a SIM card reader)
Aluminum extrusion enclosure which improve heat •
dissipation
Fanless design which can sustain the operating •
temperature from -20~55°C (with industrial grade
components
System Specifications
Processor
BIOS AMI SPI Flash BIOS
System
Memory
USB
Digital I/O
Expansion Bus
OS Support Microsoft Windows 8
Storage
Networking
Display
Audio
LEDs Power, HDD active, 3G active
Physical
Characteristics
Environment
Power
Standards and
Regulation
Reliability
Sockets 1 x 204-pin SODIMM socket
Technology DDR3L 1066 MHz
Max. Capacity Up to 4 GB
HDD/SSD Support 1 x 2.5” HDD/SSD drive bay
Expansion 1 x CF type I/II socket
LAN
Controller Intel i210 x 2
Graphics Controller Intel® HD Graphics
Display Interface
Audio Controller
Connector
Housing
Weight 2 kg
Dimensions (WxHxD)
Mounting Options VESA and wall mount
Operating Temperature
Storage Temperature -20~70°C
Ambient Relative Humidity
(non-condensing)
Input Voltage
Connector 2 pin terminal block
AC Adapter
EMC FCC/CE: Class A
Green product RoHS
Alter tool
Automatic Reboot Trigger
Intel® Atom™ E3825 (1.33
GHz) CPU
4 x USB 2.0, 1x USB 3.0 compliant hosts: Type A connector
2 x DI and 2 x DO with +5V
TTL Level
Mini-PCIe x 2 (full-sized socket);
one with SIM card reader
2 x 10/100/1000Mbps,
Autosensing,RJ-45
VGA x 1 (1600x1200), HDMI x1
(1920x1080)
Audio Codec realtek ALC886 HD
Audio, Low Power Audio
Audio I /O for mic-in and lineout with phone jack connectors
Top cover is Aluminum extrusion
for main heat dissipation
273.8 x 60 x 144 mm (10.78” x
2.36” x 5.67”)
-20~55°C (with Industrial grade
components)
5 to 95% (non-condensing)
DC+9~30 V +/- 5% Input with
ATX power control
External AC/DC Adapter, 75W
19V/3.95A with Phoenix contact
Built-in buzzer and RTC (realtime clock) with lithium battery
backup
Watchdog Timer 1~255 level
time interval system reset,
software programmable
Embedded and Industrial Computing
4
Chapter 1
Package Contents
Your package contains the following items:
LEC-2530 Fanless Embedded System •
Drivers and User’s Manual CD (S09OADA64H100) •
2-pin Terminal Block (P/N: 04AW20023Z101) •
6-pin Terminal Block (P/N: 04AW20061Z101) •
Standard Accessories
080W1N0002001 SATA SSD/HDD cable w/ power
SE9ESAD07R100 Wall Mount
Optional Power Cords
080W240318306 US Power Cord
080W240318305 Schuko (EU) Power Cord
080W240318301 UK Power Cord
080W240318307 China Power Cord
080W240318309 Japan Power Cord
Introduction
Optional Mounting Kit
SE9ESA900R100 Wall Mount 4
PE9ESA8300100 VESA Mount
SE9ESA8310100 Rack Mount
Optional Accessories
0TAWWPER11Z01
OTAWWPER12Z01
OTAWMC8090Z01 3G Module Green MC8090 PCI Express Mini Card 3G
080W0Q0000501 Cable Internal Antenna cable for 3G//GPS
080W1Q0001501 Cable Internal Wi-Fi Antenna Cable
0TZW000000039 Antenna SMA Antenna, male jack / female plug
For more information on the accessories, visit Lanner
website:
http://www.lannerinc.com/products/all-purpose-boxcomputers/industrial-automation/lec-2530
Wi-Fi module Green WPER-116GN 802.11bgn Mini PCIe
module
Green WPEA-121N 802.11abgn Mini PCIe
module
module
module
Embedded and Industrial Computing
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Chapter 2
Chapter 2:
System Components
System Drawing
Mechanical dimensions of the LEC-2530
Unit: mm
System Components
273.8
Embedded and Industrial Computing
58.13
144.75
52.13
6
Chapter 2
Intel® Atom™ E3825 Processor
2x PCI-E x1
1 x USB 3.0
Connector
2x USB 2.0
connectors
USB
2.0/3.0
SATA
2.0
SATA
2.0
USB 2.0
PCIe
Intel
I210
Intel
I210
SIO
DDR3L
SO-DIMM
Up to 4G
Audio
Codec
SP339E
UART X 2
MIO
Design Reservation
PCIe x 1
USB2.0 x 3
CF
SATA
Mini-PCIe with
SIM Card
Reader
Line-out
and Mic-in
Jack
DB9
RS232/422/485
x2
RS232
Pin Header
Digital I/O
DI x 2
DO x 2
VGA HDMI
SPIF223A
LEK-IOA10
DB9
RS232 x 2
2x USB 2.0
connector
USB 2.0 x2
Mini-PCIe
USB2.0
PCIe
9~30Vdc-in
PWN+12Vdc
Block Diagram
The block diagram depicts the relationships among the
interfaces and modules on the motherboard..
System Components
Embedded and Industrial Computing
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