Intel D525MW, D525MWV, TOTAL REACH OCU DP, TOTAL REACH DDS-R, BLKD525MW Technical Product Specification

Intel® Desktop Board D525MW and Intel® Desktop Board D525MWV

Technical Product Specification

July 2013

Order Number: E98416-003

The Intel product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D525MW and Intel Desktop Board D525MWV Specification Update.

Desktop Board D525MW and Intel Desktop Board D525MWV may contain design defects or errors known as errata that may cause the

Revision History

Revision Revision Histor y Date

-001 First release o f the Intel® Desktop Board D525MW and Intel® Desktop Board D525MWV Technical Product S pecification

-002 Specification Clarification May 2013

-003 Specification Clarification July 2013

This product spec ification applies to only the standard Intel® Desktop Board D525MW and Intel® Desktop Board D525MWV with BIOS iden tifier MWPNT10N.86A.

Changes to this s p ecification will be publis hed in the Intel Desktop Board D525MW and Intel Desktop Board D525MWV Specification Update b efore being incorporate d into a revision of th is document.

INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIO NS OF SALE F O R SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.

Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other intellectual proper ty rights that relate to the presented subject matter. The furnishing of documents and other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise, to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.

Intel may make chang e s to specifications and p roduct descrip tions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves the s e for future def inition and shall have no res p onsibility whatsoev e r for conflicts or inco mpatibilities arising from future changes to the m .

Desktop Boards may contain design defects or errors known as errata, which may cause the product

Intel to deviate from p ublished specifications. Current characte rized errata are available on request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our product order.

Intel, the Intel logo , a nd Intel Atom are trade m arks of Intel Co rporation in the United S ta te s and other countries.

July 2010

AA Revision

BIOS Revision

Notes

Device

Stepping

S-Spec Numbers

Board Identification Information

Basic Desktop Board D525MW Identification Information

E93080-300 MWPNT10N.86A.0049 1,2 E93082-300 MWPNT10N.86A.0049 1,2 E93080-301 MWPNT10N.86A.0069 1,2 E93081-301 MWPNT10N.86A.0069 1,2 E93082-301 MWPNT10N.86A.0069 1,2 E93080-400 MWPNT10N.86A.0069 1,2 E93081-400 MWPNT10N.86A.0069 1,2 E93082-400 MWPNT10N.86A.0069 1,2 Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

2. The CG82NM10 chipset used on this AA r e v i s io n c onsists of the follo wing component:

CG82NM10 B0 SLGXX

Specification Changes or Clarifications

The table below indicates the Spec ification Changes or Specification Clarifications that apply to the Intel

Specification Changes or Clarifications

Date Type of Change Description of Changes or C larifications

May 2013 Spec Clarification Added ENERGY ST A R Note to Section 5.1.5. July 2013 S p e c C l arification Deleted references to ENERGY STAR.

Desktop Board D525MW.

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

motherboards/motherboards.html?wapkw=desktop+boards for the latest

documentation.

http://www.intel.com/content/www/us/en/motherboards/desktop-

iii

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Preface

Chapter

Description

A description of the hardware used on the board

A map of the resources of the board

The features s upported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D525MW and Intel standard product and available manufacturing options.

Desktop Board D525MWV. It describes the

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop Board D525MW and Intel Desktop Board D525MWV and its comp onents to the vendors, system integrators, and other engineers and technicians who need this level of infor mation. It is specifically not intended for general audiences.

What This Document Contai ns

Typographical Conventions

This section cont ains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging har dware or losing data .

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gbit Gigabit (1,073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilo bit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/s Megabits per second xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the p roperty of thei r

respective owners.

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Onl ine Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Intel® D525 Graphics Su b system ............................................. 17

1.4 System Memory ............................................................................... 18

1.5 Intel® NM10 Express Chipset .............................................................. 19

1.5.2 USB ..................................................................................... 21

1.5.3 SATA Support ....................................................................... 21

1.6 Real-Ti me Clock Subsystem ............................................................... 22

1.7 Legacy I/O Controller ........................................................................ 22

1.8 LAN Subsystem ................................................................................ 23

1.8.1 LAN Subsystem Drivers .......................................................... 23

1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24

1.9 Audio Subsystem .............................................................................. 25

1.9.1 Audio Subsystem Software ..................................................... 26

1.9.2 Audio Connectors and Headers ................................................ 26

1.10 Hardware Management Subsystem ..................................................... 27

1.10.1 Hardware Monitoring ............................................................. 27

1.10.2 Thermal Monitoring ............................................................... 28

1.11 Power Management .......................................................................... 29

1.11.1 ACPI .................................................................................... 29

1.11.2 Hardware Support ................................................................. 32

2 Technical Reference

2.1 Memory Map .................................................................................... 35

2.1.1 Addressable Memory ............................................................. 35

2.2 Connectors and Headers .................................................................... 38

2.2.1 Back Panel ........................................................................... 39

2.2.2 Component-side Connectors and Headers................................. 41

2.3 BIOS Configuration Jumper Block ....................................................... 51

2.4 Mechanical Considerations ................................................................. 53

2.4.1 Form Factor .......................................................................... 53

2.5 El ectrical Considerations .................................................................... 54

2.5.1 Fan Header Current Capability ................................................ 54

2.5.2 Add-in Board Considerations ................................................... 54

2.6 Thermal Considerations ..................................................................... 54

2.6.1 Passive Heatsink Design in a Passive System Environment ......... 56

vii

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

2.7 Power Consumption .......................................................................... 59

2.7.1 Minimum Load Configuration ................................................... 59

2.7.2 Maximum Load Configuration .................................................. 59

2.8 Reliability......................................................................................... 60

2.9 Environmental .................................................................................. 60

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 61

3.2 BIOS Flash Memory Organization ........................................................ 62

3.3 Resource Configuration ..................................................................... 62

3.3.1 PCI* Autoconfiguration .......................................................... 62

3.4 System Management BIOS (SMBIOS) ................................................. 63

3.5 Legacy USB Support ......................................................................... 64

3.6 BIOS Updates .................................................................................. 65

3.6.1 BIOS Recovery ...................................................................... 65

3.6.2 Custom Splash Screen ........................................................... 66

3.7 Boot Options .................................................................................... 66

3.7.1 Optical Drive Boot ................................................................. 66

3.7.2 Network Boot ........................................................................ 66

3.7.3 Booting Without Attached Devices ........................................... 67

3.7.4 Changing the Default Boot Device During POST ......................... 67

3.8 BIOS Security Features ..................................................................... 68

4 Board Status and Error Messages

4.1 BIOS Beep Codes ............................................................................. 69

4.2 Front-panel Power LED Blink Codes ..................................................... 70

4.3 BIOS Error Messages ........................................................................ 70

4.4 Port 80h POST Codes ........................................................................ 71

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 77

5.1.1 Safety Standards................................................................... 77

5.1.2 European Union Declaration of Conformity Statement ................ 78

5.1.3 Product Ecology Statements ................................................... 79

5.1.4 EMC Regulations ................................................................... 81

5.1.5 e-Standby and ErP Compliance ............................................... 84

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85

5.2 Battery Disposal Information .............................................................. 86

viii

Contents

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. LAN Connector LED Locations ............................................................. 24

4. Back Panel Audio Connectors ............................................................. 26

5. Thermal Sensors and Fan Header ....................................................... 28

6. Location of the Standby Power Indicator LED ....................................... 34

7. Detailed System Memory Address Map ................................................ 36

8. Back Panel Connectors ...................................................................... 39

9. I/O Shield Reference Diagram ............................................................ 40

10. Component-side Connectors and Headers ............................................ 41

11. Connection Diagram for Front Panel Header ......................................... 48

12. Connection Diagram for Front Panel USB Header .................................. 50

13. Connection Diagram for Front Panel USB Header with

Intel Z- USB Solid-State Drive or Compatible Device Support ................. 50

14. Location of the BIOS Configuration Jumper Block .................................. 51

15. Board Dimensions ............................................................................. 53

16. Localized High Temperature Zones ..................................................... 55

17. Fan Location Guide for Cassis Selection (Chassis Orientation is

Not Restricted) ................................................................................. 58

Tables

1. Feature Summary ............................................................................. 11

2. Board Components Shown in Figure 1 ................................................. 14

3. Supported Memory Configurations ...................................................... 18

4. LAN Connector LED States ................................................................. 24

5. Audio Jack Support ........................................................................... 25

6. Effects of Pressing the Power Switch ................................................... 29

7. Power States and Targeted System Power ........................................... 30

8. Wake-up Devices and Events ............................................................. 31

9. System Memory Map ........................................................................ 37

0. Component-side Connectors and Headers Shown in Figure 10 ................ 42

11. Serial Port Header ............................................................................ 43

12. LVDS Data Connector - 30-Pin (D525MWV only) ................................... 43

13. LVDS Panel Voltage Selection Jumper (D525MWV on ly) ......................... 44

14. LVDS Inverter P ower Connector (D525MWV on ly) ................................. 44

15. LVDS Inverter P ower Voltage Select ion Jumper (D525 MWV on ly) ........... 44

16. Chassis Fan Header .......................................................................... 44

17. SATA Connectors .............................................................................. 45

18. Front Panel Wireless Activity LED Header ............................................. 45

19. Front Panel Audio Header for Intel HD Audio ........................................ 45

20. Front Panel Audio Header for AC ’97 Audio ........................................... 45

21. Front Panel USB Header .................................................................... 46

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

22. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support ................................................................ 46

23. Power Connector .............................................................................. 47

24. Front Panel Header ........................................................................... 48

25. States for a One-Color Power LED ....................................................... 49

26. BIOS Configuration Jumper Settings ................................................... 52

27. Fan Header Current Capability ............................................................ 54

28. Thermal Considerations for Components .............................................. 56

29. Minimum Load Configuration Current and Power Results ........................ 59

30. Maximum Load Configuration Current and Power Results ....................... 60

31. Intel Desktop Board D525MW and Intel Desktop Board D525MWV

Environmental Specifications .............................................................. 60

32. BIOS Setup Program Menu Bar ........................................................... 62

33. BIOS Setup Program Function Keys .................................................... 62

34. Acceptable Drives/Media Types for BIOS R ecovery ................................ 65

35. Boot Device Menu O ptions ................................................................. 67

36. Supervisor and User Password Functions ............................................. 68

37. BIOS Beep Codes ............................................................................. 69

38. Front-panel Power LED Blink Codes ..................................................... 70

39. BIOS Error Messages ........................................................................ 70

40. Port 80h POST Code Ranges .............................................................. 71

41. Port 80h POST Codes ........................................................................ 72

42. Typical Port 80h POST Sequence ........................................................ 75

43. Safety Standards .............................................................................. 77

44. EMC Regulations ............................................................................... 81

46. Regulatory Compliance Marks ............................................................ 85

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Modul e (SO-

Legacy I/O Control

• Seven USB 2.0 ports:

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board D525MW and Intel Desktop Board D525MWV.

Table 1. Feature Summary

Form Factor Mini-ITX, (6.7 inches b y 6.7 inches [170 m illim e te r s by 170 millimeters])

compatible with micr o A T X

Processor Passively-cooled , s oldered-down Dual-Core Intel® Atom™ process or with

integrated graphi c s and inte grated memory c o ntroller

Memory

Chipset Passively coole d , Intel® NM10 Express Chipset Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the Realtek*

Internal Graphics Onboard Intel® graphics subsy s te m w ith s up port for:

Peripheral Interfaces

LAN Support 10/100/1000 Mbit/s Ethernet LAN subsy s te m us ing a Realtek 8111E Gigabit

DIMM) sockets

• Support for DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 MHz SO-DIMMs Note: DDR3 1066 MHz and DDR3 1333 MHz memory will run at 800 MHz

• Support for up to 2 GB of system me mory on a single SO-DI MM (4 GB with

two SO-DIMMs)

ALC662 high definition audio codec

• Integrated GMCH

• Analog displays (V G A )

• Flat Panel displays (LVDS interface – D525MWV only)

Winbond W83627DHG-A based Legacy I/O controller for hardware m anagement, serial, parallel, and PS /2 * ports

― Four back pane l p orts ― Two ports are im p le m e nte d w ith a d ual port internal header f or front panel

cabling

― One port is impleme nte d with an internal header (brown-colored) that

supports an Intel

• Two Serial ATA (SA T A ) 3 .0 Gb/s connector s (s up p orting IDE and AHC I mode)

• One parallel por t connector on the back panel

• One serial port c o nne c tor on the back panel

• One serial por t he ad e r

• PS/2*-style keyboard and mouse ports

Ethernet Controller

Z-U130 USB Solid-State Drive or compatible d e v ic e

continued

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

• Intel® BIOS (resid e nt in the S PI Flash device)

• Support for PC I* Local Bus Spec ification Revision 2.3

• One PCI Conventional bus connector (with riser card support for up to two PCI

• Hardware monitoring through the Windbo nd I/O controller

Specification

Table 1. Feature Summary (continued)

BIOS

• Support for A d vanced Configur ation and Power Interface (ACPI), Plug and

Play, and SMBIOS

Instantly Available PC Technology

Expansion Capabilities

Hardware Monitor Subsystem

• Suspend to RAM s up p ort

• Wake on PCI, PCI Ex press*, PS/2, serial, front panel, USB ports, and LAN

cards)

• PCI Express x1 Mini Card connector

• Voltage sense to d e te c t o ut of range powe r s upply voltages

• Thermal sense to dete c t out of range thermal v a lue s

• One fan header

• One fan sense input used to monitor fan activ ity

• Fan speed control

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Table 2 lists the components identified in Figure 1.

Figure 1. Major Board Components

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Back panel connector s

LVDS inverter p a ne l v oltage selection jumper (D525MWV only)

LVDS inverter p ower connector (D525MWV only)

LVDS panel connector (D525MWV only)

SO-DIMM channel A socke t, DIMM 0

SATA connector 0

Front panel USB hea d e r (black)

BIOS setup co nf i g uration jumper block

PCI Express x1 Mini Card connecto r

Front panel USB head e r supports I nte l Z -U130 USB Solid-State Drive or compatible device (brown-colored)

PCI conventional b us c o nne c tor

Specification

Table 2. Board Components Shown in Figure 1

Item/callout from Figure 1

A B C D E F G H

J K L M N O P Q R S T U Front Panel Wireless A c ti v ity LED Header V

Description

Serial port heade r LVDS inverter p ower voltage se le c tion jumper (D525MWV only)

Processor core power connector (2 x 2) Intel Atom processor Power connector (2 x 12)

SO-DIMM channel A socke t, DIMM 1 Battery SATA connector 1

Front panel header Standby power LED

Intel NM10 Expr e s s C hipset

X Y Z

S/PDIF header Chassis fan header Front panel audio he ad e r

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

To find information a bout…

Visit this World Wide Web site:

For information about

Refer to

Power supply c o nne c tors

Section 2.2.2.3, page 47

Specification

1.2 Online Support

Intel Desktop B oard D525MW and Intel Desktop B oard D525MWV

Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available config ur a tio ns for the Intel

Desktop Board D525MW and Intel Desktop Board D525MWV

Supported processors http://processormatch.intel.com Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://www.intel.com/products/motherboard/index.htm

http://ark.intel.com

025414.htm

1.3 Processor

The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with integrated graphics and integrated memory controller.

NOTE

The board is des igned to be passively cooled in a prope rly ventilated chassi s. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness.

Product Description

1.3.1 Intel® D525 Graphics Subsystem

1.3.1.1 Intel® Graphics Media Accelerator 3150 Graph ics Controller

The Intel GMA 3150 graphics controller features the following:

• 400 MHz core frequency

• High quality texture engine  DX9.0c* and OpenGL* 1.4 compliant  Hardware Pixel Shader 2.0  Vertex Shader Model 2.0

• 3D Graphics Rendering enhancements  1.6 dual texture GigaPixel/s max f ill rate  16-bit and 32-bit color  Vertex cache

• Video  Software DVD at 30 fps full screen  DVMT support up to 256 MB

• Display  Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)  Supports LVDS displays up to 1366 x 768 (single channel, 18 bpp) (D525MWV

only)

 Dual independent display support with LVDS option (D525MWV only)

For information about Refer to

Obtaining graphics s oftware and utilities Section 1.2, page 16

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

1.4 System Memory

The board has two 204-pin DDR3 SO-DIMM sockets and supports the following memory features:

• DDR3 SDRAM SO-DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided DIMMs

• 4 GB maximum total system memory

• Minimum total system memory: 256 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 MHz SO-DIMMs

(DDR3 1066 MHz and DDR3 1333 MHz memory will run at 800 MHz)

NOTE

Due to passively-cooled thermal constraints, system memory must have an operating temperature rating of 85

The board is des igned to be passively cooled in a prope rly ventilated chassis. Chassis venting locations are recommended above the system memory area for maximum heat dissipation effectiveness.

NOTE

To be fully compliant with all applicable DDR3 SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presenc e Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, perfor ma nce and reliability may be impacte d or the DIMMs may not function under the determined frequency.

Table 3 lists the supported SO-DIMM configurations.

Table 3. Supported Memory Configurations

DIMM Capacity Configuration

1024 MB DS 1 Gbit 64 M x16/64 M x16 8 1024 MB SS 1 Gbit 128 M x8/empty 8 2048 MB DS 2 Gbit 128 M x16/128 M x16 8 2048 MB SS 2 Gbit 256 M x8/empty 8

Note: In the second col umn, “ DS” refers to double-sided memo ry modules (containing two rows of SDRAM)

and “SS” refe rs to single-sided mem o ry modules (containing one row of SDRAM).

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

Product Description

For information about

Refer to

1.5 Intel® NM10 Express Chipset

The Intel NM10 Express Chipset provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths.

NOTE

The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.5.1.1 Video Memory Allocation

Video memory is allocated from the total available system memory for the efficient balancing of 2-D/3-D graphics performance and overall system performance. Dynamic allocation of system memory to video memory is as follows:

• 256 MB total RAM results in 32 MB video RAM

• 512 MB total RAM results in 64 MB video RAM

• 1 GB total RAM results in 128 MB video RAM

• 2 GB total RAM results in 224 MB video RAM

1.5.1.2 Analog Display (VGA)

The VGA port supports analog displays. The maximum suppor ted resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate.

1.5.1.3 Flat Panel Interface (LVDS) – (D525MWV only)

The flat panel interface (LVDS ) supports the following:

• Panel support up to UXGA (1366 x 768)

• 25 MHz to 112 MHz single–channel; @18 bpp  TFT panel type

• Panel fitting, panning, and center mode

• CPIS 1.5 compliant

• Spread spectrum clocking

• Panel power sequencing

• Integrated PWM interface for LCD backlight inverter control

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

1.5.1.4 Configuration Modes

For monitors attached to the VGA port, video m odes supported by this board are based on the Extended Display I dentification Data (EDID) protocol.

Video mode configuration for LVDS displays (D525MWV only) is supported as follows:

• Automatic panel identification via Extended Display Identification Data (EDID) for LVDS panels supporting EDI D protocol.

• Manual LVDS panel configuration through the BIOS s etup page. This feature allows the manual entry of critical panel settings (eq uivalent to the 18-byte Detailed Timings Descriptor structur e defined by the VESA EDID specification) for non-EDID panel support.

In addition, BIOS setup provides the following configuration parameters for LVDS displays (D525MWV only):

• Screen Brightness: allows the end-user to set screen brightness for the display.

• Maintain Aspect Ratio: allows the end-user to select whether the native aspect ratio

is to be preserved during POST and before the video driver is loaded.

• LVDS Configuration Changes: allows the system integra tor to “lock” critical settings of the LVDS configuration to avoid end-users potentially rendering the display unusable (refer to Note 1).

• Inverter Frequency and Polarity: allows the system integrator to set the operating frequency and polarity of the panel inverter board.

• Minimum Inverter Current Limit (%): allows the system integrator to set minimum PWM%, as appropriate, according to the power requirements of the LVDS display and the selected inverter board.

NOTE

Support for LVDS (D525MWV only) configuration complies with the following:

1. “Unlocking” of critical settings of the LVDS c onfiguration is supported via Intel Integrator Toolkit’s command-line tool.

2. Critical settings of the LVDS configuration are not exposed through Intel Integrator Toolkit or Intel® Integrator Assis tant GUIs.

3. Critical settings of the LVDS configuration will not be overwritten by loading BIOS setup defaults.

4. Critical settings of the LVDS configuration will be preserved across BIOS updates.

Product Description

1.5.2 USB

The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers (four ports route d to the back panel and three ports routed to two front panel USB 2.0 headers). One of the front panel USB headers (brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.

NOTE

Computer systems that have an unshielded cable attached to a USB por t m a y not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 8, page 39 The location of the front panel USB headers Figure 10, page 41

1.5.3 SATA Support

The board provides two SATA interface connectors that support one device per connector.

The board’s SATA controller offers independent SATA ports with a theoretical maximum transfer rate of 3.0 Gbits/s on each port. One device can be installed on each port for a maximum of tw o SATA devices. A point-to-point interface is used for host to device connections, u nlike PATA which supports a master/s lave configuration and two devices on each channel.

For compatibility, the underlying SATA functionality is transparent to the operating system. The SATA contr oller supports IDE and AHCI configuration and can operate in both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources are assigned (IRQ 14 a nd 1 5 ). In native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows Vista* operating systems.

For information about Refer to

Obtaining AHCI driver Section 1.2, page 16 The location of the S A TA connectors Figure 10, page 41

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the po wer supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• One serial port header

• One serial port connector on the back panel

• One parallel port connector with Extended Capabilities Port (ECP) and Enhanced

Parallel Port (EPP) suppor t

• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems

• PS/2-style keyboard and mouse ports

• Intelligent power management, including a programmable wake-up event interface

• PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

For information about Refer to

The location of the serial port header Figure 10, page 41 The serial port head e r signal mapping Table 11, on page 43

Product Description

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek 8111E Gigabit Ethernet Controller for 10/100/1000 Mbit/s Ethernet LAN

connectivity

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface that supports the Ethernet controller

• PCI Conventional bus power management  Supports ACPI technology  Supports LAN wake capabilities

1.8.1 LAN Subsystem Drivers

LAN drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN drive rs Section 1.2, page 16

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

LED

LED Color

LED State

Condition

Specification

1.8.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 3).

Figure 3. LAN Connector LED Locations

Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is opera ting.

Table 4. LAN Connector LED States

Off LAN link is not estab lis he d.

Link/Activity (A) Green

Link Speed (B) Green/Yellow

On LAN link is established . Blinking LAN ac tivity is occurring . Off 10 Mbits/s data rate is selected or negotiated. Green 100 Mbits/s data ra te is se l e c te d o r negotiated. Yellow 1000 Mbits/s data r a te is se l e c te d o r negotiated.

Product Description

1.9 Audio Subsystem

The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek ALC662 audio codec

The audio subsystem has the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device tha t is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support

• 3-port analog audio out stack

• Windows Vista Basic certification

• A signal-to-noise (S/N) ratio of 95 dB

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

Front panel – Green No Yes No No Yes Front panel – Pink No No No Yes No Back panel – Blue Yes No Yes No No Back panel – Green No Yes No No Yes Back panel – Pink No No No Yes No

Line In

Line/

Front Out Rear Out

MIC

Headphones

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

The back panel audio c onnectors

Figure 4, page 26

Specification

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio sof tw a r e and drivers Section 1.2, page 16

1.9.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back pane l and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors).

Item Description

A Line in B Line out C Mic in

Figure 4. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The locations of the f ront panel audio header and S/PDIF audio header Figure 10, page 41 The signal names of the f ront panel audio header and S/PDIF head e r Section 2.2.2.1, page 43

Product Description

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Thermal and voltage monitoring

• Chassis intrusion detection

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG-A device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, a nd + VCCP

• SMBus interface

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Item

Description

Chassis fan header

Remote thermal sensor

Thermal diode, loc ate d on the processor die

Specification

1.10.2 Thermal Monitoring

Figure 5 shows the locations of the thermal sensors and fan header.

Figure 5. Thermal Sensors and Fan Header

Product Description

1.11 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power connector  Fan header  LAN wake capabilities  Instantly Available PC technology  Wake from USB  Wake from PS/2 devices  Power Management Event signal (PME#) wa ke-up support  WAKE# signal wake-up support

1.11.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the boa rd requires an operating system that provides full ACPI support. AC PI features include:

• Plug and Play (including bus and device enumerat io n)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achiev ing less than 15-watt system op eration in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 8 on page 31)

• Support for a front panel power and sleep mode switch

Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 6. Effects of Pressing the Power Switch

If the system i s in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – working sta te )

On (ACPI G0 – wo rking state)

Sleep (ACPI G1 – slee ping state)

…and the power switch is pressed for

Less than four seconds Power-on

Less than four seconds Power-off

More than four sec o nds Fail safe power-off

Less than four seconds Wake-up

More than four sec o nds Power-off

…the system enters this state

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

(Note 2)

Specification

1.11.1.1 System States and Power State s

Under ACPI, the operating system directs all system and device power state transitions. The opera ting sy stem puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a who le into a low-power state.

Table 7 lists the power states supported b y the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 7. Power States and Targeted System Power

Global States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off. AC power is disconnected from the computer.

Notes:

1. Total system powe r is dependent on the system configuratio n, inc l ud ing add-in boards and p e ripherals powered by the system’s power supply.

2. Dependent on the stand b y power consumption of wake-up devices used in the system.

Sleeping States

S0 – working C0 – working D0 – working

S1 – Processor stopped

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved . Cold boot is required.

No power to the system.

Processor States

C1 – stop grant

No power D3 – no power

No power D3 – no power for

Device States

state. D1, D2, D3 –

device specification specific.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

5 W < power < 52.5 W

Power < 5 W

No power to the s y s te m . Service can be performed safely.

(Note 1)

Product Description

These devices/events can wake up the computer…

…from this state

(Note 1)

(Notes 1 and 3)

(Note 1)

(Note 2)

(Notes 1 and 4)

1.11.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific states.

Table 8. Wake-up Devices and Events

LAN S1, S3, S4, S5 PME# signal S1, S3, S4, S5 Wake# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 RTC alarm S4, S5 Serial port S1, S3 USB S1, S3 PS/2 devices S1, S3, S4, S5

Notes:

1. S 4 im p lie s operating system s up port only. Wake from S5 must include wa k e after loss of power.

2. US B ports are turned off during S4/S 5 states.

3. Wak e # signal must be contro ll ab le by the BIOS (enable /disable option).

4. PS /2 w a k e from S5 should have a selection in the BIOS to enable wake f rom a combination key (Alt + Print Screen) or the keyboard power button.

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, a nd peripherals must fully support ACPI wake events.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

For information about

Refer to

Specification

1.11.2 Hardware Support

The board provides several power management hardware features, including:

• Power connector

• Fan header

• LAN wake capa bilities

• Instantly Available P C technology

• Wake from USB

• Wake from PS/2 devices

• Power Management Event signal (PME#) w ake-up support

• WAKE# signal wake-up support

• +5V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.

NOTE

The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.

1.11.2.1 Fan Header

The function/operation of the fan header is as follows:

• The fan is on when the boa rd is in the S0 state.

• The fan is off when the board is off or in the S3, S4, or S5 state.

• The chassis fan header supports closed-loop fan control that can adjust the fan

speed and is wired to a fa n ta chometer input.

• The fan header supports +12 V, 3-wire fans at 1 A maximum.

The locations of the f an he a d e r and thermal sensors Figure 5, page 28 The signal names of the cha s s is f a n hea d e r Table 16, page 43

1.11.2.2 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem network adapter monitors network traffic at the Media Independent Interface. The board supports LAN wake capabilities with ACPI in t he following ways:

• By Ping

• By Magic Packet

Upon detecting the configured wake packet type, the LAN subsystem a sserts a wakeup signal that powers up the compute r.

Product Description

1.11.2.3 Instantly Available PC Technology

Instantly Available PC technology enab les the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, the front panel LED will blink). When signaled by a wake-up device or event, the system quickly returns to its last known state. Table 8 on page 31 lists the devices and events that can wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also suppor t this s pecification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers.

1.11.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S1 or S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from U SB and support in the operating system.

1.11.2.5 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.11.2.6 Wake from PS/2 Devices

PS/2 keyboard activity wakes the computer from an ACPI S1, S3, S4, or S5 state. However, when the computer is in an ACPI S4 or S5 state, the o nly PS/2 activity that will wake the computer is the Alt + Print Screen or the Power Key available only on some keyboards.

1.11.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.

1.11.2.8 Wake from Serial Port

Serial Port activity wakes the computer from an ACPI S1 or S3 state.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

1.11.2.9 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 6 shows the location of the standby power indicator LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to d o so could damage the b oard and any attached dev i ces.

Figure 6. Location of the Standby Power Indicator LED

2 Technical Reference

2.1 Memory Map

2.1.1 Addressable Memory

The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory ). On a system that has 4 GB of system mem ory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/ SPI Flash (4 MB)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• Front side bus interrupts (17 MB)

• Internal graphics address registers

• Memory-mapped I/O that is dynamically allocated for PCI Conve ntional add-in

cards

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 7 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Figure 7. Detailed System Memory Address Map

Technical Reference

Table 9 lists the system memory map.

Table 9. System Memory Map

Address Range (decimal)

1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high D OS

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Extended conve ntional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventiona l me mory

Address Range (hex)

Size

Description

memory (open to the PC I bus). Dependent on vid e o adapter used.

memory manager software)

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

2.2 Connectors and Headers

CAUTION

Only the following connectors/headers have overcurrent protection: Back panel and front panel USB, VGA, serial, and PS/2.

The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

NOTE

This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Back panel I/O connectors (see page 39)

• Component-side connectors and headers (see page 41)

2.2.1 Back Panel

Item

Description

2.2.1.1 Back Panel Connectors

Figure 8 shows the location of the back panel connectors.

A PS/2 keyboard/mouse B PS/2 keybo ard/mouse C Serial port D Parallel port E VGA port F USB ports G LAN H USB ports I Line in J Line out K Mic in

Technical Reference

Figure 8. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

2.2.1.2 I/O Shield

The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis. As an added benefit for system configurations with wireless PCI Express Mini Card solutions, the I/O shield also provides pre-cut holes for user installation of up to two external wireless antennas. Figure 9 shows an I/O shield reference diagram.

Figure 9. I/O Shield Reference Diagram

Technical Reference

2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.

Figure 10. Component-side Connectors and Headers

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Chassis fan header

LVDS inverter p a ne l v oltage selection jumper (D525MWV only)

LVDS inverter p ower voltage se le c tion jumper (D525MWV only)

LVDS panel connector (D525MWV only)

SATA connector 1

SATA connector 0

Front panel USB head e r supports Inte l Z -U130 USB Solid-State Drive or compatible device (brown-colored)

Front panel audio he ad e r

Specification

Table 10 lists the component-side connectors and headers identified in Figure 10.

Table 10. Component-side Connectors and Headers Shown in Figure 10

Item/callout from Figure 10 Description

B C D

F G H

L M N Front Panel Wireless A c ti v ity LED Header O

LVDS inverter p ower connector (D525MWV only) Serial port heade r

Processor core power connector (2 x 2) Power connector (2 x 12)

USB front panel header Front panel header PCI Express x1 Mini Card connecto r

P Q R

PCI conventional b us c o nne c tor S/PDIF header

Technical Reference

Signal Name

Name

Description

Name

Description

negative

positive

ROM

signaling

negative

positive

negative

positive

GND

Ground

GND

Ground

negative

positive

GND

Ground

GND

Ground

GND

Ground

GND

Ground

power output

output

power output

output

signal

2.2.2.1 Signal Tables for the Connectors and Headers

Table 11. Serial Port Header

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data) 3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready) 5 Ground 6 DSR (Data Set Ready) 7 RTS (R e q ue s t To Send) 8 CTS (Clear To Send) 9 RI (Ring Indicator) 10 Key (no pin)

Table 12. LVDS Data Connector - 30-Pin (D525MWV only)

Signal

1 LA_CLKN LV DS Channel A diff

clock output -

3 LA_CLKP LVDS C hanne l A diff

clock output -

5 EDID_3.3V Power for EDID

7 LA_DATAN0 LVDS Channel A diff

data output –

9 LA_DATAP0 LVDS Channe l A d iff

data output –

11 LA_DATAN1 LVDS Channel A diff

data output –

13 LA_DATAP1 LVDS Channel A d iff

data output –

17 LA_DATAN2 LVDS Channel A diff

data output –

19 LA_DATAP2 LVDS Channel A d iff

data output –

2 NC

4 NC

6 EDID_GND Ground for EDID

8 NC

10 NC

12 NC

14 NC

18 NC

20 NC

25 3.3 V/5 V/12 V Selectable LCD

27 3.3 V/5 V/12 V Selectable LCD

29 EDID_CLK EDID/DDC clock

26 3.3 V/5 V/12 V Selectable LCD power

28 3.3 V/5 V/12 V Selectable LCD power

30 EDID_DATA EDID/DDC d ata s ignal

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Signal Name

Description

Specification

Table 13. LVDS Panel Voltage Selection Jumper (D525MWV only)

Voltage Jumper Setting Configuration

3.3 V 2 and 4

5 V 6 and 4

Jumper position for 3.3 V (default)

Jumper position for 5 V

12 V 3 and 4

Jumper position for 12 V

Table 14. LVDS Inverter Power Connector (D525MWV only)

1 GND Ground 2 GND Ground 3 5 V/12 V Inverter power 4 5 V/12 V Inverter power 5 INV_RATING Inverter rating 6 BKLT_PWM Backlight PWM 7 BKLT_EN Backl ig ht e nable

Table 15. LVDS Inverter Power Voltage Selection Jumper (D525MWV only)

Voltage Jumper Setting Configuration

5 V 1 and 2

Jumper position for 5 V (default)

12 V 3 and 2

Table 16. Chassis Fan Header

Pin Signal N a me

1 Ground 2 +12 V (PWM controlled pulses) 3 Tach

Jumper position for 12 V

Signal Name

Table 17. SATA Connectors

Pin Signal N a me

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Table 18. Front Panel Wireless Activity LED Header

1 LED (+) 2 Ground

Technical Reference

Table 19. Front Panel Audio Header for Intel HD Audio

Pin Signal N a me Pin Signal Name

1 [Port 1 ] Le ft channel 2 Ground 3 [Port 1 ] R i g ht c hanne l 4 PRESENCE# (Dong le p resent) 5 [Port 2 ] R i g ht c hanne l 6 [Port 1] SENSE_RETURN 7 SENSE_ S E ND (Jack detection) 8 Key (no pin) 9 [Port 2 ] Le ft channel 10 [Port 2] SENSE_RETURN

Table 20. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Pin Signal Name

1 MIC 2 AUD_GND 3 MIC_BIAS 4 AUD_GND 5 FP_OUT_R 6 FP_RETURN_R 7 AUD_5V 8 KEY (no pin) 9 FP_OUT_L 10 FP_RETURN_L

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Table 21. Front Panel USB Header

Pin Signal Name Pin Signal Name

1 +5 VDC 2 +5 VDC 3 D- 4 D5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect

Table 22. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support

Pin Signal Name Pin Signal Name

1 +5 VDC 2 NC 3 D- 4 NC 5 D+ 6 NC 7 Ground 8 NC 9 KEY (no pin) 10 LED#

Technical Reference

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• PCI Express x1 Mini Card (rev 1.2 compliant) connector

• PCI Conventional (rev 2.3 compliant) bus conne ctor (with riser card support for up

to two PCI cards)

Note the following considerations f or the PCI Conventional bus co nn ector:

• The PCI Conventional bus connector is b us master capable.

• SMBus signals are routed to the PCI Conventional bus connector. This enables PCI

Conventional bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.  The SMBus data line is connected to pin A41.

The PCI Co nventional bus connector also supports single-slot and dual-slot riser cards for use of up to two bus master PCI expansion cards. In order to supp ort two PCI bus master expansion cards, the riser card must support the fo llowing PCI signal routing:

• Pin A11: additional 33 MHz PCI clock

• Pin B10: additional PCI Request signal (i.e., PREQ#2)

• Pin B14: additional PCI Grant signal (i.e., GNT#2)

2.2.2.3 Power Supply Connector

The board has a 2 x 12 power connector (see Table 23). This board requires a TFX12V or SFX12V power supply.

Table 23. Power Connector

Pin Signal N a me Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWR G D (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V 23 +5 V 12 No connect 24 Ground

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

In/

Specification

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 24 lists the sign al names of the front panel header. Figure 11 is a connection diagram for the front panel header.

Table 24. Front Panel Header

Pin Signal

Out Description

Pin Signal

Out Description

Hard Drive Activity LED Power LED

1 HD_PWR Out Hard disk LED

pull-up to +5 V

3 HDA# Out Hard disk active

LED

2 HDR_BLNK_GRN Out Front panel gre e n

LED

4 HDR_BLNK_YEL Out Front panel yellow

LED

Reset Switch On/Off Switch

5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground

Power Not Connected

9 +5 V Power 10 N/C Not connected

Figure 11. Connection Diagram for Front Panel Header

Technical Reference

LED State

Description

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to pro vide a visual indicator that data is being read from or written to a hard drive.

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the s witch is closed, the board resets and runs the POST.

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a single- or dual-color LED. Table 25 shows the default states for a single-color LED.

Table 25. States for a One-Color Power LED

Off Po w e r off/hibernate (S 5/S4) Blinking Sleeping (S3) Steady Green Running/Away (S0/S1)

NOTE

The LED states listed in Table 25 are default settings that can be modified through BIOS setup. Systems built with a dual-color front panel power LED can also use alternate color state options.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply circuitry to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply circuitry will recognize a nothe r on/off signal.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

2.2.2.5 Front Panel USB Headers

Figure 12 and Figure 13 are connection diagrams for the front panel USB headers.

NOTE

• The +5 VDC power on the USB headers is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 s pecification for

high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Header

Figure 13. Connection Diagram for Front Panel USB Header

with Intel Z- USB Solid-State Drive or Compatible Device Support

Technical Reference

2.3 BIOS Configuration Jumper Block

CAUTION

Do not move the jumper with the power on. Alw ays turn off the power and unpl ug t he power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 14 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 26 lists the jumper settings for the three modes: normal, configure, and recovery.

Figure 14. Location of the BIOS Configuration Jumper Block

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Table 26. BIOS Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal 1-2

The BIOS uses cur rent configuration information and passwords f or booting.

Configure 2-3

Recovery None

After the POST runs , S e tup runs automatically. The maintenance menu is display e d .

The BIOS attempts to recover the BI OS configuration. S e e Section 3.7 for more information on BIOS recovery.

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the microATX sp ecification.

Figure 15. Board Dimensions

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

2.5 Electrical Considerations

2.5.1 Fan Header Current Capability

Table 27 lists the current capability of the fan header.

Table 27. Fan Header Current Capability

Fan Header Maximum Avai lable Current

Chassis fan 1.5 A

2.5.2 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for the PCI Conventional slot. The total +5 V current draw for the PCI Conventional expansion slot (total load) must not exceed 2 A.

2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel Desktop Boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this doc ument will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.

Technical Reference

Item

Description

Processor voltage regulator area

Intel Atom processor

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 16) can reach a temperature of up to 85 an open chassis.

Figure 16 shows the locations of the localized high temperature zones.

C in

Figure 16. Localized High Temperature Zones

Table 28 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Intel NM10 Express Chipset

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

For information about

Refer to

Specification

Table 28. Thermal Considerations for Components

Component Maximum Case Temperature

Intel Atom processor 99 oC Processor voltage regulator area 85 oC Intel NM10 Express Chipset 113 oC Memory SO-DIMM 85 oC

Processor datasheets and specification updates Section 1.2, page 16

2.6.1 Passive Heatsink Design in a Passive System Environment

This section highlights important guidelines and related thermal boundary conditions for passive heatsink design in a passive system environment. Passive heatsink describes a thermal solution without a fan attached. Passive system environment describes a chassis with either a power supply fan or a built-in chassis fan.

This information should be used in conjunction with the Thermal/Mechanical Specifications and Design Guidelines (TMSDG) published for Intel D500 Series processors. The TMSDG contains detailed package information and thermal mechanical specifications for the processors. The TMSDG also contains information on how to enable a c ompletely fanless design provided the right usage scenario and boundary conditions are observed for optimal thermal design. While the TMSDG has a section on thermal design for passive system environments (pages 29-30), the information in this section c an also be used to complement the TMSDG.

2.6.1.1 Definition of Terms

Term Description

TA The measured amb ie nt te mperature locally surrounding the pro c e s s or. The ambient

TJ Processor junction temperature.

Junction-to-ambient therm al characterization parameter (psi ). A measure of therm al solution

TIM Thermal Interface Materi al : the thermally conductive c ompound between the heatsink and the

TDP Thermal Design Power: a power dissipation target based on worst-case applic ations. Thermal

TA external The measured external ambient temperature surrounding the chassis. T he external ambient

temperature should be measured just ups tr e a m o f a passive heatsink.

performance using total pac kage power. Defined as (T Note: Heat source must be specified for Ψ measurements.

processor die surface. T hi s material fills the air gaps and voids, and enhances the transfer of the heat from the processor die s urface to the heatsink.

solutions should be designed t o di ssipate the thermal design power.

temperature should be measured just upstream of t he chassis inlet vent.

- TA)/TDP.

Atom™ D400 and

2.6.1.2 Thermal Specifications Guideline

Terms

Requirements

TA ≤ 50 °C TJ ≤ 100 °C

ΨJA ≤ 3.85 °C/W

TIM Honeywell PCM45F TDP 13 W TA external ≤ 35 °C

2.6.1.3 Heatsink Design Guideline

Maximum heatsink size Heatsink mass ≤ 80 grams Retention type Spring loa d e d fasteners Heatsink preload 11.3 +/- 3.6 lb

Note: Refers to the he ats ink installed on the board.

(Note)

87 x 62 x 35.54 mm

Technical Reference

2.6.1.4 Chassis Design Guideline

The pin fin heatsink design used on this board will be able to dissipate up to 13 W of processor power in most of the passively enabled system chassis. This board is targeted for 3-7 liters volumetric or larger, desktop/tower orientation, mini-ITX and micro-ATX chassis with a chassis fan. The recommended fan type is an exhaust fan.

For best thermal performance, it is recommended that the chassis fan provide reasonable airflow directly over the all the major components on the board. The pin fin heatsink is designed to have the best thermal performance when airflow direction is parallel to the heatsink fins.

The processor on the board will generate the highest amount of heat, leading to high ambient temperature within the chassis. The chassis fan should be located near the board region in order to effectively regulate airflow (see Figure 17). A chassis fan located further away from the board region, i.e., at the optical disk drive or hard disk drive region, will be less effective in controlling the local ambient temperature. Regardless of where the chassis fan is located, the maximum local ambient temperature as defined by T also provide adequate openings for airflow to pass through. The recommended freearea-ratio of chassis vents sho uld be equal to or greater than 0.53. By using the reference pin fin heatsink, most chassis with a chassis fan enabled should have local ambient temperature safely below the 50 °C limit.

A should be capped at 50 °C. Cha ssis inlet vents should

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Figure 17. Fan Location Guide for Chassis Selection

(Chassis Orientation is Not Restricted)

For all chassis configurations, the heatsink performance parameter, Ψ

should be less

than 3.85 °C/W. The detail thermal measurement metrology is described in the TMSDG. For chas sis that fail to meet the thermal spec ifications guideline highlighted above, an actively cooled heatsink solution should be used.

Technical Reference

Output Voltage

Minimum Load

2.7 Power Consumption

Power measurements were performed to determine bare minimum and likely maximum power requirements from the board, as well as attached devices, in order to facilitate power supply rating estimates for specific syste m configurations.

2.7.1 Minimum Load Configuration

Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement co nditions. Minimum load configuration tes t results are s h own in Table 29. The test configuration was defined as follows:

• 2 GB DDR3/800 MHz SO-DIMM

• USB keyboard and mouse

• LAN linked at 1000 Mb/s

• DOS booted via network (PXE); system at idle

• All on board peripherals enabled (serial, parallel, audio, …)

Table 29. Minimum Load Configuration Current and Power Results

3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB

0.45 A 2.2 A 0.4 A 0.143 A 0.03 A 0.13 A

2.7.2 Maximum Load Configuration

Maximum load refers to the incremental power demands placed on the power supply, augmenting the minimum load configuration into a fully-featured system that stresses power consumption from all subsystems. Maximum load co nfiguration test results are shown in Table 30. The test configuration was defined as follows:

• 4 GB DDR3/800 MHz SO-DIMM

• 14.1-inch LCD via LVDS (D525MWV only)

• SATA DVD-R/W  Load: DVD playback

• 3.5-inch SATA hard disk drive, running Microsoft Windows V ist a Home Basic  Load: continuous read/write benchmark

• 2.5-inch SATA hard disk drive  Load: continuous read/write benchmark

• Intel Z-U130 USB Solid-State Drive or compatible device on the USB flash drive

header

 Load: continuous read/write benchmark

• Wireless card on PCI Express x1 Mini Card slot, connected via 802.11n protocol  Load: continuous read/write benchmark on remote share

• Riser card on conventional PCI slot, populated with PCI LAN card, running file

transfer through local network to SATA hard drive

• USB keyboard and mouse

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Output Voltage

Maximum Load

Parameter

Specification

Temperature

Non-Operating

-20 °C to +70 °C

Operating

0 °C to +50 °C

Shock

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/sec o nd²

Packaged

Half sine 2 millisecond

Product weight (po und s )

Free fall (inches)

Velocity change (inche s /s ²)

<20

167 21-40

152 41-80

136 81-100

118

Vibration

Unpackaged

5 Hz to 20 Hz: 0.01 g ² Hz s lo ping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged

10 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Specification

• Back and front panel hos t-powered USB devices (other than keyboard and mouse)  Load: continuous read/write activity on external drive/peripheral

• LAN linked at 1000 Mb/s  Load: continuous read/write benchmark on remote share

• All on board peripherals enabled (serial, parallel, audio, …)

Table 30. Maximum Load Configuration Current and Power Results

3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB

0.78 A 4.84 A 1.31 A 0.433 A 0.03 A 0.243 A

2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF pre diction is used to estimate repair rates and spare parts requirements.

The MTBF data was calculated from predicted data at 55 ºC. The Intel Desktop Board D525MW and Intel Desktop Board D525MWV have an MTBF of at least 504 ,588 hours.

2.9 Environmental

Table 31 lists the environmental specifications for the board.

Table 31. Intel Desktop Board D525MW and Intel Desktop Board D525MWV

Environmental Specifications

Maintenance

Main

Advanced

Security

Power

Boot

Exit

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration ut ility, LAN EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs a re identified as MWPNT10N.86A.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the oper a ting system boot begins. The men u bar is shown below.

NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 51 shows how to put the board in configure mode.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

<↑> or <↓>

Specification

Table 32 lists the BIOS Setup program menu features.

Table 32. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit

Clears passwords and displays processor information

Displays processor and memory configuration

Configures advanced features available through the chipset

Sets passwords and security features

Configures power management features and power states options

Selects boot options

Saves or discards changes to Setup program options

Table 33 lists the function keys available for menu screens.

Table 33. BIOS Setup Program Function Keys

BIOS Setup Program Function Key

<←> or <→>

<Enter> Executes command or selects the submenu <F9> Load the default conf iguration values for the current menu <F10> Save the current values and exits the B IOS Setup program <Esc> Exits the menu

Description

Selects a different menu screen (Move s the c ur s or left or right) Selects an item (Move s the c ursor up or do w n)

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI* Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMB IOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system compone nts. The MIF database defines the data a nd provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems req uire an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board informatio n can be found in the BIOS under the A dditional Information header under the Main BIOS page.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB ke yboard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice ar e not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be accessed by using Intel Inte grator Toolkit.

To install an operating system that suppo rts USB, verify that Legacy USB support in the BIOS Setup pro gram is set to Enabled and follow the operating system’s installa tion instructions.

Overview of BIOS Features

3.6 BIOS Updates

The BIOS can be u pdated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this

• Intel® F7 switch allows a user to select where the BIOS .bio file is located and

Both utilities verify that the updated BIOS m a t ches the target system to prevent accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://downloadcenter.intel.com

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS c a n be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

utility, the BIOS can be updated from a file on a hard disk, a USB dr ive (a flash drive or a USB drive), or an optical drive.

perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

3.6.1 BIOS Recovery

It is u nlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 34 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 34. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

Optical drive c o nne c te d to the SATA interfac e Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette dr iv e (w i th a 1 .44 MB diskette) No USB hard disk drive No

For information about Refer to

BIOS update instructions http://www.intel.com/support/motherboards/desktop/sb

/CS-022312.htm

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Refer to

Specification

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom splash screen, it will share space with the I ntel branded logo.

For information about

Intel Integrato r Toolkit http://developer.intel.com/design/motherbd/software/itk/

Integrator’s Toolkit that is

3.7 Boot Options

In the BIOS Setup program, the user can choose to bo ot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.7.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.7.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces b ooting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

Overview of BIOS Features

3.7.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.7.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displaye d . This menu displays the list of available boot devices (a s set in the BIOS setup program’s Boot Device Priority submenu). Table 35 lists the boot device menu options.

Table 35. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> <Enter> Exits the menu, saves changes, and boots from the s e le c te d

<Esc> Exits the menu without saving c hang e s

Selects a default boot device

device

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

3.8 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A superviso r password and a user password can be set for the BIOS Setup program and for booting the computer , with the following restrictions:

• The supervisor password gives unrestricted access to v iew a nd change all the Setup options in the BIOS Setup program. This is the superviso r mode.

• The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the us er restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.

Table 36 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 36. Supervisor and User Password Functions

Password Set

Neither Can chang e all

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no pas s word is set, any user can change all Setup op tions.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

4 Board Status and Error Messages

4.1 BIOS Beep Codes

The BIOS us es audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST. The beep codes are listed in Table 37. These beep codes can be heard through a speaker attached to the board’s line out audio jack (see Figure 4, B on page 26).

Table 37. BIOS Beep Codes

Type Pattern Frequency

F2 Setup/F10 B o ot Menu Prompt

BIOS update in progress None Video error On-off (1.0 second eac h) tw o times, then

Memory error On-off (1.0 second each) three times , the n

Thermal trip warning Alternate high and low beeps (1 .0 s e c ond each)

One 0.5 second beep when BIOS is ready to accept keyboa r d input

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) o nc e and the BIOS will continue to boot.

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) until the s y s te m is p o wered off.

for eight beeps, f ollowed by sys te m s hut d o wn.

932 Hz

932 Hz When no VGA option R O M is found.

932 Hz

High beep 2000 Hz Low beep 1500 Hz

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

4.2 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 38).

Table 38. Front-panel Power LED Blink Codes

Type Pattern Note

F2 Setup/F10 B o ot Menu Prompt

BIOS update in progress Off when the update begi ns , then on for

Video error On-off (1.0 second eac h) tw o times, then

Memory error On-off (1.0 second each) three times , the n

Thermal trip warning Each beep will be accompanied b y the following

None

0.5 seconds, the n o ff for 0.5 se c onds. The pattern repeats until the B IOS update is complete.

2.5-second pause (o ff), entire pattern r e p e ats (blink and pause) until the sy s te m is p owered off.

2.5-second pause (o ff), entire pattern r e p e ats (blinks and pause) until the system is powered off.

blink pattern: .25 se co nds On, .25 seconds Off, .25 seconds On, .25 seconds Of f. This will result in a total of 16 blinks.

When no VGA option R O M is found.

4.3 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem. Table 39 lists the error messages and provides a brief description of each.

Table 39. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Re place the battery so o n. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have

been corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device Available System did not find a devic e to b oot.

Board Status and Error Messages

4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the P OST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card ca n d ecode the port and d isplay the contents on a medium such as a seven-segment display.

NOTE

The POST card must be installed in the PCI bus connector.

The following tables provide information ab out the POST codes generated by the BIOS:

• Table 40 lists the Port 80h POST code ranges

• Table 41 lists the Port 80h POST codes themselves

• Table 42 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 40. Port 80h POST Code Ranges

Range Category/Subsystem

00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable CPU error. 20 – 2F Memory/Chipset: 2F is no memory detected o r no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use. 50 – 5F I/O Buss e s : PC I, USB, ISA, ATA, e tc . 5F is an unrecoverable error. S tart with PCI. 60 – 6F Reserved for future use (for new busses). 70 – 7F Output Dev ic e s : A ll output consoles. 7F is an unrecoverable e rror. 80 – 8F Reserved for future use (new output console codes). 90 – 9F Input devices: Keyboard /Mouse. 9F is an unreco v e rable error. A0 – AF Reserved fo r future use (new input console codes). B0 – BF Bo ot Devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for f uture use. D0 – DF Boot device selection. E0 – FF E0 – EE: Miscellaneous codes. See Table 41.

EF: boot/S3 r e s ume failure. F0 – FF: FF processor exception.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Host Processor

Chipset

USB

Local Console

Remote Console

Specification

Table 41. Port 80h POST Codes

POST Code Description of POST Operation

10 Power-on initialization of the host pr ocessor (Boot S trap Processor) 11 Host processor cache initial izati o n (inc luding APs) 12 Starting Application proce s s o r initialization 13 SMM initialization

21 Initializing a chipset component

22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameter s in the me m o ry controller and the D IMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 28 Testing memory

50 Enumerating PCI busses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initializatio n 53 – 57 Reserved for PCI Bus

58 Resetting USB bus 59 Reserved for USB

5A Resetting PATA/SATA b us and all devices 5B R eserv ed f o r ATA

5C Re s e tting SMBus 5D Reserved for SMBus

70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller

78 Resetting the console contro lle r 79 Disabling the console contro lle r 7A Ena b ling the console controller

Memory

PCI Bus

ATA/ATAPI/SATA

SMBus

continued

Board Status and Error Messages

Keyboard (PS/2 or USB)

Fixed Media

Removable Media

PEI Core

Table 41. Port 80h POST Codes (continued)

POST Code Description of POST Operation

90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input b uffer 95 Instructing keyboard c ontroller to run Se lf Test (PS/2 only)

98 Resetting mouse 99 Disabling mouse 9A D etecting presence of mouse 9B Enabling mouse

B0 Resetting fixed me d i a B1 Disabling fixed me d ia B2 Detecting prese nc e o f a fixed media (hard drive detectio n e tc .) B3 Enabling/configuring a f ixed media

B8 Resetting remov able media B9 Disabling remov able media BA Detecting presence of a removable media (CD-ROM detection, e tc .) BC Enabling/confi g uring a removable me dia

Dy Trying b oot selection y (y= 0 to 15)

E0 Started dispatching PEI Ms (em itte d on first repor t of EFI_SW_PC _INIT_BEGIN

EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Per ma ne nt me mory found E1, E3 Reserved for PEI/PEIMs

E4 Enter e d DXE phase E5 Started dispatching dr ivers E6 Started connecting dri v e rs

Mouse (PS/2 or USB)

BDS

DXE Core

continued

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

DXE Drivers

Runtime Phase/EFI OS Boot

PEIMs/Recovery

Specification

Table 41. Port 80h POST Codes (continued)

POST Code Description of POST Operation

E7 Waiting f or user input E8 Checking password E9 Enter ing BIOS setup EB Calling Legacy O p ti o n ROMs

F4 Entering Sleep s tate F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAd dressMap ( ) has been c alle d FA EFI runtime service ResetSystem ( ) has been called

30 Crisis Recovery has initiated per user request 31 Crisis R e c overy has initiated b y s oftware (corr up t flash) 34 Loading recovery capsule 35 Handing of f control to the rec o very capsule 3F Unable to recover

Table 42. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a chipset co mponent 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memo ry 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application p rocessor initializatio n 13 SMM initialization 50 Enumerating PCI buss e s 51 Allocating resour c e d to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling V ideo BIOS 58 Resetting USB bus 5A Resetting PA T A /S A T A b us and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PA T A /S A T A b us and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for use r input 01 INT 19 00 Ready to boot

Board Status and Error Messages

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the follo wing regulatory compliance information for Intel Des ktop Board D525MW and Intel Desktop Board D525MWV:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification markings

5.1.1 Safety Standards

Intel Desktop Board D525MW and Intel Desktop B oard D525MWV comply with the safety standards stated in Table 43 when correctly installed in a compatible host system.

Table 43. Safety Standards

Standard Title

CSA/UL 60950-1 Information Tec hno l o gy Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Eq uipment – Safety - Par t 1 : G e ne ral

Requirements (Euro pean Union)

IEC 60950-1 Information Tec hno l o gy Equipment – Safety - Part 1: General

Requirements (I nte r na tio na l)

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

5.1.2 European Union Declaration of Conformity Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board D525MW is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europee s Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direk tiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Complia nc e and Battery Disposal Information

中文

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide produc t ecology concer ns and regulations.

5.1.3.1 Disposal Considerations

This product contains the fo llowing mater ials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology details of this program, including the scope of covered products, available locatio ns, shipping instructions, terms and conditions, etc.

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program

（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology

了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

for the

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf de r

http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usado s en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology

para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology

pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expé d ition, les conditions générales, etc .

日本語インテルでは、環境保護活動の一環として、使い終えたインテル

ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、

http://www.intel.com/in

tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksa nakan Program Kitar Semula Produk unt uk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk t erguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology

untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology

(em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Complia nc e and Battery Disposal Information

Regulation

Title

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Progr am) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology

за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

Intel Desktop Board D525MW and Intel Desktop B oard D525MWV comply with the EMC regulations stated in Table 44 when correctly installed in a compatible host system.

Table 44. EMC Regulations

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipme nt S tandard, Digital Apparatus. (Canada) EN55022 Limits and methods of measurement of Radio Interference Characteristics

EN55024 Information Technology Eq ui p me nt – Immunity Characteristics Limits and

EN55022 Australian Communications Authority, S ta nd ard for Electro m ag ne tic

CISPR 22 Limits and methods of me as urement of Radio D is turbance Character is tic s

CISPR 24 Information Tec hno l o gy Equipment – Immunity Characteristics – Limits

VCCI V-3, V-4 Voluntary Control f o r Interferenc e b y Information Tec hnology Equipment.

KN-22, KN-24 Korean Communications C ommission – Framework Act on

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal R e gulations, Part 15, Subp a r t B , Radio Frequency Devices. (USA)

of Information Technology Equip me nt. (European Union)

methods of measurement. (European Union)

Compatibility. (Austr ali a and N e w Z e ala nd )

of Information Technology Equip me nt. (International)

and Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (So uth Korea)

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC perfo rmance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686 This equipment has been teste d and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in acco rdance with the instructions, may caus e harmful interfe rence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the use r is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the us er’s authority to operate the equipment. Tested to comply with FCC sta nda rds for home or office use.

Canadian Department o f C o mmun ications Compliance Sta te me n t

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interf erence Regulations of the Canadian Department of Comm unications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Complia nc e and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standar d of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagne tic conformity registration, so it can be used not only in residential areas, but also other areas.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

5.1.5 e-Standby and ErP Compliance

Intel Desktop Board D525MW and Intel Desktop B oard D525MWV meet the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2013 (ErP) Lot 6

For information about Refer to

Electronic Produc t Environmental Assessm e nt To ol (EPEAT) http://www.epeat.net/ Korea e-Standby Pr o gram http://www.kemco.or.kr/new_eng/pg02

/pg02100300.asp

European Union Energ y-related Products Directive 200 9 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Regulatory Complia nc e and Battery Disposal Information

Description

Mark

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board D525MW and Intel Desktop B oard D525MWV have the regulatory compliance marks shown in Table 45.

Table 45. Regulatory Compliance Marks

UL joint US/Canada Rec o gnized Component mark. Includes adjac e nt U L file number for Intel Desktop Boards: E210882.

FCC Declaratio n o f Conformity lo g o mark for Clas s B e quipment.

CE mark. Declaring c o m p li anc e to the European Union (EU) EMC d irective, Low Voltage dire c tive, and RoHS dire c tiv e .

Australian Communicatio ns A uthority (ACA) and New Z e aland Radio Spectrum Management (NZ RSM) C-tick mark. Inc lud e s adjacent Intel supplier code num b e r, N-232.

Japan VCCI (Voluntary Control Co unc i l f or Interfer e nc e ) mark.

Korea Certificati o n ma r k. Includes an adjace nt KC C (Korean Communications Commis s ion) certification numbe r : KCC-REM-CPU-D525MW.

Taiwan BSMI (Bureau o f Standards, Metrolo g y and Inspections ) mark. Includes adjacent Intel company number, D33025.

Printed wiring boa r d manufacturer’s r e c o gnition mark. Consists o f a unique UL recognized manuf a c tur e r’s logo, along wi th a f la mm ab il ity rating (solder side).

China RoHS/Environme nta lly Friendly Use Pe riod Logo: This is an example of the symbol used on Intel Desktop Boards and associate d collateral. The color of the mar k may vary depe nd ing upon the application. The Environmental Friendly Usage Period (EFUP) for Intel De s k top Boards has been determined to be 10 years.

V-0

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

PRÉCAUTION

FORHOLDSREGEL

OBS!

VIKTIGT!

VARO

VORSICHT

AVVERTIMENTO

Specification

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbes tä mmelserna.

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten y mp ä ristömääräysten mukaisesti.

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo co rretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Complia nc e and Battery Disposal Information

PRECAUCIÓN

WAARSCHUWING

ATENÇÃO

AŚCIAROŽZNAŚĆ

UPOZORNÌNÍ

Προσοχή

VIGYÁZAT

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las rec omendadas por el fabri cante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

AWAS

OSTRZEŻENIE

PRECAUŢIE

ВНИМАНИЕ

UPOZORNENIE

POZOR

UYARI

OСТОРОГА

Specification

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak be tul. B a teri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Complia nc e and Battery Disposal Information

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product Specification

Intel D525MW, D525MWV, TOTAL REACH OCU DP, TOTAL REACH DDS-R, BLKD525MW Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual