Intel D525MW, D525MWV, TOTAL REACH OCU DP, TOTAL REACH DDS-R, BLKD525MW Technical Product Specification

Intel® Desktop Board D525MW and
Intel® Desktop Board D525MWV

Technical Product Specification

July 2013

Order Number: E98416-003

®

The Intel
product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D525MW and Intel Desktop
Board D525MWV Specification Update.

Desktop Board D525MW and Intel Desktop Board D525MWV may contain design defects or errors known as errata that may cause the

Revision History

Revision Revision Histor y Date

-001 First release o f the Intel® Desktop Board D525MW and Intel® Desktop
Board D525MWV Technical Product S pecification

-002 Specification Clarification May 2013

-003 Specification Clarification July 2013

This product spec ification applies to only the standard Intel® Desktop Board D525MW and Intel®
Desktop Board D525MWV with BIOS iden tifier MWPNT10N.86A.

Changes to this s p ecification will be publis hed in the Intel Desktop Board D525MW and Intel
Desktop Board D525MWV Specification Update b efore being incorporate d into a revision of th is
document.

INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIO NS OF SALE F O R
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.

Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other
intellectual proper ty rights that relate to the presented subject matter. The furnishing of documents and
other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.

Intel may make chang e s to specifications and p roduct descrip tions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves the s e for future def inition and shall have no res p onsibility whatsoev e r for
conflicts or inco mpatibilities arising from future changes to the m .

®

Desktop Boards may contain design defects or errors known as errata, which may cause the product

Intel
to deviate from p ublished specifications. Current characte rized errata are available on request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our
product order.

Intel, the Intel logo , a nd Intel Atom are trade m arks of Intel Co rporation in the United S ta te s and other
countries.

* Other names and brands may be claimed a s the property of others.
Copyright © 2010-2013, Inte l C orporation. All r ig hts reserved.

July 2010

AA Revision

BIOS Revision

Notes

Device

Stepping

S-Spec Numbers

Board Identification Information

Basic Desktop Board D525MW Identification Information

E93080-300 MWPNT10N.86A.0049 1,2
E93082-300 MWPNT10N.86A.0049 1,2
E93080-301 MWPNT10N.86A.0069 1,2
E93081-301 MWPNT10N.86A.0069 1,2
E93082-301 MWPNT10N.86A.0069 1,2
E93080-400 MWPNT10N.86A.0069 1,2
E93081-400 MWPNT10N.86A.0069 1,2
E93082-400 MWPNT10N.86A.0069 1,2
Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

2. The CG82NM10 chipset used on this AA r e v i s io n c onsists of the follo wing component:

CG82NM10 B0 SLGXX

Specification Changes or Clarifications

The table below indicates the Spec ification Changes or Specification Clarifications that
apply to the Intel

Specification Changes or Clarifications

Date Type of Change Description of Changes or C larifications

May 2013 Spec Clarification Added ENERGY ST A R Note to Section 5.1.5.
July 2013 S p e c C l arification Deleted references to ENERGY STAR.

®

Desktop Board D525MW.

Errata

Current characterized errata, if any, are documented in a separate Specification
Update. See

motherboards/motherboards.html?wapkw=desktop+boards for the latest

documentation.

http://www.intel.com/content/www/us/en/motherboards/desktop-

iii

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

iv

Preface

Chapter

Description

1

A description of the hardware used on the board

2

A map of the resources of the board

3

The features s upported by the BIOS Setup program

4

A description of the BIOS error messages, beep codes, and POST codes

5

Regulatory compliance and battery disposal information

This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D525MW and Intel
standard product and available manufacturing options.

®

Desktop Board D525MWV. It describes the

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D525MW and Intel Desktop Board D525MWV and its comp onents to the vendors,
system integrators, and other engineers and technicians who need this level of
infor mation. It is specifically not intended for general audiences.

What This Document Contai ns

®

Typographical Conventions

This section cont ains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging har dware or losing data .

v

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilo bit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/s Megabits per second
xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of thei r

respective owners.

vi

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Onl ine Support ................................................................................. 16

1.3 Processor ........................................................................................ 16

1.3.1 Intel® D525 Graphics Su b system ............................................. 17

1.4 System Memory ............................................................................... 18

1.5 Intel® NM10 Express Chipset .............................................................. 19

1.5.2 USB ..................................................................................... 21

1.5.3 SATA Support ....................................................................... 21

1.6 Real-Ti me Clock Subsystem ............................................................... 22

1.7 Legacy I/O Controller ........................................................................ 22

1.8 LAN Subsystem ................................................................................ 23

1.8.1 LAN Subsystem Drivers .......................................................... 23

1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24

1.9 Audio Subsystem .............................................................................. 25

1.9.1 Audio Subsystem Software ..................................................... 26

1.9.2 Audio Connectors and Headers ................................................ 26

1.10 Hardware Management Subsystem ..................................................... 27

1.10.1 Hardware Monitoring ............................................................. 27

1.10.2 Thermal Monitoring ............................................................... 28

1.11 Power Management .......................................................................... 29

1.11.1 ACPI .................................................................................... 29

1.11.2 Hardware Support ................................................................. 32

2 Technical Reference

2.1 Memory Map .................................................................................... 35

2.1.1 Addressable Memory ............................................................. 35

2.2 Connectors and Headers .................................................................... 38

2.2.1 Back Panel ........................................................................... 39

2.2.2 Component-side Connectors and Headers................................. 41

2.3 BIOS Configuration Jumper Block ....................................................... 51

2.4 Mechanical Considerations ................................................................. 53

2.4.1 Form Factor .......................................................................... 53

2.5 El ectrical Considerations .................................................................... 54

2.5.1 Fan Header Current Capability ................................................ 54

2.5.2 Add-in Board Considerations ................................................... 54

2.6 Thermal Considerations ..................................................................... 54

2.6.1 Passive Heatsink Design in a Passive System Environment ......... 56

vii

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

2.7 Power Consumption .......................................................................... 59

2.7.1 Minimum Load Configuration ................................................... 59

2.7.2 Maximum Load Configuration .................................................. 59

2.8 Reliability......................................................................................... 60

2.9 Environmental .................................................................................. 60

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 61

3.2 BIOS Flash Memory Organization ........................................................ 62

3.3 Resource Configuration ..................................................................... 62

3.3.1 PCI* Autoconfiguration .......................................................... 62

3.4 System Management BIOS (SMBIOS) ................................................. 63

3.5 Legacy USB Support ......................................................................... 64

3.6 BIOS Updates .................................................................................. 65

3.6.1 BIOS Recovery ...................................................................... 65

3.6.2 Custom Splash Screen ........................................................... 66

3.7 Boot Options .................................................................................... 66

3.7.1 Optical Drive Boot ................................................................. 66

3.7.2 Network Boot ........................................................................ 66

3.7.3 Booting Without Attached Devices ........................................... 67

3.7.4 Changing the Default Boot Device During POST ......................... 67

3.8 BIOS Security Features ..................................................................... 68

4 Board Status and Error Messages

4.1 BIOS Beep Codes ............................................................................. 69

4.2 Front-panel Power LED Blink Codes ..................................................... 70

4.3 BIOS Error Messages ........................................................................ 70

4.4 Port 80h POST Codes ........................................................................ 71

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 77

5.1.1 Safety Standards................................................................... 77

5.1.2 European Union Declaration of Conformity Statement ................ 78

5.1.3 Product Ecology Statements ................................................... 79

5.1.4 EMC Regulations ................................................................... 81

5.1.5 e-Standby and ErP Compliance ............................................... 84

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85

5.2 Battery Disposal Information .............................................................. 86

viii

Contents

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. LAN Connector LED Locations ............................................................. 24

4. Back Panel Audio Connectors ............................................................. 26

5. Thermal Sensors and Fan Header ....................................................... 28

6. Location of the Standby Power Indicator LED ....................................... 34

7. Detailed System Memory Address Map ................................................ 36

8. Back Panel Connectors ...................................................................... 39

9. I/O Shield Reference Diagram ............................................................ 40

10. Component-side Connectors and Headers ............................................ 41

11. Connection Diagram for Front Panel Header ......................................... 48

12. Connection Diagram for Front Panel USB Header .................................. 50

13. Connection Diagram for Front Panel USB Header with

Intel Z- USB Solid-State Drive or Compatible Device Support ................. 50

14. Location of the BIOS Configuration Jumper Block .................................. 51

15. Board Dimensions ............................................................................. 53

16. Localized High Temperature Zones ..................................................... 55

17. Fan Location Guide for Cassis Selection (Chassis Orientation is

Not Restricted) ................................................................................. 58

Tables

1. Feature Summary ............................................................................. 11

2. Board Components Shown in Figure 1 ................................................. 14

3. Supported Memory Configurations ...................................................... 18

4. LAN Connector LED States ................................................................. 24

5. Audio Jack Support ........................................................................... 25

6. Effects of Pressing the Power Switch ................................................... 29

7. Power States and Targeted System Power ........................................... 30

8. Wake-up Devices and Events ............................................................. 31

9. System Memory Map ........................................................................ 37

1

0. Component-side Connectors and Headers Shown in Figure 10 ................ 42

11. Serial Port Header ............................................................................ 43

12. LVDS Data Connector - 30-Pin (D525MWV only) ................................... 43

13. LVDS Panel Voltage Selection Jumper (D525MWV on ly) ......................... 44

14. LVDS Inverter P ower Connector (D525MWV on ly) ................................. 44

15. LVDS Inverter P ower Voltage Select ion Jumper (D525 MWV on ly) ........... 44

16. Chassis Fan Header .......................................................................... 44

17. SATA Connectors .............................................................................. 45

18. Front Panel Wireless Activity LED Header ............................................. 45

19. Front Panel Audio Header for Intel HD Audio ........................................ 45

20. Front Panel Audio Header for AC ’97 Audio ........................................... 45

21. Front Panel USB Header .................................................................... 46

ix

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

22. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or

Compatible Device Support ................................................................ 46

23. Power Connector .............................................................................. 47

24. Front Panel Header ........................................................................... 48

25. States for a One-Color Power LED ....................................................... 49

26. BIOS Configuration Jumper Settings ................................................... 52

27. Fan Header Current Capability ............................................................ 54

28. Thermal Considerations for Components .............................................. 56

29. Minimum Load Configuration Current and Power Results ........................ 59

30. Maximum Load Configuration Current and Power Results ....................... 60

31. Intel Desktop Board D525MW and Intel Desktop Board D525MWV

Environmental Specifications .............................................................. 60

32. BIOS Setup Program Menu Bar ........................................................... 62

33. BIOS Setup Program Function Keys .................................................... 62

34. Acceptable Drives/Media Types for BIOS R ecovery ................................ 65

35. Boot Device Menu O ptions ................................................................. 67

36. Supervisor and User Password Functions ............................................. 68

37. BIOS Beep Codes ............................................................................. 69

38. Front-panel Power LED Blink Codes ..................................................... 70

39. BIOS Error Messages ........................................................................ 70

40. Port 80h POST Code Ranges .............................................................. 71

41. Port 80h POST Codes ........................................................................ 72

42. Typical Port 80h POST Sequence ........................................................ 75

43. Safety Standards .............................................................................. 77

44. EMC Regulations ............................................................................... 81

46. Regulatory Compliance Marks ............................................................ 85

x

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Modul e (SO-

Legacy I/O Control

• Seven USB 2.0 ports:

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board D525MW and Intel
Desktop Board D525MWV.

Table 1. Feature Summary

Form Factor Mini-ITX, (6.7 inches b y 6.7 inches [170 m illim e te r s by 170 millimeters])

compatible with micr o A T X

Processor Passively-cooled , s oldered-down Dual-Core Intel® Atom™ process or with

integrated graphi c s and inte grated memory c o ntroller

Memory

Chipset Passively coole d , Intel® NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem s upport based on the Realtek*

Internal Graphics Onboard Intel® graphics subsy s te m w ith s up port for:

Peripheral
Interfaces

LAN Support 10/100/1000 Mbit/s Ethernet LAN subsy s te m us ing a Realtek 8111E Gigabit

DIMM) sockets

• Support for DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 MHz SO-DIMMs
Note: DDR3 1066 MHz and DDR3 1333 MHz memory will run at 800 MHz

• Support for up to 2 GB of system me mory on a single SO-DI MM (4 GB with

two SO-DIMMs)

ALC662 high definition audio codec

• Integrated GMCH

• Analog displays (V G A )

• Flat Panel displays (LVDS interface – D525MWV only)

Winbond W83627DHG-A based Legacy I/O controller for hardware m anagement,
serial, parallel, and PS /2 * ports

― Four back pane l p orts
― Two ports are im p le m e nte d w ith a d ual port internal header f or front panel

cabling

― One port is impleme nte d with an internal header (brown-colored) that

supports an Intel

• Two Serial ATA (SA T A ) 3 .0 Gb/s connector s (s up p orting IDE and AHC I mode)

• One parallel por t connector on the back panel

• One serial port c o nne c tor on the back panel

• One serial por t he ad e r

• PS/2*-style keyboard and mouse ports

Ethernet Controller

®

Z-U130 USB Solid-State Drive or compatible d e v ic e

continued

11

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

• Intel® BIOS (resid e nt in the S PI Flash device)

• Support for PC I* Local Bus Spec ification Revision 2.3

• One PCI Conventional bus connector (with riser card support for up to two PCI

• Hardware monitoring through the Windbo nd I/O controller

Specification

Table 1. Feature Summary (continued)

BIOS

• Support for A d vanced Configur ation and Power Interface (ACPI), Plug and

Play, and SMBIOS

Instantly Available
PC Technology

Expansion
Capabilities

Hardware Monitor
Subsystem

• Suspend to RAM s up p ort

• Wake on PCI, PCI Ex press*, PS/2, serial, front panel, USB ports, and LAN

cards)

• PCI Express x1 Mini Card connector

• Voltage sense to d e te c t o ut of range powe r s upply voltages

• Thermal sense to dete c t out of range thermal v a lue s

• One fan header

• One fan sense input used to monitor fan activ ity

• Fan speed control

12

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Table 2 lists the components identified in Figure 1.

Figure 1. Major Board Components

13

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

Back panel connector s

LVDS inverter p a ne l v oltage selection jumper (D525MWV only)

LVDS inverter p ower connector (D525MWV only)

LVDS panel connector (D525MWV only)

SO-DIMM channel A socke t, DIMM 0

SATA connector 0

Front panel USB hea d e r (black)

BIOS setup co nf i g uration jumper block

PCI Express x1 Mini Card connecto r

Front panel USB head e r supports I nte l Z -U130 USB Solid-State
Drive or compatible device (brown-colored)

PCI conventional b us c o nne c tor

Specification

Table 2. Board Components Shown in Figure 1

Item/callout
from Figure 1

A
B
C
D
E
F
G
H

I

J
K
L
M
N
O
P
Q
R
S
T
U Front Panel Wireless A c ti v ity LED Header
V

Description

Serial port heade r
LVDS inverter p ower voltage se le c tion jumper (D525MWV only)

Processor core power connector (2 x 2)
Intel Atom processor
Power connector (2 x 12)

SO-DIMM channel A socke t, DIMM 1
Battery
SATA connector 1

Front panel header
Standby power LED

Intel NM10 Expr e s s C hipset

W

X
Y
Z

S/PDIF header
Chassis fan header
Front panel audio he ad e r

14

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

15

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

To find information a bout…

Visit this World Wide Web site:

For information about

Refer to

Power supply c o nne c tors

Section 2.2.2.3, page 47

Specification

1.2 Online Support

Intel Desktop B oard D525MW and
Intel Desktop B oard D525MWV

Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for the Intel

Desktop Board D525MW and Intel
Desktop Board D525MWV

Supported processors http://processormatch.intel.com
Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://www.intel.com/products/motherboard/index.htm

http://ark.intel.com

025414.htm

1.3 Processor

The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.

NOTE

The board is des igned to be passively cooled in a prope rly ventilated chassi s. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.

16

Product Description

1.3.1 Intel® D525 Graphics Subsystem

1.3.1.1 Intel® Graphics Media Accelerator 3150 Graph ics
Controller

The Intel GMA 3150 graphics controller features the following:

• 400 MHz core frequency

• High quality texture engine
 DX9.0c* and OpenGL* 1.4 compliant
 Hardware Pixel Shader 2.0
 Vertex Shader Model 2.0

• 3D Graphics Rendering enhancements
 1.6 dual texture GigaPixel/s max f ill rate
 16-bit and 32-bit color
 Vertex cache

• Video
 Software DVD at 30 fps full screen
 DVMT support up to 256 MB

• Display
 Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
 Supports LVDS displays up to 1366 x 768 (single channel, 18 bpp) (D525MWV

only)

 Dual independent display support with LVDS option (D525MWV only)

For information about Refer to

Obtaining graphics s oftware and utilities Section 1.2, page 16

17

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

1.4 System Memory

The board has two 204-pin DDR3 SO-DIMM sockets and supports the following
memory features:

• DDR3 SDRAM SO-DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided DIMMs

• 4 GB maximum total system memory

• Minimum total system memory: 256 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 MHz SO-DIMMs

(DDR3 1066 MHz and DDR3 1333 MHz memory will run at 800 MHz)

NOTE

Due to passively-cooled thermal constraints, system memory must have an operating
temperature rating of 85

The board is des igned to be passively cooled in a prope rly ventilated chassis. Chassis
venting locations are recommended above the system memory area for maximum heat
dissipation effectiveness.

o

C.

NOTE

To be fully compliant with all applicable DDR3 SDRAM memory specifications, the
board should be populated with DIMMs that support the Serial Presenc e Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, perfor ma nce and reliability may be impacte d or the DIMMs may not
function under the determined frequency.

Table 3 lists the supported SO-DIMM configurations.

Table 3. Supported Memory Configurations

DIMM
Capacity Configuration

1024 MB DS 1 Gbit 64 M x16/64 M x16 8
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 2 Gbit 128 M x16/128 M x16 8
2048 MB SS 2 Gbit 256 M x8/empty 8

Note: In the second col umn, “ DS” refers to double-sided memo ry modules (containing two rows of SDRAM)

and “SS” refe rs to single-sided mem o ry modules (containing one row of SDRAM).

SDRAM
Density

SDRAM Organization
Front-side/Back-side

Number of
SDRAM Devices

18

Product Description

For information about

Refer to

1.5 Intel® NM10 Express Chipset

The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.

NOTE

The board is des igned to be passively cooled in a prope rly ventilated chassi s. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.

The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2

1.5.1.1 Video Memory Allocation

Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:

• 256 MB total RAM results in 32 MB video RAM

• 512 MB total RAM results in 64 MB video RAM

• 1 GB total RAM results in 128 MB video RAM

• 2 GB total RAM results in 224 MB video RAM

1.5.1.2 Analog Display (VGA)

The VGA port supports analog displays. The maximum suppor ted resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate.

1.5.1.3 Flat Panel Interface (LVDS) – (D525MWV only)

The flat panel interface (LVDS ) supports the following:

• Panel support up to UXGA (1366 x 768)

• 25 MHz to 112 MHz single–channel; @18 bpp
 TFT panel type

• Panel fitting, panning, and center mode

• CPIS 1.5 compliant

• Spread spectrum clocking

• Panel power sequencing

• Integrated PWM interface for LCD backlight inverter control

19

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

1.5.1.4 Configuration Modes

For monitors attached to the VGA port, video m odes supported by this board are based
on the Extended Display I dentification Data (EDID) protocol.

Video mode configuration for LVDS displays (D525MWV only) is supported as follows:

• Automatic panel identification via Extended Display Identification Data (EDID) for
LVDS panels supporting EDI D protocol.

• Manual LVDS panel configuration through the BIOS s etup page. This feature allows
the manual entry of critical panel settings (eq uivalent to the 18-byte Detailed
Timings Descriptor structur e defined by the VESA EDID specification) for non-EDID
panel support.

In addition, BIOS setup provides the following configuration parameters for LVDS
displays (D525MWV only):

• Screen Brightness: allows the end-user to set screen brightness for the display.

• Maintain Aspect Ratio: allows the end-user to select whether the native aspect ratio

is to be preserved during POST and before the video driver is loaded.

• LVDS Configuration Changes: allows the system integra tor to “lock” critical settings
of the LVDS configuration to avoid end-users potentially rendering the display
unusable (refer to Note 1).

• Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.

• Minimum Inverter Current Limit (%): allows the system integrator to set minimum
PWM%, as appropriate, according to the power requirements of the LVDS display
and the selected inverter board.

NOTE

Support for LVDS (D525MWV only) configuration complies with the following:

1. “Unlocking” of critical settings of the LVDS c onfiguration is supported via Intel
Integrator Toolkit’s command-line tool.

2. Critical settings of the LVDS configuration are not exposed through Intel Integrator
Toolkit or Intel® Integrator Assis tant GUIs.

3. Critical settings of the LVDS configuration will not be overwritten by loading BIOS
setup defaults.

4. Critical settings of the LVDS configuration will be preserved across BIOS updates.

®

20

Product Description

1.5.2 USB

The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers (four ports route d to the back panel and three
ports routed to two front panel USB 2.0 headers). One of the front panel USB headers
(brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.

NOTE

Computer systems that have an unshielded cable attached to a USB por t m a y not meet
FCC Class B requirements, even if no device is attached to the cable. Use shielded
cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 8, page 39
The location of the front panel USB headers Figure 10, page 41

1.5.3 SATA Support

The board provides two SATA interface connectors that support one device per
connector.

The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gbits/s on each port. One device can be installed on
each port for a maximum of tw o SATA devices. A point-to-point interface is used for
host to device connections, u nlike PATA which supports a master/s lave configuration
and two devices on each channel.

For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA contr oller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 a nd 1 5 ). In native mode, standard PCI Conventional bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows* XP and Windows Vista* operating systems.

For information about Refer to

Obtaining AHCI driver Section 1.2, page 16
The location of the S A TA connectors Figure 10, page 41

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Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product
Specification

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the po wer supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied.

NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.7 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• One serial port header

• One serial port connector on the back panel

• One parallel port connector with Extended Capabilities Port (ECP) and Enhanced

Parallel Port (EPP) suppor t

• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems

• PS/2-style keyboard and mouse ports

• Intelligent power management, including a programmable wake-up event interface

• PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

For information about Refer to

The location of the serial port header Figure 10, page 41
The serial port head e r signal mapping Table 11, on page 43

22

Product Description

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek 8111E Gigabit Ethernet Controller for 10/100/1000 Mbit/s Ethernet LAN

connectivity

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface that supports the Ethernet controller

• PCI Conventional bus power management
 Supports ACPI technology
 Supports LAN wake capabilities

1.8.1 LAN Subsystem Drivers

LAN drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN drive rs Section 1.2, page 16

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Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

LED

LED Color

LED State

Condition

Specification

1.8.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 3).

Figure 3. LAN Connector LED Locations

Table 4 describes the LED states when the board is powered up and the Ethernet LAN
subsystem is opera ting.

Table 4. LAN Connector LED States

Off LAN link is not estab lis he d.

Link/Activity (A) Green

Link Speed (B) Green/Yellow

On LAN link is established .
Blinking LAN ac tivity is occurring .
Off 10 Mbits/s data rate is selected or negotiated.
Green 100 Mbits/s data ra te is se l e c te d o r negotiated.
Yellow 1000 Mbits/s data r a te is se l e c te d o r negotiated.

24

Product Description

1.9 Audio Subsystem

The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:

• Intel NM10 Express Chipset

• Realtek ALC662 audio codec

The audio subsystem has the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device tha t is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.

• Front panel Intel HD Audio and AC ’97 audio support

• 3-port analog audio out stack

• Windows Vista Basic certification

• A signal-to-noise (S/N) ratio of 95 dB

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

Front panel – Green No Yes No No Yes
Front panel – Pink No No No Yes No
Back panel – Blue Yes No Yes No No
Back panel – Green No Yes No No Yes
Back panel – Pink No No No Yes No

Line In

Line/

Front Out Rear Out

MIC

Headphones

25

Intel Desktop Board D525MW and Intel Desktop Board D525 M WV Technical Product

The back panel audio c onnectors

Figure 4, page 26

Specification

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio sof tw a r e and drivers Section 1.2, page 16

1.9.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back pane l and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors).

Item Description

A Line in
B Line out
C Mic in

Figure 4. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

For information about Refer to

The locations of the f ront panel audio header and S/PDIF audio header Figure 10, page 41
The signal names of the f ront panel audio header and S/PDIF head e r Section 2.2.2.1, page 43

26

Product Description

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:

• Thermal and voltage monitoring

• Chassis intrusion detection

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-A device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, a nd + VCCP

• SMBus interface

27