Intel TIGPT1U - Carrier Grade Server Specification

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Intel® Carrier Grade Server TIGPT1U

Technical Product Specification

Revision 1.0

June, 2004

Enterprise Platforms & Services Division

Intel Secret

Revision History Intel® Carrier Grade Server TIGPT1U TPS

Revision History

Date

June 2004 1.0 Initial release

Revision

Number

Modifications

Disclaimers

THIS SPECIFICATION IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Intel disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.

The Intel may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document is an intermediate draft for comment only and is subject to change without notice. Readers should not design products based on this document.

C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation.

Carrier Grader Server TIGPT1U may contain design defects or errors known as errata which

C bus/protocol or the SMBus

*Other brands and names are the property of their respective owners.

Intel Secret Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Table of Contents

Table of Contents

1. Introduction ............................................................................................................. 1

1.1 Document Structure and Outline.................................................................. 1

2. System Overview .................................................................................................... 2

2.1 System Features.......................................................................................... 2

2.2 Chapter Structure and Outline...................................................................... 3

2.3 Introduction .................................................................................................. 4

2.4 External Chassis Features........................................................................... 8

2.4.1 Front View of Chassis .................................................................................. 8

2.4.2 Front Panel .................................................................................................. 8

2.4.3 Chassis Peripheral Bay and Hot-Plug SCSI Hard Drive Bays.................... 10

2.4.4 Rear View of Chassis................................................................................. 13

2.5 Internal Chassis Features .......................................................................... 15

2.5.1 Telecom SE7210TP1-E Server Baseboard ............................................... 15

2.5.2 Full-Height, Full-Length PCI Adapter Subsystem....................................... 16

2.5.3 Power Subsystem ...................................................................................... 17

2.5.4 Cooling Subsystem .................................................................................... 18

2.6 Server Management .................................................................................. 19

2.6.1 Baseboard Management Controller ........................................................... 19

2.7 Specifications............................................................................................. 20

2.7.1 Environmental Specifications ..................................................................... 20

2.7.2 Physical Specifications .............................................................................. 21

3. Cables and Connectors ........................................................................................ 22

3.1 Chapter Structure and Outline ................................................................... 22

3.2 Interconnect Block Diagram....................................................................... 23

3.3 Cable and Interconnect Descriptions ......................................................... 24

3.4 Exteranly-Accessible Interconnects ........................................................... 25

3.4.1 Keyboard and Mouse Ports........................................................................ 25

3.4.2 Serial Ports ................................................................................................ 26

3.4.3 Video Port .................................................................................................. 27

3.4.4 Universal Serial Bus (USB) Interface ......................................................... 27

3.4.5 Ethernet Connector.................................................................................... 28

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Table of Contents Intel® Carrier Grade Server TIGPT1U TPS

3.4.6 Telco Alarms Connector............................................................................. 28

3.4.7 AC Power Input for AC-Input Power Supply............................................... 28

3.4.8 DC Power Input for DC-Input Power Supply .............................................. 29

4. Extended Front Panel System Board .................................................................. 30

4.1 Features..................................................................................................... 30

4.2 Chapter Structure and Outline ................................................................... 30

4.3 Introduction ................................................................................................ 31

4.4 Functional Description of Front Panel Switches, LEDs, and Relays .......... 31

4.4.1 Front Panel Switches ................................................................................. 31

4.4.2 Front Panel LEDs....................................................................................... 32

4.4.3 System Status LEDs .................................................................................. 32

4.4.4 System Fault LEDs .................................................................................... 33

4.4.5 LED Color Selection................................................................................... 33

4.4.6 System Fault Relays .................................................................................. 34

4.4.7 Server Management Bus (SMBus) Interface.............................................. 34

4.5 Connector Information ............................................................................... 35

4.5.1 Extended Front Panel Board USB Connector Pinout................................. 37

4.5.2 Extended Front Panel Board uProcessor Power Connector Pinout ........... 37

4.5.3 Extended Front Panel Board Front Panel Connector Pinout...................... 38

4.5.4 Extended Front Panel Board Midplane Connector Pinout.......................... 38

4.5.5 Extended Front Panel Board Power/Signal Connector Pinout ................... 39

4.5.6 Extended Front Panel Board Alarm/COM2 Connector Pinout.................... 39

4.5.7 Extended Front Panel Board Baseboard Power Connector Pinout............ 40

4.5.8 Extended Front Panel Board COM2/USB Connector Pinout ..................... 40

4.5.9 Extended Front Panel Board NEBS Riser Power Connector Pinout .......... 40

4.6 SCSI Power Subsystem............................................................................. 41

4.6.1 SCSI Drive Power Control.......................................................................... 41

4.6.2 Internal SCSI Drive Power Switching......................................................... 41

4.6.3 SCSI Drive Status LEDs ............................................................................ 42

4.7 Specifications............................................................................................. 43

4.7.1 Electrical Specifications ............................................................................. 43

5. Power Interconnect System Board...................................................................... 44

5.1 Features..................................................................................................... 44

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Intel® Carrier Grade Server TIGPT1U TPS Table of Contents

5.2 Chapter Structure and Outline ................................................................... 44

5.3 Functional Description of Power Interconnect System Board .................... 44

5.4 Connector Description ............................................................................... 45

5.4.1 Connector Mating to the Power Supply Pinout........................................... 45

5.4.2 Connector Mating to the Extended Front Panel System Board Pinout....... 46

6. NEBS 3.3 V Riser Board........................................................................................ 47

6.1 Chapter Structure and Outline ................................................................... 47

6.2 Functional Description ............................................................................... 47

6.3 Connector Interface ................................................................................... 48

6.3.1 NEBS Riser Power Connector Pinout ........................................................ 50

6.4 Electrical Specification ............................................................................... 51

7. Midplane Board ..................................................................................................... 52

7.1 Chapter Structure and Outline ................................................................... 52

7.2 Introduction ................................................................................................ 52

7.3 Functional Description ............................................................................... 53

7.3.1 Midplane System Board SCSI Subsystem Block Diagram......................... 53

7.3.2 SCSI Bus ................................................................................................... 54

7.3.3 SCA2 Connector Interlocks........................................................................ 54

7.3.4 Signal Descriptions .................................................................................... 54

7.4 Connector Interface ................................................................................... 56

7.4.1 Midplane Power/Signal Connector Pinout.................................................. 57

7.4.2 Midplane SCSl Connector Pinout and SCSI ID settings ............................ 57

7.5 Specifications............................................................................................. 57

7.5.1 Electrical Specifications ............................................................................. 57

8. DC Power Subsystem ........................................................................................... 58

8.1 Features..................................................................................................... 58

8.2 Chapter Structure and Outline ................................................................... 58

8.3 Introduction ................................................................................................ 58

8.4 Mechanical Interface.................................................................................. 59

8.4.1 Power Supply Cage Mechanical Outline.................................................... 59

8.4.2 DC Input Terminal Block Connector........................................................... 60

8.4.3 DC Output Connector ................................................................................ 61

8.4.4 Power Supply Module LED Indicators........................................................ 63

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Table of Contents Intel® Carrier Grade Server TIGPT1U TPS

8.5 Electrical Requirements ............................................................................. 63

8.5.1 DC Input Voltage Specification .................................................................. 63

8.5.2 Dual DC Input ............................................................................................ 63

8.5.3 DC Output Current Specifications .............................................................. 64

9. AC Power Subsystem ........................................................................................... 65

9.1 Features..................................................................................................... 65

9.2 Chapter Structure and Outline ................................................................... 65

9.3 Introduction ................................................................................................ 65

9.4 Mechanical Interface.................................................................................. 66

9.4.1 Power Supply Cage Mechanical Outline.................................................... 66

9.4.2 AC Input Connector ................................................................................... 66

9.4.3 DC Output Connector ................................................................................ 67

9.4.4 Power Supply Module LED Indicators........................................................ 69

9.5 Electrical Requirements ............................................................................. 69

9.5.1 AC Input Voltage Specification................................................................... 69

10. Regulatory Specifications .................................................................................... 70

10.1 Safety Compliance..................................................................................... 70

10.2 Electromagnetic Compatibility.................................................................... 70

10.3 CE Mark..................................................................................................... 70

10.4 NEBS Compliance (DC Input Only) ........................................................... 71

10.5 ETSI Standards Compliance (DC Input Only)............................................ 71

Appendix A: Glossary................................................................................................. 72

Appendix B: Reference Documents .......................................................................... 76

Intel Secret Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS List of Figures

List of Figures

Figure 2-1. Intel® Carrier Grade Server TIGPT1U ........................................................... 4

Figure 2-2. Intel® Carrier Grade Server TIGPT1U (shown with top covers and bezel

removed) ................................................................................................................... 5

Figure 2-3. Intel® Carrier Grade Server TIGPT1U Block Diagram ................................... 7

Figure 2-4. Front View of System.................................................................................... 8

Figure 2-5. Front View of System (shown with bezel removed) ...................................... 8

Figure 2-6. Front Panel Details ....................................................................................... 9

Figure 2-7. Chassis Peripheral Bay and Hard Drive Bays............................................. 10

Figure 2-8. Peripheral Drive Bay ................................................................................... 11

Figure 2-9. Drive Carrier Assembly ............................................................................... 11

Figure 2-10. SCSI Hard Drive Bays .............................................................................. 12

Figure 2-11. SCSI Hard Drive Carrier............................................................................ 13

Figure 2-12. Rear View of System ................................................................................ 13

Figure 2-13. Telecom SE7210TP1-E Server Baseboard Block Diagram ...................... 15

Figure 2-14. Full-Height, Full-Length PCI Adapter Subsystem...................................... 17

Figure 2-15. System Fan Assemblies............................................................................ 18

Figure 3-1. Intel® Carrier Grade Server TIGPT1U Interconnect Block Diagram ........... 23

Figure 3-2. Telco Alarms Connector.............................................................................. 28

Figure 3-3. AC Power Input Connector ......................................................................... 29

Figure 3-4. DC Power Input Connector ......................................................................... 29

Figure 3-5. Terminal Lug ............................................................................................... 29

Figure 4-1. Extended Front Panel Board....................................................................... 31

Figure 4-2. Extended Front Panel Board Connector Location....................................... 36

Figure 5-1. Physical Layout of Power Interconnect System Board................................ 44

Figure 6-1. Physical Layout of NEBS 3.3 V Riser Board ............................................... 48

Figure 7-1. Midplane System Board SCSI Subsystem Block Diagram.......................... 53

Figure 7-2. Extended Front Panel Board Connector Location....................................... 56

Figure 8-1. Power Subsystem Enclosure Outline Drawing............................................ 59

Figure 8-2. DC Input Terminal Block ............................................................................. 60

Figure 8-3. Terminal Lug ............................................................................................... 60

Figure 8-4. Terminal Block Polarity .............................................................................. 60

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List of Figures Intel® Carrier Grade Server TIGPT1U TPS

Figure 8-5. Edge Finger Layout..................................................................................... 62

Figure 9-1. Power Subsystem Enclosure Outline Drawing............................................ 66

Figure 9-2. Edge Finger Layout..................................................................................... 68

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Intel® Carrier Grade Server TIGPT1U TPS List of Tables

List of Tables

Table 2-1. Intel® Carrier Grade Server TIGPT1U Feature List......................................... 2

Table 2-2. Front Panel Features ..................................................................................... 9

Table 2-3. System Features - Rear ............................................................................... 14

Table 2-4. Environmental Specifications Summary....................................................... 20

Table 2-5. Dimensions and Weight ............................................................................... 21

Table 3-1. System Interconnect Descriptions................................................................ 24

Table 3-2. Keyboard/Mouse PS/2 Connector Pin Out (J9A1) ....................................... 25

Table 3-3. COM1: 9-pin Serial A Port Pin Out (J8A1) ................................................... 26

Table 3-4. COM2: Serial Port Connector on Front Panel .............................................. 26

Table 3-5. Video Connector .......................................................................................... 27

Table 3-6. Single USB Connector ................................................................................. 27

Table 3-7. Magjack Connector (RJ45, 10/100/1000) Pin Out (J5A1, J6A2) .................. 28

Table 3-8. Telco Alarms Connector............................................................................... 28

Table 4-1. Front Panel Switch Description .................................................................... 31

Table 4-2. LED Specifications ....................................................................................... 32

Table 4-3. Front Panel System Status LED Description................................................ 32

Table 4-4. Front Panel System Fault LED Description.................................................. 33

Table 4-5. LED Color Selection..................................................................................... 33

Table 4-6. Alarms SMBus I/O Mapping......................................................................... 34

Table 4-7. SCSI SMBus I/O Mapping............................................................................ 35

Table 4-8. Extended Front Panel System Board Connector Information....................... 35

Table 4-9. Connector Housing Information.................................................................... 36

Table 4-10. 8-pin (1 x 8) USB J2G1 Connector............................................................. 37

Table 4-11. 8-pin (2 x 4) uP Power J5A1 Connector..................................................... 37

Table 4-12. 34-pin (2 x 17) Front Panel J8A1 Connector .............................................. 38

Table 4-13. 12-pin (2 x 6) Mid-Plane J1E1 Connector .................................................. 38

Table 4-14. 10-pin (2 x 5) Power/Signal J9A1 Connector ............................................. 39

Table 4-15. 24-pin (2 x 12) Alarm/COM2 J9B1 Connector............................................ 39

Table 4-16. 20-pin (2 x 10) Baseboard Power J10A1 Connector .................................. 40

Table 4-17. 16-pin Baseboard Power J1A1 Connector ................................................. 40

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List of Tables Intel® Carrier Grade Server TIGPT1U TPS

Table 4-18. 3-pin (1 x 3) NEBS Riser Power J3E1 Connector ...................................... 40

Table 4-19. LED Activity Definitions .............................................................................. 42

Table 4-20. Maximum Power Requirements (mA) ........................................................ 43

Table 5-1. 2 x 31 Connector Pinout to 250 Watt Power Supply .................................... 45

Table 5-2. 2 x 31 Connector Pinout to Extended Front Panel System Board................ 46

Table 6-1. Riser Card Slot Pin-out Common Signals .................................................... 48

Table 6-2. PCI Card Connector Signals ........................................................................ 49

Table 6-3. 3-pin (1 x 3) NEBS Riser Power J1A1 Connector ........................................ 50

Table 7-1. LVD SCSI Bus Signals – J2L1, J4A1, J8A1................................................. 55

Table 7-2. Extended Front Panel System Board Connector Information....................... 56

Table 7-3. Connector Housing Information.................................................................... 57

Table 7-4. 12-pin (2 x 6) Midplane J9L1 Connector ...................................................... 57

Table 7-5. MPB Power Requirements ........................................................................... 57

Table 8-1. 250 Watt DC-input Power Supply DC Output Ratings.................................. 58

Table 8-2. Edge Finger Pinout ...................................................................................... 61

Table 8-3. LED Indicators.............................................................................................. 63

Table 8-4. DC Input Rating............................................................................................ 63

Table 8-5. 250 W Load Ratings..................................................................................... 64

Table 9-1. 250 Watt AC-input Power Supply DC Output Ratings.................................. 65

Table 9-2. Edge Finger Pinout ...................................................................................... 67

Table 9-3. LED Indicators.............................................................................................. 69

Table 9-4. AC Input Rating............................................................................................ 69

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Intel® Carrier Grade Server TIGPT1U TPS Introduction

1. Introduction

This document provides an overview of the Intel Industrial Grade Prescott 1U (1.75”) high) and includes information on chassis hardware, cables, connectors, SE7210TP1-E System Baseboard, system boards, power subsystem, and regulatory requirements.

Carrier Grade Server TIGPT1U (Telecom

1.1 Document Structure and Outline

This document is organized into the following chapters:

Chapter 1: Introduction

Provides an overview of this document.

Chapter 2: System Overview

Provides an overview of the Intel

Chapter 3: Cables and Connectors

Describes the cables and connectors used to interconnect the system board set and the Intel

Chapter 4: Extended Front Panel System Board

Describes the specifications of the extended front panel system board.

Chapter 5: Power Interconnect System Board

Describes the specifications of the power interconnect system board.

TIGPT1U components.

TIGPT1U server chassis hardware.

Chapter 6: NEBS 3.3 V Riser Board

Describes the specifications of the Network Equipment Building Specifications (NEBS) 3.3 V riser board.

Chapter 7: Midplane Board

Describes the specifications of the midplane board.

Chapter 8: DC Power Subsystem

Describes the specifications of the DC power subsystem.

Chapter 9: AC Power Subsystem

Describes the specifications of the AC power subsystem.

Chapter 10: Regulatory Specifications

Describes system compliance to regulatory specifications.

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System Overview Intel® Carrier Grade Server TIGPT1U TPS

2. System Overview

This chapter describes the features of the Intel® Carrier Grade Server TIGPT1U chassis.

2.1 System Features

Table 2-1 provides a list and brief description of the features of the Intel® Carrier Grade Server TIGPT1U.

Table 2-1. Intel® Carrier Grade Server TIGPT1U Feature List

Feature Description

Compact, high-density system Rack-mount server with a height of 1 U (1.75 inches) and a depth of 20.0 inches

Configuration flexibility Single processor capability in low profile and cost/value effective packaging

Stand-alone system Intel® Pentium® 4 Processor with hyper-threading technology at 3.0 GHz

Serviceability Front access to hot swap disk drives

Availability Integrated HostRAID™ ready to provide RAID 1 capability using two hot-swap

Small Computer System Interface (SCSI) disk drives.

Manageability Remote management

Emergency management port (Serial and LAN)

IPMI 1.5 compliant

Remote diagnostics support

System-level scalability 4 GB DDR333/DDR400 unbuffered 184-pin DDR SDRAM DIMM memory

support

Single Intel

1 Full Height Full Length 3.3 V/Universal 64-bit x 66 MHz PCI-X Slots

2 internal hot-swap SCSI disk drives (SCA support)

1 Low Profile CD-ROM

Front panel Power switch

Reset switch

NMI switch

ID switch

Main power LED

HDD activity LED

NIC activity LED

ID LED

Pentium® 4 Processor support

Hard Drive 0 Fault LED

Hard Drive 1 Fault LED

Telco power alarm fault LED/Relay

Telco critical alarm fault LED/Relay

Telco major alarm fault LED/Relay

Telco minor alarm fault LED/Relay

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Intel® Carrier Grade Server TIGPT1U TPS System Overview

2.2 Chapter Structure and Outline

This chapter is organized into the following sections. The content of each section is summarized as follows.

Section 2.3: Introduction

Provides an overview and block diagram of the Intel

Carrier Grade

Server TIGPT1U.

Section 2.4: External Chassis Features

Describes features of the Intel

Carrier Grade Server TIGPT1U chassis in

detail (buttons, switches, bezel, etc.).

Section 2.5: Internal Chassis Features

Provides an overview of the components of the Intel

Carrier Grade

Server TIGPT1U.

Section 2.6: Server Management

Describes the server management features of the Intel

Carrier Grade

Server TIGPT1U.

Section 2.7: Specifications

Summarizes the environmental and physical specifications of the Intel

Carrier Grade Server TIGPT1U.

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System Overview Intel® Carrier Grade Server TIGPT1U TPS

2.3 Introduction

The Intel® TIGPT1U is a compact, high-density, rack mount server system with support for one

Intel

Pentium® 4 Processor and 4 GB DDR266/DDR333/DDR400 unbuffered 184-pin DDR SDRAM DIMM memory. The Intel drives and remote management. The scalable architecture of the Intel variety of operating systems (OS).

Figure 2-1 shows an isometric view of the system.

Figure 2-2 shows the system with the top covers and the front bezel removed.

TIGPT1U high availability features include hot swap disk

TIGPT1U supports a

Figure 2-1. Intel® Carrier Grade Server TIGPT1U

The Intel® TIGPT1U uses the SE7210TP1-E system baseboard, which contains connectors for installing one Intel DIMM slots and supports up to 4 GB error checking and correcting (ECC) unbuffered Synchronous Dynamic Random Access Memory (SDRAM). The SE7210TP1-E system baseboard also contains 1 PCI slots (implemented via riser cards), input/output (I/O) ports and various controllers.

Pentium® 4 Processor utilizing the uPGA478 socket. The baseboard has 4

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Intel® Carrier Grade Server TIGPT1U TPS System Overview

Figure 2-2. Intel

Carrier Grade Server TIGPT1U (shown with top covers and bezel removed)

A. Power Supply H. SCSI Hard Disk Drive Bays B. PCI card bracket (full-length) I. Peripheral Bay (CDROM or DVD) C. Riser card assembly (full-length) J. Front Panel LEDs and Switches D. SE7210TP1-E Server Baseboard K. COM2/USB Front Panel Connector E. System Memory L. Extended Front Panel System Board F. System Fans M. Power Interconnect System Board G. Midplane System Board

The SE7210TP1-E system baseboard is mounted horizontally toward the rear of the chassis behind the system fan array.

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System Overview Intel® Carrier Grade Server TIGPT1U TPS

Up to two 1.0” Ultra-320 SCSI technology hard drives can be mounted in the hot swap drive bays,

which are located in the bottom front of the chassis. The front bezel needs to be removed to

access the hot swap drive trays when installing or removing them from the hot

swap drive bays.

Figure 2-2 shows the location of the two hot swap drive bays.

A slim-line CD-ROM drive can also be mounted in the system above the two hot swap drive bays.

System boards include the extended front panel board, the power supply interface board, and the SCSI hot swap backplane board. The extended front panel board is located in the front left of the chassis, the power supply interface board is located in the mid left of the chassis, and the SCSI hot swap backplane is located in the mid center and right of the chassis.

The 250 W power supply is mounted at the left-rear of the chassis. Two power supply options are available, one with AC-input and one with DC-input.

The system contains a fan array consisting of two 40 x 48 mm fans and one 40 x 28 mm fans to cool the SE7210TP1-E System Baseboard and other components. The fans are installed directly behind the drive bays and are located in front of the baseboard. Another 40 x 28 mm fan is located to the left of the hot swap drive bays and is used to cool the PCI adapter and left side of the SE7210TP1-E System Baseboard. Individual fan connectors are located on the system baseboard.

The front bezel can be customized to meet OEM industrial design requirements. The bezel design allows adequate airflow to cool the system components. The front bezel is removed to access the drive bay.

Figure 2-3 shows a block diagram of the Intel

Carrier Grade Server TIGPT1U with

interconnections.

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Intel® Carrier Grade Server TIGPT1U TPS System Overview

250 W Power Supply

(AC-input or DC-input)

Interconnect Board

LAN 2 82541 Gb E/N

VGA RAGE XL

87431

mBMC

PCI Slot 1

Full Height/Full Length

5V Riser PCI-X 64/66

PCI Riser Slot 1

PCI-X 64/66

SCSI AIC-7901

USB1/2/3 (Back)

USB 4 (Front)

ATA/100 (IDE)

Front Panel

Front Panel Baseboard Pwr

Pwr

PCI-X 64/66

6300ESB

I/O Controller

Fan 6

Winbond

W83627HF-AW

Super I/O

PCI

LPC Bus

64/33

Hub

Baseboard Pwr

COM2/Alarm

82802

8 Mb

F/W Hub

Flash BIOS

CSA

HUB Interface

Fan 1

Alarm Out

PS2 Keyboard/Mouse

COM1 (Back)

COM2 (Front)

LAN1 82547 Gb E/N

Pentium 4 uPGA478

Front Side Bus

800 MB/s

827210 Memory

Controller Hub

Baseboard

CPU VRM

Channel A

Channel B

DDR 400/333

System

Pwr

2GB DDR SDRAM

Fan 5Fan 4Fan 3 Fan 2

USB 4

Extended Front Panel Board

Push Buttons

U S B

Pwr|Rst

O M 2

NMI|ID

System Fault LEDs

Crt|Mjr|Mnr|Pwr

Activity/ID LEDs

ID|NIC|On|Disk1|Disk0

Figure 2-3. Intel® Carrier Grade Server TIGPT1U Block Diagram

Pwr

CDROM/DVD Drive Bay

Note: The CDROM/DVD

Drive is positioned above

SCSI Hard Drive Bay 1

Sig 2x20, Pwr 1x2

1/2"

CDROM/DVD

SCSI LVD Term

MidPlane Board

MP Pwr

SCSI SCA Conn 80pin

SCSI Hard Drive 1 Hot Plug Drive Assembly Consists of:

1. SCA SCSI Disk Drive

2. Drive Carrier

SCSI SCA Conn 80pin

SCSI Hard Drive 1 Hot Plug Drive Assembly Consists of:

1. SCA SCSI Disk Drive

2. Drive Carrier

SCSI Hard Drive Bay 1 SCSI Hard Drive Bay 0

SCSI BB Conn

68 Pin Wide U-320 SCSI Bus

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System Overview Intel® Carrier Grade Server TIGPT1U TPS

2.4 External Chassis Features

2.4.1 Front View of Chassis

Figure 2-4 shows the front view of the system. Figure 2-5 shows the front view of the system with the front bezel removed. Removing the front bezel provides access to the two hot-plug hard drive bays.

Both areas are described in detail in the following sections.

RJ45 COM2 and USB Connectors

RJ45 COM2 and Dual USB Connectors

Front Panel Control Switches and Status LEDs

Figure 2-4. Front View of System

Front Panel Control Switches and Status LEDs

Peripheral Bay

Drive Bay 2 Drive Bay 1

Peripheral Bay

Drive Bay 2 Drive Bay 1

Figure 2-5. Front View of System (shown with bezel removed)

Drive Bay 2 Handle Drive Bay 1 Handle

2.4.2 Front Panel

The front panel features are shown in Figure 2-6 and described in Table 2-2. All front panel control switches and status LEDs are contained on the front panel system board. Please refer to Section 5 Front Panel System Board for a detailed description of the control switches and status LEDs contained on the Front Panel.

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Intel® Carrier Grade Server TIGPT1U TPS System Overview

ABCDEF

GHIJKLM

Figure 2-6. Front Panel Details

Table 2-2. Front Panel Features

Item Feature Description

Front Panel Switches

A Power switch Toggles the system power

B Reset switch Resets the system

L ID switch Toggles system ID LED

M NMI switch Assert NMI to baseboard

Front Panel Alarm LEDs and Relays

C Critical (amber) When continuously lit, indicates the presence of a Critical System

Fault. A critical system fault is an error or event that is detected by the system with a fatal impact to the system. In this case, the system cannot continue to operate. An example could be the loss of a large section of memory, or other corruption, that renders the system not operational. The front panel critical alarm relay will be engaged.

D Major (amber) When continuously lit, indicates the presence of a Major System Fault.

A major system fault is an error or event that is detected by the system that has discernable impact to system operation. In this case, the system can continue to operate but in a “degraded” fashion (reduced performance or loss of non-fatal feature reduction). An example could be the loss of one of two mirrored disks. The front panel major alarm relay will be engaged.

E Minor (amber) When continuously lit, indicates the presence of a Minor System Fault.

A minor system fault is an error or event that is detected by the system but has little impact to actual system operation. An example would be a correctable ECC error. The front panel minor alarm relay will be engaged.

F Power (amber) When continuously lit, indicates the presence of a Power System

Fault. The front panel power alarm relay will be engaged.

Front Panel Status LEDs

G Disk 1 Activity/Fault LED

(green/amber)

H Disk 2 Activity/Fault LED

(green/amber)

I Main power LED (green) When continuously lit, indicates the presence of DC power in the

Indicates disk 1 SCSI hard drive activity when green, or a disk 1 SCSI hard drive fault when amber

Indicates disk 2 SCSI hard drive activity when green, or a disk 2 SCSI hard drive fault when amber

server. The LED goes out when the power is turned off or the power source is disrupted.

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System Overview Intel® Carrier Grade Server TIGPT1U TPS

Item Feature Description

J NIC0/NIC1 activity LED (green) Indicates activity on either NIC0 or NIC1

K System ID LED (white) Continuously lit when activated by (1) software command to extended

front panel board or (2) by the front panel ID switch

2.4.3 Chassis Peripheral Bay and Hot-Plug SCSI Hard Drive Bays

The Intel® TIGPT1U server chassis provides two hot-swap SCSI hard drive bays at the front of the chassis, along with a peripheral bay that supports either a fixed CDROM Drive (read-only or read/write, or a fixed DVD Drive. Both hot-plug SCSI hard drive bays may be populated with a

3.5” SCSI Single Connector Attachment (SCA) hard disk drive mounted in a SCSI drive carrier.

The SCSI ID for each hard drive position is hardwired on the midplane board, so the use of jumper(s) to select a unique SCSI ID is not necessary. Hard disk drive position 1 is hardwired to SCSI ID 0 on the SCSI bus and hard disk drive position 2 is hardwired to SCSI ID 1 on the SCSI bus.

A. Hard drive bay 1 (SCSI ID 0) B. Hard drive bay 2 (SCSI ID 1) C. Peripheral drive bay D. CD-ROM drive or DVD drive mounted in a peripheral carrier E. Hard disk drive module

Figure 2-7. Chassis Peripheral Bay and Hard Drive Bays

2.4.3.1 Peripheral Drive Bay

The peripheral bay supports either a CDROM drive or a DVD drive.

The peripheral drive carrier assembly can be configured with either a 0.5” (12.7 mm) slim-line CD-ROM or DVD drive. The install sequence is (1) slide the peripheral drive carrier into the peripheral drive bay, (2) tighten the thumb screw to secure the peripheral drive carrier to the chassis, and (3) connect the IDE and power cables to the interconnect board.

Note: A floppy drive cannot be installed in the system using the peripheral drive bay. If a floppy drive is needed, it will be necessary to use a Universal Serial Bus (USB) floppy and connect it to

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the USB connection on the front of the unit or one of the USB connections on the back of the unit.

Figure 2-8. Peripheral Drive Bay

2.4.3.1.1 Peripheral Drive Carrier Assembly

The CDROM drive or DVD drive is installed in the drive carrier assembly before installing it into the system. An exploded view of the drive carrier assembly is shown in the following figure:

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A. Drive carrier metal housing B. CD-ROM or DVD Drive C. Interface Board D. Two screws to connect interface board to CD-ROM or DVD drive

Figure 2-9. Drive Carrier Assembly

System Overview Intel® Carrier Grade Server TIGPT1U TPS

Prior to installing the drive in the system, (1) the interface board is connected to the back of the drive and secured with two 8mm screws. The drive is then installed in the drive carrier metal housing by holding the left side of the drive carrier in the left hand, and with the right hand installing the right side of the drive into the right side of the drive carrier, (2) making sure to line up the two holes in the right side of the drive with the two mounting tabs on the right side of the drive carrier. Then, while flexing the left side of the drive carrier slightly down, (3) insert the left side of the drive into the drive carrier, making sure to line up the two holes on the left side of the drive with the two mounting tabs on the left side of the drive carrier. If this is done correctly, the drive carrier will be flush with the bottom and sides of the drive, and all four mounting tabs will be installed in the mounting holes on the drive. Observe that the right side mounting tabs are correctly inserted into the right side mounting holes on the drive by looking at the right bottom of the drive carrier assembly. Observe that the left side mounting tabs are correctly inserted into the left side mounting holes on the drive by looking at the top left of the drive carrier assembly.

2.4.3.2 Hard Drive Bays

There are two hot-plug SCSI SCA hard drive bays in the system (see (1) and (2) in the drawing below). Each hard drive bay supports a U320 SCA (single connector attach) SCSI disk drive mounted in a drive tray. The drive tray is installed into the front of the chassis in the hard drive bay, and then secured in place by latching the handle on the drive tray. Ultra 320 SCSI technology (SCA interconnect) or slower hard disk drives can be installed in the hard drive bays. The hard drive bays are designed to accept 15,000 rotations per minute (RPM) hard drives (and below) that consume up to 18 W of power.

Figure 2-10. SCSI Hard Drive Bays

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2.4.3.2.1 Hard Drive Tray

Each hard drive used in the system must be mounted to a drive tray using four screws inserted into the sides of the drive as shown in the figure.

Figure 2-11. SCSI Hard Drive Carrier

2.4.4 Rear View of Chassis

Figure 2-12. Rear View of System

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Table 2-3. System Features - Rear

Item Description

A USB 1, USB 2, USB 3

B PS/2 Mouse

C DB15 Alarm Connector

D PCI card bracket (full-height)

E Power supply

F AC power input ( AC input power supply shown)

G Ground Studs (used with system with DC input power supply)

H RJ45 Network Interface Card (NIC) 2 connector

I RJ45 NIC 1 connector

J Video connector

K DB9 serial 2 port

L PS/2 Keyboard connector

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2.5 Internal Chassis Features

2.5.1 Telecom SE7210TP1-E Server Baseboard

The telecom SE7210TP1-E Server Baseboard is a monolithic printed circuit board that can accept one Intel The figure below shows the functional blocks of the telecom SE7210TP1-E Server Baseboard and the plug-in modules that it supports.

Pentium® 4 Processor with hyper-threading technology in a µPGA478 socket.

Figure 2-13. Telecom SE7210TP1-E Server Baseboard Block Diagram

o Support for an Intel® Pentium® 4 Processor with hyper-threading technology in a µPGA478

socket (3.0 GHz frequency, 1 M L2 cache, 800 MHz Front Side Bus (FSB), 90 nm manufacturing technology).

o 400/533/800 MHz FSB o Intel

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E7210 chipset

• Intel

827210 Memory Controller Hub (MCH)

6300ESB I/O Controller Hub (Hance Rapids)

82802AC 8 Megabit Firmware Hub (FWH)

System Overview Intel® Carrier Grade Server TIGPT1U TPS

o Support for single-sided or double-sided dual inline memory module (DIMM) double-data

rate (DDR) memory providing up to 4 GB of system memory with four 184-pin DIMM sockets

• PC3200 (400 MHz): to run 400 MHz memory at full speed requires an Intel

Pentium® 4

Processor with 800 MHz system bus frequency.

• PC2700 (333 MHz): to run 333 MHz memory at full speed requires an Intel

Pentium® 4

Processor with 533 MHz system bus frequency.

o Intel

Note: PC2700 (333 MHZ) memory will run at 320 MHz frequency when using an Intel Pentium

82547EI Platform LAN Connect (PLC) device for 10/100/1000 Mbps Ethernet LAN

4 Processor with 800 MHz system bus frequency.

connectivity

o Intel

82541EI device for 10/100/1000 Mbps Ethernet LAN connectivity

o Two independent PCI buses (one 32-bit, 33 MHz, 5 V; one 64-bit, 66 MHz, 3.3 V) with one

PCI connectors and two embedded devices:

• One PCI-X 64-bit 66-MHz PCI slots

• Integrated 2D/3D graphics controller: ATI* Rage* XL Video Controller with 8 MB of

SDRAM

• Single channel, Ultra 320 Small Computer System Interface (SCSI) Controller: Adaptec* 7901*

o Low Pin Count (LPC) bus segment with one embedded device: Winbond* W83627HF-AW

LPC Bus I/O controller chip providing all PC-compatible I/O (floppy, serial, keyboard and mouse)

o Three external USB 2.0 ports on the back panel with an additional internal header, which

provides support for one additional USB port for front panel support (four total USB 2.0 ports)

o One serial port and one serial port header o Two Integrated Drive Electronics (IDE) interfaces with Ultra 33, 66 and 100 Direct Memory

Access (DMA) mode

o Support for up to six system fans o Server System Infrastructure (SSI)-compliant connectors for SSI interface support: front

panel, power connector

o Intel

Server Management 5.8 support via the National Semiconductor* PC87431M*

Baseboard Management Controller (mBMC)

2.5.2 Full-Height, Full-Length PCI Adapter Subsystem

A one-slot PCI adapter assembly that supports one full-height/full-length PCI adapter is installed in the PCI riser slot located at the left side of the SE7210TP1-E System Baseboard. This PCI adapter assembly is configured and installed as shown in the following figure. After the PCI adapter assembly is removed from the system, it is configured with one PCI adapter by plugging the PCI adapter into the PCI connector on the riser card (either a 3.3 V riser card or a 5 V riser card) that is part of the PCI adapter assembly. The PCI adapter assembly is then installed into the system by plugging the riser card into the riser card connector on the SE7210TP1-E System Baseboard. Finally, the thumb screw located on the back of the server is secured to the PCI adapter assembly. Refer to the SE7210TP1-E System Baseboard specification for electrical characteristics for this PCI adapter subsystem. The maximum power supported for PCI adapters installed in the PCI Adapter subsystem is 25 watts.

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1-slot PCI Adapter Assembly - supports one full-height/full-length PCI adapter or one full-height/half-length PCI adapters

Install PCI Adapter Assembly in System

Secure PCI Adapter Assembly to chassis

with captive fastener on back of chassis

Install PCI Adapter in

PCI Adapter Assembly

Figure 2-14. Full-Height, Full-Length PCI Adapter Subsystem

2.5.3 Power Subsystem

The Intel® Carrier Grade Server TIGPT1U can be configured with either a 250 watt AC-input power supply or a 250 watt DC-input power supply.

The 250 watt power supply interconnects to the power interface board with a board-edge connector. A board edge connector is also used by the extended front panel board to interconnect to the power interface board. Power is then is carried to the 5 V riser board, the midplane board, and the system baseboard via discrete cables connected to individual connectors on the extended front panel board. The 250 watt power supply is capable of handling the worst-case power requirements for a fully configured Intel TIGPT1U. This includes one Intel

Pentium® 4 Processor, 4 GB of memory, two hard drives at 18 W per drive (typical worst case 3.5-inch by 1.0-inch, 15 k RPM drive), and one 25 watt PCI adapter.

Carrier Grade Server

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2.5.4 Cooling Subsystem

2.5.4.1 Description

All system components except the power supply are cooled by two system fan assemblies. One fan assembly is mounted near the middle of the chassis, and a second fan assembly is mounted to the left of hard drive bay 1. These fan assemblies are shown in Figure 2-15.

Figure 2-15. System Fan Assemblies

One fan assembly contains two 40 x 48 mm counter rotating fans that are used to cool the Intel® Pentium

4 Processor, and also contains one 40 x 28 mm fan that is used to cool the DDR SDRAM memory and the processor Voltage Regulator Module (VRM) circuitry. Air to these fans comes in the front of the chassis and passes over the SCSI disk drives helping to provide cooling to the SCSI disk drives.

The other fan assembly contains one 40 x 28 mm fan that is used to cool the PCI adapter (maximum of 25 watts) as well as the components on the SE7210TP1-E System Baseboard that are located to the left of the Intel

Pentium® 4 Processor.

Each fan provides tachometer signal output to the SE7210TP1-E System Baseboard to indicate a fan failure.

2.5.4.2 Ambient Temperature Control

The SE7210TP1-E System Baseboard contains a pulse-width-modulation (PWM) circuit, which cycles the 12 Vdc fan voltage to provide quiet operation when system ambient temperature is low and there are no fan failures. Under normal room ambient conditions (less than 24° C) the fan power circuit supplies an effective fan voltage of 6.0 Vdc. When the room ambient temperature exceeds 24° C, the fan control circuit provides increased voltage levels to increase the speed of the fan. There are sixteen fan speed increments between 24° C and 40° C. At 40° C the fans operate at their maximum speed to provide maximum airflow.

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2.5.4.3 Cooling Summary

The four-fan cooling subsystem is sized to provide cooling for:

• One Intel

Pentium® 4 Processor (3.0 GHz frequency, 1 M L2 cache, 800 MHz FSB,

90nm manufacturing technology)

• The SE7210TP1-E System Baseboard components

• 4 GB of SDRAM memory

• Two 15,000 RPM hard drives at a maximum of 18 watts per drive

• 1 PCI card at a maximum of 25 watts

The cooling subsystem is designed to meet acoustic and thermal requirements at the lower fan speed settings. At the higher fan speed settings, thermal requirements are met for the maximum ambient temperatures, but acoustic requirements are not met. The environmental specifications are summarized in 2.7.1.

2.6 Server Management

The Telco SE7210TP1-E Server Baseboard server management architecture features the National Semiconductor* PC87431M Baseboard Management Controller (mBMC), which autonomously monitors server status and provides the interface to server management control functions. This controller is responsible for controlling system power, resets, monitoring voltages, temperatures, fans, and communicating with secondary controllers on its Intelligent Platform Management Bus (IPMB).

The functions of the mBMC controller are summarized in the following section. The firmware for the National Semiconductor* PC87431M* (mBMC) is not intended to be field upgraded. Refer to the System Server Management External Architecture Specification for more details.

2.6.1 Baseboard Management Controller

The mBMC on the SE7210TP1-E System Baseboard provides server management monitoring capabilities. A flash memory is associated with the mBMC that holds the operational code, sensor data records (SDR), and system event log (SEL). There is also a serial Electrical Erasable Programmable Read Only Memory (EEPROM) that holds the mBMC configuration defaults and field replaceable unit (FRU) information. The various server management functions provided by the Bus Management Controller (BMC) are listed as follows:

• Baseboard voltage monitoring

• Fan failure detection

• Fan speed control

• Processor voltage monitoring

• Processor presence detection

• Processor internal error (IERR) monitoring

• Fault resilient booting (FRB)

• Watchdog timer

• Periodic system management interrupt (SMI) timer

• One I

• System event log (SEL) management and access

C management bus interface for communicating with SIO and ADT7463

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• Sensor data record (SDR) repository management and access

• Processor nonmaskable interrupt (NMI) monitoring

• Processor System Management Interrupt (SMI) monitoring

• Time-stamp clock

• Secure mode and video blank

• Software front panel NMI generation

2.7 Specifications

2.7.1 Environmental Specifications

The Intel® TIGPT1U has been tested to the environmental specifications as indicated in Table 2-4. All testing was performed per procedures defined in Bellcore GR-63-CORE NEBS Physical Protection, Bellcore GR-3580 NEBS Criteria Levels, Bellcore GR-1089-CORE EMC and Electrical Safety – Generic Criteria for Network Telecommunications Equipment, and the Intel Environmental Standards Handbook.

Table 2-4. Environmental Specifications Summary

Environment Specification

Temperature operating 5o C to 40o C (41o F to 104o F)

Temperature nonoperating -40o C to 70o C (-104o F to 158o F)

Altitude 0 to 1,800 m (0 to 5,905 ft)

Humidity nonoperating 95%, noncondensing at temperatures of 23o C (73o F) to 40o C (104o F)

Vibration operating Swept sine survey at an acceleration amplitude of 0.1 g from 5 to 100 Hz and

back to 5 Hz at a rate of 0.1 octave/minute, 90 minutes per axis on all three axes as per Bellcore GR-63-CORE standards

Vibration nonoperating Swept sine survey at an acceleration amplitude of 0.5 g from 5 to 50 Hz at a

rate of 0.1 octaves/minute, and an acceleration amplitude of 3.0 g from 50 to 500 Hz at a rate of 0.25 octaves/minute, on all three axes as per Bellcore GR63-CORE standard.

2.2 Grms, 10 minutes per axis on all three axes as per the Intel Environmental Standards Handbook

Shock operating Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three

axes as per the Intel

Shock nonoperating Trapezoidal, 25 G, 170 inches/sec delta V, three drops in each direction, on

each of the three axes as per Intel

Safety UL 1950, CSA 950, IEC 950, TUV/GS EN60950

Emissions Certified to FCC Class A; tested to CISPR 22 Class A,

EN 55022 Class A, VCCI Class A ITE, AS/NZS 3548 Class A

Immunity Verified to comply with EN 50082-1

Electrostatic discharge (ESD) Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8 kV

contact discharge without physical damage as per Intel Standards Handbook

Acoustic

Sound pressure: < 55 dBA at ambient temperatures < 24° C measured at bystander positions in operating mode

Environmental Standards Handbook

Environmental

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2.7.2 Physical Specifications

Table 2-5 describes the physical specifications of the Intel® TIGPT1U.

Table 2-5. Dimensions and Weight

Height 1.70 inches (43 mm)

Width 16.9 inches (430 mm)

Depth 20 inches (509 mm)

Front clearance 2 inches (76 mm)

Side clearance 1 inches (25 mm)

Rear clearance 3.6 inches (92 mm)

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Cables and Connectors Intel® Carrier Grade Server TIGPT1U TPS

3. Cables and Connectors

This chapter describes interconnections between the various components of the Intel® Carrier Grade Server TIGPT1U. In addition, this chapter includes an overview diagram of the Intel

TIGPT1U interconnections, as well as tables describing the signals and pin-outs for the connectors on the various system boards. Refer to the appropriate SE7210TP1-E System Baseboard section or system board sections in this document for other connector signal descriptions and pin-outs.

3.1 Chapter Structure and Outline

The information contained in this chapter is organized into four sections. The information is presented in a modular format, with numbered headings for each major topic and subtopic. The content of each section is summarized as follows:

Section 3.2: Interconnect Block Diagram

Provides an overview of system interconnects.

Section 3.3: Cable and Interconnect Descriptions

Provides a list of all the connectors and cables in the system.

Section 3.4: User-accessible Interconnects

Describes the form-factor and pin-out of user-accessible interconnects.

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3.2 Interconnect Block Diagram

Figure 3-1 shows interconnections for all of the boards used in the Intel® TIGPT1U.

System Baseboard

Serial

Alarm Conn

2x5 COM

Fan 4

2x5

2 NIC, 2 USB, COM2, 1 Kybd/

2x8 Alarm

Fan 3

1x3

1x3 Fan

Mouse, 1 Video

1x3 Fan

Pwr 2x4

2x4 uP Pwr

250 W Power Supply

(AC-input or DC-input)

Power Conn 2x31

Interconnect Board

Power Conn 2x31

3.3V to 5V Regulator 5A

Pwr 2x6

2x6 MP PWR

Extended Front Panel Board

USB 2x5

Push Buttons

Pwr|Rst

NMI|ID

2x5 Pin USB Cbl

System Fault LEDs

Crt|Mjr|Mnr|Pwr

Activity/ID LEDs

ID|NIC|On|Disk1|Disk0

1x3 pwr cbl (5V)

1x3 Fan

Pwr 1x3

Fan 5

1x3

Fan 6

1x3

68 Pin Wide U-320

SCSI CBL

2x5 Pin USB Cbl

2x17 Front

Panel Cable

2x4

2x6 MP PWR

1x3 Fan

FP 2x17

2x4 uP Pwr

1x3 Fan

Fan 6 40x28

6300ESB

I/O Controller

Hub

2x20 IDE

Cable

Pwr 2x6

SCSI SCA Conn 80pin SCSI SCA Conn 80pin

SCSI SCA Conn 80pin

SCSI Hard Drive 1 Hot Plug Drive Assembly Consists of:

1. SCA SCSI Disk Drive

2. Drive Carrier

SCSI Hard Drive Bay 1 SCSI Hard Drive Bay 0

2x20 IDE Cable

CDROM

Signal 2x20, Power 1x2

CDROM

MidPlane Board

SCSI LVD Term

1x2 CDROM Pwr

1/2"

Pentium 4 uPGA478

827210

Memory

Controller

Fan 1

1x3

1x3 Fan

Fan 1/3

40x48

SCSI SCA Conn 80pin

SCSI Hard Drive 0 Hot Plug Drive Assembly Consists of:

1. SCA SCSI Disk Drive

2. Drive Carrier

CDROM Drive Bay

Note: The CDROM

Drive is positioned

above SCSI Hard

Drive Bay 1

Hub

Fan 2

1x3

1x3 Fan

Fan 2/4

40x48

68 Pin Wide U-320

SCSI CBL

SCSI BB Conn

68 Pin Wide U-320 SCSI Bus

Fan 5

40x28

Figure 3-1. Intel® Carrier Grade Server TIGPT1U Interconnect Block Diagram

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3.3 Cable and Interconnect Descriptions

Table 3-1 describes all cables and connectors of the Intel® Carrier Grade Server TIGPT1U.

Table 3-1. System Interconnect Descriptions

System Board

Baseboard J5G2 1 x 5 P/S Signal Connector P/S Sig Cable J5G2 1 x 5 P/S Signal

Baseboard J4J1 2 x 12 P/S Power

Baseboard J9B1 2 x 4 uP Power Connector P/S uP Pwr Cbl J9B1 2 x 4 uP Power Connector

Baseboard J4J2 2 x 20 IDE Connector IDE Cable J4J2 2 x 20 IDE Connector

Baseboard J1J1 68 pin SCSI Ch B Conn SCSI BB Cbl J1J1 68 pin SCSI Connector

Baseboard J8A2 2 x 5 Serial Port Connector USB/Com2/Alrm J8A2 2 x 5 Serial Port

Baseboard J5A1 1 x 3 Fan 1 Pwr/Tach Conn 40 x 48 Fan

Baseboard J7A2 1 x 3 Fan 2 Pwr/Tach Conn 40 x 48 Fan Left J7A2 1 x 3 Fan Pwr/Tach Conn

Baseboard J7J3 1 x 3 Fan 3 Pwr/Tach Conn 40 x 48 Fan

Baseboard J7J2 1 x 3 Fan 4 Pwr/Tach Conn 40 x 48 Fan Left J7J2 1 x 3 Fan Pwr/Tach Conn

Baseboard J1E2 1 x 3 Fan 5 Pwr/Tach Conn 40 x 28 Fan PCI J1E2 1 x 3 Fan Pwr/Tach Conn

Baseboard J1E1 1 x 3 Fan 5 Pwr/Tach Conn 40 x 28 Fan

Baseboard J3J2 2 x 17 Front Panel Conn Front Panel (FP)

Baseboard J5G1 2 x 5 USB Connector USB Cable J5G1 2 x 5 USB Connector

MP Board J2L1 68 pin SCSI Connector SCSI BB Cbl J2L1 68 pin SCSI Connector

MP Board J4A1 80 pin SCA Connector SCSI Drive 1 J4A1 80 pin SCA Connector

MP Board J8A1 80 pin SCA Connector SCSI Drive 2 J8A1 80 pin SCA Connector

MP Board J9L1 2 x 6 MP-FP Connector MP-FP Cable J9L1 2 x 6 MP-FP Connector

FP Board J1E1 2 x 6 MP Power Conn MP-FP Cable J1E1 2 x 6 MP-FP Connector

FP Board J3H1 1 x 3 Riser Power Conn P/S CDRsr Cb J3H1 1 x 3 Riser Power Conn

FP Board J2G1 1 x 8 USB Connector USB Cable J2G1 1 x 8 USB Connector

FP Board J5A1 2 x 4 uP Power Connector P/S uP Pwr Cbl J5A1 2 x 4 uP Power Connector

FP Board J8A1 2 x 17 Front Panel Conn FP Cable J8A1 2 x 17 Front Panel Conn

FP Board J9B1 2 x 12 COM2/Alarm Conn C2/Alarm Cbl J9B1 2 x 12 COM2/Alarm Conn

FP Board J9A1 2 x 5 PS Sig/Pwr Conn PS Sig/Pwr Cbl J9A1 2 x 5 PS Sig/Pwr Conn

FP Board J10A1 2 x 10 PS Pwr Conn PS Pwr Cable J10A1 2 x 10 PS Pwr Conn

FP Board J1J1 RJ45 COM2/ USB con N/C

Ref Des

Connector Description Cable/Device

/Board

SE7210TP1-E Baseboard Connections

P/S Pwr Cable J4J1 2 x 12 P/S Power Conn

Connector

Right

Mem

Cable

Midplane Board Connections

Extended Front Panel Board

Ref Des

J5A1 1 x 3 Fan Pwr/Tach Conn

J7J3 1 x 3 Fan Pwr/Tach Conn

J1E1 1 x 3 Fan Pwr/Tach Conn

J3J2 2 x 17 Front Panel Conn

Connector Description

Connector

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Intel® Carrier Grade Server TIGPT1U TPS Cables and Connectors

CDROM Interface Board Connections

CDROM I/F P1 2 x 1 Power Connector CDROM Pwr Cb P1 2 x 1 Power Connector

CDROM I/F P3 2 x 20 IDE Connector IDE Cable P3 2 x 20 IDE Connector

NEBS Riser Board Connections

NEBS Rsr J1A1 1 x 3 Power Connector P/S CDRsr Cb J1A1 1 x 3 Power Connector

3.4 Exteranly-Accessible Interconnects

3.4.1 Keyboard and Mouse Ports

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these connectors are protected with a PolySwitch* circuit that, like a self-healing fuse, reestablishes the connection after an overcurrent condition is removed.

NOTE

✏

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the server should be turned off before a keyboard or mouse is connected or disconnected.

The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.

Table 3-2. Keyboard/Mouse PS/2 Connector Pin Out (J9A1)

Connector Pin Signal Name

Keyboard

Mouse

1 Data

2 NC

3 GND

4 +5 V (Fused)

5 Clock

6 NC

7 Data

8 NC

9 GND

10 +5 V (Fused)

11 Clock

12 NC

13 NC

14 NC

15 NC

16 NC

17 NC

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Cables and Connectors Intel® Carrier Grade Server TIGPT1U TPS

3.4.2 Serial Ports

The Intel® Server Board SE7210TP1-E has one 9-pin D-sub serial port connector for COM1 and one 2 x 5 serial port connector COM2. COM2 is brought out the front of the chassis by an RJ45 connector. by cabling between the 2 x 5 serial port connector on the Intel SE7210TP1-E and a mating connector on the extended front panel board. The following tables detail the pin outs of these two ports.

Table 3-3. COM1: 9-pin Serial A Port Pin Out (J8A1)

Pin Signal

1 DCD (Data Carrier Detect)

2 RXD (Receive Data)

3 TXD (Transmit Data)

4 DTR (Data Terminal Ready)

5 GND

6 DSR (Data Set Ready)

7 RTS (Request to Send)

8 CTS (Clear to Send)

9 RI (Ring Indicator)

The front panel board has provision for the COM2 port using a RJ45 connector. This RJ45 connector is accessible at the front of the system.

Server Board

Table 3-4. COM2: Serial Port Connector on Front Panel

Pin Signal

1 RTS (request to send)

2 DTR (data terminal ready)

3 TXD (transmit data)

4 GND

5 RIA (ring indicator)

6 RXD (receive data)

7 DSR/DCD (date set ready / data carrier detect1)

8 CTS (clear to send)

Use jumper on extended front panel board to select

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3.4.3 Video Port

The video port interface is a standard VGA compatible, 15-pin connector. Onboard video is supplied by an ATI* Rage* XL video controller with 8 MB of onboard video SGRAM.

Table 3-5. Video Connector

Pin Signal

1 Red (analog color signal R)

2 Green (analog color signal G)

3 Blue (analog color signal B)

4 No connection

5 GND

6 GND

7 GND

8 GND

9 Fused VCC (+5 V)

10 GND

11 No connection

12 V_MONID1

13 HSYNC (horizontal sync)

14 VSYNC (vertical sync)

15 V_MONID2

3.4.4 Universal Serial Bus (USB) Interface

The baseboard provides four USB ports. USB ports 1, 2, and 3 are brought out the rear of the unit on the baseboard, and USB port 4 is brought out the front of the unit on the extended front panel. The front USB port is accessible without removing the front bezel. The built-in USB ports permit the direct connection of four USB peripherals without an external hub. If more devices are required, an external hub can be connected to any of the built-in ports.

Table 3-6. Single USB Connector

Pin Signal

1 Fused VCC (+5 V w/over-current monitor of ports 0, 1, 2, and 3)

2 DATAL0 (differential data line paired with DATAH0)

3 DATAH0 (differential data line paired with DATAL0)

4 GND

5 GND

6 GND

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3.4.5 Ethernet Connector

The server board SE7210TP1-E supports two NIC RJ45 connectors for the Ethernet ports. The following table details the pin-out of each of the connectors.

Table 3-7. Magjack Connector (RJ45, 10/100/1000) Pin Out (J5A1, J6A2)

Pin Signal Name Pin Signal Name

1 LAN_V_1P8 10 LAN_MDI_0*

2 LAN_MDI_2* 11 LAN_MDI_0

3 LAN_MDI_2 12 LAN_V_1P8

4 LAN_MDI_1 13 LAN_LINK_100*

5 LAN_MDI_1* 14 LAN_LINK

6 LAN_V_1P8 15 LAN_LINK_UP*

7 LAN_V_1P8 16 LAN_ACTLED*

8 LAN_MDI_3 17 GND

9 LAN_MDI_3* 18 GND

3.4.6 Telco Alarms Connector

The system provides one telco DB15 alarms connector on the rear bulkhead. Table 3-8 shows the pinout for the telco alarms connector, and Figure 3-2 shows the telco alarms connector as viewed from the back of the server.

Table 3-8. Telco Alarms Connector

Pin Description Pin Description

1 MinorReset + 9 MinorAlarm – NC 2 MinorReset - 10 MinorAlarm - COM 3 MajorReset + 11 MajorAlarm - NO 4 MajorReset - 12 MajorAlarm - NC 5 CriticalAlarm - NO 13 MajorAlarm - COM 6 CriticalAlarm - NC 14 PwrAlarm - NO 7 CriticalAlarm - COM 15 PwrAlarm - COM 8 MinorAlarm - NO

915

3.4.7 AC Power Input for AC-Input Power Supply

One IEC320-C13 receptacle is provided at the rear of the AC-input power supply. It is recommended to use an appropriately sized power cord and AC main. Please refer to Section 9, AC Power Subsystem, in this document for system voltage, frequency, and current draw specifications.

Revision 1.0

Figure 3-2. Telco Alarms Connector

Intel® Carrier Grade Server TIGPT1U TPS Cables and Connectors

Figure 3-3. AC Power Input Connector

3.4.8 DC Power Input for DC-Input Power Supply

A DC power terminal block is provided at the rear of the DC-input power supply. It is recommended to use appropriately sized power wire and DC main.

Figure 3-4. DC Power Input Connector

The terminal block will accept standard terminal lugs size Newark stock # 81N1501 type CRST0-1406-HT that accept 14 AWG wire gauge. The width (w, see Figure 2-1) of the lug can be no larger than 0.25 inches.

Figure 3-5. Terminal Lug

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Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4. Extended Front Panel System Board

This chapter describes the basic functions and interface requirements of the Extended Front Panel system board that is designed for the Intel

Carrier Grade Server TIGPT1U.

4.1 Features

• Four switches to control power-on, reset, NMI, and the system ID LED

• One system ID LED that can be controlled remotely or by the system ID switch

• Two system activity LEDs that indicate power-on and NIC activity

• Two hard drive activity/fault LEDS that indicate activity/fault status for drives 0 and 1

• Four system fault LEDs that indicate critical, major, minor, and power system fault status

• Four system fault relays for external critical, major, minor, and power fault indicators

• Hot-swap circuitry for controlling power delivery to SCSI disk drives 0 and 1

• Power distribution to SE7210TP1-E System Baseboard, drive carrier assemblies, and

hot plug disk drives 1 and 2

4.2 Chapter Structure and Outline

The information contained in this chapter is organized into eight sections. The information is presented in a modular format, with numbered headings for each major topic and subtopic. The content of each section is summarized as follows:

Section 4.3: Introduction

Provides an overview of the Intel showing primary components and their relationships, and physical board layout diagrams.

TIGPT1U extended front panel board,

Section 4.4: Functional Description of Front Panel Switches, LEDs, and Relays

Provides a functional description of the front panel switches, LEDs, and relays contained on the FPIO board.

Section 4.5: Connector Information

Provides information on all connectors contained on the extended front panel board. Gives signal descriptions and the corresponding electrical parameters for each input and output of a given connector.

Section 4.6: SCSI Power Subsystem

Provides information on the hard drive interface circuitry on the extended front panel board. The hard drive interface circuitry is designed to give the end user support for two SCSI hot-plug hard drives. The design enables easy use and replacement of the SCSI hard drives without powering down the system.

Section 4.7: Specifications

Describes the electrical, environmental and mechanical specifications.

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.3 Introduction

The extended front panel system board provides the means of mounting and electrically connecting switches and indicators for system operation and status. These features are accessible and visible from the front of the chassis. In addition, it contains the hard drive hotplug control circuitry necessary for the hot-plug SCSI disk drives. An alarms function is also provided. The extended front panel system board is designed for use with telecom SE7210TP1-E Server Baseboards.

Power

34 Pin Front Panel

Connector

Supply

Aux I

BUS

MidPlane

Connector

Alarm/COM2

Connector

USB

Connector

PCF 8574

Front Panel

LEDs

Hot Swap

Power

Cntrl

12V & 5V

Front Panel

COM2/USB

Connector

Front Panel

Switches

C BUS

PCF 8574

Alarms

Circuits

Figure 4-1. Extended Front Panel Board

4.4 Functional Description of Front Panel Switches, LEDs, and

Relays

4.4.1 Front Panel Switches

The front panel has a power switch, a reset switch, an NMI switch, and a system ID switch. The function of each switch is described in the following table.

Switch Function

Power Switch A momentary switch, APCI compliant, used to toggle system power on/off.

Reset Switch A momentary switch used to reset the system when it is in the power-on

state.

NMI Switch A momentary switch used to instruct the processor to copy system memory

to hard disk

System ID Switch A momentary switch used to instruct the processor to toggle the state of the

system ID LED

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Table 4-1. Front Panel Switch Description

Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4.4.2 Front Panel LEDs

Table 4-2. LED Specifications

LED Function LED Color Peak Wavelength

(nm)

ID White N/A 50 36 Blue 470 50 18 NIC Green 560 12 6 ON Green 560 12 6 DRV 1/0 Activity Green 568 12 2.6 DRV 1/0 Red 625 12 4.0 CRT Red 660 23 6 Yellow-Green 570 16.8 6 MJR Red 660 23 6 Yellow-Green 570 16.8 6 MNR Yellow 580 5.9 3 PWR Yellow 580 5.9 3

Luminous

Intensity

Typ(mcd)

Luminous

Intensity

Min(mcd)

4.4.3 System Status LEDs

There are five extended front panel system board system status LEDs. The function of these system status LEDs is described in the following table.

Table 4-3. Front Panel System Status LED Description

Status LED Function

Power The green Power LED indicates that system power is on when it is

illuminated continuously. When it is blinking green, it indicates that the system is in ACPI sleep mode.

NIC0/NIC1 The green NIC activity LED indicates network link presence and activity on

either NIC0 or NIC1

System ID The white or blue NIC activity LED is used to identify a particular system.

The LED can be toggled remotely or with the System ID Switch

Disk 0 The green/amber/red hard drive 1 activity/fault LED displays activity or fault

status for hard disk drive 1

Disk 1 The green/amber/red hard drive 2 activity/fault LED displays activity or fault

status for hard disk drive 2

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.4.4 System Fault LEDs

There are four front panel system fault LEDs. The function of these system fault LEDs is described in the following table.

Table 4-4. Front Panel System Fault LED Description

Fault LED Function

Critical This amber or red LED alarm is illuminated via the Server Management Bus

(SMBus) and may only be turned off via SMBUS control. When continuously lit, it indicates the presence of a Critical System Fault. A critical system fault is an error or event that is detected by the system with a fatal impact to the system. In this case, the system cannot continue to operate. An example could be the loss of a large section of memory, or other corruption, that renders the system not operational. The front panel critical alarm relay will be engaged.

Major This amber or red major alarm is illuminated via SMBUS bus and may be

turned off via SMBUS control or alarm connector reset. When continuously lit, it indicates the presence of a Major System Fault. A major system fault is an error or event that is detected by the system that has discernable impact to system operation. In this case, the system can continue to operate, but in a “degraded” fashion (reduced performance or loss of non-fatal feature reduction). An example could be the loss of one of two mirrored disks. The front panel major alarm relay will be engaged.

Minor This amber LED minor alarm is illuminated via SMBUS bus and may be

turned off via SMBUS control or alarm connector reset. When continuously lit, it indicates the presence of a Minor System Fault. A minor system fault is an error or event that is detected by the system but has little impact to actual system operation. An example would be a correctable ECC error. The front panel minor alarm relay will be engaged.

Power The amber power alarm is illuminated via SMBUS bus or SYS_FLT_LED_L

signal and may only be turned off via SMBUS control. When continuously lit, it indicates the presence of a Power System Fault. The front panel power alarm relay will be engaged.

4.4.5 LED Color Selection

The Extended Front Panel Board (XFPB) supports population options for two different SKUs, the Intel fault LEDs. The OEM SKU supports a blue ID LED and red hard disk drive (HDD) fault LEDs. Selecting between the two SKUs are done during board build. For an Intel LED at location DS4J2 and install n-FETs at locations Q5W6 and Q5W2. For an OEM SKU, install a blue LED at location DS4J2 and remove n-FETs at locations Q5W6 and Q5W2. LED color selection to support the Intel

Revision 1.0

SKU and an OEM SKU. The Intel® SKU supports a white ID LED and amber HDD

SKU, install a white

SKU and OEM SKU are outlined in the following table:

Table 4-5. LED Color Selection

Board

SKU

OEM ID Blue DS4J2 Install iPN 697565-010

Intel ID White DS4J2 Install iPN 697565-009

OEM Disk 0 Fault Red Q5W6 Remove component

Intel Disk 0 Fault Amber Q5W6 Install component

OEM Disk 1 Fault Red Q5W2 Remove component

Intel Disk 1 Fault Amber Q5W2 Install component

LED Color Board Location Reference

Designator

Board Population Option

Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4.4.6 System Fault Relays

The front panel board contains four relays. These relays are for power, critical, major and minor alarms. The relays are controlled via the SMBus. See Section 4.4.7 for programming information.

4.4.7 Server Management Bus (SMBus) Interface

The Torrey Pines baseboard communicates to the XFPB via the auxiliary I2C bus to support server management functions. The I SMBus functionality. Two I/O expanders on the XFPB are used as slave devices to interface to the SMBus.

The first device (U3H1) is used to support the control and monitoring of the front panel alarms. All signals at U3H1 that interface to the alarms circuitry are active low. During power up, the device will reset all I/Os to the default High state. However, during system soft resets, the device requires a software command to reinitialize all I/Os to the default inactive state.

Access to U3H1 during a write cycle can be performed by writing to address 0 x 40. Access to U3H1 during a read cycle can be performed by writing to address 0 x 41. Refer to Table 4-6 for an I/O map of U3H1.

C interface operates at less than 20 Khz rate to support

The second device (U2H1) is used to support the control and monitoring of the two SCSI hard drives. Also, during a drive fault condition, U2H1 receives commands from the baseboard to activate the proper drive fault LED to provide visual indications of a fault condition. All signals at U2H1 that interface to the SCSI control circuitry are active low. During power up, the device will reset all I/Os to the default High state. However, during system soft resets, the device requires a software command to reinitialize all I/Os to the default inactive state.

Access to U2H1 during a write cycle can be performed by writing to address 0 x 44. Access to U2H1 during a read cycle can be performed by writing to address 0 x 45. Refer to Table 4-7 for an I/O map of U2H1.

Table 4-6. Alarms SMBus I/O Mapping

Bit I/O Name Description

0 O Power alarm Writing 0 turns on the power alarm relay and illuminates the POWER LED,

writing 1 turns both off. The relay and LED may also be turned on by a FAN_FAIL_L signal.

1 O Critical alarm Writing 0 turns on the critical alarm relay and illuminates the CRITICAL LED,

writing 1 turns both off.

2 O Major alarm Writing a 1 to 0 edge will turn on the flip-flip that enables major alarm relay.

Writing a 1 will turn off the major alarm relay or a MAJOR_RESET signal input. MAJOR LED in on when output is 0, off when output is 1. 1

3 O Minor alarm Writing a 1 to 0 edge will turn on the flip-flip that enables major alarm relay.

4 I Major alarm

sense

5 I Minor alarm

sense

Writing a 1 will turn off the major alarm relay or a MINOR_RESET signal input. MINOR LED in on when output is 0, off when output is 1.

Senses the state of the major alarm relay. 0 relay is on, 1 relay is off. This allows software to detect if the MAJOR_RESET signal was activated. Always write 1 during write operations.

Senses the state of the minor alarm relay. 0 relay is on, 1 relay is off. This allows software to detect if the MINOR_RESET signal was activated. Always write 1 during write operations.

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

Bit I/O Name Description

6 I Critical/Major

color

7 I Not used Reserved for future use, always write 1 during write operations.

Normally closed (NC) and normally open (NO) relay contacts are provided on the rear panel Telco alarms

connector. To activate the relay, a 1 to 0 transition must be written.

Writing a 1 turns CRITICAL and MAJOR LEDs to yellow, writing 0 color is RED. Strapping J7D1 pins 7-8 forces LEDs to RED. Resets to yellow.

Table 4-7. SCSI SMBus I/O Mapping

Bit I/O Name Description

0 O SCSI1_LED_FLT_N Writing 0 to this signal will activate the SCSI drive fault circuitry and

illuminate the SCSI1 fault LED.

1 O SCSI0_LED_FLT_N Writing 0 to this signal will activate the SCSI drive fault circuitry and

illuminate the SCSI0 fault LED.

2 O SCSI1_INSERTED_N This signal provides a future use option to allow server management to

control activation of the SCSI1 drive power delivery circuitry. Writing 0 to this signal will enable the hot swap circuitry to power on. However, the signal is set to the disabled mode in the current board configuration.

3 O SCSI0_INSERTED_N This signal provides a future use option to allow server management to

4 I SCSI1_MATED_N This signal senses drive presence at SCSI drive slot 1. A low state at this

signal indicates that a drive is populated at slot 1

5 I SCSI0_MATED_N This signal senses drive presence at SCSI drive slot 0. A low state at this

signal indicates that a drive is populated at slot 0

6 I SCSI_PWRGOOD1 This signal senses the state of the SCSI drive 1 hot swap controller. A low

state at this signal indicates that no power is delivered to drive 1.

7 I SCSI_PWRGOOD0 This signal senses the state of the SCSI drive 1 hot swap controller. A low

state at this signal indicates that no power is delivered to drive 1.

4.5 Connector Information

The following tables show all the connectors on the XFPB and the interconnection to other devices within the Intel following figure of the connector location.

Table 4-8. Extended Front Panel System Board Connector Information

Loc Ref Des Function Interconnect Connects to

1 J2G1 1 x 8 USB Connector USB Cable Baseboard USB Connector 2 J5A1 2 x 4 Processor Power Conn uP Pwr Cable Baseboard uP Power Connector

3 J8A1 2 x 17 Front Panel Conn FP Cable Baseboard Front Panel Connector 10 J1E1 2 x 6 Midplane Pwr/Sig 11 J9A1 2 x 5 Power Conn Pwr/Sig Cable Baseboard Power/Signal Connector 12 J9B1 2 x 12 Alarm/COM2 Conn Alarm/Com Cbl Baseboard COM2/Chassis Alarm 13 J10A1 2 x 10 Power Connector Power Cable Baseboard Power Connector 14 J1J1 RJ45 COM2/USB Conn N/C 16 J3H1 1 x 3 NEBS Riser Pwr Conn Riser Pwr Cbl NEBS Riser Power Connector

Revision 1.0

TIGPT1U. In addition, the first column references the location on the

FPIO Board Connections

MP Cable Midplane Power/Signal Connector

Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

Figure 4-2. Extended Front Panel Board Connector Location

Table 4-9. Connector Housing Information

Conn Function Intel PN AML s/k/l/p* cnt hsn

J2G1 USB 1 x 8 C13083-007 Molex 43650-0817 y/y/y/y 30u” 94V0 J5A1 uP Pwr 2 x 4 A81170-001 Molex 39-29-9086 y/y/y/y Tin 94V0 J8A1 FP 2 x 17 A57940-002 Foxconn HL15177 y/y/y/y 15u” 94V0 J1E1 MP 2 x 6 691314-004 Molex 43045-1218 y/y/y/y Tin 94V0 J9A1 BB Pwr/Sig 2 x 5 2

J9B1 Alarm/COM 2 x 12 2 mm A62345-003 Molex 87333-2420 y/y/n/y 15u” 94V0 J10A1 Baseboard (BB) Pwr

2 x 10 J1J1 COM2/USB 680356-004 680358-004 y/y/y/y 30u” 94V0 J3E1 Riser Pwr 1 x 3 703140-002 Molex 39-30-2036 y/y/y/y Tin 35u” 94V0

s/k/l/p* - shrouded/keyed/latching/polarized

Extended Front Panel Board

700000-772 Molex 87333-1021 y/y/n/y 30u” 94V0

703141-001 Molex 39-29-9207 y/y/y/y Tin 35u” 94V0

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.5.1 Extended Front Panel Board USB Connector Pinout

The following table details the pin-out of the USB connector to the SE7210TP1-E System Baseboard.

Table 4-10. 8-pin (1 x 8) USB J2G1 Connector

Pin USB Signal

1 GND

2 GND

3 FP_USB_N

4 FP_USB_P

5 USBPWR

6 GND

7 GND

8 GND

4.5.2 Extended Front Panel Board uProcessor Power Connector Pinout

The following table details the pin-out of the uP power connector to the SE7210TP1-E System Baseboard.

Table 4-11. 8-pin (2 x 4) uP Power J5A1 Connector

Pin uP Power Signal Pin uP Power Signal

1 GND 2 P12V_A

3 GND 4 P12V_A

5 GND 6 P12V_A

7 GND 8 P12V_A

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Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4.5.3 Extended Front Panel Board Front Panel Connector Pinout

The following table details the pin-out of the front panel connector to the SE7210TP1-E System Baseboard.

Table 4-12. 34-pin (2 x 17) Front Panel J8A1 Connector

Pin Front Panel Signal Pin Front Panel Signal

1 GND 2 P5V_STBY

3 Keying Pin 4 NC_FAN_FAIL_PWR

5 PWR_ON_LED_N 6 NC_POWER_FAIL_PWR

7 NC_HD_ACT_PWR 8 NC_POWER_FAIL_PWR

9 NC_HD_ACT_N 10 FP_SYS_FLT_LED_N

11 FP_PWR_BTN_N 12 P3V3_STBY

13 GND 14 NIC1_LED_N

15 FP_RST_BTN_N 16 NC_FP_SDA

17 GND 18 NC_FP_SCL

19 NC_SLEEP_BTN 20 NC_SSI_PIN20

21 GND 22 P3V3_STBY

23 FP_NMI_BTN_N 24 NIC2_LED_N

25 NC_SSI_PIN25 26 NC_SSI_PIN26

27 P5V_STBY 28 P5V_STBY

29 FP_ID_LED_N 30 STATUS_LED_N

31 FP_ID_LED_N 32 P5V

33 GND 34 NC_HDD_FLT_N

4.5.4 Extended Front Panel Board Midplane Connector Pinout

The following table details the pin-out of the connector to the Mid-Plane System Baseboard.

Table 4-13. 12-pin (2 x 6) Mid-Plane J1E1 Connector

Pin Mid-Plane Signal Pin Mid-Plane Signal

1 SCSI0_5V 2 SCSI0_12V

3 SCSI1_5V 4 SCSI1_12V

5 ACT_SCSI0_N 6 P5V

7 GND 8 GND

9 GND 10 SCSI0_MATED_N

11 ACT_SCSI1_N 12 SCSI1_MATED_N

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.5.5 Extended Front Panel Board Power/Signal Connector Pinout

The following table details the pin-out of the power/signal connector to the SE7210TP1-E System Baseboard.

Table 4-14. 10-pin (2 x 5) Power/Signal J9A1 Connector

Pin Power/Signal Signal Pin Power/Signal Signal

1 PS_SCL 2 PS_SDA

3 PS_ALERT_N 4 GND_REM_SENSE

5 PWR_REM_SENSE 6 PWOK

7 PSON_N 8 N12V

9 P5V 10 GND

4.5.6 Extended Front Panel Board Alarm/COM2 Connector Pinout

The following table details the pin-out of the Alarm/COM2 connector to the SE7210TP1-E System Baseboard (COM2) and to the chassis rear access port (Alarm).

Table 4-15. 24-pin (2 x 12) Alarm/COM2 J9B1 Connector

Pin Front Panel Signal Pin Front Panel Signal

1 GND 2 MIN_RST_P

3 RS232_RI 4 MINR_NC

5 RS232_DTR 6 MIN_RST_N

7 RS232_CTS 8 MINR_COMM

9 RS232_TXD 10 MAJ_RST_P

11 RS232_RTS 12 MAJ_NO

13 RS232_RXD 14 MAJ_RST_N

15 RS232_DSR 16 MAJ_NC

17 RS232_DCD 18 CRIT_NO

19 CRIT_COM 20 MAJ_COMM

21 POWER_COMM 22 CRIT_NC

23 MIN_NO 24 POWER_NO

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Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4.5.7 Extended Front Panel Board Baseboard Power Connector Pinout

The following table details the pin-out of the baseboard power connector to the SE7210TP1-E System Baseboard

Table 4-16. 20-pin (2 x 10) Baseboard Power J10A1 Connector

Pin Front Panel Signal Pin Front Panel Signal

1 P3V3 2 P3V3

3 P3V3 4 P3V3

5 P5V 6 P5V

7 P5V 8 P12V_A

9 P12V_A 10 GND

11 GND 12 GND

13 GND 14 GND

15 P5V 16 P5V

17 GND 18 GND

19 GND 20 P5V_STBY

4.5.8 Extended Front Panel Board COM2/USB Connector Pinout

The following table details the pin-out of the front access panel COMM/USB connector.

Table 4-17. 16-pin Baseboard Power J1A1 Connector

Pin USB Signal Pin COM2 Signal

1 GND 9 RJ45_RTS

2 GND 10 RJ45_DTR

3 GND 11 RJ45_TXD

4 GND 12 GND

5 USBPWR 13 RJ45_RI

6 USB_TOP_DM 14 RJ45_RXD

7 USB_TOP_DP 15 RJ45_DSR_DCD*

8 GND 16 RJ45_CTS

* Pin 15 RJ45_DSR_DCD is selected via jumpers on J3H1 on the extended front panel board as follows:

J3H1 Pin1 to Pin2 – select DSR J3H1 Pin 2 to Pin 3 – select DCD

4.5.9 Extended Front Panel Board NEBS Riser Power Connector Pinout

The following table details the pin-out of the 1 x 3 NEBS Riser Power connector.

Table 4-18. 3-pin (1 x 3) NEBS Riser Power J3E1 Connector

Pin 1 x 3 Power Signal

1 P5V_A

2 GND

3 GND

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.6 SCSI Power Subsystem

The SCSI power subsystem on the extended front panel board is designed to provide power delivery to the two SCSI hot-swappable hard drives that are mated to the midplane peripheral board. The design enables on-demand power delivery of +5 V and +12 V to the SCSI drives, without the need to power cycle the Intel

4.6.1 SCSI Drive Power Control

The SCSI power management circuit is intended to support the control function for hot-insertion of the two SCSI hard drives. The design enables on-the-fly replacement of the SCSI hard drives without powering down the system.

SCSI Power Control includes SCSI drive power switching, over-current protection, and system status notification.

Once a SCSI drive is mated to the chassis, the control circuit begins to turn on approximately 48 mS after the drive’s scsi_mated signal goes low. Power to the SCSI device 5 V line begins to ramp approximately 6 mS after the control circuit is activated, and the SCSI 12 V line begins to ramp approximately 8 mS after the control circuit is activated. The scsi_mated signal not only activates the power control circuit, it also notifies server management software through the SMBus that the drive has been inserted. After the output voltages are stable, the power control circuit provides an active high power_good signal to the server management software to notify that the 5 V and 12 V supplies are at nominal voltage.

TIGPT1U during drive insertion/removal.

The SCSI power control circuit contains current sensing mechanism to detect conditions where excessive current are being drawn. When the current draw reaches 5 A on either the 12 V or 5 V supply, the control circuit disconnects power to the drive and times out for 9.4 mS (200 KΩ * Ctim = 200 K * .047 uF).

4.6.2 Internal SCSI Drive Power Switching

Each SCSI drive is supplied with +12 V and +5 V. Separate Metal-Oxide Semiconductor Field Effect (MOSFET) switches apply and remove the +12 V and +5 V to each internal SCSI drive.

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Extended Front Panel System Board Intel® Carrier Grade Server TIGPT1U TPS

4.6.3 SCSI Drive Status LEDs

The status LEDs give the user a visual indication of the drives’ condition. There is a single LED for each drive. The LEDs are bi-colored and use a combination of color and blinking frequency to indicate multiple conditions. The LEDs are mounted on the extended front panel system board, and the light is directed to the front panel through the use of a light pipe assembly. See Table 4-19 for LED activity definitions. See Firmware EPS for definitions of the different blink rates.

Table 4-19. LED Activity Definitions

LED State Drive Active Fault Condition

Solid Green

Blinking Green X

Solid Yellow/Red

Blinking Yellow/Red

Blank

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Intel® Carrier Grade Server TIGPT1U TPS Extended Front Panel System Board

4.7 Specifications

4.7.1 Electrical Specifications

DC specifications for the Intel® TIGPT1U extended front panel board power connectors are summarized in this section. All power rails must operate within +/- 5% voltage range.

Table 4-20. Maximum Power Requirements (mA)

CIRCUIT

FUNCTION

STATUS LEDs 41 56 3 17

ALARM RELAY CNTL 0.4 76

ALARM LEDs 0.3 55

I/O EXPANDERS 22 26 4 6 0 0.0

SCSI CONTROLLERS 22 55

TOTAL CURRENT(mA) 22 55 63 82 7.7 154 0 0.6 0.6175 1.93416

POWER(W) 0.264 0.693 0.315 0.4305 0.0385 0.8085 0 0.00216 0.6175 1.93416

P12V_B P5V P5V_STBY

TYP

MAX

(mA)

TYP (mA)

MAX (mA)

TYP (mA)

MAX (mA)

P3V3_STBY

TYP (mA)

MAX (mA)

POWER Dissipation (Watts)

TYP MAX

POWER Dissipation (Watts)

Note: Software limits 2 alarms active at once power fault and one of major, minor or critical alarms.

Alarms connector relay contacts are rated at 1 A with a maximum rating of 30 W(DC) / 60 VA (AC).

Alarms connector external alarm (major and/or minor) reset is an optoisolated input that is

reverse voltage protected. A voltage of 3.3 V to 48 V input with a pulse width of at least 200 ms

is required to activate the alarm-reset function. Maximum current is 12 mA.

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Power Interconnect System Board Intel® Carrier Grade Server TIGPT1U TPS

5. Power Interconnect System Board

This chapter describes the basic functions and interface requirements of the power interconnect board that is designed for the Intel

Carrier Grade Server TIGPT1U.

5.1 Features

• Used to interconnect between the power supply and the extended front panel board

• Two connectors on the board, No active components on board

5.2 Chapter Structure and Outline

The information contained in this chapter is organized into two sections. The information is presented in a modular format, with numbered headings for each major topic and subtopic. The content of each section is summarized as follows:

Section 5.1: Functional Description of Power Interconnect System Board

Provides an overview of the Intel

Carrier Grade Server TIGPT1U Front

Panel I/O (FPIO) Board and a physical board layout diagram.

Section 5.2: Connector Description

Provides connector descriptions for all connectors on the interface board.

5.3 Functional Description of Power Interconnect System Board

The power interconnect board is used to interconnect between the power supply and the extended front panel board. Both the power supply and the front panel board have card-edge fingers to interface to the card-edge connectors on the power interconnect system board.

Power passes from the 250 watt power supply through the power interconnect system board to the extended front panel system board. Power is then distributed from the extended front panel system board to the other system boards via discrete cables.

2/1 – Board 1/2 – AMP 532600-4 Connector, Card Edge, Right-Angle

Figure 5-1. Physical Layout of Power Interconnect System Board

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Intel® Carrier Grade Server TIGPT1U TPS Power Interconnect System Board

5.4 Connector Description

5.4.1 Connector Mating to the Power Supply Pinout

The following table details the pin-out of the 2 x 31 connector that is used to interface to the card-edge connector on the 250 watt power supply.

Table 5-1. 2 x 31 Connector Pinout to 250 Watt Power Supply

Pin Power Supply Signal Pin Power Supply Signal

1 N12V 32 P3V3

2 PWOK 33 P3V3

3 RESERVED1 34 P3V3

4 RESERVED2 35 P5V

5 5VSB 36 P5V

6 NC 37 P5V

7 RESERVED3 38 GND

8 RESERVED4 39 GND

9 RESERVED5 40 GND

10 RESERVED6 41 GND

11 P12V_B 42 GND

12 P12V_B 43 GND

13 P12V_B 44 GND

14 P12V_A 45 GND

15 P12V_A 46 GND

16 P12V_A 47 P12V_A

17 GND 48 P12V_A

18 GND 49 P12V_A

19 GND 50 P12V_B

20 GND 51 P12V_B

21 GND 52 P12V_B

22 GND 53 RESERVED7

23 GND 54 RESERVED8

24 GND 55 PWR_REM_SENSE

25 GND 56 RESERVED9

26 P5V 57 RESERVED10

27 P5V 58 GND_REM_SENSE

28 P5v 59 PS_ALERT_N

29 P3V3 60 PS_SCL

30 P3V3 61 PS_SDA

31 P3V3 62 PSON_N

Revision 1.0

Power Interconnect System Board Intel® Carrier Grade Server TIGPT1U TPS

5.4.2 Connector Mating to the Extended Front Panel System Board Pinout

The following table details the pin-out of the 2 x 31 connector that is used to interface to the card-edge connector on the extended front panel system board.

Table 5-2. 2 x 31 Connector Pinout to Extended Front Panel System Board

Pin Power Supply Signal Pin Power Supply Signal

1 P3V3 32 PSON_N

2 P3V3 33 PS_SDA

3 P3V3 34 PS_SCL

4 P5V 35 PS_ALERT_N

5 P5V 36 GND_REM_SENSE

6 P5v 37 RESERVED10

7 GND 38 RESERVED9

8 GND 39 PWR_REM_SENSE

9 GND 40 RESERVED8

10 GND 41 RESERVED7

11 GND 42 P12V_B

12 GND 43 P12V_B

13 GND 44 P12V_B

14 GND 45 P12V_A

15 GND 46 P12V_A

16 P12V_A 47 P12V_A

17 P12V_A 48 GND

18 P12V_A 49 GND

19 P12V_B 50 GND

20 P12V_B 51 GND

21 P12V_B 52 GND

22 RESERVED6 53 GND

23 RESERVED5 54 GND

24 RESERVED4 55 GND

25 RESERVED3 56 GND

26 NC 57 P5V

27 5VSB 58 P5V

28 RESERVED2 59 P5V

29 RESERVED1 60 P3V3

30 PWOK 61 P3V3

31 N12V 62 P3V3

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board

6. NEBS 3.3 V Riser Board

This chapter describes the design and external interface of the Intel® TIGPT1U NEBS 3.3 V riser board. Features of the NEBS 3.3 V riser board include:

• One 66 MHz 3.3 V 64-bit PCI slot

• A 1 x 3 power connector to provide 5V power to support one Peripheral Component

Interconnect (PCI) adapter with a maximum power requirement of 25 watts (5 V @ 5 A). Note that the 5 V power rail is only connected to the 1 x 3 power connector. 5 V supply connections from the baseboard are disconnected at the riser connector.

6.1 Chapter Structure and Outline

Section 6.2: Functional Description:

Provides a functional description of the NEBS 3.3 V riser board.

Section 6.3: Connector Interface:

Gives signal descriptions and the corresponding electrical parameters for each input and output of a given connector.

Section 6.4: Electrical Specification:

Describes the electrical, environmental, and mechanical specifications.

6.2 Functional Description

The NEBS 3.3 V riser board contains one 66 MHz 3.3 V 64-bit slot. A 1 x 3 power connector is used to provide 5 V power to the PCI adapter plugged into the NEBS 3.3 V riser board, and is capable of supporting a PCI adapter with a maximum wattage of 25 watts (5 V @ 5 A).

The riser is intended to mate to slot 1 of the Baseboard. The riser can accept 5 V from either the baseboard edge fingers or through the connector cable assembly from the XFPB. Selecting between the two supplies are done as follows:

1. To select P5V_A from the XFPB -- Install cable from the PDB to J1A1 and depopulate RP7A1, RP7A2, RP7A3 (default state).

2. To select P5V from baseboard -- Install RP7A1, RP7A2, RP7A3 and remove cable from the PDB.

Revision 1.0

NEBS 3.3 V Riser Board Intel® Carrier Grade Server TIGPT1U TPS

1/1 – Board 8 – Connector 10028958-X3184 Conn, PCI, 3.3 V, Low Profile 1 x 3 Connector – Molex 39-30-3036

Figure 6-1. Physical Layout of NEBS 3.3 V Riser Board

6.3 Connector Interface

Table 6-1 describes the common signals between the edge finger and the system baseboard.

Table 6-1. Riser Card Slot Pin-out Common Signals

Pin Side B Side A Pin Side B Side A

1 -12 V TRST_N 49 M66EN AD[09]

2 TCK +12 V 50 Ground Ground

3 Ground TMS 51 Ground Ground

4 TDO TDI 52 AD[08] C/BE[0]#

5 +5 V +5 V 53 AD[07] +3.3 V

6 +5 V INTA_N 54 +3.3 V AD[06]

7 INTB_N INTC_N 55 AD[05] AD[04]

8 INTD_N +5 V 56 AD[03] Ground

9 PRSNT1_N NC 57 Ground AD[02]

10 NC +3V_IO 58 AD[01] AD[00]

11 PRSNT2_N NC 59 +3V_IO +3V_IO

Connector Key Connector Key

14 NC 3.3 VAUX 62 +5 V +5 V

15 Ground RST#

16 CLK +3V_IO

17 Ground GNT_N 63 Reserved Ground

18 REQ_N Ground 64 Ground C/BE[7]#

19 +3V_IO PME# 65 C/BE[6]# C/BE[5]#

20 AD[31] AD[30] 66 C/BE[4]# VIO

21 AD[29] +3.3 V 67 Ground PAR64

22 Ground AD[28] 68 AD[63] AD[62]

60 ACK64# REQ64#

61 +5 V +5 V

Connector Key Connector Key

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board

Pin Side B Side A Pin Side B Side A

23 AD[27] AD[26] 69 AD[61] Ground

24 AD[25] Ground 70 +3V_IO AD[60]

25 +3.3 V AD[24] 71 AD[59] AD[58]

26 C/BE[3]# IDSEL 72 AD[57] Ground

27 AD[23] +3.3 V 73 Ground AD[56]

28 Ground AD[22] 74 AD[55] AD[54]

29 AD[21] AD[20] 75 AD[53] +3V_IO

30 AD[19] Ground 76 Ground AD[52]

31 +3.3 V AD[18] 77 AD[51] AD[50]

32 AD[17] AD[16] 78 AD[49] Ground

33 C/BE[2]# +3.3 V 79 +3V_IO AD[48]

34 Ground FRAME# 80 AD[47] AD[46]

35 IRDY# Ground 81 AD[45] Ground

36 +3.3 V TRDY# 82 Ground AD[44]

37 DEVSEL# Ground 83 AD[43] AD[42]

38 Ground STOP# 84 AD[41] +3V_IO

39 LOCK# +3.3 V 85 Ground AD[40]

40 PERR# SMBUS SCL 86 AD[39] AD[38]

41 +3.3 V SMBUS SDA 87 AD[37] Ground

42 SERR# Ground 88 +3V_IO AD[36]

43 +3.3 V PAR 89 AD[35] AD[34]

44 C/BE[1]# AD[15] 90 AD[33] Ground

45 AD[14] +3.3 V 91 Ground AD[32]

46 Ground AD[13] 92 NC NC

47 AD[12] AD[11] 93 NC Ground

48 AD[10] Ground 94 Ground NC

Table 6-2 describes the common signals between the PCI card connector and PCI edge fingers.

Table 6-2. PCI Card Connector Signals

Pin Side B Side A Pin Side B Side A

1 -12 V TRST_N 49 M66EN AD[09]

2 TCK +12 V 50 Ground Ground

3 Ground TMS 51 Ground Ground

4 TDO TDI 52 AD[08] C/BE[0]#

5 +5V_A +5V_A 53 AD[07] +3.3 V

6 +5V_A INTA_N 54 +3.3 V AD[06]

7 INTB_N INTC_N 55 AD[05] AD[04]

8 INTD_N +5V_A 56 AD[03] Ground

9 PRSNT1_N NC 57 Ground AD[02]

10 NC +3V_IO 58 AD[01] AD[00]

11 PRSNT2_N NC 59 +3V_IO +3V_IO

Connector Key Connector Key

14 NC 3.3 VAUX 62 +5V_A +5V_A

Revision 1.0

60 ACK64# REQ64#

61 +5V_A +5V_A

NEBS 3.3 V Riser Board Intel® Carrier Grade Server TIGPT1U TPS

Pin Side B Side A Pin Side B Side A

15 Ground RST#

16 CLK +3V_IO

17 Ground GNT_N 63 Reserved Ground

18 REQ_N Ground 64 Ground C/BE[7]#

19 +3V_IO PME# 65 C/BE[6]# C/BE[5]#

20 AD[31] AD[30] 66 C/BE[4]# VIO

21 AD[29] +3.3 V 67 Ground PAR64

22 Ground AD[28] 68 AD[63] AD[62]

23 AD[27] AD[26] 69 AD[61] Ground

24 AD[25] Ground 70 +3V_IO AD[60]

25 +3.3 V AD[24] 71 AD[59] AD[58]

26 C/BE[3]# IDSEL 72 AD[57] Ground

27 AD[23] +3.3 V 73 Ground AD[56]

28 Ground AD[22] 74 AD[55] AD[54]

29 AD[21] AD[20] 75 AD[53] +3V_IO

30 AD[19] Ground 76 Ground AD[52]

31 +3.3 V AD[18] 77 AD[51] AD[50]

32 AD[17] AD[16] 78 AD[49] Ground

33 C/BE[2]# +3.3 V 79 +3V_IO AD[48]

34 Ground FRAME# 80 AD[47] AD[46]

35 IRDY# Ground 81 AD[45] Ground

36 +3.3 V TRDY# 82 Ground AD[44]

37 DEVSEL# Ground 83 AD[43] AD[42]

38 Ground STOP# 84 AD[41] +3V_IO

39 LOCK# +3.3 V 85 Ground AD[40]

40 PERR# SMBUS SCL 86 AD[39] AD[38]

41 +3.3 V SMBUS SDA 87 AD[37] Ground

42 SERR# Ground 88 +3V_IO AD[36]

43 +3.3 V PAR 89 AD[35] AD[34]

44 C/BE[1]# AD[15] 90 AD[33] Ground

45 AD[14] +3.3 V 91 Ground AD[32]

46 Ground AD[13] 92 NC NC

47 AD[12] AD[11] 93 NC Ground

48 AD[10] Ground 94 Ground NC

Connector Key Connector Key

6.3.1 NEBS Riser Power Connector Pinout

The following table details the pin-out of the 1 x 3 NEBS Riser Power connector.

Table 6-3. 3-pin (1 x 3) NEBS Riser Power J1A1 Connector

Revision 1.0

Pin 1 x 3 Power Signal

1 +5V_A

2 GND

3 GND

Intel® Carrier Grade Server TIGPT1U TPS NEBS 3.3 V Riser Board

6.4 Electrical Specification

The PCI slot on the riser is limited to a maximum of 25 W total power from the installed PCI adapter. This maximum power per slot conforms to PCI Specification 2.2.

Revision 1.0

Midplane Board Intel® Carrier Grade Server TIGPT1U TPS

7. Midplane Board

This chapter describes the design and external interface of the Intel® TIGPT1U Midplane system board. Features of the midplane system board include:

• SCSI Hot Swap Hard Disk Drive SCA Connectors

• SCSI ULTRA320 Active Terminators

• SCSI Hard Disk Drive Power Management

7.1 Chapter Structure and Outline

Section 7.2: Introduction:

Provides an overview of the Intel

TIGPT1U midplane system board, showing primary components and their relationships, and physical board layout diagrams.

Section 7.3: Functional Description:

Provides a functional description of the midplane system board.

Section 7.4: Connector Interface:

Gives signal descriptions and the corresponding electrical parameters for each input and output of a given connector.

Section 7.5: Specifications:

Describes the electrical, environmental and mechanical specifications.

7.2 Introduction

The Intel® TIGPT1U midplane peripheral board provides all SCSI subsystem components necessary to interface to the hot plug SCSI SCA hard disk drives. This includes the SCSI hot swap hard disk drive SCA connectors, the SCSI ultra320 active terminators, the SCSI hard disk drive power management circuitry, and the SCSI contact sense circuit for detecting the presence of SCSI hot swap hard disk drives.

The following figure shows a functional block diagram of the midplane system board.

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Midplane Board

7.3 Functional Description

The SCSI subsystem on the midplane board is designed to give the end user support for two SCSI hot-plug hard drives. The design enables easy use and replacement of the SCSI hard drives without powering down the system. The following block diagram and functional description will explain how the midplane SCSI subsystem works.

7.3.1 Midplane System Board SCSI Subsystem Block Diagram

The block diagram in Figure 7-1 illustrates the general architecture of the midplane board SCSI subsystem. The physical and functional blocks of the SCSI subsystem are shown, with arrows representing buses and signals, and the blocks representing the functional parts of the SCSI subsystem.

68 Pin SCSI

connector

(from

Baseboard)

Mid Plane Power/Signal Connector

5 V

Internal LVD SCSI U320

12 V

SCSI Status Signals

12 V

SCA-2

Connector

Drive 2

SCSI Drive 2

Figure 7-1. Midplane System Board SCSI Subsystem Block Diagram

SCSI Drive 1

5 V

SCA-2

Drive 1

SCSI Status Signals

LVD Active Terminator

Revision 1.0

Midplane Board Intel® Carrier Grade Server TIGPT1U TPS

7.3.2 SCSI Bus

The midplane system board SCSI subsystem passes the SCSI bus from the SE7210TP1-E System Baseboard to the internal SCSI drives. The SCSI bus is Ultra 320 (SPI-4) capable. Single-Ended (SE) drives are not supported. SE drives should not be installed as the behavior of the drives is unpredictable and data corruption could result. The bus is comprised of 68 signals. The bus clock is 80 MHz. The 320 Mbytes data rate results from double transition (DT) data transfers on a two byte wide bus. The SCSI bus attaches to the SE7210TP1-E System Baseboard via a 68-pin SCSI connector.

320 Mbytes/s = 2 byte bus * 80 MHz clock * double transitions.

NOTE: The SCSI drives and SCSI controller on the SE7210TP1-E System Baseboard determine actual SCSI bus data rate.

7.3.3 SCA2 Connector Interlocks

The SCA2 connectors on the Midplane board (MPB) have interlocks. The mated1 and mated2 signals are used to provide Interlock notification for the SCSI device and Baseboard, respectively. Sensing and delay circuitry on the MPB will utilize the input mating signal from the drive to monitor hot insertion. Approximately 60 mS after hot insertion, the MPB activates its own mated acknowledgement signal to the drive to notify the drive that it can safely power-up.

7.3.4 Signal Descriptions

The following notations are used to describe the signal type, from the perspective of the FPIO SCSI subsystem:

Notation Description

I Input pin to the SCSI subsystem

O Output pin from the SCSI subsystem

I/O Bi-directional (input/output) pin

PWR Power Supply pin

The signal description also includes the type of buffer used for the particular signal:

Notation Description

LVD Low Voltage Differential SCSI

SE Standard Single Ended SCSI

TTL 5 V TTL signals

CMOS 5 V CMOS signals

3.3 V CMOS 3.3 V CMOS signals

Analog Typically a voltage reference or specialty power supply

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Midplane Board

7.3.4.1 LVD SCSI Connectors

The low voltage differential (LVD) connector carries signals between the midplane SCSI bus and internal SCSI drives through the SCSI SCA connectors. The LVD SCSI bus’s signals are driven by either the baseboard SCSI controller, the LVD/SE Transceiver, or the internal SCSI drives. Table 7-1 provides a description of each signal on the SCSI connectors.

Table 7-1. LVD SCSI Bus Signals – J2L1, J4A1, J8A1

Signal Type Driver Name and Description

DB_[15..0][P, N] I/O LVD/

DB_P0[P, N]

DB_P1[P, N]

DIFFSENSE I Analog

ATN_[P, N] I/O LVD/

BSY_[P, N] I/O LVD

ACK_[P, N] I/O LVD

RST_[P, N] I/O LVD

MSG_[P, N] I/O LVD

SEL_[P, N] I/O LVD

CD_[P, N] I/O LVD

REQ_[P, N] I/O LVD

IO_[P, N] I/O LVD

SCSI_ID O GND/OPEN

MATED [1,2] I/O TTL

I/O LVD/

SCSI Data Bus. These pins, with the DBP[1/0][P/N] pins form the bi-directional SCSI data bus.

SCSI Data Parity. These pins support parity on the SCSI bus. DBP0[P/N] supports parity for data [7..0]

DBP1[P/N] supports parity for data [15..8]

Differential Sense. This pin monitors the DIFFSENSE signal from the terminator. The voltage level determines the operating mode of the target devices on the SCSI bus. If the voltage on the DIFFSENSE signal is from –0.35 V to +0.5 V the mode will be SE. If it is from +0.7 V to 1.9 V the mode will be LVD.

SCSI Bus Attention. These pins are asserted by a SCSI device in initiator mode to alert the target that the initiator has a message to transfer.

SCSI Bus Busy. In SE mode, these pins are bi-directional and are asserted to gain use of the SCSI bus and to indicate that that SCSI bus is in use.

SCSI Bus Acknowledge. These pins are asserted by a SCSI device in initiator mode to acknowledge the target’s request for a data transfer.

SCSI Bus Reset. In SE mode, these pins are bi-directional and are asserted when all the SCSI devices attached to the SCSI bus need to be reset.

SCSI Bus Message Phase. These pins are asserted by a SCSI device in target mode to indicate the Message In or Message Out phase.

SCSI Bus Select. In SE mode, these pins are bidirectional and are asserted by the controller when attempting to select or reselect a SCSI device.

SCSI Bus Control/Data Phase. These pins are asserted or de-asserted by a SCSI device in target mode to indicate that control or data information is being transferred over the SCSI bus

SCSI Bus Request. These pins are asserted by a SCSI device in target mode to indicate that the target is requesting a data transfer over the SCSI bus.

SCSI Bus I/O Phase. These pins are asserted by a SCSI device in target mode to indicate the direction of data movement on the SCSI bus between the target and the initiator.

SCSI ID. Sets internal SCSI ID depending on slot. Drive 0 has SCSI address 0. Drive 1 has SCSI address 1.

SCSI MATED. Pins are used to determine if SCSI is present and has proper contact. See T10/1302D Annex C for additional information.

Revision 1.0

Midplane Board Intel® Carrier Grade Server TIGPT1U TPS

Signal Type Driver Name and Description

GND I/O PWR

P12V O PWR

P5V O PWR

Ground. These pins provide Secondary Ground reference.

+12-V supply. Max 1.5 A of continuous current. Max 5 amps peak current.

+5-V supply. Max 1.5 A of continuous current. Max 5

amps peak current.

7.4 Connector Interface

The following table shows all the connectors on the midplane system board, the interconnect used for each connector, and the destination for the interconnect. In addition, the first column references the location on the following figure of the connector location.

Table 7-2. Extended Front Panel System Board Connector Information

FPIO Board Connections

Loc Ref Des Function Interconnect Connects to

1 J9L1 2x6 Midplane Pwr/Sig Conn Main Power

(MP) Cable

2 J4A1 80 Pin SCA SCSI Conn N/A SCSI SCA Hard Disk Drive 3 J8A1 80 Pin SCA SCSI Conn N/A SCSI SCA Hard Disk Drive 4 J2L1 64 Pin SCSI Connector SCSI Cable Baseboard SCSI Connector

Extended Front Panel Pwr/Sig Conn

Figure 7-2. Extended Front Panel Board Connector Location

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Midplane Board

Table 7-3. Connector Housing Information

Conn Function Intel PN AML s/k/l/p* cnt hsn

J9L1 2x6 Midplane Pwr/Sig 691314-004 Molex 43045-1218 y/y/y/y tin 94V0 J4A1 80 Pin SCA SCSI Conn 626530-380 Fxconn LS2640X-C64 y/y/n/y 30u” 94V0 J8A1 80 Pin SCA SCSI Conn 626530-380 Fxconn LS2640X-C64 y/y/n/y 30u” 94V0 J2L1 68 Pin SCSI Connector 628525-069 Molex 15-87-0305 y/y/n/y 30u” 94V0 s/k/l/p* - shrouded/keyed/latching/polarized

Extended Front Panel Board

7.4.1 Midplane Power/Signal Connector Pinout

The following table details the pin-out of the midplane power/signal connector

Table 7-4. 12-pin (2 x 6) Midplane J9L1 Connector

Pin Midplane Signal Pin Midplane Signal

1 SCSI0_5V 2 SCSI0_12V

3 SCSI1_5V 4 SCSI1_12V

5 ACT_SCSI0_N 6 P5V

7 GND 8 GND

9 GND 10 SCSI0_MATED_N

11 ACT_SCSI1_N 12 SCSI1_MATED_N

7.4.2 Midplane SCSl Connector Pinout and SCSI ID settings

The 68 Pin SCSI connector pinout and the 80 Pin SCSI SCA connector will not be documented, since they conform to standard SCSI connector pinouts. The SCSI ID for each hard drive position is hardwired on the midplane board, so the use of jumper(s) to select a unique SCSI ID is not necessary. Hard disk drive position 1 is hardwired to SCSI ID 0 on the SCSI bus and hard disk drive position 2 is hardwired to SCSI ID 1 on the SCSI bus.

7.5 Specifications

7.5.1 Electrical Specifications

DC specifications for the Intel® TIGPT1U midplane system board power connectors are summarized in this section. All power rails must operate within +/- 5% voltage range.

Table 7-5. MPB Power Requirements

POWER

P12V_B P5V

CIRCUIT

FUNCTION TYP(mA) MAX(mA) TYP(mA) MAX(mA) TYP MAX

ACTIVE

TERMINATORS 22 27

SCSI

CONTROLLERS

TOTAL

CURRENT(mA)

POWER(W) 0.264 0.693 0.11 0.14175 0.374 0.83475

22 55

22 55 22 27 0.374 0.83475

DISSIPATION (Watts)

POWER DISSIPATION (Watts)

Revision 1.0

DC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

8. DC Power Subsystem

This chapter defines the features and functionality of the DC-input power supply. The DC-input power supply will be NEBS hardened, so NEBS certification of the Intel TIGPT1U will be performed with the Intel

TIGPT1U configured with a DC-input power supply.

Carrier Grade Server

8.1 Features

• 250 W output capability in full DC input voltage range

• Power good indication LED

• Predictive failure warning

• Cooling fans with multispeed capability

• Remote sense of 3.3 V, 5 V, and 12 Vdc outputs

• DC_OK circuitry for brown out protection and recovery

• Built-in overloading protection capability

• Onboard field replaceable unit (FRU) information

• I

C interface for server management functions

8.2 Chapter Structure and Outline

The information contained in this chapter is organized into three sections. The information is presented in a modular format, with numbered headings for each major topic and subtopic. The content of each section is summarized as follows:

Section 8.3: Introduction

Provides an overview of the Intel

TIGPT1U DC-input power subsystem.

Section 8.4: Mechanical Interface

Describes the form factor and connector pinouts.

Section 8.5: Electrical Requirements

Describes the electrical parameters for the inputs and outputs.

8.3 Introduction

The Intel® Carrier Grade Server TIGPT1U uses a –48 V DC-input switching power subsystem, which provides up to 250 W DC with –48 V DC-input and with current and remote sense regulation. All power supply module connectors accommodate “blind mating.” The power subsystem has four externally enabled outputs, and one +5 V standby output at 2.0 A. The +5 Vdc standby output is present whenever –48V DC power is applied. The four externally enabled outputs have the following ratings:

Table 8-1. 250 Watt DC-input Power Supply DC Output Ratings

+3.3 V at 16 A

+5 V at 12 A

+12V1 (baseboard) at 16 A with 17 A peak (combined +12V1 & +12V2 <= 18 A)

+12V2 (peripherals) at 10 A with 22 A peak (combined +12V1 & +12V2 <= 18 A)

-12 V at 0.5 A

+5VSB at 2.0 A

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS DC Power Subsystem

8.4 Mechanical Interface

8.4.1 Power Supply Cage Mechanical Outline

The Intel® Carrier Grade Server TIGPT1U’s C-input power supply mechanical outline and dimensions are shown below. The unit of measurement is millimeters.

Air Flow direction

Figure 8-1. Power Subsystem Enclosure Outline Drawing

Note: The power subsystem enclosure has dimensions of 40.0 mm (1.57”) H X 106.0 mm

(4.17”) W X 300.0 mm (11.8”) D.

Revision 1.0

DC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

8.4.2 DC Input Terminal Block Connector

The power input DC line connector is a 4-position terminal strip that accepts crimp ring terminals. The terminal strip has 0.325” (8.26 mm) center spacing and accepts 0.25” outside diameter (OD) crimp ring terminals for up to 14 AWG wire. In addition, a plastic protective cover is mounted over the terminal strip and fastened with 2 screws. This is shown in the following figure.

Figure 8-2. DC Input Terminal Block

The terminal block will accept standard terminal lugs size Newark stock # 81N1501 type CRST0-1406-HT that accept 14 AWG wire gauge. The width of the lug can be no larger than 0.25 inches.

Figure 8-3. Terminal Lug

Revision 1.0

Figure 8-4. Terminal Block Polarity

Intel® Carrier Grade Server TIGPT1U TPS DC Power Subsystem

8.4.3 DC Output Connector

The power supply provides card edge fingers, which mate to a connector located in the system. This is a blind mating type connector that connects the power supply’s output voltages and signals. The card edge fingers are located on the power supply as shown below. Card edge finger pin assignments are listed below. The figure below shows the card edge layout for the power supply. The connector located in the system is an AMP

Table 8-2. Edge Finger Pinout

* 1364999-1* or equivalent.

Description Pin# Pin# Description

-12 V

PWOK

Reserved Reserved

5VSB

Removed keying pin (NC)

Reserved Reserved Reserved Reserved

12V2

12V2 12V2

12V1 12V1

12V1 Ground Ground Ground Ground Ground Ground Ground Ground Ground

5 V 5 V 5 V

3.3 V

3.3 V Signals that can be defined as low true or high true use the following convention: signal# = low true Reserved pins are reserved for future use.

Note: All dimensions are in mm.

1 62 2 61 3 60 4 59 5 58 6 57 7 56 8 55

9 54 10 53 11 52

13 50 14 49 15 48 16 47 17 46 18 45 19 44 20 43 21 42 22 41 23 40 24 39 25 38 26 37 27 36 28 35 29 34 30 33

31 32

PSON#

SDA SCL

Reserved

ReturnS

Reserved Reserved

3.3VS

Reserved Reserved

12V2

keying position

12V2 12V2

12V1 12V1

12V1 Ground Ground Ground Ground Ground Ground Ground Ground Ground

5 V 5 V 5 V

3.3 V

Revision 1.0

DC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

Top View of Power Supply

Keying Notch

PSON#

SDA

3.3VS

Reserved

12V2

Reserved

12V1

5 V

3.3 V

No Connect

ReturnS

SCL

7.62 MIN

1.27 +/-0.05

9 spaces @ 2.54

29.03 +/-0.05

1.27

6.35 +/-0.05

1.07 +/-0.05

21.59 +/-0.05

6.35 +/-0.05

51.89 +/-0.05

6.35 +/-0.05

-12 V PWOK

5VSB

Reserved

12V2

Reserved

12V1

GROUND

5 V

3.3 V

Removed pin (NC)

Bottom view of power supply

1.6

0.38 x 45 2x

1.57 x 45 2x

5.08 MIN

Revision 1.0

Figure 8-5. Edge Finger Layout

Intel® Carrier Grade Server TIGPT1U TPS DC Power Subsystem

8.4.4 Power Supply Module LED Indicators

There is a single bi-color LED to indicate power supply status. When DC line is applied to the Power Supply Unit (PSU) and standby voltages are available the LED blinks green. The LED turns on solid green to indicate that all the power outputs are available. In case of over-current protection (OCP), over-voltage protection (OVP), over-temperature protection (OTP), fan failure, or under voltage, the LED turns on solid amber. Refer to the table below.

Table 8-3. LED Indicators

POWER SUPPLY CONDITION Power Supply LED

No DC line power to all PSU Off DC line present / Only Standby Outputs On Blink Green Power supply DC outputs ON and OK Green Power supply shutdown due to over current, over temperature, fan failure, over voltage, or under voltage. Power supply failed and DC line fuse open or other critical failure. Amber or Off

Amber

8.5 Electrical Requirements

8.5.1 DC Input Voltage Specification

The power supply is capable of supplying full rated output power over entire nominal –48/-60 VDC that covers the range from –38 VDC to –75 VDC. The power supply will automatically recover from DC power loss. The input voltage and current requirements for continuous operation are stated below. The power supply is able to start up under peak loading at any input voltage listed below.

Table 8-4. DC Input Rating

Parameter Min Nom Max Unit

Vin (-48 VDC)

Iin (-38 VDC)

Iin (-75 VDC)

- 38.0 - 48.0/-60.0 - 75.0

- 9.4

- 4.75

VDC

ADC

8.5.2 Dual DC Input

The power supply requires a dual power feed (A and B battery feed). The A and B feeds are interconnected via blocking diodes with 250 VDC minimum blocking voltage rating. The power supply provides four series diodes, one for each wire feed. The power supply also provides two internal slow-blow fuses, one on each –48 V input wire.

Revision 1.0

DC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

8.5.3 DC Output Current Specifications

The combined output power of all outputs can not exceed 250 W. Each output has a maximum and minimum current rating shown. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions.

Table 8-5. 250 W Load Ratings

Voltage Minimum

Continuous Load

+3.3 V 1.5 A

+5 V 1.0 A +12V1 1.5 A +12V2 0.5 A

-12 V 0 A

+5VSB 0.1 A

1. Maximum continuous total DC output power should not exceed 250 Watts.

2. Peak load on the combined 12 V output shall not exceed 22 A (while 12V1 shall not exceed 17 A pk).

3. Maximum continuous load on the combined 12 V output shall not exceed 18 A.

4. Peak total DC output power should not exceed 300 Watts.

5. Peak power and current loading shall be supported for a minimum of 12 seconds.

Maximum

Continuous Load

16 A

12 A 16 A (see note 3) 10 A (see note 3)

0.5 A

2.0 A

Peak Load Max Continuous Wattage

52.8 W

60.0 W

22.0 A

See note 2

6.0 W

10.0 W Total = 250 W = see note 1

216.0 W

(see note 3)

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS AC Power Subsystem

9. AC Power Subsystem

This chapter defines the features and functionality of the AC-input switching power subsystem. The AC power supply will not be NEBS hardened, so NEBS certification of an Intel

Carrier

Grade Server TIGPT1U configured with an AC power subsystem will not be possible.

9.1 Features

• 250 W output capability in full AC input voltage range

• Power good indication LED

• Predictive failure warning

• Cooling fans with multispeed capability

• Remote sense of 3.3 V, 5 V, and 12 Vdc outputs

• AC_OK circuitry for brown out protection and recovery

• Built-in overloading protection capability

• Onboard field replaceable unit (FRU) information

• I

C interface for server management functions

9.2 Chapter Structure and Outline

Section 9.3: Introduction

Provides an overview of the Intel

TIGPT1U AC-input power subsystem.

Section 9.4: Mechanical Interface

Describes the form factor and connector pin-outs.

Section 9.5: Electrical Requirements

Describes the electrical parameters for the inputs and outputs.

9.3 Introduction

The Intel® Carrier Grade Server TIGPT1U uses an AC input switching power subsystem, which provides up to 250 W DC with 110/220 Voltage of Alternating Current (VAC) input and with current and remote sense regulation. All power supply connectors, including AC and DC connectors, accommodate “blind mating.” The power subsystem has four externally enabled outputs, and one +5 V standby output at 2.0 A. The +5 Vdc standby output is present whenever 110/220 VAC power is applied. The four externally enabled outputs have the following ratings:

Table 9-1. 250 Watt AC-input Power Supply DC Output Ratings

+3.3 V at 16 A

+5 V at 12 A

+12V1 (baseboard) at 16 A with 17 A peak (combined +12V1 & +12V2 <= 18 A)

+12V2 (peripherals) at 10 A with 22 A peak (combined +12V1 & +12V2 <= 18 A)

-12 V at 0.5 A

+5VSB at 2.0 A

Revision 1.0

AC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

9.4 Mechanical Interface

9.4.1 Power Supply Cage Mechanical Outline

The Intel® TIGPT1U’s AC-input power supply mechanical outline and dimensions are shown below. The unit of measurement is millimeters.

ir Flow direction

Figure 9-1. Power Subsystem Enclosure Outline Drawing

Note: The power subsystem enclosure has dimensions of 40.0 mm (1.57”) H X 106.0 mm

(4.17”) W X 300.0 mm (11.8”) D.

9.4.2 AC Input Connector

The AC input connector shall be an International Electrotechnical Commission (IEC) 320 C-14 power inlet. This inlet is rated for 15 A/250 VAC.

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS AC Power Subsystem

9.4.3 DC Output Connector

Table 9-2. Edge Finger Pinout

Description Pin# Pin# Description

-12 V

PWOK

Reserved Reserved

5VSB

Removed keying pin (NC)

Reserved Reserved Reserved Reserved

12V2

12V2 12V2

12V1 12V1

12V1 Ground Ground Ground Ground Ground Ground Ground Ground Ground

5 V 5 V 5 V

3.3 V

3.3 V Signals that can be defined as low true or high true use the following convention: signal# = low true Reserved pins are reserved for future use.

Note: All dimensions are in mm.

1 62 2 61 3 60 4 59 5 58 6 57 7 56 8 55

9 54 10 53 11 52

13 50 14 49 15 48 16 47 17 46 18 45 19 44 20 43 21 42 22 41 23 40 24 39 25 38 26 37 27 36 28 35 29 34 30 33

31 32

PSON#

SDA SCL

Reserved

ReturnS

Reserved Reserved

3.3VS

Reserved Reserved

12V2

keying position

12V2 12V2

12V1 12V1

12V1 Ground Ground Ground Ground Ground Ground Ground Ground Ground

5 V 5 V 5 V

3.3 V

Revision 1.0

AC Power Subsystem Intel® Carrier Grade Server TIGPT1U TPS

Top View of Power Supply

Keying Notch

PSON#

SDA

3.3VS

Reserved

12 V2

Reserved

12 V1

5 V

3.3 V

No Connect

ReturnS

SCL

7.62 MIN

1.27 +/-0.05

9 spaces @ 2.54

29.03 +/-0.05

1.27

6.35 +/-0.05

1.07 +/-0.05

21.59 +/-0.05

6.35 +/-0.05

51.89 +/-0.05

6.35 +/-0.05

-12 V PWOK

5VSB

Reserved

12V2

Reserved

12V1

GROUND

5 V

3.3 V

Removed pin (NC)

Bottom view of power supply

1.6

0.38 x 45 2x

1.57 x 45 2x

5.08 MIN

Revision 1.0

Figure 9-2. Edge Finger Layout

Intel® Carrier Grade Server TIGPT1U TPS AC Power Subsystem

9.4.4 Power Supply Module LED Indicators

There is a single bi-color LED to indicate power supply status. When AC is applied to the PSU and standby voltages are available the LED blinks green. The LED turns on solid green to indicate that all the power outputs are available. In case of OCP or OVP or OTP or fan failure or under voltage the LED should turn ON solid amber. Refer to the following table for conditions of the LEDs.

Table 9-3. LED Indicators

POWER SUPPLY CONDITION Power Supply LED

No AC power to all PSU Off AC present / Only Standby Outputs On Blink Green Power supply DC outputs ON and OK Green Power supply shutdown due to over current, over temperature, fan failure, over voltage, or under voltage. Power supply failed and AC fuse open or other critical failure. Amber or Off

Amber

9.5 Electrical Requirements

9.5.1 AC Input Voltage Specification

The power supply will operate within all specified limits over the following input voltage ranges. Harmonic distortion of up to 10% THD will not cause the power supply to go out of specified limits. The power supply shall power off if the AC input is less than 70 VAC. The power supply shall operate properly at 85 VAC input voltage to guarantee proper design margins.

Table 9-4. AC Input Rating

PARAMETER MIN RATED MAX Max Input Current Max Rated Input Current

Voltage (110) 90 V Voltage (220)

Frequency 47 Hz 63 Hz

1 Maximum input current at low input voltage range shall be measured at the lowest input voltage which the power supply

continues to operate (70 VAC ≤ Vin < 85 VAC). 2 Maximum input current at high input voltage range shall be measured at 180 VAC. 3 This is not intended to be used for determining agency input current markings.

Maximum rated input current is measured at 100 VAC and 200 VAC.

rms

180 V

100-127 V

200-240 V

rms

140 V

rms

264 V

rms

5.7 A

rms

2.3 A

rms

1,3

3.6 A

rms

2,3

rms

1.8 A

rms

Revision 1.0

Regulatory Specifications Intel® Carrier Grade Server TIGPT1U TPS

10. Regulatory Specifications

The Intel® Carrier Grade Server TIGPT1U meets the specifications and regulations for safety and EMC defined in this chapter.

10.1 Safety Compliance

USA/Canada

Europe

International

UL 60950, 3rd Edition/CSA 22.2, No. 60950-0, 3rd Edition

Low Voltage Directive, 73/23/EEC

TUV/GS to EN60950 3

CB Certificate and Report to IEC 950, 3 SEC) 207/94 and all international deviations

Edition

10.2 Electromagnetic Compatibility

USA

Canada

Europe

Australia/New Zealand

Japan

Taiwan

Korea

China

Russia

International

FCC 47 CFR Parts 2 and 15, Verified Class A Limit

IC ICES-003 Class A Limit

EMC Directive, 89/336/EEC

EN55022, Class A Limit, Radiated & Conducted Emissions

EN55024 Immunity Characteristics for ITE

EN61000-4-2 ESD Immunity (level 2 contact discharge, level 3 air discharge)

EN61000-4-3 Radiated Immunity (level 2)

EN61000-4-4 Electrical Fast Transient (level 2)

EN61000-4-5 Surge

EN61000-4-6 Conducted RF

EN61000-4-8 Power Frequency Magnetic Fields

EN61000-4-11 Voltage Fluctuations and Short Interrupts

EN61000-3-2 Harmonic Currents

EN61000-3-3 Voltage Flicker

AS/NZS 3548, Class A Limit

VCCI Class A ITE (CISPR 22, Class A Limit)

IEC 1000-3-2; Harmonic Currents

BSMI Approval, CNS 13438, Class A

RRL Approval, Class A

CCC Approval

Gost Approval

CISPR 22, Class A Limit

Edition including EMKO-TSE (74-

10.3 CE Mark

The CE marking on this product indicates that it is in compliance with the European Union’s EMC Directive 89/336/EEC, and Low Voltage Directive, 73/23/EEC.

Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Regulatory Specifications

10.4 NEBS Compliance (DC Input Only)

The Intel® TIGPT1U with DC input is compliant with the following NEBS specifications:

• NEBS GR-63-CORE, Issue 2 – Physical Protection

• NEBS GR-1089-CORE, Issue 3 – Electromagnetic Compatibility and Electrical Safety

10.5 ETSI Standards Compliance (DC Input Only)

The Intel® TIGPT1U with DC input is compliant with the following ETSI specifications:

• ETSI EN 300 386 EMC requirements for Telecom Equip.

• ETS 300-019-2-1 Storage Tests, Class T1.2

• ETS 300-019-2-2 Transportation Tests, Class T2.3

• ETS 300-019-2-3 Operational Tests, Class T3.2

• ETS 753 Acoustic Noise

Revision 1.0

Appendix A: Glossary Intel® Carrier Grade Server TIGPT1U TPS

Appendix A: Glossary

This appendix contains important acronyms and terms used in the preceding chapters.

Term Definition

A, Amp Ampere

A/µs Amps per microsecond

AC Alternating current

ACPI Advanced Configuration and Power Interface

ANSI American National Standards Institute

APIC Advanced Programmable Interrupt Controller

ASIC Application specific integrated circuit

AWG American wire gauge

BIOS Basic input/output system

BMC Baseboard management controller

Bridge Circuitry that connects one computer bus to another

Byte 8-bit quantity

C Centigrade

CE Community European

CFM Cubic feet per minute

CISPR International Special Committee on Radio Interference

CSA Canadian Standards Organization

CTS Clear to send

DAT Digital audio tape

dB Decibel

dBA Acoustic decibel

DC Direct current

DIMM Dual inline memory module

DMI Desktop management interface

DOS Disk operating system

DRAM Dynamic random access memory

DSR Data set ready

DTR Data terminal ready

DWORD Double word - 32-bit quantity

ECC Error checking and correcting

EEPROM Electrical erasable programmable read-only memory

EMC Electromagnetic compatibility

EMI Electromagnetic interference

EMP Emergency management port

EN European Standard (Norme Européenne or Europäische Norm)

EPS External product specification

ESCD Extended system configuration data

ESD Electrostatic discharge

ESR Equivalent series resistance

F Fahrenheit

Intel Secret Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Appendix A: Glossary

Term Definition

FCC Federal Communications Commission

FFC Flexible flat connector

Flash ROM EEPROM

FPC Front panel controller

FRB Fault resilient booting

FRU Field replaceable unit

G Acceleration in gravity units, 1G = 980665 m/s2

GB Gigabyte - 1024 MB

GND Ground

GPIO General purpose input/output

Grms Root mean square of acceleration in gravity units

GUI Graphical user interface

HDD Hard disk drive

HPIB Hot-plug indicator board

HSC Hot-swap controller

Hz Hertz – 1 cycle/second

I/O Input/output

I2C* Inter-integrated circuit bus

ICMB Intelligent Chassis Management Bus

IDE Integrated drive electronics

IEC International Electrotechnical Commission

IEEE Institute of Electrical and Electronics Engineers

IFLASH Utility to update Flash EEPROM

IMB Intelligent management bus

IPMB Intelligent Platform Management Bus

IPMI Intelligent Platform Management Initiative

IRQ Interrupt request line

ITE Information technology equipment

ITP In-target probe

JAE Japan Aviation Electronics

KB Kilobyte - 1024 bytes

kV Killivolt – 1,000 volts

L2 Second-level cache

LAN Local area network

LED Light-emitting diode

LVDS Low voltage differential SCSI

mA Milliamp

MB Megabyte - 1024 KB

MEC Memory expansion card

mm Millimeter

MPS Multiprocessor specification

MTTR Mean time to repair

mΩ

NEMKO Norges Elektriske Materiellkontroll (Norwegian Board of Testing and Approval of Electrical

Milliohm

Equipment)

Revision 1.0

Appendix A: Glossary Intel® Carrier Grade Server TIGPT1U TPS

Term Definition

NIC Network interface card

NMI Nonmaskable interrupt

NWPA NetWare* Peripheral Architecture

ODI Open data-link interface

OEM Original equipment manufacturer

OPROM Option ROM (expansion BIOS for a peripheral)

OS Operating system

OTP Over-temperature protection

OVP Over-voltage protection

PC-100 Collection of specifications for 100 MHz memory modules

PCB Printed circuit board

PCI Peripheral component interconnect

PHP PCI hot-plug

PID Programmable interrupt device

PIRQ PCI interrupt request line

PMM POST memory manager

PnP Plug and play

POST Power-on Self Test

PSU Power supply unit

PVC Polyvinyl chloride

PWM Pulse width modulation

RAS Reliability, availability, and serviceability

RIA Ring indicator

RPM Rotations per minute

RTS Request to send

SAF-TE SCSI Accessed Fault-Tolerant Enclosures

SCA Single connector attachment

SCL Serial clock

SCSI Small Computer System Interface

SDR Sensor data records

SDRAM Synchronous dynamic RAM

SEC Single edge connector

SEL System event log

SELV Safety extra low voltage

SEMKO Sverge Elektriske Materiellkontroll (Swedish Board of Testing and Approval of Electrical

Equipment)

SGRAM Synchronous graphics RAM

SM Server management

SMBIOS System management BIOS

SMBus Subset of I2C bus/protocol (developed by Intel)

SMI System management interrupt

SMM Server management mode

SMP Symmetric multiprocessing

SMRAM System management RAM

SMS Server management software

Intel Secret Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Appendix A: Glossary

Term Definition

SPD Serial presence detect

SSI Server system infrastructure

TUV Technischer Uberwachungs-Verein (A safety testing laboratory with headquarters in Germany)

UL Underwriters Laboratories, Inc.

USB Universal Serial Bus

UV Under-voltage

V Volt

VA Volt-amps (volts multiplied by amps)

Vac Volts alternating current

VCCI Voluntary Control Council for Interference

Vdc Volts direct current

VDE Verband Deutscher Electrotechniker (German Institute of Electrical Engineers)

VGA Video graphics array

VRM Voltage regulator module

VSB Voltage standby

W Watt

WfM Wired for Management

Word A 16-bit quantity

Ω

µF

µs

Ohm

Microfarad

Microsecond

Revision 1.0

Appendix B: Reference Documents Intel® Carrier Grade Server TIGPT1U TPS

Appendix B: Reference Documents

Refer to the following documents for additional information:

ACPI

• Advanced Configuration And Power Interface Specification, Revision 1.0b,

http://www.teleport.com/~acpi/

AMI* BIOS

• http://www.ami.com/support/doc/Server.pdf

Boot

• BIOS Boot Specification, Version 1.01, http://www.ptltd.com/techs/specs.html.

• El Torito CD-ROM Boot Specification, Version1.0,

http://www.ptltd.com/techs/specs.html

DMI

• Desktop Management Interface (DMI) Specification, Version 2.0s, Desktop Management

Task Force, Inc., http://www.dmtf.org/spec/dmis.html

ESCD

• Extended System Configuration Data Specification, Version 1.02a,

http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM

Ethernet

• Intel 82547EI Gigabit Ehternet Controller Datasheet, Intel Corporation,

http://www.intel.com/design/network/products/lan/controllers/82547ei.htm

• Intel 82541EI Gigabit Ehternet Controller Datasheet, Intel Corporation,

http://www.intel.com/design/network/products/lan/controllers/82541gi.htm

Flash

• Intel 5 VOLT FlashFile™ Memory (28F008SA x8) Datasheet, December 1998, Intel

Corporation, Number 290429-008,

http://developer.intel.com/design/flcomp/datashts/290429.htm

• Intelligent Input/Output (I

Group, http://www.Intelligent-IO.com

Intel Secret Revision 1.0

O) Architecture Specification, Revision 1.0, I2O Special Interest

Intel® Carrier Grade Server TIGPT1U TPS Appendix B: Reference Documents

MPS

• MultiProcessor Specification, Version 1.4, Intel Corporation,

http://www-techdoc.intel.com/design/intarch/manuals/242016.htm

PC133 SDRAM

• PC SDRAM Registered DIMM Specification, Revision 1.2, Intel Corporation,

http://developer.intel.com/technology/memory/

• PC SDRAM Specification, Revision 1.63, Intel Corporation,

http://developer.intel.com/technology/memory/.

• PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2A, Intel

Corporation, http://developer.intel.com/technology/memory/

PCI

• PCI Bus Power Management Interface Specification, Revision 1.1, PCI Special Interest

Group, http://www.pcisig.com/

• PCI Local Bus Specification, Revision 2.1, PCI Special Interest Group,

http://www.pcisig.com/

• PCI Hot-plug Specification, Revision 1.0, PCI Special Interest Group,

http://www.pcisig.com/

• PCI Hot-plug Application and Design, Alan Goodrum, ISBN 0-929392-60-4.

• Compaq PCI Hot-Plug Megacell Specification.

PID

• Programmable Interrupt Device External Product Specification, Revision 1.1, Intel

Corporation, Document number OR4-680777.

Plug and Play

• Plug and Play BIOS Specification, Version 1.0a,

http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM

• Clarification to Plug and Play BIOS Specification, Version 1.0a,

http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM

• Plug and Play ISA Specification, Version 1.0a,

http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM

• Clarification to Plug and Play ISA Specification, Version 1.0a,

http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM

PMM

• POST Memory Manager Specification, Version 1.01,

http://www.ptltd.com/techs/specs.html

Revision 1.0

Appendix B: Reference Documents Intel® Carrier Grade Server TIGPT1U TPS

Power Supply

• TBD

Regulatory

• CISPR 22: Limits and Methods of Measurement of Radio Interference Characteristics of

Information Technology Equipment, 2

• CFR 47: Federal Communications Commission (FCC) Compliance with the Class A

Edition.

Limits for Computing Devices (FCC Mark), Part 2 & 15.

• ANSI C63.4: American National Standard for Methods of Measurement of Radio-Noise

Emissions from Low Voltage Electronic Equipment in the Range of 9 kHz to 40 GHz for

EMI Testing, 1992.

• CISPR 24: Information Technology Equipment - Immunity Characteristics Limits and

Methods of Measurement, 1

• ICES-003: Canadian Radio Interference Regulations for Digital Apparatus.

• EN 61000-3-2: Electromagnetic Compatibility (EMC) Part 3: Limits - Section 2: Limits for

Edition.

Harmonic Current Emissions.

• JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-

Use Equipment.

SCSI

• Adaptec* AIC-7899* Dual-Channel PCI-to-Ultra 320/M SCSI Single-Chip Host Adapter

Specification, http://www.adaptec.com/

Server Management

• Emergency Management Port v1.0 Interface External Product Specification, Revision

0.83, Intel Corporation.

• Intelligent Platform Management Interface (IPMI) Specification, Version 1.0, Revision

1.1, Intel Corporation, http://developer.intel.com/design/servers/ipmi/spec.htm

SMBIOS

• System Management BIOS Reference Specification, Version 2.3,

http://www.ptltd.com/techs/specs.html

Super I/O

• National* PC97317* SuperI/O Plug and Play Compatible Chip with ACPI-Compliant

Controller/Extender, http://www.national.com/pf/PC/PC97317.html

USB

• Universal Serial Bus Specification, Revision 2.0, http://www.usb.org/developers.

VGA

• ATI* RAGE* IIC Technical Reference Manual.

• ATI-264 VT4* Graphics Controller Technical Reference Manual.

Intel Secret Revision 1.0

Intel® Carrier Grade Server TIGPT1U TPS Appendix B: Reference Documents

Wired for Management

• Wired for Management (WfM) Baseline Specifications, Version 2.0, Intel Corporation,

http://developer.intel.com/ial/wfm/wfmspecs.htm

Windows

• Hardware Design Guide for Microsoft* Windows NT Server*, Version 2.0,

http://www.microsoft.com/HWDEV/serverdg.htm

Miscellaneous

• Intel Environmental Standards Handbook, June 1999, Intel Document No. 662394-04.

• VRM 8.3 DC-DC Converter Specification.

• VRM 8.4 DC-DC Converter Specification.

Revision 1.0

Intel TIGPT1U - Carrier Grade Server Specification

Specifications and Main Features

Frequently Asked Questions

User Manual