Intel TIGI2U user guide

Intel® Carrier Grade Server TIGI2U User Guide

A Guide for Technically Qualified Assemblers of Intel Subassemblies/Products

Order Number: D15006-003

Identified

Disclaimers

Disclaimer

Information in this document is provided in connection with Intel otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not designed, intended or authorized for use in any medical, life saving, or life sustaining applications or for any other application in which the failure of the Intel product could create a situation where personal injury or death may occur. Intel may make changes to specifications and product descriptions at any time, without notice.

Intel server boards contain a number of high-density VLSI and power delivery components that need adequate airflow for cooling. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation can not be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or nonoperating limits.

Intel, Intel Pentium, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

products. No license, express or implied, by estoppel or

* Other names and brands may be claimed as the property of others.

Carrier Grade Server TIGI2U User Guide

Intel

Preface

About this Manual

Thank you for purchasing and using the Intel® Carrier Grade Server TIGI2U (Telecom Industrial Grade Intel

Xeon™ processor 2U Server).

This manual is for system technicians who are responsible for troubleshooting, upgrading, and repairing this Carrier Grade Server. This document provides a brief overview of the features of the board/chassis, a list of accessories or other components you may need, troubleshooting information, and instructions on how to add and replace components on the Intel

Carrier Grade Server TIGI2U. For the latest version of this manual, refer to

http://support.intel.com/support/motherboards/server/TIGI2U.

Manual Organization

Chapter 1 provides a brief overview of the Carrier Grade Server TIGI2U. In this chapter, you will find a list of the server board features, chassis features, photos of the product, and product diagrams to help you identify components and their locations.

Chapter 2 provides instructions on adding and replacing components. Use this chapter for step-by-step instructions and diagrams for installing or replacing components such as the memory, processor, front panel board, the battery, and other components.

Chapter 3 provides instructions on using the utilities that are shipped with the board or that may be required to update the system. This includes how to navigate through the BIOS (Basic Input/Output System) Setup screens, how to perform a BIOS update, and how to reset the password or CMOS (Complementary Metal Oxide Semiconductor). Information about the specific BIOS settings and screens is available in the Intel TIGI2U Technical Product Specification. See “

Additional Information and Software” for a

link to the Technical Product Specification.

Server Board

Chapter 4 provides troubleshooting information. In this chapter, you will find BIOS error messages and POST (Power-on Self Test) code messages. You will also find suggestions for performing troubleshooting activities to identify the source of a problem.

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Preface

What Your Platform Includes

Your Intel® Carrier Grade Server TIGI2U includes the following components:

 One Intel  One 2U rack-mount chassis  Two hard disk drive carriers  One bracket for installing a CD ROM or DVD-ROM drive  One 600 W SSI (Server System Infrastructure) PFC (Power Factor Correction)  Four-fan assembly for cooling the processor, DIMMs (Dual Inline Memory Modules),

PCI slot and other internal components

 One processor air duct  Front panel I/O board  Cables and connectors  CD-ROM drive  One IMM Advanced Module

See the Intel® Carrier Grade Server TIGI2U Hardware Reference Guide for initial installation instructions.

Server Board SE7502JR2

Product Accessories

You may need or want to purchase one or more of the following accessory items for your server:

 One Intel  One processor heat sink  DDR2-400 memory DIMMs  Hard disk drives (HDDs)  PCI (Peripheral Component Interconnect) add-in card  Rack mount kit  Power cord (If not included with the platform. This product ships with a power cord in

North America only.)

For information about the accessories, memory, processors, and third-party hardware that has been tested and can be used with your board, and for ordering information for Intel products, see

Xeon™ Processor: 3.2 GHz with an 800 MHz system bus

http://support.intel.com/support/motherboards/server/TIGI2U/compat.htm.

Carrier Grade Server TIGI2U User Guide

Intel

Preface

Additional Information and Software

If you need more information about this product or information about the accessories that can be used with this Carrier Grade Server, go to

http://support.intel.com/support/motherboards/server/TIGI2U/index.htm

 In-depth technical information about the server board included with this Carrier

Grade Server, including BIOS settings and chipset information

 The latest product information  Accessories or other Intel server products  Hardware (peripheral boards, adapter cards) and operating systems that have been

tested with this product

 DIMMs that have been tested with this product  The power budget for this product  Software to manage your Carrier Grade Server  Diagnostics testing software  Firmware and BIOS updates  System drivers

Safety Information

WARNING

Although you may be using this guide or another resource as a reference, before working with your server product pay close attention to the safety instructions. You must adhere to the assembly instructions in this guide to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this guide. Use of other products / components will void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold.

WARNING

All LAN ports of the equipment are considered Type 2 or Type 4 intrabuilding ports as described in NEBS GR-1089-CORE, Issue 4. The LAN ports are suitable for connection to intra-building or unexposed wiring or cabling only. The LAN ports of the equipment MUST NOT be metalically connected to interfaces that connect to the OSP or its wiring. The addition of primary protectors is not sufficient protection in order to connect these interfaces metalically to OSP wiring. All LAN ports must be installed with shielded cabling which must be grounded at both ends.

Carrier Grade Server TIGI2U User Guide

Intel

Preface

Emissions Disclaimer

To ensure EMC (Electromagnetic Compatibility) compliance with your local regional rules and regulations, the final configuration of your end system product may require additional EMC compliance testing. For more information, please contact your local Intel Representative.

See “

Regulatory and Integration Information” for product Safety and EMC regulatory

compliance information. This is an FCC (Federal Communications Commission) Class A device.

Intended Uses

This product was evaluated as Information Technology Equipment (ITE), which may be installed in Central Offices, Telecommunication Centers, offices, schools, computer rooms, and similar commercial type locations where the National Electrical Code (NEC) applies. The suitability of this product for other product categories and environments (medical, industrial, OSP telecommunications, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.

WARNING

Anchor the equipment rack: The equipment rack must be anchored to

an unmovable support to prevent it from falling over when one or

more servers are extended in front of the rack on slides. You must

also consider the weight of any other device installed in the rack. A

crush hazard exists should the rack tilt forward which could cause

serious injury.

If AC power supplies are installed:

Mains AC power disconnect: The AC power cord(s) is considered the

mains disconnect for the server and must be readily accessible when

installed. If the individual server power cord(s) will not be readily

accessible for disconnection then you are responsible for installing an

AC power disconnect for the entire rack unit. This main disconnect

must be readily accessible, and it must be labeled as controlling

power to the entire rack, not just to the server(s).

Grounding the rack installation: To avoid the potential for an electrical

shock hazard, you must include a third wire safety ground conductor

with the rack installation. If the server power cord is plugged into an

AC outlet that is part of the rack, then you must provide proper

grounding for the rack itself. If the server power cord is plugged into a

wall AC outlet, the safety ground conductor in the power cord provides

proper grounding only for the server. You must provide additional,

proper grounding for the rack and other devices installed in it.

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Preface

Overcurrent protection: The server is designed for an AC line voltage

source with up to 20 amperes of overcurrent protection per cord feed.

If the power system for the equipment rack is installed on a branch

circuit with more than 20 amperes of protection, you must provide

supplemental protection for the server. The overall current rating of a

configured server is less than 6 amperes. It is intended that an

external Surge Protective Device (SPD) will be utilized at the AC

power service for the equipment.

If DC power supplies are installed:

Connection with a DC (Direct Current) source should only be

performed by trained service personnel. The server with DC input is to

be installed in a Restricted Access Location in accordance with

articles 110-16, 110-17, and 110-18 of the National Electric Code,

ANSI/NFPA 70. The DC source must be electrically isolated by double

or reinforced insulation from any hazardous AC source. The DC

source must be capable of providing up to 600 Watts of continuous

power per feed pair.

Main DC power disconnect: You are responsible for installing a

properly rated DC power disconnect for the server system. This mains

disconnect must be readily accessible, and it must be labeled as

controlling power to the server. The circuit breaker of a centralized DC

power system may be used as a disconnect device when easily

accessible and should be rated no more than 10 amps.

Grounding the server: To avoid the potential for an electrical shock

hazard, you must reliably connect an earth grounding conductor to the

server. The earth grounding conductor must be a minimum 14AWG

connected to the earth ground stud(s) on the rear of the server. The

safety ground conductor should be connected to the chassis stud with

a Listed closed two-hole crimp terminal having 5/8 inch pitch. The

nuts on the chassis earth ground studs should be installed with a

10 in/lbs torque. The safety ground conductor provides proper

grounding only for the server. You must provide additional, proper

grounding for the rack and other devices installed in it. The battery

return input terminal is designed as an isolated DC return (DC-I) from

the frame earth ground per NEBS GR-1089-CORE.

Overcurrent protection: Overcurrent protection circuit breakers must

be provided as part of each host equipment rack and must be

incorporated in the field wiring between the DC source and the server.

The branch circuit protection shall be rated minimum 75Vdc, 10 A

maximum per feed pair. If the DC power system for the equipment

rack is installed with more than 10 amperes of protection, you must

provide supplemental protection for the server. The overall current

rating of a server configured is 10 amperes.

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Preface

WARNING

Do not attempt to modify or use an AC power cordset that is not the

exact type required. You must use a power cordset that meets the

following criteria:

• Rating: In the U.S. and Canada, cords must be UL (Underwriters Laboratories, Inc.) Listed/CSA (Canadian Standards Organization) Certified type SJT, 18-3 AWG (American Wire Gauge). Outside of the U.S. and Canada, cords must be flexible harmonized (<HAR>) or VDE (Verband Deutscher Electrotechniker, German Institute of Electrical Engineers) certified cord with 3 x 0.75 mm conductors rated 250 VAC (Volts Alternating Current).

• Connector, wall outlet end: Cords must be terminated in grounding-type male plug designed for use in your region. The connector must have certification marks showing certification by an agency acceptable in your region and for U.S. must be Listed and rated 125% of overall current rating of the server.

• Connector, server end: The connectors that plug into the AC receptacle on the server must be an approved IEC (International Electrotechnical Commission) 320, sheet C13, type female connector.

• Cord length and flexibility: Cords must be less than 4.5 meters (14.76 feet) long.

CAUTION

Temperature: The temperature, in which the server operates when installed in an equipment rack, must not go below 5 °C (41 °F) or rise above 40 °C (104 °F). Extreme fluctuations in temperature can cause a variety of problems in your server.

Ventilation: The equipment rack must provide sufficient airflow to the front of the server to maintain proper cooling. The rack must also include ventilation sufficient to exhaust a maximum of 1023 BTU's (British Thermal Units) per hour for the server. The rack selected and the ventilation provided must be suitable to the environment in which the server will be used.

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Preface

Safety Cautions

Read all caution and safety statements in this document before performing any of the instructions. See also Intel Server Boards and Server Chassis Safety Information on the Resource CD and/or at

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Wichtige Sicherheitshinweise

Lesen Sie zunächst sämtliche Warn- und Sicherheitshinweise in diesem Dokument, bevor Sie eine der Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise zu Intel-Serverplatinen und -Servergehäusen auf der Ressourcen-CD oder unter

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

重要安全指导

在执行任何指令之前，请阅读本文档中的所有注意事项及安全声明。参见 Resource CD（资源光盘）和/或

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm 上的

Server Boards and Server Chassis Safety Information

（《Intel

Intel

服务器主板与服务器机箱安全信息》）。

Consignes de sécurité

Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce document avant de suivre toute instruction. Consultez Intel Server Boards and Server Chassis Safety Information sur le CD Resource CD ou bien rendez-vous sur le site

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Instrucciones de seguridad importantes

Lea todas las declaraciones de seguridad y precaución de este documento antes de realizar cualquiera de las instrucciones. Vea Intel Server Boards and Server Chassis Safety Information en el CD Resource y/o en

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Carrier Grade Server TIGI2U User Guide

Intel

Contents

Preface .................................................................................................................iii

Intel® Carrier Grade Server TIGI2U Features .................................................. 16

Server Platform Components................................................................................................19

Server Platform Back Panel..................................................................................................20

Server Platform Front Panel..................................................................................................21

Server Platform Peripherals..................................................................................................22

Server Board Connector and Component Locations ............................................................23

Configuration Jumpers..........................................................................................................24

Front Panel IO (FPIO) System Board ...................................................................................25

Features.......................................................................................................................25

FPIO SCSI Subsystem Status LEDs............................................................................25

Peripheral Bay.......................................................................................................................26

Hard Disk Drives...................................................................................................................26

Interconnect System (SysCon) Board...................................................................................26

Power Supply........................................................................................................................27

System Cooling.....................................................................................................................28

Hardware Requirements.......................................................................................................28

Processor.....................................................................................................................28

Memory ........................................................................................................................29

Platform Installations and Upgrades............................................................... 33

Before You Begin..................................................................................................................33

Tools and Supplies Needed.........................................................................................33

System References......................................................................................................33

Cable Routing Reference.............................................................................................33

Removing and Installing the Chassis Cover .........................................................................35

Removing the Chassis Cover.......................................................................................35

Installing the Chassis Cover.........................................................................................36

Removing and Installing the Front Bezel ..............................................................................37

Removing the Front Bezel............................................................................................37

Installing the Front Bezel..............................................................................................38

Removing and Installing the Processor Air Duct...................................................................39

Removing the Processor Air Duct................................................................................39

Installing the Processor Air Duct..................................................................................40

Installing and Removing Memory DIMMs .............................................................................41

Installing DIMMs...........................................................................................................41

Removing DIMMs.........................................................................................................42

Replacing the Processor.......................................................................................................42

Removing the Processor..............................................................................................43

Installing the Processor................................................................................................44

Installing or Removing a Hard Drive .....................................................................................46

Installing a Hard Drive..................................................................................................46

Removing a Hard Drive................................................................................................48

Replacing the CD-ROM Drive...............................................................................................48

Removing the CD-ROM / DVD-ROM Drive..................................................................49

Installing the CD-ROM / DVD-ROM Drive....................................................................50

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Contents

Installing or Removing a PCI Add-in Card ............................................................................51

Installing a PCI Add-in Card.........................................................................................51

Removing a PCI Add-in Card.......................................................................................53

Replacing the Power Supply.................................................................................................55

Removing the Power Supply........................................................................................55

Installing the Power Supply..........................................................................................56

DC Power In Male Connector Configuration................................................................56

Grounding a DC Powered System...............................................................................57

Replacing the Four-Fan Assembly........................................................................................57

Removing the Four-Fan Assembly...............................................................................58

Installing the Four-Fan Assembly.................................................................................59

Replacing the Mini-Bezel ......................................................................................................60

Replacing the Front Panel I/O Board....................................................................................61

Removing the Front Panel I/O Board...........................................................................61

Replacing the Light Pipe ..............................................................................................63

Installing the Front Panel I/O Board.............................................................................64

Replacing the PCI Riser Board.............................................................................................66

Replacing the Power Interface Board ...................................................................................68

Removing the Power Interface Board ..........................................................................69

Installing the Power Interface Board ............................................................................70

Replacing the Serial/Alarms Cable .......................................................................................70

Removing the Serial/Alarms Cable ..............................................................................71

Installing the Serial/Alarms Cable ................................................................................72

Replacing the Server Board..................................................................................................73

Removing the Server Board.........................................................................................73

Installing the Server Board...........................................................................................75

Replacing the Backup Battery...............................................................................................77

Installing or Replacing the Power Cord........................................................................79

Installing the Platform into a Rack.........................................................................................79

Equipment Rack Precautions................................................................................................79

Server Utilities ................................................................................................... 82

Using the BIOS Setup Utility.................................................................................................82

Starting Setup ..............................................................................................................82

If You Cannot Access Setup ........................................................................................82

Setup Menus................................................................................................................82

Upgrading the BIOS..............................................................................................................84

Preparing for the Upgrade............................................................................................84

Upgrading the BIOS.....................................................................................................85

Clearing the Password..........................................................................................................85

Clearing the CMOS...............................................................................................................86

Troubleshooting................................................................................................ 87

Resetting the System............................................................................................................87

Problems following Initial System Installation .......................................................................88

First Steps Checklist.....................................................................................................88

Hardware Diagnostic Testing................................................................................................89

Verifying Proper Operation of Key System Lights........................................................89

Confirming Loading of the Operating System ..............................................................90

Specific Problems and Corrective Actions............................................................................90

Power Light Does Not Light..........................................................................................90

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Contents

No Characters Appear on Screen................................................................................91

Characters Are Distorted or Incorrect...........................................................................91

System Cooling Fans Do Not Rotate Properly.............................................................92

CD-ROM Drive or DVD-ROM Drive Activity Light Does Not Light ...............................92

Cannot Connect to a Server .........................................................................................92

Problems with Network.................................................................................................93

System Boots when Installing PCI Card.......................................................................93

Problems with Newly Installed Application Software....................................................94

Problems with Application Software that Ran Correctly Earlier....................................94

Devices are not Recognized under Device Manager (Windows* Operating System)..95

Hard Drive(s) are not Recognized................................................................................95

Bootable CD-ROM Is Not Detected..............................................................................95

LED Information ...........................................................................................................96

BIOS Error Messages...........................................................................................................97

BIOS POST Beep Codes.............................................................................................98

Regulatory and Certification Information..................................................... 100

Product Regulatory Compliance .........................................................................................100

Product Safety Compliance........................................................................................100

Product EMC Compliance – Class A Compliance......................................................100

Certifications / Registrations / Declarations................................................................101

Product Regulatory Compliance Markings.................................................................101

Electromagnetic Compatibility Notices................................................................................102

FCC (USA).................................................................................................................102

Industry Canada (ICES-003)......................................................................................103

Europe (CE Declaration of Conformity)......................................................................103

VCCI (Japan) .............................................................................................................104

BSMI (Taiwan)............................................................................................................104

Korean RRL Compliance............................................................................................104

Regulated Specified Components ..............................................................................105

Getting Help..................................................................................................... 106

Intel® Server Issue Report Form.................................................................... 107

Warranty........................................................................................................... 111

Limited Warranty for Intel® Chassis Subassembly Products...............................................111

Extent of Limited Warranty..................................................................................................111

Warranty Limitations and Exclusions..................................................................................112

Limitations of Liability.................................................................................................112

How to Obtain Warranty Service.........................................................................................113

Telephone Support.....................................................................................................113

Returning a Defective Product ...................................................................................114

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Contents

Figures

Figure 1. Intel® Carrier Grade Server TIGI2U ......................................................................16

Figure 2. System Components.............................................................................................19

Figure 3. Platform Back........................................................................................................20

Figure 4. Front of Server Platform........................................................................................22

Figure 5. Optional Peripheral CD-ROM or DVD-ROM Drive................................................22

Figure 6. Intel® Server Platform TIGI2U Board Diagram......................................................23

Figure 7. Configuration Jumper Location.............................................................................24

Figure 8. SysCon Board.......................................................................................................26

Figure 9. System Cable Routing..........................................................................................34

Figure 10. Removing the Chassis Cover .............................................................................35

Figure 11. Installing the Chassis Cover ...............................................................................36

Figure 12. Removing the Front Bezel ..................................................................................37

Figure 13. Installing the Front Bezel ....................................................................................38

Figure 14. Removing the Processor Air Duct.......................................................................39

Figure 15. Installing the Processor Air Duct.........................................................................40

Figure 16. Installing Memory DIMMs ...................................................................................41

Figure 17. Removing Heat Sink............................................................................................43

Figure 18. Open the Processor Socket Lever.......................................................................44

Figure 19. Installing the Processor in the Processor Socket.................................................44

Figure 20. Close Processor Socket Lever.............................................................................45

Figure 21. Installing Heat Sink.............................................................................................45

Figure 22. Removing Hard Drive Carrier from Chassis........................................................46

Figure 23. Attaching a Hard Disk Drive to a Carrier.............................................................47

Figure 24. Inserting Hard Disk Drive Assembly into Chassis...............................................48

Figure 25. Removing CD-ROM / DVD-ROM Drive Assembly from Chassis........................49

Figure 26. Install CD-ROM Drive or DVD-ROM Drive Assembly into Chassis ....................50

Figure 27. Removing Riser Assembly from Chassis............................................................51

Figure 28. Installing Low-Profile PCI Card into Riser...........................................................52

Figure 29. Installing Full Length PCI Card into Riser...........................................................53

Figure 30. Removing a Low-Profile PCI Card......................................................................54

Figure 31. Removing a Full Height PCI Card.......................................................................54

Figure 32. Removing the Power Supply...............................................................................55

Figure 33. Installing the Power Supply.................................................................................56

Figure 34. DC Power In Male Connector Configuration.......................................................56

Figure 35. Connecting the Terminal Lug..............................................................................57

Figure 36. Removing the Four-Fan Assembly .....................................................................58

Figure 37. Installing the Four-Fan Assembly .......................................................................59

Figure 38. Removing the Mini Bezel....................................................................................60

Figure 39. Removing the Front Panel Board........................................................................62

Figure 40. Replacing the Light Pipe.....................................................................................63

Figure 41. Inserting the Front Panel Board..........................................................................64

Figure 42. Cabling to Front Panel Board..............................................................................65

Figure 43. Removing the Low-Profile PCI Riser Board........................................................66

Figure 44. Removing the Full Height PCI Riser Board.........................................................67

Figure 45. Installing the Low-Profile PCI Riser Board..........................................................67

Figure 46. Installing the Full Height PCI Riser Board...........................................................68

Figure 47. Removing the Power Interface Board.................................................................69

Figure 48. Installing the Power Interface Board...................................................................70

Figure 49. Removing the Serial/Alarms Cable Threaded Standoffs ....................................71

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Contents

Figure 50. Removing the Serial/Alarms Connector from the Chassis..................................71

Figure 51. Installing the Serial/Alarms Connector into Chassis...........................................72

Figure 52. Installing the Serial/Alarms Cable Threaded Standoffs ......................................72

Figure 53. Removing the Server Board................................................................................74

Figure 54. Installing the Server Board..................................................................................75

Figure 55. Securing SCSI Cable to Server Board Connector..............................................76

Figure 56. Replacing the Battery..........................................................................................78

Figure 57. Password Recovery Jumper...............................................................................85

Figure 58. CMOS Recovery Jumper....................................................................................86

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Contents

Tables

Table 1. Server Platform Features .................................................................................17

Table 2. NIC LEDs..........................................................................................................20

Table 3. Configuration Jumper [J1H2]............................................................................24

Table 4. LED Activity Definitions ....................................................................................25

Table 5. Keyboard Commands.......................................................................................83

Table 6. BIOS Error Messages.......................................................................................97

Table 7. POST Error Beep Codes..................................................................................98

Table 8. Error Beep Codes Provided by Intel® Management Modules..........................98

Table 9. Product Certification Markings........................................................................101

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Server Platform Features

Intel® Carrier Grade Server TIGI2U Features

This chapter briefly describes the main features of the Intel® Carrier Grade Server TIGI2U. This chapter provides a diagram of the product, a list of the server features, and diagrams showing the location of important components and connections on the server platform.

The Intel

Carrier Grade Server TIGI2U is shown in the following diagram.

Figure 1. Intel® Carrier Grade Server TIGI2U

Carrier Grade Server TIGI2U User Guide

Intel

TP01642

Server Platform Features

Table 1 summarizes the major features of the server platform.

Table 1. Server Platform Features

Feature Description

Processors Support for up to two Intel® Xeon™ processors with an 800 MT/s MHz front side

bus at frequency 3.2 GHz with 2MB cache.

Memory

Chipset Intel® E7520 chipset, including:

 Memory mirroring and memory sparing options  Six DIMM slots supporting DDR-2 400MHz memory

 E7520 MCH  PXH

 Intel® 82801ER I/O Controller Hub 5-R (ICH-5R)

I/O Control External connections:

 Stacked PS/2 ports for keyboard and mouse  RJ45 Serial B port  Two RJ45 NIC connectors for 10/100/1000 Mb connections  Two rear USB 2.0 ports  One front USB port - USB 2.0 compliant with less than ten feet of

external cable

 U320 high-density 80-pin SCSI connector (channel B)

Internal connections:

 Two USB port headers, each of which supports two USB 2.0 ports  One DH10 Serial A header  One Ultra320 80-pin SCSI connector (Channel A)  One ATA-100 connector  SSI-compliant 34-pin, high-density 100-pin, and alternate 50-pin control

panel headers

 Intel® Management Module 120-pin connector, supporting the

Professional and Advanced server management modules

Add-in Card

 One low-profile riser slot that supports a riser card capable of supporting

upto three low-profile PCI-X 64/100MHz add-in cards.

 One full-height riser slot, utilizing Intel® Adaptive Slot technology. Capable

of supporting riser cards that follows PCI-X specifications. The riser card can support up to three full-height, full-length PCI-X 64/100 MHz add-in cards.

Video On-board ATI* RAGE XL video controller with 8MB SDRAM

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Continued

Server Platform Features

Feature Description

Hard Drive SCSI support:

LAN Dual Intel® 82546GB 10/100/1000 NICs Fans

Server Management / Diagnostics

Server Management

 Dual-channel LSI Logic* 53C1030 Ultra320 SCSI controller

⎯ Implements LSI Logic* Fusion-MPT architecture ⎯ Supports LSI Logic* Integrated Mirroring and Striping technology

 Zero-channel RAID supporting the RUBI-2 specification

 Two 80mm x 38mm fans  Two 40mm x 28mm fans

 On-board Platform Instrumentation using the National Semiconductor*

PC87431M mini-Baseboard Management Controller (mBMC) (Default).

 Support for optional Intel® Management Module - Advanced Edition or

Professional Edition

 Support for Intel® Server Management 8.x

 Intel® Light-Guided Diagnostics on all field replaceable units (F RUs)

Server Management 5.8 support

Intel Telco Alarm Manager (TAM)

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Server Platform Features

Server Platform Components

TP01643

A. Power Distribution Board F. System Fans B. Processor Air Duct G. Front Panel I/O Board C. Power Supplies H. SCSI Hard Disk Drive Carriers D. PCI Riser Card Assembly I. Peripheral Bay (CD-ROM or DVD-ROM drive)

E. Intel

Server Board SE7520JR2

Figure 2. System Components

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Server Platform Features

Server Platform Back Panel

F J

B C D

M N

A DB15 Alarms Connector H RJ45 NIC 1 Connector B PCI Card Bracket (low-profile) I RJ45 NIC 2 Connector C PCI Card Bracket (full-height) J Video Connector D Optional second power supply or filler

panel (filler panel shown) E Power Supply L USB 0 F PS/2 Mouse and Keyb oard Connectors M Server Management Port G Rear Serial Port N SCSI Channel B

Figure 3. Platform Back

K USB 1

TP01644

The NIC LEDs at the right and left of each NIC provide the following information.

Table 2. NIC LEDs

NIC LED Color LED State Description

Off No network connection Solid Amber Network connection in place Blinking Amber Transmit/receive activity Off 10 Mbps connection (if left LED is on or

blinking) Solid Amber 100 Mbps connection Solid Green 1000 Mbps connection

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NIC1 / NIC2 (Gigabit)

Left LED

Right LED

Server Platform Features

Server Platform Front Panel

C ED F

CRT MNR PWRMJR

ID ONNIC

Alarms

Status

K M

1 0

Alarms

CRT MNR PWRMJR

Status

ID ONNIC

1 0

T U

TP01645

Front Panel Buttons

A Power button Toggles the system power B Reset button Resets the system G NMI button Assert NMI to baseboard H ID button Toggles system ID LED

Front Panel LEDs

C Critical (amber ) When continuously lit, indicates the presence of a Critical System Fault. A

critical system fault is an error or event that is detected by the system with a fatal impact to the system. In this case, the system cannot continue to operate. An example is the loss of a large section of memory that renders the system not operational. The front panel critical alarm relay will be engaged.

D Major (amber) When continuously lit, indicates the presence of a Major System Fault. A

major system fault is an error or event that is detected by the system that has discernable impact to system operation. In this case, the system can continue to operate but in a “degraded” fashion (reduced performance or loss of nonfatal feature reduction). An example is the loss of one of two mirrored disks. The front panel major alarm relay will be engaged.

E Minor (amber) When continuously lit, indicates the presence of a Minor System Fault. A

minor system fault is an error or event that is detected by the system but has little impact on actual system operation. An example is a correctable ECC error. The front panel minor alarm relay will be engaged.

F Power (amber) When continuously lit, indicates the presence of a Power System Fault. The

front panel power alarm relay will be engaged.

I System ID LED (white) Continuously lit when activated either by a software command or by the front

panel ID button.

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continued

Server Platform Features

J NIC activity LED (green) Indicates activity on either NIC. K Main power LED (green) When continuously lit, indicates the presence of DC power in the server. The

LED goes out when the power is turned off or if the power source is disrupted.

L Disk 1 Activity/Fault LED

(green/amber)

M Disk 0 Activity/Fault LED

(green/amber)

Front of Server Platform

N Optional CD-ROM or DVD-ROM Drive O Serial B via RJ45 P USB 2 Q Anti-static Connection R Drive Carrier 0 S Drive Release Lever T Drive Carrier 1 U Drive Release Lever

Indicates disk 1 SCSI hard drive activity when green, or a disk 1 SCSI hard drive fault when amber.

Indicates disk 0 SCSI hard drive activity when green, or a disk 0 SCSI hard drive fault when amber.

Figure 4. Front of Server Platform

Server Platform Peripherals

The platform provides for a peripheral location to install either a CD-ROM or a DVD-ROM drive. The platform comes with a CD-ROM drive installed. For information on replacing the CD-ROM drive, see “

Replacing the CD-ROM Drive”.

TP01647

Figure 5. Optional Peripheral CD-ROM or DVD-ROM Drive

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Server Platform Features

Server Board Connector and Component Locations

BA CD E

P O

A. SCSI Channel B J. Fan board connector B. Battery K. Secondary IDE channel C. Full-height riser slot

D. Low-profile riser slot E. Back panel I/O ports F. DIMM sockets G. Processor socket 1 H. Processor socket 2 I. +12V processor power R. 120-pin connector for Intel® Management Module

L. 24-pin SSI power connector M. 50-pin control panel connector N. Power supply signal cable O. USB header (1 x 10) P. IDE power connector Q. SCSI channel A

GHI

TP01646

Figure 6. Intel® Server Platform TIGI2U Board Diagram

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Server Platform Features

Configuration Jumpers

J1H2

1-2: Default

A1-A2: CMOS Clear by BMC A2-A3: CMOS Clear Force Erase B1-B2: Recovery Boot Disable (Normal Boot) B2-B3: Recovery Boot Enable C1-C2: Password Clear Protect C2-C3: Password Clear Erase

Figure 7. Configuration Jumper Location

Table 3. Configuration Jumper [J1H2]

Jumper Name Pins What happens at system reset…

1-2 These pins should be jumpered for normal system operation. Password Clear (line “A” in figure above)

(line “B” in figure above)

“C” in figure above)

2-3 If these pins are jumpered, administrator and user passwords will be cleared on the

next reset. These pins should not be jumpered for normal operation. 1-2 These pins should be jumpered for normal system operation. Recovery Boot 2-3 If these pins are jumpered, the system will attempt to recover the BIOS by loading the

BIOS code into the flash device from a floppy disk. This jumper is typically used when

the BIOS has become corrupted. These pins should not be jumpered for normal

operation. 1-2 These pins should be jumpered for normal system operation. CMOS Clear (line 2-3 If these pins are jumpered, the CMOS settings will be cleared on the next reset.

These pins should not be jumpered for normal operation.

TP01652

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Server Platform Features

Front Panel IO (FPIO) System Board

Features

The TIGI2U server system has the following FPIO features:

• Four switches to control power-on, reset, NMI, and the system ID LED

• One system ID LED that can be controlled remotely or by the system ID switch

• Two system activity LEDs that indicate power-on and NIC activity

• Two hard drive activity/fault LEDS that indicate activity/fault status for drives 1 and 2

• Four system fault LEDs that indicate critical, major, minor, and power system fault

status

• Four system fault relays for external critical, major, minor, and power fault indicators

• One SCSI bus with hot-swap circuitry for controlling hot-swap SCSI disk drives 1 and 2

• IDE Bus from IDE Connector to blind mate connector

• One blind mate connector for interfacing to CDROM or floppy drive carrier assembly

• Connectors for interfacing to the power supply, server baseboard, drive carrier

assemblies, and hot plug disk drives 1 and 2

FPIO SCSI Subsystem Status LEDs

The status LEDs give the user a visual indication of the drives’ condition. There is a single LED for each drive. The LEDs are bi-colored and use a combination of color and blinking frequency to indicate multiple conditions. The LEDs are mounted on the FPIO board, and the light is directed to the front panel through the use of a light pipe assembly. See 4

for LED activity definitions. See the Firmware EPS for definitions of the different blink

rates.

Table 4. LED Activity Definitions

LED State Drive Active Fault Condition

Solid Green Blinking Green X Blinking

Yellow/Green Blinking

Yellow/Blank Blank

Table

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Server Platform Features

Peripheral Bay

One peripheral drive (either a slim-line CD-ROM drive or a slim-line DVD-ROM drive) can be mounted in the system using a blind-mate peripheral drive carrier inserted into the peripheral drive bay. The peripheral drive bay is located above the hard drive tray and to the left.

Hard Disk Drives

The platform ships with two drive carriers for mounting hot swap Ultra320 SCSI hard disk drives in the chassis.

For information on how to install these drives, see “

Installing or Removing a Hard Drive”.

 NOTE

The Intel® Carrier Grade Server TIGI2U does not support all SCSI hard drives. For a list of validated hard drive manufacturers and hard drive types, see

http://support.intel.com/support/motherboards/server/TIGI2U

Drives can consume up to 17 watts of power each. Drives must be specified to run at a maximum ambient temperature of 45 °C.

Interconnect System (SysCon) Board

The interface board is used in the CD-ROM drive carrier assembly as the signal and power interface between the CD-ROM drive and the FPIO system board. The interface board has standard IDE and power connectors for interfacing to the CD-ROM drive, and has a high-density blind-mate connector for interfacing to the FPIO system board.

TP01691

Figure 8. SysCon Board

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Server Platform Features

Power Supply

The power supply cage supports up to two hot-swap power supplies (either AC input or DC input) in a (1+1) redundant configuration. A power supply filler module for the empty power supply site is supplied for systems without redundancy. Only the DC input version is NEBS certified.

The power subsystem supports the implementation of remote management features including remote enable, which permits power to be activated from a variety of sources.

The power supply is rated for 600 watts of power at the following voltages.

AC Power Supply:

PARAMETER MIN RATED MAX Max Input Current

DC Voltage -38 VDC -48VDC/ -60VDC -75VDC 20.5ADC

DC Power Supply:

PARAMETER MIN RATED MAX

Start-up

Vac

Power

Off

Vac

Max Input

AC Current

Max Rated

Input AC

Current

Line Voltage (110)

Line Voltage (220)

Frequency 47 Hz 50/60Hz 63 Hz

90V

180V

rms

100-127 V

200-240 V

rms

140V

264V

85Vac

rms

±4Vac

- -

rms

75Vac ±5Vac

Notes:

1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

3. This is not to be used for determining agency input current markings.

4. Maximum rated input current is measured at 100VAC and 200VAC

10.0 A

rms

5.0 A

1,3

rms

2,3

8.9A

4.5A

rms

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Server Platform Features

System Cooling

All system components except the power supply cage are cooled by a set of fans mounted near the middle of the chassis and behind the hard drive bays. The TIGI2U system comes in a non-redundant, four-fan configuration that consists of two 80mm x 38mm fans and two 40mm x 28mm fans.

Air flows in through the front bezel over the peripheral bay and the hard drive bays, passes through the fans and over the baseboard, and exhausts through the rear of the chassis. Each fan provides tachometer signal output to the server baseboard to indicate a fan failure.

The cooling subsystem contains a fan array consisting of two 80 x 38 mm fans and two 40 x 28 mm fans to cool the server board and other components. A fan failure is indicated by one of the fault LEDs located on the front panel.

Hardware Requirements

To avoid integration difficulties and possible board damage, your system must meet the requirements outlined below. For a list of qualified components, see the links under

“

Additional Information and Software.”

Processor

The server board accommodates two Intel® Xeon™ 3.2 GHz processors operating at 800 MHz FSB with 2MB cache.

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Server Platform Features

Memory

The Server Board SE7520JR2 provides six DIMM sockets across two channels, Channel A and Channel B. Channel A consists of DIMM sockets 1A, 2A, and 3A. Channel B consists of DIMM sockets 1B, 2B, and 3B.

If six DIMMs are installed, the following maximum capacitites are possible:  For DDR-2 400: Maximum capacity of 16 GB

A minimum of one 256MB DIMM is required in DIMM socket 1A or 1B. This uses singlechannel interleave. However, for dual-channel interleave, providing optimum performance, a minimum of two DIMMs should be installed in DIMM sockets 1A and 1B. Except for the option of installing a single DIMM in socket 1A or 1B, DIMMs must be installed in pairs and populated as follows:

 DIMM1A and DIMM 1B: Populate these two sockets together first  DIMM 2A and DIMM 2B: Populate these sockets in addition to DIMM 1A and DIMM 2A

if four DIMMs are to be used.

 DIMM 3A and DIMM3B: Populate these sockets after DIMM 1A, DIMM1B, DIMM2A,

and DIMM2B have been populated.

DIMMs must meet the following requirements:

 Use only DDR2-400 ECC, registered DDR DIMM modules  Use only DIMMs that comply with the DDR specifications.  Use only DIMMs with DIMM organization of x72 ECC  Use only 240pin DIMMs

 NOTE

When using DDR2-400 DIMM technologies, a maximum of four loads per memory channel is supported. When all DIMMs used in the system match this technology, a maximum of four DIMMs can be populated. Refer to the Intel Product Specification for additional information regarding the memory sub-system.

In determining your memory requirements, the need for memory sparing or memory mirroring must be considered.

Memory Sparing and Mirroring

The Intel® E7520 chipset includes hardware that supports memory mirroring and memory on-line sparing. Both memory mirroring and memory on-line sparing provide a way to prevent data loss in case a DIMM fails.

With memory mirroring the system maintains two copies of all data in the memory subsystem. If a DIMM fails, the data is not lost because the second copy of the data is available from the mirrored DIMM in the opposite channel. The system will not fail due to memory error unless both the primary and the mirrored copy of the data become corrupt at the same time.

Server Board SE7520JR2 Technical

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Server Platform Features

In a mirrored system, the maximum usable memory is one-half of the installed memory, with a minimum of four DIMMs installed. Since the data is duplicated across DIMMs, it means that up to one-half of the installed DIMMs are actively in use at any one time. The remaining DIMMs are used for mirroring.

Two methods for memory mirroring are available:

 Four identical DIMMs are used in DIMM sockets 1A, 1B, 2A, and 2B.

⎯ If the DIMM in socket 1A fails, the DIMM in socket 2B takes over. ⎯ If the DIMM in socket 1B fails, the DIMM in socket 2A takes over.

 Four DIMMs are used with identical single-ranked DIMMs in Banks 2 and 3. DIMMs in

sockets 1A and 1B must be dual-ranked and identical.

⎯ If the DIMM in socket 1A fails, the DIMM in socket 1B takes over. ⎯ If the DIMM in socket 2A fails, the DIMM in socket 3B takes over. ⎯ If the DIMM in socket 2B fails the DIMM in socket 3A takes over.

For memory on-line sparing, one DIMM per channel is used as the memory spare. The spare DIMM is not available for use, but is kept in reserve. If a DIMM begins to fail, the content of the failing DIMM is copied to the spare DIMM in that channel. When all of the data is copied to the spare DIMM, the primary DIMM is removed from service and the spare DIMM takes its place.

When memory on-line sparing is used, the spare DIMMs must be equal to or larger than the largest in-service DIMM in that channel.

 NOTE

Memory mirroring and memory sparing are mutually exclusive. Only one can be active at a time. Refer to the Intel SE7520JR2 Technical Product Specification for additional information regarding the memory sub-system.

All memory components and DIMMs used with the Intel must comply with the DDR specifications. For a complete list of supported memory DIMMs, see the links under “

Additional Information and Software.”

Server Board

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