Intel® Server Boards S5000PSL
and S5000XSL
Technical Product Specification
Intel order number: D41763-003
Revision 1.2
September 2006
Enterprise Platforms and Services Division – Marketing
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Intel® Server Boards S5000PSL and S5000XSL Revision History
Revision History
Date Revision
Number
November 2005 0.5 Preliminary Draft
March 2006 0.9 Updated all sections with the latest product information, updated illustrations,
added section for Regulatory/Certification, added appendix for Sensor Table,
POST Code Diagnostic LED’s, POST Code & Error Handling, Supported Chassis,
Added references for the S5000XSL.
May 2006 1.0 Updated the Server Board picture and Block Diagram, added information for
which slot the ROMB card goes into, added information on the HDD LED Header,
added information on the Snoop Filter, and cleaned other general things up in the
document.
September 2006 1.1 Updated legal disclaimer; Updated Processor Table; Updated Memory Section
September 2006 1.2 Updated Reference Documents
Modifications
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and / or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
The Intel
cause the product to deviate from published specifications. Refer to the Intel® Server Boards S5000PSL and
S5000XSL Specification Update for published errata.
Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of
these components when the fully integrated system is used together. It is the responsibility of the system integrator
that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters
to determine the amount of air flow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2006.
®
Server Boards S5000PSL and S5000XSL may contain design defects or errors known as errata which may
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Table of Contents Intel® Server Boards S5000PSL and S5000XSL TPS
Table of Contents
1. Introduction ........................................................................................................................12
1.1 Chapter Outline...................................................................................................... 12
1.2 Server Board Use Disclaimer ................................................................................ 12
2. Server Board Overview......................................................................................................14
2.1 Server Board Feature Set...................................................................................... 14
2.2 Server Board Layout.............................................................................................. 17
2.2.1 Server Board Connector and Component Layout.................................................. 18
2.2.2 Server Board Mechanical Drawings ...................................................................... 20
2.2.3 Server Board ATX I/O Layout ................................................................................ 26
3. Functional Architecture.....................................................................................................27
3.1 Intel® 5000P / 5000X Memory Controller Hub (MCH)............................................ 29
3.1.1 System Bus Interface............................................................................................. 29
3.1.2 Processor Support ................................................................................................. 29
3.1.3 Memory Sub-system.............................................................................................. 32
3.1.4 Snoop Filter (5000X MCH only)............................................................................. 41
3.2 Enterprise South Bridge (ESB2-E) ........................................................................ 41
3.2.1 PCI Sub-system..................................................................................................... 42
3.2.2 Serial ATA Support ................................................................................................ 44
3.2.3 Parallel ATA (PATA) Support ................................................................................ 45
3.2.4 USB 2.0 Support.................................................................................................... 45
3.3 Video Support ........................................................................................................ 45
3.3.1 Video Modes..........................................................................................................47
3.3.2 Video Memory Interface......................................................................................... 47
3.3.3 Dual Video ............................................................................................................. 47
3.4 SAS Controller ....................................................................................................... 48
3.4.1 SAS RAID Support ................................................................................................ 48
3.4.2 SAS / SATA Connector Sharing ............................................................................ 48
3.5 Network Interface Controller (NIC) ........................................................................ 48
3.5.1 Intel® I/O Acceleration Technolgy ..........................................................................49
3.5.2 MAC Address Definition......................................................................................... 49
3.6 Super I/O ...............................................................................................................49
3.6.1 Serial Ports ............................................................................................................ 50
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3.6.2 Floppy Disk Controller ...........................................................................................50
3.6.3 Keyboard and Mouse Support ............................................................................... 50
3.6.4 Wake-up Control....................................................................................................50
3.6.5 System Health Support.......................................................................................... 50
4. Platform Management........................................................................................................51
5. Connector / Header Locations and Pin-outs....................................................................53
5.1 Board Connector Information................................................................................. 53
5.2 Power Connectors ................................................................................................. 54
5.3 System Management Headers ..............................................................................56
5.3.1 Intel® Remote Management Module (Intel® RMM) Connector ............................... 56
5.3.2 LCP / AUX IPMB Header....................................................................................... 57
5.3.3 IPMB Header ......................................................................................................... 58
5.3.4 HSBP Header ........................................................................................................ 58
5.3.5 SGPIO Header....................................................................................................... 58
5.3.6 SES I2C..................................................................................................................58
5.3.7 HDD Activity LED Header...................................................................................... 59
5.4 Front Panel Connector........................................................................................... 59
5.5 I/O Connectors....................................................................................................... 59
5.5.1 VGA Connector...................................................................................................... 59
5.5.2 NIC Connectors ..................................................................................................... 60
5.5.3 IDE Connector ....................................................................................................... 60
5.5.4 Intel® Remote Management Module NIC Connector ............................................. 61
5.5.5 SATA / SAS Connectors........................................................................................ 63
5.5.6 Serial Port Connectors........................................................................................... 63
5.5.7 Keyboard and Mouse Connector ........................................................................... 64
5.5.8 USB Connector...................................................................................................... 65
5.6 Fan Headers .......................................................................................................... 66
6. Jumper Blocks....................................................................................................................68
6.1 CMOS Clear and Password Reset Usage Procedure ...........................................69
6.2 BMC Force Update Procedure .............................................................................. 69
6.3 BIOS Select Jumper .............................................................................................. 70
7. Intel® Light Guided Diagnostics........................................................................................71
7.1 5 Volt Standby LED ...............................................................................................71
7.2 Fan Fault LEDs......................................................................................................72
7.3 System ID LED and System Status LED ............................................................... 73
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7.3.1 System Status LED – BMC Initialization................................................................ 74
7.4 DIMM Fault LEDs .................................................................................................. 76
7.5 Processor Fault LEDs............................................................................................77
7.6 Post Code Diagnostic LEDs ..................................................................................78
8. Design and Environmental Specifications.......................................................................79
8.1 Server Boards S5000PSL and S5000XSL Design Specifications ......................... 79
8.2 Server Board Power Requirements .......................................................................80
8.2.1 Processor Power Support...................................................................................... 81
8.3 Power Supply Output Requirements ..................................................................... 81
8.3.1 Grounding .............................................................................................................. 82
8.3.2 Standby Outputs .................................................................................................... 82
8.3.3 Remote Sense ....................................................................................................... 82
8.3.4 Voltage Regulation ................................................................................................83
8.3.5 Dynamic Loading ................................................................................................... 83
8.3.6 Capacitive Loading ................................................................................................ 84
8.3.7 Ripple / Noise ........................................................................................................84
8.3.8 Timing Requirements............................................................................................. 84
8.3.9 Residual Voltage Immunity in Standby Mode ........................................................ 87
9. Regulatory and Certification Information.........................................................................88
9.1 Product Regulatory Compliance ............................................................................ 88
9.1.1 Product Safety Compliance ................................................................................... 88
9.1.2 Product EMC Compliance – Class A Compliance ................................................. 88
9.1.3 Certifications / Registrations / Declarations ........................................................... 89
9.2 Product Regulatory Compliance Markings ............................................................ 89
9.3 Electromagnetic Compatibility Notices ..................................................................90
9.3.1 FCC Verification Statement (USA) ........................................................................ 90
9.3.2 ICES-003 (Canada) ............................................................................................... 90
9.3.3 Europe (CE Declaration of Conformity) ................................................................. 91
9.3.4 VCCI (Japan) ......................................................................................................... 91
9.3.5 BSMI (Taiwan) ....................................................................................................... 91
9.3.6 RRL (Korea)........................................................................................................... 91
9.3.7 CNCA (CCC-China)............................................................................................... 92
9.4 Restriction of Hazardous Substances (RoHS) Compliance................................... 92
Appendix A: Integration and Usage Tips................................................................................93
Appendix B: BMC Sensor Tables............................................................................................94
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Appendix C: POST Code Diagnostic LED Decoder.............................................................109
Appendix D: POST Code Errors ............................................................................................114
Appendix E: Supported Intel® Server Chassis.....................................................................117
Glossary...................................................................................................................................118
Reference Documents............................................................................................................121
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List of Figures Intel® Server Boards S5000PSL and S5000XSL TPS
List of Figures
Figure 1. Server Board Photograph ............................................................................................ 17
Figure 2. Major Board Components............................................................................................ 19
Figure 3. Mounting Hole Positions .............................................................................................. 20
Figure 4. Component Positions...................................................................................................21
Figure 5. Restricted Areas on Side 1 .......................................................................................... 22
Figure 6. Restricted Areas on Side 2 .......................................................................................... 23
Figure 7. Restricted Areas on Side 2, “Detail B” ......................................................................... 24
Figure 8. CPU and Memory Duct Keepout ................................................................................. 25
Figure 9. ATX I/O Layout ............................................................................................................ 26
Figure 10. Functional Block Diagram..........................................................................................28
Figure 11. CEK Processor Mounting ..........................................................................................31
Figure 12. Memory Layout .......................................................................................................... 32
Figure 13. Minimum Two DIMM Memory Configuration.............................................................. 37
Figure 14. Recommended Four DIMM Configuration ................................................................. 38
Figure 15. Single Branch Mode Sparing DIMM Configuration .................................................... 40
Figure 16. SMBUS Block Diagram.............................................................................................. 52
Figure 17. Jumper Blocks (J1C3, J1D1, J1D2, J1E32) ..............................................................68
Figure 18. 5 Volt Standby Status LED Location.......................................................................... 71
Figure 19. Fan Fault LED Locations ........................................................................................... 72
Figure 20. System ID LED and System Status LED Locations................................................... 73
Figure 21. DIMM Fault LED Locations........................................................................................ 76
Figure 22. Processor Fault LED Locations ................................................................................. 77
Figure 23. POST Code Diagnostic LED Location ....................................................................... 78
Figure 24. Power Distribution Block Diagram ............................................................................. 80
Figure 25. Output Voltage Timing ............................................................................................... 85
Figure 26. Turn On/Off Timing (Power Supply Signals).............................................................. 86
Figure 27. Diagnostic LED Placement Diagram .......................................................................109
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List of Tables
Table 1. Server Board Features..................................................................................................14
Table 2. Processor Support Matrix .............................................................................................29
Table 3. I2C Addresses for Memory Module SMB ......................................................................33
Table 4. Maximum Eight-DIMM System Memory Configruation – x8 Single Rank ..................... 34
Table 5. Maximum Eight-DIMM System Memory Configuration – x4 Dual Rank........................ 34
Table 6. PCI Bus Segment Characteristics................................................................................. 42
Table 7. Video Modes ................................................................................................................. 47
Table 8. NIC2 Status LED........................................................................................................... 48
Table 9. Serial B Header Pin-out ................................................................................................50
Table 10. Board Connector Matrix .............................................................................................. 53
Table 11. Power Connector Pin-out (J9B5) ................................................................................ 54
Table 12. 12 V Power Connector Pin-out (J3J2) ........................................................................55
Table 13. Power Supply Signal Connector Pin-out (J9D1) ......................................................... 55
Table 14. P12V4 Power Connector Pin-out (J5A2) ....................................................................55
Table 15. RMM Connector Pin-out (J5B1).................................................................................. 56
Table 16. LPC / AUX IPMB Header Pin-out (J2J1)..................................................................... 57
Table 17. IPMB Header Pin-out (J4J1) ....................................................................................... 58
Table 18. HSBP Header Pin-out (J1J7, J1J2) ............................................................................58
Table 19. SGPIO Header Pin-out (J2H1, J1J5) .......................................................................... 58
Table 20. SES I2C Header Pin-out (J1J3)...................................................................................58
Table 21. HDD Activity LED Header Pin-out (J2J3).................................................................... 59
Table 22. Front Panel SSI Standard 24-pin Connector Pin-out (J1E4) ......................................59
Table 23. VGA Connector Pin-out (J7A1)................................................................................... 59
Table 24. RJ-45 10/100/1000 NIC Connector Pin-out (JA6A1, JA6A2)...................................... 60
Table 25. IDE 40-pin Connector Pin-out (J2J2) .......................................................................... 60
Table 26. 40-pin RMM NIC Module Connector Pin-out (J3B2)................................................... 61
Table 27. SATA / SAS Connector Pin-out (J1J1, J1H2, J1H1, J1G2, J1G1, J1F2) ................... 63
Table 28. External DB9 Serial A Port Pin-out (J7A1).................................................................. 63
Table 29. Internal 9-pin Serial B Header Pin-out (J1B1)............................................................. 64
Table 30. Stacked PS/2 Keyboard and Mouse Port Pin-out (J9A1) ........................................... 64
Table 31. External USB Connector Pin-out (JA6A1, JA6A2)...................................................... 65
Table 32. Internal USB Connector Pin-out (J3J1)....................................................................... 65
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List of Tables Intel® Server Boards S5000PSL and S5000XSL TPS
Table 33. SSI 4-pin Fan Header Pin-out (J9J1, J5J1, J9B3, J9B4)............................................66
Table 34. SSI 6-pin Fan Header Pin-out (J3H1, J3H2, J3H3, J3H4).......................................... 66
Table 35. Server Board Jumpers (J1C3, J1D1, J1D2, J1E3) ..................................................... 68
Table 36. System Status LED.....................................................................................................74
Table 37. Server Board Design Specifications ...........................................................................79
Table 38. Intel® Xeon® Processor Dual Processor TDP Guidelines ........................................... 81
Table 39. 550 W Load Ratings ...................................................................................................81
Table 40. Voltage Regulation Limits ........................................................................................... 83
Table 41. Transient Load Requirements..................................................................................... 83
Table 42. Capacitive Loading Conditions ...................................................................................84
Table 43. Ripple and Noise......................................................................................................... 84
Table 44. Output Voltage Timing ................................................................................................ 85
Table 45. Turn On/Off Timing ..................................................................................................... 86
Table 46. BMC Sensors..............................................................................................................96
Table 47. POST Progress Code LED Example ........................................................................110
Table 48. Diagnostic LED POST Code Decoder ...................................................................... 110
Table 49. POST Error Messages and Handling........................................................................ 114
Table 50. POST Error Beep Codes ..........................................................................................116
Table 51. BMC Beep Codes ..................................................................................................... 116
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
1. Introduction
This Technical Product Specification (TPS) provides board-specific information about the features, functionality, and high-level
architecture of the Intel
®
Server Boards S5000PSL and S5000XSL. See the Intel® S5000 Server Board Family Datasheet for details
about board sub-systems, including the chipset, BIOS, and server management.
In addition, design level information for specific sub-systems can be obtained by ordering the External Product Specifications (EPS)
for a given sub-system. EPS documents are not publicly available and must be ordered through your local Intel representative.
1.1 Chapter Outline
This document is divided into the following chapters
Chapter 1 – Introduction
Chapter 2 – Server Board Overview
Chapter 3 – Functional Architecture
Chapter 4 – Platform Management
Chapter 5 – Connector and Header Location and Pin-out
Chapter 6 – Configuration Jumpers
Chapter 7 – Light-Guided Diagnostics
Chapter 8 – Power and Environmental specifications
Chapter 9 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – BMC Sensor Tables
Appendix C – POST Code Diagnostic LED Decoder
Appendix D – POST Code Errors
Appendix E – Supported Intel
®
Server Chassis
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server
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building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel-developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
2. Server Board Overview
The Intel® Server Boards S5000PSL and S5000XSL are monolithic printed circuit boards with features that support the pedestal
server markets.
2.1 Server Board Feature Set
Table 1. Server Board Features
Feature Description
Processors Socket J (771-pin LGA sockets) supporting one or two Dual-Core Intel® Xeon®
processors 5000 sequence, with system bus speeds of 667 MHz, 1066 MHz, and
1333 MHz.
Memory Eight DIMM sockets supporting fully buffered DIMM technology (FBDIMM) memory.
240-pin DDR2-533 and DDR2-677 FBDIMMs can be used.
Chipset Intel® 5000P Memory Controller Hub (Server Board S5000PSL only)
®
5000X Memory Controller Hub (Server Board S5000XSL only)
Intel
®
ESB2-E I/O Controller
Intel
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Feature Description
On-board
Connectors/Headers
Add-in PCI, PCI-X*, PCI
Express* Cards
Video On-board ATI* ES1000 video controller with 16-MB DDR SDRAM
Hard Drive Support for six SATA-2 hard drives
LAN Two 10 / 100 / 1000 Intel® 82563EB PHYs supporting Intel® I/O Acceleration
External connections:
Stacked PS/2* ports for keyboard and mouse
Stacked video / DB9 serial port A connector
Two RJ45 / 2xUSB connectors for 10 / 100 / 1000 Mb and USB 2.0 support
One USB 2x5 pin header, which supports two USB ports
One USB port Type A connector
One DH10 serial port B header
Six SATA-2 connectors with integrated RAID 0, 1, and 10 support
(order code S5000PSLSATA only)
Software RAID 5 support through an optional SATA RAID KEY (this feature is
currently not supported and will be made available after production launch)
Two SATA-2 connectors and four SATA-2 / SAS connectors with integrated RAID
0, 1, and 10 support (order code S5000PSLSAS only)
Software RAID 5 support through an optional SAS RAID KEY (order code
S5000PSLSAS only; this feature is currently not supported and will be made
available after production launch)
One ATA100 40-pin connector
One RMM connector to support the optional Intel
One I/O connector supporting an optional RMM NIC I/O module
SSI-compliant front panel header
SSI-compliant 24-pin main power connector, supporting the ATX-12 V standard
on the first 20 pins
One full-length / full-height PCI-X 64-bit slot with up to 133-MHz support when
only one PCI-X slot is populated
One full-length / full-height PCI-X 64-bit slot with up to 100 MHz support
One full-length / full-height PCI Express* x8 (x4 throughput); x8 (x8 throughput)
with order code S5000PSLSATA) slot
One half-length / full-height PCI Express* x8 (x8 throughput) slot
Two full-length / full-height PCI Express* x16 (x8 throughput) slots
Support for four SAS hard drives (order code S5000PSLSAS only)
Technology
®
Remote Management Module
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
Feature Description
Fans Support for
Two processor fans
Four front hot-swap fans
Two rear system fans
Server Management Support for Intel® System Management Software
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2.2 Server Board Layout
Figure 1. Server Board Photograph
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
Q
N
O
P
U
R
S
O
Q
M
2.2.1 Server Board Connector and Component Layout
The following figure shows the board layout of the server board. Each connector and major component is identified by a letter. A
table of component descriptions follows the figure.
I
A B DGFEC
J
H
K
L
UU
TT
M
SS
RR
Q
PP
O
NN
M
LL
KK
JJ
II
HH
GG AAZY
FF BBDD
V
X
CCEE
W
T
AF000247
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A. PCI-X 64-bit, 100-MHz slot 1 Q. DIMM sockets GG. Enclosure management SAS
SGPIO header (order code
S5000PSLSAS only)
B. PCI-X 64-bit, 133-/100-MHz slot 2 R. Processor 1 socket HH. Enclosure management SAS
SES I2C (order code S5000PSLSAS
only)
C. PCI Express* x4 / x8 slot 3 S. Processor 2 socket II. Hot-swap backplane A header
D. Advanced Server Management
Interface NIC connector
E. PCI Express* x4 slot 4 (ROMB
Slot)
F. PCI Express x8 slot 5 V. System fan 4 header LL. SATA 2 or SAS 0 (SAS 0 on
G. PCI Express x8 slot 6 W. System fan 3 header MM. SATA 3 or SAS 1 (SAS 1 on
H. CMOS battery X. IPMB connector NN. SATA 4 or SAS 2 (SAS 2 on
I. P12V4 connector Y. System fan 2 header OO. SATA 5 or SAS 3 (SAS 3 on
J. RMM connector (connector for
®
Intel
Remote Management Module)
K. Back panel I/O ports AA. Processor power connector QQ. Front control panel header
L. Diagnostic and identify LEDs BB. USB header RR. SATA software RAID 5 key
M. System fan 6 header CC. IDE connector SS. SAS software RAID 5 key
N. System fan 5 header DD. Enclosure management SATA
O. Main power connector EE. Intel® Local Control Panel
P. Auxilliary power signal connector FF. Hot-swap backplane B header
T. Processor 2 fan header JJ. SATA 0
U. Processor 1 fan header KK. SATA 1
order code S5000PSLSAS only)
order code S5000PSLSAS only)
order code S5000PSLSAS only)
order code S5000PSLSAS only)
Z. System fan 1 header PP. USB port
connector
connector (order code
S5000PSLSAS only)
TT. Serial B / emergency
SGPIO header
header
management port header
UU. Chassis intrusion header
Figure 2. Major Board Components
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2.2.2 Server Board Mechanical Drawings
Figure 3. Mounting Hole Positions
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Figure 4. Component Positions
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
304.80
12.000[]
20.32
0.800[]
TYP
60.100
2.3661[]
IMM3 COMPONENT
HEIGHT 3.6 MM
72.800
2.8661[]
HEATSINK DISSASEMBLY AREA,
.275" [8.26mm] MAX COMPONENT
HEIGHT RESTRICTION, 4 PLACES
Ø
10.160
0.4000[]
GROUND PAD BOTH SIDES
NO COMPONENT
8 PLCS
.433" [14mm] MAX COMPONENT
HEIGHT RESTRICTION
SOCKET AREA, NO COMPONENT
PLACEMENT ALLOWED, 2 PLACES
93.98
3.700[]
326.57
12.857[]
TYP
330.20
13.000[]
18.72
0.737[]
311.66
12.270[]
TYP
322.40
12.693[]
TYP
TYP
301.50
11.870[]
TYP
11.20
0.441[]
116.000
4.5669[]
6.35
0.250[]
5.33
0.210[]
TYP
7.92
0.312[]
TYP
16.05
0.632[]
TYP
60.96
2.400[]
.118" [3.81mm] MAX COMPONENT
HEIGHT RESTRICTION, 2 PLACES
HEATSINK AREA. .325" [8.26mm] MAX
COMPONENT HEIGHT RESTRICTIO, 2 PLACES
MAX HEIGHT OF COMPONENTS AND MATING COMPONENTS
SHALL NOT EXCEED 15.24mm [.600"]
3
22.86
Figure 5. Restricted Areas on Side 1
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0.3000[]
20.320
0.8000[]
11 PLCS
5.08
0.200[]
TYP
R TYP14.730
0.5799[]
.100 [2.54<<] MAX COMPONENT
HEIGHT IN THESE ZONES
96.52
3.800[]
12.07
0.475[]
TYP7.620
57.15
2.250[]
LIMITED COMPONENT HEIGHT
.058" MAXIMUM 13 PLACES
3
R
25.40
1.000[]
TYP
20.320
0.8000[]
2X 8.000
0.3150[]
NO COMPONENTS ALLOWED
TRACES OKAY IN THIS REGION
2X 3.120
0.1228[]
78.74
3.100[]
2X 0.350
0.0138[]
Ø
GROUND PAD
10.160
0.4000[]
NO COMPONENT
1 PLACE
2
66.554
2.6202[]
177.80
7.000[]
SEE DETAIL B
7.62
0.300[]
12.70
0.500[]
5.08
0.200[]
CEK HEATSINK SPRING PLATE ZONE
NO COMPONENT PLACEMENT OR
THROUGH HOLE LEADS ALLOWED
17.78
0.700[]
5.08
0.200[]
Figure 6. Restricted Areas on Side 2
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THIS ZONE 16 PLCS
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Server Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
5.00
0.197[]
3X 4.00
0.157[]
3X 10.13
0.399[]
5.00
0.197[]
3X 3.00
CHASSIS ID PADS
0.118[]
Figure 7. Restricted Areas on Side 2, “Detail B”
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10.160 [0.4000]
0.000 [0.0000]
320.040
[12.6000]
16.510 [0.6500]
0.000 [0.0000]
14.0mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
SUPPORT AREA,
NO COMPONENT
ALLOWED
145.600 [5.7323]
154.685 [6.0900]
15.0mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
235.085 [9.2553]
9.0 mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
27.0 mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
13.0 mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
317.580 [12.5032]
14.0mm COMPONENT HEIGHT
LIMIT DEFINED BY DUCT DETAIL
26.635
[1.0486]
73.482
[2.8930]
97.846
[3.8522]
118.351
[4.6595]
111.351 [4.3839]
143.732
[5.6588]
282.585
[11.1254]
188.152 [7.4076]
193.152 [7.6044]
SUPPORT AREA,
NO COMPONENT
ALLOWED
194.152
[7.6438]
187.152
[7.3682]
288.290 [11.3500]
273.091 [10.7516]
26.578 [1.0464]
43.302 [1.7048]
143.136 [5.6353]
168.123 [6.6190]
178.578 [7.0306]
16.5mm COMPONENT HEIGHT
LIMIT DEFINE BY DUCT DETAIL
1.25mm COMPONENT HEIGHT
LIMIT DEFINE BY DUCT DETAIL
NO COMPONENT ALLOWED
107.920 [4.2488]
117.851 [4.6398]
101.402 [3.9922]
112.851 [4.4430]
Figure 8. CPU and Memory Duct Keepout
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2.2.3 Server Board ATX I/O Layout
The drawing below shows the layout of the rear I/O components for the server board.
E GCA
B D HF
AF000222
A. PS/2 mouse E. NIC port 1 (1 Gb)
B. PS/2 keyboard F. USB port 2 (top), 3 (bottom)
C. Serial port G. NIC port 2 (1 Gb)
D. Video H. USB port 0 (top), 1 (bottom)
Figure 9. ATX I/O Layout
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3. Functional Architecture
The architecture and design of the Intel® Server Boards S5000PSL and S5000XSL are based on the Intel® S5000P and S5000X
chipsets respectively. These chipsets are designed for systems that use the Intel
®
Xeon® processor with system bus speeds of 667
MHz, 1066 MHz, and 1333 MHz.
The chipset contains two main components: the Memory Controller Hub (MCH) for the host bridge and the I/O controller hub for the
I/O sub-system. The chipset uses the Enterprise South Bridge (ESB2-E) for the I/O controller hub. This chapter provides a high-level
description of the functionality associated with each chipset component and the architectural blocks that make up the server board.
For more information about the functional architecture blocks, see the Intel
®
S5000 Server Board Family Datasheet.
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Figure 10. Functional Block Diagram
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3.1 Intel® 5000P / 5000X Memory Controller Hub (MCH)
The Memory Controller Hub (MCH) is a single 1432-pin FCBGA package, which includes the following core platform functions:
System Bus Interface for the processor sub-system
Memory Controller
PCI-Express Ports including the Enterprise South Bridge Interface (ESI)
FBD Thermal Management
SMBUS Interface
This section provides a high-level overview of some of these core functions as they pertain to this server board. Additional
information can be obtained from the Intel S5000 Server Board Family Datasheet and the Intel 5000 Series Chipset Memory
Controller Hub Datasheet.
3.1.1 System Bus Interface
The MCH is configured for symmetric multi-processing across two independent front side bus interfaces that connect to the DualCore Intel
®
Xeon® processors. Each front side bus on the MCH uses a 64-bit wide 667, 1066, or 1333-MHz data bus. The 1333-MHz
data bus is capable of transferring data at up to 10.66 GB/s. The MCH supports a 36-bit wide address bus, capable of addressing up
to 64 GB of memory. The MCH is the priority agent for both front side bus interfaces, and is optimized for one processor on each
bus.
3.1.2 Processor Support
The server board supports one or two Dual Core Intel® Xeon® processors 5000 sequence, with system bus speeds of 667 MHz, 1066
MHz, and1333 MHz, and core frequencies starting at 3.73 GHz. Previous generations of the Intel
supported on this server board.
Note: Only Dual Core Intel
®
Xeon® processors 5000 Sequence that support system bus speeds of 667 MHz, 1066 MHz and 1333
MHz are supported on this server board. See the following table for a list of supported processors.
Table 2. Processor Support Matrix
Processor Family System Bus Speed Core Frequency Cache Watts Support
Intel® Xeon® Processor 5030 667MHz 2.67 GHz 2x 2 MB 95 Yes
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Intel® Xeon® Processor 5050 667 MHz 3.0 GHz 2x 2 MB 95 Yes
Intel® Xeon® Processor 5060 1066 MHz 3.2 GHz 2x 2 MB 130 Yes
Intel® Xeon® Processor 5063 1066 MHz 3.2 GHz 2x 2 MB 95 Yes
Intel® Xeon® Processor 5080 1066 MHz 3.73 GHz 2x 2 MB 130 Yes
Intel® Xeon® Processor 5110 1066 MHz 1.60 4 MB 65 Yes
Intel® Xeon® Processor 5120 1066 MHz 1.86 4 MB 65 Yes
Intel® Xeon® Processor 5130 1333 2.00 4 MB 65 Yes
Intel® Xeon® Processor 5140 1333 2.33 4 MB 65 Yes
Intel® Xeon® Processor 5148 1333 2.33 4 MB 40 Yes
Intel® Xeon® Processor 5150 1333 2.66 4 MB 65 Yes
Intel® Xeon® Processor 5160 1333 3.00 4 MB 80 Yes
3.1.2.1 Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. When only one processor is
installed, it must be in the socket labeled CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current requirements are not
supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2 Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heatsink retention solution. The server
board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heatsink
attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking
order of the chassis, CEK spring, server board, TIM, and heatsink.
The CEK spring is removable, allowing for the use of non-Intel heatsink retention solutions.
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Note: The processor heat sink and CEK spring shown in the following diagram are for reference purposes only. The actual
processor heat sink and CEK solutions compatible with this generation server board may be of a different design.
Heatsink assembly
Thermal Interface
Material (TIM)
Server Board
TP02091
CEK Spring
Chassis
AF000196
Figure 11. CEK Processor Mounting
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3.1.3 Memory Sub-system
The MCH masters four fully buffered DIMM (FBD) memory channels. FBD memory utilizes a narrow high speed frame oriented
interface referred to as a channel. The four FBD channels are organized into two branches of two channels per branch. Each branch
is supported by a separate memory controller. The two channels on each branch operate in lock-step to increase FBD bandwidth.
The four channels are routed to sixteen DIMM sockets and are capable of supporting registered DDR2-533 and DDR2-667 FBDIMM
memory (stacked or unstacked). The read bandwidth of each FBDIMM channel 4.25 GB/s for DDR2-533 FBDIMM memory which
gives a total read bandwidth of 17 GB/s for four DIMM channels. The read bandwidth of each FBDIMM channel 5.35 GB/s for DDR2667 FBDIMM memory which gives a total read bandwidth of 21.4 GB/s for four DIMM channels.
On the Intel
®
Server Boards S5000PSL and S5000XSL, a pair of channels becomes a branch where Branch 0 consists of channels A
and B, and Branch 1 consists of channels C and D. FBD memory channels are organized into two branches for support of RAID 1
(mirroring).
MCH
Branch 0
Channel B
Channel A
DIMM A1
DIMM A2
DIMM B1
DIMM B2
DIMM C1
DIMM C2
DIMM D1
DIMM D2
Branch 1
Channel C
Channel D
TP02299
Figure 12. Memory Layout
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To boot the system, the system BIOS on the server board uses a dedicated I2C bus to retrieve DIMM information needed to program
the MCH memory registers. The following table provides the I
2
C addresses for each DIMM socket.
Table 3. I2C Addresses for Memory Module SMB
Device Address
DIMM A1 0xA0
DIMM A2 0xA2
DIMM B1 0xA0
DIMM B2 0xA2
DIMM C1 0xA0
DIMM C2 0xA2
DIMM D1 0xA0
DIMM D2 0xA2
3.1.3.1 Memory RASUM Features
The MCH supports several memory RASUM (Reliability, Availability, Serviceability, Usability, and Manageability) features. These
features include the Intel
®
x4 Single Device Data Correction (Intel® x4 SDDC) for the following:
Memory error detection and correction
Memory scrubbing
Retry on correctable errors
Memory built-in self-test
DIMM sparing
Memory mirroring
See the Intel® S5000 Server Board Family Datasheet for more information about these features.
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3.1.3.2 Supported Memory
The server board supports up to eight DDR2-533 or DDR2-667 fully-buffered DIMMs (FBD memory). The following tables show the
maximum memory configurations supported with the specified memory technology.
Table 4. Maximum Eight-DIMM System Memory Configruation – x8 Single Rank
DRAM Technology
x8 Single Rank
256 Mb 1 GB 2 GB
512 Mb 2 GB 4 GB
1024 Mb 4 GB 8 GB
2048 Mb 8 GB 16 GB
Maximum Capacity
Mirrored Mode
Maximum Capacity
Non-mirrored Mode
Table 5. Maximum Eight-DIMM System Memory Configuration – x4 Dual Rank
DRAM Technology
x4 Dual Rank
256 Mb 4 GB 8 GB
512 Mb 8 GB 16 GB
1024 Mb 16 GB 32 GB
2048 Mb 16 GB 32 GB
Maximum Capacity
Mirrored Mode
Maximum Capacity
Non-mirrored Mode
Note: Only fully buffered DDR2 DIMMs (FBDIMMs) are supported on this server board. See the Intel
S5000PSL/S5000XSL Tested Memory List for a list of supported memory for this server board.
®
Server Board
3.1.3.3 DIMM Population Rules and Supported DIMM Configurations
DIMM population rules depend on the operating mode of the memory controller, which is determined by the number of DIMMs
installed. DIMMs must be populated in pairs. DIMM pairs are populated in the following DIMM slot order: A1 & B1, C1 & D1, A2 &
B2, C2 & D2. DIMMs within a given pair must be identical with respect to size, speed, and organization. However, DIMM capacities
can be different between different DIMM pairs.
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For example, a valid mixed DIMM configuration may have 512MB DIMMs installed in DIMM Slots A1 & B1, and 1GB DIMMs installed
in DIMM slots C1 & D1.
Intel supported DIMM configurations for this server board are shown in the following table.
Supported and Validated configuration : Slot is populated
Supported but not validated configuration : Slot is
populated
Slot is not populated
Mirroring: Y = Yes. Indicates that configuration supports Memory Mirroring.
Sparing: Y(x) = Yes. Indicates that configuration supports Memory Sparing.
Where x = 0 : Sparing supported on Branch0 only
1 : Sparing supported on Branch1 only
0,1 : Sparing supported on both branches
Branch 0 Branch 1
Channel A Channel B Channel C Channel D
Mirroring
Possible
Sparing
Possible
DIMM_A1 DIMM_A2 DIMM_B1 DIMM B2 DIMM C1 DIMM C2 DIMM D1 DIMM D2
Y (0)
Y
Y (0)
Y Y (0, 1)
Notes:
- Single channel mode is only tested and supported with a 512MB x8 FBDIMM installed in DIMM Slot A1.
- The supported memory configurations must meet population rules defined above.
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er Board Overview Intel® Server Boards S5000PSL and S5000XSL TPS
Serv
- For best performance, the number of DIMMs installed should be balanced across both memory branches. For Example: a four
DIMM configuration will perform better than a two DIMM configuration and should be installed in DIMM Slots A1, B1, C1, and D1.
An eight DIMM configuration will perform better then a six DIMM configuration.
- Although mixed DIMM capacities between channels is supported, Intel does not validate DIMMs in mixed DIMM configurations.
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3.1.3.3.1 Minimum Non-Mirrored Mode Configuration
The server board is capable of supporting a minimum of one DIMM installed. However, for
system performance reasons, Intel’s recommendation is that at least 2 DIMMs be installed.
The following diagram shows the recommended minimum DIMM memory configuration.
Populated DIMM slots are shown in Grey.
MCH
Branch 0
Channel B
Channel A
DIMM A1
DIMM A2
DIMM B1
DIMM B2
DIMM C1
DIMM C2
DIMM D1
DIMM D2
Branch 1
Figure 13. Minimum Two DIMM Memory Configuration
Channel C
Channel D
TP02300
Note: The server board supports single DIMM mode operation. Intel will only validate and
support this configuration with a single 512 MB x8 FBDIMM installed in DIMM socket A1.
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3.1.3.4 Non-mirrored Mode Memory Upgrades
The minimum memory upgrade increment is two DIMMs per branch. The DIMMs must cover the
same slot position on both channels. DIMMs pairs must be identical with respect to size, speed,
and organization. DIMMs that cover adjacent slot positions do not need to be identical.
When adding two DIMMs to the configuration shown in
Figure 13 (above), the DIMMs should be
populated in DIMM sockets C1 and D1 as shown in the following diagram. Populated DIMM
sockets are shown in Grey.
MCH
Branch 0
Channel B
Channel A
DIMM A1
DIMM A2
DIMM B1
DIMM B2
DIMM C1
DIMM C2
DIMM D1
DIMM D2
Branch 1
Channel C
Channel D
TP02301
Figure 14. Recommended Four DIMM Configuration
Functionally, DIMM sockets A2 and B2 could also have been populated instead of DIMM
sockets C1 and D1. However, your system will not achieve equivalent performance.
Figure 13,
on the previous page, shows the supported DIMM configuration that is recommended because it
allows both branches to operate independently and simultaneously. FBD bandwidth is doubled
when both branches operate in parallel.
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3.1.3.4.1 Mirrored Mode Memory Configuration
When operating in mirrored mode, both branches operate in lock step. In mirrored mode, branch
1 contains a replicate copy of the data in branch 0. The minimum DIMM configuration to support
memory mirroring is four DIMMs, populated as shown in
Figure 14, above. All four DIMMs must
be identical with respect to size, speed, and organization.
To upgrade a four DIMM mirrored memory configuration, four additional DIMMs must be added
to the system. All four DIMMs in the second set must be identical to the first with the exception
of speed. The MCH will adjust to the lowest speed DIMM.
3.1.3.4.2 Sparing Mode Memory Configuration
The MCH provides memory sparing capabilities. Sparing is a RAS feature that involves
configuring a DIMM to be placed in reserve so it can be use to replace a DIMM that fails. DIMM
sparing occurs within a given bank of memory and is not supported across branches. There are
two supported Memory Sparing configurations.
Single Branch Mode Sparing
Dual Branch Mode Sparing
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3.1.3.4.2.1 Single Branch Mode Sparing
Slot 2
Slot 1
DIMM_A2
DIMM_A1
Channel A Channel B Channel C Channel D
DIMM_B2
DIMM_B1
DIMM_C2
DIMM_C1
DIMM_D2
DIMM_D1
Bran ch 0 Branch 1
Intel® 5000P/5000X Memory Controll er Hub
Figure 15. Single Branch Mode Sparing DIMM Configuration
DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.
DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.
DIMM_A1 and DIMM_A2 need not be identical in organization, size and speed.
DIMM_B1 and DIMM_B2 need not be identical in organization, size and speed.
Sparing should be enabled in BIOS setup.
The BIOS will configure Rank Sparing Mode.
The larger of the pairs {DIMM_A1, DIMM_B1} and {DIMM_A2, DIMM_B2} will be
selected as the spare pair unit.
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3.1.3.4.2.2 Dual Branch Mode Sparing
Dual branch mode sparing requires that all eight DIMM sockets be populated and must comply
with the following population rules.
DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.
DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.
DIMM_C1 and DIMM_D1 must be identical in organization, size and speed.
DIMM_C2 and DIMM_D2 must be identical in organization, size and speed.
DIMM_A1 and DIMM_A2 need not be identical in organization, size and speed.
DIMM_B1 and DIMM_B2 need not be identical in organization, size and speed.
DIMM_C1 and DIMM_C2 need not be identical in organization, size and speed.
DIMM_D1 and DIMM_D2 need not be identical in organization, size and speed.
Sparing should be enabled in BIOS setup.
The BIOS will configure Rank Sparing Mode.
The larger of the pairs {DIMM_A1, DIMM_B1}, {DIMM_A2, DIMM_B2},
{DIMM_C1, DIMM_D1}, and {DIMM_C2, DIMM_D2} are selected as the spare pair units.
3.1.4 Snoop Filter (5000X MCH only)
The 5000X version of the MCH includes a snoop filter. Depending on the application of the
server, this feature can be used to enhance the performance of the server by eliminating traffic
on the snooped system bus of the processor being snooped. By removing snoops form the
snooped bus, the full bandwidth is available for other transactions.
3.2 Enterprise South Bridge (ESB2-E)
The ESB2-E is a multi-function device that provides four distinct functions: an I/O controller, a
PCI-X* bridge, a GB Ethernet controller, and a baseboard management controller (BMC). Each
function has its own set of configuration registers. Once configured, each appears to the system
as a distinct hardware controller.
The ESB2-E provides the gateway to all PC-compatible I/O devices and features. The server
boards use the following ESB2-E features:
PCI-X bus interface
Six-channel SATA interface with SATA Busy LED Control
Dual GbE MAC
Baseboard Management Controller (BMC)
Single ATA interface, with Ultra DMA 100 capability
Universal Serial Bus 2.0 (USB) interface
Removable media drives
LPC bus interface
PC-compatible timer/counter and DMA controllers
APIC and 8259 interrupt controller
Power management
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System RTC
General purpose I/O
This section describes the function of most of the listed features as they pertain to these server
boards. For more detail information, see the Intel S5000 Server Board Family Datasheet or the
Intel 631xESB/632xESB I/O Controller Hub Datasheet.
3.2.1 PCI Sub-system
The primary I/O buses for the server board are PCI, PCI Express*, and PCI-X,* with six
independent PCI bus segments. The PCI buses comply with the PCI Local Bus Specification,
Revision 2.3. The table below lists the characteristics of the PCI bus segments. Details about
each bus segment follow the table.
Table 6. PCI Bus Segment Characteristics
PCI Bus Segment Voltage Width Speed Type PCI I/O Card Slots
PCI32
ESB2-E
PXA
ESB2-E
PXA
ESB2-E
PE0
ESB2-E PCI
Express* Port0
PE1
ESB2-E PCI
Express* Port1
PE2
ESB2-E PCI
Express* Port2
PE4, PE5
BNB PCI Express*
Ports 4, 5
PE6, PE7
BNB PCI Express*
Ports 6, 7
3.3 V 32 bit 33 MHz PCI None. Used internally for video controller
3.3 V / 5.0 V 64 bit 100 MHz PCI-X* PCI-X Slot 1
3.3 V / 5.0 V 64 bit 133 MHz PCI-X* PCI-X Slot 2
3.3 V X4 10 Gb/S PCI
Express*
3.3 V X4 10 Gb/S PCI
Express
3.3 V X4 10 Gb/S PCI
Express
3.3 V X8 20 Gb/S PCI
Express
3.3 V X8 20 Gb/S PCI
Express
X4 throughput PCI Express* Slot 4 (ROMB
Slot)
x4 throughput PCI Express* Slot 3 (x8
throughput for server boards that do not
support SAS by combining PE2 with PE1)
x4 throughput to onboard SAS (re-routed
to Slot 3 for server boards that do not
support SAS)
X8 throughput PCI Express* Slot 5
X8 throughput PCI Express* Slot 6
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3.2.1.1 PCI32: 32-bit, 33-MHz PCI Sub-system
All 32-bit, 33-MHz PCI I/O is directed through the ESB2-E ICH6. The 32-bit, 33-MHz PCI
segment created by the ESB2-E-ICH6 is known as the PCI32 segment. The PCI32 segment
supports the following embedded devices:
2D Graphics Accelerator: ATI* ES1000 Video Controller
3.2.1.2 PXA: 64-bit, 133-MHz PCI Sub-system
One 64-bit PCI-X bus segment is directed through the ESB2-E ICH6. This PCI-X segment, PXA,
is routed to PCI-X Slots 1 and 2. With only one PCI-X adapter populated in Slot 2 and Slot 1 left
empty, PCI-X Slot 2 supports a maximum speed of 133MHz. With both Slot 1 and Slot 2
populated, Slot 2 supports a maximum speed of 100MHz. PCI-X Slot 1 supports a maximum
speed of 100MHz even when Slot 2 is not populated.
3.2.1.3 PE0: One x4 PCI Express* Bus Segment
One x4 PCI Express* bus segment is directed through the ESB2-E. This PCI Express* segment,
PE0, is routed to PCI Express* Slot 4 (ROMB Slot).
3.2.1.4 PE1: One x4 PCI Express* Bus Segment
One x4 PCI Express* bus segment is directed through the ESB2-E. This PCI Express* segment,
PE1, is routed to PCI Express* Slot 3. This becomes a x8 PCI Express* bus segment for server
boards that do not support SAS by combining PE2 with PE1.
3.2.1.5 PE2: One x4 PCI Express* Bus Segment
One x4 PCI Express* bus segment is directed through the ESB2-E. This PCI Express* segment,
PE2, is routed to PCI Express* Slot 3 for server boards that do not support SAS, or to the
onboard SAS controller for server boards that do support SAS.
3.2.1.6 PE4, PE5: Two x4 PCI Express* Bus Segments
Two x4 PCI Express* bus segments are directed through the MCH. These PCI Express*
segments, PE4 and PE5, are routed to PCI Express* Slot 5.
3.2.1.7 PE6, PE7: Two x4 PCI Express* Bus Segments
Two x4 PCI Express* bus segments are directed through the MCH. These PCI Express*
segments, PE6 and PE7, are routed to PCI Express* Slot 6.
3.2.1.8 PCI Express* Riser Slot
PCI Express* Slot 6 supports 3
rd
party riser cards for both 1U and 2U system configurations.
Two PCI Express* pins are designated as Riser Type pins with the definitions noted in the table
below.
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SLOT 6 SETUP
2U Riser, 2 x4 PCI Express* Slots2 0 1
1U Riser, 1 x8 PCI Express* Slot3 1 0
1
LP Riser TYPE 1 LP Riser Type 0
GPI: ESB2 GPI 28 GPI: ESB2 GPI 27
PCI-E Pin: B48 [RSVD] PCI-E Pin: B49 [GND]
Notes:
1 The server board contains a weak pull-up resistor on the two Riser Type nets.
2 The 2U riser card needs to pull-down the PCI Express* pin B48 with a 0 ohm resistor
and leave as a No-Connect (NC) PCI Express* pin B49.
3 The 1U riser card needs to follow the standard PCI Express* Adapter pin-out by leaving
pin B48 as a No-Connect (NC) and pin B49 as ground.
The following table provides the supported bus throughput for the given riser card used and the
number of add-in cards installed.
PCI Express* Slot 6 Riser
Support
1U Riser Card X8 NA
2U Riser Card X4 X4
1 add-in card 2 add-in cards
Note: There are no population rules for installing a single add-in card in the 2U riser card; a
single add in card can be installed in either PCI Express* slot.
3.2.2 Serial ATA Support
The ESB2-E has an integrated Serial ATA (SATA) controller that supports independent DMA
operation on six ports and supports data transfer rates of up to 3.0 Gb/s. The six SATA ports on
the server board are numbered SATA-0 thru SATA-5. The SATA ports can be enabled/disabled
and/or configured by accessing the BIOS Setup utility during POST.
3.2.2.1 Intel
The onboard storage capability of this server board includes support for Intel
Server RAID Technology which provides three standard software RAID levels: data stripping
(RAID Level 0), data mirroring (RAID Level 1), and data stripping with mirroring (RAID Level
10). For higher performance, data stripping can be used to alleviate disk bottlenecks by taking
advantage of the dual independent DMA engines that each SATA port offers. Data mirroring is
used for data security. Should a disk fail, a mirrored copy of the failed disk is brought on-line.
There is no loss of either PCI resources (request/grant pair) or add-in card slots.
With the addition of an optional Intel RAID Activation Key, Intel
Technology is also capable of providing fault tolerant data stripping (software RAID Level 5),
such that if a SATA hard drive should fail, the lost data can be restored on a replacement drive
from the other drives that make up the RAID 5 pack.
See Figure 2 Major Board Components for the location of Intel RAID Activation Key connector
location.
®
Embedded Server RAID Technology II Support
®
Embedded Server RAID
®
Embedded
Note: Availability of the Intel RAID Activation Key to support software RAID 5 will be deferred
until after product launch of this server board.
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Intel® Embedded Server RAID Technology functionality requires the following items:
• Intel
• Intel
• Intel
®
ESB-2 IO Controller Hub
®
Embedded Server RAID Technology Option ROM
®
Embedded Server RAID Technology II drivers, most recent revision
• At least two SATA hard disk drives
Intel® Embedded Server RAID Technology is not available in the following configurations:
• The SATA controller in compatible mode
• Intel® Embedded Server RAID Technology II has been disabled
3.2.2.2 Intel
The Intel
®
Embedded Server RAID Technology for SATA Option ROM provides a pre-OS user
interface for the Intel
ability for an Intel
well as to detect any faults in the Intel
to the Intel
®
RAID controller.
®
Embedded Server RAID Technology Option ROM
®
Embedded Server RAID Technology implementation and provides the
®
Embedded Server RAID Technology volume to be used as a boot disk as
®
Embedded Server RAID Technology volume(s) attached
3.2.3 Parallel ATA (PATA) Support
The integrated IDE controller of the ESB2-E ICH6 provides one IDE channel. It redefines
signals on the IDE cable to allow both host and target throttling of data and transfer rates of up
to 100 MB/s. For this server board, the IDE channel was designed to provide optical drive
support to the platform. The BIOS initializes and supports ATAPI devices such as LS-120/240,
CD-ROM, CD-RW and DVD-ROM. The IDE channel is accessed through a single standard 40pin IDE connector (J2J2) that provides the I/O signals. The ATA channel can be configured and
enabled or disabled by accessing the BIOS Setup utility during POST.
3.2.4 USB 2.0 Support
The USB controller functionality integrated into ESB2-E provides the server board with the
interface for up to eight USB 2.0 ports. Four external connectors are located on the back edge
of the server board. One internal 2x5 header (J3J1) is provided, capable of supporting two
optional USB 2.0 ports. One USB port Type A connector (J3G1) is provided to support
installation of a USB device inside the server chassis. An additional USB port is dedicated to the
®
Intel
Remote Management Module (Intel® RMM) connector.
3.3 Video Support
The server board provides an ATI* ES1000 PCI graphics accelerator, along with 16 MB of video
DDR SDRAM and support circuitry for an embedded SVGA video sub-system. The ATI ES1000
chip contains an SVGA video controller, clock generator, 2D engine, and RAMDAC in a 359-pin
BGA. One 4M x 16 x 4-bank DDR SDRAM chip provides 16 MB of video memory.
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The SVGA sub-system supports a variety of modes, up to 1024 x 768 resolution in 8 / 16 /
32 bpp modes under 2D. It also supports both CRT and LCD monitors up to a 100 Hz vertical
refresh rate.
Video is accessed using a standard 15-pin VGA connector found on the back edge of the server
board. The on-board video controller can be disabled using the BIOS Setup Utility or when an
add-in video card is installed. The system BIOS provides the option for dual-video operation
when an add-in video card is configured in the system.
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3.3.1 Video Modes
The ATI* ES1000 chip supports all standard IBM* VGA modes. The following table shows the
2D modes supported for both CRT and LCD.
Table 7. Video Modes
2D Video Mode Support 2D Mode Refresh Rate (Hz)
8 bpp 16 bpp 32 bpp
640x480 60, 72, 75, 85, 90,
100, 120, 160, 200
800x600 60, 70, 72, 75, 85,
90, 100, 120,160
1024x768 60, 70, 72,
75,85,90,100
1152x864 43,47,60,70,75,80,85 Supported Supported Supported
1280x1024 60,70,74,75 Supported Supported Supported
1600x1200 52 Supported Supported Supported
Supported Supported Supported
Supported Supported Supported
Supported Supported Supported
3.3.2 Video Memory Interface
The memory controller sub-system of the ES1000 arbitrates requests from the direct memory
interface, the VGA graphics controller, the drawing co-processor, the display controller, the
video scalar, and the hardware cursor. Requests are serviced in a manner that ensures display
integrity and maximum CPU/co-processor drawing performance.
The server board supports a 16 MB (4 Meg x 16-bit x 4 banks) DDR SDRAM device for video
memory.
3.3.3 Dual Video
The BIOS supports single- and dual-video modes. The dual-video mode is enabled by default.
In single mode (Dual Monitor Video = disabled), the on-board video controller is disabled
when an add-in video card is detected.
In dual mode (On-board Video = enabled, Dual Monitor Video = enabled), the on-board
video controller is enabled and will be the primary video device. The external video card
will be allocated resources and is considered the secondary video device. The BIOS
Setup utility provides options to configure the feature as follows.
On-board Video
Dual Monitor Video
Enabled
Disabled
Enabled
Disabled
Shaded if on-board video is set to "Disabled"
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3.4 SAS Controller
The SAS1064e controller supports x4 PCI Express* link widths and is a single-function PCI
Express end-point device. The SAS controller supports the SAS protocol as described in the
Serial Attached SCSI Standard, version 1.0. The controller also supports SAS 1.1 features.
The SAS1064e controller supports a 32-bit external memory bus that provides an interface for
Flash ROM and NVSRAM devices.
3.4.1 SAS RAID Support
RAID modes 0, 1, and 10 are supported. An optional SAS RAID Key can be used to support SW
RAID 5.
3.4.2 SAS / SATA Connector Sharing
Four SATA connectors are shared between SATA and SAS, depending on the version of the
server board. For SAS server boards, four of the six SATA connectors are used for SAS
functionality. For SATA server boards, all six SATA connectors are used for SATA functionality.
3.5 Network Interface Controller (NIC)
Network interface support is provided from the built in Dual GbE MAC features of the ESB2 in
conjunction with the Intel
provide the server board with support for dual LAN ports designed for 10/100/1000 Mbps
operation.
The 82563EB device is based upon proven PHY technology integrated into Intel’s gigabit
Ethernet controllers. The physical layer circuitry provides a standard IEEE 802.3 Ethernet
interface for 1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and
802.3ab). The 82563EB device is capable of transmitting and receiving data at rates of
1000 Mbps, 100 Mbps, or 10 Mbps.
Each network interface controller (NIC) drives two LEDs located on each network interface
connector. The link / activity LED (at the right of the connector) indicates network connection
when on, and transmit / receive activity when blinking. The speed LED (at the left of the
connector) indicates 1000-Mbps operation when amber, 100-Mbps operation when green, and
10-Mbps when off. The table below provides an overview of the LEDs.
LED Color LED State NIC State
Green/Amber (Left)
Green (Right)
®
82563EB compact Physical Layer Transceiver (PHY). Together, they
Table 8. NIC2 Status LED
Off 10 Mbps
Green 100 Mbps
Amber 1000 Mbps
On Active Connection
Blinking Transmit / Receive activity
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3.5.1 Intel® I/O Acceleration Technolgy
Intel® I/O Acceleration Technology moves network data more efficiently through Dual-Core
®
Intel
Xeon® processor 5000 sequence-based servers for improved application responsiveness
across diverse operating systems and virtualized environments. Intel
application responsiveness by unleashing the power of Dual-Core Intel
sequence through more efficient network data movement and reduced system overhead. Intel
multi-port network adapters with Intel
consolidation and virtualization via stateless network acceleration that seamlessly scales across
multiple ports and virtual machines. Intel
®
I/OAT provide high-performance I/O for server
®
I/OAT provides safe and flexible network acceleration
®
I/OAT improves network
®
Xeon® processors 5000
through tight integration into popular operating systems & virtual machine monitors, avoiding the
support risks of 3rd-party network stacks and preserving existing network requirements such as
teaming and failover.
3.5.2 MAC Address Definition
Each Intel® Server Board S5000PSL / S5000XSL has four MAC addresses assigned to it at the
Intel factory. During the manufacturing process, each server board will have a white MAC
address sticker placed on the board. The sticker will display the MAC address in both bar code
and alpha numeric formats. The printed MAC address is assigned to NIC 1 on the server board.
NIC 2 is assigned the NIC 1 MAC address + 1.
Two additional MAC addresses are assigned to the Baseboard Management Controller (BMC)
embedded in the ESB-2. These MAC addresses are used by the BMC’s embedded network
stack to enable IPMI remote management over LAN. BMC LAN Channel 1 is assigned the NIC1
MAC address + 2, and BMC LAN Channel 2 is assigned the NIC1 MAC address + 3
3.6 Super I/O
Legacy I/O support is provided by using a National Semiconductor* PC87427 Super I/O device.
This chip contains all of the necessary circuitry to support the following functions:
GPIOs
Two serial ports
Keyboard and mouse support
Wake up control
System health support
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3.6.1 Serial Ports
The server board provides two serial ports: an external DB9 serial port and an internal DH10
serial header. The rear DB9 serial A port is a fully-functional serial port that can support any
standard serial device.
Serial B is an optional port that is accessed through a 9-pin internal DH-10 header. A standard
DH10 to DB9 cable can be used to direct serial B to the rear of a chassis. The serial B interface
follows the standard RS232 pin-out as defined in the following table.
Table 9. Serial B Header Pin-out
Pin Signal Name Serial Port B Header Pin-out
1 DCD
2 DSR
3 RX
4 RTS
5 TX
6 CTS
7 DTR
8 RI
9 GND
3.6.2 Floppy Disk Controller
The server board does not support a floppy disk controller interface. However, the system BIOS
recognizes USB floppy devices.
3.6.3 Keyboard and Mouse Support
Dual-stacked PS/2* ports are provided on the back edge of the server board for keyboard and
mouse support. Either port can support a mouse or keyboard. Neither port supports hot
plugging.
3.6.4 Wake-up Control
The super I/O contains functionality that allows various events to power on and power off the
system.
3.6.5 System Health Support
The super I/O provides an interface via GPIOs for BIOS and system management firmware to
activate the diagnostic LEDs, the FRU fault indicator LEDs for processors, FBDIMMS, fans and
the system status LED. See section
The super I/O provides PMW fan control to the system fans, monitors tach and presence signals
for the system fans and monitors server board and front panel temperature.
7 for the location of the LEDs on the server board.
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4. Platform Management
The platform management sub-system is based on the integrated Baseboard Management
Controller features of the ESB2-E. The on-board platform management sub-system consists of
communication buses, sensors, system BIOS, and server management firmware. The following
diagram provides an overview of the Server Management Bus (SMBUS) architecture used on
this server board.
See Appendix B for on-board sensor data.
For more detailed platform management information, see the Intel
Datasheet.
®
S5000 Server Board Family
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Figure 16. SMBUS Block Diagram
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5. Connector / Header Locations and Pin-outs
5.1 Board Connector Information
The following section provides detailed information regarding all connectors, headers and
jumpers on the server board.
lists all connector types available on the board and the corresponding reference designators
printed on the silkscreen.
Connector Quantity Reference Designators Connector Type Pin
Power supply 4 J9B5
CPU 2 J8G1, J5G1 CPU sockets 771
Main memory 8 J7B1, J7B2, J7B3, J8B1, J8B2, J8B3, J9B1, J9B2 DIMM sockets 240
PCI-X 2 J1B2, J2B1 Card edge
PCI Express* x8 2 J2B2, J3B1 Card edge
PCI Express* x16 2 J4B2, J4B1 Card edge
Intel® RMM 1 J5B1 Mezzanine 120
RMM NIC 1 J3B2 Mezzanine 40
RAID Key 2 J1E1, J1D3 Key holder 3
IDE 1 J2J2 Shrouded header 40
System fans 4 J3H1, J3H2, J3H3, J3H4 Header 6
System fans 2 J9B3, J9B4 Header 4
CPU fans 2 J9J1, J5J1 Header 4
Battery 1 XBT4D1 Battery holder 3
Keyboard / mouse 1 J9A1 PS2, stacked 12
Stacked RJ45 /
2xUSB
Stacked video /
verial port A
Serial port B 1 J1B1 Header 10
Front panel 1 J1E4 Header 24
Internal USB 1 J3J1 Header 10
Internal USB 1 J3G1 Type A
Chassis Intrusion 1 J1A1 Header 2
Serial ATA / SAS 6 J1G1, J1F2, J1H1, J1G2, J1J1, J1H2 Header 7
HSBP / SGPIO 4 J1J2, J1J7, J2H1, J1J5 Header 4
SES I2C 1 J1J3 Header 3
2 JA6A1, JA6A2 External LAN
1 J7A1 External DSub /
Table 10. Board Connector Matrix
Table 10. Board Connector Matrix
J3J2
J9D1
J5A2
Main power
CPU power
P/S aux / IPMB
P12V4 power
built-in magnetic
and dual USB
DB9
connector
Count
24
8
5
4
22
24
4
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Connector Quantity Reference Designators Connector Type Pin
Count
LCP/AUX IPMB 1 J2J1 Header 4
IPMB 1 J4J1 Header 3
HDD Activity 1 J2J3 Header 2
Configuration
jumpers
4 J1D2 (Password Clear), J1D1 (CMOS Clear), J1C3
(BIOS Bank Select), J1E3 (BMC Force Update)
Jumper 3
5.2 Power Connectors
The main power supply connection uses an SSI-compliant 2x12 pin connector (J9B5). In
addition, there are three additional power related connectors:
One SSI-compliant 2x4 pin power connector (J3J2) provides 12V power to the CPU
Voltage Regulators
One SSI-compliant 1x5 pin connector (J9D1) provides I
supply
One SSI-compliant 2x2 pin connector (J5A2) provides additional 12V power to the
server board
The following tables define the connector pin-outs.
2
C monitoring of the power
Table 11. Power Connector Pin-out (J9B5)
Pin Signal Color Pin Signal Color
1 +3.3 Vdc Orange 13 +3.3 Vdc Orange
2 +3.3 Vdc Orange 14 -12 Vdc Blue
3 GND Black 15 GND Black
4 +5 Vdc Red 16 PS_ON# Green
5 GND Black 17 GND Black
6 +5 Vdc Red 18 GND Black
7 GND Black 19 GND Black
8 PWR_OK Gray 20 RSVD_(-5 V) White
9 5 VSB Purple 21 +5 Vdc Red
10 +12 Vdc Yellow 22 +5 Vdc Red
11 +12 Vdc Yellow 23 +5 Vdc Red
12 +3.3 Vdc Orange 24 GND Black
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Table 12. 12 V Power Connector Pin-out (J3J2)
Pin Signal Color
1 GND Black
2 GND Black
3 GND Black
4 GND Black
5 +12 Vdc Yellow / black
6 +12 Vdc Yellow / black
7 +12 Vdc Yellow / black
8 +12 Vdc Yellow / black
Table 13. Power Supply Signal Connector Pin-out (J9D1)
Pin Signal Color
1 SMB_CLK_ESB_FP_PWR_R Orange
2 SMB_DAT_ESB_FP_PWR_R Black
3 SMB_ALRT_3_ESB_R Red
4 3.3 V SENSE- Yellow
5 3.3 V SENSE+ Green
Table 14. P12V4 Power Connector Pin-out (J5A2)
Pin Signal Color
1 GND Black
2 GND Black
3 +12 Vdc Yellow / black
4 +12 Vdc Yellow / black
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5.3 System Management Headers
5.3.1 Intel® Remote Management Module (Intel® RMM) Connector
A 120-pin Intel® RMM connector (J5B1) is included on the server board to support the optional
®
Intel
Remote Management Module. There is no support for third party ASMI cards on this
server board.
Note: This connector is not compatible with the Intel
®
Server Management Module Professional
Edition (Product Code AXXIMMPRO) or the Intel® Server Management Module Advanced
Edition (Product Code AXXIMMADV).
Table 15. RMM Connector Pin-out (J5B1)
Pin Signal Name Pin Signal Name
1 Reserved - NC 2 GND
3 ESB_PLT_RST_G1_N 4 Reserved - NC
5 GND 6 Reserved - NC
7 Reserved - NC 8 GND
9 Reserved - NC 10 GND
11 GND 12 Reserved - NC
13 GND 14 IRQ_SERIAL_R
15 USB_ESB_P7P 16 GND
17 USB_ESB_P7N 18 GND
19 GND 20 Reserved - NC
21 P3V3 22 Reserved - NC
23 LPC_LAD<0> 24 GND
25 LPC_LAD<1> 26 LPC_FRAME_N
27 P3V3 28 LPC_LAD<2>
29 LPC_LCLK 30 LPC_LAD<3>
31 P3V3 32 P3V3
33 SMB_1_3V3SB_MS_DAT 34 SMB_IPMB_3V3SB_DAT
35 SMB_1_3V3SB_SL_DAT 36 SMB_IPMB_3V3SB_CLK
37 SMB_1_3V3SB_MS_CLK 38 SMB_0_3V3SB_MS_CLK
39 SMB_1_3V3SB_INT 40 SMB_0_3V3SB_INT
41 P3V3_AUX 42 SMB_0_3V3SB_MS_DAT
43 SPB_IMM_DSR_N 44 SMB_0_3V3SB_SL_DAT
45 SPB_IMM_RTS_N 46 P3V3_AUX
47 SPB_IMM_CTS_N 48 FM_IMM_PRESENT_N
49 SPB_IMM_DCD_N 50 SPB_IMM_DTR_N
51 SPB_RI_N 52 SPB_IMM_SIN
53 SPB_IMM_SOUT 54 P3V3_AUX
55 P3V3_AUX 56 V_LCDDATA7
57 V_LCDCNTL3 56 V_LCDDATA6
59 P3V3_AUX 60 V_LCDDATA5
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Pin Signal Name Pin Signal Name
61 Reserved - NC 62 V_LCDDATA4
63 Reserved - NC 64 V_LCDDATA3
65 GND 66 V_LCDCNTL1
67 V_LCDCNTL0 68 GND
69 Reserved - NC 70 V_LCDDATA15
71 GND 72 V_LCDDATA714
73 V_LCDDATA23 74 V_LCDDATA13
75 V_LCDDATA22 76 V_LCDDATA12
77 V_LCDDATA21 78 V_LCDDATA11
79 V_LCDDATA20 80 GND
81 V_LCDDATA19 82 V_LCDCNTL2
83 GND 84 V_DVO_DDC_SDA
85 FM_MAN_LAN_TYPE1 86 V_DVO_DDC_SCL
87 FM_MAN_LAN_TYPE2 88 RST_PS_PWRGD
89 Reserved - NC 90 Reserved - NC
91 Reserved - NC 92 Reserved - NC
93 MII_MDC_RMII_SPARE 94 Reserved - NC
95 MII_COL_RMIIB_RXER 96 GND
97 GND 98 MII_CRS_RMIIB_CRS
99 MII_TXER_RMIIB_TXEN 100 MII_TXCLK_RMIIB_RXCLK
101 MII_MDIO_RMIIB_PRESENT 102 GND
103 GND 104 MII_TXD3_RMIIB_TXD1
105 MII_RXD3_RMIIB_RXD1 106 MII_TXD2_RMIIB_TXD0
107 MII_RXD2_RMIIB_RXD0 108 GND
109 GND 110 MII_TXD1_RMIIA_TXD1
111 MII_RXD1_RMIIA_RXD1 112 MII_TXD0_RMIIA_TXD0
113 MII_RXD0_RMIIA_RXD0 114 GND
115 GND 116 MII_TXEN_RMIIA_TXEN
117 MII_RXCLK 118 MII_RXER_RMIIA_TXER
119 MII_RXDV_RMIIA_CRS 120 GND
5.3.2 LCP / AUX IPMB Header
Table 16. LPC / AUX IPMB Header Pin-out (J2J1)
Pin Signal Name Description
1 SMB_IPMB_5VSB_DAT BMC IMB 5V standby data line
2 GND Ground
3 SMB_IPMB_5VSB_CLK BMC IMB 5V standby clock line
4 P5V_STBY +5 V standby power
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5.3.3 IPMB Header
Table 17. IPMB Header Pin-out (J4J1)
Pin Signal Name Description
1 SMB_IPMB_5VSB_DAT BMC IMB 5V Standby Data Line
2 GND Ground
3 SMB_IPMB_5VSB_CLK BMC IMB 5V Standby Clock Line
5.3.4 HSBP Header
Table 18. HSBP Header Pin-out (J1J7, J1J2)
Pin Signal Name Description
1 SMB_IPMB_5V_DAT BMC IMB 5V Data Line
2 GND Ground
3 SMB_IPMB_5V_CLK BMC IMB 5V Clock Line
4 GND – HSBP_A
P5V – HSBP_B
Ground for HSBP A
+5V for HSBP B
5.3.5 SGPIO Header
Table 19. SGPIO Header Pin-out (J2H1, J1J5)
Pin Signal Name Description
1 SGPIO_CLOCK SGPIO Clock Signal
2 SGPIO_LOAD SGPIO Load Signal
3 SGPIO_DATAOUT SGPIO Data Out
4 SGPIO_DATAIN SGPIO Data In
5.3.6 SES I2C
Table 20. SES I2C Header Pin-out (J1J3)
Pin Signal Name Description
1 SMB_SAS_3V3_DAT BMC SAS 3V Data Line
2 GND Ground
3 SMB_SAS_3V3_CLK BMC SAS 3V Clock Line
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5.3.7 HDD Activity LED Header
Table 21. HDD Activity LED Header Pin-out (J2J3)
Pin Signal Name Description
1 LED_SCSI_CONN_N HDD Activity LED Input
2 GND Ground
5.4 Front Panel Connector
The server board provides a 24-pin SSI front panel connector (J1E4) for use with Intel® and
third-party chassis. The following table provides the pin-out for this connector.
Table 22. Front Panel SSI Standard 24-pin Connector Pin-out (J1E4)
Pin Signal Name Pin Signal Name
1 P3V3_STBY 2 P3V3_STBY
3 Key 4 P5V_STBY
5 FP_PWR_LED_N 6 FP_ID_LED_BUF_N
7 P3V3 8 FP_LED_STATUS_GREEN_N
9 LED_HDD_ACTIVITY_N 10 FP_LED_STATUS_A MBER_N
11 FP_PWR_BTN_N 12 NIC1_ACT_LED_N
13 GND 14 NIC1_LINK_LED_N
15 BMC_RST_BTN_N 16 SMB_SENSOR_3V3STB_DATA
17 GND 18 SMB_SENSOR_3V3STB_CLK
19 FP_ID_BTN_N 20 FP_CHASSIS_INTRU
21 FM_SIO_TEMP_SENSOR 22 NIC2_ACT_LED_N
23 FP_NMI_BTN_N 24 NIC2_LINK_LED_N
5.5 I/O Connectors
5.5.1 VGA Connector
The following table details the pin-out definition of the VGA connector (J7A1) that is part of the
stacked video / serial port A connector.
Table 23. VGA Connector Pin-out (J7A1)
Pin Signal Name Description
1 V_IO_R_CONN Red (analog color signal R)
2 V_IO_G_CONN Green (analog color signal G)
3 V_IO_B_CONN Blue (analog color signal B)
4 TP_VID_CONN_B4 No connection
5 GND Ground
6 GND Ground
7 GND Ground
8 GND Ground
9 TP_VID_CONN_B9 No connection
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Pin Signal Name Description
10 GND Ground
11 TP_VID_CONN_B11 No connection
12 V_IO_DDCDAT DDCDAT
13 V_IO_HSYNC_CONN HSYNC (horizontal sync)
14 V_IO_VSYNC_CONN VSYNC (vertical sync)
15 V_IO_DDCCLK DDCCLK
5.5.2 NIC Connectors
The server board provides two stacked RJ45 / 2xUSB connectors side-by-side on the back
edge of the board (JA6A1, JA6A2). The pin-out for NIC connectors are identical and are defined
in the following table.
Table 24. RJ-45 10/100/1000 NIC Connector Pin-out (JA6A1, JA6A2)
Pin Signal Name
1 GND
2 P1V8_NIC
3 NIC_A_MDI3P
4 NIC_A_MDI3N
5 NIC_A_MDI2P
6 NIC_A_MDI2N
7 NIC_A_MDI1P
8 NIC_A_MDI1N
9 NIC_A_MDI0P
10 NIC_A_MDI0N
11 (D1) NIC_LINKA_1000_N (LED
12 (D2) NIC_LINKA_100_N (LED)
13 (D3) NIC_ACT_LED_N
14 NIC_LINK_LED_N
15 GND
16 GND
5.5.3 IDE Connector
The server board provides one legacy IDE ATA100 40-pin connector (J2J2). The pin-out is
defined in the following table.
Table 25. IDE 40-pin Connector Pin-out (J2J2)
Pin Signal Name Pin Signal Name
1 ESB_PLT_RST_IDE_N 2 GND
3 RIDE_DD_7 4 RIDE_DD_8
5 RIDE_DD_6 6 RIDE_DD_9
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Pin Signal Name Pin Signal Name
7 RIDE_DD_5 8 RIDE_DD_10
9 RIDE_DD_4 10 RIDE_DD_11
11 RIDE_DD_3 12 RIDE_DD_12
13 RIDE_DD_2 14 RIDE_DD_13
15 RIDE_DD_1 16 RIDE_DD_14
17 RIDE_DD_0 18 RIDE_DD_15
19 GND 20 KEY
21 RIDE_DDREQ 22 GND
23 RIDE_DIOW_N 24 GND
25 RIDE_DIOR_N 26 GND
27 RIDE_PIORDY 28 GND
29 RIDE_DDACK_N 30 GND
31 IRQ_IDE 32 TP_PIDE_32
33 RIDE_DA1 34 IDE_PRI_CBLSNS
35 RIDE_DA0 36 RIDE_DA2
37 RIDE_DCS1_N 38 RIDE_DCS3_N
39 LED_IDE_N 40 GND
5.5.4 Intel® Remote Management Module NIC Connector
The server board provides an internal 40-pin connector (J3B2) to accommodate a proprietary
form factor Intel
out of the Intel
®
Remote Management Module NIC module. The following table details the pin-
®
RMM NIC module connector.
Table 26. 40-pin RMM NIC Module Connector Pin-out (J3B2)
Pin Signal Name Pin Signal Name
1 FM_MAN_LAN_TYPE2 2 FM_MAN_LAN_TYPE1
3 P3V3_AUX 4 MII_MDIO_RMIIB_PRESENT
5 P3V3_AUX 6 MII_MDC_RMII_SPARE
7 GND 8 MII_RXD3_RMIIB_RXD1
9 GND 10 MII_RXD2_RMIIB_RXD0
11 GND 12 MII_RXD1_RMIIA_RXD1
13 GND 14 MII_RXD0_RMIIA_RXD0
15 GND 16 MII_RXDV_RMIIA_CRS
17 GND 18 MII_RXCLK
19 GND 20 MII_RXER_RMIIA_RXER
21 GND 22 KEY
23 GND 24 MII_TXCLK_RMIIB_RXCLK
25 GND 26 MII_TXEN_RMIIA_TXEN
27 GND 28 MII_TXD0_RMIIA_TXD0
29 GND 30 MII_TXD1_RMIIA_TXD1
31 GND 32 MII_TXD2_RMIIB_TXD0
33 GND 34 MII_TXD3_RMIIB_TXD1
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Pin Signal Name Pin Signal Name
35 P3V3_AUX 36 MII_COL_RMIIB_RXER
37 P3V3_AUX 38 MII_CRS_RMIIB_CRS
39 P3V3_AUX 40 MII_TXER_RMIIB_TXEN
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5.5.5 SATA / SAS Connectors
The server board provides up to six SATA / SAS connectors:
SATA-0 (J1J1)
SATA-1 (J1H2)
SATA-2 / SAS-0 (J1H1)
SATA-3 / SAS-1 (J1G2)
SATA-4 / SAS-2 (J1G1)
SATA-5 / SAS-3 (J1F2)
The pin configuration for each connector is identical and is defined in the following table.
Table 27. SATA / SAS Connector Pin-out (J1J1, J1H2, J1H1, J1G2, J1G1, J1F2)
Pin Signal Name Description
1 GND Ground
2 SATA/SAS_TX_P_C Positive side of transmit differential pair
3 SATA/SAS_TX_N_C Negative side of transmit differential pair
4 GND Ground
5 SATA/SAS_RX_N_C Negative side of receive differential pair
6 SATA/SAS_RX_P_C Positive side of receive differential pair
7 GND Ground
5.5.6 Serial Port Connectors
The server board provides one external DB9 Serial A port (J7A1) and one internal 9-pin serial B
header (J1B1). The following tables define the pin-outs.
Table 28. External DB9 Serial A Port Pin-out (J7A1)
Pin Signal Name Description
1 SPA_DCD DCD (carrier detect)
2 SPA_SIN_L RXD (receive data)
3 SPA_SOUT_N TXD (Transmit data)
4 SPA_DTR DTR (Data terminal ready)
5 GND Ground
6 SPA_DSR DSR (data set ready)
7 SPA_RTS RTS (request to send)
8 SPA_CTS CTS (clear to send)
9 SPA_RI RI (Ring Indicate)
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Table 29. Internal 9-pin Serial B Header Pin-out (J1B1)
Pin Signal Name Description
1 SPB_DCD DCD (carrier detect)
2 SPB_DSR DSR (data set ready)
3 SPB_SIN_L RXD (receive data)
4 SPB_RTS RTS (request to send)
5 SPB_SOUT_N TXD (Transmit data)
6 SPB_CTS CTS (clear to send)
7 SPB_DTR DTR (Data terminal ready)
8 SPB_RI RI (Ring indicate)
9 SPB_EN_N Enable
5.5.7 Keyboard and Mouse Connector
Two stacked PS/2* ports (J9A1) support a keyboard and a mouse. Either PS/2 port can support
a mouse or keyboard. The following table details the pin-out of the PS/2 connectors.
Table 30. Stacked PS/2 Keyboard and Mouse Port Pin-out (J9A1)
Pin Signal Name Description
1 KB_DATA_F Keyboard data
2 TP_PS2_2 Test point – keyboard
3 GND Ground
4 P5V_KB_F Keyboard / mouse power
5 KB_CLK_F Keyboard clock
6 TP_PS2_6 Test point – keyboard / mouse
7 MS_DAT_F Mouse data
8 TP_PS2_8 Test point – keyboard / mouse
9 GND Ground
10 P5V_KB_F Keyboard / mouse power
11 MS_CLK_F Mouse clock
12 TP_PS2_12 Test point – keyboard / mouse
13 GND Ground
14 GND Ground
15 GND Ground
16 GND Ground
17 GND Ground
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5.5.8 USB Connector
The following table details the pin-out of the external USB connectors (JA6A1, JA6A2) found on
the back edge of the server board.
Table 31. External USB Connector Pin-out (JA6A1, JA6A2)
Pin Signal Name Description
1 USB_OC USB_PWR
2 USB_PN DATAL0 (Differential data line paired with DATAH0)
3 USB_PP DATAH0 (Differential data line paired with DATAL0)
4 GND Ground
One 2x5 connector on the server board (J3J1) provides an option to support an additional two
USB ports. The pin-out of the connector is detailed in the following table.
Table 32. Internal USB Connector Pin-out (J3J1)
Pin Signal Name Description
1 USB2_VBUS5 USB power (port 5)
2 USB2_VBUS4 USB power (port 4)
3 USB_ESB_P5N_CONN USB port 5 negative signal
4 USB_ESB_P4N_CONN USB port 4 negative signal
5 USB_ESB_P5P_CONN USB port 5 positive signal
6 USB_ESB_P4P_CONN USB port 4 positive signal
7 Ground
8 Ground
9 Key No pin
10 TP_USB_ESB_NC Test point
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5.6 Fan Headers
The server board provides four SSI-compliant 4-pin and four SSI-compliant 6-pin fan headers to
be used as CPU, and IO cooling fans. 3-pin fans are supported on all fan headers. 6-pin fans
are supported on header J3H4, J3H3, J3H2, and J3H1. 4-pin fans are supported on header
J9J1, J5J1, J3H4, J3H3, J9B4, and J9B3. 4-pin fans are not supported on header J3H2, and
J3H1, since these headers are tied to the CPU1 PWM. These fan headers should also not be
used for CPU cooling fans. The pin configuration for each of the 4-pin and 6-pin fan headers is
identical and is defined in the following tables.
Two 4-pin fan headers are designated as processor cooling fans:
- CPU1 fan (J9J1)
- CPU2 fan (J5J1)
Four 6-pin fan headers are designated as hot-swap system fans:
- Hot-swap system fan 1 (J3H4)
- Hot-swap system fan 2 (J3H3)
- Hot-swap system fan 3 (J3H2)
- Hot-swap system fan 4 (J3H1)
Two 4-pin fan headers are designated as rear system fans:
- System fan 5 (J9B4)
- System fan 6 (J9B3)
Table 33. SSI 4-pin Fan Header Pin-out (J9J1, J5J1, J9B3, J9B4)
Pin Signal Name Type Description
1 Ground GND Ground is the power supply ground
2 12V Power Power supply 12 V
3 Fan Tach In FAN_TACH signal is connected to the BMC to monitor the fan speed
4 Fan PWM Out FAN_PWM signal to control fan speed
Table 34. SSI 6-pin Fan Header Pin-out (J3H1, J3H2, J3H3, J3H4)
Pin Signal Name Type Description
1 Ground GND Ground is the power supply ground
2 12V Power Power supply 12 V
3 Fan Tach In FAN_TACH signal is connected to the BMC to monitor the fan speed
4 Fan PWM Out FAN_PWM signal to control fan speed
5 Fan Presence In Indicates the fan is present
6 Fan Fault LED Out Lights the fan fault LED
Note: Intel Corporation server boards support peripheral components and contain a number of
high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s
own chassis are designed and tested to meet the intended thermal requirements of these
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components when the fully integrated system is used together. It is the responsibility of the
system integrator that chooses not to use Intel developed server building blocks to consult
vendor datasheets and operating parameters to determine the amount of air flow required for
their specific application and environmental conditions. Intel Corporation can not be held
responsible if components fail or the server board does not operate correctly when used outside
any of their published operating or non-operating limits.
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6. Jumper Blocks
The server board has several 3-pin jumper blocks that can be used to configure, protect, or
recover specific features of the server board.
Pin 1 on each jumper block can be identified by the following symbol on the silkscreen: ▼
BIOS Bank Select
Force Lower
Bank
Normal
Operation
(default)
CMOS Clear
2
3
J1C3
Disable
Enable
Password Clear
Protect
Clear
BMC Force Update
Disable
Enable
2
3
J1D1
2
3
J1D2
2
3
J1E3
Figure 17. Jumper Blocks (J1C3, J1D1, J1D2, J1E32)
Table 35. Server Board Jumpers (J1C3, J1D1, J1D2, J1E3)
Jumper Name Pins System Results
Select
J1D1: CMOS Clear
J1D2: Password
Clear
J1E3: BMC Forced
Update
1-2
2-3
1-2
2-3 If these pins are jumpered, the CMOS settings will be cleared immediately. These pins
1-2
2-3 If these pins are jumpered, administrator and user passwords will be cleared
1-2
2-3 BMC Firmware Force Update Mode – Enabled
If these pins are jumper the system will boot from an alternate BIOS image. J1C3: BIOS Bank
System is configured for normal operation. (Default)
These pins should have a jumper in place for normal system operation. (Default)
should not be jumpered for normal operation
These pins should have a jumper in place for normal system operation. (Default)
immediately. These pins should not be jumpered for normal operation.
BMC Firmware Force Update Mode – Disabled (Default)
AF000422
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6.1 CMOS Clear and Password Reset Usage Procedure
The CMOS Clear (J1D1) and Password Reset (J1D2) recovery features are designed such that
the desired operation can be achieved with minimal system down time. The usage procedure for
these two features has changed from previous generation Intel server boards. The following
procedure outlines the new usage model.
1. Power down server. Do not unplug the power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
3. Move jumper from the default operating position, covering pins 1 and 2, to the reset /
clear position, covering pins 2 and 3.
4. Wait 5 seconds.
5. Move the jumper back to default position, covering pins 1 and 2.
6. Close the server chassis.
7. Power up the server.
The password and/or CMOS is now cleared and can be reset by going into BIOS setup.
Note: Removing AC Power before performing the CMOS Clear operation will cause the system
to automatically power up and immediately power down, after the procedure is followed and AC
power is re-applied. If this happens,, remove the AC power cord again, wait 30 seconds, and reinstall the AC power cord. Power up system and proceed to the <F2> BIOS Setup Utility to reset
the desired settings.
6.2 BMC Force Update Procedure
When performing a standard BMC firmware update procedure, the update utility places the
BMC into an update mode, allowing the firmware to load safely onto the flash device. In the
unlikely event that the BMC firmware update process fails due to the BMC not being in the
proper update state, the server board provides a BMC Force Update jumper (J1E3) which will
force the BMC into the proper update state. The following procedure should be following in the
event the standard BMC firmware update process fails.
1. Power down and remove the AC power cord.
2. Open the server chassis. See your server chassis documentation for instructions.
3. Move jumper from the default operating position, covering pins1 and 2, to the enabled
position, covering pins 2 and 3.
4. Close the server chassis.
5. Reconnect the AC cord and power up the server.
6. Perform the BMC firmware update procedure as documented in the README.TXT file
that is included in the given BMC firmware update package. After successful completion
of the firmware update process, the firmware update utility may generate an error stating
that the BMC is still in update mode.
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7. Power down and remove the AC power cord.
8. Open the server chassis.
9. Move jumper from the enabled position, covering pins 2 and 3 to the disabled position,
covering pins 1 and 2.
10. Close the server chassis.
11. Reconnect the AC cord and power up the server.
Note: Normal BMC functionality is disabled with the Force BMC Update jumper is set to the
enabled position. The server should never be run with the BMC Force Update jumper set in this
position. This jumper setting should only be used when the standard firmware update process
fails. This jumper should remain in the default / disabled position when the server is running
normally.
6.3 BIOS Select Jumper
The jumper block at J1C3, located at the left of PCI-X* slot 1, is used to select which BIOS
image the system will boot to. Pin 1 on the jumper is identified with a ‘▼’. This jumper should
only be moved if you want to force the BIOS to boot to the secondary bank, which may hold a
different version of BIOS.
The rolling BIOS feature of the server board will automatically alternate the boot BIOS to the
secondary bank if the BIOS image in the primary bank is corrupted and cannot boot.
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7. Intel® Light Guided Diagnostics
The server boards have several on-board diagnostic LEDs to assist in troubleshooting boardlevel issues. This section provides a description the location and function of each LED on the
server board. For a more detailed description of what drives the diagnostic LED operation, see
the Intel
7.1 5 Volt Standby LED
Several server management features of this server board require that a 5 volt stand-by voltage
be supplied from the power supply. Some of the features and components that require this
voltage be present when the system is “Off” include the BMC within the ESB2-E, onboard NICs,
and optional RMM connector with Intel RMM installed.
The LED is located just to the right of the CMOS Battery in the center of the server board and is
labeled “5VSB_LED” is illuminated when AC power is applied to the platform and 5 volt standby
voltage is supplied to the server board by the power supply.
®
S5000 Server Board Family Datasheet.
AF000224
Figure 18. 5 Volt Standby Status LED Location
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7.2 Fan Fault LEDs
Fan fault LEDs are present for the two CPU fans and the two rear system fans. The two CPU
fan fault LEDs are located next to each CPU fan header. The two rear system fan fault LEDs
are located next to each rear system fan header are shown in the following figure.
AF000203
Figure 19. Fan Fault LED Locations
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7.3 System ID LED and System Status LED
The server board provides LEDs for both system ID and system status. These LEDs are located
in the rear I/O area of the server board between the PS/2* mouse / keyboard stacked
connectors and the video / serial stacked connectors. The location of these LEDs are shown in
the following figure.
A B
AF000204
A. System ID LED
B. System Status LED
Figure 20. System ID LED and System Status LED Locations
The blue System ID LED can be illuminated using either of two mechanisms.
By pressing the System ID Button on the system front panel the ID LED will display a
solid blue color, until the button is pressed again.
By issuing the appropriate hex IPMI “Chassis Identify” value, the ID LED will either Blink
Blue for 15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI
Chassis Identify value is issued to turn it off.
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The bi-color System Status LED operates as follows:
Table 36. System Status LED
Color State Criticality Description
Off N/A Not ready AC power off
Green /
Amber
Green Solid on System OK System booted and ready.
Green Blink Degraded System degraded
Amber Blink Non-critical Non-fatal alarm – system is likely to fail
Amber Solid on Critical, non-
Alternating
Blink
Not ready Pre DC Power On – 20-30 second BMC Initialization when AC is
applied to the server. Control Panel buttons are disabled until BMC
initialization is complete.
• Unable to use all of the installed memory (more than one
DIMM installed).
• Correctable errors over a threshold of 10 and migrating to a
spare DIMM (memory sparing). This indicates that the user
no longer has spared DIMMs indicating a redundancy lost
condition. Corresponding DIMM LED should light up.
• In mirrored configuration, when memory mirroring takes
place and system loses memory redundancy. This is not
covered by (2).
• Redundancy loss such as power-supply or fan. This does
not apply to non-redundant sub-systems.
• PCI-e link errors
• CPU failure / disabled – if there are two processors and one
of them fails
• Fan alarm – Fan failure. Number of operational fans should
be more than minimum number needed to cool the system
• Non-critical threshold crossed – Temperature and voltage
• Critical voltage threshold crossed
• VRD hot asserted
• Minimum number of fans to cool the system not present or
failed
• In non-sparing and non-mirroring mode if the threshold of
ten correctable errors is crossed within the window
Fatal alarm – system has failed or shutdown
recoverable
• DIMM failure when there is one DIMM present, no good
memory present
• Run-time memory uncorrectable error in non-redundant
mode
• IERR signal asserted
• Processor 1 missing
• Temperature (CPU ThermTrip, memory TempHi, critical
threshold crossed)
• No power good – power fault
• Processor configuration error (for instance, processor
stepping mismatch)
7.3.1 System Status LED – BMC Initialization
When the AC power is first applied to the system and 5V-STBY is present, the BMC
controller on the server board requires 5-10 seconds to initialize. During this time, the
system status LED will blink, alternating between amber and green, and the power button
functionality of the control panel is disabled preventing the server from powering up. Once
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BMC initialization has completed, the status LED will stop blinking and the power button
functionality is restored and can be used to turn on the server.
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7.4 DIMM Fault LEDs
The server board provides a memory fault LED for each DIMM socket. These LEDs are located
towards the rear of the server board next to each DIMM connector.
AF000205
Figure 21. DIMM Fault LED Locations
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7.5 Processor Fault LEDs
The server board provides a fault LED for each processor socket. These LEDs are located near
the processor sockets.
AF000206
Figure 22. Processor Fault LED Locations
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7.6 Post Code Diagnostic LEDs
POST code diagnostic LEDs are located on the back edge of the server board in the rear I/O
area of the server board between the PS/2 mouse / keyboard stacked connectors and the video
/ serial stacked connectors.
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS will display the given POST code to the POST code diagnostic
LEDs on the back edge of the server board. To assist in troubleshooting a system hang during
the POST process, the Diagnostic LEDs can be used to identify the last POST process to be
executed. See Appendix C for a complete description of how these LEDs are read, and for a list
of all supported POST codes.
A. Status LED D. Bit 2 LED (POST LED)
B. ID LED E. Bit 1 LED (POST LED)
C. MSB LED (POST LED) F. LSB LED (POST LED)
Figure 23. POST Code Diagnostic LED Location
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8. Design and Environmental Specifications
8.1 Server Boards S5000PSL and S5000XSL Design Specifications
The operation of the server boards at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect system reliability.
Table 37. Server Board Design Specifications
Operating Temperature 0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature -40º C to 70º C (-40º F to 158º F)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 50 G, 170 inches / sec
Shock (Packaged)
<20 pounds
20 to <40 pounds
40 to <80 pounds
80 to <100 pounds
100 to <120 pounds
120 pounds
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Note:
1
Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel® Xeon®
processor 5000 sequence maximum case temperature.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of air flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
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8.2 Server Board Power Requirements
This section provides power supply design guidelines for a system using the Intel® Server Boards S5000PSL and S5000XSL,
including voltage and current specifications, and power supply on/off sequencing characteristics. The following diagram shows the
power distribution implemented on these server boards.
Figure 24. Power Distribution Block Diagram
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8.2.1 Processor Power Support
The server board supports the Thermal Design Point (TDP) guideline for Intel® Xeon®
processors. The Flexible Motherboard Guidelines (FMB) has also been followed to help
determine the suggested thermal and current design values for anticipating future processor
needs. The following table provides maximum values for Icc, TDP power and T
core Intel
®
Xeon® processor 5000 sequence family.
Table 38. Intel® Xeon® Processor Dual Processor TDP Guidelines
TDP Power Max TCASE Icc MAX
130 W 70º C 150 A
Note: These values are for reference only. The Dual-Core Intel® Xeon®) processor 5000
sequence Datasheet contains the actual specifications for the processor. If the values found in
the Dual-Core Intel(r) Xeon(r) processor 5000 sequence Datasheet are different than those
published here, the Dual-Core Intel(r) Xeon(r) processor 5000 sequence Datasheet values will
supersede these, and should be used.
for the dual
CASE
8.3 Power Supply Output Requirements
This section is for reference purposes only. The intent is to provide guidance to system
designers to determine a power supply for use with this server board. This section specifies the
power supply requirements Intel used to develop a power supply for its 5U server system.
The combined power of all outputs shall not exceed the rated output power of the power supply.
The power supply must meet both static and dynamic voltage regulation requirements for the
minimum loading conditions.
Table 39. 550 W Load Ratings
Voltage Minimum
Continuous
+3.3 V 1.5 A 24 A
+5 V 1.0 A 24 A
+12 V1 0.5 A 16 A 18 A
+12 V2 0.5 A 16 A 18 A
+12 V3 0.5 A 14 A
+12 V4 0.5 A 8 A 13 A
-12 V 0 A 0.5 A
+5 VSB 0.1 A 3.0 A 3.5 A
1. Maximum continuous total DC output power should not exceed 550 W.
2. Maximum continuous combined load on +3.3 VDC and +5 VDC outputs shall not exceed 140W.
3. Maximum peak total DC output power should not exceed 660W.
4. Peak power and current loading shall be supported for a minimum of 12 seconds.
5. Maximum combined current for the 12 V outputs shall be 41 A.
6. Peak current for the combined 12 V outputs shall be 50A.
Maximum
Continuous
Peak
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8.3.1 Grounding
The grounds of the pins of the power supply output connector provide the power return path.
The output connector ground pins is connected to safety ground (power supply enclosure). This
grounding should is designed to ensure passing the maximum allowed common mode noise
levels.
8.3.2 Standby Outputs
The 5 VSB output shall be present when an AC input greater than the power supply turn on
voltage is applied.
8.3.3 Remote Sense
The power supply has remote sense return to regulate out ground drops for all output voltages:
+3.3 V, +5 V, +12 V1, +12 V2, +12 V3, -12 V, and 5 VSB. The power supply uses remote sense
(3.3 VS) to regulate out drops in the system for the +3.3 V output.
The +5 V, +12 V1, +12 V2, +12 V3, –12 V and 5 VSB outputs only use remote sense referenced
to the remote sense return signal. The remote sense input impedance to the power supply must
be greater than 200 Ω on 3.3 VS and 5 VS. This is the value of the resistor connecting the
remote sense to the output voltage internal to the power supply.
Remote sense must be able to regulate out a minimum of a 200 mV drop on the +3.3 V output.
The remote sense return must be able to regulate out a minimum of a 200 mV drop in the power
ground return. The current in any remote sense line shall be less than 5 mA to prevent voltage
sensing errors.
The power supply must operate within specification over the full range of voltage drops from the
power supply’s output connector to the remote sense points.
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8.3.4 Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple / noise.
Table 40. Voltage Regulation Limits
Parameter Tolerance Minimum Nominal Maximum Units
+3.3V - 5% / +5% +3.14 +3.30 +3.46 V
+5V - 5% / +5% +4.75 +5.00 +5.25 V
+12V 1 - 5% / +5% +11.40 +12.00 +12.60 V
+12V 2 - 5% / +5% +11.40 +12.00 +12.60 V
+12V 3 - 5% / +5% +11.40 +12.00 +12.60 V
+12V 4 - 5% / +5% +11.40 +12.00 +12.60 V
- 12V - 5% / +9% - 11.40 -12.00 -13.08 V
+5VSB - 5% / +5% +4.75 +5.00 +5.25 V
1. Maximum continuous total output power should not exceed 670 W.
2. Maximum continuous load on the combined 12 V output shall not exceed 48 A.
3. Peak load on the combined 12 V output shall not exceed 52 A.
4. Peak total DC output power should not exceed 730 W.
rms
rms
rms
rms
rms
rms
rms
rms
8.3.5 Dynamic Loading
The output voltages shall remain within limits for the step loading and capacitive loading
specified in the table below. The load transient repetition rate shall be tested between 50 Hz
and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test
specification. The Δ step load may occur anywhere within the minimum load to the maximum
load conditions.
Table 41. Transient Load Requirements
Output
+3.3V 7.0A
+5V 7.0A
+12V 25A
+5VSB 0.5A
1. Step loads on each 12V output may happen simultaneously.
Δ Step Load Size 1
Load Slew Rate Test Capacitive Load
0.25 A/μsec 4700 μF
0.25 A/μsec 1000 μF
0.25 A/μsec 4700 μF
0.25 A/μsec 20 μF
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8.3.6 Capacitive Loading
The power supply shall be stable and meet all requirements with the following capacitive
loading ranges.
Table 42. Capacitive Loading Conditions
Output Minimum Maximum Units
+3.3 V 250 6800
+5 V 400 4700
1, 2, 3, 4
+12 V
-12 V 1 350
+5 VSB 20 350
1. Maximum continuous total output power should not exceed 670 W.
2. Maximum continuous load on the combined 12 V output shall not exceed 48 A.
3. Peak load on the combined 12 V output shall not exceed 52 A.
4. Peak total DC output power should not exceed 730 W.
500 each 11,000
μF
μF
μF
μF
μF
8.3.7 Ripple / Noise
The maximum allowed ripple/noise output of the power supply is defined in the following table.
This is measured over a bandwidth of 0Hz to 20MHz at the power supply output connectors. A
10 μF tantalum capacitor in parallel with a 0.1 μF ceramic capacitor are placed at the point of
measurement.
Table 43. Ripple and Noise
+3.3 V +5 V +12 V
50mVp-p 50mVp-p 120mVp-p 120mVp-p 50mVp-p
1. Maximum continuous total output power should not exceed 670 W.
2. Maximum continuous load on the combined 12 V output shall not exceed 48 A.
3. Peak load on the combined 12 V output shall not exceed 52 A.
4. Peak total DC output power should not exceed 730 W.
1, 2, 3, 4
-12 V +5 VSB
8.3.8 Timing Requirements
The following are the timing requirements for the power supply operation. The output voltages
must rise from 10% to within regulation limits (T
rise from 1.0 to 25 ms. All outputs must rise monotonically. Each output voltage shall reach
regulation within 50 ms (T
) of each other during turn on of the power supply. Each output
vout_on
voltage shall fall out of regulation within 400 msec (T
) within 5 to 70 ms. 5 VSB is allowed to
vout_rise
) of each other during turn off.
vout_off
The following tables and diagrams show the timing requirements for the power supply being
turned on and off via the AC input with PSON held low, and the PSON signal with the AC input
applied.
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Table 44. Output Voltage Timing
Item Description Minimum Maximum Units
T
Output voltage rise time from each main output. 5.0 1 70 1 ms
vout_rise
T
All main outputs must be within regulation of each other within this
vout_on
time.
T
All main outputs must leave regulation within this time. 400 ms
vout_off
1. The 5VSB output voltage rise time is from 1.0 ms to 25 ms
50 ms
V out
10% V out
V1
V2
V3
V4
T
vout_rise
T
vout_on
Figure 25. Output Voltage Timing
T
vout_off
TP02313
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Table 45. Turn On/Off Timing
Item Description Minimum Maximum Units
T
sb_on_delay
T
ac_on_delay
T
vout_holdup
T
pwok_holdup
T
pson_on_delay
T
pson_pwok
T
pwok_on
T
pwok_off
T
pwok_low
T
sb_vout
T
5VSB_holdup
Delay from AC being applied to 5VSB being within regulation. 1500 ms
Delay from AC being applied to all output voltages being within
regulation.
2500
Time all output voltages stay within regulation after loss of AC. 21 ms
Delay from loss of AC to de-assertion of PWOK 20 ms
Delay from PSON# active to output voltages within regulation
limits.
5 400
Delay from PSON# deactivate to PWOK being de-asserted. 50 ms
Delay from output voltages within regulation limits to PWOK
asserted at turn on.
Delay from PWOK de-asserted to output voltages (3.3V, 5V,
12V, -12V) dropping out of regulation limits.
Duration of PWOK being in the de-asserted state during an
off/on cycle using AC or the PSON signal.
Delay from 5VSB being in regulation to O/Ps being in
regulation at AC turn on.
Time the 5VSB output voltage stays within regulation after loss
of AC.
100 500
1
100
50 1000
70
ms
ms
ms
ms
ms
ms
ms
AC Input
Vout
T
sb_on_delay
PWOK
5VSB
PSON
T
vout_holdup
T
pwok_low
T
sb_on_delay
T
pwok_on
T
pson_on_delay
PSON turn on/off cycle
T
pwok_off
T
pson_pwok
T
AC_on_delay
T
sb_vout
AC turn on/off cycle
T
T
pwok_on
T
pwok_h oldup
T
5VSB_holdup
pwok_off
Figure 26. Turn On/Off Timing (Power Supply Signals)
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8.3.9 Residual Voltage Immunity in Standby Mode
The power supply should be immune to any residual voltage placed on its outputs (typically, a
leakage voltage through the system from standby output) up to 500 mV. There shall be no
additional heat generated, nor stressing of any internal components with this voltage applied to
any individual output, and all outputs simultaneously. It also should not trip the power supply
protection circuits during turn on.
Residual voltage at the power supply outputs for a no load condition shall not exceed 100 mV
when AC voltage is applied and the PSON# signal is de-asserted.
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Design and Environmental Specifications Intel® Server Boards S5000PSL and S5000XSL TPS
9. Regulatory and Certification Information
To help ensure EMC compliance with your local regional rules and regulations, before computer
integration, make sure that the chassis, power supply, and other modules have passed EMC
testing using a server board with a microprocessor from the same family (or higher) and
operating at the same (or higher) speed as the microprocessor used on this server board. The
final configuration of your end system product may require additional EMC compliance testing.
For more information please contact your local Intel Representative.
This is an FCC Class A device. Integration of it into a Class B chassis does not result in a Class
B device.
9.1 Product Regulatory Compliance
Intended Application – This product was evaluated as Information Technology Equipment
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type
locations. The suitability of this product for other product categories and environments (such as:
medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment,
etc.), other than an ITE application, may require further evaluation.
9.1.1 Product Safety Compliance
UL60950 – CSA 60950(USA / Canada)
EN60950 (Europe)
IEC60950 (International)
CB Certificate & Report, IEC60950 (report to include all country national deviations)
GOST R 50377-92 – Listed on one System License (Russia)
Belarus License – Listed on System License (Belarus)
CE - Low Voltage Directive 73/23/EEE (Europe)
IRAM Certification (Argentina)
9.1.2 Product EMC Compliance – Class A Compliance
FCC /ICES-003 - Emissions (USA/Canada) Verification
CISPR 22 – Emissions (International)
EN55022 - Emissions (Europe)
EN55024 - Immunity (Europe)
CE – EMC Directive 89/336/EEC (Europe)
VCCI Emissions (Japan)
AS/NZS 3548 Emissions (Australia / New Zealand)
BSMI CNS13438 Emissions (Taiwan)
GOST R 29216-91 Emissions - Listed on one System License (Russia)
GOST R 50628-95 Immunity –Listed on one System License (Russia)
Belarus License – Listed on one System License (Belarus)
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RRL MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea)
9.1.3 Certifications / Registrations / Declarations
UL Certification or NRTL (US/Canada)
CB Certifications (International)
CE Declaration of Conformity (CENELEC Europe)
FCC/ICES-003 Class A Attestation (USA/Canada)
C-Tick Declaration of Conformity (Australia)
MED Declaration of Conformity (New Zealand)
BSMI Certification (Taiwan)
RRL Certification (Korea)
Ecology Declaration (International)
9.2 Product Regulatory Compliance Markings
The Intel® Server Board bears the following regulatory marks.
Regulatory Compliance Region Marking
UL Mark USA/Canada
CE Mark Europe
EMC Marking (Class A) Canada
BSMI Marking (Class A) Taiwan
C-tick Marking Australia / New Zealand
RRL MIC Mark Korea
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
Country of Origin Exporting Requirements Made in xxxxx (Provided by label, not silkscreen)
Model Designation Regulatory Identification Examples (Server Board S5000PSL) for boxed
type boards; or Board PB number for non-boxed
boards (typically high-end boards)
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9.3 Electromagnetic Compatibility Notices
9.3.1 FCC Verification Statement (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals that are not shielded and grounded may result in interference
to radio and TV reception.
9.3.2 ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux
appareils numériques de Classe B prescrites dans la norme sur le matériel brouilleur:
“Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
English translation of the notice above:
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.
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9.3.3 Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
9.3.4 VCCI (Japan)
English translation of the notice above:
This is a Class B product based on the standard of the Voluntary Control Council for
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.
9.3.5 BSMI (Taiwan)
The BSMI Certification Marking and EMC warning is located on the outside rear area of
the product.
9.3.6 RRL (Korea)
Following is the RRL certification information for Korea.
English translation of the notice above:
1. Type of Equipment (Model Name): On License and Product
2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative
3. Name of Certification Recipient: Intel Corporation
4. Date of Manufacturer: Refer to date code on product
5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
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9.3.7 CNCA (CCC-China)
The CCC Certification Marking and EMC warning is located on the outside rear area of
the product.
A
9.4 Restriction of Hazardous Substances (RoHS)
Compliance
Intel has a system in place to restrict the use of banned substances in accordance with the
European Directive 2002/95/EC. Compliance is based on declaration that materials banned in
the RoHS Directive are either (1) below all applicable substance threshold limits or (2) an
approved/pending RoHS exemption applies.
Note: RoHS implementation details are not fully defined and may change.
Threshold limits and banned substances are noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
- Lead
- Mercury
- Hexavalent Chromium
- Polybrominated Biphenyls Diphenyl Ethers (PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
- Cadmium
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Appendix A: Integration and Usage Tips
When adding or removing components or peripherals from the server board, AC power
must be removed. With AC power plugged into the server board, 5-volt standby is still
present even though the server board is powered off.
Processors must be installed in order. CPU 1 is located near the edge of the server
board and must be populated to operate the board.
On the back edge of the server board are four diagnostic LEDs that display a sequence
of red, green, or amber POST codes during the boot process. If the server board hangs
during POST, the LEDs will display the last POST event run before the hang.
Only Fully Buffered DIMMs (FBDIMMs) are supported on this server board. For a list of
supported memory for this server board, see the Intel
Memory List.
For a list of Intel supported operating systems, add-in cards, and peripherals for this
server board, see the Intel
Only Dual-Core Intel
®
S5000PSL / S5000XSL Tested Hardware and OS List.
®
Xeon® processors 5000 Series, with system bus speeds of 667,
1066, or 1333 MHz are supported on this server board. Previous generation Intel
processors are not supported.
For the best performance, the number of FBDIMMs installed should be balanced across
both memory branches. For example: a four-DIMM configuration will perform better than
a two DIMM configuration. In a four-DIMM configuration, FBDIMMs should be installed in
DIMM sockets A1, B1, C1, and D1. An eight-DIMM configuration will perform better then
a six DIMM configuration.
The Intel
®
RMM connector is not compatible with the Intel® Server Management Module
Professional Edition (Product Code AXXIMMPRO) or with the Intel
Module Advanced Edition (Product Code AXXIMMADV)
Removing AC power before performing the CMOS Clear operation will cause the system
to automatically power up and immediately power down after the CMOS Clear procedure
is followed and AC power is re-applied. If this happens, remove the AC power cord, wait
30 seconds, and then re-connect the AC power cord. Power up the system and proceed
to the <F2> BIOS Setup Utility to reset the desired settings.
Normal BMC functionality is disabled with the force BMC update jumper set to the
“enabled” position (pins 2-3). The server should never be run with the BMC force update
jumper set in this position and should only be used when the standard firmware update
process fails. This jumper should remain in the default (disabled) position (pins 1-2)
when the server is running normally.
When performing a BIOS update procedure, the BIOS select jumper must be set to its
default position (pins 2-3).
®
S5000PSL / S5000XSL Tested
®
Xeon®
®
Server Management
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Appendix B: BMC Sensor Tables Intel® Server Boards S5000PSL and S5000XSL TPS
Appendix B: BMC Sensor Tables
This appendix lists the sensor identification numbers and information about the sensor type,
name, supported thresholds, assertion and de-assertion information, and a brief description of
the sensor purpose. See the Intelligent Platform Management Interface Specification, Version
2.0, for sensor and event/reading-type table information.
Sensor Type
The Sensor Type is the values enumerated in the Sensor Type Codes table in the IPMI
specification. The Sensor Type provides the context in which to interpret the sensor,
such as the physical entity or characteristic that is represented by this sensor.
Event / Reading Type
The Event/Reading Type values are from the Event/Reading Type Code Ranges and
Generic Event/Reading Type Codes tables in the IPMI specification. Digital sensors are
a specific type of discrete sensor, which have only two states.
Event Offset/Triggers
Event Thresholds are event-generating thresholds for threshold types of sensors.
- [u,l][nr,c,nc]: upper nonrecoverable, upper critical, upper noncritical, lower
nonrecoverable, lower critical, lower noncritical
- uc, lc: upper critical, lower critical
Event Triggers are supported event-generating offsets for discrete type sensors. The
offsets can be found in the Generic Event/Reading Type Codes or Sensor Type Codes
tables in the IPMI specification, depending on whether the sensor event/reading type is
generic or a sensor-specific response.
Assertion / De-assertion Enables
Assertion and de-assertion indicators reveal the type of events the sensor generates:
- As: Assertions
- De: De-assertion
Readable Value / Offsets
- Readable Value indicates the type of value returned for threshold and other non-
discrete type sensors.
- Readable Offsets indicate the offsets for discrete sensors that are readable with the
Get Sensor Reading command. Unless otherwise indicated, all event triggers are
readable; Readable Offsets consist of the reading type offsets that do not generate
events.
Event Data
Event data is the data that is included in an event message generated by the sensor. For
threshold-based sensors, the following abbreviations are used:
- R: Reading value
- T: Threshold value
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Rearm Sensors
The rearm is a request for the event status for a sensor to be rechecked and updated
upon a transition between good and bad states. Rearming the sensors can be done
manually or automatically. This column indicates the type supported by the sensor. The
following abbreviations are used in the comment column to describe a sensor:
- A: Auto-rearm
- M: Manual rearm
Default Hysteresis
The hysteresis setting applies to all thresholds of the sensor. This column provides the
count of hysterisis for the sensor, which can be 1 or 2 (positive or negative hysteresis).
Criticality
Criticality is a classification of the severity and nature of the condition. It also controls the
behavior of the Control Panel Status LED
Standby
Some sensors operate on standby power. These sensors may be accessed and / or
generate events when the main (system) power is off, but AC power is present.
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Appendix B: BMC Sensor Tables Intel® Server Boards S5000PSL and S5000XSL TPS
Table 46. BMC Sensors
Sensor
Name
Power Unit
Status
Power Unit
Redundancy
Sensor
Number
01h All Power Unit
02h Chassis-
System
Applica-
bility
specific
Sensor Type Event /
Reading
Sensor
09h
Power Unit
09h
Specific
6Fh
Generic
0Bh
Type
Event Offset
Triggers
Power down
Power cycle
A/C lost
Soft power
control failure
Power unit
failure
Predictive
failure
Redundancy
regained
Non-red: suff
res from redund
Redundancy
lost
Redundancy
degraded
Non-red: suff
from insuff
Non-red:
insufficient
Redun degrade
from full
Redun degrade
from nonredundant
Criticality Assert /
De-assert
OK
Crit
Non-Crit
OK
Degraded
OK
Critical
OK
As – Trig Offset A X
As – Trig Offset A X
Readable
Value /
Offsets
Event Data Rearm Standby
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Sensor
Name
Watchdog 03h All Watchdog 2
Platform
Security
Violation
Physical
Security
FP Diag
Interrupt
(NMI)
System
Event Log
Session
Audit
System
Event
('System
Event')
Sensor
Number
04h All Platform
05h Chassis
07h All Critical
09h All Event
0Ah All Session Audit
0Bh All System Event
System
Applica-
bility
Intrusion
is chassisspecific
Sensor Type Event /
23h
Security
Violation
Attempt
06h
Physical
Security
05h
Interrupt
13h
Logging
Disabled
10h
2Ah
12h
Reading
Type
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Sensor
Specific
6Fh
Event Offset
Triggers
Timer expired,
status only
Hard reset
Power down
Power cycle
Timer interrupt
Secure mode
violation
attempt
Out-of-band
access
password
violation
Chassis
intrusion
LAN leash lost
1
Front panel NMI
/ diagnostic
interrupt
Bus
uncorrectable
error
Log area reset /
cleared
00h – Session
activation
01h – Session
deactivation
00 – System
reconfigured
04 – PEF action
Criticality Assert /
De-assert
OK As – Trig Offset A X
OK As – Trig Offset A X
OK As and De – Trig Offset A X
OK As – Trig Offset A –
OK As – Trig Offset A X
OK As – As defined
OK As – Trig Offset A X
Readable
Value /
Offsets
Event Data Rearm Standby
A X
by IPMI
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Appendix B: BMC Sensor Tables Intel® Server Boards S5000PSL and S5000XSL TPS
Sensor
Name
BB +1.2V
Vtt
BB+1.9V
NIC Core
BB +1.5V
AUX
BB +1.5V 13h All Voltage
BB +1.8V 14h All Voltage
BB +3.3V 15h All Voltage
BB +3.3V
STB
BB +1.5V
ESB
BB +5V 18h All Voltage
BB +1.2V
NIC
BB +12V
AUX
BB 0.9V 1Bh All Voltage
BB Vbat 1Eh All Voltage
BB Temp 30h All Temperature
Front
Panel
Temp
Sensor
Number
10h All Voltage
11h All Voltage
12h All Voltage
16h All Voltage
17h All Voltage
19h All Voltage
1Ah All Voltage
32h All Temperature
System
Applica-
bility
Sensor Type Event /
02h
02h
02h
02h
02h
02h
02h
02h
02h
02h
02h
02h
02h
01h
01h
Reading
Type
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Digital
Discrete
05h
Threshold
01h
Threshold
01h
Event Offset
Triggers
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
01h – Limit
exceeded
[u,l] [c,nc] Threshold
[u,l] [c,nc] Threshold
Criticality Assert /
defined
defined
defined
defined
defined
defined
defined
defined
defined
defined
defined
defined
Critical As and De – R, T A X
defined
defined
Readable
De-assert
As and De Analog R, T A –
As and De Analog R, T A X
As and De Analog R, T A
As and De Analog R, T A
As and De Analog R, T A –
As and De Analog R, T A –
As and De Analog R, T A X
As and De Analog R, T A X
As and De Analog R, T A –
As and De Analog R, T A –
As and De Analog R, T A –
As and De Analog R, T A –
As and De Analog R, T A X
As and De Analog R, T A X
Value /
Offsets
Event Data Rearm Standby
–
–
Revision 1.2
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Intel® Server Boards S5000PSL and S5000XSL TPS Appendix B: BMC Sensor Tables
Sensor
Name
BNB Temp 33h All Temperature
Tach Fan 1 50h Chassis-
Tach Fan 2 51h Chassis-
Tach Fan 3 52h Chassis-
Tach Fan 4 53h Chassis-
Tach Fan 5 54h Chassis-
Tach Fan 6 55h Chassis-
Tach Fan 7 56h Chassis-
Tach Fan 8 57h Chassis-
Tach Fan 9 58h Chassis-
Tach Fan
10
Fan 1
Present
Fan 2
Present
Fan 3
Present
Fan 4
Present
Sensor
Number
59h Chassis-
60h Chassis-
61h Chassis-
62h Chassis-
63h Chassis-
System
Applica-
bility
specific
specific
specific
specific
specific
specific
specific
specific
specific
specific
specific
specific
specific
specific
Sensor Type Event /
01h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Reading
Type
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Threshold
01h
Generic
08h
Generic
08h
Generic
08h
Generic
08h
Event Offset
Triggers
[u,l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
[l] [c,nc] Threshold
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Criticality Assert /
De-assert
As and De Analog R, T A –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
As and De Analog R, T M –
defined
Readable
Value /
Offsets
Event Data Rearm Standby
Revision 1.2
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Intel order number: D41763-003
Appendix B: BMC Sensor Tables Intel® Server Boards S5000PSL and S5000XSL TPS
Sensor
Name
Fan 5
Present
Fan 6
Present
Fan 7
Present
Fan 8
Present
Fan 9
Present
Fan 10
Present
Fan
Redundancy
Power
Supply
Status 1
Sensor
Number
64h Chassis-
65h Chassis-
66h Chassis-
67h Chassis-
68h Chassis-
69h Chassis-
6Fh Chassis-
70h Chassis-
System
Applica-
bility
specific
specific
specific
specific
specific
specific
specific
specific
Sensor Type Event /
Reading
Type
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Power Supply
08h
Generic
08h
Generic
08h
Generic
08h
Generic
08h
Generic
08h
Generic
08h
Generic
0Bh
Sensor
Specific
6Fh
Event Offset
Triggers
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Device present OK As and De – T A –
Redundancy
regained
Redundancy
lost
Redundancy
degraded
Non-red: suff
res from redund
Non-red: suff
from insuff
Non-red:
insufficient
Redun degrade
from full
Redun degrade
from nonredundant
Presence OK
Failure Critical
Predictive fail Non-Crit
A/C lost Critical
Criticality Assert /
De-assert
OK
Degraded
OK
Critical
OK
As – Trig Offset A X
As and De – Trig Offset A X
Readable
Value /
Offsets
Event Data Rearm Standby
Revision 1.2
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Intel order number: D41763-003
Intel® Server Boards S5000PSL and S5000XSL TPS Appendix B: BMC Sensor Tables
Sensor
Name
Power
Supply
Status 2
Power
Nozzle
Power
Supply 1
Power
Nozzle
Power
Supply 2
Power
Gauge
V1 rail
(+12v)
Power
Supply 1
Power
Gauge
V1 rail
(+12v)
Power
Supply 2
Power
Gauge
(aggregate
power)
Power
Supply 1
Sensor
Number
71h Chassis-
78h Chassis-
79h Chassis-
7Ah Chassis-
7Bh Chassis-
7Ch Chassis-
System
Applica-
bility
specific
specific
specific
specific
specific
specific
Sensor Type Event /
Reading
Type
Power Supply
08h
Current
03h
Current
03h
Current
03h
Current Threshold
03h
Other Units Threshold
0Bh
Sensor
Specific
6Fh
Threshold
01h
Threshold
01h
Threshold [u] [c,nc] Threshold
01h
01h
01h
Event Offset
Triggers
Configuration
error
Presence OK
Failure Critical
Predictive fail Non-Crit
A/C lost Critical
Configuration
error
[u] [c,nc] Threshold
[u] [c,nc] Threshold
[u] [c,nc] Threshold
[u] [c,nc] Threshold
Criticality Assert /
Non-Crit
As and De – Trig Offset A X
Non-Crit
As and De Analog R, T A –
defined
As and De Analog R, T A –
defined
As and De Analog R, T A –
defined
As and De Analog R, T A
defined
As and De Analog R, T A
defined
De-assert
Readable
Value /
Offsets
Event Data Rearm Standby
–
–
Revision 1.2
101
Intel order number: D41763-003
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