Intel R2000LT2, R2000LH2, S4600LT2, S4600LH2 Technical Product Specification
Revision 1.0
Intel® Server System R2000LH2/T2
Product Family
Technical Product Specification
April 2013
Enterprise Platforms and Services Division
Revision History Intel® Server System R2000LH2/T2 Product Family TPS
ii
Date
Revision
Number
Modifications
June 2012
0.8
Updates to images and all sections
Updates to images, environmental data,system boards,power supply section,
April 2013
1.0
Updates to Power Supply section, POST Codes, and formatting
Revision History
Nov 2012 0.95
IO Riser, GPGPU, Post Codes, and connector pinouts
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Revision 1.0
Intel® Server System R2000LH2/T2 Product Family TPS Table of Contents
iii
Table of Contents
1. Introduction ........................................................................................................................ 1
1.1 Chapter Outline ...................................................................................................... 1
1.2 Server Board Use Disclaimer ................................................................................. 2
2. Product Family Overview ................................................................................................... 3
2.1 Chassis Dimensions ............................................................................................... 6
2.2 System Level Environmental Limits ........................................................................ 7
2.3 System Features and Options Overview ................................................................ 9
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options ............................................... 9
2.3.2 Back Panel Features ............................................................................................ 10
2.3.3 Front Control Panel Options ................................................................................. 10
2.4 Server Board Features Overview ......................................................................... 12
2.5 Available Front Bezel Support .............................................................................. 13
2.6 Available Rack and Cabinet Mounting Kit Options ................................................ 14
3. Power Subsystem ............................................................................................................. 15
3.1 Mechanical Overview ........................................................................................... 16
3.2 Power Connectors ................................................................................................ 18
3.2.1 Power Supply Module Card Edge Connector ....................................................... 18
3.3 Power Supply Module Efficiency .......................................................................... 19
3.4 AC and DC Power Cord Specification Requirements ........................................... 20
3.5 AC Input Specifications ........................................................................................ 21
3.5.1 Power Factor ........................................................................................................ 21
3.5.2 AC Input Voltage Specification ............................................................................. 21
3.5.3 AC Line Isolation Requirements ........................................................................... 21
3.5.4 AC Line Dropout/Holdup ...................................................................................... 21
3.5.5 AC Line Fuse ....................................................................................................... 22
3.5.6 AC Inrush ............................................................................................................. 22
3.5.7 AC Line Transient Specification ........................................................................... 22
3.5.8 Susceptibility Requirements ................................................................................. 23
3.5.9 Electrostatic Discharge Susceptibility ................................................................... 23
3.5.10 Fast Transient/Burst ............................................................................................. 23
3.5.11 Radiated Immunity ............................................................................................... 23
3.5.12 Surge Immunity .................................................................................................... 23
3.5.13 Power Recovery ................................................................................................... 24
3.5.14 Voltage Interruptions ............................................................................................ 24
3.5.15 Protection Circuits ................................................................................................ 24
3.5.16 Over-current Protection (OCP) ............................................................................. 24
3.5.17 Over-voltage Protection (OVP) ............................................................................. 24
3.5.18 Over-temperature Protection (OTP) ..................................................................... 25
3.6 1600W DC Power Supply Support ....................................................................... 26
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3.6.1 Power Supply Module Efficiency .......................................................................... 26
3.6.2 DC Inlet Connector ............................................................................................... 26
3.6.3 DC Input Voltage Specification ............................................................................. 26
3.6.4 DC Holdup/Dropout Time ..................................................................................... 26
3.6.5 DC Line Fuse ....................................................................................................... 27
3.6.6 DC Inrush ............................................................................................................. 27
3.6.7 DC Line Surge Voltages (Line Transients) ........................................................... 27
3.6.8 Residual Voltage Immunity in Standby Mode ....................................................... 28
3.6.9 Protection Circuits ................................................................................................ 28
3.6.10 Over Temperature Protection (OTP) .................................................................... 29
3.7 Cold Redundancy Support ................................................................................... 30
3.7.1 Powering on Cold Standby Supplies to Maintain Best Efficiency .......................... 30
3.7.2 Powering on Cold Standby Supplies during a Fault or Over Current Condition..... 31
3.7.3 BMC Requirements .............................................................................................. 31
3.7.4 Power Supply Turn On Function .......................................................................... 31
3.8 Closed Loop System Throttling (CLST) ................................................................ 32
3.9 Smart Ride Through (SmaRT) .............................................................................. 32
3.10 Power Supply Status LED .................................................................................... 32
4. Thermal Management ....................................................................................................... 33
4.1 Thermal Operation and Configuration Requirements ............................................ 33
4.2 Thermal Management Overview .......................................................................... 35
4.2.1 Set Throttling Mode .............................................................................................. 35
4.2.2 Altitude ................................................................................................................. 35
4.2.3 Set Fan Profile ..................................................................................................... 36
4.2.4 Fan PWM Offset ................................................................................................... 36
4.2.5 Quiet Fan Idle Mode ............................................................................................. 36
4.2.6 Thermal Sensor Input for Fan Speed Control ....................................................... 37
4.3 System Fans ........................................................................................................ 39
4.3.1 Lower Fan Board .................................................................................................. 41
4.3.2 Upper Fans .......................................................................................................... 42
4.4 Power Supply Module Fan ................................................................................... 43
5. System Storage and Peripheral Drive Bays Overview ................................................... 44
5.1 2.5” Hard Disk Drive Support ................................................................................ 44
5.1.1 2.5” Drive Hot-Swap Backplane Overview ............................................................ 46
5.2 3.5” Hard Disk Drive Support ................................................................................ 48
5.2.1 3.5” Drive Hot-Swap Backplane Overview ............................................................ 49
5.3 Optical Drive Support ........................................................................................... 52
5.4 Solid State Drive (SSD) Support........................................................................... 53
5.5 Low Profile eUSB SSD Support ........................................................................... 54
5.6 SATA DOM Support ............................................................................................. 55
6. Storage Controller Options Overview ............................................................................. 56
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6.1 Embedded SATA/SAS Controller Support ............................................................ 56
6.2 Embedded Software RAID Support ...................................................................... 58
6.2.1 Intel® Embedded Server RAID Technology 2 (ESRT2) ......................................... 58
6.2.2 Intel® Rapid Storage Technology (RSTe) ............................................................. 58
7. Front Control Panel and I/O Panel Overview .................................................................. 60
7.1 I/O Panel Features ............................................................................................... 60
7.2 Control Panel Features ........................................................................................ 61
8. Intel® Local Control Panel ................................................................................................ 65
8.1 LCD Functionality ................................................................................................. 66
8.2 Main Menu ........................................................................................................... 68
8.3 Event Menu .......................................................................................................... 69
8.4 View Menu ........................................................................................................... 70
8.4.1 System FW Version (SysFwVer) .......................................................................... 70
8.4.2 System Information (SysInfo) ............................................................................... 70
8.4.3 BMC IP Configuration ........................................................................................... 71
8.4.4 RMM4 IP Configuration ........................................................................................ 71
8.4.5 Power ................................................................................................................... 72
8.4.6 Last Post Code (Last PC) ..................................................................................... 72
8.5 Config Menu ......................................................................................................... 73
8.5.1 IP Version ............................................................................................................ 73
8.5.2 BMC IP................................................................................................................. 73
8.5.3 RMM4 IP .............................................................................................................. 75
8.5.4 Boot Device .......................................................................................................... 75
8.5.5 Banner ................................................................................................................. 76
9. PCI Riser Card Support .................................................................................................... 77
9.1 Riser Slot Overview .............................................................................................. 77
9.2 GPGPU Support on the PCIe Risers .................................................................... 79
9.2.1 GPGPU Power ..................................................................................................... 79
9.2.2 GPGPU Cable ...................................................................................................... 79
9.3 Wattage Limitation of the PCI Loading ................................................................. 80
9.4 Riser Slot Mapping .............................................................................................. 81
9.5 Riser Card Drawing .............................................................................................. 82
10. Additonal System Boards ................................................................................................ 83
10.1 Power Distribution Board (PDB) ........................................................................... 83
10.2 Setting the Power Supply Addressing for PMBus and FRU .................................. 83
10.3 12V Over Current Protection ................................................................................ 83
10.3.1 Over Current Protection Circuits ........................................................................... 83
10.4 Power Supply Keying ........................................................................................... 84
10.5 PDB Connectors .................................................................................................. 84
10.5.1 Grounding ............................................................................................................ 84
10.5.2 Power Supply Card Edge Connectors .................................................................. 84
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10.5.3 Motherboard Power Connectors ........................................................................... 85
10.5.4 Motherboard Signal from PDB .............................................................................. 86
10.5.5 GPGPU Power Connectors .................................................................................. 86
10.5.6 Upper Fan Connector ........................................................................................... 87
10.6 PDB Drawing........................................................................................................ 88
11. Front Panel ........................................................................................................................ 89
12. IO Module Support ........................................................................................................... 90
13. Intel® Intelligent Power Node Manager (NM) ................................................................... 92
13.1 Overview .............................................................................................................. 92
13.1.1 Hardware Requirements ...................................................................................... 92
13.1.2 Features ............................................................................................................... 92
13.1.3 Role of BMC in NM .............................................................................................. 93
13.1.4 ME System Management Bus (SMBus) Interface ................................................. 94
13.1.5 PECI 3.0 ............................................................................................................... 94
13.1.6 PECI Proxy .......................................................................................................... 94
13.1.7 ME Power and Firmware Startup.......................................................................... 95
13.1.8 ME Firmware Update ........................................................................................... 95
13.1.9 NM Discovery OEM SDR ..................................................................................... 95
13.1.10 SmaRT/CLST ....................................................................................................... 96
Appendix A: Integration and Usage Tip ................................................................................ 97
Appendix B: POST Code Diagnostic LED Decoder .............................................................. 98
Appendix C: POST Code Errors ........................................................................................... 104
Glossary ................................................................................................................................ 111
Reference Documents .......................................................................................................... 114
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List of Figures
Figure 1. System Overview ......................................................................................................... 3
Figure 2. System Assembly......................................................................................................... 3
Figure 3. Chassis Dimensions ..................................................................................................... 6
Figure 4. System Components Overview .................................................................................... 9
Figure 5. 2.5" Hot Swap Hard Drive Bay - 8 Drive Configuration ................................................. 9
Figure 6. 3.5" Hotswap Hard Drive Bay - 4 Drive Configuration ................................................... 9
Figure 7. Back Panel Feature Identification ............................................................................... 10
Figure 8. Front Control Panel Options ....................................................................................... 10
Figure 9. Intel® Server Board S4600LH2/LT2 ............................................................................ 12
Figure 10. Optional Front Bezel (Intel Product Order Code – A2UBEZEL) ................................ 13
Figure 11. Installing the Front Bezel .......................................................................................... 13
Figure 12. Power Supply ........................................................................................................... 15
Figure 13. Power Supply Module Mechanical Drawing .............................................................. 16
Figure 14. Power Supply Module .............................................................................................. 16
Figure 15. AC and DC Power Supplies – Connector View ........................................................ 17
Figure 16. AC Power Cord ........................................................................................................ 20
Figure 17. DC Power Cord ........................................................................................................ 20
Figure 18. 75VDC Test ............................................................................................................. 27
Figure 19. 0VDC Test ............................................................................................................... 28
Figure 20. Fan Control Model .................................................................................................... 38
Figure 21. System Fan Identification ......................................................................................... 39
Figure 22. System Fan Assembly.............................................................................................. 40
Figure 23. Upper and Lower System Fan Connections ............................................................. 41
Figure 24. Lower Fan Board ...................................................................................................... 41
Figure 25. Lower Fan Board Dimensions .................................................................................. 42
Figure 26. Upper Fans Connectors on PDB .............................................................................. 42
Figure 27. 8 x 2.5" Hard Drive Configuration ............................................................................. 44
Figure 28. 2.5” Hard Disk Drive Assembly ................................................................................. 45
Figure 29. 2.5” Drive LEDs ........................................................................................................ 45
Figure 30. 2.5” Drive Hot-Swap Backplane Assembly ............................................................... 46
Figure 31. 2.5” Drive Hot-Swap Backplane – Front Side ........................................................... 46
Figure 32. 2.5” Drive Hot-Swap Backplane – Back Side ............................................................ 47
Figure 33. 4 x 3.5" Hard Drive Configuration ............................................................................. 48
Figure 34. 3.5” Hard Disk Drive Assembly ................................................................................. 48
Figure 35. 3.5” Drive LEDs ........................................................................................................ 49
Figure 36. 3.5” Drive Hot-Swap Backplane Assembly ............................................................... 50
Figure 37. 3.5” Drive Hot-Swap Backplane – Front Side ........................................................... 50
Figure 38. 3.5” Drive Hot-Swap Backplane – Back Side ............................................................ 51
Figure 39. Optical Drive Support ............................................................................................... 52
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Figure 40. Optical Drive Assembly ............................................................................................ 52
Figure 41. 2.5" Solid State Drive (SSD) Mounting Option .......................................................... 53
Figure 42. Low Profile eUSB SSD Support ............................................................................... 54
Figure 43. InnoDisk* Low Profile SATA DOM ............................................................................ 55
Figure 44. Embedded SATA/SAS Controller Support ................................................................ 56
Figure 45. Front I/O Panel Features .......................................................................................... 60
Figure 46. Front Control Panel Features ................................................................................... 61
Figure 47. Intel® Local Control Panel Option ............................................................................. 65
Figure 48. LCP Background Color during Normal Operation ..................................................... 66
Figure 49. LCP Background Color during an Error .................................................................... 66
Figure 50. LCP Main Menu ....................................................................................................... 68
Figure 51. LCP Event Menu ...................................................................................................... 69
Figure 52. LCP View Menu ....................................................................................................... 70
Figure 53. System Firmware Versions Menu ............................................................................. 70
Figure 54. System Information Menu ........................................................................................ 70
Figure 55. LCP – BMC IP Configuration .................................................................................... 71
Figure 56. LCP – RMM4 IP Configuration ................................................................................. 71
Figure 57. LCP – Power Consumed by the System Currently ................................................... 72
Figure 58. LCP – Last BIOS Post Code .................................................................................... 72
Figure 59. LCP – Configure Menu Items ................................................................................... 73
Figure 60. LCP – IP Version Configuration Screen ................................................................... 73
Figure 61. LCP – BMC IP Configuration Menu .......................................................................... 73
Figure 62. LCP – BMC IP Source Configuration Menu .............................................................. 73
Figure 63. Screen shots for Configuring IP Address, Subnet Mask, and Gateway .................... 74
Figure 64. State Transition Diagram for Setting IP Address ...................................................... 75
Figure 65. Boot Options Configuration Menu ............................................................................ 75
Figure 66. Banner Configuration Menu ..................................................................................... 76
Figure 67. PCIe Risers and Add-in Cards ................................................................................. 78
Figure 68. GPGPU Cable .......................................................................................................... 79
Figure 69. IO Riser CPU Mapping ............................................................................................. 81
Figure 70. Right Riser Card Drawing ......................................................................................... 82
Figure 71. Left Riser Card Drawing ........................................................................................... 82
Figure 72. PDB ......................................................................................................................... 83
Figure 73. Upper Fans Connectors on PDB .............................................................................. 87
Figure 74. PDB Drawing ........................................................................................................... 88
Figure 75. SSI Common Front Panel Board .............................................................................. 89
Figure 76. Mezzanine Support .................................................................................................. 90
Figure 77. RMM4 Installation .................................................................................................... 91
Figure 78. PECI Proxy .............................................................................................................. 94
Figure 79. POST Diagnostic LED Location ............................................................................... 98
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List of Tables
Table 1. Server System ............................................................................................................... 4
Table 2. System Feature Set ....................................................................................................... 4
Table 3. System Environmental Limits Summary ........................................................................ 7
Table 4 Front Control Panel Options ......................................................................................... 10
Table 5. Power Supply Module Output Power Connector Pin-out ............................................. 18
Table 6. 1600 Watt (AC) Power Supply Efficiency (Gold) .......................................................... 19
Table 7. AC Power Cord Specifications .................................................................................... 20
Table 8. Power Factor ............................................................................................................... 21
Table 9. AC Input Voltage Range .............................................................................................. 21
Table 10. AC Line Dropout/Holdup ............................................................................................ 22
Table 11. AC Line Sag Transient Performance ......................................................................... 22
Table 12. AC Line Surge Transient Performance ...................................................................... 23
Table 13. Performance Criteria ................................................................................................. 23
Table 14. Power Supply Over Current Protection ...................................................................... 24
Table 15. Over Voltage Protection (OVP) Limits ....................................................................... 25
Table 16. 1600 Watt (DC) Power Supply Efficiency (Platinum) ................................................. 26
Table 17. 1600 Watt (DC) Power Supply Efficiency (Platinum) ................................................. 26
Table 18. DC Holdup/Dropout Time .......................................................................................... 26
Table 19. Line Voltage Transient Limits .................................................................................... 28
Table 20. Over Current Protection............................................................................................. 29
Table 21. Over Voltage Protection Limits .................................................................................. 29
Table 22. Example Load Share Threshold for Activating Supplies ............................................ 30
Table 23. LED Indicators ........................................................................................................... 32
Table 24. Lower Fan Connector Pin-out .................................................................................... 41
Table 25. Upper Fan Connector Pin-out (Fans 8-11) ................................................................. 42
Table 26. 2.5” Drive Status LED States ..................................................................................... 45
Table 27. 2.5” Drive Activity LED States.................................................................................... 45
Table 28. 3.5” Drive Status LED States ..................................................................................... 49
Table 29. 3.5” Drive Activity LED States.................................................................................... 49
Table 30. Intel® RAID C600 Upgrade Key Options .................................................................... 57
Table 31. System Status LED State Definitions......................................................................... 62
Table 32. Power/Sleep LED Functional States .......................................................................... 64
Table 33. GPGPU Aux Connector Pin-out (J9 and J10) ............................................................ 79
Table 34. Wattage Limitation of PCIe Loading .......................................................................... 80
Table 35. Over Current Protection Circuits ................................................................................ 83
Table 36. Power Supply Card Edge Connector Pin-out P8 and P9 ........................................... 84
Table 37. Main Power (J8) Connector Pin-out ........................................................................... 85
Table 38. Main Power (J6) Connector Pin-out ........................................................................... 85
Table 39. Power Control Signals Pin-out (J5) ............................................................................ 86
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Table 40. GPGPU Aux Connector Pin-out (J9 and J10) ............................................................ 86
Table 41. Upper Fan Connector Pin-out (Fans 8-11) ................................................................ 87
Table 42. SSI Front Panel Connector Pin-out (Baseboard) ....................................................... 89
Table 43. Intel® I/O Modules ..................................................................................................... 90
Table 44. POST Progress Code LED Example ......................................................................... 99
Table 45. POST Progress Codes .............................................................................................. 99
Table 46. MRC Progress Codes ............................................................................................. 102
Table 47. MRC Fatal Error Codes ........................................................................................... 103
Table 48. POST Error Messages and Handling ....................................................................... 105
Table 49. POST Error Beep Codes ......................................................................................... 110
Table 50. Integrated BMC Beep Codes ................................................................................... 110
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Intel® Server System R2000LH2/T2 Product Family TPS Introduction
1
1.1 Chapter Outline
1. Introduction
This Technical Product Specification (TPS) provides system level information for the Intel®
Server System R2000LH2 and Intel
level features of both these product families are common, however the server board integrated
into them is different. The Intel
®
Intel
Server Board S4600LH2 and the Intel® Server System R2000LTH2 product family is
integrated with the Intel
®
Server Board S4600LT2.
®
Server System R2000LT2 product families. The system
®
Server System R2000LH2 product family is integrated with an
This document describes the functions and features of the integrated server system which
includes the chassis layout, system boards, power subsystem, cooling subsystem, storage
subsystem options, and available installable options. Server board specific details can be
obtained by referencing the Intel
®
Server Boards S4600LH2/T2 Product Specification.
In addition, design-level information related to specific server board components or subsystems
can be obtained by ordering External Product Specifications (EPS) or External Design
Specifications (EDS) related to this server generation. EPS and EDS documents are made
available under NDA with Intel and must be ordered through your local Intel representative. See
the Reference Documents
section for a complete list of available documents.
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Product Family Overview
Chapter 3 – Power Subsystem
Chapter 4 – Thermal Management
Chapter 5 – System Storage and Peripherals Drive Bay Overview
Chapter 6 – Storage Controller Options Overview
Chapter 7 – Front Control Panel and I/O Panel Overview
Chapter 8 – Intel
Chapter 9 – PCI Riser Card Support
Chapter 10 – Additional System Boards
Chapter 11 – Front P anel
Chapter 12 – IO Module Support
Chapter 13 –Intel
Appendix A – Integration and Usage Tips
Appendix B – POST Code Diagnostic LED Decoder
Appendix C – Post Code Errors
Glossary
Reference Documents
®
Local Control Panel
®
Intelligent Power Node Manager (NM)
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Introduction Intel® Server System R2000LH2/T2 Product Family TPS
2
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
Very Large Scale Integration (VLSI) and power delivery components that need adequate airflow
to cool. Intel ensures through its own chassis development and testing that when Intel
building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses
not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible if components fail or the
server board does not operate correctly when used outside any of their published operating or
non-operating limits.
®
server
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Figure 1. System Overview
Figure 2. System Assembly
2. Product Family Overview
This generation of Intel 2U server platforms offers a variety of system options to meet the varied
configuration r equirements of high-density high-performance computing environments. The
®
Intel
Server System R2000LH2 and Intel® Server System R2000LT2 servers are comprised of
several available 2U rack mount server systems that are integrated with either an Intel
Board S4600LH2 or Intel
®
Server Board S4600LT2.
This chapter provides a high-level overview of the system features and available options as
supported in different platform SKUs within this server family. Greater detail for each major
system component or feature is provided in the following chapters.
®
Server
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Product Family Overview Intel® Server System R2000LH2/T2 Product Family TPS
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Table 1. Server System
Server System
Integrated Server Board
Intel® Server System R2000LH2
Intel® Server Board S4600LH2
Intel® Server System R2000LT2
Intel® Server Board S4600LT2
Table 2. System Feature Set
Feature
Description
Processor support
Support for up to four Intel® Xeon® processors E5-4600 product family with a Thermal
Memory
48 DIMM slots – 3 DIMMs / Channel – 4 memory channels per processor
Chipset
Intel® C600-A chipset with support for optional Storage Option Select keys
External I/O
DB-15 Video connector (Rear)
Internal I/O
One 2x5 pin connector providing front panel support for two USB ports
Optional I/O Module
The following I/O modules utilize a single proprietary on-board connector. An installed I/O
System Fans
11 managed system fan headers
Riser Cards
Two riser card slots:
Video Integrated 2D Video Controller
On-board storage
controllers and
One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices
Note: Table 2
lists features common to both server product families. Features that are unique to
one product family are identified by either denoting the server system name or the integrated
server board name.
Design Power (TDP) of up to 130 W
Unbuffered DDR3 (UDIMM), registered DDR3 (RDIMM), Load Reduced DDR3
(LRDIMM)
Memory DDR3 data transfer r ates of 800, 1066, 1333, and 1600 MT/s
DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V
connections
RJ-45 Serial Port A connector
S4600LH2 Dual-port Network Interface supporting 10/100/1000Mbps
S4600LT2 Dual-port Network Interface supporting 100/1000/10000Mbps
6 USB 2.0 connectors (4 rear + 2 front)
connectors / headers
support
One Type-A USB 2.0 connector
One 2x15 pin SSI-EEB compliant front panel header
One 2x7pin Front Panel Video connector
One DH-10 Serial Port B connector
module can be supported in addition to standard on-board features and any add-in
expansion cards.
Quad port 1 GbE based on Intel® Ethernet Controller I350 – RMS25CB0080
Dual port 10GBase-T Ethernet module based on Intel® Ethernet Controller I350
Dual SFP+ port 10GbE module based on Intel® 82500 10 GbE controller
Single Port FDR speed Infiniband* module with QSFP connector
Each riser card slot has a total of 48 PCIe lanes routed to them.
Each riser card slot supports various Full Height Full Length (FHFL) and Full Height
Half Length (FHHL) cards.
16 MB DDR3 Memory
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Feature
Description
options
Two 7-pin single port AHCI SATA connectors capable of supporting up to 6 GB/sec
Security
TPM Module AXXTPME5 (Accessory Option)
Server Management
Integrated Baseboard Management Controller, IPMI 2.0 compliant
Power Supply
The server system can have up to two power supply modules installed, providing
Storage Bay Options
8x – 2.5” SATA/SAS Hot Swap Hard Drive Bays
Available Rack
Tool-less rack mount premium rail kit – Intel Product Code – AXXPRAIL
Two SCU 4-port mini-SAS connectors capable of supporting up to 3 GB/sec
SAS/SATA
®
Intel
Support for Intel® Server Management Software
Intel® Remote Management Module 4 Lite – Accessory Option
Intel® Remote Management Module 4 Management NIC – Accessory Option
RAID C600 Upgrade Key support providing optional expanded SATA/SAS RAID
capabilities
Options
Mount Kit Options
support for the following power configurations: 1+0, 1+1 Redundant Power, and 2+0
Combined Power
Two power supply options:
AC 1600W
DC 1600W
4x – 3.5” SATA/SAS Hot Swap Hard Drive Bays
4x – 3.5” SATA/SAS Fixed Hard Drive Bays
Value rack mount rail kit – Intel Product Code – AXXVRAIL
Cable Management Arm – Intel Product Code – AXX1U2UCMA (*supported with
AXXPRAIL only)
2-post fixed mount bracket kit – Intel Product Code – AXX2POSTBRCKT
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Product Family Overview Intel® Server System R2000LH2/T2 Product Family TPS
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2.1 Chassis Dimensions
Figure 3. Chassis Dimensions
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2.2 System Level Environmental Limits
Table 3. System Environmental Limits Summary
Parameter
Limits
Temperature
Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC 1 (50ºF to 95ºF)
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hrs. per
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hrs. per
Shipping
-40ºC to 70ºC (-40ºF to 158ºF)
Altitude
Operating
Support operation up to 3050m with ASHRAE class deratings
Humidity
Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28°C (at
Shock
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25 g, velocity change is based on packaged weight
Packaged
Product Weight: ≥ 40 to < 80
Vibration
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage
90 Hz to 132 V and 180 V to 264 V
Frequency
47 Hz to 63 Hz
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Non-
Unidirectional
Line to earth
AC Leads 2.0 kV
ESD
Air Discharged
12.0 kV
Contact
8.0 kV
Acoustics
Power in Watts
<300 W ≥300 W ≥600 W ≥1000 W
Servers/Rack
7.0 7.0 7.0 7.0
The following table defines the system level operating and non-operating environmental limits.
with the maximum rate of change not to exceed 10°C per hour
year
year
temperatures from 25°C to 35°C)
Sound Power
Measured
operating and
operating
Only
Discharge
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
I/O Leads 1.0 kV
DC Leads 0.5 kV
Mount BA
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Note:
1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool. Intel ensures through its own chassis development and testing that when
®
server building blocks are used together, the fully integrated system will meet the intended thermal
Intel
requirements of these components. It is the responsibility of the system integrator who chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to determine
the amount of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly when used
outside any of its published operating or non-operati ng limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
See the Intel® Server Board S4600LH2/T2 Power Budget and Thermal Configuration Guidelines
Tool for system configuration requirements and limitations.
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2.3 System Features and Options Overview
Figure 4. System Components Overview
2.3.1
Hot Swap Hard Drive Bay and Front Panel Options
Figure 5. 2.5" Hot Swap Hard Drive Bay - 8 Drive Configuration
Figure 6. 3.5" Hotswap Hard Drive Bay - 4 Drive Configuration
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2.3.2
Back Panel Features
Figure 7. Back Panel Feature Identification
2.3.3
Front Control Panel Options
Figure 8. Front Control Panel Options
Table 4 Front Control Panel Options
Label
Description
Label
Description
A
System ID Button
F
System Status LED
w/Integrated LED
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Label
Description
Label
Description
B
NMI Button (recessed,
G
Power Button
C
NIC-1 Activity LED
H
Hard Drive Activity LED
D
Not used
I
Not used
E
System Cold Reset
J
NIC-2 Activity LED
tool required for use)
Button
w/Integrated LED
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2.4 Server Board Features Overview
Figure 9. Intel® Server Board S4600LH2/LT2
The following illustration provides a general overview of the server board, identifying key feature
and component locations. The majority of the items identified are common for the Intel
®
Server
Board S4600LH2 and S4600LH2. The accompanying table identifies variations when present.
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2.5 Available Front Bezel Support
Figure 10. Optional Front Bezel (Intel Product Order Code – A2UBEZEL)
Figure 11. Installing the Front Bezel
The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow to maintain system cooling requirements. The bezel
assembly includes snap-in options that can be used for customization.
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2.6 Available Rack and Cabinet Mounting Kit Options
Tool-less rack mount rail kit – Intel Product Code – AXXPRAIL
- 2U compatible
- 65 lbs. max support weight
- Tool-less installation
- Full extension from rack
- Drop in system install
- Optional cable management arm support
Cable Management Arm – Intel Product Code – AXX1U2UCMA (*supported with
AXXPRAIL only)
2-Post Fixed mount bracket kit – Intel Product Code – AXX2POSTBRCKT
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Intel® Server System R2000LH2/T2 Product Family TPS Power Subsystem
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Figure 12. Power Supply
3. Power Subsystem
This chapter provides a high level overview of the power management features and
specification data for the power supply options available for this server product. Specification
variations are identified for each supported power supply.
The server system can have up to two power supply modules installed, supporting the following
power supply configurations: 1+0 (single power supply), 1+1 redundant power, and 2+0
combined power (non-redundant).The 1+1 redundant power and 2+0 combined power
configurations are automatically configured depending on the total power draw of the system. If
the total system power draw exceeds the power capacity of a single power supply module, the
power from the second power supply module will be utilized. If this occurs, power redundancy
will be lost. In a 2+0 power configuration, the total power available may be less than twice the
rated power of the installed power supply modules due to the amount of heat produced with
both supplies providing peak power. If system thermals exceed programmed limits, platform
management will attempt to keep the system operational. See
(CLST) and Thermal Management for det ails.
There are two power supply options available for this server product: 1600W AC and 1600W
DC.
Closed Loop System Throttling
Note: Mixing of AC and DC power supplies in the same system is unsupported.
The power supplies are modular, allowing for tool-less insertion and extraction from a bay in the
back of the chassis. When inserted, the card edge connector of the power supply mates blindly
to a matching slot connector on the server board.
In the event of a power supply failure, redundant 1+1 power supply configurations support hotswap extraction and insertion.
The AC input is auto-ranging and power factor corrected.
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3.1 Mechanical Overview
Figure 13. Power Supply Module Mechanical Drawing
Figure 14. Power Supply Module
The physical size of the power supply enclosure is 39/40mm x 74mm x 185mm. The power
supply contains a single 40mm fan. The power supply has a card edge output that interfaces
with a 2x25 card edge connector in the system. The AC plugs directly into the external face of
the power supply.
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Figure 15. AC and DC Power Supplies – Connector View
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3.2 Power Connectors
3.2.1
Power Supply Module Card Edge Connector
Table 5. Power Supply Module Output Power Connector Pin-out
Pin
Name
Pin
Name
A1
GND
B1
GND
A2
GND
B2
GND
A3
GND
B3
GND
A4
GND
B4
GND
A5
GND
B5
GND
A6
GND
B6
GND
A7
GND
B7
GND
A8
GND
B8
GND
A9
GND
B9
GND
A10
+12V
B10
+12V
A11
+12V
B11
+12V
A12
+12V
B12
+12V
A13
+12V
B13
+12V
A14
+12V
B14
+12V
A15
+12V
B15
+12V
A16
+12V
B16
+12V
A17
+12V
B17
+12V
A18
+12V
B18
+12V
A19
PMBus SDA
B19
A0 (SMBus address)
A20
PMBus SCL
B20
A1 (SMBus address)
A21
PSON
B21
12V stby
A22
SMBAlert#
B22
Cold Redundancy Bus
A23
Return Sense
B23
12V load share bus
A24
+12V remote Sense
B24
No Connect
A25
PWOK
B25
Compatibility Check
Each power supply module has a single 2x25 card edge output connection that plugs directly
into a matching slot connector on the server board. The connector provides both power and
communication signals to the server board. The following table defines the connector pin-out.
The connector pin out in table applies to the 1600W (AC) and 1600W (DC) power supplies.
Note: Mixing of AC and DC power supplies in the same system is unsupported.
pin*
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