Intel mPGA604 User Manual
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mPGA604 Socket
Mechanical Design Guide
March 2005
Document Number: 254239-002
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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The mPGA604 socket may contain design defects or errors known as errata, which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents, which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-5484725, or by visiting
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Copyright © 2003-2005, Intel Corporation. All rights reserved.
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Intel's Web Site.
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Contents
1 Introduction.......................................................................................................................7
1.1 Objective ................................................................................................................7
1.2 Purpose.................................................................................................................. 7
1.3 Scope ..................................................................................................................... 7
2 Assembled Component and Package Description........................................................ 9
3 Mechanical Requirements..............................................................................................11
3.1 Attachment ........................................................................................................... 11
3.2 Materials............................................................................................................... 11
3.2.1 Socket Housing....................................................................................... 11
3.2.2 Color........................................................................................................ 11
3.3 Cutouts for Package Removal .............................................................................11
3.4 Socket Standoffs Height ......................................................................................11
3.5 Markings............................................................................................................... 12
3.5.1 Name....................................................................................................... 12
3.5.2 Lock (Closed) and Unlock (Open) Markings........................................... 12
3.5.3 Lot Traceability........................................................................................ 12
3.6 Socket Size ..........................................................................................................12
3.7 Socket/Package Translation During Actuation ....................................................13
3.8 Orientation in Packaging, Shipping and Handling ...............................................13
3.9 Contact Characteristics........................................................................................ 13
3.9.1 Number of contacts................................................................................. 13
3.9.2 Base Material .......................................................................................... 13
3.9.3 Contact Area Plating ............................................................................... 13
3.9.4 Solder Ball Attachment Area Plating....................................................... 13
3.9.5 Solder Ball Characteristics...................................................................... 13
3.9.6 Lubricants................................................................................................ 13
3.10 Material and Recycling Requirements .................................................................13
3.11 Lever Actuation Requirements............................................................................. 14
3.12 Socket Engagement/Disengagement Force ........................................................ 14
3.13 Visual Aids ...........................................................................................................14
3.14 Socket BGA Co-Planarity..................................................................................... 14
3.15 Solder Ball True Position .....................................................................................14
3.16 Critical-to-Function Dimensions ........................................................................... 14
4 Electrical Requirements.................................................................................................17
4.1 Electrical Resistance............................................................................................ 18
4.2 Determination of Maximum Electrical Resistance ...............................................22
4.3 Inductance............................................................................................................ 23
4.3.1 Design Procedure for Inductance Measurements .................................. 24
4.3.2 Correlation of Measurement and Model Data Inductance ...................... 25
4.4 Pin-to-Pin Capacitance ........................................................................................ 25
4.5 Dielectric Withstand Voltage ................................................................................25
4.6 Insulation Resistance........................................................................................... 25
4.7 Contact Current Rating ........................................................................................ 25
5 Environmental Requirements........................................................................................27
5.1 Mixed Flowing Gas ..............................................................................................28
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5.2
Solvent Resistance ..............................................................................................28
5.3 Durability ..............................................................................................................28
6 Validation Testing Requirements.................................................................................. 29
6.1 Applicable Documents .........................................................................................29
6.2 Testing Facility .....................................................................................................29
6.3 Funding ................................................................................................................29
6.4 Socket Design Verification ...................................................................................29
6.5 Reporting.............................................................................................................. 29
6.6 Process Changes................................................................................................. 29
6.7 Quality Assurance Requirements ........................................................................30
6.8 Socket Test Plan.................................................................................................. 30
6.8.1 Submission of an mPGA604 Socket for Validation Testing.................... 30
6.9 Mechanical Samples............................................................................................ 30
6.10 Socket Validation Notification ..............................................................................30
6.11 Production Lot Definition...................................................................................... 30
6.12 Socket Validation .................................................................................................30
7 Safety Requirements ......................................................................................................31
8 Documentation Requirements....................................................................................... 33
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9 Mechanical Drawings .....................................................................................................35
Figures
4-1 Methodology for Measuring Total Electrical Resistance...................................... 18
4-2 Methodology for Measuring Electrical Resistance of the Jumper........................ 18
4-3 Electrical Resistance Fixtures Superimposed ..................................................... 19
4-4 Inductance Measurement Fixture Cross-Section................................................. 23
4-5 Inductance and Capacitance Fixture ................................................................... 23
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ................. 27
9-1 mPGA604 Socket Drawing (Sheet 1 of 4) ........................................................... 35
9-2 mPGA604 Socket Drawing (Sheet 2 of 4) ........................................................... 36
9-3 mPGA604 Socket Drawing (Sheet 3 of 4) ........................................................... 37
9-4 mPGA604 Socket Drawing (Sheet 4 of 4) ........................................................... 38
9-5 603-Pin Interposer Assembly Drawing (Sheet 1 of 6).......................................... 39
9-6 603-Pin Interposer Assembly Drawing (Sheet 2 of 6).......................................... 40
9-7 603-Pin Interposer Assembly Drawing (Sheet 3 of 6).......................................... 41
9-8 603-Pin Interposer Assembly Drawing OLGA Keepout (Sheet 4 of 6)................ 42
9-9 603-Pin Interposer Assembly Drawing FCBGA2 Keepout (Sheet 5 of 6)............ 43
9-10 603-Pin Interposer Assembly Drawing (Sheet 6 of 6).......................................... 44
Tables
3-1 Package Critical-To-Function (CTF) Dimensions ................................................ 15
4-1 Electrical Requirements for Sockets.................................................................... 17
4-2 Definitions (Sheet 1 of 2) .....................................................................................17
4-3 Resistance Test Fixture Netlist (Sheet 1 of 2) ..................................................... 21
4-4 Net list for FSETV4 Rev 1 Edge Fingers ............................................................. 26
5-1 Use Conditions Environment ............................................................................... 27
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Revision History
Revision
Number
001 • Initial release of the document. October 2003
002 • Updated for 2005 Intel® Xeon™ products. March 2005
Note: Not all revisions may be published.
Description Date
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Mechanical Design Guide
Re-Validation Notice to Socket Vendors
Any significant change to the socket will require submission of a detailed explanation of the change
at least 60 days prior to the planned implementation. Intel will review the modification and establish
the necessary re-validation procedure that the socket must pass. Any testing that is required MUST
be completed before the change is implemented.
Typical examples of significant changes include, but are not limited to, the following: plastic
material changes including base material or color; contact changes including base material, plating
material or thickness; and design modifications.
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For details on validation testing requirements, see
Section 6.
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1 Introduction
1.1 Objective
This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation
and server platforms based on Intel microprocessors. The socket provides I/O, power and ground
contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with
solder balls/surface mount features for surface mounting with the motherboard. The mPGA604
Socket contacts have 1.27mm pitch with regular pin array, to mate with a 604-pin processor
package. A 604-pin package will be mated with a 603 solder ball socket. The dummy pin is a key
that allows either the 603-pin processor package or the 604-pin processor package to be used in the
same socket.
1.2 Purpose
To define functional, quality, reliability, and material (that is, visual, dimensional and physical)
requirements and design guidelines of the mPGA604 Socket in order to provide low cost, low risk,
robust, high volume manufacturable (HVM) socket solution available from multiple sources.
1.3 Scope
This design guideline applies to all 604-pin ZIF sockets purchased to the requirements of this design
guideline.
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Introduction
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2 Assembled Component and
Package Description
The mPGA604 socket dimensions and characteristics must be compatible with that of the processor
package and related assembly components. Processors using flip-chip pin grid array (FC- mPGA4)
package technology are targeted to be used with the mPGA604 socket.
The assembled component may consist of a cooling solution (heatsink, fan, and retention
mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines
document provides information for designing components compliant with the Intel reference design.
Relevant processor FC-mPGA4 package and pin-out information is given in the processor
Electrical, Mechanical and Thermal Specifications document.
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Assembled Component and Package Description
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3 Mechanical Requirements
3.1 Attachment
A retention system needs to isolate any load in excess of 222.41 N, compressive, from the socket
during the shock and vibration conditions outlined in
mechanical shock and vibration requirements listed in
retention mechanism attached. Socket can only be attached by the 603 contacts to the motherboard.
No external (i.e. screw, extra solder, adhesive....) methods to attach the socket are acceptable.
3.2 Materials
3.2.1 Socket Housing
Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of
withstanding a temperature of 240°C for 40sec (minimum) typical of a reflow profile for solder
material used on the socket. The material must have a thermal coefficient of expansion in the XY
plane capable of passing reliability tests rated for an expected high operating temperature, mounted
on FR4type motherboard material.
Section 5. The socket must pass the
Section 5 with the associated heatsink and
3.2.2 Color
The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place
vision systems. The base and cover of the socket may be different colors as long as they meet the
above requirement.
3.3 Cutouts for Package Removal
Recessed cutouts are required in the side of the socket to provide better access to the package
substrate, and facilitate the manual removal of inserted package (see
3.4 Socket Standoffs Height
Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin
shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket
standoffs and the pin field cannot contact the standoffs (see
Section 9).
Section 9).
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Mechanical Requirements
3.5 Markings
All markings required in this section must be able to withstand a temperature of 240 ºC for 40
seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any
environmental test procedure outlined in
Section 5.
3.5.1 Name
mPGA604 (Font type is Helvetica Bold – minimum 6 point).
This mark shall be molded or Laser Marked into the processor side of the socket housing.
Manufacturer’s insignia (font size at supplier’s discretion).
This mark will be molded or laser marked into the socket housing. Both marks must be visible when
first seated in the motherboard. Any request for variation from this marking requires a written
description (detailing size and location) to be provided to Intel for approval.
3.5.2 Lock (Closed) and Unlock (Open) Markings
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The universal symbols for ‘Lock’ and ‘Unlock’ are to be marked on the socket in the appropriate
positions. Clear indicator marks must be located on the actuation mechanism that identifies the lock
(closed) and unlock (open) positions of the cover as well as the actuation direction. These marks
should still be visible after a package is inserted into the socket.
3.5.3 Lot Traceability
Each socket will be marked with a lot identification code that will allow traceability of all
components, date of manufacture (year and week), and assembly location. The mark must be placed
on a surface that is visible when mounted on a printed circuit board. In addition, this identification
code must be marked on the exterior of the box in which the units ship.
3.6 Socket Size
The socket size must meet the dimensions as shown in Section 9, allowing full insertion of the pins
in the socket, without interference between the socket and the pin field. The mPGA604 Socket and
actuation area must fit within the keep-in zone defined in
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Section 9.
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Mechanical Requirements
3.7 Socket/Package Translation During Actuation
The socket shall be built so that the post-actuated package pin field displacement will not exceed
1.27 mm. Movement will be along the Y direction. No Z-axis travel (lift out) of the package is
allowed during actuation.
3.8 Orientation in Packaging, Shipping and Handling
Packaging media needs to support high volume manufacturing.
3.9 Contact Characteristics
3.9.1 Number of contacts
Total number of contacts: 603.
Total number of contact holes: 604.
3.9.2 Base Material
High strength copper alloy.
3.9.3 Contact Area Plating
0.762 µm (min) gold plating over 1.27 µm (min) nickel underplate in critical contact areas (area on
socket contacts where processor pins will mate) is required. No contamination by solder in the
contact area is allowed during solder reflow.
3.9.4 Solder Ball Attachment Area Plating
3.81 µm (min) Tin/Lead (typically 85+-5Sn/Pb balance).
3.9.5 Solder Ball Characteristics
Tin/Lead (63/37 + 0.5% Sn).
3.9.6 Lubricants
For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are
used elsewhere within the socket assembly, these lubricants must not be able to migrate to the
socket contacts.
3.10 Material and Recycling Requirements
Cadmium shall not be used in the painting or plating of the socket.
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Mechanical Requirements
CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic
component exceeding 25g must be recyclable as per the European Blue Angel recycling design
guidelines.
3.11 Lever Actuation Requirements
• Lever closed direction—right.
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• Actuation direction called out in
• 135º lever travel max.
• Pivot point in the center of the actuation area on the top of the socket.
Section 9.
Section 9.
3.12 Socket Engagement/Disengagement Force
The force on the actuation lever arm must not exceed 44N to engage or disengage the package into
the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard.
The processor package must not be utilized in the actuation of the socket. Any actuation must meet
or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of
Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).
3.13 Visual Aids
The socket top will have markings identifying Pin 1. This marking will be represented by a clearly
visible triangular symbol (see
Section 9).
3.14 Socket BGA Co-Planarity
The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in
Section 9.
3.15 Solder Ball True Position
The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see
Section 9).
3.16 Critical-to-Function Dimensions
The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric.
Asymmetric features are designed to properly align the socket to the motherboard and prevent the
socket from being assembled incorrectly to the motherboard.
Critical-to-function (CTF) dimensions are identified in
the mPGA604 socket drawing in
document. Dimensional requirements identified in the drawing and in
dimensions will be verified as part of the validation process. Also, supplier will provide and
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Section 9 and take precedence over all values presented in this
Table 3-1. The CTF values are detailed on
Table 3-1 must be met. These
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