Intel mPGA604 User Manual 2
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mPGA604 Socket
Design Guidelines
Revision 1.0
October 2003
Document Number: 254239-001
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Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.
Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your
product order.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO
FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications, product descriptions, and plans at any time, without notice.
All dates are provided for planning purposes only and are subject to change without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The mPGA604 socket may contain design defects or errors known as errata, which may cause the product to deviate from published specifications.
Current characterized err ata are available upon reques t.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling1-800-548-
4725, or by visiting Intel's website at http://www.intel.com.
Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Copyright © 2003, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.
®
PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS
2 mPGA604 Socket Design Guidelines
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Contents
1 Introduction.......................................................................................................................9
1.1 Objective ................................................................................................................9
1.2 Purpose..................................................................................................................9
1.3 Scope.....................................................................................................................9
2 Assembled Component and Package Description...................................................... 11
2.1 Assembled Component Description..................................................................... 11
2.2 Package Description ............................................................................................11
3 Mechanical Requirements..............................................................................................13
3.1 Mechanical Supports ...........................................................................................13
3.2 Materials............................................................................................................... 13
3.2.1 Socket Housing.......................................................................................13
3.2.2 Color........................................................................................................ 13
3.3 Cutouts for Package Removal.............................................................................13
3.4 Socket Standoff Height ........................................................................................13
3.5 Markings............................................................................................................... 14
3.5.1 Name....................................................................................................... 14
3.5.2 Lock (Closed) and Unlock (Open) Markings...........................................14
3.5.3 Lot Traceability........................................................................................ 14
3.6 Socket Size ..........................................................................................................15
3.7 Socket/Package Translation During Actuation .................................................... 15
3.8 Orientation in Packaging, Shipping and Handling ...............................................15
3.9 Contact Characteristics........................................................................................15
3.9.1 Number of Contacts................................................................................15
3.9.2 Base Material..........................................................................................15
3.9.3 Contact Area Plating...............................................................................15
3.9.4 Solder Ball Attachment Area Plat ing....................................................... 15
3.9.5 Solder Ball Characteristics...................................................................... 15
3.9.6 Lubricants................................................................................................ 16
3.10 Material and Recycling Requirements.................................................................16
3.11 Lever Actuation Requirements.............................................................................16
3.12 Socket Engagement/Disengagement Force........................................................16
3.13 Visual Aids ...........................................................................................................16
3.14 Socket BGA Co-Planarity..................................................................................... 16
3.15 Solder Ball True Position .....................................................................................16
3.16 Critical-to-Function Dimensions...........................................................................17
4 Electrical Requirements .................................................................................................19
4.1 Electrical Resistance............................................................................................ 20
4.2 Determination of Maximum Electrical Resistance ............................................... 24
4.3 Inductance............................................................................................................ 24
4.3.1 Design Procedure for Inductance Measurements ..................................25
4.3.2 Correlation of Measurement and Model Data Inductance......................26
4.4 Pin-to-Pin Capacitance ........................................................................................27
4.5 Dielectric Withstand Voltage................................................................................ 27
4.6 Insulation Resistance...........................................................................................27
4.7 Contact Current Rating ........................................................................................ 27
mPGA604 Socket Design Guidelines 3
5 Environmental Requirements........................................................................................29
5.1 Porosity Test........................................................................................................30
5.1.1 Porosity Test Method..............................................................................30
5.1.2 Porosity Test Criteria ..............................................................................30
5.2 Plating Thickness.................................................................................................30
5.3 Solvent Resistance ..............................................................................................30
5.4 Solderability.......................................................................................................... 30
5.5 Durability..............................................................................................................31
6 Validation Testing Requirements..................................................................................33
6.1 Applicable Documents .........................................................................................33
6.2 Testing Facility .....................................................................................................33
6.3 Funding................................................................................................................33
6.4 Socket Design Verification...................................................................................33
6.5 Reporting.............................................................................................................. 33
6.6 Process Changes.................................................................................................33
6.7 Quality Assurance Requirem ents ........................................................................34
6.8 Socket Test Plan..................................................................................................34
6.8.1 Submission of an mPGA604 Socket for Validation Testing....................34
6.9 Mechanical Samples............................................................................................34
6.10 Socket Validation Notification .............................................................................. 34
6.11 Production Lot Definition......................................................................................34
6.12 Socket Validation .................................................................................................34
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7 Safety Requirements ...................................................................................................... 35
8 Documentation Requirements....................................................................................... 37
A Appendix A......................................................................................................................39
Figures
Figure 4-1. Methodology for Measuring Total Electrical Resistance ................................20
Figure 4-2. Methodology for Measuring Electrical Resistance of the Jumper .................. 20
Figure 4-3. Electrical Resistance Fixtures Superimposed................................................ 21
Figure 4-4. Inductance Measurement Fixture Cross-Section...........................................25
Figure 4-5. Inductance and Capacitance Fixture..............................................................25
Figure 5-1. Flowchart of Knowledge-Based Reliability Evaluation Methodology .............29
Figure A-1. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 1 of 3)......................39
Figure A-2. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 2 of 3)......................40
Figure A-3. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 3 of 3)......................41
Figure A-4. mPGA604 Socket Drawing (Sheet 1 of 3) ..................................................... 42
Figure A-5. mPGA604 Socket Drawing (Sheet 2 of 3) ..................................................... 43
Figure A-6. mPGA604 Socket Drawing (Sheet 3 of 3) ..................................................... 44
Figure A-7. 603-Pin Interposer Assembly Drawing (Sheet 1 of 7)....................................45
Figure A-8. 603-Pin Interposer Assembly Drawing (Sheet 2 of 7)....................................46
Figure A-9. 603-Pin Interposer Assembly Drawing (Sheet 3 of 7)....................................47
Figure A-10. 603-Pin Interposer Assembly Drawing (Sheet 4 of 7)..................................48
Figure A-11. 603-Pin Interposer Assembly Drawing (Sheet 5 of 7)..................................49
Figure A-12. 603-Pin Interposer Assembly Drawing (Sheet 6 of 7)..................................50
Figure A-13. 603-Pin Interposer Assembly Drawing (Sheet 7 of 7)..................................51
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Tables
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2-1 Package Critical-To-Function (CTF) Dimensions ................................................ 11
3-1 Socket Critical-to-Function Dimensions...............................................................17
4-1 Electrical Requirements for Sockets.................................................................... 19
4-2 Definitions ............................................................................................................19
4-3 Resistance Test Fixtures Netlist ..........................................................................22
4-4 Netlist for FSETV4 Rev 1 Edge Fingers .............................................................. 27
5-1 Use Conditions Environment ...............................................................................29
mPGA604 Socket Design Guidelines 5
Revision History
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Revision
Number
1.0 • Initial releas e of the document. October 2003
Description Date
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Re-Validation Notice to Socket Vendors
Any significant change to the socket will require submission of a detailed explanation of the change
at least 60 days prior to the planned implementation. Intel will review the modification and
establish the necessary re-validation procedure that the socket must pass. Any testing that is
required MUST be completed before the change is implemented.
Typical examples of significant changes include, but are not limited to, the following: plastic
material changes including base material or color; contact changes including base material, plating
material or thickness; and design modifications.
For details on validation testing requirements, see Section 6.
mPGA604 Socket Design Guidelines 7
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1 Introduction
1.1 Objective
This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation
and server platforms based on future Intel microprocessors. The socket provides I/O, power and
ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket
with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604
socket contacts have 50mil pitch with regular pin array, to mate with a 604-pin processor package.
A 604-pin package will be mated with a 603 solder ball socket. The dummy pin is a key that allows
either the 603-pin processor package or the 604-pin processor package to be used in the same
socket.
1.2 Purpose
To define functional, quality, reliability, and material (that is, visual, dimensional and physical)
requirements and design guidelines of the mPGA604 socket in order to provide low cost, low risk,
robust, high volume manufacturable (HVM) socket solution available from multiple sources.
1.3 Scope
This design guideline applies to all 604-pin ZIF sockets purchased to the requirements of this design
guideline.
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Introduction
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10 mPGA604 Socket Design Guidelines
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2 Assembled Component and
Package Description
Information provided in this section is to ensure dimensional compatibility of the mPGA604 socket
with that of the 604-pin processor package. The processor package must be inserted into the
mPGA604 socket with zero insertion force when the socket is not actuated.
2.1 Assembled Component Description
The assembled component may consist of a heatsink, EMI shield, clips, fan, retention mechanism
(RM), and processor package. Specific details can be obtained from Thermal Design Guidelines,
consult your Intel field representative to obtain this document.
2.2 Package Description
The outline of the processor package that can be used with the mPGA604 socket is illustrated in
Figure A-1. This drawing does not include potential heatsinks since these are used at the OEM's
discretion.
The pin-out for the 604-pin processor package is shown in Figure A-2.
The pin dimension details, base material, plating material and plating thickness are shown in
Figure A-3. Note the dimensional variation when designing to ensure ZIF. The package Critical-ToFunction (CTF) dimensions are presented in Table 2-1. CTF values are detailed on the processor
package drawings and take precedence over all values presented in this document.
Table 2-1. Package Critical-To-Function (CTF) Dimensions
Dimension
Shoulder Diameter (Land Solder Fillet Shoulder Inclusion)
Pin Diameter
Shoulder Diameter Protrusion (Land Solder Fillet Shoulder
Inclusion)
Pin Length (Effective)*
Pin True Position (Pattern Relating and Feature Relating)*
Flatness of Processor*
Note: Pin length, pin true position and flatness tolerances are controlled by Geometric Dimensioning and
Tolerancing (GD&T) c ontrols.
mPGA604 Socket Design Guidelines 11
Assembled Component and Pack ag e Des c riptio n
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3 Mechanical Requirements
3.1 Mechanical Supports
A retention system needs to isolate any load in excess of 50 lbf, compressive, from the socket during
the shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical
shock and vibration requirements listed in Sections 5 with the associated heatsink and retention
mechanism attached. socket can only be attached by the 603 contacts to the motherboard. No
external (i.e. screw, extra solder, adhesive, etc.) methods to attach the socket are acceptable.
3.2 Materials
3.2.1 Socket Housing
Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of
withstanding a temperature of 240°C for 40sec (minimum) typical of a reflow profile for solder
material used on the socket. The material must have a thermal coefficient of expansion in the XY
plane capable of passing reliability tests rated for an expected high operating temperature, mounted
on FR4-type motherboard material.
3.2.2 Color
The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place
vision systems. The base and cover of the socket may be different colors as long as they meet the
above requirement.
3.3 Cutouts for Package Removal
Recessed cutouts are required in the side of the socket to provide better access to the package
substrate, and facilitate the manual removal of inserted package. Figure A-6.
3.4 Socket Standoff Height
Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin
shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket
standoffs and the pin field cannot contact the standoffs. Figure A-5.
mPGA604 Socket Design Guidelines 13
Mechanical Requirements
3.5 Markings
All markings required in this section must be able to withstand a temperature of 240°C for 40
seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any
environmental test procedure outlined in Section 5.
3.5.1 Name
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Proper seating
mPGA604 (font type is Helvetica Bold – minimum 6 point).
This mark shall be molded or Laser Marked into the processor side of the socket housing.
Manufacturer’s insignia (font size at supplie r’s discretion).
This mark will be molded or laser marked into the socket housing. Both marks must be visible when
first seated in the motherboard. Any request for variation from this marking requires a written
description (detailing size and location) to be provided to Intel for approval.
3.5.2 Lock (Closed) and Unlock (Open) Markings
The universal symbols for ‘Lock’ and ‘Unlock’ are to be marked on the socket in the appropriate
positions. Clear indicator marks must be located on the actuation mechanism that identi fie s the lock
(closed) and unlock (open) positions of the cover as well as the actuation direction. These marks
should still be visible after a package is inserted into the socket.
Lock (closed) Unlock (open)
3.5.3 Lot Traceability
Each socket will be marked with a lot identification code that will allow traceability of all
components, date of manufacture (year and week), and assembly location. The mark must be placed
on a surface that is visible when mounted on a printed circuit board. In addition, this identification
code must be marked on the exterior of the box in which the units ship.
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Mechanical Requirements
3.6 Socket Size
The socket size must meet the dimensions as shown in Figure A-5 and Figure A-6, allowing full
insertion of the pins in the socket, without interference between the socket and the pin field. The
mPGA604 socket and actuation area must fit within the keep-in zone defined in Figure A-6.
3.7 Socket/Package Translation During Actuation
The socket shall be built so that the post-actuated package pin field displace ment will not exceed
1.27 mm. Movement will be along the Y direction (refer to axes as indicated in Figure A-5. No Zaxis travel (lift out) of the package is allowed during actuation.
3.8 Orientation in Packaging, Shipping and Handling
Packaging media needs to support high volume manufacturing.
3.9 Contact Characteristics
3.9.1 Number of Contacts
Total number of contacts: 603.
Total number of contact holes: 604.
3.9.2 Base Material
High strength copper alloy.
3.9.3 Contact Area Plating
0.762 µm (min) gold plating over 1.27 µm (min) nickel underplate in critical contact areas (area on
socket contacts where processor pins will mate) is required. No contamination by solder in the
contact area is allowed during solder reflow.
3.9.4 Solder Ball Attachment Area Plating
3.81 µm (min) Tin/Lead (typically 85±5Sn/15Pb).
3.9.5 Solder Ball Characteristics
Tin/Lead (63/37 ± 0.5% Sn).
mPGA604 Socket Design Guidelines 15
Mechanical Requirements
3.9.6 Lubricants
For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are
used elsewhere within the socket assembly, these lubricants must not be able to migrate to the
socket contacts.
3.10 Material and Recycling Requirements
Cadmium shall not be used in the painting or plating of the socket.
CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic
component exceeding 25g must be recyclable as per the European Blue Angel recycling design
guidelines.
3.11 Lever Actuation Requirements
• Lever closed direc tion – right.
• Actuation direction called out in Figure A-5.
• 135° lever travel max.
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• Pivot point in the center of the actuation area on the top of the socket. Figure A-6.
3.12 Socket Engagement/Disengagement Force
The force on the actuation lever arm must not exceed 44N to engage or disengage the package into
the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard.
The processor package must not be utilized in the actuation of the socket. Any actuation m ust meet
or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of
Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).
3.13 Visual Aids
The socket top will have markings identifying Pin 1. This marking will be represented by a clearly
visible triangular symbol. See Figure A-6.
3.14 Socket BGA Co-Planarity
The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in
Figure A-5.
3.15 Solder Ball True Position
The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see
Figure A-5).
16 mPGA604 Socket Design Guidelines
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