Intel JBOD2312S3SP Hardware Manual
Intel® Storage System JBOD2312S3SP
Hardware Guide
A document providing a system level overview of product features, functions,
architecture, and support specifications
Revision 1.3
Mar 2016
Intel® Server Boards and Systems
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JBOD2000S3SP Hardware Guide
ii
Revision
Number
November 2014
0.9
Pre-production release.
December 2014
1.0
Production version release.
May 2015
1.1
Removed references to PSU Cold Redundancy support.
October 2015
1.2
Added optional PSU and power cable references in the Power Subsystem
March 2016
1.3
Converted to the new format.
Revision History
Date
Modifications
section.
JBOD2000S3SP Hardware Guide
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Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
course of performance, course of dealing, or usage in trade.
This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest
Hardware Guide.
The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.
Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others
© 2016 Intel Corporation.
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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Table of Contents
1 Introduction .................................................................................................................................................................. 1
1.1 Server Product Use Disclaimer ............................................................................................................................................... 1
1.2 Product Errata ............................................................................................................................................................................... 1
2 Product Family Overview ........................................................................................................................................... 2
2.1 Chassis Dimensions .................................................................................................................................................................... 3
2.2 System Level Environmental Limits ...................................................................................................................................... 4
2.3 System Features and Options Overview ............................................................................................................................. 5
2.3.1 Hot Swap Hard Drive Bay .................................................................................................................................................. 5
2.3.2 Front Control Panel .............................................................................................................................................................. 6
2.3.3 Back Panel Features ............................................................................................................................................................ 7
3 System Storage and Peripheral Drive Bay Overview ........................................................................................... 8
3.1 3.5” Hard Disk Drive Support .................................................................................................................................................. 8
3.2 3.5” Drive Hot-Swap Backplane Overview ........................................................................................................................ 9
3.2.1 Cypress* CY8C22545 Enclosure Management Controller ............................................................................... 10
4 Power Subsystem ..................................................................................................................................................... 11
4.1 Power Distribution Board (PDB) .......................................................................................................................................... 12
4.2 Mechanical Overview .............................................................................................................................................................. 14
4.3 Power Connectors ..................................................................................................................................................................... 16
4.3.1 Power Supply Module Card Edge Connector ........................................................................................................ 16
4.3.2 Hot-Swap Backplane Power Connector ................................................................................................................... 16
4.4 Power Supply Module Efficiency ......................................................................................................................................... 17
4.5 AC Power Cord Specification Requirements ................................................................................................................... 17
4.6 AC Input Specifications........................................................................................................................................................... 17
4.6.1 Power Factor ....................................................................................................................................................................... 17
4.6.2 AC Input Voltage Specification .................................................................................................................................... 18
4.6.3 AC Line Isolation Requirements .................................................................................................................................. 18
4.6.4 AC Line Dropout/Holdup ............................................................................................................................................... 18
4.6.5 AC Line Fuse ........................................................................................................................................................................ 19
4.6.6 AC Inrush............................................................................................................................................................................... 19
4.6.7 AC Line Transient Specification ................................................................................................................................... 19
4.6.8 Susceptibility Requirements ......................................................................................................................................... 20
4.6.9 Electrostatic Discharge Susceptibility ...................................................................................................................... 20
4.6.10 Fast Transient/Burst ....................................................................................................................................................... 20
4.6.11 Radiated Immunity.......................................................................................................................................................... 20
4.6.12 Surge Immunity ................................................................................................................................................................ 20
4.6.13 Voltage Interruptions ..................................................................................................................................................... 20
4.6.14 Protection Circuits ........................................................................................................................................................... 21
4.6.15 Over Current Protection (OCP) .................................................................................................................................. 21
4.6.16 Over Voltage Protection (OVP) .................................................................................................................................. 21
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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4.6.17 Over Temperature Protection (OTP) ........................................................................................................................ 21
4.7 Power Supply Status LED ...................................................................................................................................................... 21
5 Thermal Management ............................................................................................................................................. 23
5.1 Thermal Operation and Configuration Requirements ............................................................................................... 23
5.2 Thermal Management Overview ........................................................................................................................................ 23
5.3 Thermal Sensor Input for Fan Speed Control ................................................................................................................ 23
5.4 System Fans ................................................................................................................................................................................ 24
5.5 Fan Speed Control .................................................................................................................................................................... 26
5.6 Power Supply Module Fan ..................................................................................................................................................... 26
6 JBOD2000S3SP Internal Connection Overview ................................................................................................ 27
6.1 Expander Board ......................................................................................................................................................................... 27
6.1.1 JBOD SAS Expander Port Numbering ...................................................................................................................... 29
6.1.2 JBOD2312S3SP Interconnection ............................................................................................................................... 30
7 JBOD2000S3SP External SAS Connection Mode Overview ........................................................................... 31
7.1 External SAS Controller Support ........................................................................................................................................ 31
7.2 External SAS Cable .................................................................................................................................................................. 31
7.3 Hard Drive Type ......................................................................................................................................................................... 32
7.4 JBOD Cascade ............................................................................................................................................................................ 32
7.5 Single-port JBOD2000S3SP External Connection Mode ......................................................................................... 32
7.5.1 Single JBOD2000S3SP Connection .......................................................................................................................... 32
7.5.2 Two JBOD2000S3SP Cascade ..................................................................................................................................... 33
7.5.3 Dual-path Connection ..................................................................................................................................................... 34
7.5.4 Dual-path with Cascaded JBOD2000S3SP ............................................................................................................ 35
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List of Figures
Figure 1. 12 x 3.5” Drive JBOD2000S3 Product Drawing ....................................................................................2
Figure 2. Chassis Dimensions ................................................................................................................................3
Figure 3. System Components Overview..............................................................................................................5
Figure 4. 12 x 3.5" Drive JBOD2000S3SP Front View ..........................................................................................5
Figure 5. Front Panel Options ................................................................................................................................6
Figure 6. JBOD2312S3SP Back View ....................................................................................................................7
Figure 7. 3.5” Hard Drive Bay – 12-Drive Configuration ......................................................................................8
Figure 8. 3.5” Drive Tray Assembly .......................................................................................................................8
Figure 9. Status and Activity LED on 3.5” Drive Tray ...........................................................................................8
Figure 10. 3.5” Hot-Swap Backplane and Drive Bay Assembly ..........................................................................9
Figure 11. SFF-8482 Connector on 3.5” HSBP .....................................................................................................9
Figure 12. Components on 3.5” HSBP ................................................................................................................ 10
Figure 13. Power Supply Assembly .................................................................................................................... 11
Figure 14. Power Distribution Board (PDB) ........................................................................................................ 12
Figure 15. PDB Component Placement ............................................................................................................... 13
Figure 16. Fan Fault LED Block Diagram ............................................................................................................. 14
Figure 17. Power Supply Module Mechanical Drawing ..................................................................................... 15
Figure 18. Power Supply Module ........................................................................................................................ 15
Figure 19. AC Power Supply – Connector View .................................................................................................. 15
Figure 20. AC Power Cord .................................................................................................................................... 17
Figure 21. System Fan Identification .................................................................................................................. 24
Figure 22. System Fan Assembly ......................................................................................................................... 25
Figure 23. Internal SAS Expander Location ........................................................................................................ 28
Figure 24: SAS Expander Port Numbering ......................................................................................................... 29
Figure 25. 12x3.5” Single-port JBOD2000S3SP Interconnection Diagram..................................................... 30
Figure 26. SFF-8644 mini-SAS Cable .................................................................................................................. 31
Figure 27. Single JBOD2000S3SP Connection .................................................................................................. 32
Figure 28. Two Single-port JBOD2000S3SP Cascade ....................................................................................... 33
Figure 29. Two Groups of Cascaded Single-port JBOD2000S3SP ................................................................... 33
Figure 30. Dual-path Connection ........................................................................................................................ 34
Figure 31. Dual-path with Cascaded JBOD2000S3SP ....................................................................................... 35
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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List of Tables
Table 1. System Environmental Limits Summary ................................................................................................4
Table 2. Power LED Functional States ..................................................................................................................6
Table 3. System Status LED State Definitions ......................................................................................................6
Table 4. Status LED Status .....................................................................................................................................9
Table 5. Activity LED Status ...................................................................................................................................9
Table 6: Auto Power On Jumper Options ........................................................................................................... 13
Table 7. Power Supply Module Output Power Connector Pin-out ................................................................... 16
Table 8. Hot-swap Backplane Power Connector Pin-out (“HSBP PWR”) ......................................................... 17
Table 9. 460 Watt Power Supply Efficiency ....................................................................................................... 17
Table 10. AC Power Cord Specifications ............................................................................................................. 17
Table 11. Power Factor ......................................................................................................................................... 18
Table 12. AC Input Voltage Range ....................................................................................................................... 18
Table 13. AC Line Dropout/Holdup ..................................................................................................................... 18
Table 14. AC Line Sag Transient Performance ................................................................................................... 19
Table 15. AC Line Surge Transient Performance ................................................................................................ 19
Table 16. Performance Criteria............................................................................................................................ 20
Table 17. 460 Watt Power Supply Over Current Protection ............................................................................. 21
Table 18. Over Voltage Protection (OVP) Limits ................................................................................................ 21
Table 19. LED Indicators ...................................................................................................................................... 22
Table 20. System Fan Connector Pin-out ........................................................................................................... 25
Table 21: PWM Settings ....................................................................................................................................... 26
Table 22: Temperature Notification Thresholds ................................................................................................ 26
Table 23: External Cable List ............................................................................................................................... 36
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Intel® Storage Server System JBOD2312S3SP Hardware Guide
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1 Introduction
This Hardware Guide provides system-level information for the Intel® Storage System JBOD2312S3SP.
This document describes the functions and features of this JBOD product and includes the chassis layout,
system boards, power subsystem, cooling subsystem, storage subsystem options, and available installable
options.
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 –Product Family Overview
Chapter 3 – System Storage and Peripheral Drive Bay Overview
Chapter 4 – Power Subsystem
Chapter 5 – Thermal Management
Chapter 6 – JBOD2000S3SP Internal Connection Overview
Chapter 7 – JBOD2000S3SP External SAS Connection Mode Overview
Appendix A – Qualified External Mini-SAS Cable List
Reference Documents
1.1 Server Product Use Disclaimer
It is the responsibility of the system integrator who chooses not to use Intel-developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required
for their specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail to operate correctly when used outside any of their published operating or non-operating
limits.
1.2 Product Errata
The products described in this document may contain design defects or errors known as errata which may
®
cause the product to deviate from published specifications. Product Errata are documented in the Intel
Storage System JBOD2312S3SP Monthly Specification Update which can be downloaded from
http://www.Intel.com/support.
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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Figure 1. 12 x 3.5” Drive JBOD2000S3 Product Drawing
2 Product Family Overview
The Intel® Storage System JBOD2312S3SP offers the flexibility of adding additional storage to an existing
server system with support for 12Gb/s SAS or SATA hard disk drives or SSDs, redundant fan power and
power options, and SES communication with the server to monitor the health of the JBOD subsystems.
This chapter provides a high-level overview of the detail for each major system components and features
provided in the following sections.
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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Figure 2. Chassis Dimensions
2.1 Chassis Dimensions
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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Table 1. System Environmental Limits Summary
Parameter
Limits
1
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hrs per year.
Shipping
-40ºC to 70ºC (-40ºF to 158ºF)
Altitude
Operating
Support operation up to 3050m with ASHRAE class deratings.
50% to 90%, non-condensing with a maximum wet bulb of 28ºC (at temperatures from
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25g, velocity change is based on packaged weight
Product Weight: ≥ 40 to < 80
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
5 Hz to 500 Hz 1.09 g RMS random
Voltage
90 V AC to 132 V AC and 180 V AC to 264 V AC
Frequency
47 Hz to 63 Hz
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Nonoperating and
Unidirectional
AC Leads 2.0 kV
Air Discharged
12.0 kV
Contact Discharge
8.0 kV
Power in Watts
<300 W ≥300 W ≥600 W ≥1000 W
Servers/Rack
7.0 7.0 7.0 7.0
2.2 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Temperature
Humidity Shipping
Shock
Vibration
Operating
Packaged
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC
maximum rate of change not to exceed 10ºC per hour.
25ºC to 35ºC)
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
1
(50ºF to 95ºF) with the
AC-DC
operating
ESD
Acoustics Sound
Power Measured
Line to earth Only
Mount BA
I/O Leads 1.0 kV
DC Leads 0.5 kV
System 460W Redundant Power Supplies (CRPS) operate in spread-core flow conditions (positive pressure
to the power supply’s inlet) and incorporate a 40mm fan for its own thermal management. To ensure PS
thermal protection under all operating conditions the fan speed control has a closed loop algorithm based
on both the critical component temperature and the ambient temperature (inlet temperature). The PS over
Temperature Protection (OTP) protects against over temperature conditions created by the loss of fan
cooling or excessive ambient temperature. In an OTP condition the PS will shut down and restore power
1
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to
cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the
amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held respon sible if
components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.
Intel® Storage Server System JBOD2312S3SP Hardware Guide
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Figure 3. System Components Overview
Figure 4. 12 x 3.5" Drive JBOD2000S3SP Front View
when the temperature drops to within specified limits. The OTP trip level for inlet temperature is 65ºC with a
minimum of 4ºC margin to prevent on and off oscillation.
Disclaimer Note: Intel ensures the unpackaged JBOD system meets the shock requirement mentioned above
through its own chassis development and system configuration. It is the responsibility of the system
integrator to determine the proper shock level of the JBOD system if the system integrator chooses a different
system configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or
the system boards do not operate correctly when used outside any of its published operating or nonoperating limits.
2.3 System Features and Options Overview
2.3.1 Hot Swap Hard Drive Bay
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