Intel JBOD 2000 Hardware Manual
Revision 1.42
November 2015
Intel® Storage Server System JBOD
2000 Family
Hardware Guide
Revision History Intel® Storage Server System JBOD 2000 Family Hardware Guide
ii
Date
Revision
Number
Modifications
December 2012
0.9
Pre-production release.
March 2013
1.0
First release.
July 2013
1.05
Removed Chapter 9 and Appendix A.
September 2013
1.1
Restructured the document.
Added chapter for external connection mode.
November 2013
1.2
Removed JBOD2224S2SP( 2.5”, single port SKU) related content
March 2014
1.3
Removed original section 4.6.13 about power recovery
September 2014
1.4
Removed the description of SMBus connector on the HSBP, as they are not
used.
January 2015
1.41
Removed qualified mini-SAS cable list as many models have been EOL’ed by
vendors
November 2015
1.42
Removed PSU Cold Redundancy support
Added verbiage mentioning the spare PSU does not include a power
cord and added reference to the Config. Guide.
Revision History
Revision 1.42
Intel® Storage Server System JBOD 2000 Family Disclaimers
iii
Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly,
in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION
CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES,
SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH,
HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS'
FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL
INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR
NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF
THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not
rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves
these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this
information.
The products described in this document may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your
product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may
be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.
Revision 1.42
Table of Contents Intel® Storage Server System JBOD 2000 Family Hardware Guide
iv
Table of Contents
1. Introduction ........................................................................................................................ 1
1.1 Server Product Use Disclaimer .............................................................................. 1
1.2 Product Errata ........................................................................................................ 1
2. Product Family Overview ................................................................................................... 2
2.1 Chassis Dimensions ............................................................................................... 4
2.2 System Level Environmental Limits ........................................................................ 5
2.3 System Features and Options Overview ................................................................ 7
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options ............................................... 7
2.3.2 Front Panel Options ............................................................................................... 8
2.3.3 Back Panel Features ............................................................................................ 10
3. System Storage and Peripheral Drive Bays Overview ................................................... 11
3.1 2.5” Hard Disk Drive Support ................................................................................ 11
3.1.1 2.5” Drive Hot-Swap Backplane Overview ............................................................ 13
3.1.2 Cypress* CY8C22545 Enclosure Management Controller .................................... 14
3.2 3.5” Hard Disk Drive Support ................................................................................ 15
3.2.1 3.5” Drive Hot-Swap Backplane Overview ............................................................ 16
3.2.2 Cypress* CY8C22545 Enclosure Management Controller .................................... 17
4. Power Subsystem ............................................................................................................. 18
4.1 Power Distribution Board (PDB) ........................................................................... 19
4.2 Mechanical Overview ........................................................................................... 23
4.3 Power Connectors ................................................................................................ 24
4.3.1 Power Supply Module Card Edge Connector ....................................................... 24
4.3.2 Hot-Swap Backplane Power Connector................................................................ 25
4.4 Power Supply Module Efficiency .......................................................................... 25
4.5 AC Power Cord Specification Requirements ........................................................ 25
4.6 AC Input Specifications ........................................................................................ 26
4.6.1 Power Factor ........................................................................................................ 26
4.6.2 AC Input Voltage Specification ............................................................................. 26
4.6.3 AC Line Isolation Requirements ........................................................................... 26
4.6.4 AC Line Dropout/Holdup ...................................................................................... 26
4.6.5 AC Line Fuse ....................................................................................................... 27
4.6.6 AC Inrush ............................................................................................................. 27
4.6.7 AC Line Transient Specification ........................................................................... 27
4.6.8 Susceptibility Requirements ................................................................................. 28
4.6.9 Electrostatic Discharge Susceptibility ................................................................... 28
4.6.10 Fast Transient/Burst ............................................................................................. 28
4.6.11 Radiated Immunity ............................................................................................... 28
4.6.12 Surge Immunity .................................................................................................... 28
4.6.13 Voltage Interruptions ............................................................................................ 29
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Intel® Storage Server System JBOD 2000 Family Hardware Guide Table of Contents
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4.6.14 Protection Circuits ................................................................................................ 29
4.6.15 Over Current Protection (OCP) ............................................................................ 29
4.6.16 Over Voltage Protection (OVP) ............................................................................ 29
4.6.17 Over Temperature Protection (OTP) .................................................................... 30
4.7 Power Supply Status LED .................................................................................... 31
5. Thermal Management ....................................................................................................... 32
5.1 Thermal Operation and Configuration Requirements ............................................ 32
5.2 Thermal Management Overview .......................................................................... 32
5.3 Thermal Sensor Input for Fan Speed Control ....................................................... 33
5.4 System Fans ........................................................................................................ 33
5.5 Power Supply Module Fan ................................................................................... 34
6. JBOD 2000 Internal Connection Overview ...................................................................... 35
6.1 Expander Board ................................................................................................... 35
6.2 JBOD SAS Interface Board .................................................................................. 37
6.2.1 JBOD SAS Interface Board Port Numbering ........................................................ 37
6.3 Pin-outs ................................................................................................................ 38
6.3.1 JBOD2312S2SP Interconnection ......................................................................... 39
6.3.2 JBOD2224S2DP Interconnection ......................................................................... 42
7. JBOD 2000 External SAS Connection Mode Overview .................................................. 45
7.1 External SAS Controller Support .......................................................................... 45
7.2 External SAS Cable.............................................................................................. 45
7.3 Hard Drive Type ................................................................................................... 46
7.4 JBOD Cascade .................................................................................................... 46
7.5 Single-port JBOD 2000 External Connection Mode .............................................. 46
7.5.1 Single JBOD 2000 Connection ............................................................................. 46
7.5.2 Two JBOD 2000 Cascade .................................................................................... 47
7.5.3 Dual-path Connection ........................................................................................... 48
7.5.4 Dual-path with Cascaded JBOD 2000 .................................................................. 48
7.6 Dual-port JBOD 2000 External Connection Mode ................................................ 49
7.6.1 Dual-domain SAS for Dual-port JBOD 2000 ......................................................... 49
7.6.2 Dual-domain SAS for Cascaded Dual-port JBOD 2000 ........................................ 50
7.6.3 Dual-domain SAS for Two-node Cluster ............................................................... 51
Reference Documents ............................................................................................................ 53
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List of Figures Intel® Storage Server System JBOD 2000 Family Hardware Guide
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List of Figures
Figure 1. 24 x 2.5” Drive JBOD 2000 Product Drawing ............................................................... 2
Figure 2. 12 x 3.5” Drive JBOD 2000 Product Drawing ............................................................... 3
Figure 3. Chassis Dimensions ..................................................................................................... 4
Figure 4. System Components Overview .................................................................................... 7
Figure 5. 12 x 3.5" Drive JBOD2000 Front View ......................................................................... 7
Figure 6. 24 x 2.5" Drive JBOD2000 Front View ......................................................................... 7
Figure 7. Front Panel Options ..................................................................................................... 8
Figure 8. Single-port Backplane JBOD2000 Back View ............................................................ 10
Figure 9. Dual-port Backplane JBOD2000 Back View ............................................................... 10
Figure 10. 2.5" Hard Drive Bay – 24-Drive Configuration .......................................................... 11
Figure 11. 2.5” Drive Tray Assembly ......................................................................................... 11
Figure 12. Status and Activity LED on 2.5” Drive Tray ............................................................... 12
Figure 13. 2.5” Hot-Swap Backplane and Drive Bay Assembly ................................................. 13
Figure 14. SFF-8482 Connector on HSBP ................................................................................ 13
Figure 15. Components on dual port 2.5” HSBP ....................................................................... 14
Figure 16. 3.5” Hard Drive Bay – 12-Drive Configuration .......................................................... 15
Figure 17. 3.5” Drive Tray Assembly ......................................................................................... 15
Figure 18. Status and Activity LED on 3.5” Drive Tray ............................................................... 15
Figure 19. 3.5” Hot-Swap Backplane and Drive Bay Assembly ................................................. 16
Figure 20. SFF-8482 Connector on 3.5” HSBP ......................................................................... 16
Figure 21. Components on 3.5” HSBP ...................................................................................... 17
Figure 22. Power Supply Assembly ........................................................................................... 18
Figure 23. Power Distribution Board (PDB) ............................................................................... 19
Figure 24. PDB Component Placement .................................................................................... 20
Figure 25. Fan Fault LED Block Diagram .................................................................................. 22
Figure 26. Power Supply Module Mechanical Drawing .............................................................. 23
Figure 27. Power Supply Module .............................................................................................. 23
Figure 28. AC Power Supply – Connector View ........................................................................ 23
Figure 29. AC Power Cord ........................................................................................................ 25
Figure 30. System Fan Identification ......................................................................................... 33
Figure 31. System Fan Assembly.............................................................................................. 34
Figure 32. Internal SAS Expander Location .............................................................................. 36
Figure 33. JBOD 2000 SAS Interface Board Port Number ........................................................ 37
Figure 34. 12x3.5” Single-port JBOD 2000 Interconnection Diagram ........................................ 39
Figure 35. Primary SAS Expander ............................................................................................ 40
Figure 36. 2U 24x2.5” Dual-port JBOD2000 Interconnection Diagram ...................................... 42
Figure 37. Secondary SAS Expander ........................................................................................ 44
Figure 38. SFF-8088 mini-SAS Cable ....................................................................................... 45
Figure 39. Single JBOD 2000 Connection ................................................................................. 46
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Figure 40. Two Single-port JBOD 2000 Cascade ...................................................................... 47
Figure 41. Two Groups of Cascaded Single-port JBOD 2000 ................................................... 47
Figure 42. Dual-path Connection .............................................................................................. 48
Figure 43. Dual-path with Cascaded JBOD 2000 ...................................................................... 48
Figure 44. Dual-domain SAS for Dual-port JBOD 2000 ............................................................. 49
Figure 45. Two SAS Controllers Dual-domain SAS Connection ................................................ 50
Figure 46. Dual-domain SAS for Cascaded Dual-port JBOD 2000 ............................................ 50
Figure 47. Dual-domain SAS for a Two-node Cluster ................................................................ 51
Figure 48. Cascaded JBOD 2000 for a Two-node Cluster ......................................................... 52
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List of Tables Intel® Storage Server System JBOD 2000 Family Hardware Guide
viii
List of Tables
Table 1. System Feature Set ....................................................................................................... 2
Table 2. System Environmental Limits Summary ........................................................................ 5
Table 3. Power LED Functional States ........................................................................................ 8
Table 4. System Status LED State Definitions............................................................................. 8
Table 5. Drive Status LED States .............................................................................................. 12
Table 6. Drive Activity LED States............................................................................................. 12
Table 7. Status LED Status ....................................................................................................... 15
Table 8. Activity LED Status ...................................................................................................... 16
Table 9. Power Supply Module Output Power Connector Pin-out ............................................. 24
Table 10. Hot-swap Backplane Power Connector Pin-out (“HSBP PWR”) ................................. 25
Table 11. 460 Watt Power Supply Efficiency (Gold) .................................................................. 25
Table 12. AC Power Cord Specifications................................................................................... 25
Table 13. Power Factor ............................................................................................................. 26
Table 14. AC Input Voltage Range ............................................................................................ 26
Table 15. AC Line Dropout/Holdup ............................................................................................ 27
Table 16. AC Line Sag Transient Performance ......................................................................... 27
Table 17. AC Line Surge Transient Performance ...................................................................... 28
Table 18. Performance Criteria ................................................................................................. 28
Table 19. 460 Watt Power Supply Over Current Protection ....................................................... 29
Table 20. Over Voltage Protection (OVP) Limits ....................................................................... 30
Table 21. LED Indicators ........................................................................................................... 31
Table 22. System Fan Connector Pin-out .................................................................................. 34
Table 23. SGPIO Headers Pin-out ............................................................................................ 38
Table 24. 12x3.5” Single-port JBOD 2000 Internal Components ............................................... 40
Table 25. Primary SAS Expander in 12x3.5” Single-port JBOD 2000 Connector Mapping ........ 41
Table 26. 2U 24x2.5” Dual-port JBOD2000 Components .......................................................... 43
Table 27. Primary SAS Expander in 24x2.5” Dual-port JBOD 2000 Connector Mapping ........... 44
Table 28. Second SAS Expander in 24x2.5” Dual-port JBOD 2000 Connector Mapping ........... 44
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Intel® Storage Server System JBOD 2000 Family Hardware Guide Introduction
1
1. Introduction
This Hardware Guide provides system-level information for the Intel® Storage Server System
JBOD 2000 Family.
This document describes the functions and features of JBOD product that includes the chassis
layout, system boards, power subsystem, cooling subsystem, storage subsystem options, and
available installable options.
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Product Family Overview
Chapter 3 – System Storage and Peripheral Drive Bays Overview
Chapter 4 – Power Subsystem
Chapter 5 – Thermal Management
Chapter 6 – JBOD 2000 Internal Connection Overview
Chapter 7 – JBOD 2000 External SAS Connection Mode Overview
Appendix A – Qualified External Mini-SAS Cable List
Reference Documents
1.1 Server Product Use Disclaimer
It is the responsibility of the system integrator who chooses not to use Intel-developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail to operate correctly when used outside any of
their published operating or non-operating limits.
1.2 Product Errata
The products described in this document may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Product Errata are
documented in the Intel® Storage Server System JBOD 2000 Family Monthly Specification
Update which can be downloaded from http://www.Intel.com.
Revision 1.42
Product Family Overview Intel® Storage Server System JBOD 2000 Family Hardware Guide
2
Intel® Storage Server System JBOD
2000 Family
Description
JBOD2224S2DP
2U JBOD supports 24 x 2.5” drives, with a dual-port backplane.
JBOD2312S2SP
2U JBOD supports 12 x 3.5” drives, with a single-port backplane.
2. Product Family Overview
This generation of Intel® Storage Server System JBOD 2000 Family offers a variety of options to
meet the configuration requirements of high-density high-performance computing environments.
The Intel® Storage Server System JBOD 2000 Family is comprised of three product offerings.
Note: The following table lists features common to the Intel® Storage Server System JBOD 2000
Family. Features that are unique to one product in the family are identified by denoting the full
JBOD Product Code name.
Table 1. System Feature Set
This chapter provides a high-level overview of the Intel® Storage Server System JBOD 2000
Family features and available options as supported in different JBOD SKUs. Greater detail for
each major system component or feature is provided in the following chapters.
Figure 1. 24 x 2.5” Drive JBOD 2000 Product Drawing
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Intel® Storage Server System JBOD 2000 Family Hardware Guide Product Family Overview
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Figure 2. 12 x 3.5” Drive JBOD 2000 Product Drawing
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Product Family Overview Intel® Storage Server System JBOD 2000 Family Hardware Guide
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2.1 Chassis Dimensions
Figure 3. Chassis Dimensions
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Intel® Storage Server System JBOD 2000 Family Hardware Guide Product Family Overview
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Parameter
Limits
Temperature
Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to 35ºC 1 (50ºF to 95ºF) with
the maximum rate of change not to exceed 10ºC per hour.
ASHRAE Class A3 – Includes operation up to 40ºC for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45ºC for up to 90 hrs per year.
Shipping
-40ºC to 70ºC (-40ºF to 158ºF)
Altitude
Operating
Support operation up to 3050m with ASHRAE class deratings.
Humidity
Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28ºC (at
temperatures from 25ºC to 35ºC)
Shock
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25g, velocity change is based on packaged weight
Packaged
Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage
90 V AC to 132 V AC and 180 V AC to 264 V AC
Frequency
47 Hz to 63 Hz
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Nonoperating and
operating
Unidirectional
2.2 System Level Environmental Limits
To keep the system operating within supported maximum thermal limits, the system must meet
the following operating and configuration guidelines:
The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE
Class A2) with short-term excursion-based operation up to 45ºC (ASHRAE Class A4).
- The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per
year.
- The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per year.
- When operating within the extended operating temperature range, the system
performance may be impacted.
- There is no system reliability impact when operating at the extended temperature
range within the approved limits.
The following table defines the system level operating and non-operating environmental limits.
Table 2. System Environmental Limits Summary
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Product Family Overview Intel® Storage Server System JBOD 2000 Family Hardware Guide
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Parameter
Limits
Line to earth
Only
AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
ESD
Air Discharged
12.0 kV
Contact
Discharge
8.0 kV
Acoustics
Sound Power
Measured
Power in Watts
<300 W ≥300 W ≥600 W ≥1000 W
Servers/Rack
Mount BA
7.0 7.0 7.0 7.0
Note:
1.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel ensures through its own chassis development and testing that
when Intel server building blocks are used together, the fully integrated system will meet the intended
thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
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Intel® Storage Server System JBOD 2000 Family Hardware Guide Product Family Overview
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2.3 System Features and Options Overview
Figure 4. System Components Overview
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options
Figure 5. 12 x 3.5" Drive JBOD2000 Front View
Figure 6. 24 x 2.5" Drive JBOD2000 Front View
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Product Family Overview Intel® Storage Server System JBOD 2000 Family Hardware Guide
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Label
Description
A
Power Button w/Integrated LED
B
System Status LED
State
Power Mode
LED
Description
Power-off
Non-ACPI
Off
System power is off.
Power-on
Non-ACPI
On
System power is on.
Color
State
Criticality
Description
Off
System is not
operating
Not ready
The system is powered off (AC and/or DC).
Green
Solid on
Ok
Indicates that the system status is “healthy”. The system is not
exhibiting any errors. AC power is present and the system is
either in a standby state or has been powered on.
2.3.2 Front Panel Options
Figure 7. Front Panel Options
The Power Button toggles the system power on and off. Pressing this button sends a signal to
the integrated PDB board, which either powers on or powers off the system. The integrated LED
is a single-color (Green) indicator that supports different states as defined in the following table.
Table 3. Power LED Functional States
The System Status LED is a bi-color (Green/Amber) indicator that shows the current health of
the server system. The system provides two locations for this feature: one is located on the
Front Control Panel, and the other is located on the back edge of the server board, viewable
from the back of the system. Both LEDs are tied together and show the same state. The System
Status LED states are driven by the on-board platform management subsystem. The following
table provides a description of each supported LED state.
Table 4. System Status LED State Definitions
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Color
State
Criticality
Description
Amber
Solid on
SMBUS Alert
Event
Encountered
P12V is out of its limits.
P5V is out of its limits.
A fan fault has been detected.
An over temperature event has been detected.
P3V3 is out of its limits.
Remote 1 and/or Remote 2 temperature sensor is either
open or shorted.
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