Intel EUROCOM 450 User Manual

Intel

Core 2 Duo based CPU Board

hardware documentation

Revision 0A

Revision

Revision Changes Date / Name

0A First Edition 30.10.07 / ac

DISCLAIMER

© 2007 ELTEC Elektronik AG. The information, data, and figures in this document including respective references have been verified and found to be legitimate. In particular in the event of error they may, therefore, be changed at any time without prior notice. The complete risk inherent in the utilization of this document or in the results of its utilization shall be with the user; to this end, ELTEC Elektronik AG shall not accept any liability. Regardless of the applicability of respective copyrights, no portion of this document shall be copied, forwarded or stored in a data reception system or entered into such systems without the express prior written consent of ELTEC Elektronik AG, regardless of how such acts are performed and what system is used (electronic, mechanic, photocopying, recording, etc.). All product and company names are registered trademarks of the respective companies. Our General Business, Delivery, Offer, and Payment Terms and Conditions shall otherwise apply.

Federal communications commission statement

Þ This device complies with FCC Rules Part 15. Operation is subject to the following two conditions: Þ This device may not cause harmful interference, and Þ This device must accept any interference received including interference that may cause undesired operation. Þ This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15

of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with manufacturer’s instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try correct the interference by one or more of the following measures:

Þ Reorient or relocate the receiving antenna. Þ Increase the separation between the equipment and receiver. Þ Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. Þ Consult the dealer or an experienced radio/TV technician for help. Þ The us of shielded cables for connection of the monitor to the graphics card is required to assure compliance with

FCC regulations. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

Canadian department of communications statement

Þ This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in

the Radio Interference Regulations of the Canadian Department of Communications.

Þ This class B digital apparatus complies with Canadian ICES-003

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SAFETY INFORMATION

Electrical safety

Þ To prevent electrical shock hazard, disconnect the power cable from the electrical outlet before reloading the

system.

Þ When adding or removing devices to or from the system, ensure that the power cables for the devices are

unplugged before the signal cables are connected. If possible, disconnect all power cables from the existing system before you add device.

Þ Before connecting or removing signals cables from motherboard, ensure that all power cables are unplugged. Þ Make sure that your power supply is set to the correct voltage in your area. If you are not sure about the voltage of

the electrical outlet you are using, contact your local power company.

Þ If the power supply is broken, do not try to fix it by yourself. Contact a qualified service technician or your retailer.

Operation safety

Þ Before installing the motherboard and adding devices on it, carefully read the manuals that came with the

package.

Þ Before using the product, make sure all cables are correctly connected and the power cables are not damaged. If

you detect any damage, contact your dealer immediately.

Þ To avoid short circuits, keep paper clips, screws, and staples away from connectors, slots sockets and circuitry. Þ Avoid dust, humidity, and temperature extremes. Do not place the product in any area where it may become wet. Þ Place the product on a stable surface. Þ If you encounter technical problems with the product, contact a qualified service technician or your retailer.

EMC Rules

This unit has to be installed in a shielded housing. If not installed in a properly shielded enclosure, and used in accordance with the instruction manual, this product may cause radio interference in which case the user may be required to take adequate measures at his or her own expense

IMPROTANT INFORMATION

This product is not an end user product. It was developed and manufactured for further processing by trained personnel.

RECYCLING

Please recycle packaging environmentally friendly: Packaging materials are recyclable. Please do not dispose packaging into domestic waste but recycle it.

Please recycle old or redundant devices environmentally friendly: Old devices contain valuable recyclable materials that should be reutilized. Therefore please dispose

.... old devices at collection points which are suitable.

hardware documentation

table of contents

1. Specification .......................................................................................................1

1.1. Blockdiagram....................................................................................................................1

1.2. Main Features ...................................................................................................................2

1.3. Overview........................................................................................................................... 3

1.3.1. Technical Details..................................................................................................................................... 3

1.3.1.1. CPU ..........................................................................................................................................3

1.3.1.2. Memory Configuration............................................................................................................... 3

1.3.1.3. Chip Set .................................................................................................................................... 3

1.3.1.4. Graphics Interface ..................................................................................................................... 4

1.3.1.5. Boot PROM ...............................................................................................................................4

1.3.1.6. Ethernet Interfaces.................................................................................................................... 4

1.3.1.7. COM Express Interface...............................................................................................................4

1.3.1.8. Timer ........................................................................................................................................ 4

1.3.1.9. Operating Systems .................................................................................................................... 4

1.3.1.10. Miscellaneous ........................................................................................................................... 4

1.3.1.11. Industry-grade Case .................................................................................................................. 4

1.4. Installation ....................................................................................................................... 5

1.4.1. Introduction ........................................................................................................................................... 5

1.4.2. DIMM Installation ................................................................................................................................... 5

1.4.3. Board Installation................................................................................................................................... 5

1.5. Cooling Requirements .......................................................................................................6

1.6. Testing the Installation ...................................................................................................... 6

2. BIOS Setup ........................................................................................................ 6

2.1.1. Power On Self Test..................................................................................................................................6

2.2. Intel Boot Agent / PXE ....................................................................................................... 8

2.2.1. Boot Agent Setup.................................................................................................................................... 8

2.2.2. Setup Screen options ..............................................................................................................................8

2.2.3. Diagnostics Information........................................................................................................................ 10

3. Interface Connectors .........................................................................................11

3.1. COMExpress Connector .....................................................................................................11

4. Board Parameters.............................................................................................. 13

4.1. Host Bus ..........................................................................................................................13

hardware documentation

4.2. COM Express ....................................................................................................................13

4.3. Memory ...........................................................................................................................13

4.4. PCI Local Bus ...................................................................................................................13

4.5. Network ...........................................................................................................................13

4.6. USB .................................................................................................................................13

4.7. Video I/O .........................................................................................................................13

4.8. MTBF Values ................................................................................................................... 14

4.9. Environmental Conditions................................................................................................ 14

5. Programmers Reference..................................................................................... 15

5.1. Interrupts.........................................................................................................................15

hardware documentation

list of table

Table 3.1: COMExpress Connector ................................................................................................................................11

Table 4.1: Resolution Table..........................................................................................................................................14

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