Award is a registered trademark of Award Software International,
Inc.
PS/2 is a trademark of International Business Machines
Corporation.
Intel and Celeron are registered trademarks of Intel Corporation.
Microsoft Windows is a registered trademark of Microsoft
Corporation.
Winbond is a registered trademark of Winbond Electronics
Corporation.
All other product names or trademarks are properties of their
respective owners.
Attention:
Before installing the CPU heat sink, remove the two protective
sheaths as shown in the figure below.
The ET900 board incorporates the Mobile Intel
Chipset for Embedded Computing, consisting of the Intel
Graphic Memory Controller Hub (GMCH) and Intel
Hub 7-M (ICH7-M), an optimized integrated graphics solution with a
533MHz and 667MHz front-side bus. Dimensions of the board are
95mm x 125mm.
The integrated powerful 3D graphics engine, based on Intel® Graphics
Media Accelerator 950 (Intel
®
GMA 950) architecture, operates at core
speeds of up to 400 MHz. It features a low-power design and is validated
with the Intel® Core Duo/Solo on 65nm process. With DDR2 667MHz
SO-DIMM socket on board, the board supports up to 2GB of DDR2
system memory.
®
Graphics Media Accelerator 950 supports a unique intelligent
Intel
memory management scheme called Dynamic Video Memory
Technology (DVMT). DVMT handles diverse applications by providi ng
the maximum (224MB) availability of system memory for general
computer usage, while supplying additional graphics memory when a
3D-intensive application requests it. The Intel GMA 950 graphics
architecture also takes advantage of the high-performance Intel
processor. Intel GMA 950 graphics supports Dual Independent Display
technology.
The main features of the board are:
Supports COM ETX Type II Module pin-out definitions
Supports Intel
®
CoreTM Duo/Solo processors
Supports up to 533/667MHz FSB
One DDR2 SDRAM SO-DIMM, Max. 2GB
Intel
Intel
®
945GM Express VGA for CRT / LVDS
®
945GM Integrated VGA; Supports CRT / LVDS
Supports up to six x1 PCI-E, one x16 PCI-E, four PCI
®
945GM Express
®
®
945GM
I/O Controller
ET900 User’s Manual 1
INTRODUCTION
Checklist
Your ET900 package should include the items listed below.
• The ET900 CPU Module
• This User’s Manual
• 1 CD containing the following:
• Chipset Drivers
• Flash Memory Utility
2
ET900 User’s Manual
ET900 Specifications
Form Factor
CPU Type
CPU Voltage
System Speed
CPU Operate
Frequency
Cache
Green /APM
CPU Socket
Chipset
BIOS
Memory
VGA
LVDS
TV-Out
LAN
USB 2.0
Serial ATA Ports
Parallel IDE
Audio
Connector to
Carrier Board
Watchdog Timer
System Voltage
Other
Board Size
COM-ETX w/ Pin-Out Type 2
Intel Core Duo/Solo Mobile Processors
0.700V ~ 1.5V
Up to 1.66GHz or above
533MHz/667MHz FSB
2MB
APM1.2
BGA CPU on board / mPGA 478MT Socket
Intel 945GM Chipset
GMCH: 82945GM 1466-pin FCBGA
ICH7M: 82801GBM 652-pin mBGA FWH
Award BIOS, support ACPI Function
DDR2 667/533 SO-DIMM x1 (w/o ECC
function), Max. 2GB
945GM built-in, supports CRT/S-VIDEO
945GM built-in, supports 18+18 bits, single or
dual channel LVDS
Support TV-Out (Composite) and S-Video
ICH7M built-in 10/100BT MAC + Intel
EP82562ETPHY
ICH7M built-in USB 2.0 host controller, support
8 ports
ICH7M built-in SATA controller, supports 2
ports
ICH7M built-in one channel Ultra DMA
33/66/100
ICH7M Built-in Audio controller (AC97 Codec
at carrier board)
Two 220-pin connectors (A-B & C-D)
Yes (256 segments, 0, 1, 2…255 sec/min)
+5V, +3.3V, +12V, 5VSB
Modem Wakeup, LAN Wakeup
95mm x 125mm
INTRODUCTION
ET900 User’s Manual 3
INTRODUCTION
Dimensions
4
ET900 User’s Manual
INTRODUCTION
Installing the Processor
The ET900 is available with a processor socket on board or with an
Intel® processor on board. In the case that your ET900 comes a Socket
479 processor socket for Intel
follow the instructions below regarding the processor installation.
The processor socket comes with a screw to secure the processor. As
shown in the left picture below, loosen the screw first before inserting
the processor. Place the processor into the socket by making sure the
notch on the corner of the processor corresponds with the notch on the
inside of the socket. Once the processor has slide into the socket, fasten
the screw. Refer to the figures below.
®
Pentium® M or Celeron® M processors,
NOTE:
Ensure that the CPU heat sink and the CPU top surface are in
total contact to avoid CPU overheating problem that would
cause your system to hang or be unstable.
ET900 User’s Manual 5
INTRODUCTION
Installing the Memory
The ET900 COM Express CPU module accommodates 200-pin
DDR2-533 and DDR2-667 SODIMM memory modules with capacities
up to 1GB. Non-ECC is supported.
Installing and Removing Memory Modules
To install the DDR2 modules, locate the memory slot on the board and
perform the following steps:
1. Hold the DDR2 module so that the key of the DDR2 module align
with those on the memory slot. Insert the module into the socket at a
slight angle (approximately 30 degrees). Note that the socket and
module are both keyed, which means that the modul e can be i nstal l ed
only in one direction.
2. To seat the memory module into the socket, apply firm and even
pressure to each end of the module until you feel it slip down into the
socket.
3. With the module properly seated in the socket, rotate the module
downward. Continue pressing downward until the clips at each end
lock into position.
4. To remove the DDR2 module, press the clips with both hands.
6
ET900 User’s Manual
INTRODUCTION
Connectors on ET900
J2, J3: COM Express Type 2 Connectors
The Type 2 connectors come in two 220-pin 0.5mm pitch receptacles.
They include PCI, IDE, GBE and up to 22 general-purpose PCIE lanes
(PCIE 0-5 and PCIE 16-31). For most Type 2 implementations, it is
expected that PCIE lanes 16-31 are used for graphics. Hence they are
designated PEG lanes 0-15 in the following table. Modules
implementing Pin out Type 2, such as the ET900, uses the pin-out
shown.
This chapter describes the different settings available in the Award
BIOS that comes with the board. The topics covered in this chapter are
as follows: