Intel® E8500 Chipset North
Bridge (NB) and eXternal Memory
Bridge (XMB)
Thermal/Mechanical Design Guide
March 2005
Document Number 306749-001
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PRO PERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEV ER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING T O FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PA TENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, critical control or safety systems, or in nuclear
facility applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “un defined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
®
The Intel
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Xeon, Intel NetBurst, Intel SpeedStep, Intel Extended Memory 64 Technology and the Intel logo are trademarks or registered
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory5
Bridge (XMB) Thermal/Mechanical Design Guide
Revision History
Document
Number
306749001• Initial release of this documentMarch 2005
Revision
Number
NOTE: Not all revisions may be published.
DescriptionDate
§
6Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
1Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to
improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel
chipset North Bridge (NB) component and the Intel
(XMB) component.
• Describe two reference thermal solutions that meet the specification of the E8500 chipset NB
component.
• Describe a reference thermal solution that meets the specification of the E8500 chipset XMB
component.
Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die
temperatures at or below thermal specifications. This is accomplished by providing a low localambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient
thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified
limits, a system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.
®
®
E8500 chipset eXternal Memory Bridge
E8500
The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling
is required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.
This document addresses thermal design and specifications for the E8500 chipset NB and XMB
components only. For thermal design information on other chipset components, refer to the
respective component datasheet. For the Intel
®
Intel
6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the
®
Intel
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
1.1Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided to the
system designer. Figure 1-1 illustrates the design process impl icit to this document and the tools
appropriate for each step.
®
6700PXH 64-bit PCI Hub, refer to the
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory7
Bridge (XMB) Thermal/Mechanical Design Guide
Introduction
Figure 1-1. Thermal Design Process
1.2Definition of Terms
BGABall grid array. A package type, defined by a resin-fiber substrate, onto which a
die is mounted, bonded and encapsulated in molding compound. The primary
electrical interface is an array of solder balls attached to the substrate opposite
the die and molding compound.
001239
BLTBond line thickness. Final settled thickness of the thermal interface material
after installation of heatsink.
ICH5I/O controller hub. The chipset component that contains the primary PCI
interface, LPC interface, USB, S-ATA, and other legacy functions.
IHSIntegrated Heat Spreader, Integral part of the NB package. It enhances
dissipation of heat generated by the NB die and provides interface surface
between NB die and cooling solution.
IMIIndependent memory Interfaces. Port connecting the NB to the XMB
Intel® 6700PXH
64-bit PCI Hub
The chipset component that performs PCI bridging functions between the PCI
Express* interface and the PCI Bus. It contains two PCI bus interfaces that can
be independently configured to operate in PCI (33 or 66 MHz) or PCI-X*
mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.
T
case_max
Maximum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.
T
case_min
Minimum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.
TDPThermal design power. Thermal solutions should be designed to dissipate this
target power level. TDP is not the maximum power that the chipset can
dissipate.
TIMThermal interface material. Thermally conductive material installed between
two surfaces to improve heat transfer and reduce interface contact resistance.
NBIntel
®
E8500 chipset North Bridge Component. The chipset component that
provides the interconnect to the processors, XMBs and various I/O components.
8Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
XMB Intel® E8500 chipset eXternal Memory Bridge Component. The chipset
component that bridges the IMI and DDR interfaces.
1.3Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
®
• Intel
• Intel
• Intel
• Intel
• Intel
• Intel
• Intel
• Intel
• 64-bit Intel
• 64-bit Intel
• 64-bit Intel
• 64-bit Intel
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide
®
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
®
Xeon™ Processor MP with up to 8MB L3 Cache Thermal/Mechanical Design
Guidelines
®
Xeon™ Processor MP with 1MB L2 Cache Datasheet
®
Xeon™ Processor MP with 1MB L2 Cache Thermal/Mechanical Design
Guidelines
Introduction
• BGA/OLGA Assembly Development Guide
• Various system thermal design suggestions (http://www.formfactors.org)
Note:Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
§
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory9
Bridge (XMB) Thermal/Mechanical Design Guide
Introduction
10Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
2Packaging Technology
0.20 –C–
IHS
Substrate
0.435 ± 0.025 mm
See Note 3
Seating Plane
2.44 ± 0.071 mm
See Note 1
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
0.20
See Note 4
3.79 ± 0.144 mm
4.23 ± 0.146 mm
The E8500 chipsets consist of four individual components: the NB, the XMB, the Intel® 6700PXH
64-bit PCI Hub and the I/O controller hub (ICH5r). The E8500 chipset NB component use a
42.5 mm sq uared , 12-lay er flip chip ball gri d array (FC-BGA) package (see Figure 2-1 through
Figure 2-3). The E8500 chipset XMB component uses a 37.5mm squared, 10-layer FB-BGA
package (see Figure 2-4 through Figure 2-6). For information on the Intel 6700PXH 64-bit PCI
Hub package, refer to the Intel
information on the ICH5 package, refer to the Intel
®
82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.
Intel
Figure 2-1. NB Package Dimensions (Top View)
Han d lin g
Exclusion
Area
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide. For
®
82801EB I/O Controller Hub 5 (ICH5) and
38.5 mm
NB
TNB
IHS
IHS
42.5 mm38.5 mm
42.5 mm
Figure 2-2. NB Package Dimensions (Side View)
Intel® 8500 Chipset North Bridge (NB) and eXternal Memory11
Bridge (XMB) Thermal/Mechanical Design Guide
Packaging Technology
Figure 2-3. NB Package Dimensions (Bottom View)
AV
A
U
AT
A
R
AP
A
N
AM
AL
AK
AJ
A
H
AG
AF
AE
A
A
D
C
AB
AA
Y
W
V
U
T
R
P
N
M
20.202
37X 1.092
L
K
J
H
G
F
E
D
C
B
A
11252321191715139753127 293733 3531
37X 1.092
2822262420181614121086423634323038
42.5 + 0.05
A
20.202
42.5 + 0.05
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
CA0.2
B
12Intel® 8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Figure 2-4. XMB Package Dimensions (Top View)
Notes:
1. Primary datum -C- and seat ing plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) or ientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
0.20
–C–
Die
Substrate
0.435 ± 0.025 mm
See Note 3
Seating Plane
2.100 ± 0.121 mm
See Note 1
Decoup
Cap
0.7 mm Max
2.535 ± 0.123 mm
0.84 ± 0.05 mm
0.20
See Note 4
Handling
Exclusion
Area
8.88mm.
14.02mm.
Packaging Tech no lo gy
Die
Keepout
Area
6.65mm.11.73mm.
XMB
Die
23.50mm.
27.50mm.
37.50mm.
Figure 2-5. XMB Package Dimensions (Side View)
37.50mm.27.50mm.23.50mm.
Intel® 8500 Chipset North Bridge (NB) and eXternal Memory13
Bridge (XMB) Thermal/Mechanical Design Guide
Packaging Technology
0
Figure 2-6. XMB Package Dimensions (Bottom View)
AV
A
U
AT
A
R
AP
A
N
AM
AL
AK
AJ
A
H
AG
AF
AE
A
A
D
C
AB
AA
Y
W
V
U
T
R
P
N
M
20.202
37X 1.092
L
K
J
H
G
F
E
D
C
B
A
37X 1.092
11252321191715139753127 293733 3531
2822262420181614121086423634323038
42.5 + 0.
A
20.202
42.5 + 0.05
CA0.2
2.1Package Mechanical Requirements
The E8500 chipset NB package has an IHS and the XMB package has an exposed bare die which is
capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of
sustaining a dynamic or static compressive load applied to any edge of the bare die. These
mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only
§
B
14Intel® 8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
3Thermal Specifications
3.1Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the E8500 chipset NB/XMB
components to consume maximum power dissipation for sustained time periods. Therefore, in
order to arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting power
consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that
the thermal solutions should be designed to. TDP is no t th e maxi mu m power that the chipset can
dissipate.
For TDP specifications, see Table 3-1 for the E8500 chipset NB component and Table 3-2 for the
E8500 chipset XMB component FC-BGA packages have poor heat transfer capability into the
board and have minimal thermal capability without a thermal solution. Intel recommends that
system designers plan for one or more heatsinks when using the E8500 chipsets NB/XMB
components.
3.2Die Case Temperature Specifications
To ensure proper operation and reliability of the E8500 chipset NB/XMB components, the die
temperatures must be at or between the maximum/minimum operating temperature ranges as
specified in Table 3-1 and Table 3-2. System and/or component level thermal solutions are required
to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately
measuring package die temperatures.
Table 3-1. Intel® E8500 Chipset NB Thermal Specifications
ParameterValueNotes
T
case_max
T
case_min
TDP
with 1 XMB attached
TDP
with 2 XMBs attached
TDP
with 3 XMBs attached
TDP
with 4 XMBs attached
NOTE:
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory15
Bridge (XMB) Thermal/Mechanical Design Guide
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
105°C
5°C
9.1WDDR-266
9.3WDDR-333
8.5WDDR2-400
§
16Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
4Thermal Simulation
Intel provides thermal simulation models of the E8500 chipset NB/XMB components and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact yo ur Intel field sales representative to order the thermal models and
user's guides.
§
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory17
Bridge (XMB) Thermal/Mechanical Design Guide
Thermal Simulation
18Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
5Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques to measure the
NB/XMB die temperatures. Section 5.1 provides guidelines on how to accurately measure the
NB/XMB die temperatures. Section 5.2 contains information on running an application program
that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers
useful guidelines for thermal performance and evaluation.
5.1Die Case Temperature Measurements
T o ensure functionality and reliability, the T
the maximum/minimum operating range of the temperature specification as noted in Table 3-1 and
Table 3-2. The surface temperature at the geometric center of the die corresponds to T
Measuring T
Temperature differences between the temperature of a surface and the surrounding local ambient
air can introduce errors in the measurements. The measurement errors could be due to a poor
thermal contact between the thermocouple junction and the surface of the package, heat loss by
radiation and/or convection, conduction through thermocouple leads, and/or contact between the
thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement
accuracy, only the 0° thermocouple attach approach is recommended.
Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of
the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using a high thermal conductivity cement. During this step, ensure no
contact is present between the thermocouple cement and the heatsink base because any contact
will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 5-3).
requires special care to ensure an accurate temperature measurement.
case
of the NB/XMB must be maintained at or between
case
.
case
6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the
milled slot.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory19
Bridge (XMB) Thermal/Mechanical Design Guide
Thermal Metrology
Figure 5-1. Thermal Solution Decision Flowchart
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
001240
NOTE: Not to scale.
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Die
Thermocouple
NOTE: Not to scale.
20Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Wire
Cement +
Thermocouple Bead
Substrate
001321
Bridge (XMB) Thermal/Mechanical Design Guide
5.2Power Simulation Software
Thermal Metrology
The power simulation software is a utility designed to dissipate the thermal design power on an
E8500 chipset NB component or XMB component when used in conjunction with the 64-bit Intel
Xeon™ processor MP. The combination of the above mentioned processor and the higher
bandwidth capability of the E8500 chipsets enable higher levels of system performance. To assess
the thermal performance of the chipset thermal solution under “worst-case realistic application”
conditions, Intel is developing a software utility that operates the chipset at near worst-case thermal
power dissipation.
The power simulation software being developed should only be used to test thermal solutions at or
near the thermal design power. Figure 5-1 shows a decision flowchart for determining thermal
solution needs. Real world applications may exceed the thermal design power limit for transient
time periods. For power supply current requirements under these transient conditions, please refer
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact
your Intel field sales representative to order the power utility software and user's guide.
§
®
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory21
Bridge (XMB) Thermal/Mechanical Design Guide
Thermal Metrology
22Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6NB Reference Thermal Solution #1
Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500 chipset NB component under operating environments and specifications defined in this
document. This chapter describes the overall requirements for the 1
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the Intel
PCI Hub, refer to thermal specification in the IntelThermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
the Intel
(ICH5R) Thermal Design Guide.
®
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
6.1Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)
®
6700PXH 64-bit PCI Hub
st
NB reference thermal
®
6700PXH 64-bit
The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard
6.2Heatsink Performance
Figure 6-1 depicts the measured thermal performance of the 1st NB reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory23
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity
1.50
1.40
1.30
1.20
1.10
Ȍca (°C/W)
1.00
0.90
0.80
Ȍ
100200300400500600700
Flow Rate (LFM)
6.3Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB
thermal solution are shown in Figure 6-2.
When using heatsinks that extend beyond the NB reference heatsink envelope shown in
Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot
exceed 4.14 mm (0.16 in.) in height.
24Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Figure 6-2. First NB Reference Heatsink Volumetric Envelope
Heatsink
Fin
Heatsin k Base
FCBGA + Solder Balls
IH S + T IM 2
Motherboard
64.52 mm .
42.50 m m .
NB Reference Thermal Solution #1
55.09 mm.
4 mm.
4.29 mm.
TNB
Heatsink
Heatsink
Fin
42.50 mm.
64.52 mm .
Heatsin k Base
6.4Board-Level Components Keepout Dimensions
The location of hole pattern and keepout zones for the reference thermal solution are shown in
Figure 6-3.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory25
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
6.5First NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
Figure 6-3. First NB Heatsink Board Component Keepout
64.500mm.
55.245mm.
42.500mm.
4X Ø 5.5mm
4X Ø 2.95 ± 0.0254mm
No Component Keep Out Area
4.14mm Max Component Height
Heatsink Mounting Hole
NOTE: All dimensions are in millimeters.
TNB Location
NB Location
42.500mm.
64.500mm.55.245mm.
26Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
Figure 6-4. First NB Heatsink Assembly
NB Reference Thermal Solution #1
6.5.2Extruded Heatsink Profiles
The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.
Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other
heatsinks with similar dimensions and increased thermal performance may be available. Full
mechanical drawing of this heatsink is provided in Appendix B.
6.5.3Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.5.4Thermal Interface Material
A TIM provides improved conductivity between the die and heatsink. The reference thermal
solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm
(1.5 in. x 1.5 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch
after it reaches its phase change temperature.
6.5.4.1Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled
thickness of the thermal interface material after installation of heatsink. The effect of pressure on
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory27
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1 The
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C
2
inch
/W.
Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure
Pressure (psi)Thermal Resistance (°C × in2)/W
50.37
100.30
200.21
300.17
NOTE:
1. All measured at 50°C.
6.5.5Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two
NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.
Figure 6-5. First NB Heatsink Extrusion Profile
28Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6.6Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in Table 6-2.
Table 6-2. Reliability Guidelines
(1)
Test
RequirementPass/Fail Criteria
NB Reference Thermal Solution #1
(2)
Mechanical
Shock
Random
Vibration
Temperature Life85°C, 2000 hours total, checkpoints at 168,
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory29
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
30Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7NB Reference Thermal Solution #2
Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500 chipset NB component under operating environments and specifications defined in this
document. This chapter describes the overall requirements for the 2nd NB reference thermal
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the Intel
PCI Hub, refer to thermal specification in the IntelThermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal
specification in the Intel
Controller Hub 5 R (ICH5R) Thermal Design Guide.
®
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O
7.1Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to
the local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environmental external
to the system.)
®
6700PXH 64-bit PCI Hub
®
6700PXH 64-bit
The fastener for this reference thermal solution is intended to be used on motherboard with
thickness between 0.085” and 0.093”.
7.2Heatsink Performance
Figure 7-1 depicts the measured thermal performance of the 2nd NB reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory31
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
Figure 7-1. Second NB Reference Heatsink Measu red Thermal Performance vs.
Approach Velocity
2.3
2
1.7
1.4
1.1
Ȍca (°C/W)
0.8
0.5
0100200300400500600
Flow Rate (LFM)
7.3Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB
thermal solution are shown in Figure 7-2.
When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,
any motherboard components placed between the heatsink and motherboard cannot exceed
4.14 mm (0.16 in.) in height.
32Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
Figure 7-2. Second NB Reference Heatsink Volumetric Envelope
Heatsink
Fin
Heatsink B ase
FCBGA
IH S + T IM 2
Motherboard
64.52 m m .
42.50 m m .
4 mm.
4.29 mm .
55.09 m m.
Heatsink B ase
Heatsink
Fin
64.52 mm .
40.50 m m .
7.4Board-Level Components Keepout Dimensions
Please refer to Section 6.4 for detail.
7.5Second NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory33
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
Figure 7-3. Second NB Heatsink Asse mbly
7.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
7.5.2Extruded Heatsink Profiles
Please refer to Section 6.5.2 for detail.
7.5.3Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4Thermal Interface Material
Please refer to Section 6.5.4 for detail.
7.5.4.1Effect of Pressure on TIM Performance
Please refer to Section 6.5.4.1 for detail.
7.5.5Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with
either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the
fastener.
34Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7.6Reliability Guidelines
Please refer to Section 6.6 for detail.
NB Reference Thermal Solution #2
§
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory35
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
36Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
8XMB Reference Thermal Solution
2.5
3
3.5
4
4.5
5
5.5
0100200300400500600
Flow Rate (LFM)
Ȍca (°C/W)
Intel has developed one different reference thermal solution designed to meet the cooling needs of
the E8500 chipset XMB component under operating environments and specifications defined in
this document. This chapter describes the overall requirements for the XMB reference thermal
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
specific system local-ambient operating conditions. For information on the Intel
PCI Hub, refer to thermal specification in the IntelThermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
the Intel
(ICH5R) Thermal Design Guide.
®
82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
8.1Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)
®
6700PXH 64-bit PCI Hub
®
6700PXH 64-bit
The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard.
8.2Heatsink Performance
Figure 8-1 depicts the measured thermal performance of the XMB reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory37
Bridge (XMB) Thermal/Mechanical Design Guide
XMB Reference Thermal Solution
8.3Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB
thermal solution are showing in Figure 8-2.
When using heatsinks that extend beyond the XMB reference heatsink envelope shown in
Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot
The locations of holes pattern and keepout zones for the reference thermal solution are shown in
Figure 8-3.
8.5XMB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset XMB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4
shows the reference thermal solution assembly and associated components.
38Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
Figure 8-3. XMB Heatsink Board Component Keepou t
63.500mm.
55.250mm.
37.500mm.
37.5mm
XMB Reference Thermal Solution
4X Ø 5.5mm
4X Ø 2.95 ± 0.0254mm
8.5.1Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
Figure 8-4. XMB Heatsink Assembly
XMB Location
No Component Keep Out Area
2.48mm Max Com ponent Height
Heatsink Mounting Hole
38.097mm. 48.260mm.
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory39
Bridge (XMB) Thermal/Mechanical Design Guide
XMB Reference Thermal Solution
8.5.2Extruded Heatsink Profiles
The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.
Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other
heatsinks with similar dimensions and increased thermal performance may be available. A full
mechanical drawing of this heatsink is provided in Appendix B.
8.5.3Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
8.5.4Thermal Interface Material
A TIM provides improved conductivity between the die and the heatsink. The reference thermal
solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm
(0.7 in. x 0.7 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch
after it reaches its phase change temperature.
8.5.4.1Effect of Pressure on TIM Performance
Please refer to Section 6.5.4.1 for detail.
8.5.5Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B
for a mechanical drawing of the fastener.
40Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Figure 8-5. XMB Heatsink Extrusion Profile
XMB Reference Thermal Solution
8.6Reliability Guidelines
Please refer to Section 6.6 for detail.
§
Intel® E8500 Chipset North Bridge (NB) and eXternal Memory41
Bridge (XMB) Thermal/Mechanical Design Guide
XMB Reference Thermal Solution
42Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
AThermal Solution Component
Suppliers
Table A-1. NB Heatsink Thermal Solution #1
PartIntel Part Number
Heatsink Assembly includes:
• Unidirectional Fin Heatsink
• Thermal Interface Material
• Retaining Fastener
Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)