Intel E8500 User Manual

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB)

Thermal/Mechanical Design Guide

March 2005

Document Number 306749-001

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E8500 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) may contain design defects or errors known as errata which may

2 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Contents

1 Introduction.........................................................................................................................7

1.1 Design Flow................................ .................................... ... ..................................................7

1.2 Definition of Terms...............................................................................................................8

1.3 Reference Documents.................................................................. ... ....................................9

2 Packaging Technology.... .... .............................................................................................11

2.1 Package Mechanical Requirements ..................................................................................14

3 Thermal Specifications........ .......................................... ... ... .......................................... ...15

3.1 Thermal Design Power (TDP)............................................................................................15

3.2 Die Case Temperature Specifications ...............................................................................15

4 Thermal Simulation ................ ... ... ... .... ... ... ... .... ... .......................................... ... ... .............17

5 Thermal Metrology .............. ... ... ... ... .... .......................................... ... ... .............................19

5.1 Die Case Temperature Measurements..............................................................................19

5.2 Power Simulation Software................................................................................................21

6 NB Reference Thermal Solution #1..................................................................................23

6.1 Operating Environment......................................................................................................23

6.2 Heatsink Performance .......................................................................................................23

6.3 Mechanical Design Envelope.............................................................................................24

6.4 Board-Level Components Keepout Dimensions................................................................25

6.5 First NB Heatsink Thermal Solution Assembly ..................................................................26

6.5.1 Heatsink Orientation............................................................................................27

6.5.2 Extruded Heatsink Profiles..................................................................................27

6.5.3 Mechanical Interface Material..............................................................................27

6.5.4 Thermal Interface Material...................................................................................27

6.5.5 Heatsink Retaining Fastener ...............................................................................28

6.6 Reliability Guidelines..........................................................................................................29

7 NB Reference Thermal Solution #2..................................................................................31

7.1 Operating Environment......................................................................................................31

7.2 Heatsink Performance .......................................................................................................31

7.3 Mechanical Design Envelope.............................................................................................32

7.4 Board-Level Components Keepout Dimensions................................................................33

7.5 Second NB Heatsink Thermal Solution Assembly.............................................................33

7.5.1 Heatsink Orientation............................................................................................34

7.5.2 Extruded Heatsink Profiles..................................................................................34

7.5.3 Mechanical Interface Material..............................................................................34

7.5.4 Thermal Interface Material...................................................................................34

7.5.5 Heatsink Retaining Fastener ...............................................................................34

7.6 Reliability Guidelines..........................................................................................................35

8 XMB Reference Thermal Solution....................................................................................37

8.1 Operating Environment......................................................................................................37

8.2 Heatsink Performance .......................................................................................................37

8.3 Mechanical Design Envelope.............................................................................................38

8.4 Board-Level Components Keepout Dimensions................................................................38

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 3 Bridge (XMB) Thermal/Mechanical Design Guide

8.5 XMB Heatsink Thermal Solution Assembly.......................................................................38

8.5.1 Heatsink Orientation...........................................................................................39

8.5.2 Extruded Heatsink Profiles .................................................................................40

8.5.3 Mechanical Interface Material............................................................................. 40

8.5.4 Thermal Interface Material.................................................................................. 40

8.5.5 Heatsink Retaining Fastener ..............................................................................40

8.6 Reliability Guidelines......................................................................................................... 41

A Thermal Solution Component Suppliers ..........................................................................43

B Mechanical Drawings.......................................................................................................47

Figures

1-1 Thermal Design Process.......................................................... .. ..................................... ... .8

2-1 NB Package Dimensions (Top View)................................................................................11

2-2 NB Package Dimensions (Side View)...............................................................................11

2-3 NB Package Dimensions (Bottom View)........................................................................... 12

2-4 XMB Package Dimensions (Top View) .............................................................................13

2-5 XMB Package Dimensions (Side View)............................................................................ 13

2-6 XMB Package Dimensions (Bottom View)........................................................................ 14

5-1 Thermal Solution Decision Flowchart................................................................................ 20

5-2 Zero Degree Angle Attach Heatsink Modifications............................................................ 20

5-3 Zero Degree Angle Attach Methodology (Top View)......................................................... 20

6-1 First NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity............................................................................................................. 24

6-2 First NB Reference Heatsink Volumetric Envelope........................................................... 25

6-3 First NB Heatsink Board Component Keepout.................................................................. 26

6-4 First NB Heatsink Assembly.............................................................................................. 27

6-5 First NB Heatsink Extrusion Profile................................................................................... 28

7-1 Second NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity............................................................................................................. 32

7-2 Second NB Reference Heatsink Volumetric Envelope ..................................................... 33

7-3 Second NB Heatsink Assembly ........................................................................................34

8-1 XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity.......... 37

8-2 XMB Reference Heatsink Volumetric Envelope................................................................ 38

8-3 XMB Heatsink Board Component Keepout....................................................................... 39

8-4 XMB Heatsink Assembly............................................................ .......................................39

8-5 XMB Heatsink Extrusion Profile........................................................................................ 41

B-1 NB Heatsink #1 Assembly Drawing .................................................................................. 48

B-2 NB Heatsink #1 Drawing................................................................................................... 49

B-3 NB Heatsink #2 Assembly Drawing .................................................................................. 50

B-4 NB Heatsink #2 Drawing................................................................................................... 51

B-5 XMB Heatsink Assembly Drawing.....................................................................................52

B-6 XMB Heatsink Drawing ..................................................................................................... 53

4 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Tables

3-1 Intel® E8500 Chipset NB Thermal Specifications ..............................................................15

3-2 Intel

6-1 Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure.....28

6-2 Reliability Guidelines..........................................................................................................29

A-1 NB Heatsink Thermal Solution #1......................................................................................43

A-2 NB Heatsink Thermal Solution #2......................................................................................44

A-3 XMB Heatsink Thermal Solution........................................................................................44

B-1 Mechanical Drawing List....................................................................................................47

E8500 Chipset XMB Thermal Specifications...........................................................16

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 5 Bridge (XMB) Thermal/Mechanical Design Guide

Revision History

Document

Number

306749 001 • Initial release of this document March 2005

Revision

Number

NOTE: Not all revisions may be published.

Description Date

6 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the Intel

chipset North Bridge (NB) component and the Intel (XMB) component.

• Describe two reference thermal solutions that meet the specification of the E8500 chipset NB

component.

• Describe a reference thermal solution that meets the specification of the E8500 chipset XMB

component.

Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die temperatures at or below thermal specifications. This is accomplished by providing a low localambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

E8500 chipset eXternal Memory Bridge

E8500

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the E8500 chipset NB and XMB components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the Intel

Intel

6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the

Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1-1 illustrates the design process impl icit to this document and the tools appropriate for each step.

6700PXH 64-bit PCI Hub, refer to the

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 7 Bridge (XMB) Thermal/Mechanical Design Guide

Introduction

Figure 1-1. Thermal Design Process

1.2 Definition of Terms

BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a

die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.

001239

BLT Bond line thickness. Final settled thickness of the thermal interface material

after installation of heatsink.

ICH5 I/O controller hub. The chipset component that contains the primary PCI

interface, LPC interface, USB, S-ATA, and other legacy functions.

IHS Integrated Heat Spreader, Integral part of the NB package. It enhances

dissipation of heat generated by the NB die and provides interface surface between NB die and cooling solution.

IMI Independent memory Interfaces. Port connecting the NB to the XMB

Intel® 6700PXH 64-bit PCI Hub

The chipset component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.

case_max

Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

case_min

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

TDP Thermal design power. Thermal solutions should be designed to dissipate this

target power level. TDP is not the maximum power that the chipset can dissipate.

TIM Thermal interface material. Thermally conductive material installed between

two surfaces to improve heat transfer and reduce interface contact resistance.

NB Intel

E8500 chipset North Bridge Component. The chipset component that

provides the interconnect to the processors, XMBs and various I/O components.

8 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Intel® E8500 chipset eXternal Memory Bridge Component. The chipset

component that bridges the IMI and DDR interfaces.

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

• Intel

• 64-bit Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide

82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Datasheet

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

6700PXH 64-bit PCI Hub Datasheet

E8500 Chipset North Bridge (NB) Datasheet

E8500 Chipset North Bridge (NB) Specification Update

E8500 Chipset eXternal Memory Bridge (XMB) Datasheet

E8500 Chipset eXternal Memory Bridge (XMB) Specification Update

Xeon™ Processor MP with up to 8MB L3 Cache Datasheet

Xeon™ Processor MP with up to 8MB L3 Cache Thermal/Mechanical Design

Guidelines

Xeon™ Processor MP with 1MB L2 Cache Datasheet

Xeon™ Processor MP with 1MB L2 Cache Thermal/Mechanical Design

Guidelines

Introduction

• BGA/OLGA Assembly Development Guide

• Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales

representative. Some documents may not be available at this time.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 9 Bridge (XMB) Thermal/Mechanical Design Guide

Introduction

10 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

2 Packaging Technology

0.20 –C–

IHS

Substrate

0.435 ± 0.025 mm See Note 3

Seating Plane

2.44 ± 0.071 mm

See Note 1

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

0.20

See Note 4

3.79 ± 0.144 mm

4.23 ± 0.146 mm

The E8500 chipsets consist of four individual components: the NB, the XMB, the Intel® 6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5r). The E8500 chipset NB component use a

42.5 mm sq uared , 12-lay er flip chip ball gri d array (FC-BGA) package (see Figure 2-1 through

Figure 2-3). The E8500 chipset XMB component uses a 37.5mm squared, 10-layer FB-BGA

package (see Figure 2-4 through Figure 2-6). For information on the Intel 6700PXH 64-bit PCI Hub package, refer to the Intel information on the ICH5 package, refer to the Intel

82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.

Intel

Figure 2-1. NB Package Dimensions (Top View)

Han d lin g

Exclusion

Area

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide. For

82801EB I/O Controller Hub 5 (ICH5) and

38.5 mm

TNB

IHS

42.5 mm38.5 mm

42.5 mm

Figure 2-2. NB Package Dimensions (Side View)

Intel® 8500 Chipset North Bridge (NB) and eXternal Memory 11 Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-3. NB Package Dimensions (Bottom View)

A U

A R

A N

A H

20.202

37X 1.092

11 2523211917151397531 27 29 3733 3531

37X 1.092

2822 26242018161412108642 36343230 38

42.5 + 0.05

20.202

42.5 + 0.05

NOTES:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

CA0.2

12 Intel® 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Figure 2-4. XMB Package Dimensions (Top View)

Notes:

1. Primary datum -C- and seat ing plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) or ientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

0.20

–C–

Die

Substrate

0.435 ± 0.025 mm See Note 3

Seating Plane

2.100 ± 0.121 mm

See Note 1

Decoup

Cap

0.7 mm Max

2.535 ± 0.123 mm

0.84 ± 0.05 mm

0.20

See Note 4

Handling

Exclusion

Area

8.88mm.

14.02mm.

Packaging Tech no lo gy

Die

Keepout

Area

6.65mm.11.73mm.

XMB

Die

23.50mm.

27.50mm.

37.50mm.

Figure 2-5. XMB Package Dimensions (Side View)

37.50mm.27.50mm.23.50mm.

Intel® 8500 Chipset North Bridge (NB) and eXternal Memory 13 Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-6. XMB Package Dimensions (Bottom View)

A U

A R

A N

A H

20.202

37X 1.092

11 2523211917151397531 27 29 3733 3531

2822 26242018161412108642 36343230 38

42.5 + 0.

20.202

42.5 + 0.05 CA0.2

2.1 Package Mechanical Requirements

The E8500 chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes:

1. The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2. These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/IHS top surface.

3. These specifications are based on limited testing for design characterization. Loading limits are for the package only

14 Intel® 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

3 Thermal Specifications

3.1 Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500 chipset NB/XMB components to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is no t th e maxi mu m power that the chipset can dissipate.

For TDP specifications, see Table 3-1 for the E8500 chipset NB component and Table 3-2 for the E8500 chipset XMB component FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for one or more heatsinks when using the E8500 chipsets NB/XMB components.

3.2 Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500 chipset NB/XMB components, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1 and Table 3-2. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® E8500 Chipset NB Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

with 1 XMB attached

TDP

with 2 XMBs attached

TDP

with 3 XMBs attached

TDP

with 4 XMBs attached

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 15 Bridge (XMB) Thermal/Mechanical Design Guide

104°C

5°C

17.9W

19.8W

22.4W

24.5W

Thermal Specifications

Table 3-2. Intel® E8500 Chipset XMB Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

dual channel

TDP

dual channel

TDP

dual channel

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

105°C

5°C

9.1W DDR-266

9.3W DDR-333

8.5W DDR2-400

16 Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

4 Thermal Simulation

Intel provides thermal simulation models of the E8500 chipset NB/XMB components and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in ICEPAK* format. Contact yo ur Intel field sales representative to order the thermal models and user's guides.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory 17 Bridge (XMB) Thermal/Mechanical Design Guide

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