Intel DZ77SL-50K Specification
Intel® Desktop Board
DZ77SL-50K
Technical Product Specification
The Intel Desktop Board DZ77SL-50K may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DZ77SL-50K Specification Update.
April 2012
Part Number: G58188-001
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DZ77SL-50K Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier
SLZ7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2012, Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
April 2012
Board Identification Information
Basic Desktop Board DZ77SL-50K Identification Information
AA Revision BIOS Revision Notes
G39622
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Z77 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel Z77 Express Chipset C1 SLJCZ
SLZ7710H.86A.0055
1,2
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DZ77SL-50K Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DZ77SL-50K.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DZ77SL-50K and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DZ77SL-50K
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
®
Desktop
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DZ77SL-50K Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview........................................................................................ 11
1.1.1 Feature Summary
1.1.2 Board Layout
1.1.3 Block Diagram
1.2 O
nline Support ................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Graphics Subsystem
1.4 System Memory
.............................................................................. 19
1.4.1 Memory Configurations
®
1.5 Intel
1.5.1 Dire
Z77 Express Chipset ............................................................... 22
ct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces
1.5.3 USB ................................................................................... 24
1.5.4 SATA Interfaces
1.6 Real-Time Clock
1.7 Legacy I/O
Controller ....................................................................... 26
Subsystem .............................................................. 26
1.7.1 Consumer Infrared
1.8 Audio Subsystem
............................................................................ 27
1.8.1 Audio Subsystem Software
1.8.2 Audio Connectors
1.9 LAN Su
1.9.1 Intel
bsystem ............................................................................... 29
®
82579LF Gigabit Ethernet Controller .............................. 29
1.9.2 LAN Subsystem Software
1.9.3 RJ-45
LAN Connector with Integrated LEDs .............................. 30
1.10Hardware Management
1.10.1 Hardware Monitoring
1.10.2 Fan Monitoring ..................................................................... 31
1.10.3 Chassis
Intrusion and Detection ............................................. 31
1.10.4 Thermal Monitoring
1.11Power Management
1.11.1 ACPI
................................................................................... 33
......................................................................... 33
1.11.2 Hardware Support
................................................................ 11
....................................................................... 13
..................................................................... 15
............................................................. 17
......................................................... 20
................................................................ 22
................................................................... 24
(CIR) ....................................................... 26
.................................................... 27
and Headers ............................................... 28
...................................................... 30
Subsystem .................................................... 31
............................................................ 31
.............................................................. 32
................................................................ 35
2 Technical Reference
2.1 Memory Resources
2.1.1 Addre
2.1.2 Memo
2.2 Connect
ors and Headers ................................................................... 43
2.2.1 Back Panel
2.2.2 Component-side Connectors
2.3 Jumper Block
vii
ssable Memory ............................................................. 41
ry Map ........................................................................ 43
.................................................................................. 55
.......................................................................... 41
Connectors .......................................................... 44
and Headers ................................ 45
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.4 Mechanical Considerations ................................................................ 57
2.4.1 Form
2.5 Electr
ical Considerations ................................................................... 58
2.5.1 Power Supply Considerations
2.5.2 Fan Header Curren
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
Factor ......................................................................... 57
................................................. 58
t Capability ................................................ 59
.................................................. 59
.................................................................... 59
2.7 Reliability ....................................................................................... 62
2.8 Environmental ................................................................................ 62
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 63
3.2 BIOS
3.3 Resource Configuration
3.4 System
3.5 Legacy USB Support
3.6 BIOS Updates
3.7 BIOS
3.8 Boot
3.9 Adjusting Boot
3.10BIOS Security Features .................................................................... 70
3.11BIOS Performance Features
Flash Memory Organization ....................................................... 64
.................................................................... 64
3.3.1 PCI E
xpress Autoconfiguration ................................................ 64
Management BIOS (SMBIOS) ................................................. 65
........................................................................ 65
................................................................................. 66
3.6.1 Language Support
3.6.2 Custom Splash
................................................................ 66
Screen .......................................................... 67
Recovery ................................................................................ 67
Options ................................................................................... 68
3.8.1 Optical Drive Boot
3.8.2 Networ
k Boot ....................................................................... 68
................................................................ 68
3.8.3 Booting Without Attached Devices .......................................... 68
3.8.4 Changing the
Default Boot Device During POST ........................ 68
Speed ....................................................................... 69
3.9.1 Peripheral
3.9.2 BIOS Boot Optimizations
Selection and Configuration .................................... 69
....................................................... 69
.............................................................. 71
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 73
4.2 BIOS Beep
Codes ............................................................................ 73
4.3 Front-panel Power
4.4 BIOS Error Messages
4.5 Port 80h
POST Codes ....................................................................... 75
5 Regulatory Compliance and Battery Disposal Information
5.1 Regula
5.1.1 Safety Standards ................................................................. 81
5.1.2 European
5.1.3 Product Ecology Statements
5.1.4 China RoHS
5.1.5 EMC Regulations
viii
tory Compliance ..................................................................... 81
LED Blink Codes .................................................... 74
....................................................................... 74
Union Declaration of Conformity Statement ................ 82
.................................................. 83
......................................................................... 86
.................................................................. 87
Contents
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 89
5.1.7 Regula
5.2 Batte
ry Disposal Information ............................................................. 91
tory Compliance Marks (Board Level) ............................. 90
Figures
1. Major Board Components ................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 21
4. Back Panel Audio Connectors ............................................................ 28
5. LAN Connector LED Locations ............................................................ 30
6. Thermal Sensors and Fan Headers ..................................................... 32
7. Location of the Standby Power LED .................................................... 39
8. Detailed System Memory Address Map
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header
12. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54
13. Location of the Jumper Block ............................................................ 55
14. Board Dimensions ........................................................................... 57
15. Localized High Temperature Zones ..................................................... 60
16. Intel Desktop Board DZ77SL-50K China RoHS Material Self
Declaration Table
............................................................................ 86
............................................... 42
........................................ 52
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 19
4. HDMI Port Status Conditions ............................................................. 23
5. Audio Formats Supported by the HDMI Interface .................................. 23
6. Audio Jack Support .......................................................................... 27
7. LAN Connector LED States ................................................................ 30
8. Effects of Pressing the Power
9. Power States and Targeted
10. Wake-up Devices and Events ............................................................ 35
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 10 ................ 46
13. Front Panel Audio Header for Intel HD Audio
14. Front Panel Audio Header for AC ’97 Audio
15. Front Panel USB 2.0 Headers ............................................................ 47
16. Front Panel USB 3.0 Connector .......................................................... 48
17. SATA Connectors ............................................................................. 48
18. S/PDIF Header ................................................................................ 48
19. Chassis Intrusion Header .................................................................. 49
20. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 49
21. Back Panel CIR Emitter (Output) Header ............................................. 49
Switch .................................................. 33
System Power .......................................... 34
....................................... 47
.......................................... 47
ix
Intel Desktop Board DZ77SL-50K Technical Product Specification
22. Front Panel CIR Receiver (Input) Header ............................................ 49
23. LPC Debug Header ........................................................................... 50
24. Processor Core Power Connector........................................................ 51
25. Main Power Connector ...................................................................... 51
26. Front Panel Header .......................................................................... 52
27. States for a One-Color Power LED ...................................................... 53
28. States for a Two-Color Power LED ...................................................... 53
29. Alternate Front Panel Power/Sleep LED Header
30. BIOS Setup Configuration Jumper
31. Recommended Power Supply C
Settings.......................................... 56
urrent Values (High Power) .................... 58
.................................... 53
32. Recommended Power Supply Current Values (Low Power) ..................... 58
33. Fan Header Current Capability ........................................................... 59
34. Thermal Considerations for Components ............................................. 61
35. Tcontrol Values for Components ........................................................ 61
36. Environmental Specifications ............................................................. 62
37. BIOS Setup Program Menu Bar .......................................................... 64
38. BIOS Setup Program
39. Acceptable Drives/Media Types for BIOS Recovery
Function Keys ................................................... 64
............................... 67
40. Boot Device Menu Options ................................................................ 68
41. Supervisor and User Password Functions ............................................ 70
42. BIOS Beep Codes ............................................................................ 73
43. Front-panel Power LED Blink Codes
.................................................... 74
44. BIOS Error Messages ....................................................................... 74
45. Port 80h POST Code Ranges ............................................................. 75
46. Port 80h POST Codes ....................................................................... 76
47. Typical Port 80h POST Sequence ....................................................... 80
48. Safety Standards ............................................................................. 81
49. EMC Regulations ............................................................................. 87
50. Regulatory Compliance Marks ........................................................... 90
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio
ATX (12 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
rd
• 3
generation Intel® Core processor family and 2nd generation Intel® Core
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
― External graphics interface controller
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz to +2667 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
processor family processors
®
Z77 Express Chipset consisting of the Intel
Intel
Controller Hub (PCH)
• Integrated graphics support for processors with Intel HD Graphics:
― High Definition Multimedia Interface* (HDMI*) v1.4a
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
• 8-channel (5+1) Intel High Definition Audio via the Realtek* ALC662 audio
• 8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
processor family processors
codec
(HDMI*)
®
HD Graphics)
rd
generation Intel Core
®
Z77 Express Platform
rd
generation Intel Core
continued
11
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral
Interfaces
Expansion
Capabilities
BIOS
Instantly Available
PC Technology
LAN Support
Legacy I/O Control Nuvoton NCT6776D I/O controller for CIR, PS/2 port, and hardware management
Hardware Monitor
Subsystem
• Four USB 3.0 ports:
― Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
― Two front panel USB 3.0 ports are implemented through one internal
connector (blue)
• Eight USB 2.0 ports:
― Four ports implemented with stacked back panel connectors (black)
― Four front panel ports implemented through two internal headers
• Six Serial ATA (SATA) ports:
― Two SATA 6.0 Gb/s interfaces through the Intel Z77 Express Chipset with
®
Rapid Storage Technology RAID support (blue)
Intel
― Three internal SATA 3.0 Gb/s interfaces through Intel Z77 Express Chipset
with Intel Rapid Storage Technology RAID support (black)
― One back panel eSATA port (red)
• PS/2*-style keyboard/mouse port
• One PCI Express 3.0 x16 add-in card connector
• One PCI Express 2.0 x4 bus add-in card connector from the PCH
• One PCI Express 2.0 x1 bus add-in card connector from the PCH
• Three Conventional PCI bus add-in card connectors from the PCH via a PCI
bridge
rd
Note: PCI Express 3.0 is only supported by 3
generation Intel Core
processor family processors
®
• Intel
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
• Support for PCI Express* Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, Consumer Infrared (CIR), PS/2,
and USB ports
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel
Ethernet Controller
support
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
®
82579V Gigabit
12
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DZ77SL-50K.
Product Description
13
Figure 1. Major Board Components
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Des
A Conventional PCI add-in card connector
B Conventional PCI add-in card connector
C Conventional PCI add-in card connector
D Front panel USB 3.0 connector (blue)
E PCI Express x4 add-in card connector
F Rear chassis fan header
G PCI Express x16 add-in card connector
H PCI Express x1 add-in card connector
I Back panel connectors
J 12 V processor core voltage connector (2 x 4 pin)
K LGA1155 processor socket
L Processor fan header
M DIMM 3 (Channel A DIMM 0)
N DIMM 1 (Channel A DIMM 1)
O DIMM 4 (Channel B DIMM 0)
P DIMM 2 (Channel B DIMM 1)
Q Front chassis fan header
R Consumer IR receiver (input) header
S Consumer IR emitter (output) header
T Main power connector (2 x 12)
U BIOS Setup configuration jumper block
V Intel Z77 Express Chipset
W SATA 6.0 Gb/s connector through the PCH (blue)
X SATA 3.0 Gb/s connector through the PCH (black)
Y SATA 3.0 Gb/s connector through the PCH (black)
Z Chassis intrusion header
AA Low Pin Count (LPC) Debug header
BB Alternate front panel power/sleep LED header
CC Front panel header
DD Front panel USB 2.0 connectors
EE Piezoelectric speaker
FF Battery
GG Power fault LED
HH Standby power LED
II S/PDIF out header
JJ Front panel audio header
cription
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
15
Figure 2. Block Diagram
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DZ77SL-50K http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DZ77SL-50K
Supported processors http://processormatc
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
h.intel.com
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processor family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed
above are only supported when falling within the wattage requirements of Intel
Desktop Board DZ77SL-50K. See the Intel web site listed below for the most up-todate list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 58 for information on power supply requirements for this board.
16
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
nd
⎯ DirectX* 11 (2
generation Intel Core processor family processors support
CS4.0 only) support
⎯ OpenGL* 3.0 support
⎯ Shader Model 4.0
⎯ High-Definition content at up to 1080p resolution
⎯ Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
⎯ Intel
®
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
⎯ Blu-ray* S3D via HDMI 1.4a
⎯ Dynamic Video Memory Technology (DVMT) 5.0 support
⎯ Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
17
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.3.1.2 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x,
and 1.x and 2
nd
generation Intel Core processor family processors support PCI
Express 2.x and 1.x:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of
16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
18
Product Description
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1066 MHz to +2667 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIMMs are only supported by 3
processor family processors
• XMP version 1.3 performance profile support for memory speeds up to +2667 MHz
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
SDRAM
Density
DIMM
Capacity Configuration
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 256 M x8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
(Note)
SDRAM Organization
Front-side/Back-side
/CS-025414.htm
Number of SDRAM
Devices
19
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
20
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if
installing only two DIMMs on your board.
21
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.5 Intel® Z77 Express Chipset
Intel Z77 Express Chipset with Intel Flexible Display Interconect (Intel FDI) and Direct
Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel Z77 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel Z77 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the
display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI).
22
Product Description
1.5.2.3 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI interface supports the
HDMI 1.4a specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
HDMI port will behave as described in Table 4.
Table 4.
PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled
PCI Express x16 add-in card installed Enabled
Note: May require BIOS setup menu changes.
HDMI Port Status Conditions
(Note)
1.5.2.4 Integrated Audio Provided by the HDMI Interface
The HDMI interface from the PCH supports audio. Table 5 shows the specific audio
technologies supported by the PCH.
Table 5. Audio Formats Supported by the HDMI Interface
Audio Formats HDMI 1.4a
AC-3 - Dolby* Digital Yes
Dolby Digital Plus Yes
DTS-HD* Yes
LPCM, 192 kHz/24 bit, 8 Channel Yes
23
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.5.3 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host
controller which supports USB 3.0 ports. This controller allows data transfers up to
5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),
and low-speed (LS) traffic on the bus.
The board supports up to eight USB 2.0 ports and four USB 3.0 ports.
The Intel Z77 Express Chipset provides the USB controller for the 2.0/3.0 ports. The
port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Four USB 2.0 front panel ports are implemented through two internal headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 44
The location of the front panel USB headers Figure 10, page 45
1.5.4 SATA Interfaces
The board provides six SATA connectors, through the PCH, which support one device
each:
• Two SATA 6.0 Gb/s interfaces through the Intel Z77 Express Chipset with Intel
Rapid Storage Technology RAID support (blue)
• Three internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel Z77 Express
Chipset with Intel Rapid Storage Technology RAID support (black)
• One back panel eSATA port (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used
for host to device connections.
®
The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
24
Product Description
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP and Windows 7 operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 45
.
1.5.4.1 SATA RAID
The board supports Intel Rapid Storage Technology which provides the following RAID
(Redundant Array of Independent Drives) levels via the Intel Z77 Express Chipset:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.5.4.2 Intel® Smart Response Technology
Intel® Smart Response Technology is a disk caching solution that can provide improved
computer system performance with improved power savings. It allows configuration of
a computer system with the advantage of having HDDs for maximum storage capacity
with system performance at or near SSD performance levels.
For more information on Intel Smart Response Technology, go to
http://www.intel.com/support/chipsets/sb/CS-032826.htm
NOTE
In order to use supported RAID and Intel Smart Response Technology features, you
must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you
must press F6 to install the RAID drivers. See your Microsoft Windows XP
documentation for more information about installing drivers during installation.
Microsoft Windows 7 includes the necessary RAID drivers for both AHCI and RAID
without the need to install separate RAID drivers using the F6 switch in the operating
system installation process.
25
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• PS/2-style keyboard/mouse port
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.7.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to connect to
Intel Desktop Boards for this feature to work.
26
Product Description
1.8 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel Z77 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• A signal-to-noise (S/N) ratio of 95 dB.
• Windows Vista Ultimate and Windows 7 Ultimate certification.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support
Audio Jack
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl panel) Default
Back panel – Pink Default
Microphone Headphones
Line Out
(Front Spks)
Line In
(Surround)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
Mic-In
(Center/Sub)
27
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors). The available configurable back panel audio connectors are shown in
Figure 4.
Item Description
A Line in/surround
B Line out/front speakers
C Mic in/center/sub
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 45
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 47
The back panel audio connectors Section 2.2.1, page 44
28
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel Z77 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.9.1 Intel® 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state
⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
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