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Intel DZ77SL-50K Specification

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Intel® Desktop Board DZ77SL-50K
Technical Product Specification
April 2012
Part Number: G58188-001
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DZ77SL-50K Technical Product Specification
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier SLZ7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
®
All Intel computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, 3 trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others. Copyright © 2012, Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
April 2012
Board Identification Information
Basic Desktop Board DZ77SL-50K Identification Information
AA Revision BIOS Revision Notes
G39622 Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Z77 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel Z77 Express Chipset C1 SLJCZ
SLZ7710H.86A.0055
1,2
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.
iii
Intel Desktop Board DZ77SL-50K Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board DZ77SL-50K.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop Board DZ77SL-50K and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DZ77SL-50K 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information
Typographical Conventions
®
Desktop
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DZ77SL-50K Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1Product Description
1.1Overview........................................................................................ 11
1.1.1 Feature Summary
1.1.2 Board Layout
1.1.3 Block Diagram
1.2O
nline Support ................................................................................ 16
1.3Processor ....................................................................................... 16
1.3.1 Graphics Subsystem
1.4System Memory
.............................................................................. 19
1.4.1 Memory Configurations
®
1.5Intel
1.5.1 Dire
Z77 Express Chipset ............................................................... 22
ct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces
1.5.3 USB ................................................................................... 24
1.5.4 SATA Interfaces
1.6Real-Time Clock
1.7Legacy I/O
Controller ....................................................................... 26
Subsystem .............................................................. 26
1.7.1 Consumer Infrared
1.8Audio Subsystem
............................................................................ 27
1.8.1 Audio Subsystem Software
1.8.2 Audio Connectors
1.9LAN Su
1.9.1 Intel
bsystem ............................................................................... 29
®
82579LF Gigabit Ethernet Controller .............................. 29
1.9.2 LAN Subsystem Software
1.9.3 RJ-45
LAN Connector with Integrated LEDs .............................. 30
1.10Hardware Management
1.10.1Hardware Monitoring
1.10.2Fan Monitoring ..................................................................... 31
1.10.3Chassis
Intrusion and Detection ............................................. 31
1.10.4Thermal Monitoring
1.11Power Management
1.11.1ACPI
................................................................................... 33
......................................................................... 33
1.11.2Hardware Support
................................................................ 11
....................................................................... 13
..................................................................... 15
............................................................. 17
......................................................... 20
................................................................ 22
................................................................... 24
(CIR) ....................................................... 26
.................................................... 27
and Headers ............................................... 28
...................................................... 30
Subsystem .................................................... 31
............................................................ 31
.............................................................. 32
................................................................ 35
2Technical Reference
2.1Memory Resources
2.1.1 Addre
2.1.2 Memo
2.2Connect
ors and Headers ................................................................... 43
2.2.1 Back Panel
2.2.2 Component-side Connectors
2.3Jumper Block
vii
ssable Memory ............................................................. 41
ry Map ........................................................................ 43
.................................................................................. 55
.......................................................................... 41
Connectors .......................................................... 44
and Headers ................................ 45
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.4Mechanical Considerations ................................................................ 57
2.4.1 Form
2.5Electr
ical Considerations ................................................................... 58
2.5.1 Power Supply Considerations
2.5.2 Fan Header Curren
2.5.3 Add-in Board Considerations
2.6Thermal Considerations
Factor ......................................................................... 57
................................................. 58
t Capability ................................................ 59
.................................................. 59
.................................................................... 59
2.7Reliability ....................................................................................... 62
2.8Environmental ................................................................................ 62
3Overview of BIOS Features
3.1Introduction ................................................................................... 63
3.2BIOS
3.3Resource Configuration
3.4System
3.5Legacy USB Support
3.6BIOS Updates
3.7BIOS
3.8 Boot
3.9Adjusting Boot
3.10BIOS Security Features .................................................................... 70
3.11BIOS Performance Features
Flash Memory Organization ....................................................... 64
.................................................................... 64
3.3.1 PCI E
xpress Autoconfiguration ................................................ 64
Management BIOS (SMBIOS) ................................................. 65
........................................................................ 65
................................................................................. 66
3.6.1 Language Support
3.6.2 Custom Splash
................................................................ 66
Screen .......................................................... 67
Recovery ................................................................................ 67
Options ................................................................................... 68
3.8.1 Optical Drive Boot
3.8.2 Networ
k Boot ....................................................................... 68
................................................................ 68
3.8.3 Booting Without Attached Devices .......................................... 68
3.8.4 Changing the
Default Boot Device During POST ........................ 68
Speed ....................................................................... 69
3.9.1 Peripheral
3.9.2 BIOS Boot Optimizations
Selection and Configuration .................................... 69
....................................................... 69
.............................................................. 71
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 73
4.2BIOS Beep
Codes ............................................................................ 73
4.3Front-panel Power
4.4BIOS Error Messages
4.5Port 80h
POST Codes ....................................................................... 75
5Regulatory Compliance and Battery Disposal Information
5.1Regula
5.1.1 Safety Standards ................................................................. 81
5.1.2 European
5.1.3 Product Ecology Statements
5.1.4 China RoHS
5.1.5 EMC Regulations
viii
tory Compliance ..................................................................... 81
LED Blink Codes .................................................... 74
....................................................................... 74
Union Declaration of Conformity Statement ................ 82
.................................................. 83
......................................................................... 86
.................................................................. 87
Contents
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 89
5.1.7 Regula
5.2Batte
ry Disposal Information ............................................................. 91
tory Compliance Marks (Board Level) ............................. 90
Figures
1. Major Board Components ................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 21
4. Back Panel Audio Connectors ............................................................ 28
5. LAN Connector LED Locations ............................................................ 30
6. Thermal Sensors and Fan Headers ..................................................... 32
7. Location of the Standby Power LED .................................................... 39
8. Detailed System Memory Address Map
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header
12. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54
13. Location of the Jumper Block ............................................................ 55
14. Board Dimensions ........................................................................... 57
15. Localized High Temperature Zones ..................................................... 60
16. Intel Desktop Board DZ77SL-50K China RoHS Material Self Declaration Table
............................................................................ 86
............................................... 42
........................................ 52
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 19
4. HDMI Port Status Conditions ............................................................. 23
5. Audio Formats Supported by the HDMI Interface .................................. 23
6. Audio Jack Support .......................................................................... 27
7. LAN Connector LED States ................................................................ 30
8. Effects of Pressing the Power
9. Power States and Targeted
10. Wake-up Devices and Events ............................................................ 35
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 10 ................ 46
13. Front Panel Audio Header for Intel HD Audio
14. Front Panel Audio Header for AC ’97 Audio
15. Front Panel USB 2.0 Headers ............................................................ 47
16. Front Panel USB 3.0 Connector .......................................................... 48
17. SATA Connectors ............................................................................. 48
18. S/PDIF Header ................................................................................ 48
19. Chassis Intrusion Header .................................................................. 49
20. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 49
21. Back Panel CIR Emitter (Output) Header ............................................. 49
Switch .................................................. 33
System Power .......................................... 34
....................................... 47
.......................................... 47
ix
Intel Desktop Board DZ77SL-50K Technical Product Specification
22. Front Panel CIR Receiver (Input) Header ............................................ 49
23. LPC Debug Header ........................................................................... 50
24. Processor Core Power Connector........................................................ 51
25. Main Power Connector ...................................................................... 51
26. Front Panel Header .......................................................................... 52
27. States for a One-Color Power LED ...................................................... 53
28. States for a Two-Color Power LED ...................................................... 53
29. Alternate Front Panel Power/Sleep LED Header
30. BIOS Setup Configuration Jumper
31. Recommended Power Supply C
Settings.......................................... 56
urrent Values (High Power) .................... 58
.................................... 53
32. Recommended Power Supply Current Values (Low Power) ..................... 58
33. Fan Header Current Capability ........................................................... 59
34. Thermal Considerations for Components ............................................. 61
35. Tcontrol Values for Components ........................................................ 61
36. Environmental Specifications ............................................................. 62
37. BIOS Setup Program Menu Bar .......................................................... 64
38. BIOS Setup Program
39. Acceptable Drives/Media Types for BIOS Recovery
Function Keys ................................................... 64
............................... 67
40. Boot Device Menu Options ................................................................ 68
41. Supervisor and User Password Functions ............................................ 70
42. BIOS Beep Codes ............................................................................ 73
43. Front-panel Power LED Blink Codes
.................................................... 74
44. BIOS Error Messages ....................................................................... 74
45. Port 80h POST Code Ranges ............................................................. 75
46. Port 80h POST Codes ....................................................................... 76
47. Typical Port 80h POST Sequence ....................................................... 80
48. Safety Standards ............................................................................. 81
49. EMC Regulations ............................................................................. 87
50. Regulatory Compliance Marks ........................................................... 90
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor Processor
Memory
Chipset
Graphics
Audio
ATX (12 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
rd
• 3
generation Intel® Core processor family and 2nd generation Intel® Core
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support ― Integrated graphics processing (processors with Intel ― External graphics interface controller
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz to +2667 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3 processor family processors
®
Z77 Express Chipset consisting of the Intel
Intel Controller Hub (PCH)
• Integrated graphics support for processors with Intel HD Graphics: ― High Definition Multimedia Interface* (HDMI*) v1.4a
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
• 8-channel (5+1) Intel High Definition Audio via the Realtek* ALC662 audio
• 8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
processor family processors
codec
(HDMI*)
®
HD Graphics)
rd
generation Intel Core
®
Z77 Express Platform
rd
generation Intel Core
continued
11
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral Interfaces
Expansion Capabilities
BIOS
Instantly Available PC Technology
LAN Support
Legacy I/O Control Nuvoton NCT6776D I/O controller for CIR, PS/2 port, and hardware management
Hardware Monitor Subsystem
• Four USB 3.0 ports:
― Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
― Two front panel USB 3.0 ports are implemented through one internal
connector (blue)
• Eight USB 2.0 ports:
― Four ports implemented with stacked back panel connectors (black) ― Four front panel ports implemented through two internal headers
• Six Serial ATA (SATA) ports:
― Two SATA 6.0 Gb/s interfaces through the Intel Z77 Express Chipset with
®
Rapid Storage Technology RAID support (blue)
Intel
― Three internal SATA 3.0 Gb/s interfaces through Intel Z77 Express Chipset
with Intel Rapid Storage Technology RAID support (black)
― One back panel eSATA port (red)
• PS/2*-style keyboard/mouse port
• One PCI Express 3.0 x16 add-in card connector
• One PCI Express 2.0 x4 bus add-in card connector from the PCH
• One PCI Express 2.0 x1 bus add-in card connector from the PCH
• Three Conventional PCI bus add-in card connectors from the PCH via a PCI
bridge
rd
Note: PCI Express 3.0 is only supported by 3
generation Intel Core
processor family processors
®
• Intel
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
• Support for PCI Express* Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, Consumer Infrared (CIR), PS/2,
and USB ports
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel Ethernet Controller
support
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
®
82579V Gigabit
12
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DZ77SL-50K.
Product Description
13
Figure 1. Major Board Components
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout from Figure 1 Des
A Conventional PCI add-in card connector B Conventional PCI add-in card connector C Conventional PCI add-in card connector D Front panel USB 3.0 connector (blue) E PCI Express x4 add-in card connector F Rear chassis fan header G PCI Express x16 add-in card connector H PCI Express x1 add-in card connector I Back panel connectors J 12 V processor core voltage connector (2 x 4 pin) K LGA1155 processor socket L Processor fan header M DIMM 3 (Channel A DIMM 0) N DIMM 1 (Channel A DIMM 1) O DIMM 4 (Channel B DIMM 0) P DIMM 2 (Channel B DIMM 1) Q Front chassis fan header R Consumer IR receiver (input) header S Consumer IR emitter (output) header T Main power connector (2 x 12) U BIOS Setup configuration jumper block V Intel Z77 Express Chipset W SATA 6.0 Gb/s connector through the PCH (blue) X SATA 3.0 Gb/s connector through the PCH (black) Y SATA 3.0 Gb/s connector through the PCH (black) Z Chassis intrusion header AA Low Pin Count (LPC) Debug header BB Alternate front panel power/sleep LED header CC Front panel header DD Front panel USB 2.0 connectors EE Piezoelectric speaker FF Battery GG Power fault LED HH Standby power LED II S/PDIF out header JJ Front panel audio header
cription
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
15
Figure 2. Block Diagram
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DZ77SL-50K http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel
Desktop Board DZ77SL-50K
Supported processors http://processormatc Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
h.intel.com
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors.
Other processors may be supported in the future. This board supports processors with a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed above are only supported when falling within the wattage requirements of Intel Desktop Board DZ77SL-50K. See the Intel web site listed below for the most up-to­date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 58 for information on power supply requirements for this board.
16
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI Express x16 add-in graphics card.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
nd
⎯ DirectX* 11 (2
generation Intel Core processor family processors support
CS4.0 only) support
⎯ OpenGL* 3.0 support ⎯ Shader Model 4.0
⎯ High-Definition content at up to 1080p resolution ⎯ Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
⎯ Intel
®
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video) Note: Intel Quick Sync is enabled with the appropriate software application
⎯ Blu-ray* S3D via HDMI 1.4a ⎯ Dynamic Video Memory Technology (DVMT) 5.0 support ⎯ Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
17
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.3.1.2 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x, and 1.x and 2
nd
generation Intel Core processor family processors support PCI
Express 2.x and 1.x:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of 32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of 16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of 8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
18
Product Description
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1066 MHz to +2667 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIMMs are only supported by 3
processor family processors
• XMP version 1.3 performance profile support for memory speeds up to +2667 MHz
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
SDRAM Density
DIMM Capacity Configuration
1024 MB SS 1 Gbit 128 M x8/empty 8 2048 MB DS 1 Gbit 128 M x8/128 M x8 16 2048 MB SS 2 Gbit 256 M x8/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x8 16 4096 MB SS 4 Gbit 512 M x8/empty 8 8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
(Note)
SDRAM Organization Front-side/Back-side
/CS-025414.htm
Number of SDRAM Devices
19
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
20
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if installing only two DIMMs on your board.
21
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.5 Intel® Z77 Express Chipset
Intel Z77 Express Chipset with Intel Flexible Display Interconect (Intel FDI) and Direct Media Interface (DMI) interconnect provides interfaces to the processor and the display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel Z77 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel Z77 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the memory interface, display planes, and pipes while the PCH has transcoder and display interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects the display engine in the processor with the display interfaces on the PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcoded as per the display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized copy or unreceptive between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDMI).
22
Product Description
1.5.2.3 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi­channel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI interface supports the HDMI 1.4a specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the HDMI port will behave as described in Table 4.
Table 4.
PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled PCI Express x16 add-in card installed Enabled
Note: May require BIOS setup menu changes.
HDMI Port Status Conditions
(Note)
1.5.2.4 Integrated Audio Provided by the HDMI Interface
The HDMI interface from the PCH supports audio. Table 5 shows the specific audio technologies supported by the PCH.
Table 5. Audio Formats Supported by the HDMI Interface
Audio Formats HDMI 1.4a
AC-3 - Dolby* Digital Yes Dolby Digital Plus Yes DTS-HD* Yes LPCM, 192 kHz/24 bit, 8 Channel Yes
23
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.5.3 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to 480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host controller which supports USB 3.0 ports. This controller allows data transfers up to 5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS), and low-speed (LS) traffic on the bus.
The board supports up to eight USB 2.0 ports and four USB 3.0 ports. The Intel Z77 Express Chipset provides the USB controller for the 2.0/3.0 ports. The
port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Four USB 2.0 front panel ports are implemented through two internal headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 44 The location of the front panel USB headers Figure 10, page 45
1.5.4 SATA Interfaces
The board provides six SATA connectors, through the PCH, which support one device each:
• Two SATA 6.0 Gb/s interfaces through the Intel Z77 Express Chipset with Intel
Rapid Storage Technology RAID support (blue)
• Three internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel Z77 Express
Chipset with Intel Rapid Storage Technology RAID support (black)
• One back panel eSATA port (red) The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used for host to device connections.
®
The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0 Specification, Revision 1.0 (AHCI support is required for some elements).
The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE
24
Product Description
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 7 operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 45
.
1.5.4.1 SATA RAID
The board supports Intel Rapid Storage Technology which provides the following RAID (Redundant Array of Independent Drives) levels via the Intel Z77 Express Chipset:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.5.4.2 Intel® Smart Response Technology
Intel® Smart Response Technology is a disk caching solution that can provide improved computer system performance with improved power savings. It allows configuration of a computer system with the advantage of having HDDs for maximum storage capacity with system performance at or near SSD performance levels.
For more information on Intel Smart Response Technology, go to
http://www.intel.com/support/chipsets/sb/CS-032826.htm
NOTE
In order to use supported RAID and Intel Smart Response Technology features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Microsoft Windows 7 includes the necessary RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system installation process.
25
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• PS/2-style keyboard/mouse port
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.7.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models.
The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for this feature to work.
26
Product Description
1.8 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following:
• Intel Z77 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• A signal-to-noise (S/N) ratio of 95 dB.
• Windows Vista Ultimate and Windows 7 Ultimate certification.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support
Audio Jack
Front panel – Green Default Front panel – Pink Default Back panel – Blue Default Back panel – Green (ctrl panel) Default Back panel – Pink Default
Micro­phone Headphones
Line Out
(Front Spks)
Line In
(Surround)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
Mic-In
(Center/Sub)
27
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors). The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Line in/surround B Line out/front speakers C Mic in/center/sub
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 45 The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 47 The back panel audio connectors Section 2.2.1, page 44
28
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel Z77 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.9.1 Intel® 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state ⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
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Intel Desktop Board DZ77SL-50K Technical Product Specification
1.9.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green) B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 7 describes the LED states when the board is powered up and the LAN subsystem is operating.
Table 7. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established. Blinking LAN activity is occurring. Off 10 Mb/s data rate is selected. Green 100 Mb/s data rate is selected. Yellow 1000 Mb/s data rate is selected.
30
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton NCT6776D device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP,
PCH VCC
• SMBus interface
and
1.10.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party software.
For information about Refer to
The functions of the fan headers Section 1.11.2.2, page 36
1.10.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 45
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Intel Desktop Board DZ77SL-50K Technical Product Specification
1.10.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header B Thermal diode, located on the processor die C Processor fan header D Front chassis fan header E Thermal diode, located on the Intel Z77 PCH
Figure 6. Thermal Sensors and Fan Headers
32
Product Description
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support ⎯ Wake from PS/2 devices ⎯ Wake from Consumer IR ⎯ Wake from S5 ⎯ Power Supervisor ⎯ +5 V Standby Power Indicator LED
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 10 on page 35)
• Support
Table 8 lists the system states based on how long the po depending on how ACPI is configured with an ACPI-aware operating system.
Table 8. Effects of Pressing the Power Switch
If the system is in this state…
Off (ACPI G2/G5 – Soft off) On (ACPI G0 – working state) On (ACPI G0 – working state) Sleep (ACPI G1 – sleeping state) Sleep (ACPI G1 – sleeping state)
for a front panel power and sleep mode switch
wer switch is pressed,
…and the power switch is pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than six seconds Fail safe power-off
Less than four seconds Wake-up
More than six seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
33
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.11.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Table 9 lists the power states supported by the
board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.
Table 9. Power States and Targeted System Power
Global States Sleeping States
G0 – working state
G1 – sleeping state
G1 – sleeping state
G2/S5 S5 – Soft off.
G3 – mechanical off
AC power is disconnected from the computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
S0 – working C0 – working D0 – working
S3 – Suspend to RAM. Context saved to RAM.
S4 – Suspend to disk. Context saved to disk.
Context not saved. Cold boot is required.
No power to the system.
Processor States
No power D3 – no power
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
except for wake-up logic.
except for wake-up logic.
except for wake-up logic.
wake-up logic, except when provided by battery or external source.
Targeted System Power
Full power > 30 W
Power < 5 W
Power < 5 W
Power < 5 W
No power to the system. Service can be performed safely.
(Note 1)
(Note 2)
(Note 2)
(Note 2)
34
Product Description
1.11.1.2 Wake-up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch RTC alarm LAN USB S3 PME# signal
WAKE# PS/2 devices
Consumer IR S3, S4, S5
Notes:
1. S4 implies operating system support only.
2. Wake from S4 and S5 is recommended by Microsoft.
3. PS/2 wake from S5 has a selection in the BIOS to enable wake from a combination key (Alt + Print
Screen) or the keyboard power button.
NOTE
S3, S4, S5 S3, S4, S5 S3, S4, S5
S3, S4, S5 S3, S4, S5
S3, S4, S5
Note 1)
(
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Notes 1 and 3)
(Note 2)
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.
1.11.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• Power Management Event signal (PME#) wake-up support
• PCI Express WAKE# signal support
• Wake from PS/2 devices
• Wake from Consumer IR
• Wake from S5
• Power Supervisor
• +5 V Standby Power Indicator LED
35
Intel Desktop Board DZ77SL-50K Technical Product Specification
LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.
1.11.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 10, page 45 The signal names of the main power connector Table 25, page 51
1.11.2.2 Fan Headers
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state
• The fans are off when the board is off or in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• The fan headers are controlled by Pulse Width Modulation
For information about Refer to
The location of the fan headers Figure 10, page 45 The location of the fan headers and sensors for thermal monitoring Figure 6, page 32
36
Product Description
1.11.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways:
• The PCI Express WAKE# signal
• By Ping
• Magic Packet
• The onboard LAN subsystem
1.11.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to­RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 10 on page 35 lists the devices and events that can wake the co
The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and PCI Express add-in cards and drivers.
mputer from the S3 state.
37
Intel Desktop Board DZ77SL-50K Technical Product Specification
1.11.2.5 Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.11.2.6 PME# Signal Wake-up Support
When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.11.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.
1.11.2.8 Wake from PS/2 Devices
PS/2 keyboard activity wakes the computer from an ACPI S3, S4, or S5 state. However, when the computer is in an ACPI S4 or S5 state, the only PS/2 activity that will wake the computer is the Alt + Print Screen or the Power Key available only on some keyboards.
1.11.2.9 Wake from Consumer IR
CIR activity wakes the computer from an ACPI S3, S4, or S5 state.
1.11.2.10 Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.
1.11.2.11 Power Supervisor
The Power Supervisor actively monitors the input voltages from the power supply and protects the board and any attached peripherals from electrical overstress and possible physical damage. The Power Supervisor will activate if it detects the power supply voltage rails have deviated outside the current ATX power supply specification and safe operating levels.
If the Power Supervisor detects an out of spec voltage, the following will happen:
1. The board will be powered down immediately to protect circuits from electrical
overstress and possible physical damage.
2. A red warning LED (see Figure 1, FF) on the board will activate as a visual cue.
3. D
uring the next power on, a message will be displayed on the screen to notify the user that the power supply voltage rails have deviated outside the current ATX power supply specification and safe operating levels.
4. A message will be added to the BIOS Event Log for each event that takes place
until the BIOS Event Log is cleared.
38
Product Description
1.11.2.12 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power LED
39
Intel Desktop Board DZ77SL-50K Technical Product Specification
40
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 32 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (32 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of t
he system memory map. All installed system memory can be used when there is no
overlap of system addresses.
41
Intel Desktop Board DZ77SL-50K Technical Product Specification
Figure 8. Detailed System Memory Address Map
42
2.1.2 Memory Map
Table 11 lists the system memory map.
Table 11. System Memory Map
Technical Reference
Address Range (decimal)
1024 K - 33550336 K 100000 – 7FFC00000 32764 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Address Range (hex)
Size Description
memory (open to the PCI Conventional bus). Dependent on video adapter used.
memory manager software)
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front panel USB and PS/2.
The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into these groups:
• Back panel I/O connectors
• Component-side connectors and headers (see page 45)
43
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.2.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors for the board.
Item Description
A PS/2 ports B USB 2.0 ports C USB 2.0 ports D eSATA connector E HDMI connector F LAN port G USB 3.0 ports H Line in/surround I Line out/front speakers J Mic-in/center/sub
Figure 9. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
44
Technical Reference
2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
45
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 12 lists the component-side connectors and headers
identified in Figure 10.
Table 12. Component-side Connectors and Headers Shown in Figure 10
Item/callout f rom Figure 10 Des
A Conventional PCI add-in card connector B Conventional PCI add-in card connector C Conventional PCI add-in card connector D Front panel USB 3.0 connector (blue) E PCI Express x4 add-in card connector F Rear chassis fan header G PCI Express x16 add-in card connector H PCI Express x1 add-in card connector I 12 v processor core voltage connector (2 x 4 pin) J Processor fan header K Front chassis fan header L Consumer IR receiver (input) header M Consumer IR emitter (output) header N Main power connector (2 x 12) O SATA 6.0 Gb/s connector through the PCH (blue) P SATA 3.0 Gb/s connector through the PCH (black) Q SATA 3.0 Gb/s connector through the PCH (black) R Chassis intrusion header S Alternate front panel power/sleep LED header T Front panel header U LPC Debug header V Front panel USB 2.0 header W Front panel USB 2.0 header X S/PDIF out header Y Front panel audio header
cription
46
Technical Reference
2.2.2.1 Signal Tables for the Connectors and Headers
Table 13. Front Panel Audio Header for Intel HD Audio
Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 14. Front Panel Audio Header for AC ’97 Audio
Pin Signal Name Pin Signal Name
1 MIC 2 AUD_GND 3 MIC_BIAS 4 AUD_GND 5 FP_OUT_R 6 FP_RETURN_R 7 AUD_5V 8 KEY (no pin) 9 FP_OUT_L 10 FP_RETURN_L
Table 15. Front Panel USB 2.0 Headers
Pin Signal Name Pin Signal Name
1 +5 V DC 2 +5 V DC 3 D- 4 D­5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect
47
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 16. Front Panel USB 3.0 Connector
Pin Signal Name Description
1 Vbus Power 2 IntA_P1_SSRX− USB3 ICC Port1 SuperSpeed Rx− 3 IntA_P1_SSRX+ USB3 ICC Port1 SuperSpeed Rx+ 4 GND Ground 5 IntA_P1_SSTX− USB3 ICC Port1 SuperSpeed Tx− 6 IntA_P1_SSTX+ USB3 ICC Port1 SuperSpeed Tx+ 7 GND Ground 8 IntA_P1_D− USB3 ICC Port1 D− (USB2 Signal D−) 9 IntA_P1_D+ USB3 ICC Port1 D+ (USB2 Signal D+) 10 ID Over Current Protection 11 IntA_P2_D+ USB3 ICC Port2 D+ (USB2 Signal D+) 12 IntA_P2_D− USB3 ICC Port2 D− (USB2 Signal D−) 13 GND Ground 14 IntA_P2_SSTX+ USB3 ICC Port2 SuperSpeed Tx+ 15 IntA_P2_SSTX− USB3 ICC Port2 SuperSpeed Tx− 16 GND Ground 17 IntA_P2_SSRX+ USB3 ICC Port2 SuperSpeed Rx+ 18 IntA_P2_SSRX− USB3 ICC Port2 SuperSpeed Rx+ 19 Vbus Power
Table 17. SATA Connectors
Pin Signal Name
1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground
Table 18. S/PDIF Header
Pin Signal Name
1 Ground 2 S/PDIF out 3 Key (no pin) 4 +5 V DC
48
Table 19. Chassis Intrusion Header
Pin Signal Name
1 Intruder# 2 Ground
Table 20. Processor, Front, and Rear Chassis
(4-Pin) Fan Headers
Pin Signal Name
1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
(Note)
Table 21. Back Panel CIR Emitter (Output) Header
Technical Reference
Pin Signal Name
1 Emitter out 1 2 Emitter out 2 3 Ground 4 Key (no pin) 5 Jack detect 1 6 Jack detect 2
Table 22. Front Panel CIR Receiver (Input) Header
Pin Signal Name
1 Ground 2 LED 3 NC 4 Learn-in 5 5 V standby 6 VCC 7 Key (no pin) 8 CIR Input
49
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 23. LPC Debug Header
Pin Signal Name Pin Signal Name
1 CK_33M_DEBUG 2 GND 3 PLTRST# 4 LFRAME# 5 LAD0 6 LAD1 7 LAD2 8 LAD3 9 GND 10 GND 11 +3.3 V 12 +3.3 V 13 Key (no pin) 14 +3.3 V
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• One PCI Express x16 (3.0/2.x/1.x)
• One PCI Express x4 (2.x/1.x)
• One PCI Express x1 (2.x/1.x)
• Three Conventional PCI (rev 2.3)
Note the following considerations for the Conventional PCI bus connectors:
• The Conventional PCI bus connectors are bus master capable.
• SMBus signals are routed to the Conventional PCI bus connectors. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41.
NOTE
PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors.
50
Technical Reference
2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable to the main power connector, leaving pins 11, 12, 23, and 24 unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.
Table 24. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground 3 +12 V 4 +12 V
Table 25. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 12
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
+12 V 2 x 12 connector detect
(Note)
(Note)
23 24
(Note)
+5 V Ground
(Note)
For information about Refer to
Power supply considerations Section 2.5.1 on page 58
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Intel Desktop Board DZ77SL-50K Technical Product Specification
2.2.2.4 Front Panel Header
This section describes the functions of the front panel header. Table 26 lists the signal names of the front panel header. Figure 11 is a connection diagram for the header.
Table 26. Front Panel Header
Pin Signal Name Description Pin Signal Name Description
1 HDD_POWER_LED Pull-up resistor (750
Ω) to +5V
3 HDD_LED# [Out] Hard disk
activity LED 5 GROUND Ground 6 POWER_SWITCH# [In] Power switch 7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground 9 +5V_DC Power 10 Key No pin
2 POWER_LED_MAIN [Out] Front panel LED
(main color)
4 POWER_LED_ALT [Out] Front panel LED
(alt color)
front panel
Figure 11. Connection Diagram for Front Panel Header
2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.
52
Technical Reference
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 27 shows the possible states for a o
ne-color LED. Table 28 shows the possible states for a two-color
LED.
Table 27.
LED State Description
Off Power off/sleeping Steady Green Running
States for a One-Color Power LED
Table 28. States for a Two-Color Power LED
LED State Description
Off Power off Steady Green Running Steady Yellow Sleeping
NOTE
The colors listed in Table 27 and Table 28 are suggested colors only. Actual LED colors are chassis-specific.
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.
2.2.2.5 Alternate Front Panel Power/Sleep LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.
Table 29. Alternate Front Panel Power/Sleep LED Header
Pin Signal Name Description
1 POWER_LED_MAIN [Out] Front panel LED (main color) 2 Key (no pin) 3 POWER_LED_ALT [Out] Front panel LED (alt color)
53
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.2.2.6 Front Panel USB 2.0 Headers
Figure 12 is a connection diagram for the front panel USB 2.0 headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for
high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB 2.0 Headers
54
Technical Reference
2.3 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 13 shows the location of the jumper block. the BIOS Setup program’s mode. Table 30 describes the jumper settings for the three modes: no and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.
rmal, configure, and recovery. When the jumper is set to configure mode
The 3-pin jumper block determines
55
Figure 13. Location of the Jumper Block
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 30. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal
Configure
1-2
2-3
The BIOS uses current configuration information and passwords for booting.
After the POST runs, Setup runs automatically. The maintenance menu is displayed.
Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values.
Recovery
None
The BIOS attempts to recover the BIOS configuration. A recovery CD or flash drive is required.
56
Technical Reference
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12 inches by 9.60 inches [304.80 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.
57
Figure 14. Board Dimensions
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 V DC and +5 V DC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a high power system consisting of a supported 95 W processor (see Section 1.3 on page 16 for a list of supported processors),
4 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 460 W. Table 31 lists possible recommended power supply current rail values.
Table 3
Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Current 22 A 20 A 20 A 20 A 0.3 A 2.5 A
1. Recommended Power Supply Current Values (High Power)
For example, for a low power system consisting of a supported 35 W processor (see Section 1.3 on page 16 for a list of supported processors),
2 GB DDR3 RAM, integrated graphics, one SSD, one optical drive, and no extra onboard peripherals enabled, the minimum recommended power supply is a 180 W. Table 32 lists possible recommended power supply current rail values.
Note: If the correct power supply and
system configuration is used, a smaller power supply will work.
Table 32. Recommended Power Supply Current Values (Low Power)
Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Current 16 A 16 A 12 A N/A 0.3 A 1.5 A
For information about Refer to
Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb
/CS-026472.htm
58
Technical Reference
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.
Table 33 lists the current capabi
Table 33. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A
lity of the fan headers.
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots filled) must not exceed the system’s power supply +5 V maximum current or 14 A in total.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 120 an open chassis.
Figure 15 shows the locations of the localized high temperature zones.
o
C in
Figure 15. Localized High Temperature Zones
60
Item Description
A Processor voltage regulator area B Processor C Intel Z77 Express Chipset
Technical Reference
Table 34 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.
Table 34. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel Z77 Express Chipset 104 oC
To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 34. This is a requirement for sustained power
dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol.
Table 35. Tcontrol Values for Components
Component Tcontrol
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel Z77 Express Chipset 104 oC
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 16 Intel Z77 Express Chipset http://www.intel.com/products/desktop/
chipsets/
61
Intel Desktop Board DZ77SL-50K Technical Product Specification
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board DZ77SL-50K is 255,651 hours.
2.8 Environmental
Table 36 lists the environmental specifications for the board.
Table 36. Environmental Specifications
Parameter Specification Temperature
Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-20 °C to +70 °C 0 °C to +55 °C
62
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as
When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Exit
SLZ7710H.86A.
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 55 shows how to put the board in configure mode.
63
Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 37 lists the BIOS Setup program menu features.
Table 37.
Maintenance Main
Clears passwords and displays processor information
BIOS Setup Program Menu Bar
Displays processor and memory configuration
Configura­tion
Configures advanced features available through the chipset
Performance Security Power
Configures Memory, Bus and Processor overrides
Sets passwords and security features
Table 38 lists the function keys available for menu screens.
Table 38. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<←> or <→> <↑> or <↓> <Tab> Selects a field (Not implemented) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current values and exits the BIOS Setup program <Esc> Exits the menu
Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down)
Configures power management features and power supply controls
Boot
Selects boot options
Exit
Saves or discards changes to Setup program options
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB) flash memory device.
3.3 Resource Configuration
3.3.1 PCI Express Autoconfiguration
The BIOS can automatically configure PCI Express devices. PCI Express devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI Express cards without having to configure the system. When a user turns on the system after adding a PCI Express card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.
64
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel
Toolkit.
®
Integrator
65
Intel Desktop Board DZ77SL-50K Technical Product Specification
To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:
• Intel
• Intel
Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
®
Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
®
Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm.
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.
66
Overview of BIOS Features
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software tools http://developer.intel.com/design/motherbd/software.htm
Refer to
3.7 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 39 lists the drives and media types that can and ca to be made bootable.
nnot be used for BIOS recovery. The BIOS recovery media does not need
Table 39. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the SATA interface Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive No
For information about Refer to
BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm
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Intel Desktop Board DZ77SL-50K Technical Product Specification
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.
3.8.1 Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 40 lists the boot device menu options.
Table 40.
Boot Device Menu Function Keys Description
<↑> or <↓> <Enter> Exits the menu, and boots from the selected device <Esc> Exits the menu and boots according to the boot priority
Boot Device Menu Options
Selects a default boot device
defined through BIOS setup
68
Overview of BIOS Features
3.9 Adjusting Boot Speed
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
• Enabling the Fast Boot feature
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds that minimizes hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot menu, enable the settings for Fast Boot. This option will allow BIOS to
skip through various stages of POST and boot quickly to the last detected boot device.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).
69
Intel Desktop Board DZ77SL-50K Technical Product Specification
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 41 shows the effects of setting the s
upervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 41. Supervisor and User Password Functions
Password Set
Neither Can change all
Supervisor only
User only N/A Can change all
Supervisor and user set
Note: If no password is set, any user can change all Setup options.
Supervisor Mode
options Can change all
options
Can change all options
(Note)
User Mode
Can change all options
Can change a limited number of options
options Can change a
limited number of options
(Note)
Setup Options
None None None
Supervisor Password Supervisor None
Enter Password Clear User Password
Supervisor Password Enter Password
Password to Enter Setup
User User
Supervisor or user
Password During Boot
Supervisor or user
70
Overview of BIOS Features
NOTE
The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines / Recommendations of the National Institute of Standards and Technology. Refer to
http://csrc.nist.gov/publications/nistpub
more information.
s/800-147/NIST-SP800-147-April2011.pdf for
3.11 BIOS Performance Features
The BIOS includes the following options to provide custom performance enhancements when using 3 processor family processors in an LGA1155 socket.
• Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted
down)
• Memory multiplier adjustment
• Memory voltage adjustment
• Graphics multiplier adjustment
rd
generation Intel Core processor family and 2nd generation Intel Core
71
Intel Desktop Board DZ77SL-50K Technical Product Specification
72
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information during POST.
For information about Refer to
The location of the onboard speaker Figure 1, page 13
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 42).
Table 42.
BIOS Beep Codes
Type Pattern Frequency
F2 Setup/F10 Boot Menu prompt
BIOS recovery progress update
BIOS recovery succeeded
BIOS recovery failure On 1.0 second then off for 0.5 seconds will
Video error On-off (1.0 second each) two times, then
Memory error On-off (1.0 second each) three times, then
Thermal trip warning Alternate high and low beeps (1.0 second each)
One 0.5 second beep when BIOS is ready to accept keyboard input
Rising and falling tones with on 0.5 seconds followed by off 0.25 seconds and repeat with next tone then 1 second off after highest tone then repeat sequence with falling tones.
Play 3 times for 0.5 seconds on then off for 0.25 seconds
repeat until system shutdown
2.5-second pause (off), entire pattern repeats (beeps and pause) once and the BIOS will continue to boot.
2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off.
for eight beeps, followed by system shut down.
932 Hz
139 Hz, 165 Hz, 196 Hz, 262 Hz, 262 Hz, 196 Hz, 165 Hz, 139 Hz
139 Hz
110 Hz
932 Hz When no VGA option ROM is found.
932 Hz
High beep 2000 Hz Low beep 1500 Hz
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Intel Desktop Board DZ77SL-50K Technical Product Specification
4.3 Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 43).
Table 43.
Front-panel Power LED Blink Codes
Type Pattern Note
F2 Setup/F10 Boot Menu Prompt
BIOS update in progress Off when the update begins, then on for
Video error On-off (1.0 second each) two times, then
Memory error On-off (1.0 second each) three times, then
Thermal trip warning Each beep will be accompanied by the following
None
0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.
2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off.
2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off.
blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.
4.4 BIOS Error Messages
When no VGA option ROM is found.
Table 44 lists the error messages and provides a brief description of each.
Table 44. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
74
Error Messages and Beep Codes
4.5 Port 80h Power On Self Test (POST) Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes on a medium such as a seven-segment display, requires a POST card that can interface with the Low Pin Count (LPC) Debug header or a POST card that can be installed in one of the Conventional PCI connectors. Refer to the location of the LPC Debug header in Figure 1.
T
he following tables provide information about the POST codes generated by the BIOS:
• Table 45 lists the Port 80h POST code ranges
• Table 46 lists the Port 80h POST codes themselves
• Table 47 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 45. Port 80h POST Code Ranges
Range Subsystem
0x00 – 0x05 Entering SX states S0 to S5. 0x10, 0x20, 0x30,
0x40, 0x50 0x08 – 0x0F Security (SEC) phase 0x11 – 0x1F PEI phase pre MRC execution 0x21 – 0x29 MRC Memory detection 0x2A – 0x2F PEI phase post MRC execution 0x31 – 0x35 Recovery 0x36 – 0x3F Platform DXE driver 0x41 – 0x4F CPU Initialization (PEI, DXE, SMM) 0x50 – 0x5F I/O Buses: PCI, USB, ISA, ATA etc. 0x5F is an unrecoverable error. Start with PCI. 0x60 – 0x6F BDS 0x70 – 0x7F Output Devices: All output consoles. 0x80 – 0x8F For future use 0x90 – 0x9F Input devices: Keyboard/Mouse. 0xA0 – 0xAF For future use 0xB0 – 0xBF Boot Devices: Includes fixed media and removable media. Not that critical since
0xC0 – 0xCF For future use 0xD0 – 0xDF For future use 0xF0 – 0xFF
Resuming from SX states. 0x10 – S1, 0x20 – S2, 0x30 – S3, etc.
consoles should be up at this point.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 46. Port 80h POST Codes
Port 80 Code Progress Code Enumeration
ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state 0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5 Security Phase (SEC) 0x08 Starting BIOS execution after CPU BIST 0x09 SPI prefetching and caching 0x0A Load BSP microcode 0x0B Load APs microcodes 0x0C Platform program baseaddresses 0x0D Wake Up All APs 0x0E Initialize NEM 0x0F Pass entry point of the PEI core PEI before MRC PEI Platform driver 0x11 Set bootmode, GPIO init 0x12 Early chipset register programming including graphics init 0x13 Basic PCH init, discrete device init (1394, SATA) 0x14 LAN init 0x15 Exit early platform init driver PEI SMBUS 0x16 SMBUSriver init 0x17 Entry to SMBUS execute read/write 0x18 Exit SMBUS execute read/write PEI CK505 Clock Programming 0x19 Entry to CK505 programming 0x1A Exit CK505 programming PEI Over-Clock Programming 0x1B Entry to entry to PEI over-clock programming 0x1C Exit PEI over-clock programming Memory 0x21 MRC entry point 0x23 Reading SPD from memory DIMMs 0x24 Detecting presence of memory DIMMs 0x27 Configuring memory 0x28 Testing memory 0x29 Exit MRC driver
continued
76
Error Messages and Beep Codes
Table 46. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
PEI after MRC 0x2A Start to Program MTRR Settings 0x2B Done Programming MTRR Settings PEIMs/Recovery 0x31 Crisis Recovery has initiated 0x33 Loading recovery capsule 0x34 Start recovery capsule/ valid capsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEI SMM Phase 0x44 Begin CPU SMM Init smm relocate bases 0x45 Smm relocate bases for APs 0x46 End CPU SMM Init CPU DXE Phase 0x47 CPU DXE Phase begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed 0x4A Initialize strings to HII database 0x4B Initialize MP Support 0x4C CPU DXE Phase End CPU DXE SMM Phase 0x4D CPU DXE SMM Phase begin 0x4E Relocate SM bases for all APs 0x4F CPU DXE SMM Phase end IO BUSES 0x50 Enumerating PCI buses 0x51 Allocating resources to PCI bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA/ATAPI/SATA 0x5A Resetting PATA/SATA bus and all devices 0x5B Reserved for ATA
continued
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Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 46. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
BDS 0x60 BDS driver entry point initialize 0x61 BDS service routine entry point (can be called multiple times) 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 0x6A BDS Step10 0x6B BDS Step11 0x6C BDS Step12 0x6D BDS Step13 0x6E BDS Step14 0x6F BDS return to DXE core (should not get here) Keyboard (PS2 or USB) 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the keyboard 0x94 Clearing keyboard input buffer 0x95 Instructing keyboard controller to run Self Test (PS2 only) Mouse (PS2 or USB) 0x98 Resetting mouse 0x99 Detecting mouse 0x9A Detecting presence of mouse 0x9B Enabling mouse Fixed Media 0xB0 Resetting fixed media 0xB1 Disabling fixed media
0xB2 Detecting presence of a fixed media (IDE hard drive detection etc.) 0xB3 Enabling/configuring a fixed media
continued
78
Error Messages and Beep Codes
Table 46. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection
etc.) 0xBB Enabling/configuring a removable media DXE Core 0xE4 Entered DXE phase BDS 0xE7 Waiting for user input 0xE8 Checking password 0xE9 Entering BIOS setup 0xEB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot 0xF8 EFI boot service ExitBootServices ( ) has been called 0xF9 EFI runtime service SetVirtualAddressMap ( ) has been called
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Intel Desktop Board DZ77SL-50K Technical Product Specification
Table 47. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application processor initialization 13 SMM initialization 50 Enumerating PCI buses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot
80
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Intel Desktop Board DZ77SL-50K:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards
Intel Desktop Board DZ77SL-50K complies with the safety standards stated in Table 48 when correctly installed in a compatible host system.
Table 4
Standard Title
CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General
EN 60950-1 Information Technology Equipment – Safety - Part 1: General
IEC 60950-1 Information Technology Equipment – Safety - Part 1: General
8. Safety Standards
Requirements (USA and Canada)
Requirements (European Union)
Requirements (International)
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Intel Desktop Board DZ77SL-50K Technical Product Specification
5.1.2 European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DZ77SL-50K is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk D 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.
ette produktet er i henhold til bestemmelsene i det europeiske direktivet
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Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/ details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰 当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
/product_ecology
product_ecology for the
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Intel Desktop Board DZ77SL-50K Technical Product Specification
Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology
para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.
Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.
日本語 インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
pour en
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology
untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology
(em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.
84
Regulatory Compliance and Battery Disposal Information
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology
за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
5.1.4 China RoHS
Intel Desktop Board DZ77SL-50K is a China RoHS-compliant product. The China Ministry of Information Industry (MII) stipulates that a material Self
Declaration Table (SDT) must be included in a product’s user documentation. The SDT for Intel Desktop Board DZ77SL-50K is shown in Figure 16.
Figure 16. Intel Desktop Board DZ77SL-50K China RoHS Material
86
Self Declaration Table
Regulatory Compliance and Battery Disposal Information
5.1.5 EMC Regulations
Intel Desktop Board DZ77SL-50K complies with the EMC regulations stated in Table 49 when correctly installed in a compatible host system.
Table 49. EMC Regulations
Regulation Title
FCC 47 CFR Part 15, Subpart B
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada) EN55022 Limits and methods of measurement of Radio Interference Characteristics
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
EN55022 Australian Communications Authority, Standard for Electromagnetic
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
KN-22, KN-24 Korean Communications Commission – Framework Act on
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA)
of Information Technology Equipment. (European Union)
methods of measurement. (European Union)
Compatibility. (Australia and New Zealand)
Information Technology Equipment. (International)
Methods of Measurement. (International)
(Japan)
Telecommunications and Radio Waves Act (South Korea)
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.
88
Regulatory Compliance and Battery Disposal Information
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP
Compliance
The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.
Intel Desktop Board DZ77SL-50K meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:
• Energy Star v5.0, category D
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP) Lot 6
NOTE
Energy Star compliance is based at the system level not the board level. Use of an Intel Desktop Board alone does not guarantee Energy Star compliance.
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable­product-policy/ecodesign/index_en.htm
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Intel Desktop Board DZ77SL-50K Technical Product Specification
5.1.7 Regulatory Compliance Marks (Board Level)
Intel Desktop Board DZ77SL-50K has the regulatory compliance marks shown in Table 50.
Table 50.
Regulatory Compliance Marks
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean Communications Commission) certification number: KCC-REM-CPU-DZ77SL-50K.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique UL recognized manufacturer’s logo, along with a flammability rating (solder side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.
V-0
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Regulatory Compliance and Battery Disposal Information
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel Desktop Board DZ77SL-50K Technical Product Specification
小心
如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保 規範來處理使用過的電池。
주의
배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야 하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다.
THẬN TRỌNG
Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa phương về môi trường.
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Regulatory Compliance and Battery Disposal Information
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