The Intel Desktop Board DQ87PG may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DQ87PG Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ87PG Technical Product
Specification
This product spec ification applies to only the standar d Intel® Desktop Board with BIOS identifier
PGQ8710H.86A.
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in home s , offices , schoo ls , com p uter room s , and sim ilar locati o ns . The
suitability of this product for other PC or embedded no n-PC app lic a tio ns or o ther e nviro nme nts , s uc h as
medical, industrial, alarm systems, te s t equipment, etc. may not be supported without further evaluation by
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to any such patents, trademarks, copyrights, or othe r intelle c tua l p ro perty rights.
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Designers must not rely on the absence or characteristic s of any feature s or instructions marked “reserved”
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conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defe c ts or error s know n as err ata , which may c ause the prod uc t to
deviate from published specifications . C urrent characterized errata are available on request.
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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
May 2013
Board Identification Information
Basic Desktop Board DQ87PG Identification Information
AA Revision BIOS Revision Notes
G74154 PGQ8710H.86A 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Q87 chipset used on this AA revis io n co ns is ts of the follo w i ng co mponent:
Device Stepping S-Spec Numbers
Intel Q87 Express Chipset C1 SR137
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See
motherboards/motherboards.html?wapkw=desktop+boardsfor the latest
A map of the resou r ces of the Intel Desk top Board
3
The features supported by the BIOS Setup program
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DQ87PG.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DQ87PG and its components to the vendors, system integrators, and other
engineers and technician s who need this level of information. It is specifical ly not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DQ87PG
4 A description of the BIOS error mes s a ges , beep codes, and POST codes
5 Regulatory comp lia nce and battery dis posal informati on
Typographical Conventions
®
Desktop
This section cont ains information abo u t t he conventions used in this sp ecification. No t
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
# Used after a signal name to identify an active-low sig nal (s uch as USB P0# )
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per sec ond
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadec ima l value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brand s and names tha t are the prop e rty of their
respective owners.
vi
Contents
Revision History
Board Identification Information .................................................................. iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Conventional PCI add-in card connector
B Conventional PCI add-in card connector
C Rear fan header
D S/PDIF out header
E PCI Express x16 add-in card connector
F Battery
G PCI Express x1 add-in card connector
H Back panel connectors
I Piezoelectric speaker
J 12 V processor core voltage connector (2 x 2)
K LGA1150 processor socket
L Power supervisor LED
M Processor fan header
N Standby power LED
O DIMM 3 (Channel A DIMM 0)
P DIMM 1 (Channel A DIMM 1)
Q DIMM 4 (Channel B DIMM 0)
R DIMM 2 (Channel B DIMM 1)
S Front fan header
T Main po we r connector (2 x 12)
U Front panel USB 3.0 connector
V Intel® Management Engine “M” state LED
W Intel Q87 Express Chipset
X Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header
Y Chas s is intrusion header
Z Alternate front panel power/slee p LED head er
AA Front panel connector
BB SATA 6.0 Gb/s connectors
CC BIOS Setup configuration jumper block
DD Front panel USB 2.0 connector
EE Front panel USB 2.0 connector
FF Front panel USB 2.0 connector
GG Serial port connector
HH Fro nt p ane l audio connector
II Internal mono speaker header
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
To find information about… Visit this World Wide Web site:
Intel Desktop Board DQ87PG http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
The board supports 4th generation Intel Core processors. Other processors may be
supported in the future. This board supports processors with a maximum wattage of
95 W Thermal Design Power (TDP). The processors listed above are only supported
when falling within the wattage requirements of Intel Desktop Board DQ87PG. See the
Intel web site listed below for the most up-to-date list of supported processors.
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply .
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 63 for information on power supply requirements for this board.
16
Product Description
(Note)
1.3.1 Processor Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
The board supports integrated graphics for processors with Intel HD Graphics.
1.3.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
DirectX* 11.1 support
OpenGL* 4.0 support
• Video
Next Generation Intel
video playback and enhancement fea tures tha t improve the end user’s viewing
experience
Encode/trans code HD content
Playback of high definition content incl uding Blu-ray* disc
Superior image quality with sharper, more colorful images
DirectX* Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2 HW Decode
®
Intel
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync Video is enabled by an appropriate software application.
®
Clear Video Technology HD support is a collection of
1.3.1.2 DisplayPort*
DisplayPort is a digital c ommunication interface that utilizes differential signali ng to
achieve a high bandwidth bus interfac e designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPo rt is suitable for display
connections betw een co n sum er el ectr on ics devices such as high definition optical disc
players, set top boxes, and TV displays. DisplayPort output can also be converted to
HDMI using a DisplayPort-HDMI converter. The DisplayPort interface supports the
1.2 specification, including Multi-Stream Transport (MST) for monitor daisy-chaining.
DisplayPort’s maximum supported disp lay re solution is 3840 x 2160 @ 60Hz.
Table 3. DisplayPort Status Conditions
PCI Express x16 Connector Status DisplayPort Status
1.3.1.3 Integrated Audio Provided by the DisplayPort Interface
The DisplayPort interface from the PCH supports audio. The processor supports two
High Definition audio streams on two digital ports simultaneously.
Table 4 shows the specific audio technologies supported by the PCH.
Table 4. Audio Formats Supported by the DisplayPort Interface
Audio Formats DisplayPort
AC-3 - Dolby* Digital Yes
Dolby Digital Plus Yes
DTS-HD* Yes
LPCM, 192 kHz/24 bit, 8 Channel Yes
Dolby TrueHD, DTS-HD Master
Audio* (Lossless Blu-ray Disc Audio
Format)
Yes
1.3.1.4 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or interception between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (DVI and DisplayPort).
1.3.1.5 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the DVI-D connector status.
1.3.1.6 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
1.3.1.7 Multiple Display Configurations
The following multiple display config uratio n modes are s upport ed (with appropriate
driver software):
•Single Display is a mode with one display port activated to display the output to
one display device.
• Intel
• Extended Desktop is a mode with up to three display ports activate d to drive the
®
Display Clone is a mode with up to three display ports activated to drive the
display content of same color depth setting but potentially different ref r esh ra t e
and resolution settings to all the active display devices connected.
content with potentially different color depth, refresh rate, and resolution settings
on each of the active display devices connected.
18
Product Description
1.3.1.8 PCI Express Graphics
4th generation Intel Core proces sors support PCI Express 3.0, 2.x, and 1.x:
•PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
•PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultane ously, for a total bandwidth of
16 GB/s.
•PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultane ously, for a total bandwidth of
8 GB/s.
The board has four DIMM sockets and supports the following memory features:
•1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, sin gl e-sided or double-sided DIMMs with the following restriction:
DIMMs with x16 organization are not supported.
•32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 47 for information on the total amount of addressable
memory.
• XMP version 1.3 performance profile support for memory speeds of 1600 MHz or
lower
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined fr eq u en cy.
Table 5 lists the supported DIMM configurations.
Table 5. Supported Memory Configurations
DIMM
4096 MB SS 4 Gbit 512 M x8/empty 8
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing o ne row of SDRAM).
4th generation Intel Core proces sors support the following types of memory
organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applicat ions. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the othe r. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowes t within the system
memory map) is mapped to dual channel operation; the to pm ost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate b oth channels.
Figure 3 illustrates the memory channel and D IMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if
installing only two DIMMs on your board.
22
Product Description
1.5 Intel® Q87 Express Chipset
Intel Q87 Express Chipset with Intel Flexible Display Inter connect (Intel FDI) and
Direct Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel Q87 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel Q87 chipset
Resources used by the chipset Chapte r 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, fu l l-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host
controller which supports USB 3.0 ports. This controller allows data transfers up to
5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),
and low-speed (LS) traffic on the bus.
The Intel Q87 Express Chipset provides the USB controller for the USB 2.0/3.0 ports.
The port arrangement is as follows:
• USB 3.0 ports:
Four USB 3.0 ports are implemented with stacked back panel connectors
Two front panel USB 3.0 ports are implemented through one internal connector
• USB 2.0 ports:
Two ports are implemented with stacked back panel connectors
Six front panel ports are implemented through three dual-port internal headers
NOTE
Computer systems that have an unshielded ca b le a ttached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 49
The location of the front panel USB headers Figure 10, page 50
The board provides six SATA connectors, through the PCH, which support one device
each.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s. A point-to-point interface is used for host to device connections.
The PC H supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of th e Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 50
1.5.3.1 Intel® Rapid Storage Technology / SATA RAID
The PCH supports Intel® Rapid Storage Technology, providing both AHCI a nd
integrated RAID functionality. The RAID capability provides high-performance RAID 0,
1, 5, and 10 functionality on all SATA ports. Other RAID features include hot spare
support, SMART alerting, and RAID 0 auto replace. Software components include an
Option ROM for pre-boot configuration and boot functionality, a Microsoft* Windows*
compatible driver, and a user interface for configuration and management of the RAID
capability of the PCH.
.
1.5.3.2 Intel® Smart Response Technology
Intel® Smart Response Technology is a disk caching solution that can provide improved
computer system performance with improve d pow er savings. It allows configuration of
a computer system with the advantage of having HD Ds for maximum storage capacity
with system performance at or near SSD performance levels.
For more information on Intel Smart Response Technology, go to
In order to use supported RAID and Intel Smart Response Technology features, you
must first enable RAID in the BIOS.
24
Product Description
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The c lock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Super I/O Controller
The I/O controller provides the following features:
• One serial port connector
• One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support)
• PS/2-style keyboard/mouse interface on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a program mable wake-up event interface
• Conventional PCI bus power m anagement support
The BIOS Setup program provides configuration options for the I/O controller.
The board supports Intel HD Audio via the Realtek ALC662 audio codec. The audio
subsystem supports the following features:
•Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio por t .
•Digital-to-Analog Converters (DAC) with 95 dB SNR (A-weighting) and Analog-toDigital Converters (ADC) with 90 dB SNR (A-weighting).
•Ten DAC channels support 16/ 2 0 /24-bit PCM format for 5.1 channel sound
playback, plus two channels of concurrent independent stereo sound output
(multiple streaming) through the front panel output.
• Two stereo ADCs support 16/20-bit PCM format, multiple stereo recording
• Microphone Acoustic Echo Cancellation (AEC), Noise S uppression (NS), and Beam
Forming (BF) technology for voice applications.
•Windows 7 Ultimate and Windows 8 Pro certification.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support
Audio Jack
Front panel - Green Default
Front panel - Pink Default
Back panel - Blue Default
Back panel - Green (ctrl panel) Default
Back panel - Pink Default
Microphone
Head-
phones
Line-Out
(Front
Speakers)
(ctrl panel)
Line-In
(Surround)
(ctrl panel)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, pa ge 16
Mic-In
(Center/Sub)
(ctrl panel)
26
Product Description
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front pa nel audio
connectors). The available configurable back panel audio connector s are shown in
Figure 4.
Item Description
A Line-in
B Line-out (front speakers)
C Mic-in (center/sub)
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio connector and S/PDIF audio header Figure 10, page 50
The signal names of the front panel audio connector a nd S/PDIF audio header Section 2.2.2.1, page 52
The back panel audio connectors Section 2.2.1, page 49
1.8.2.1 S/PDIF Header
The S/PDIF header allows connections to optical dong les for digital audio output.
1.8.2.2 Internal Mono Speaker Header
The internal mono speaker header allows co nnection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton NCT6683
device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V
• SMBus interface
SM
, +V
,andPCH VCC
CCP
1.10.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 42
1.10.3 Chassis Intrusion and Detection
The board supports a chassis security featur e that detects if the chassis cover is
removed. The security feature uses a mechan ical switch on the chass is that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 50
30
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