Intel DQ77MK User Manual
Intel® Desktop Board
DQ77MK
Technical Product Specification
July 2013
Part Number: G54941-004
The Intel Desktop Board DQ77MK may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DQ77MK Specification Update.
-003
Specification Clarifica tio n
May 2013
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ77MK Technical Product
Specification
-002 Specification Clarification October 2012
-004 Specification Clarifica tio n July 2013
This product spec ification applies to only the standard Intel® Desktop Board with BIOS identifier
MKQ7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITION S OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PROD UCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A P ARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FO R ANY AP PL I CATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in home s , offices , schoo ls , com p uter room s , and sim ilar locati o ns . The
suitability of this product for other PC or embedded non-PC applications or o ther e nviro nme nts , s uc h as
medical, industrial, alarm systems, te s t equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending pa te nt app lic ations, trademarks, copyrights, or other
intellectual property rights that r e la te to the pres e nted subjec t matte r. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwis e ,
to any such patents, trademarks, copyrights, or other intel le c tual p roperty rights.
Intel may make changes to specifications and produc t descriptions at any time, without notice.
Designers must not rely on the absence or characteristic s of any feature s or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities aris ing fr om future changes to them.
Intel desktop boards may contain design defe c ts or error s know n as err a ta, which m ay cause the product to
deviate from published specifications . C urrent characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the propert y of others.
Copyright 2012, 2013 Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
May 2012
ii
AA Revision
BIOS Revision
Notes
G39642-300
MKQ7710H.86A.0034
1,2
Date
Type of Change
Description of Change or Clarification
• Updated Table 41. Environmental Specifications to
• Added ENERGY STAR Note to Section 5.1.6.
Board Identification Information
Basic Desktop Board DQ77MK Identification Information
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Q77 chipset used on this AA revis io n co ns is ts of the follo w i ng co mponent:
Device Stepping S-Spec Numbers
Intel Q77 Express Chipset C1 SLJ83
Specification Changes or Clarifications
The table below indicates the Specifica tion Changes or Spec ificat ion Clarifications that
apply to the Intel
®
Desktop Board DQ77MK.
Specification Changes or Clarifications
October 2012 Spec Clarification
May 2013 Spec Clarification
July 2013 Spec Clarification
address operating temperature req ui r eme nts for the
board.
• Updated Section 1.11.1 Intel® vPro™ Technology to add
TPM bulleted item
• Updated Section 1.11.1.7 Trusted Platform Module (TPM)
to change TPM version and revision numbers
• Updated 1.5.2.2 Digital Visual Interface (DVI-D) and
1.5.2.3 Digital Visual Interface (DVI-I) to correct
maximum supported resolution
• Updated Section 1.8.2.1 S/PDIF Header
• Updated Section 3.10 Hard Disk Drive Password Security
Feature.
Deleted references to ENERGY STAR.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See
motherboards/motherboards.html?wapkw=desktop+boards for the latest
documentation.
http://www.intel.com/content/www/us/en/motherboards/desktop-
iii
Intel Desktop Board DQ77MK Technical Product Specification
iv
1
A description of the hardwar e used on Intel Desktop Board DQ77MK
2
A map of the resou r ces of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, bee p c odes, and POST codes
5
Regulatory comp lia nce and battery disposal informati on
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DQ77MK.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DQ77MK and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
Typographical Conventions
®
Desktop
This section cont ains information about t he conventions used in this specification. No t
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DQ77MK Technical Product Specification
Gb/s
Gigabits per second
kb/s
1000 bits per second
Other Common Notation
# Used after a signal name to identify an active-low sig nal (s uch as USB P0# )
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
I/O Input/Output
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
MB Megabyte ( 1,048,576 byt es )
MB/s Megabytes per sec ond
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadec ima l value.
x.x V Volts. Voltages are DC unless otherwise specified .
* This symbol is used to indicate third-party brand s and names tha t are the prop e r ty of their
respective owners.
vi
Contents
Revision History
Board Identification Information .................................................................. iii
Specification Changes or Clarifications ......................................................... iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 13
1.1.1 Feature Summary ................................................................. 13
1.1.2 Board Layout ........................................................................ 15
1.1.3 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.3.1 Graphics Subsystem .............................................................. 19
1.4 System Memory ............................................................................... 21
1.4.1 Memory Configurations .......................................................... 22
®
1.5 Intel
1.5.1 Direct Media Interface (DMI) .................................................. 24
1.5.2 Display Interfaces ................................................................. 24
1.5.3 USB ..................................................................................... 26
1.5.4 SATA Interfaces .................................................................... 26
1.6 Real-Time Clock Subsystem ............................................................... 28
1.7 Legacy I/O Controller ........................................................................ 28
1.8 Audio Subsystem .............................................................................. 29
1.8.1 Audio Subsystem Software ..................................................... 29
1.8.2 Audio Connectors and Headers ................................................ 30
1.9 LAN Subsystem ................................................................................ 31
1.9.1 Intel
1.9.2 LAN Subsystem Software ....................................................... 32
1.9.
1.10 Hardware Management Subsystem ..................................................... 33
1.10.1 Hardware Monitoring ............................................................. 33
1.10.2 Fan Monitoring ...................................................................... 33
1.10.3 Chassis Intrusion and Detection .............................................. 33
1.10.4 Thermal Monitoring ............................................................... 34
Q77 Express Chipset ................................................................ 24
®
82579LM Gigabit Ethernet Controller and Intel® 82574L
Gigabit Ethernet Controller ..................................................... 31
3 RJ-45 LAN Connectors with Integrated LEDs ............................. 32
vii
Intel Desktop Board DQ77MK Technical Product Specification
1.11 Intel® Security and Manageability Technologies .................................... 35
®
1.11.1 Intel
vPro™ Technology ........................................................ 35
1.11.2 Intel Small Business Technology ............................................. 38
®
1.11.3 Intel
Management Engine (Intel® ME) Software and Drivers ...... 39
1.12 Power Management .......................................................................... 40
1.12.1 ACPI .................................................................................... 40
1.12.2 Hardware Support ................................................................. 42
2 Technical Reference
2.1 Memory Resources ........................................................................... 47
2.1.1 Addressable Memory.............................................................. 47
2.1.2 Memory Map ......................................................................... 49
2.2 Connectors and Headers .................................................................... 49
2.2.1 Back Panel Connectors ........................................................... 50
2.2.2 Component-side Connectors and Headers ................................. 51
2.3 Jumper Block ................................................................................... 63
2.4 Intel
2.5 Mechanical Considerations ................................................................. 65
2.6 Electrical Considerations .................................................................... 66
2.7 Thermal Considerations ..................................................................... 67
2.8 Reliability ........................................................................................ 70
2.9 Environmental .................................................................................. 70
®
Management Engine BIOS Extension (Intel® MEBX) Reset Header . 64
2.5.1 Form Factor .......................................................................... 65
2.6.1 Power Supply Considerations .................................................. 66
2.6.2 Power Supervisor .................................................................. 67
2.6.3 Fan Header Current Capability ................................................ 67
2.6.4 Add-in Board Considerations ................................................... 67
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 71
3.2 BIOS Flash Memory Organization ........................................................
3.3 Resource Configuration ..................................................................... 72
3.3.1 PCI Express Autoconfiguration ................................................ 72
3.4 System Management BIOS (SMBIOS) ................................................. 73
3.5 Legacy USB Support ......................................................................... 73
3.6 BIOS Updates .................................................................................. 74
3.6.1 Language Support ................................................................. 74
3.6.2 Custom Splash Screen ........................................................... 75
3.7 BIOS Recovery ................................................................................. 75
3.8 Boot Options .................................................................................... 76
3.8.1 Optical Drive Boot ................................................................. 76
3.8.2 Network Boot ........................................................................ 76
3.8.3 Booting Without Attached Devices ........................................... 76
3.8.4 Changing the Default Boot Device During POST ......................... 76
3.9 Adjusting Boot Speed ........................................................................ 77
3.9.1 Peripheral Selection and Configuration ..................................... 77
3.9.2 BIOS Boot Optimizations ........................................................ 77
72
viii
Contents
3.10 Hard Disk Drive Password Security Feature .......................................... 78
3.11 BIOS Security Features ..................................................................... 79
3.12 BIOS Performance Features ............................................................... 80
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 81
4.2 BIOS Beep Codes ............................................................................. 81
4.3 Front-panel Power LED Blink Codes ..................................................... 82
4.4 BIOS Error Messages ........................................................................ 82
4.5 Port 80h Power O n Self Test (POST) Codes .......................................... 83
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 89
5.1.1 Safety Standards................................................................... 89
5.1.2 European Union Declaration of Conformity Statement ................ 90
5.1.3 Product Ecology Statements ................................................... 91
5.1.4 China RoHS .......................................................................... 94
5.1.5 EMC Regulations ................................................................... 95
5.1.6 e-Standby and ErP Compliance ............................................... 97
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 98
5.2 Battery Disposal Information .............................................................. 99
Figures
1. Major Board Components .................................................................. 15
2. Block Diagram .................................................................................. 17
3. Memory Channel and DIMM Configuration ............................................ 23
4. Back Panel Audio Connectors ............................................................. 30
5. LAN Connectors LED Locations ........................................................... 32
6. Thermal Sensors and Fan Headers ...................................................... 34
7. Location of the Intel ME “M” State LED ................................................ 39
8. Location of the Standby Power LED ..................................................... 45
9. Detailed System Memory Address Map ................................................ 48
10. Back Panel Connectors ...................................................................... 50
11
. Component-side Connectors and Headers ............................................ 51
12. Connection Diagram for Front Panel Header ......................................... 60
13. Connection Diagram for Front Panel USB 2.0 Connectors ....................... 62
14. Location of the Jumper Block ............................................................. 63
15. Intel MEBX Reset H eader ................................................................... 64
16. Board Dimensions ............................................................................. 65
17. Localized High Temperature Zones ..................................................... 68
18. Intel Desktop Board DQ77MK China RoHS Material Self
Declaration Table .............................................................................. 94
ix
Intel Desktop Board DQ77MK Technical Product Specification
Tables
1. Feature Summary ............................................................................. 13
2. Components Shown in Figure 1 .......................................................... 16
3. Supported Memory Configurations ...................................................... 21
4. DVI Port Status Conditions................................................................. 25
5. DisplayPort Status Conditions ............................................................. 25
6. Audio Formats Supported by the DisplayPort Interface .......................... 25
7. Audio Jack Support ........................................................................... 29
8. LAN Connector LED States ................................................................. 33
9. Intel ME “M” State LED Behavior ........................................................ 39
10. Effects of Pressing the Power Switch ................................................... 40
11. Power States and Targeted System Power ........................................... 41
12. Wake-up Devices and Events ............................................................. 42
13. System Memory Map......................................................................... 49
14. Component-side Connectors and Headers Shown in Figure 11 ................ 52
15. Serial Port Connector ........................................................................ 53
16. Front Panel Audio Header for Intel HD Audio ........................................ 53
17. Front Panel Audio Header for AC ’97 Audio ........................................... 53
18. Front Panel USB 2.0 Connectors ......................................................... 53
19. Front Panel USB 3.0 Connector ........................................................... 54
20. IEEE 1394a Connector ....................................................................... 54
21. Internal Mono Speaker Header ........................................................... 54
22. PCI Express Full-/Half-Mini Card Connector .......................................... 55
23. SATA Connectors .............................................................................. 56
24. S/PDIF Header ................................................................................. 57
25. Chassis Intrusion Header ................................................................... 57
26. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 57
27. LPC Debug Header ............................................................................ 57
28
. Processor Core Power Connect or ........................................................ 59
29. Main Power Connector ....................................................................... 59
30. Front Panel Header ........................................................................... 60
31. States for a One-Color Power LED ....................................................... 61
32. States for a Two-Color Power LED....................................................... 61
33. Alternate Front Panel Power/Sleep LED Header..................................... 61
34. BIOS Setup Configuration Jumper Settings .......................................... 63
35. Intel MEBX Reset Header Signals ........................................................ 64
36. Recommended Power Supply Current Values (High Power) .................... 66
37. Recommended Power Supply Current Values (Low Power) ..................... 66
38. Fan Header Current Capability ............................................................ 67
39. Thermal Considerations for Components .............................................. 69
40. Tcontrol Values for Components ......................................................... 69
41. Environmental Specifications .............................................................. 70
42. BIOS Setup Program Menu Bar ........................................................... 72
43. BIOS Setup Program Function Keys .................................................... 72
44. Acceptable Drives/Me d ia Types for BIOS Recovery ................................ 75
45. Boot Device Menu Options ................................................................. 76
x
Contents
51. Master Key and User Hard Drive Password Functions ............................ 78
46. Supervisor and User Password Functions ............................................. 79
47. BIOS Beep Codes ............................................................................. 81
48. Front-panel Power LED Blink Codes ..................................................... 82
49. BIOS Error Messages ........................................................................ 82
50. Port 80h POST Code Ranges .............................................................. 83
51. Port 80h POST Codes ........................................................................ 84
52. Typical Port 80h POST Sequence ........................................................ 88
53. Safety Standards .............................................................................. 89
54. EMC Regulations ............................................................................... 95
55. Regulatory Compliance Marks ............................................................ 98
xi
Intel Desktop Board DQ77MK Technical Product Specification
xii
Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by
• 3rd generation Intel® Core processor family and 2nd generation Intel® Core
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Intel
®
Q77 Express Chipset consisting o f the I nte l® Q77 Express Platform
• Integrated graphics support for proces sors with I nte l® Graphics Technology:
Audio
• 8-channel (6+2) Intel High Definition Audio via the Realtek* ALC892 audio
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major feature s of the board.
Table 1. Feature Summary
Form Factor
243.84 millimeters])
Processor
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface
― Integrated memory controller with dual channe l DDR 3 m emory support
― Integrated graphics process ing (proce s so rs with Intel
― External graphics interface controlle r
Memory
• Support for DDR3 1600 M Hz , DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage ) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DI MMs are only s uppor te d by 3
processor family processors
Chipset
Controller Hub (PCH)
Graphics
― DisplayPort*
― DVI-I
― DVI-D
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PC I Exp r ess 3 .0 is only supp or te d by 3
processor family processors
®
HD Graphics)
rd
generation Intel Core
rd
generation Intel Core
codec
• 8-channel (7.1) Intel HD Audio via the DisplayPor t connector fro m the PCH
13
continued
Intel Desktop Board DQ77MK Technical Product Specification
― One port via a front-panel connector (blue)
One PCI Express 3.0 x16 add-in card connector
family processors
Intel® BIOS resident in the SPI Flash device
and SMBIOS
• Wake on PCI, PCI Express, LAN, fr ont panel, serial, and USB ports
Controller (black connector)
support
• Fan speed control
• Intel® Anti-Theft (Intel® AT)
Table 1. Feature Summary (continued)
Peripheral
Interfaces
• Four USB 3.0 ports:
― Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
― Two front panel USB 3.0 ports are implemented through one interna l
connector (blue)
• Ten USB 2.0 ports:
― Four ports implemented with stacked back panel connectors (two black and
two orange high current charging por ts )
― Four f ro nt p ane l por ts imp le mented through two internal headers (black)
― Two ports are implemented in the PCI Express Full-/Half–Mini C ard slot
• Six Serial ATA (SATA) ports:
― Two SATA 6.0 Gb/s interface through the Intel Q77 Express Chipset with
®
Intel
Rapid Storage Technology RAID support (blue)
― Two internal SATA 3.0 Gb/s interfaces through Intel Q77 Express Chipset
with Intel Rapid Storage Technology RAID supp ort (black)
― One internal SATA connector (multiplexe d with an mSAT A por t, ro ute d to
the PCI Express Full-/Half-Mini Card slot) (gray)
― One external eSATA 3.0 Gb/s interface (red)
• One serial port connector
• Two IEEE 1394a ports:
― One port via a back panel connector
Expansion
Capabilities
•
• One PCI Express 2.0 x4 bus add-in card connector from the PCH
• One PCI Express 2.0 x1 bus add-in card connector from the PCH
• One Conventional PCI bus add-in card connecto rs from the PCH
• One PCI Express Full-/Half-Mini Card conne c tor from the PCH (supporting
mSATA, Wireless Intel
®
Active Management Technology (Intel® AMT), and USB
capabilities)
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor
BIOS
•
• Support for Advanced Configuration and Power Inte rf a c e (ACPI ), Plug and Pla y ,
Instantly Available
PC Technology
LAN Support
• Support for PCI Express* Revision 3.0
• Suspend to RAM support
Two Gigabit (10/100/1000 Mb/s) LAN subsyste ms using the Intel
®
Gigabit Ethernet Controller (red connector) and Intel
82574L Gigabit Ethernet
®
82579LM
Legacy I/O Control Nuvoton NCT6776D I/O controller for ser ial po rt and hardware management
Hardware Monitor
Subsystem
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltage s
• Thermal sense to detect out of range thermal values
• Three fan headers
• Two fan sense inputs used to monitor fan activity
®
Intel® Security and
Manageability
Technologies
• Intel
• Intel
• Intel
• Intel
• Intel
vPro™ Technology
®
Active Management Technology (Intel® AMT) 8.0
®
Small Business Technology (Intel® SBT)
®
Virtualization Technology (Intel® VT)
®
Virtualization for Directed I/O (Intel® VT-d)
14
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DQ77MK.
Figure 1. Major Board Components
15
Intel Desktop Board DQ77MK Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A PCI Express x4 add-in card connector
B Conventional PCI add-in card connector
C IEEE 1394 a front panel header
D PCI Expr ess x1 add-in card connec to r
E PCI Express x16 add-in card connector
F Back panel connectors
G 12 V processor core voltage connector (2 x 2 pin)
H LGA1155 processor socket
I Rear chassis fan header
J Processor fan header
K DIMM 3 (Channel A DIMM 0)
L DIMM 1 (Channel A DIMM 1)
M DIMM 4 (Channel B DIMM 0)
N DIMM 2 (Channel B DIMM 1)
O Front chassis fan header
P Low Pin Count (LPC) Debug header
Q Chassis intrusion header
R Main p ower connector (2 x 12)
S Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header
T Battery
U Piezoelectric speaker
V Intel® Management Engine “M” state LED
W PCI Express Full-/Half-Mini Card slot
X SATA 6.0 Gb/s connector (multiplexed with an mSATA por t, routed to the PCI
Express Full-/Half-Mini Card slot) (g ray)
Y SA TA 3 .0 Gb/s co nnecto rs through the PCH (black)
Z Alternate front panel power/slee p LED head er
AA Front panel connector
BB Standby power LED
CC BIOS Setup configuration jumper block
DD SATA 6.0 Gb/s connectors through the PCH (blue)
EE Front panel USB 3.0 connector (blue)
FF Intel Q77 Express Chipset
GG Front panel USB 2.0 connector
HH Fro nt p ane l USB 2.0 connector
II Serial port connector
JJ S/PDIF out header
KK Front panel audio connector
LL Inte r na l mono speake r heade r
16
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
17
Figure 2. Block Diagram
Intel Desktop Board DQ77MK Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DQ77MK http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DQ77MK
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration informatio n http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processo r family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed
above are only supported when falling within the wattage requirements of Intel
Desktop Board DQ77MK. See the Intel web site listed below for the most up-to-date
list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 66 for information on power supply requirements for this board.
18
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
DirectX* 11 (2
nd
generation Intel Core processor family processors support
CS4.0 only) support
OpenGL* 3.0 support
Shader Model 4.0
High-Definition co nt ent at up to 1080p resolution
Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
Intel
®
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
Blu-ray* S3D via DisplayPort 1.1a
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
19
Intel Desktop Board DQ77MK Technical Product Specification
1.3.1.2 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x,
and 1.x and 2
nd
generation Intel Core processor family processors support PCI
Express 2.x and 1.x:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of
16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth o f
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
20
Product Description
Capacity
Configuration
Density
Front-side/Back-side
Devices
1024 MB
SS
1 Gbit
128 M x8/empty
8
2048 MB
DS
1 Gbit
128 M x8/128 M x8
16
2048 MB
SS
2 Gbit
256 M x8/empty
8
4096 MB
DS
2 Gbit
256 M x8/256 M x8
16
4096 MB
SS
4 Gbit
512 M x8/empty
8
8192 MB
DS
4 Gbit
512 M x8/512 M x8
16
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, sin gl e-sided or double-sided DIMMs with the following r estriction:
DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 47 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIM Ms are only supported by 3
processor family processors
• XMP version 1.3 performance profile support for memory speeds of 1600 MHz or
lower
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that suppor t the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctl y configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined fr eq u en cy.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing o ne row of SDRAM).
(Note)
SDRAM
SDRAM Organization
Number of SDRAM
21
Intel Desktop Board DQ77MK Technical Product Specification
For information about…
Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equa l. Technology and device width c an vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mo de is eq uivalent to single channel
bandwidth operation for rea l world applications. This mode is u sed when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowes t within the system
memory map) is mapped to dual channel operation; the top most DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
22
Figure 3 illustrates the memory channel and D IMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory in the blue DIMM sockets if
installing only two DIMMs on your board.
Populate DIMM soc kets in the order in which they are numbered.
23
Intel Desktop Board DQ77MK Technical Product Specification
1.5 Intel® Q77 Express Chipset
Intel Q77 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and
Direct Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel Q77 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel Q77 chipset
Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
http://www.intel.com/products/desktop/chipsets/index.htm
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the
display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects t he display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
1.5.2.3 Digital Visual Interface (DVI-I)
The DVI-I port supports both digital and analog DVI displays. The maximum supported
reso lut io n is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI por t is com pl iant with
the DVI 1.0 specification. DVI analog output can also be converted to VG A using a
DVI-VGA converter.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in Table 4.
24
Table 4. DVI Port Status Conditions
No add-in card installed
Enabled
Enabled
PCI Express x16 add-in card installed
Enabled
(Note 2)
Enabled
(Note 2)
No add-in card installed
Enabled
PCI Express x16 add-in card installed
Enabled
(Note)
AC-3 - Dolby* Digital
No
DTS-HD*
No
Product Description
PCI Express x16 Connector Status
Notes:
1. D VI analog output can also be converted to VGA with a DVI-VGA converter.
2. May require BIOS setup menu changes.
DVI Digital (DVI-D)
Port Status
DVI Analog (DVI-A)
Port Status
(Note 1)
1.5.2.4 DisplayPort
DisplayPort is a dig ital communic ation interface that util izes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. DisplayPort output can also be converted to
HDMI using a DisplayPort-HDMI converter. The DisplayPort interface supports the 1.1a
specification.
DisplayPort’s maximum supported display resolution is 2560 x 1600 at 60 Hz refresh
with a 16:10 aspect ratio (WQXGA).
Table 5. DisplayPort Status Conditions
PCI Express x16 Connector Status DisplayPort Status
Note: May require BIOS setup menu changes.
For information about Refer to
DisplayPort technology http://www.displayport.org
1.5.2.5 Integrated Audio Provided by the DisplayPort Interface
The DisplayPort interface from the PCH supports audio. Table 6 shows the specific
audio technologies supported by the PCH.
Table 6. Audio Formats Supported by the DisplayPort Interface
Audio Formats DisplayPort
Dolby Digital Plus No
LPCM, 192 kHz/24 bit, 8 Channel Yes
25
Intel Desktop Board DQ77MK Technical Product Specification
For information about
Refer to
1.5.3 USB
The PCH contains up to two Enhanced Host Contro ller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, fu l l-speed, and low-speed capable.
The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host
controller which supports USB 3.0 ports . T his c ontroller allows data transfers up to
5 Gb/s. The controller supports SuperSpeed (SS), high-speed (HS), full-speed (FS),
and low-speed (LS) traffic on the bus.
The board supports up to four USB 3.0 ports and ten USB 2.0 ports.
The Intel Q77 Express Chipset provides the USB controller for the 2.0/3.0 ports. The
port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two front panel USB 3.0 ports are implemented through one internal connector
(blue)
• Four USB 2.0 ports implemented with stacked back panel connectors (two black
and two orange high current charging ports)
• Four USB 2.0 front panel ports implemented through two internal headers (black)
• Two USB 2.0 ports are implemented in the PCI Express Full-/Half–Mini Card slo t
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
The location of the USB connectors on the back panel Figure 10, page 50
The location of the front panel USB headers Figure 11, page 51
1.5.4 SATA Interfaces
The board provides six SATA connectors, through the PCH, which support one device
each:
• Two SATA 6.0 Gb/s interfaces through the Intel Q77 Express Chipset with Intel
Rapid Storage Technology RAID support (blue)
• Two internal SATA 3.0 Gb/s interfaces through Intel Q 77 Express Chipset with Intel
Rapid Storage Technology RAID support (black)
• One internal SATA connector (multiplexed with an mSATA port, routed to the PCI
Express Full-/Half-Mini Card slot) (gray)
• One external eSATA 3.0 Gb/s interface (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two port and 3.0 Gb/s for four ports. A point-to-point interface is used for
host-to-device connections.
®
26
Product Description
The PC H supports the Serial ATA Specification, R evisio n 3.0. The PCH a lso supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
The underlying SATA functionality is tra nsparent to the operating system. The SATA
controller can operate in both legacy and na tive modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7 operating
systems.
NOTE
When an mSATA module is plugg ed into the PCI Express Full-Mini Card slot, SATA port
4 (colored gray) will be disabled automatically.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 51
.
27
Intel Desktop Board DQ77MK Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The c lock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 15 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• One serial port
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a progra mm a b le w ake-up event interface
• Conventional PCI bus power m anagement support
The BIOS Setup program provides configuration options for the I/O controller.
28
Product Description
Front panel – Green
Default
Back panel – Pink
Default
1.8 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel Q77 Express Chipset
• Realtek ALC892 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio por t. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• A signal-to-noise (S/N) ratio of 95 dB.
• Windows 7 Ultimate certification.
Table 7 lists the supported functions of the front panel and back panel audio jacks.
Table 7. Audio Jack Support
Audio Jack
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl panel) Default
Microphone Headphones
Line Out
(Front Spks)
(ctrl panel)
Line In
(Surround)
(ctrl panel)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and driver s Section 1.2, pa ge 18
Mic-In
(Center/Sub)
(ctrl panel)
29
Intel Desktop Board DQ77MK Technical Product Specification
The locations of the front panel audio header and S/PDIF audio he ader
Figure 11, page 51
The back panel audio connectors
Section 2.2.1, page 50
1.8.2 Audio Connectors and Headers
The board contains au d io connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front pa nel audio
connectors). The available configurable back panel audio connectors are shown in
Figure 4.
Item Description
A Line in/surround
B Line out/front speakers
C Mic in/center/sub
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 53
1.8.2.1 S/PDIF Header
The S/PDIF header allows connections to optical dongles for digital audio output.
1.8.2.2 Internal Mono Speaker Header
The internal mono speaker header allows connection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
30
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