Intel 315889-002 User Manual

Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0

Design Guidelines

April 2008

Reference Number: 315889-002

Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Dual-Core Intel Xeon processor 7000 sequence, the Quad-Core Intel Xeon processor 5300 Series, Dunnington, Tigerton, DualCore Intel® Xeon® 7100 series, and the Intel 5000 Series Chipsets and Intel E8500 chipsets, and the Truland and Caneland platforms may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

The code names “Clovertown,” “Wolfdale,” “Stoakley,” “Tigerton,” “Caneland”, “Dunnington”, “Aliceton,” ”Paxville MP”, “Truland”, and “Harpertown” presented in this document are only for use by Intel to identify products, technologies, or services in development, that have not been made commercially available to the public, i.e., announced, launched or shipped. They are not “commercial” names for products or services and are not intended to function as trademarks.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

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1Applications...............................................................................................................9

1.1 Introduction and Terminology ...............................................................................9

2 Output Voltage Requirements.................................................................................. 11

2.1 Voltage and Current - REQUIRED......................................................................... 11

2.2 Load Line Definitions - REQUIRED........................................................................ 13

2.3 Voltage Tolerance - REQUIRED............................................................................ 15

2.4 Processor VCC Overshoot - REQUIRED ................................................................. 16

2.5 Impedance vs. Frequency - EXPECTED.................................................................16

2.6 Stability - REQUIRED .........................................................................................18

2.7 Processor Power Sequencing - REQUIRED............................................................. 18

2.8 Dynamic Voltage Identification (D-VID) - REQUIRED ..............................................20

2.9 Overshoot at Turn-On or Turn-Off - REQUIRED...................................................... 22

2.10 Output Filter Capacitance - REQUIRED ................................................................. 22

2.11 Shut-Down Response - REQUIRED.......................................................................26

3 Control Signals ........................................................................................................ 27

3.1 Output Enable (OUTEN) - REQUIRED.................................................................... 27

3.2 Voltage Identification (VID [6:0]) - REQUIRED ...................................................... 27

3.3 Differential Remote Sense (VO_SEN+/-) - REQUIRED............................................. 29

3.4 Load Line Select (LL0, LL1, VID_Select) - REQUIRED .............................................31

4 Input Voltage and Current .......................................................................................33

4.1 Input Voltages - EXPECTED ................................................................................33

4.2 Load Transient Effects on Input Current - EXPECTED.............................................. 33

5 Processor Voltage Output Protection ....................................................................... 35

5.1 Over-Voltage Protection (OVP) - EXPECTED ..........................................................35

5.2 Over-Current Protection (OCP) - EXPECTED .......................................................... 35

6 Output Indicators .................................................................................................... 37

6.1 Voltage Regulator Ready (VR_Ready) - REQUIRED................................................. 37

6.2 Voltage Regulator Hot (VR_hot#) - PROPOSED......................................................37

6.3 Load Indicator Output (Load_Current) - PROPOSED ...............................................38

6.4 VRM Present (VRM_pres#) - EXPECTED................................................................ 38

6.5 VR_Identification (VR_ID#) - EXPECTED ..............................................................38

7 VRM – Mechanical Guidelines................................................................................... 41

7.1 VRM Connector - EXPECTED................................................................................ 41

7.2 VRM (Tyco/Elcon) Connector Keying .................................................................... 41

7.2.1 Connector Keying...................................................................................41

7.2.2 Connector Pin 1 Orientation ..................................................................... 41

7.3 Pin Descriptions and Assignments........................................................................ 41

7.4 Mechanical Dimensions - PROPOSED.................................................................... 43

7.4.1 Gold Finger Specification ......................................................................... 43

8 Environmental Conditions........................................................................................45

8.1 Operating Temperature - PROPOSED ................................................................... 45

8.2 VRM Board Temperature - REQUIRED .................................................................. 45

8.3 Non-Operating Temperature - PROPOSED.............................................................45

8.4 Humidity - PROPOSED .......................................................................................45

8.5 Altitude - PROPOSED ......................................................................................... 46

8.6 Electrostatic Discharge - PROPOSED ....................................................................46

8.7 Shock and Vibration - PROPOSED ........................................................................46

8.8 Electromagnetic Compatibility - PROPOSED........................................................... 46

8.9 Reliability - PROPOSED ......................................................................................46

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8.10 Safety - PROPOSED ...........................................................................................46

9 Manufacturing Considerations..................................................................................47

9.1 Lead Free (Pb Free) ...........................................................................................47

A Z(f) Constant Output Impedance Design..................................................................49

A.1 Introduction - PROPOSED ...................................................................................49

A.2 Voltage Transient Tool (VTT) Z(f) Theory ..............................................................52

A.3 VTT Z(f) Measurement Method ............................................................................53

A.4 Results.............................................................................................................53

A.5 Output Decoupling Design Procedure....................................................................56

Figures

2-1 VRM/EVRD 11.0 Load Current vs. Time.................................................................12

2-2 Processor Vcc Overshoot Example Waveform.........................................................16

2-3 Power Distribution Impedance vs. Frequency.........................................................17

2-4 Power-On Sequence Timing Diagram....................................................................19

2-5 Processor Transition States .................................................................................21

2-6 Dynamic VID Transition States Illustration ............................................................21

2-7 Six-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP

Power Delivery Impedance Model Path with 1206 Size Caps.....................................23

2-8 Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP

Power Delivery Impedance Model Path with 1206 Size Caps.....................................23

2-9 Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP

Power Delivery Impedance Model Path with 0805 Size Caps.....................................23

2-10 Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP

Power Delivery Impedance Model Path - Example...................................................25

3-1 Remote Sense Routing example...........................................................................30

6-1 VRM 11.0 and Platform Present Detection .............................................................39

7-1 VRM 11.0 Pin Assignments..................................................................................43

7-1 VRM 11.0 Module and Connector..........................................................................44

A-1 Typical Intel® Microprocessor Voltage Regulator Validation Setup ............................49

A-2 Z(f) Network Plot with 1.25 mW Load Line ............................................................50

A-3 Time Domain Response of a Microprocessor Voltage Regulator.................................51

A-4 Time Domain Responses and Corresponding Fourier Spectra

of Voltage, Current and Impedance......................................................................53

A-5 Photo of Motherboard Analyzed Showing High Frequency

MLCC Capacitors In the Socket Cavity and Bulk Capacitors......................................54

A-6 Measured Platform Impedance Profile Showing Change

in Impedance as Capacitors Are Removed.............................................................55

A-7 Designations of MLCC Cavity Capacitor Banks........................................................55

A-8 Simulated and Measured Waveforms of Platform Impedance Profile..........................56

Tables

1-1 VRM/EVRD 11.0 Supported Platforms and Processors............................................... 9

1-2 Guideline Categories ..........................................................................................10

2-1 Processor VID signal implementation ....................................................................11

2-2 Icc Guidelines ...................................................................................................13

2-3 VID_Select, LL1, LL0 Codes.................................................................................14

2-4 Impedance Z

2-5 Startup Sequence Timing Parameters...................................................................19

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Measurement Parameter Limits ......................................................18

2-6 Recommended Decoupling and Other Specifications for Supported

(Highest SKU) Processors - Summary .................................................................. 22

2-7 Dual-Core Intel Xeon Processor-Based Server/Dual-Core Intel Xeon

Processor-Based Server-VS/Dual-Core Intel Xeon Processor-Based

Workstation Platform Processor Decoupling Capacitor Recommendations .................. 24

2-8 ......................................................................................................................24

2-9 Dual-Core Intel Xeon 7000 Series with Intel 7300 Chipsets Platform

Processor Decoupling Capacitor Recommendations ................................................ 24

2-10 Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform

Processor Decoupling Capacitor Recommendations ................................................ 25

3-1 OUTEN Specifications......................................................................................... 27

3-2 VID [6:0] Specifications .....................................................................................27

3-3 Extended VR 10 Voltage Identification (VID) Table................................................. 28

3-4 VR 11.0 Voltage Identification (VID) Table............................................................ 29

3-5 LL0, LL1, VID_Select Specifications...................................................................... 31

3-6 VID Bit Mapping................................................................................................ 31

6-1 VR_Ready Specifications .................................................................................... 37

6-2 VR_hot# Specifications ...................................................................................... 37

6-3 VRM_pres# Specifications .................................................................................. 38

6-4 VRM_ID# Specifications ..................................................................................... 38

7-1 VRM 11.0 Connector Part Number and Vendor Name..............................................41

7-2 VRM 11.0 Connector Pin Descriptions...................................................................42

315889-002 5

Revision History

Rev # Description Rev. Date

001 • Initial Release November 2006

002

• General- Update Harpertown and Wolfdale-DP to public names

• Table 2-3 correction - Loadline ID codes for 5400/5200 series processors

April 2008

6 315889-002

The following table lists the revision schedule based on revision number and development stage of the product.

Revision Project Document State Projects Covered

0.5 Preliminary Targets HW, SW

0.5 to 0.9 Updates to Most Recent Update or 0.5 HW, SW

1.0 Design Frozen HW, SW

1.0 to 1.5 Updates to Most Recent Update or 1.0 HW, SW

1.5 Preliminary Validation Data (Doc-Dependent) HW Only

1.6 to 1.75 Updates to Most Recent Update or 1.5 HW Only

1.75 (Optional) Final Validation Data (Doc-Dependent) HW Only

1.76 to 1.9 Updates to Most Recent Update or 1.75 HW Only

Launch Launch Documents HW Only

Note: Not all revisions may be published.

315889-002 7

8 315889-002

Applications

1 Applications

1.1 Introduction and Terminology

This document defines the DC-to-DC converters to meet the processor power requirements of the following platforms:

Table 1-1. VRM/EVRD 11.0 Supported Platforms and Processors

Dual-Core Intel® Xeon® 5000 Sequence Platform with Intel® 5000P Express Chipset, Intel® 5000V Chipset, Intel® 5000X Chipset, Intel® 5100 Chipset, Intel® 5400A Chipset, or Intel® 5400B Chipset

Dual-Core Intel 5000 Series

Dual-Core Intel 5200 Series

Dual-Core Intel® Xeon® Processor 7000 Sequence-Based Platform with Intel® 7300 Chipset

Dual-Core Intel 7200 Series

Xeon® Processor

Dual-Core Intel® Xeon® Processor 5100 Series

Quad-Core Intel® Xeon® Processor 5400 Series

Quad-Core Intel® Xeon® processor 7300 Series

Quad-Core Intel® Xeon® processor 5300 Series

The requirements in this document will focus primarily on the Enterprise processors based on Dual-Core Intel

Xeon® Processor-based Server and Quad-Core Intel® Xeon® Processor-based Server/Workstation platforms. Some requirements will vary according to the needs of different computer systems and processors. The intent of this document is to define the electrical, thermal and mechanical design specifications for VRM/EVRD 11.0.

VRM – The voltage regulator module (VRM) designation in this document refers to a voltage regulator that is plugged into a baseboard via a connector or soldered in with signal and power leads, where the baseboard is designed to support more than one processor. VRM output requirements in this document are intended to match the needs of a set of microprocessors.

EVRD – The enterprise voltage regulator down (EVRD) designation in this document refers to a voltage regulator that is permanently embedded on a baseboard. The EVRD output requirements in this document are intended to match the needs of a set of microprocessors. EVRD designs are only required to meet the specifications of a specific baseboard and thus must meet the specifications of all the processors supported by that baseboard.

‘1’ – In this document, refers to a high voltage level (V

‘0’ – In this document, refers to a low voltage level (V

and VIH).

and VIL).

‘X’ – In this document, refers to a high or low voltage level (Don’t Care).

‘#’ – Symbol after a signal name in this document, refers to an active low signal,

indicating that a signal is in the asserted state when driven to a low level.

The specifications in the respective processors’ Electrical, Mechanical, and Thermal Specifications (EMTS) documents always take precedence over the data provided in this document.

VRM/EVRD 11.0 incorporates functional changes from prior VRM and EVRD design guidelines:

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• New power-on sequence

• Extended VR 10.x VID table with a 7th bit for 6.25 mV resolution and 0.83125 V to

1.6 V range, only 12.5 mV resolution will be used in Dual-Core Intel Xeon Processor-Based Platform and Intel E8500 platforms.

• Support for a separate additional VR 11.0 VID table with a 8-bit table and 6.25 mV resolution with a 31.25 mV to 1.6 V VID range, only 12.5 mV resolution will be used in Dual-Core Intel Xeon Processor-Based Servers and Intel E8500 platforms with a VID setpoint range of 0.850 V to 1.6 V.

• Tighter DC load line tolerance from ±20 mV to ±15 mV

Table 1-2. Guideline Categories

REQUIRED:

EXPECTED:

PROPOSED:

An essential feature of the design that must be supported to ensure correct processor and VRM/EVRD functionality.

A feature to ensure correct VRM/EVRD and processor functionality that can be supported using an alternate solution. The feature is necessary for consistency among system and power designs and is traditionally modified only for custom configurations. The feature may be modified or expanded by system OEMs, if the intended functionality is fully supported.

A feature that adds optional functionality to the VRM/EVRD and therefore is included as a design target. May be specified or expanded by a system OEMs.

Applications

Guideline Categories

10 315889-002

Output Voltage Requirements

2 Output Voltage Requirements

2.1 Voltage and Current - REQUIRED

There will be independent selectable voltage identification (VID) codes for the core voltage regulator. The VID code is provided by the processor to the VRM/EVRDs, which will determine a reference output voltage, as described in Section 3.2. As previously mentioned, the VR 11.0 controller will support two VID tables:

1. An extended 7-bit VR 10.x table, ranging from 0.83125 V to 1.6 V

2. An 8-bit VR11.0 linear table ranging from 0.03125 V to 1.6 V (usable range 0.5 V-

1.6 V).

For Dual-Core Intel Xeon Processor 7000/7100/7200/5000/5100/5200 Series -based servers and Quad-Core Intel Xeon Processor 7300/5300/5400 Series -based servers/ workstations, the VID bits utilization will be as shown in the table below. Section 2.2 and Section 2.3 specify deviations from the VID reference voltage.

Table 2-1. Processor VID signal implementation

VID Signals used

Processor Supported

Dual-Core Intel® Xeon® Processor 7000/7100 Series processor

Dual-Core Intel® Xeon® Processor 5000 Series

Dual-Core Intel® Xeon® Processor 5100 Series, QuadCore Intel® Xeon® Processor 5300 Series, Dual-Core Intel® Xeon® Processor 5200 Series, or Quad-Core Intel® Xeon® Processor 5400 Series processors

Quad-Core Intel(R) Xeon(R) Processor 7300 Series & Dual-Core Intel(R) Xeon(R) Processor 7200 Series processors

by Processor and

routed to VR with

Pull-Up resistors

VID[4:0,5]

(VID4=MSB

VID5=LSB)

VID[4:0,5]

(VID4=MSB

VID5=LSB)

VID[6:1]

Notes

VR10.2 mode; VID6 is not driven on the processor package (socket 604), but should be routed on the VR side with a pullup resistor; VR’s VID7 to be pulled Low.

VR10.2 mode; Land AM5 (equivalent to platform signal VID6) is not driven on the processor package, but still routed to VID6 on VR side with a pullup resistor; VR’s VID7 to be pulled Low.

VR11.0 mode; Land AM2 (equivalent to platform signal VID0) is connected to VSS on the processor package, and routed to VID0 on VR side with a pullup resistor; VR’s VID7 to be pulled Low.

VR11.0 mode; VID0 is not driven on the processor package (socket 604P), but should be routed on the VR side and pulled Low; VR’s VID7 to be pulled Low.

The load line tolerance in Section 2.2 shows the relationship between Vcc and Icc at the die of the processor.

The VRM/EVRD 11.0 is required to support the following:

• A maximum continuous load current (I

CCTDC) of 130 A.

• A maximum load current (ICCMAX) of 150 A peak.

• A maximum load current step (I

• A maximum current slew rate (dI

CCSTEP), within a 1 µs period, of 100 A.

CC/dt) of 1200 A/µs at the lands of the processor.

315889-002 11

Output Voltage Requirements

The continuous load current (ICCTDC) can also be referred to as the Thermal Design Current (TDC). It is the sustained DC equivalent current that the processor is capable of drawing indefinitely and defines the current that is used for the voltage regulator temperature assessment. At TDC, switching FETs may reach maximum allowed temperatures and may heat the baseboard layers and neighboring components. The envelope of the system operating conditions, establishes actual component and baseboard temperatures. This includes voltage regulator layout, processor fan selection, ambient temperature, chassis configuration, etc. To avoid heat related failures, baseboards should be validated for thermal compliance under the envelope of the system’s operating conditions. It is proposed that voltage regulator thermal protection be implemented for all designs (Section 6.2).

The maximum load current (I

CCMAX) represents the maximum peak current that the

processor is capable of drawing. It is the maximum current the VRM/EVRD must be electrically designed to support without tripping any protection circuitry.

The maximum step load current (IccStep) is the max dynamic step load that the processor is expected to impose on its Vcc power rail within the Iccmin and Iccmax range, where the Iccmin is the processor’s min load, constituted by its leakage current.

The amount of time required by the VR to supply current to the processor is dependent on the processor’s operational activity. As previously mentioned, the processor is capable of drawing IccTDC indefinitely; therefore, the VR must be able to supply

CCTDC) indefinitely. Refer to Figure 2-1 for the time durations required by the VR to

(I supply current for various processor loads.

It is expected that the maximum load current (I 10 ms. Further, it is expected that the load current averaged over a period of 100 seconds or greater, will be equal to or less than the thermal design current

CCTDC).

Figure 2-1. VRM/EVRD 11.0 Load Current vs. Time

Icc MAX

CCMAX) can be drawn for periods up to

Sustained Current (A)

Icc TDC

0.01 0.10 1.00 10.00 100.0 1000.0

Time Duration (s)

Table 2-2 shows the ICC guidelines for any flexible motherboard (FMB) frequencies

supported by the VRM/EVRD 11.0 in Tabl e 1-1 . For designers who choose to design their VR thermal solution to the I regulator thermal protection circuitry be implemented (see Section 6.2).

12 315889-002

CCTDC current, it is recommended that voltage

Output Voltage Requirements

Table 2-2. Icc Guidelines

Dual-Core Intel

Quad-Core Intel

Dual-Core Intel

Quad-Core Intel

Dual-Core Intel

Quad-Core Intel

Xeon® processor 7000 sequence FMB 130 150 100 1, 2

Xeon® 7100 series processor FMB 115 135 100 1, 2

Xeon® Processor 5000 Series FMB 130 150 90 1, 2

Xeon® Processor 5000 Series MV/667 FMB 100 115 76 1, 2

Xeon® Processor X5160 Series Performance FMB 70 90 40 1, 2

Xeon® Processor E5100 Series FMB 65 75 30 1, 2

Xeon® Processor L5148/5138/5128 Series FMB 35 45 25 1, 2

Xeon® processor X5300 Series Performance FMB 110 125 70 1, 2

Xeon® processor E5300 Series FMB 70 90 50 1, 2

Xeon® processor L5300 Series-LV FMB 50 60 35 1, 2

Xeon® Processor X5200 Series 70 90 37 1, 2

Xeon® Processor E5200 ( 60 75 21 1, 2

Xeon® Processor L5200 Series 38 50 36 1, 2

Xeon® Processor X5482 130 150 67 1, 2

Xeon® Processor X5400 Series 110 125 68 1, 2

Xeon® Processor E5400 Series 80 102 65 1, 2

Xeon® Processor L5400 Series 50 60 60 1, 2

Xeon® Processor X7300 Series 110 130 78 1, 2

Xeon® Processor E7300 Series 75 90 72 1, 2

Xeon® Processor 7200 Series 75 90 72 1, 2

Xeon® Processor L7300 Series 50 60 54 1, 2

Processor

CCTDC

(A)

CCMAX

(A)

CCSTEP

(A)

Notes

Notes:

1. These values are either pre-silicon or the latest known values and are subject to change. See the respective Processor’s Electrical, Mechanical, and Thermal Specifications (EMTS) for the latest IccTDC and IccMAX specifications.

2. FMB = Planned Flexible Motherboard guideline for processor end-of-life.

3. Voltage regulator thermal protection circuitry should not trip for load currents greater than ICCTDC

4. For platforms designed to support several processors, the highest current value should be used.

5. For platforms designed to support a single specific processor, only use that processor’s current requirements.

2.2 Load Line Definitions - REQUIRED

To ensure processor reliability and performance, platform DC and AC transient voltage regulation must be contained within the V boundaries, except for short burst transients above the V

Section 2.4. Die load line compliance must be guaranteed across 3-sigma component

manufacturing tolerances, thermal variation and age degradation. The following load line contains static and transient voltage regulation data as well as maximum and minimum voltage levels. It is required that the regulator’s positive and negative differential remote sense pins be connected to both the V

CC_DIE_SENSE2 and VSS_DIE_SENSE2 pin pairs of the processor socket, see Figure 3-1.

V The prefix V

CC is designated for the positive remote sense signal and the VSS prefix for

the negative remote sense signal.

315889-002 13

CCMIN and the VCCMAX die load line

CCMAX as specified in

CC_DIE_SENSE, VSS_DIE_SENSE,

The upper and lower load lines represent the allowable range of voltages that must be presented to the processor. The voltage must always stay within these boundaries for proper operation of the processor. Operating above the V in higher processor operating temperature, which may result in damage or a reduced processor lifespan. Processor temperature rise from higher functional voltages may lead to dynamic operation to low power states, which directly reduces processor performance. Operating below the V

CCMIN load line limit will result in minimum voltage

violations, which will result in reduced processor performance, system lock up, “blue screens” or data corruption.

For load line validation information, please refer to the LGA771-V2 Voltage Test Tool User’s Guide.

Figure 2-2 and Figure 2-2 shows the load line voltage offsets and current levels based

on the VID specifications for the core regulator.

The encoding in Table 2-2 for the load lines is valid for the range of load current from 0 A to 150 A. The VID_Select, load line 1 (LL1), and load line 0 (LL0) control signals from Section 3.4, form a 3-bit load line selection and will be used to configure the VRM/ EVRD to supply the proper load lines for the platforms in Table 1-1 . Refer to Figure 6-1 for additional encoding requirements for VRMs. For implementation of VID_Select, LL0, and LL1 on the baseboard refer to the appropriate platform design guidelines. The VID_Select control signal will select the appropriate VR10 or VR11 table and remap the external VID [6:0] pins to the appropriate DAC input. This line will be pulled up externally to the VTT rail (1.1 V/1.2 V ± 5%) via a recommended 4.7 kΩ resistor on the baseboard and will be programmed by the processor package. The processor does not support 5 V or 12 V levels and these should not be used. The VID_Select signal should be logic low or tied to ground for extended VR10 table selection. A logic high will

indicate a VR11 table selection. The VID_Select will not toggle during normal operation.

Table 2-3. VID_Select, LL1, LL0 Codes (Sheet 1 of 2)

Output Voltage Requirements

CCMAX load line limit will result

VID

Table

VR10.2

VR11.0

VID

Table

VID_

Select

LL1 LL0 Load Line / Processors

0 00 0 01

0 10

0 11 1 00

101

1 10 111

VID_

Select

LL1 LL0 V

1.25 mΩ; Reserved

1.25 mΩ; Dual-Core Intel® Xeon® Processor 5000 Series / MV processor LGA771 die Load Line

1.25 mΩ; Dual-Core Intel® Xeon® processor 7000 series / Dual-Core Intel® Xeon® 7100 series processor mPGA604 die Load Line

Reserved

1.00 mΩ; Reserved

1.25 mΩ; Dual-Core Intel® Xeon® Processor 5100 Series, Dual-Core Intel® Xeon® Processor 5200 Series, Quad-Core Intel® Xeon® Processor 5400 Series, Dual-Core Intel® Xeon® Processor 7200 Series, Quad-Core Intel® Xeon® Processor 7300 Series

1.50 mΩ; Reserved

1.25 mΩ; Quad-Core Intel Xeon processor 5300 Series

CC Tolerance / Die Load Line Units Notes

14 315889-002

Output Voltage Requirements

Table 2-3. VID_Select, LL1, LL0 Codes (Sheet 2 of 2)

VID

Table

Notes:

1. The Vcc values are the expected voltage measured at the processor die.

2. The Dual-Core Intel® Xeon® 7100 series / Dual-Core Intel® Xeon® processor 7000 sequence entry is

3. For VRM 11.0 mode, VRM_Pres# and VR_ID# should be held LOW for all combinations as described in

VID_

Select

VR10.2 mode

VR11.0 mode

required for backward compatibility for VR ‘modules’ only using the EVRD/VRM 10.2, but the VRM11.0 should be backward compatible with VRM10.2 platforms, as modular VRs can be transferred from one platform to another.

Section 6.

LL1 LL0 Load Line / Processors

0 00

0 01

0 10

0 11

1 00

101

1 10

111

VccMAX = VID (V) –1.25 mΩ • Icc (A) VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV VccMAX = VID (V) –1.25 mΩ • Icc (A) VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV VccMAX = VID (V) –1.25 mΩ • Icc (A) VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV

VccMAX = reserved

VccMIN = reserved VccMAX = VID (V) –1.00 mΩ • Icc (A) VccMIN = VID (V) –1.00 mΩ • Icc (A) –30 mV VccMAX = VID (V) –1.25 mΩ • Icc (A) VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV VccMAX = VID (V) –1.50 mΩ • Icc (A) VccMIN = VID (V) –1.50 mΩ • Icc (A) –30 mV VccMAX = VID (V) –1.25 mΩ • Icc (A) VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV

V2, 3

V1, 3

V3, 4

V1, 3

2.3 Voltage Tolerance - REQUIRED

The voltage ranges shown in Section 2.2 include the following tolerances:

• Initial DC output voltage set-point error.

• Output ripple and noise.

• No-load offset centering error.

• Current sensing and droop errors.

• Component aging affect.

• Full ambient temperature range and warm up.

• Dynamic output changes from minimum-to-maximum and maximum-to-minimum load should be measured at the point of regulation. When measuring the response of the die voltage to dynamic loads, use the VCC_DIE_SENSE and VSS_DIE_SENSE or VCC_DIE_SENSE2 and VSS_DIE_SENSE2 pins on the processor socket with an oscilloscope set to a DC to 20-100 MHz bandwidth limit and with probes that are

1.5 pF maximum and 1 MW minimum impedance.

• Variations of the input voltage.

315889-002 15

Output Voltage Requirements

2.4 Processor VCC Overshoot - REQUIRED

The VRM/EVRD 11.0 is permitted short transient overshoot events where Vcc exceeds the VID voltage when transitioning from a high-to-low current load condition (Figure 2-2). This overshoot cannot exceed VID + VOS_MAX. The overshoot duration, which is the time that the overshoot can remain above VID, cannot exceed TOS_MAX. These specifications apply to the processor die voltage as measured across the remote sense points and should be taken with the oscilloscope bandwidth setting limited to 20 MHz or 100 MHz, depending what is supported by your particular scope (with 20 MHz preference).

• VOS_MAX = Maximum overshoot voltage above VID = 50 mV

• TOS_MAX = Maximum overshoot time duration above VID = 25 µs

Figure 2-2. Processor Vcc Overshoot Example Waveform

VID + 0.050

Voltage [V]

VID - 0.000

0 5 10 15 20 25

Time [us]

TOS: Overshoot time above VID

: Overshoot voltage above VID

2.5 Impedance vs. Frequency - EXPECTED

Vcc power delivery designs can be susceptible to resonance phenomena capable of creating droop amplitudes that violate the load line specification. This is due to the frequency varied PCB, output decoupling and socket impedances from the power plane layout structures. Furthermore, these resonances may not be detected through standard time domain validation and require engineering analysis to identify and resolve.

Impedance vs. Frequency, Z(f) performance simulations of the power delivery network is a strongly recommended method to identify and resolve these impedances, in addition to meeting the time domain load line in Section 2.2 and Section 2.3. The decoupling selection needs to be analyzed to ensure that the impedance of the decoupling is below the load line target up to the F in Figure 2-3. Frequency domain load line and overshoot compliance is expected across the 0 Hz to FBREAK bandwidth. The power delivery frequency response is largely

BREAK (2 MHz) frequency as defined

16 315889-002

Output Voltage Requirements

dependent upon the selection of the bulk capacitors, ceramic capacitors, power plane routing and the tuning of the PWM controller’s feedback network. This analysis can be done with LGA771-V2 VTT tool impedance testing or through power delivery simulation if the designer can extract the parasitic resistance and inductance of the power planes on the motherboard along with good models for the decoupling capacitors.

Measured power delivery impedance should be within the tolerance band shown in

Figure 2-3. The tolerance band is defined for the VTT impedance measurement only.

For load line compliance, time domain validation is required and the VR tolerance band must be met at all times. Above 500 kHz, the minimum impedance tolerance is not defined and is determined by the MLCC capacitors required to get the ESL low enough to meet the load line impedance target of the F tolerance drops to the load line target impedance. Any resonance point that is above the ZMAX line needs to be carefully evaluated with the time domain method by applying transient loads at that frequency and looking for V the impedance profile up to FBREAK is important to ensure the package level decoupling properly matches the motherboard impedance. After FBREAK, the impedance measurement is permitted to rise at an inductive slope. The motherboard VR designer does not need to design for frequencies over F package decoupling takes over in the region above FBREAK.

Each of these design elements should be fully evaluated to create a cost optimized solution, capable of satisfying the processor requirements. Experimental procedures for measuring the Z(f) profile will be included (shortly) in the next revision of the EVRD_VRM11_0_LL_dVID LGA771_775-V2 VTT Tester-UG.pdf Test Methodology User’s Guide using the VTT. Additional background information regarding the theory of operation is provided in Appendix A.

BREAK frequency. At 700 kHz, the ZMAX

MAX or VMIN violations. Maintaining

BREAK as the Intel Microprocessor

Figure 2-3. Power Distribution Impedance vs. Frequency

Zone 1 PWM Droop control & compensation BW

LL Max

Z target = Z

LL Min

VR BW

500 kHz

Notes:

1. Zone 1 is defined by the VR closed loop compensation bandwidth (VR BW) of the voltage regulator. Typically 30-40 kHz for a 300 kHz voltage regulator design

2. Zones 2 & 3 are defined by the output filter capacitors and interconnect parasitic resistance and inductance. The tolerance is relaxed over 500 kHz allowing the VR designer freedom to select output filter capacitors. The goal is to keep Z(f) below Z bulk cap values, type and quantity of MLCC capacitors. The ideal impedance would be between Z Z

LLMin, but this may not be achieved with standard decoupling capacitors.

LL up to FBREAK (2 MHz) and as flat as practical, by selection of

Zone 2 Output Filter Bulk & MLCC

700 kHz

Zone 3 Inductive effects MLCC ESL + Socket

break

LL and

315889-002 17

Output Voltage Requirements

3. See Section 2.5 and Ta bl e 2 -4 , Impedance Measurement parameters and definitions

Table 2-4. Impedance Z

Processor

Dual-Core Intel

Quad-Core Intel

Dual-Core Intel

Quad-Core Intel

Dual-Core Intel

Quad-Core Intel

Xeon® Processor 5000 Series 1.25 mΩ 1.45 mΩ 1.05 mΩ 2.0 MHz

Xeon® Processor 5000 Series MV 1.25 mΩ 1.511 mΩ 0.989 mΩ 2.0 MHz

Xeon® Processor X5100 Series -Perf. 1.25 mΩ 1.583 mΩ 0.917 mΩ 2.0 MHz

Xeon® Processor E5100 Series 1.25 mΩ 1.583 mΩ 0.92 mΩ 2.0 MHz

Xeon® Processor L5100 Series LV 1.25 mΩ 1.917 mΩ 0.583 mΩ 2.0 MHz

Xeon® processor X5300 Series -Perf. 1.25 mΩ 1.49 mΩ 1.01 mΩ 2.0 MHz

Xeon® processor E5300 Series 1.25 mΩ 1.583 mΩ 0.917 mΩ 2.0 MHz

Xeon® processor L5300 Series- LV 1.25 mΩ 1.750 mΩ 0.750 mΩ 2.0 MHz

Xeon® Processor X5200 Series -Perf. 1.25 mΩ 1.583 mΩ 0.917 mΩ 2.0 MHz

Xeon® Processor E5200 Series 1.25 mΩ 1.673 mΩ 0.827 mΩ 2.0 MHz

Xeon® Processor L5238 Series 1.25 mΩ 1.850 mΩ 0.650 mΩ 2.0 MHz

Xeon® processor X5482 Series - Perf. 1.25 mΩ 1.450 mΩ 1.050 mΩ 2.0 MHz

Xeon® processor X5400 Series - Perf. 1.25 mΩ 1.490 mΩ 1.010 mΩ 2.0 MHz

Xeon® processor E5400 Series 1.25 mΩ 1.544 mΩ 0.956 mΩ 2.0 MHz

Xeon® processor L5400 Series 1.25 mΩ 1.750 mΩ 0.750 mΩ 2.0 MHz

Xeon® processor X7300 Series - Perf 1.25 mΩ 1.481 mΩ 1.019 mΩ 2.0 MHz

Xeon® processor E7300 Series 1.25 mΩ 1.583 mΩ 0.917 mΩ 2.0 MHz

Xeon® Processor 7200 Series 1.25 mΩ 1.583 mΩ 0.917 mΩ 2.0 MHz

Xeon® processor L7300 Series 1.25 mΩ 1.750 mΩ 0.750 mΩ 2.0 MHz

Measurement Parameter Limits

ZLL

ZLLMax

ZLLMin

Fbreak

Notes

Notes:

1. Z

2. Z

3. Z

is the target impedance for each processor and Z(f) value coincides with it’s Load Line slope.

is the max allowed Z

LLMAX

in Table 2 -3 ; Z IccMax.

is the min allowed Z

LLMIN

in Table 2 -3 ; Z IccMax.

is specific for each processor due to a specific combination of its Load Line value and

LLMAX

is specific for each processor due to a specific combination of its Load Line value and

LLMIN

tolerance, which still fits within the VccMax and VccMin Load Line limits listed

2.6 Stability - REQUIRED

The VRM/EVRD needs to be unconditionally stable under all specified output voltage ranges, current transients of any duty cycle, and repetition rates of up to 2 MHz. The VRM/EVRD should also be stable under a no load condition.

2.7 Processor Power Sequencing - REQUIRED

The VRM/EVRD must support platforms with defined power-up sequences. Figure 2-4 shows a timing diagram of the power-on sequencing requirements. Timing parameters for the power-on sequence are listed in Table 2 -5 .

18 315889-002

Output Voltage Requirements

Figure 2-4. Power-On Sequence Timing Diagram

BCLK [1:0]

(for reference only)

PWM Vcc

(5V/12V)

VTT

VTT_PWRGD

OUTEN

VID_SELECT

(pulled up to VTT)

Vcc_CPU

BOOT

=1.1V

VR_READY

VID bits

/ BSEL[2:0]

CPU_PWGOOD (from platform, for reference only)

(for reference only)

Notes:

1. VTT_PWRGD can be designed to be driving directly the OUTEN input.

2. Tb and Td voltage slopes are determined by soft start logic of the PWM controller.

3. Vboot is a default power-on Vcc (Core) value. Upon detection of a valid Vtt supply, the PWM controller is to

4. VTT is the processor termination regulator’s output voltage and the VTT_PWRGD is the VTT regulator’s

5. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

6. This specification requires that the VID signals be sampled no earlier than 10 µs after VCC (at VCC_BOOT

7. Parameter must be measured after applicable voltage level is stable. “Stable” means that the power supply

8. The maximum PWRGOOD rise time specification denotes the slowest allowable rise time for the processor.

RESET#

CCPLL

regulate to this value until the VID codes are read. The Vboot voltage is 1.1 V

power good status indicator.

voltage) and VTT are stable.

is in regulation as defined by the minimum and maximum DC/AC specifications for all components being powered by it.

Measured between (0.3 * VTT) and (0.7 * VTT).

VID code read by PWM at the end of Tc

VID valid

Table 2-5. Startup Sequence Timing Parameters (Sheet 1 of 2)

Timing Min Default Max Remarks

Ta =

PWM Vcc & Vtt to OUTEN delay time

Tb =

Vboot rise time

Tc =

Vboot to VID valid delay time

315889-002 19

02.0 ms5.0 ms

0.05 ms10.5 ms 10.0 ms

0.05 ms

3.0 ms

If the actual timing exceeds 2ms, the VTT VR must be capable of supporting full Itt surge current requirement per Proc’s latest EMTS

Programmable soft start ramp; Measured from 10-90% of slope

Output Voltage Requirements

Table 2-5. Startup Sequence Timing Parameters (Sheet 2 of 2)

Timing Min Default Max Remarks

Td =

VccCPU rise time to final VID

Te =

VccCPU to VR_READY assertion time

Tf =

Vtt rise time

Tg =

OUTEN to Vcc_CPU rising delay time

Note:

1. Minimum delays must be selected in a manner which will guarantee compliance to voltage tolerance specifications.

0 0.25 ms 2.5 ms

0.05 ms 3.0 ms

0.05 ms 10.0 ms

05.0 ms

Programmable soft start ramp; Measured from 10-90% of slope

Measured from 10-90% of slope

2.8 Dynamic Voltage Identification (D-VID) REQUIRED

VRM/EVRD 11.0 supports dynamic VID across the entire VID table. The VRM/EVRD must be capable of accepting voltage level changes of 12.5 mV steps every 5 µs. The low voltage state will be maintained for at least 50 µs. The worst case settling time, including line-to-line skew, for the seven VID lines is 400 ns. The VID inputs should contain circuitry to prevent false tripping or latching of VID codes during the settling time.

During a transition, the output voltage must be between the maximum voltage of the high range (“A” in Figure 2-5) and the minimum voltage of the low range (“B”). The VRM/EVRD must respond to a transition from VID-low to VID-high by regulating its Vcc output to the range defined by the new final VID code, within 50 µs of the final step. The time to move the output voltage from VID-high to VID-low will depend on the PWM controller design, the amount of system decoupling capacitance, and the processor load.

Figure 2-5 shows operating states as a representative processor changes levels. The

diagram assumes steady state, maximum current during the transition for ease of illustration; actual processor behavior allows for any dIcc/dt event during the transitions, depending on the code it is executing at that time. In the example, the processor begins in a high-load condition. In transitions 1-2 and 2-3, the processor prepares to switch to the low-voltage range with a transition to a low load condition, followed by an increased activity level. Transition 3-4 is a simplification of the multiple steps from the high-voltage load line to the low-voltage load line. Transition 4-5 is an example of a response to a load change during normal operation in the lower range.

20 315889-002

Output Voltage Requirements

Figure 2-5. Processor Transition States

VID High Load Line

VID Low Load Line

Figure 2-6 is an example of dynamic VID. The diagram assumes steady state, constant

current during the dynamic VID transition for ease of illustration; actual processor behavior allows for any dIcc/dt during the transitions, depending on the code it is executing at that time. Note that during dynamic VID, the processor will not output VID codes that would disable the voltage regulator output voltage.

Figure 2-6. Dynamic VID Transition States Illustration

ext.

VR11

VR10

table

table VID 5

VID 1

VID 0

VID 2

VID 1

VID 3

VID 2

VID 4

VID 3

VID 5

VID 4

VID 6

Note: VR11 table – VID 0 and extended VR10 table – VID 6 is reserved for future processors

worst case VID

36 VID steps @ 5 s each step = 180us

400ns

settling time

Icc-max

Upper equals

Final VID - 1.25 m * Icc

450mV

low VID to high VID

Vcc transition

high VID to low VID

Vcc transition

450mV

The diagram assumes steady state, constant current during the dynamic VID transitions for ease of illustration; actual processor behavior allows for any dIcc/dt event during the transitions, depending on the code it is executing at that time

Maximum

Vcc

settling

50µs maximum settling

from registering final VID

50µs maximum settling

from registering final VID

Lower equals

Start VID - 1.25 m * Icc -3 0mV

Upper equals

Final VID - 1.25 m * Icc

Lower equals

Start VID - 1.25 m * Icc -3 0mV

The processor load may not be sufficient to absorb all of the energy from the output capacitors on the baseboard, when VIDs change to a lower output voltage. The VRM/ EVRD design should ensure that any energy transfer from the capacitors does not impair the operation of the VRM/EVRD, the AC-DC supply, or any other parts of the system.

315889-002 21

Output Voltage Requirements

2.9 Overshoot at Turn-On or Turn-Off - REQUIRED

The core VRM/EVRD output voltage should remain within the load-line regulation band for the VID setting, while the VRM/EVRD is turning on or turning off, with no over or undershoot out of regulation. No negative voltage below –100 mV may be present at the VRM/EVRD output during turn-on or turn-off.

2.10 Output Filter Capacitance - REQUIRED

The output filter capacitance for the VRM/EVRD11.0 based designs will be located on the baseboard. The system design must ensure that the output voltage of the VRM/ EVRD conforms to the load line of Figure 2-2 and with the baseboard and processor loads. Table 2 -7 shows the number of decoupling caps recommended and other related specifications based on updated processor power requirements supported by VRM/ EVRD 11.0.

Table 2-6. Recommended Decoupling and Other Specifications for Supported

(Highest SKU) Processors - Summary

Processor

Dual-Core Intel Xeon ProcessorBased Server platform 8 layer (3PWR 3-GND and 2 SIG)

Dual-Core Intel Xeon ProcessorBased Server platform with Intel 5000 Chipsets 6 layer (2-PWR, 2GND and 2-SIG), 1 oz Cu

Dual-Core Intel Xeon ProcessorBased Server platform with Intel 5000 Chipsets 8 layer (3-PWR, 3GND and 2-SIG), 1 oz Cu

Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets Platform 8-Layer CRB MB

Dual-Core Intel Xeon 7000 Series processors with Intel 7300 Chipsets Platform 14-Layer CRB MB

560µF Alum-

Polymer

17 54

15 44

13 44

12 10 58 1000

18 65 1000 130 150

100µF

MLCC

10µF

MLCC

(0805)

(1206)

22 µF MLCC

Slew Rate

(di/dt)

A/µs

1200 130 150

Itdc (A)

Figure 2-7 through Figure 2-10 are recommended examples of baseboard decoupling

solutions and processor loads. Dual-Core Intel Xeon Processor-Based Server decoupling applies to all Dual-Core Intel Xeon Processor-Based Server/Dual-Core Intel Processor-Based Server/Dual-Core Intel Xeon Processor-Based Workstation platforms. The number of capacitors needed could change based on updated processor power requirements. The values shown are for a four to five phase 200 kHz to 700 kHz switching 150 A I

ccMAX/130 A IccTDC voltage regulator design with an output inductor

range of 0.15 µH to 0.5 µH. The type and number of bulk decoupling required is dependent on the voltage regulator design and it is highly recommended that the OEM work with the VR supplier for an optimal decoupling solution for their system and in accordance to the processor’s design requirements.

Max Icc

Xeon®

(A)

22 315889-002

Output Voltage Requirements

Figure 2-7. Six-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP Power

Delivery Impedance Model Path with 1206 Size Caps

15 X 560 uF

Aluminum-Polymer

0.40m

267 pH

Motherboard

35 X 10 uF

MLCC 1206

350 uF

0.09m

34 pH

58 pH

0.51m

90 uF8400 uF

0.4m

134 pH

9 X 10 uF

MLCC 1206

Socket and Package

20 pH

0.33m

Sense

Point

Figure 2-8. Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP

Power Delivery Impedance Model Path with 1206 Size Caps

13 X 560 uF

Aluminum-Polymer

0.46m

307 pH

Motherboard

35 X 10 uF

MLCC 1206

350 uF

0.09m

34 pH

Socket and Package

20 pH

0.33m

Sense

Point

90 uF7280 uF

0.4m

134 pH

9 X 10 uF

MLCC 1206

0.37m54 pH

Figure 2-9. Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP

Power Delivery Impedance Model Path with 0805 Size Caps

PWL

30A to 130A

1000A/uS

PWL

30A to 130A

1000A/uS

17 X 560 uF

Aluminum-Polymer

0.41m

235 pH

Motherboard

45 X 10 uF

MLCC 0805

450 uF

0.22m

25 pH

54 pH

0.43m

90 uF9520 uF

1.1m

122 pH

9 X 10 uF

MLCC 0805

Socket and Package

20 pH

0.33m

Sense

Point

30A to 130A

1000A/uS

PWL

The platform processor decoupling design incorporates fifteen 560 µF Aluminumpolymer bulk capacitors and forty four 10 µF 1206 package ceramic high-frequency capacitors per processor for a 6 layer board, thirteen 560 µF Aluminum-polymer bulk capacitors and forty four 10 µF 1206 package ceramic high-frequency capacitors per processor for a 8 layer board and seventeen 560 µF Aluminum-polymer bulk capacitors and fifty four 10 µF 0805 package ceramic high-frequency capacitors per processor for a 8 layer board (Table 2-8). At least nine of the 10 µF capacitors should be placed in the cavity of the processor socket. The remaining capacitors can be placed under the processor socket on the backside of the baseboard. The 560 µF capacitors should be placed along the sides of the processor socket, as close to the socket as the keep-out zones allow and on the south east side of the processor socket where the bulk of the power pins are located.

315889-002 23

Output Voltage Requirements

Note: The amount of bulk decoupling needed is dependent on the voltage regulator design.

Some multiphase buck regulators may have a higher switching frequency that would require a different output decoupling solution to meet the processor load line requirements than described in this document.

Table 2-7. Dual-Core Intel Xeon Processor-Based Server/Dual-Core Intel Xeon

Processor-Based Server-VS/Dual-Core Intel Xeon Processor-Based Workstation Platform Processor Decoupling Capacitor Recommendations

6 layers, (2 power, 2 ground, 2 signal), 1 oz Cu

Quantity Value Tolerance

15 560 µF Al-Polymer ±20% NA 7 4

35 10 µF 1206 Ceramic ±20% X5R or X6S 3 1.2

9 10 µF 1206 Ceramic ±20% X6S 3 1.2 1

8 layers, (3 power, 3 ground, 2 signal), 1 oz Cu

Quantity Value Tolerance

13 560 µF Al-Polymer ±20% NA 7 4

35 10 µF 1206 Ceramic ±20% X5R or X6S 3 1.2

9 10 µF 1206 Ceramic ±20% X6S 3 1.2 1

8 layers, (3 power, 3 ground, 2 signal), 1 oz Cu

Quantity Value Tolerance

17 560 µF Al-Polymer ±20% NA 7 4

45 10 µF 0805 Ceramic ±20% X5R or X6S 10 1.1

9 10 µF 0805 Ceramic ±20% X6S 10 1.1 1

Notes:

1. Only the decoupling caps inside the socket cavity need to have the temperature coefficient of “X6S”.

Temperature

Coefficient

Temperature

Coefficient

Temperature

Coefficient

ESR

(mΩ)

ESR

(mΩ)

ESR

(mΩ)

ESL

(nH)

ESL

(nH)

ESL

(nH)

Notes

Table 2-9. Dual-Core Intel Xeon 7000 Series with Intel 7300 Chipsets Platform Processor

Decoupling Capacitor Recommendations

Quantity Value / Description

18 560µF/2.5V/20%/ Oscon 6.3 3.2

65 22µF/6.3V/20%/ X5R /1206 MLCC 4 0.52

Notes: Dual-Core Intel Xeon 7000 Series processors with Intel 7300 Chipsets baseboard has 14-layers. Refer

24 315889-002

to the latest Dual-Core Intel Xeon 7000 Series processors with Intel 7300 Chipsets Platform Design Guide for baseboard stack-up details.

ESR

(mΩ)

ESL

(nH)

Notes

Output Voltage Requirements

Figure 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP

Power Delivery Impedance Model Path - Example

Low Fr Caps

12x 560µF

Oscon

6.72mF

0.58 mO

0.33 nH

Motherboard Socket & Package

HF Caps in

0.33 mO

0.56 mO

0.11 nH

socket cavity

9x 10µF

MLCC 1206

90µF

1000A/us

Mid Fr Caps

10x 100µF

MLCC 1210

1mF

0.4 mO

54 pH

0.51 mO

490µF

0.08 mO

HF Caps

49x 10µF

MLCC 1206

20 pH52 pH

20 pH

Sense

Point

30A to

130A

Table 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform Processor

Decoupling Capacitor Recommendations

Quantity Value Tolerance

12 560 µF Al-Polymer ±20% Oscon 7 4 1

10 100 µF 1210 MLCC ±10% X6S 4 0.52 1

58 10 µF 1206 MLCC ±10% X5R or X6S 5 1 1, 2

Notes:

1. Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets platform has 8-layer stackup. Refer to the latest Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets Platform Design Guide for baseboard stack-up details.

2. 9 of these HF caps are inside the processor socket cavity.

Temperature

Coefficient

ESR

(mΩ)

ESL

(nH)

Notes

315889-002 25

2.11 Shut-Down Response - REQUIRED

Once the VRM/EVRD is operating after power-up, if either the Output Enable signal is de-asserted or a specific VID off code is received, the VRM/EVRD must turn off its output (the output should go to high impedance) within 500 ms and latch off until power is cycled. If the extended VR 10 VID table is selected, the VRM/EVRD should turn off its output if VID [6:0] = XX11111. If the VR 11.0 VID table is selected, there are four VID off states; VID [6:0] = 0000000, 0000001, 1111110, or 1111111.

Output Voltage Requirements

26 315889-002

Control Signals

3 Control Signals

3.1 Output Enable (OUTEN) - REQUIRED

The VRM/EVRD must accept an input signal to enable its output voltage. When disabled, the regulator’s output should go to a high impedance state and should not sink or source current. When OUTEN is pulled low during the shutdown process, the VRM/EVRD must not exceed the previous voltage level regardless of the VID setting during the shutdown process. Once operating after power-up, it must respond to a deasserted OUTEN within 500 ms. The circuitry driving OUTEN is an open-collector/ drain signal. It is EXPECTED that the pull-up resistor will be located on the baseboard and will not be integrated into the PWM controller chip or VRM.

Table 3-1. OUTEN Specifications

Symbol Parameter Min Max Units

VIH Input Voltage High 0.8 3.465 V

VIL Input Voltage Low 0 0.4 V

3.2 Voltage Identification (VID [6:0]) - REQUIRED

The VRM/EVRD must accept a 7-bit code, VID [6:0], from the processor to set the reference Vcc operating voltage. Two VID code standards are supported within the VRM/EVRD 11.0 specification. The first is an extended VR 10 table that is fully compliant to the VRM/EVRD 10.2 standard, but adds an additional bit for 6.25 mV VID resolution. (See Table 3-3) The second is a VR 11.0 standard defined in Ta bl e 3-4. The VID_Select pin, Section 3.4, will identify which table is to be used. Designers should note that although the VR 11.0 VID code is comprised of eight bits, VID 7 is a provision for future Itanium-based processors. The VID 7 pin should be connected to V GND on the VRM module’s printed circuit board. The platforms targeted by this design guideline will only require VID [6:0].

If an “OFF” VID code is received, such as when no processor is installed, the regulator must disable its output voltage. If this disable code appears during previously normal operation, the regulator shall turn off its output within 500 ms. The circuitry driving each VID [6:0] signal can be an open-collector/drain or a push-pull output type gate. When driven by an open-collector / drain, these VID signals need to be pulled-up to the processor’s VTT voltage. Consult the appropriate platform design guide for the recommended pull-up resistor value. A typical value used is 510 Ohms. When driven by a push-pull output gate, the pull-up resistors are optional. Consult the appropriate processor EMTS for driver definition. Pull-ups to 12 V or 5 V are not supported by the CPU package and therefore are not permitted. It is EXPECTED that the pull-up resistors will be located on the baseboard and will not be integrated into the PWM controller chip or VRM.

Table 3-2. VID [6:0] Specifications

SS, VO- or

Symbol Parameter Min Max Units Notes

Note: 1) Other platform components may use VID inputs and may require tighter limits.

315889-002 27

Input High Voltage 0.8 VTT max V 1

Input Low Voltage 0 0.4 V 1

Table 3-3. Extended VR 10 Voltage Identification (VID) Table

VI D4 VI D3 VI D2 VI D1 VI D0 VI D5 VI D6 Vol t age VI D4 VI D3 VI D2 VI D1 VI D0 VI D5 VI D6 Vol t a ge

400 mV 200 mV 100 mV 50 mV 25 mV 12.5 mV 6. 25 mV (V) 400 mV 200 mV 100 mV 50 mV 25 mV 12.5 mV 6.25 mV ( V)

01010111.6 11010111.2

01010101.5937511010101.19375

01011011.587

01011001.5812511011001.18125

01011111.57

01011101.5687511011101.16875

01100011.562

01100001.5562511100001.15625

01100111.55 11100111.15

01100101.5437511100101.14375

01101011.537

01101001.5312511101001.13125

01101111.52

01101101.5187511101101.11875

01110011.512

01110001.5062511110001.10625

01110111.5 11110111.1

01110101.4937511110101.09375

01111011.487

01111001.481251111100OFF

01111111.47

01111101.468751111110OFF

10000011.462

10000001.4562500000001.08125

10000111.45 00000111.07

10000101.4437500000101.06875

10001011.437

10001001.4312500001001.05625

10001111.42

10001101.4187500001101.04375

10010011.412

10010001.4062500010001.03125

10010111.4 00010111.02

10010101.3937500010101.01875

10011011.387

10011001.3812500011001.00625

10011111.37

10011101.3687500011100.99375

10100011.362

10100001.3562500100000.98125

10100111.35 00100110.97

10100101.3437500100100.96875

10101011.337

10101001.3312500101000.95625

10101111.32

10101101.3187500101100.94375

10110011.312

10110001.3062500110000.93125

10110111.3 00110110.92

10110101.2937500110100.91875

10111011.287

10111001.2812500111000.90625

10111111.27

10111101.2687500111100.89375

11000011.262

11000001.2562501000000.88125

11000111.25 01000110.87

11000101.2437501000100.86875

11001011.237

11001001.2312501001000.85625

11001111.22

11001101.2187501001100.84375

11010011.212

11010001.2062501010000.83125

11011011.187

11011111.17

11100011.162

11101011.137

11101111.12

11110011.112

1111101OFF

1111111OFF

00000011.087

00001011.062

00001111.05

00010011.037

00011011.012

00011111

00100010.987

00101010.962

00101110.95

00110010.937

00111010.912

00111110.9

01000010.887

01001010.862

01001110.85

01010010.837

Control Signals

Note: An OFF VID code is equivalent to de-asserting the output enable input (Section 3.1).

28 315889-002

Control Signals

Table 3-4. VR 11.0 Voltage Identification (VID) Table

Note: Only VID [6.0] are used for VRM/EVRD 11.0 platforms. The eighth VID bit is provisional for future

Itanium-based platforms.

3.3 Differential Remote Sense (VO_SEN+/-) REQUIRED

The PWM controller shall include differential sense inputs to compensate for an output voltage offset of less than 300 mV in the power distribution path. This common mode voltage is expected to occur due to transient currents and parasitic inductances and is not expected to be caused by parasitic resistances.

It’s recommended that the remote sense lines’ current draw will not push the actual Load Line outside of the Load Line limits shown in Ta bl e 2- 3. As a practical guideline to minimizing offset errors, it is recommended that the combination of the sense resistor values and the remote sense current draw will result in the total DC voltage offset <= 2mV.

Note: V

315889-002 29

CC_DIE_SENSE, VSS_DIE_SENSE, VCC_DIE_SENSE2 and VSS_DIE_SENSE2 of the processor pins

are to be used as the VR sense input.

Figure 3-1. Remote Sense Routing example.

LGA 771 Socket

1 of 9

10µF

In µP

Cavity

Pin AL8

Pin AL7

Pin AN3

Pin AN4

VCC_ DIE_ SENSE2

High Impedance Path

1k 1 %

VSS_ DI E_ SENSE2

VCC_ DI E_ SENSE

VSS_ DIE_ SENSE

High Impedance Path

1k 1 %

10 1%

10 1 %

Control Signals

VCC/ VSS Feedback

Inputs

EVRD11. 0 Controller or

VRM 11. 0 Connector

Notes: For each processor, refer to the appropriate platform design guide (PDG) for the recommended VR’s

remote sense routing.

The sense lines should be routed based on the following guidelines:

• Route differentially with a maximum of 5 mils separation.

• Traces should be at least 25 mils thick, but may be reduced when routed through the processor pin field.

• Traces should have the same length.

• Traces should not exceed 5 inches in length and should not violate pulse-width modulation (PWM) vendor length requirements.

• Traces should be routed at least 20 mils away from other signals.

• Each sense line should include a 0 – 100 Ω, 5% series resistor that is placed close to the PWM or VRM connector in order to filter noise from the power planes. Designers should consult with their power delivery solution vendor to determine the appropriate resistor value.

• Reference a solid ground plane.

• Avoid switching layers.

On a VRM, the positive sense line will be connected to VO_SEN+ and the negative sense line will be connected to VO_SEN–.

The processor V

CC_DIE_SENSE, VSS_DIE_SENSE, VCC_DIE_SENSE2 and VSS_DIE_SENSE2 pins

should be connected to test points on the baseboard in order to probe the die voltage. These test points should be as close to the socket pins as possible.

A high impedance path (100X) should be routed to the center of the processor socket and terminated to one of the nine 10 µF capacitors. This provision serves as a precautionary regulation point, in the event the EVRD/VRM is powered on and processor is installed.

30 315889-002

Control Signals

3.4 Load Line Select (LL0, LL1, VID_Select) REQUIRED

The VID_Select, LL1 and LL0 control signal form a 3-bit load line selection and will used to configure the VRM/EVRD to supply the proper load line for the processors. These signals are programmed by the CPU package pin bonding. The VID_Select control signal will select the appropriate VR10 or VR11 VID table and remap the VID [6:0] pins to the appropriate DAC input. The signals are open-collector/drain or equivalent signals. Table 3-5 shows the VID_Select, LL1, and LL0 pins specification and Ta bl e 3-6 shows equations in how to obtain V

MAX

and V code. For VRMs a set of additional signals extent the usability of a modular solution, refer to Figure 6-1.

It is EXPECTED that the pull-up resistors for LL0 and LL1 will be located on the baseboard and will not be integrated into the VRM. However, the pull-up resistor for VID_Select should be located on the VRM and to maintain backward compatibility to VRM 10.2 compliant platforms a pull-down resistor of 10 kΩ is also required. The pulldown resistor is required for VRMs only and not required for EVRDs. Typically, for EVRD converters, this signal will be pulled up to VTT (1.1 V/1.2 V) via a 4.7 kΩ resistor. As an option, 3.3 V with ± 5% regulation tolerance, may be used instead of VTT for VRM or EVRD converters. Pull-ups to 12 V or 5 V are not supported by the CPU package.

The VR 10 and VR 11.0 VID pins do not have the same voltage weight. See Tabl e 3-6 for the VID bit mapping.

based on LL0, LL1, and VID_Select bit

MIN

Table 3-5. LL0, LL1, VID_Select Specifications

Symbol Parameter Min Max Units

Output Low Current 0 4 mA

Input Voltage High 0.8 3.465 V

Input Voltage Low 0 0.4 V

Table 3-6. VID Bit Mapping

VR 10.x - VID 4 VID 3 VID 2 VID 1 VID 0 VID 5 VID 6

bit

weight

VR 11.0 VID 7 VID 6 VID 5 VID 4 VID 3 VID 2 VID 1 VID 0

800mV 400mV 200mV 100mV 50mV 25mV 12.5mV 6.25mV

315889-002 31

Control Signals

32 315889-002

Input Voltage and Current

4 Input Voltage and Current

4.1 Input Voltages - EXPECTED

The power source for the VRM/EVRD is 12 V +5% / –8%. This voltage is supplied by a separate power supply. For input voltages outside the normal operating range, the VRM/EVRD should either operate properly or shut down.

4.2 Load Transient Effects on Input Current EXPECTED

The design of the VRM/EVRD, including the input power delivery filter, must ensure that the maximum slew rate of the input current does not exceed 0.5 A/µs, or as specified by the separate power supply.

Note: In the case of a VRM design, the input power delivery filter may be located either on

the VRM or on the baseboard. The decision for the placement of the filter will need to be coordinated between the baseboard and VRM designers.

It is recommended that the bulk input decoupling (with optional series 0.1-1 µH inductor) be placed on the baseboard by the VRM input connector and high frequency decoupling on the VRM module. Expected baseboard decoupling should be between 1000 µF to 2240 µF depending on VRM design and system power supply.

315889-002 33

Input Voltage and Current

34 315889-002

Processor Voltage Output Protection

5 Processor Voltage Output

Protection

These are features built into the VRM/EVRD to prevent fire, smoke or damage to itself, the processor, or other system components.

5.1 Over-Voltage Protection (OVP) - EXPECTED

The OVP circuit monitors the processor core voltage (Vcc) for an over-voltage condition. If the output is more than 200 mV above the VID level, the VRM/EVRD shuts off the output.

5.2 Over-Current Protection (OCP) - EXPECTED

The core VRM/EVRD should be capable of withstanding a continuous, abnormally low resistance on the output without damage or over-stress to the unit. Output current under this condition will be limited to no more than 120% of the maximum peak rated output of the voltage regulator at thermal equilibrium under the specified ambient temperature and airflow.

315889-002 35

Processor Voltage Output Protection

36 315889-002

Output Indicators

6 Output Indicators

6.1 Voltage Regulator Ready (VR_Ready) - REQUIRED

The VRM/EVRD VR_Ready signal is an output signal that indicates the start-up sequence is complete and the output voltage has moved to the programmed VID value. This signal will be used for start-up sequencing for other voltage regulators, clocks, and microprocessor reset. This signal is not a representation of the accuracy of the DC output to its VID value.

The platform VR_Ready signal(s) will be connected to logic to assert CPU or system PWRGD. The value of the resistor and the pull-up voltage will be determined by the circuitry on the baseboard that is receiving this signal. Typically a 1 kΩ pull to 3.3 V is used. This signal should not be de-asserted during dynamic VID operation. It should remain asserted during normal DC-DC operating conditions and only de-assert for fault shutdown conditions. It will be an open-collector/drain or equivalent signal. The pull-up resistor and voltage source will be located on the baseboard. Table 6 -1 shows the VR_Ready pin specification.

Table 6-1. VR_Ready Specifications

Symbol Parameter Min Max Units

Output Low Current 1 4 mA

Output High Voltage 0.8 3.465 V

Output Low Voltage 0 0.4 V

6.2 Voltage Regulator Hot (VR_hot#) - PROPOSED

The VRM/EVRD VR_hot# signal is an output signal that is asserted low when a thermal event is detected in the converter. Assertion of this signal will be used by the system to minimize damage to the converter due to the thermal conditions. Tab le 6-2 shows the VR_hot# signal specification. This signal will be an open-collector/drain or equivalent signal and needs to be pulled up to an appropriate voltage through a pull-up resistor on the baseboard. A typical implementation would be a 50 Ω ±5% resistor pulled up to

1.1 V/1.2 V. For platforms using a voltage higher than 1.1 V /1.2 V, a voltage level translation is required. Processors do not tolerate such voltage levels directly. Consult the appropriate PDG.

Table 6-2. VR_hot# Specifications

Symbol Parameter Min Max Units

Each customer is responsible for identifying maximum temperature specifications for all components in the VRM/EVRD design and ensuring that these specifications are not violated while continuously drawing specified Icc (TDC) levels. In the occurrence of a thermal event, a thermal sense circuit may assert the processor’s FORCEPR# signal immediately prior to exceeding maximum VRM, baseboard, and/or component thermal ratings to prevent heat damage. The assertion may be made through direct connection

Output Low Current 19.9 30 mA

Output High Voltage 0.8 3.465 V

Output Low Voltage 0 0.4 V

315889-002 37

to the FORCEPR# pin or through system management logic. Assertion of this signal will lower processor power consumption and reduce current draw through the voltage regulator, resulting in lower component temperatures. Sustained assertion of the FORCEPR# pin will cause noticeable platform performance degradation and should not occur when drawing less than the specified thermal design current for a properly designed system.

It is recommended that hysteresis be designed into the thermal sense circuit to prevent a scenario in which the VR_hot# signal is rapidly being asserted and de-asserted.

6.3 Load Indicator Output (Load_Current) PROPOSED

The VRM/EVRD may have an output with a voltage (Load_Current) level that varies linearly with the VRM/EVRD output current. The PWM controller supplier may specify a voltage-current relationship consistent with the controller’s current sensing method. Baseboard designers may route this output to a test point for system validation.

6.4 VRM Present (VRM_pres#) - EXPECTED

The VRM should have the VRM_pres# signal. This signal is an output signal used to indicate to the system that a VRM 10.x compatible module is plugged into the socket. VRM_pres# is an open-collector/drain or equivalent signal. Table 6-3 shows the VRM_pres# pin specification. It is EXPECTED that the pull-up resistor will be located on the baseboard and will not be integrated into the VRM.

Output Indicators

Table 6-3. VRM_pres# Specifications

Symbol Parameter Min Max Units

Output Low Current 0 4 mA

Output High Voltage 0.8 5.5 V

Output Low Voltage 0 0.4 V

6.5 VR_Identification (VR_ID#) - EXPECTED

The VRM should have the VR_ID# signal. This signal is an output signal used to indicate to the system that a VR11-compatible VRM is plugged into the socket.

VR_ID# is an open-collector/drain or equivalent signal. Tab le 6-4 shows the VR_ID# pin specification. It is EXPECTED that the pull-up resistor will be located on the baseboard and will not be integrated into the VRM.

The VR_ID# signal combined with the VRM_pres# signal forms a two-bit VRM identification code to indicate the type of module installed in a system. Figure 6-1 defines the two signal decode.

Table 6-4. VRM_ID# Specifications

Symbol Parameter Min Max Units

Output Low Current 0 4 mA

Output High Voltage 0.8 5.5 V

Output Low Voltage 0 0.4 V

38 315889-002

Output Indicators

)

Figure 6-1. VRM 11.0 and Platform Present Detection

RM_Pres#

(MB Pull-up,

VRM Pull-

DWN)

00 0 00

00 0 01

00 0 10Possible, ref Table 2-3 Possible, ref Table 2-3

mode

00 0 11 00 1 00

00 1 01 00 1 10

mode

00 1 11

0 1 0 0 0 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 0 0 1 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 0 1 0 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 0 1 1 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 1 0 0 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 1 0 1 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 1 1 0 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 0 1 1 1 1 N/A No Turn On VRM 10.2 present Not possible, no pullup for VR_ID# 1 0 0 0 0 N/A no module present Not possible, no pullup for VR_ID# 1 0 0 0 1 N/A no module present Not possible, no pullup for VR_ID# 1 0 0 1 0 N/A no module present Not possible, no pullup for VR_ID# 1 0 0 1 1 N/A no module present Not possible, no pullup for VR_ID# 1 0 1 0 0 N/A no module present Not possible, no pullup for VR_ID# 1 0 1 0 1 N/A no module present Not possible, no pullup for VR_ID# 1 0 1 1 0 N/A no module present Not possible, no pullup for VR_ID# 1 0 1 1 1 N/A no module present Not possible, no pullup for VR_ID# 1 1 0 0 0 N/A no module present no module present 1 1 0 0 1 N/A no module present no module present 1 1 0 1 0 N/A no module present no module present 1 1 0 1 1 N/A no module present no module present 1 1 1 0 0 N/A no module present no module present 1 1 1 0 1 N/A no module present no module present

non-valid code

1 1 1 1 0 N/A no module

RID#

(MB

PullUP,

VRM Pull

DWN

VID_SELECT

(VRM Pulldwn,

Platform

pullup)

LL1

(MB

PullUP,

CPU Pull

DWN)

Outcome VRD11.0 Module

LL0

(MB

Pull UP,

CPU Pull

(130Atdc, 150Apk, VID11.0

and VID10.2 compat, 30mV

DWN)

Outcome in VRM11.0

tol)

Possible, ref Table 2-3 Possible, ref Table 2-3 Reserved Possible, ref Table 2-3 Possible, ref Table 2-3 Reserved

Possible, ref Table 2-3 Possible, ref Table 2-3 Reserved Possible, ref Table 2-3 Possible, ref Table 2-3 Not possible, no pullup for VID_Select Possible, ref Table 2-3 Possible, ref Table 2-3 Not possible, no pullup for VID_Select Possible, ref Table 2-3 Possible, ref Table 2-3 Not possible, no pullup for VID_Select Possible, ref Table 2-3 Possible, ref Table 2-3 Not possible, no pullup for VID_Select

Platform

resent no module present

Outcome in VRM10.2 Platform

(VRM11.0 Backward Compatible;

VR10.2 platform doesn't have

VR_ID# and VID_Select)

Dual-Core Intel® Xeon® 7100 series processors (1.25mOHM / VID10.2)

315889-002 39

Output Indicators

40 315889-002

VRM – Mechanical Guidelines

7 VRM – Mechanical Guidelines

7.1 VRM Connector - EXPECTED

The part number and vendor name for VRM 11.0 connectors that can be found in

Tabl e 7-1 . The VRM reference in Section 7.2, Section 7.3 and Section 7.4, is based on

the Tyco*/Elcon* interface with the system board is a 27-pin pair edge connector. The connector uses latches to hold the VRM in place. The connector will be rated to handle a continuous load current of 130 A.

Table 7-1. VRM 11.0 Connector Part Number and Vendor Name

Connector Vendor Part Number Notes

1651929-1 (Solder Tail)

Tyco / Elcon

Molex

1766336-1 (Surface Mount) 1766436-1 (Press-Fit)

Molex iCool* VRM 24 signal 70 power pins 87787-1012 (Vertical, TH) 87786-1011 (Vertical, SM) 87818-1011 (Right Angle, TH)

1, 2

Notes:

1. These vendors are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.

2. An alternative connector has been identified by Molex for VRMs. This alternative provides many optional connector variants already in production in both vertical and horizontal (right angle) implementation. Contact your Molex representative for pin assignment, mechanical form factor details and performance characteristic data.

7.2 VRM (Tyco/Elcon) Connector Keying

7.2.1 Connector Keying

• Single notch between pins 3 and 4 (51 and 52 opposite side).

• Single notch between pins 12 and 13 (42 and 43 opposite side).

• Single notch between pins 21 and 22 (33 and 34 opposite side).

7.2.2 Connector Pin 1 Orientation

Referencing Figure 7-1, Outline Drawing, Far Side (FS) pins sequence 1 through 27, left to right. Near Side (NS) pins sequence 54 through 28. Pin 1 and 54 are opposite one another.

7.3 Pin Descriptions and Assignments

Tabl e 7-2 shows the VRM11.0 connector pin description. Pin assignments are shown in Tabl e 7-1 .

315889-002 41

Table 7-2. VRM 11.0 Connector Pin Descriptions

Name Type Description

Load_Current Output Analog signal representing the output load current

OUTEN Input Output enable

VR_Ready Output Output signal indicating that the start-up sequence is complete and the

VID [6:0]

VIN+ Power VRM Input Voltage VIN− Ground VRM Input Ground

VO+ Power VRM Output Voltage VO− Ground VRM Output Ground

VO_SEN+ VO_SEN–

VR_hot# Output Indicates to the system that a thermal event has been detected in the VR

VRM_pres# Output Indicates to the system that a VR10-compatible VRM is plugged into the

VR_ID# Output Indicates to the system that a VR11-compatible VRM is plugged into the

LL0, LL1 Input Used to configure VR load line value

VID_Select Input Used to select between extended VR10 and VR11 VID tables

Input Voltage ID pins used to specify the VRM output voltage

Input Output voltage sense pins

output voltage has moved to the programmed VID value.

socket

VRM – Mechanical Guidelines

Note: VID7 bit is not routed from the PWM control IC to the VRM connector; VID7is to be held Low on the VRM

board.

42 315889-002

VRM – Mechanical Guidelines

Figure 7-1. VRM 11.0 Pin Assignments

1 VIN− 54 VIN+

2 VIN− 53 VIN+

KEY

3 VIN− 52 VIN+

4 VID4 51 VID3

5 VID2 50 VID1

6 VID0 49 VID5

7 VO_SEN+ 48 VO_SEN−

8 VR_Ready 47 VR_hot#

9 OUTEN 46 LL0

10 Load_Current 45 LL1

11 VID6 44 VID_Select

12 VRM_pres# 43 VR_ID#

13 VO+ 42 VO+

14 VO+ 41 VO+

15 VO+ 40 VO+

16 VO− 39 VO−

17 VO− 38 VO−

18 VO− 37 VO−

19 VO+ 36 VO+

20 VO+ 35 VO+

21 VO+ 34 VO+

22 VO− 33 VO−

23 VO− 32 VO−

24 VO− 31 VO−

25 VO+ 30 VO+

26 VO+ 29 VO+

27 VO+ 28 VO+

KEY

7.4 Mechanical Dimensions - PROPOSED

The mechanical dimensions for the VRM 11.0 module and connector are shown in

Figure 7-1.

7.4.1 Gold Finger Specification

The VRM board must contain gold lands (fingers) for interfacing with the VRM connector that is 1.50 mm ±0.2 mm [0.059” ±0.008”] wide by 6.00 mm [0.236”] minimum long and spaced 2.50 mm [0.098”] apart. Traces from the lands to the power plane should be a minimum of 0.89 mm [0.035”] wide and of a minimal length.

315889-002 43

Figure 7-1. VRM 11.0 Module and Connector

96.52mm (3.80") MAX

VRM – Mechanical Guidelines

15.50mm (0.610")

9.03mm

(0.356")

MAX

51.84mm (2.04”)

13.50mm (0.531")

3.00mm (0.118")

13.18mm (0.519")

PIN 54

PIN 1

PIN 54

3.33mm (0.131")

PIN 1

2X R2.00mm (R0.08")

Component

Keepout

1.70mm (0.067")

22.97mm (0.904")

OPEN Latches 114.98mm (4.527") MAX

CLOSED Latches 102.5mm (4.035") MAX

36.07mm (1.420")

10.53mm(0.415")

5.08mm (0.200")

PCB Footprint

View A

93.34mm (3.675") MAX

NEAR SIDE Components

FAR SIDE Components

Connector Length 97.54mm (3.840") MAX

66.77mm (2.629")

8x2.50mm

(0.098")

7.87mm (0.310")

28.9mm (1.138")

9.70mm (0.382")

hole diameter

54x1.02+/-0.08mm

(.040+/-.003")

22.88mm (0.901")

12x2.50mm

(0.098")

View B

PIN 28

8.04mm (0.316")

65.34mm (2.57")

MAX

10.16mm (0.4") MAX

(0.059 +/- 0.008")

14.27mm (0.562")

MAX

R 0.65mm

(R0.026")

20.0mm (0.79")

1.50+/- 0.2mm

1.80mm (0.071")

View B

4.05mm (0.159")

59.3mm (2.33")

Ref.

7.0mm

(0.276")

View A

1.00+0/- 0.13mm

(0.039+0/-0.005")

PCB

Edge Card

Cont acts

1.57mm +/- 0.20

66.34mm (2.612")

MAX

12.0mm (0.47")

6.00mm (0.236")

0.50mm (.020")

(.062" +/-.008)

44 315889-002

Environmental Conditions

8 Environmental Conditions

The VRM/EVRD design, including materials, should meet the environmental requirements specified below.

8.1 Operating Temperature - PROPOSED

The VRM/EVRD shall meet all electrical requirements when operated at the Thermal Design Current (Icc minimum airflow of 400 LFM (2 m/s). The volumetric airflow (Q) can be measured through a wind tunnel. For testing, the baseboard should be mounted in a duct. (A VRM should be mounted on a PCB, and then mounted in a duct.) The recommended duct cross-section, assuming the PCB is horizontal and flush with the bottom of the duct, is as follows:

• Y direction duct width (perpendicular to flow, horizontal) = 0.3 m

• Z direction duct height (perpendicular to flow, vertical) = 0.15 m

• Minimum X direction duct length in front of VRM = 6 hydraulic diameters = 1.2 m

• Minimum X direction duct length behind VRM = 2 hydraulic diameters = 0.4 m

• Velocity (v) is calculated from the volumetric flow and cross-sectional area at the inlet as:

• v = Q/(0.3 x 0.15)m2 Operating conditions shall be considered to include 10 cycles between min and max temperature at a rate of 10ºC/hour and a dwell time of 30 minutes at extremes. Temperature and airflow measurements should be made in close proximity to the VRM.

) over an ambient temperature range of 0ºC to +45ºC with a

TDC

8.2 VRM Board Temperature - REQUIRED

To maintain the connector within its operating temperature range, the VRM board temperature, at the connector interface, shall not exceed a temperature equal to 90ºC. At no time during the operation is the board permitted to exceed 90ºC within a distance of 2.54 mm [0.100”] from the top of connector (0.4 in. from board edge). In order not to exceed 90ºC, it is recommended that the board be constructed from 2-ounce copper cladding. Temperature and airflow measurements should be made in close proximity to the VRM.

8.3 Non-Operating Temperature - PROPOSED

The VRM/EVRD shall not be damaged when exposed to temperatures between –40ºC and +70ºC. These shall be considered to include 50 cycles of minimum to maximum temperatures at 20ºC/hour with a dwell time of 20 minutes at the extremes.

8.4 Humidity - PROPOSED

85% relative – operating

95% relative – non-operating

315889-002 45

8.5 Altitude - PROPOSED

3.05 km [10 k feet] – operating

15.24 km [50 k feet] – non-operating

8.6 Electrostatic Discharge - PROPOSED

Testing shall be in accordance with IEC 61000-4-2.

Operating – 15 kV initialization level. The direct ESD event shall cause no out-ofregulation conditions – including overshoot, undershoot and nuisance trips of overvoltage protection, over-current protection or remote shutdown circuitry.

Non-operating –25 kV initialization level. The direct ESD event shall not cause damage to the VRM circuitry.

8.7 Shock and Vibration - PROPOSED

The shock and vibration tests should be applied at the baseboard level. The VRM/EVRD should not be damaged and the interconnect integrity not compromised during:

• A shock of 50 g (± 10%) with velocity change of 170 inches/sec (± 10%) applied three times in each of the orthogonal axes.

• Vibration of 0.01 g² per Hz at 5 Hz, sloping to 0.02 g² per Hz at 20 Hz and maintaining 0.02 g² per Hz from 20 Hz to 500 Hz for 10 minute per axis applied in each of the orthogonal axes.

Environmental Conditions

8.8 Electromagnetic Compatibility - PROPOSED

Design, including materials, should be consistent with the manufacture of units that comply with the limits of FCC Class B and CISPR22 Class B for radiated emissions.

8.9 Reliability - PROPOSED

Design, including materials, should be consistent with the manufacture of units with a Mean Time Between Failure (MTBF) of 500,000 hours of continuous operation at 55ºC, maximum-outputs load, and worst-case line, while meeting specified requirements. MTBF should be calculated in accordance with MIL-STD-217F or Bellcore.

8.10 Safety - PROPOSED

The voltage regulator is to be UL Recognized to standard UL1950 3rd Ed., including requirements of IEC950 and EN 60950. Plastic parts and printed wiring board are to be UL Recognized with 94V-0-flame class.

46 315889-002

Manufacturing Considerations

9 Manufacturing Considerations

9.1 Lead Free (Pb Free)

The use of lead in electronic products is an increasingly visible environmental and political concern. The drivers for the reduction or elimination of lead in electronic products include:

• Customer desire for environmentally friendly (‘green’) products.

• Manufacturer desire to be environmentally friendly, and be perceived as such.

• Government initiatives regarding recycling of electronic products.

• Planned and potential legislation.

The most notable legislation is the European Union (EU) Restriction on Hazardous Materials directive, also known as RoHS. The commission directive may be found at the following URL:

http://europa.eu.int/eur-lex/pri/en/oj/dat/2003/l_037/ l_03720030213en00190023.pdf

European Union “Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead...” Each EU country will implement this law and establish penalties and fines for non-compliance. The RoHS directive includes certain exemptions:

• Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead).

• Lead in solders for servers, storage and storage array systems (exemption granted until 2010).

• Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication.

• Lead in electronic ceramic parts (e.g. piezoelectronic devices).

For the latest information on RoHS please refer to the following URL:

http://europa.eu.int/eur-lex/en

Intel recommends that you consider Pb Free manufacturing processes and components for the module and module connector.

315889-002 47

Manufacturing Considerations

48 315889-002

Z(f) Constant Output Impedance Design

A Z(f) Constant Output

Impedance Design

A.1 Introduction - PROPOSED

The VRM/EVRD performance specification is based on the concept of output impedance, commonly known as the load line. The impedance is determined by the Pulse Width Modulator (PWM) controller’s Adaptive Voltage Positioning (AVP), up to the loop bandwidth of the regulator and the impedance of the output filter and socket beyond the loop bandwidth.

Figure A-1. Typical Intel

Microprocessor Voltage Regulator Validation Setup

ZPCB1 ZPCB2 ZPskt

Vin

PWM

ZBulk

ZHF1 ZHF2

VFB

VTT

315889-002 49

Figure A-2. Z(f) Network Plot with 1.25 mΩ Load Line

Z(f) Constant Output Impedance Design

The impedance plot Z(f) shown in Figure A-2 can be divided up into three major areas of interest.

• Low frequency, Zero Hz (DC) to the VR loop bandwidth. This is set by AVP and loop compensation of the VR controller or PWM control IC.

• Middle frequency, VR loop bandwidth to socket inductance rise - This is set by the bulk capacitors, MLCC capacitors and PCB layout parasitic elements.

• High frequency, controlled by socket inductance and the CPU package design.

The VRM/EVRD designer has control of the low and mid frequency impedance design. By ensuring these areas meet the load line target impedance in Section 2.2, the system design will work properly with future CPU package designs.

Figure A-2 shows the impedance vs. frequency network the system in Figure 2-1. This

example consists of 17 560 μF with an ESR of 7 mΩ and ESL of 4 nH per bulk capacitors, 1 0805 MLCC, with ESR is 10 mΩ and ESL of 1.1 nH, 2

PCB impedance of 1.0 μΩ and 0.05 pH between the bulk and 45 10 μF

PCB impedance of 1.0 μΩ and

0.05 pH between the 45 10 μF and the 9 10 μF 0805 MLCC in the socket cavity with ESR is 10 mΩ and ESL of 1.1 nH, and the LGA771 socket impedance of 330

μΩ and 20 pH.

The resonant point seen at 400 kHz is due to the mis-match between the bulk capacitors and the MLCC cavity capacitors. Increasing the capacitance values will drop the magnitude and shift the to a lower resonance frequency. For example, if the 10 capacitors are increased to 22

μF, the resonant peak drops in magnitude to 1.0 mΩ and

μF

at a frequency of 200 kHz. The resonant peak could also be reduced by reducing the ESL of the bulk capacitors by changing capacitor technology or by adding more bulk

50 315889-002

Z(f) Constant Output Impedance Design

capacitors in parallel. The effect of the mid frequency resonant point must be investigated and validated with Vdroop testing to ensure any current load transient pattern, does not violate the V

load line.

min

By defining the output impedance load line over a frequency range, the voltage regulation or voltage droop is defined at any current level as the output current multiplied by the impedance value. Currently, output impedance is validated in the time domain by measuring the voltage response to a known current step. In Figure A-1, the VTT tool replaces the CPU and the package for platform validation purposes. Typical measured voltage and currents are depicted in Figure A-3. The transient load line is defined as the voltage droop magnitude during the current rise time divided by the current step. The static load line is defined as the voltage level magnitude, after settling, divided by the current step. It is desired to have both the transient and static load line equal.

Figure A-3. Time Domain Response of a Microprocessor Voltage Regulator

The static and transient load line measurements, measure the quality of different parts of the voltage regulator design. The transient load line is governed by the parasitic impedances in the output filter board layout, decoupling capacitors, and power distribution network. The static load line is governed by the PWM controller's AVP accuracy. The time domain Vdroop testing method gives pass, fail data on meeting the target specification, but gives little insight as to how to improve the voltage regulator's response. It can be difficult to determine if you need more bulk capacitance, more high frequency MLCC capacitance or higher loop bandwidth from the time domain Vdroop waveforms. By measuring the impedance, Z(f) of the voltage regulator, these tradeoffs and optimizations can be made.

The impedance can be measured with a network analyzer, but the network analyzer can only measure the passive filter components and will not show the effects of the VR loop bandwidth and AVP. Also MLCC capacitors impedance varies with DC bias and AC ripple

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Z(f) Constant Output Impedance Design

frequency applied by the application. Hence a better method is needed to extract the impedance profile with the VR operating. The following sections introduce the theory behind using a VTT tool to create an impedance profile for the VR system.

A.2 Voltage Transient Tool (VTT) Z(f) Theory

The following expression is the definition of impedance as a function of frequency looking back from the VTT tool into the filter network and VRM.

tVFFT

fZ =

)(

The representation of the corresponding Fourier spectra of the voltage and current responses are shown in Figure A-2. The first harmonic values from the Fast Fourier Transform (FFT) are used in the calculation of Z(f). The ratio of the two, yields the impedance at a given frequency, f. By sweeping the VTT generated load transient repetition rate, I(t), over the desired region of interest, additional points are estimated on the impedance profile to obtain a near continuous impedance spectrum plot.

In the VTT tool, the die voltage, V(t), is brought out through a pair of non-current carrying remote sense pins, tied to the Vcc and Vss power plane and measured on the VTT tool substrate. The current, I(t), is a differential voltage measured across the current shunt resistors in the VTT tool. The oscilloscope's math function is used to convert the time domain voltage droop and current measurements into their corresponding frequency domain spectrum. Since the FFT of the actual response waveforms are calculated, perfect square waves of current are not needed as a stimulus. The accuracy and frequency response of this method is limited to the current shunt resistor's accuracy and the shunt's parasitic inductance. Parasitic inductance in the current shunt resistors will over estimate the actual current and hence the method will under estimate the impedance at frequencies where the inductive voltage drop dominates the resistive voltage drop. The 50 pH of parasitic inductance in the VTT causes an over estimation of current for frequencies over 1 MHz and an under estimation of impedance. This can be corrected by post processing of the data and removing the inductive voltage spike.

))((

tIFFT

))((

52 315889-002

Z(f) Constant Output Impedance Design

Figure A-4. Time Domain Responses and Corresponding Fourier Spectra

of Voltage, Current and Impedance

A.3 VTT Z(f) Measurement Method

An electronic load that has the capability to change the repetition rate up to 3 MHz of the load step is needed. The Intel LGA771/775V2 VTT by Cascade Systems Design, will meet this requirement. By monitoring the VTT current and voltage waveforms with an oscilloscope capable of executing an FFT on these waveforms, the platform impedance is found. A complete impedance profile is then generated by sweeping the input waveform frequency across the range of interest. In order to automate the data collection process, Intel has modified the VTT control software and a GPIB controlled oscilloscope is used along with software supplied with the VTT.

These utilities allow the user to automatically display and collect the magnitude and phase of the motherboard impedance in a Microsoft Excel* compatible data file. The total time it takes to extract the impedance profile using this method is about 1-2 minutes. This technique is very useful in investigating and assuring MB performance based on its stack up.

For more information on the measurement method and theory, see the paper Microprocessor Platform Impedance Characterization using VTT Tools by K. Aygun, S. Chickamenahalli, K. Eilert, M. Hill, K. Radhakrishnan and E. Stanford published at the IEEE Applied Power Electronics Conference, 2005.

A.4 Results

As an example, Figure A-5 shows the test platform with 10 560 μF Al-Poly bulk capacitors and 10 10 cavity. Figure A-6 is the measured impedance profile of the board shown in Figure A-5 as capacitors are removed. The VID setting for this measurement was 1.35 V and load

μF and 8 22 μF high frequency MLCC capacitors in the socket

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Z(f) Constant Output Impedance Design

current was 40 A. The waveforms show the effect of capacitor depopulation on the impedance profile above 1 MHz as pairs of high frequency MLCC capacitors are removed (banks 1-9) per the bank designations depicted in Figure A-7.

Simulation comparisons are made in Figure A-8 for the two extreme cases of the decoupling conditions of Figure A-7, with all MLCC plus two Al-Poly bulk capacitors in place and all cavity MLCCs plus two Al-Poly bulk capacitors removed. Simulation depicts a 6-layer distributed motherboard model. The VR model has a Type III feedback compensated switching VR (swvr) and an average model (avgvr). It can be observed from Figure A-8 that the switching model measurements agrees better beyond the VR bandwidth (40 kHz) than the average model, while the average VR model performance agrees with the overall trend. Slightly lower average model impedances are also observed and other disagreements are attributed to imperfect assumptions about the parasitics of the devices and specific adaptive voltage implementation in the VR models.

Figure A-5. Photo of Motherboard Analyzed Showing High Frequency

MLCC Capacitors In the Socket Cavity and Bulk Capacitors

54 315889-002

Z(f) Constant Output Impedance Design

Figure A-6. Measured Platform Impedance Profile Showing Change

in Impedance as Capacitors Are Removed

Magnitude of impedance profile

magnitude (mohms)

all caps installed

1. 2x 10uF removed

2. 2x 10uF removed

3. 2x 10uF removed

4. 2x 22uF removed

5. 10, 22 uF removed

6. 2x 22uF removed

7. 10, 22uF removed

8. 2x 10uF removed

9. 2x 22uF removed MLCC + 1 Bulk remo ved MLCC +2 Bulk removed

0.001 0.01 0.1 1 10 100

frequency (MHz)

Figure A-7. Designations of MLCC Cavity Capacitor Banks

10uF

22uF

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Z(f) Constant Output Impedance Design

Figure A-8. Simulated and Measured Waveforms of Platform Impedance Profile

measured vs simulated results

meas:allcaps

meas:bank1-9+2oscons sim:swvr-allcaps

sim:avgvr-allcaps sim:swvr-bank1-9+2osc

sim:avgvr-bank1-9+2osc

impedance (mohms)

0 10

-3

-2

-1

frequency(MHz)

A.5 Output Decoupling Design Procedure

1. Select type and number of bulk capacitors. Normally the equivalent ESR needs to

be approximately ½ the load line target impedance. For a 1.25 mΩ load line, the equivalent ESR should be less than 0.625 mΩ. The reason for selecting the number of bulk capacitors to yield an equivalent ESR to be ½ the target impedance is to compensate for the parasitic resistance of the PCB layout plane shapes and for aging of the capacitors. This is a starting point for the design. The final number of bulk capacitors will be determined by transient droop testing and Z(f) measurements.

2. The type and number of MLCC capacitors in the socket cavity is specified in the

Section 2.10. These are required to meet both power delivery impedance and

signal integrity issues.

3. Design the PWM loop bandwidth compensation. The ideal loop BW is set at the frequency where the bulk capacitor impedance meets the target impedance curve. In Figure A-2, it is approximately 30 kHz. Small increases in the loop bandwidth will not improve system performance until the bandwidth is moved to where the MLCC impedance meets the target impedance at ~ 700 kHz which is impractical.

Consult the PWM chip manufacturer's data sheets and application notes on calculating the PWM loop compensation and AVP programming values.

56 315889-002

Intel 315889-002 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0

Contents

Figures

Tables

Revision History

1 Applications

1.1 Introduction and Terminology

2 Output Voltage Requirements

2.1 Voltage and Current - REQUIRED

2.2 Load Line Definitions - REQUIRED

2.3 Voltage Tolerance - REQUIRED

2.4 Processor VCC Overshoot - REQUIRED

2.5 Impedance vs. Frequency - EXPECTED

2.6 Stability - REQUIRED

2.7 Processor Power Sequencing - REQUIRED

2.9 Overshoot at Turn-On or Turn-Off - REQUIRED

2.10 Output Filter Capacitance - REQUIRED

2.11 Shut-Down Response - REQUIRED

3 Control Signals

3.1 Output Enable (OUTEN) - REQUIRED

3.2 Voltage Identification (VID [6:0]) - REQUIRED

4 Input Voltage and Current

4.1 Input Voltages - EXPECTED

Processor Voltage Output Protection

5.1 Over-Voltage Protection (OVP) - EXPECTED

5.2 Over-Current Protection (OCP) - EXPECTED

6 Output Indicators

6.1 Voltage Regulator Ready (VR_Ready) - REQUIRED

6.2 Voltage Regulator Hot (VR_hot#) - PROPOSED

6.4 VRM Present (VRM_pres#) - EXPECTED

6.5 VR_Identification (VR_ID#) - EXPECTED

7.1 VRM Connector - EXPECTED

7.2 VRM (Tyco/Elcon) Connector Keying

7.2.1 Connector Keying

7.2.2 Connector Pin 1 Orientation

7.3 Pin Descriptions and Assignments

7.4 Mechanical Dimensions - PROPOSED

7.4.1 Gold Finger Specification

8 Environmental Conditions

8.1 Operating Temperature - PROPOSED

8.2 VRM Board Temperature - REQUIRED

8.3 Non-Operating Temperature - PROPOSED

8.4 Humidity - PROPOSED

8.5 Altitude - PROPOSED

8.6 Electrostatic Discharge - PROPOSED

8.7 Shock and Vibration - PROPOSED

8.8 Electromagnetic Compatibility - PROPOSED

8.9 Reliability - PROPOSED

8.10 Safety - PROPOSED

9 Manufacturing Considerations

9.1 Lead Free (Pb Free)

A.1 Introduction - PROPOSED

A.2 Voltage Transient Tool (VTT) Z(f) Theory

A.3 VTT Z(f) Measurement Method

A.4 Results

A.5 Output Decoupling Design Procedure