Intel 315889-002 User Manual
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0
Design Guidelines
April 2008
Reference Number: 315889-002
Notice: This document contains information on products in the design phase of development. The information here is subject to change without
notice. Do not finalize a design with this information.
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2 315889-002
.
Contents
1Applications...............................................................................................................9
1.1 Introduction and Terminology ...............................................................................9
2 Output Voltage Requirements.................................................................................. 11
2.1 Voltage and Current - REQUIRED......................................................................... 11
2.2 Load Line Definitions - REQUIRED........................................................................ 13
2.3 Voltage Tolerance - REQUIRED............................................................................ 15
2.4 Processor VCC Overshoot - REQUIRED ................................................................. 16
2.5 Impedance vs. Frequency - EXPECTED.................................................................16
2.6 Stability - REQUIRED .........................................................................................18
2.7 Processor Power Sequencing - REQUIRED............................................................. 18
2.8 Dynamic Voltage Identification (D-VID) - REQUIRED ..............................................20
2.9 Overshoot at Turn-On or Turn-Off - REQUIRED...................................................... 22
2.10 Output Filter Capacitance - REQUIRED ................................................................. 22
2.11 Shut-Down Response - REQUIRED.......................................................................26
3 Control Signals ........................................................................................................ 27
3.1 Output Enable (OUTEN) - REQUIRED.................................................................... 27
3.2 Voltage Identification (VID [6:0]) - REQUIRED ...................................................... 27
3.3 Differential Remote Sense (VO_SEN+/-) - REQUIRED............................................. 29
3.4 Load Line Select (LL0, LL1, VID_Select) - REQUIRED .............................................31
4 Input Voltage and Current .......................................................................................33
4.1 Input Voltages - EXPECTED ................................................................................33
4.2 Load Transient Effects on Input Current - EXPECTED.............................................. 33
5 Processor Voltage Output Protection ....................................................................... 35
5.1 Over-Voltage Protection (OVP) - EXPECTED ..........................................................35
5.2 Over-Current Protection (OCP) - EXPECTED .......................................................... 35
6 Output Indicators .................................................................................................... 37
6.1 Voltage Regulator Ready (VR_Ready) - REQUIRED................................................. 37
6.2 Voltage Regulator Hot (VR_hot#) - PROPOSED......................................................37
6.3 Load Indicator Output (Load_Current) - PROPOSED ...............................................38
6.4 VRM Present (VRM_pres#) - EXPECTED................................................................ 38
6.5 VR_Identification (VR_ID#) - EXPECTED ..............................................................38
7 VRM – Mechanical Guidelines................................................................................... 41
7.1 VRM Connector - EXPECTED................................................................................ 41
7.2 VRM (Tyco/Elcon) Connector Keying .................................................................... 41
7.2.1 Connector Keying...................................................................................41
7.2.2 Connector Pin 1 Orientation ..................................................................... 41
7.3 Pin Descriptions and Assignments........................................................................ 41
7.4 Mechanical Dimensions - PROPOSED.................................................................... 43
7.4.1 Gold Finger Specification ......................................................................... 43
8 Environmental Conditions........................................................................................45
8.1 Operating Temperature - PROPOSED ................................................................... 45
8.2 VRM Board Temperature - REQUIRED .................................................................. 45
8.3 Non-Operating Temperature - PROPOSED.............................................................45
8.4 Humidity - PROPOSED .......................................................................................45
8.5 Altitude - PROPOSED ......................................................................................... 46
8.6 Electrostatic Discharge - PROPOSED ....................................................................46
8.7 Shock and Vibration - PROPOSED ........................................................................46
8.8 Electromagnetic Compatibility - PROPOSED........................................................... 46
8.9 Reliability - PROPOSED ......................................................................................46
315889-002 3
8.10 Safety - PROPOSED ...........................................................................................46
9 Manufacturing Considerations..................................................................................47
9.1 Lead Free (Pb Free) ...........................................................................................47
A Z(f) Constant Output Impedance Design..................................................................49
A.1 Introduction - PROPOSED ...................................................................................49
A.2 Voltage Transient Tool (VTT) Z(f) Theory ..............................................................52
A.3 VTT Z(f) Measurement Method ............................................................................53
A.4 Results.............................................................................................................53
A.5 Output Decoupling Design Procedure....................................................................56
Figures
2-1 VRM/EVRD 11.0 Load Current vs. Time.................................................................12
2-2 Processor Vcc Overshoot Example Waveform.........................................................16
2-3 Power Distribution Impedance vs. Frequency.........................................................17
2-4 Power-On Sequence Timing Diagram....................................................................19
2-5 Processor Transition States .................................................................................21
2-6 Dynamic VID Transition States Illustration ............................................................21
2-7 Six-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 1206 Size Caps.....................................23
2-8 Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 1206 Size Caps.....................................23
2-9 Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP
Power Delivery Impedance Model Path with 0805 Size Caps.....................................23
2-10 Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP
Power Delivery Impedance Model Path - Example...................................................25
3-1 Remote Sense Routing example...........................................................................30
6-1 VRM 11.0 and Platform Present Detection .............................................................39
7-1 VRM 11.0 Pin Assignments..................................................................................43
7-1 VRM 11.0 Module and Connector..........................................................................44
A-1 Typical Intel® Microprocessor Voltage Regulator Validation Setup ............................49
A-2 Z(f) Network Plot with 1.25 mW Load Line ............................................................50
A-3 Time Domain Response of a Microprocessor Voltage Regulator.................................51
A-4 Time Domain Responses and Corresponding Fourier Spectra
of Voltage, Current and Impedance......................................................................53
A-5 Photo of Motherboard Analyzed Showing High Frequency
MLCC Capacitors In the Socket Cavity and Bulk Capacitors......................................54
A-6 Measured Platform Impedance Profile Showing Change
in Impedance as Capacitors Are Removed.............................................................55
A-7 Designations of MLCC Cavity Capacitor Banks........................................................55
A-8 Simulated and Measured Waveforms of Platform Impedance Profile..........................56
Tables
1-1 VRM/EVRD 11.0 Supported Platforms and Processors............................................... 9
1-2 Guideline Categories ..........................................................................................10
2-1 Processor VID signal implementation ....................................................................11
2-2 Icc Guidelines ...................................................................................................13
2-3 VID_Select, LL1, LL0 Codes.................................................................................14
2-4 Impedance Z
2-5 Startup Sequence Timing Parameters...................................................................19
4 315889-002
Measurement Parameter Limits ......................................................18
LL
2-6 Recommended Decoupling and Other Specifications for Supported
(Highest SKU) Processors - Summary .................................................................. 22
2-7 Dual-Core Intel Xeon Processor-Based Server/Dual-Core Intel Xeon
Processor-Based Server-VS/Dual-Core Intel Xeon Processor-Based
Workstation Platform Processor Decoupling Capacitor Recommendations .................. 24
2-8 ......................................................................................................................24
2-9 Dual-Core Intel Xeon 7000 Series with Intel 7300 Chipsets Platform
Processor Decoupling Capacitor Recommendations ................................................ 24
2-10 Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform
Processor Decoupling Capacitor Recommendations ................................................ 25
3-1 OUTEN Specifications......................................................................................... 27
3-2 VID [6:0] Specifications .....................................................................................27
3-3 Extended VR 10 Voltage Identification (VID) Table................................................. 28
3-4 VR 11.0 Voltage Identification (VID) Table............................................................ 29
3-5 LL0, LL1, VID_Select Specifications...................................................................... 31
3-6 VID Bit Mapping................................................................................................ 31
6-1 VR_Ready Specifications .................................................................................... 37
6-2 VR_hot# Specifications ...................................................................................... 37
6-3 VRM_pres# Specifications .................................................................................. 38
6-4 VRM_ID# Specifications ..................................................................................... 38
7-1 VRM 11.0 Connector Part Number and Vendor Name..............................................41
7-2 VRM 11.0 Connector Pin Descriptions...................................................................42
315889-002 5
Revision History
Rev # Description Rev. Date
001 • Initial Release November 2006
002
• General- Update Harpertown and Wolfdale-DP to public names
• Table 2-3 correction - Loadline ID codes for 5400/5200 series processors
April 2008
6 315889-002
The following table lists the revision schedule based on revision number and development stage of the
product.
Revision Project Document State Projects Covered
0.5 Preliminary Targets HW, SW
0.5 to 0.9 Updates to Most Recent Update or 0.5 HW, SW
1.0 Design Frozen HW, SW
1.0 to 1.5 Updates to Most Recent Update or 1.0 HW, SW
1.5 Preliminary Validation Data (Doc-Dependent) HW Only
1.6 to 1.75 Updates to Most Recent Update or 1.5 HW Only
1.75 (Optional) Final Validation Data (Doc-Dependent) HW Only
1.76 to 1.9 Updates to Most Recent Update or 1.75 HW Only
Launch Launch Documents HW Only
Note: Not all revisions may be published.
§
315889-002 7
8 315889-002
Applications
1 Applications
1.1 Introduction and Terminology
This document defines the DC-to-DC converters to meet the processor power
requirements of the following platforms:
Table 1-1. VRM/EVRD 11.0 Supported Platforms and Processors
Dual-Core Intel® Xeon® 5000 Sequence Platform with Intel® 5000P Express Chipset, Intel® 5000V
Chipset, Intel® 5000X Chipset, Intel® 5100 Chipset, Intel® 5400A Chipset, or Intel® 5400B Chipset
®
Dual-Core Intel
5000 Series
Dual-Core Intel
5200 Series
Dual-Core Intel® Xeon® Processor 7000 Sequence-Based Platform with Intel® 7300 Chipset
Dual-Core Intel
7200 Series
Xeon® Processor
®
Xeon® Processor
®
Xeon® Processor
Dual-Core Intel® Xeon® Processor
5100 Series
Quad-Core Intel® Xeon® Processor
5400 Series
Quad-Core Intel® Xeon® processor
7300 Series
Quad-Core Intel® Xeon®
processor 5300 Series
The requirements in this document will focus primarily on the Enterprise processors
based on Dual-Core Intel
®
Xeon® Processor-based Server and Quad-Core Intel®
Xeon® Processor-based Server/Workstation platforms. Some requirements will vary
according to the needs of different computer systems and processors. The intent of this
document is to define the electrical, thermal and mechanical design specifications for
VRM/EVRD 11.0.
VRM – The voltage regulator module (VRM) designation in this document refers to a
voltage regulator that is plugged into a baseboard via a connector or soldered in with
signal and power leads, where the baseboard is designed to support more than one
processor. VRM output requirements in this document are intended to match the needs
of a set of microprocessors.
EVRD – The enterprise voltage regulator down (EVRD) designation in this document
refers to a voltage regulator that is permanently embedded on a baseboard. The EVRD
output requirements in this document are intended to match the needs of a set of
microprocessors. EVRD designs are only required to meet the specifications of a
specific baseboard and thus must meet the specifications of all the processors
supported by that baseboard.
‘1’ – In this document, refers to a high voltage level (V
‘0’ – In this document, refers to a low voltage level (V
and VIH).
OH
and VIL).
OL
‘X’ – In this document, refers to a high or low voltage level (Don’t Care).
‘#’ – Symbol after a signal name in this document, refers to an active low signal,
indicating that a signal is in the asserted state when driven to a low level.
The specifications in the respective processors’ Electrical, Mechanical, and Thermal
Specifications (EMTS) documents always take precedence over the data provided in
this document.
VRM/EVRD 11.0 incorporates functional changes from prior VRM and EVRD design
guidelines:
315889-002 9
• New power-on sequence
• Extended VR 10.x VID table with a 7th bit for 6.25 mV resolution and 0.83125 V to
1.6 V range, only 12.5 mV resolution will be used in Dual-Core Intel Xeon
Processor-Based Platform and Intel E8500 platforms.
• Support for a separate additional VR 11.0 VID table with a 8-bit table and 6.25 mV
resolution with a 31.25 mV to 1.6 V VID range, only 12.5 mV resolution will be
used in Dual-Core Intel Xeon Processor-Based Servers and Intel E8500 platforms
with a VID setpoint range of 0.850 V to 1.6 V.
• Tighter DC load line tolerance from ±20 mV to ±15 mV
Table 1-2. Guideline Categories
REQUIRED:
EXPECTED:
PROPOSED:
An essential feature of the design that must be supported to ensure correct processor and
VRM/EVRD functionality.
A feature to ensure correct VRM/EVRD and processor functionality that can be supported
using an alternate solution. The feature is necessary for consistency among system and
power designs and is traditionally modified only for custom configurations. The feature may
be modified or expanded by system OEMs, if the intended functionality is fully supported.
A feature that adds optional functionality to the VRM/EVRD and therefore is included as a
design target. May be specified or expanded by a system OEMs.
Applications
Guideline Categories
§
10 315889-002
Output Voltage Requirements
2 Output Voltage Requirements
2.1 Voltage and Current - REQUIRED
There will be independent selectable voltage identification (VID) codes for the core
voltage regulator. The VID code is provided by the processor to the VRM/EVRDs, which
will determine a reference output voltage, as described in Section 3.2. As previously
mentioned, the VR 11.0 controller will support two VID tables:
1. An extended 7-bit VR 10.x table, ranging from 0.83125 V to 1.6 V
2. An 8-bit VR11.0 linear table ranging from 0.03125 V to 1.6 V (usable range 0.5 V-
1.6 V).
For Dual-Core Intel Xeon Processor 7000/7100/7200/5000/5100/5200 Series -based
servers and Quad-Core Intel Xeon Processor 7300/5300/5400 Series -based servers/
workstations, the VID bits utilization will be as shown in the table below. Section 2.2
and Section 2.3 specify deviations from the VID reference voltage.
Table 2-1. Processor VID signal implementation
VID Signals used
Processor Supported
Dual-Core Intel® Xeon®
Processor 7000/7100 Series
processor
Dual-Core Intel® Xeon®
Processor 5000 Series
Dual-Core Intel® Xeon®
Processor 5100 Series, QuadCore Intel® Xeon® Processor
5300 Series, Dual-Core
Intel® Xeon® Processor
5200 Series, or Quad-Core
Intel® Xeon® Processor
5400 Series processors
Quad-Core Intel(R) Xeon(R)
Processor 7300 Series &
Dual-Core Intel(R) Xeon(R)
Processor 7200 Series
processors
by Processor and
routed to VR with
Pull-Up resistors
VID[4:0,5]
(VID4=MSB
VID5=LSB)
VID[4:0,5]
(VID4=MSB
VID5=LSB)
VID[6:1]
VID[6:1]
Notes
VR10.2 mode; VID6 is not driven on the processor
package (socket 604), but should be routed on the VR
side with a pullup resistor; VR’s VID7 to be pulled
Low.
VR10.2 mode; Land AM5 (equivalent to platform
signal VID6) is not driven on the processor package,
but still routed to VID6 on VR side with a pullup
resistor; VR’s VID7 to be pulled Low.
VR11.0 mode; Land AM2 (equivalent to platform
signal VID0) is connected to VSS on the processor
package, and routed to VID0 on VR side with a pullup
resistor; VR’s VID7 to be pulled Low.
VR11.0 mode; VID0 is not driven on the processor
package (socket 604P), but should be routed on the
VR side and pulled Low; VR’s VID7 to be pulled Low.
The load line tolerance in Section 2.2 shows the relationship between Vcc and Icc at the
die of the processor.
The VRM/EVRD 11.0 is required to support the following:
• A maximum continuous load current (I
CCTDC) of 130 A.
• A maximum load current (ICCMAX) of 150 A peak.
• A maximum load current step (I
• A maximum current slew rate (dI
CCSTEP), within a 1 µs period, of 100 A.
CC/dt) of 1200 A/µs at the lands of the processor.
315889-002 11
Output Voltage Requirements
The continuous load current (ICCTDC) can also be referred to as the Thermal Design
Current (TDC). It is the sustained DC equivalent current that the processor is capable
of drawing indefinitely and defines the current that is used for the voltage regulator
temperature assessment. At TDC, switching FETs may reach maximum allowed
temperatures and may heat the baseboard layers and neighboring components. The
envelope of the system operating conditions, establishes actual component and
baseboard temperatures. This includes voltage regulator layout, processor fan
selection, ambient temperature, chassis configuration, etc. To avoid heat related
failures, baseboards should be validated for thermal compliance under the envelope of
the system’s operating conditions. It is proposed that voltage regulator thermal
protection be implemented for all designs (Section 6.2).
The maximum load current (I
CCMAX) represents the maximum peak current that the
processor is capable of drawing. It is the maximum current the VRM/EVRD must be
electrically designed to support without tripping any protection circuitry.
The maximum step load current (IccStep) is the max dynamic step load that the
processor is expected to impose on its Vcc power rail within the Iccmin and Iccmax
range, where the Iccmin is the processor’s min load, constituted by its leakage current.
The amount of time required by the VR to supply current to the processor is dependent
on the processor’s operational activity. As previously mentioned, the processor is
capable of drawing IccTDC indefinitely; therefore, the VR must be able to supply
CCTDC) indefinitely. Refer to Figure 2-1 for the time durations required by the VR to
(I
supply current for various processor loads.
It is expected that the maximum load current (I
10 ms. Further, it is expected that the load current averaged over a period of
100 seconds or greater, will be equal to or less than the thermal design current
CCTDC).
(I
Figure 2-1. VRM/EVRD 11.0 Load Current vs. Time
Icc MAX
CCMAX) can be drawn for periods up to
Sustained Current (A)
Icc TDC
0.01 0.10 1.00 10.00 100.0 1000.0
Time Duration (s)
Table 2-2 shows the ICC guidelines for any flexible motherboard (FMB) frequencies
supported by the VRM/EVRD 11.0 in Tabl e 1-1 . For designers who choose to design
their VR thermal solution to the I
regulator thermal protection circuitry be implemented (see Section 6.2).
12 315889-002
CCTDC current, it is recommended that voltage
Output Voltage Requirements
Table 2-2. Icc Guidelines
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Quad-Core Intel
Quad-Core Intel
Quad-Core Intel
Dual-Core Intel
Dual-Core Intel
Dual-Core Intel
Quad-Core Intel
Quad-Core Intel
Quad-Core Intel
Quad-Core Intel
Quad-Core Intel
Quad-Core Intel
Dual-Core Intel
Quad-Core Intel
®
Xeon® processor 7000 sequence FMB 130 150 100 1, 2
®
Xeon® 7100 series processor FMB 115 135 100 1, 2
®
Xeon® Processor 5000 Series FMB 130 150 90 1, 2
®
Xeon® Processor 5000 Series MV/667 FMB 100 115 76 1, 2
®
Xeon® Processor X5160 Series Performance FMB 70 90 40 1, 2
®
Xeon® Processor E5100 Series FMB 65 75 30 1, 2
®
Xeon® Processor L5148/5138/5128 Series FMB 35 45 25 1, 2
®
Xeon® processor X5300 Series Performance FMB 110 125 70 1, 2
®
Xeon® processor E5300 Series FMB 70 90 50 1, 2
®
Xeon® processor L5300 Series-LV FMB 50 60 35 1, 2
®
Xeon® Processor X5200 Series 70 90 37 1, 2
®
Xeon® Processor E5200 ( 60 75 21 1, 2
®
Xeon® Processor L5200 Series 38 50 36 1, 2
®
Xeon® Processor X5482 130 150 67 1, 2
®
Xeon® Processor X5400 Series 110 125 68 1, 2
®
Xeon® Processor E5400 Series 80 102 65 1, 2
®
Xeon® Processor L5400 Series 50 60 60 1, 2
®
Xeon® Processor X7300 Series 110 130 78 1, 2
®
Xeon® Processor E7300 Series 75 90 72 1, 2
®
Xeon® Processor 7200 Series 75 90 72 1, 2
®
Xeon® Processor L7300 Series 50 60 54 1, 2
Processor
I
CCTDC
(A)
CCMAX
I
(A)
CCSTEP
I
(A)
Notes
Notes:
1. These values are either pre-silicon or the latest known values and are subject to change. See the respective
Processor’s Electrical, Mechanical, and Thermal Specifications (EMTS) for the latest IccTDC and IccMAX
specifications.
2. FMB = Planned Flexible Motherboard guideline for processor end-of-life.
3. Voltage regulator thermal protection circuitry should not trip for load currents greater than ICCTDC
4. For platforms designed to support several processors, the highest current value should be used.
5. For platforms designed to support a single specific processor, only use that processor’s current
requirements.
2.2 Load Line Definitions - REQUIRED
To ensure processor reliability and performance, platform DC and AC transient voltage
regulation must be contained within the V
boundaries, except for short burst transients above the V
Section 2.4. Die load line compliance must be guaranteed across 3-sigma component
manufacturing tolerances, thermal variation and age degradation. The following load
line contains static and transient voltage regulation data as well as maximum and
minimum voltage levels. It is required that the regulator’s positive and negative
differential remote sense pins be connected to both the V
CC_DIE_SENSE2 and VSS_DIE_SENSE2 pin pairs of the processor socket, see Figure 3-1.
V
The prefix V
CC is designated for the positive remote sense signal and the VSS prefix for
the negative remote sense signal.
315889-002 13
CCMIN and the VCCMAX die load line
CCMAX as specified in
CC_DIE_SENSE, VSS_DIE_SENSE,
The upper and lower load lines represent the allowable range of voltages that must be
presented to the processor. The voltage must always stay within these boundaries for
proper operation of the processor. Operating above the V
in higher processor operating temperature, which may result in damage or a reduced
processor lifespan. Processor temperature rise from higher functional voltages may
lead to dynamic operation to low power states, which directly reduces processor
performance. Operating below the V
CCMIN load line limit will result in minimum voltage
violations, which will result in reduced processor performance, system lock up, “blue
screens” or data corruption.
For load line validation information, please refer to the LGA771-V2 Voltage Test Tool
User’s Guide.
Figure 2-2 and Figure 2-2 shows the load line voltage offsets and current levels based
on the VID specifications for the core regulator.
The encoding in Table 2-2 for the load lines is valid for the range of load current from
0 A to 150 A. The VID_Select, load line 1 (LL1), and load line 0 (LL0) control signals
from Section 3.4, form a 3-bit load line selection and will be used to configure the VRM/
EVRD to supply the proper load lines for the platforms in Table 1-1 . Refer to Figure 6-1
for additional encoding requirements for VRMs. For implementation of VID_Select, LL0,
and LL1 on the baseboard refer to the appropriate platform design guidelines. The
VID_Select control signal will select the appropriate VR10 or VR11 table and remap the
external VID [6:0] pins to the appropriate DAC input. This line will be pulled up
externally to the VTT rail (1.1 V/1.2 V ± 5%) via a recommended 4.7 kΩ resistor on the
baseboard and will be programmed by the processor package. The processor does not
support 5 V or 12 V levels and these should not be used. The VID_Select signal should
be logic low or tied to ground for extended VR10 table selection. A logic high will
.
indicate a VR11 table selection. The VID_Select will not toggle during normal operation.
Table 2-3. VID_Select, LL1, LL0 Codes (Sheet 1 of 2)
Output Voltage Requirements
CCMAX load line limit will result
VID
Table
VR10.2
VR11.0
VID
Table
VID_
Select
LL1 LL0 Load Line / Processors
0 00
0 01
0 10
0 11
1 00
101
1 10
111
VID_
Select
LL1 LL0 V
1.25 mΩ; Reserved
1.25 mΩ; Dual-Core Intel® Xeon® Processor 5000 Series / MV
processor LGA771 die Load Line
1.25 mΩ; Dual-Core Intel® Xeon® processor 7000 series / Dual-Core
Intel® Xeon® 7100 series processor mPGA604 die Load Line
Reserved
1.00 mΩ; Reserved
1.25 mΩ; Dual-Core Intel® Xeon® Processor 5100 Series, Dual-Core
Intel® Xeon® Processor 5200 Series, Quad-Core Intel® Xeon®
Processor 5400 Series, Dual-Core Intel® Xeon® Processor 7200
Series, Quad-Core Intel® Xeon® Processor 7300 Series
1.50 mΩ; Reserved
1.25 mΩ; Quad-Core Intel Xeon processor 5300 Series
CC Tolerance / Die Load Line Units Notes
14 315889-002
Output Voltage Requirements
Table 2-3. VID_Select, LL1, LL0 Codes (Sheet 2 of 2)
VID
Table
Notes:
1. The Vcc values are the expected voltage measured at the processor die.
2. The Dual-Core Intel® Xeon® 7100 series / Dual-Core Intel® Xeon® processor 7000 sequence entry is
3. For VRM 11.0 mode, VRM_Pres# and VR_ID# should be held LOW for all combinations as described in
VID_
Select
VR10.2 mode
VR11.0 mode
required for backward compatibility for VR ‘modules’ only using the EVRD/VRM 10.2, but the VRM11.0
should be backward compatible with VRM10.2 platforms, as modular VRs can be transferred from one
platform to another.
Section 6.
LL1 LL0 Load Line / Processors
0 00
0 01
0 10
0 11
1 00
101
1 10
111
VccMAX = VID (V) –1.25 mΩ • Icc (A)
VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV
VccMAX = VID (V) –1.25 mΩ • Icc (A)
VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV
VccMAX = VID (V) –1.25 mΩ • Icc (A)
VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV
VccMAX = reserved
VccMIN = reserved
VccMAX = VID (V) –1.00 mΩ • Icc (A)
VccMIN = VID (V) –1.00 mΩ • Icc (A) –30 mV
VccMAX = VID (V) –1.25 mΩ • Icc (A)
VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV
VccMAX = VID (V) –1.50 mΩ • Icc (A)
VccMIN = VID (V) –1.50 mΩ • Icc (A) –30 mV
VccMAX = VID (V) –1.25 mΩ • Icc (A)
VccMIN = VID (V) –1.25 mΩ • Icc (A) –30 mV
V3
V2, 3
V1, 3
V3, 4
V1, 3
V1, 3
V1, 3
V1, 3
2.3 Voltage Tolerance - REQUIRED
The voltage ranges shown in Section 2.2 include the following tolerances:
• Initial DC output voltage set-point error.
• Output ripple and noise.
• No-load offset centering error.
• Current sensing and droop errors.
• Component aging affect.
• Full ambient temperature range and warm up.
• Dynamic output changes from minimum-to-maximum and maximum-to-minimum
load should be measured at the point of regulation. When measuring the response
of the die voltage to dynamic loads, use the VCC_DIE_SENSE and VSS_DIE_SENSE
or VCC_DIE_SENSE2 and VSS_DIE_SENSE2 pins on the processor socket with an
oscilloscope set to a DC to 20-100 MHz bandwidth limit and with probes that are
1.5 pF maximum and 1 MW minimum impedance.
• Variations of the input voltage.
315889-002 15
Output Voltage Requirements
2.4 Processor VCC Overshoot - REQUIRED
The VRM/EVRD 11.0 is permitted short transient overshoot events where Vcc exceeds
the VID voltage when transitioning from a high-to-low current load condition
(Figure 2-2). This overshoot cannot exceed VID + VOS_MAX. The overshoot duration,
which is the time that the overshoot can remain above VID, cannot exceed TOS_MAX.
These specifications apply to the processor die voltage as measured across the remote
sense points and should be taken with the oscilloscope bandwidth setting limited to
20 MHz or 100 MHz, depending what is supported by your particular scope (with
20 MHz preference).
• VOS_MAX = Maximum overshoot voltage above VID = 50 mV
• TOS_MAX = Maximum overshoot time duration above VID = 25 µs
Figure 2-2. Processor Vcc Overshoot Example Waveform
V
VID + 0.050
OS
Voltage [V]
VID - 0.000
T
OS
0 5 10 15 20 25
Time [us]
TOS: Overshoot time above VID
: Overshoot voltage above VID
V
OS
2.5 Impedance vs. Frequency - EXPECTED
Vcc power delivery designs can be susceptible to resonance phenomena capable of
creating droop amplitudes that violate the load line specification. This is due to the
frequency varied PCB, output decoupling and socket impedances from the power plane
layout structures. Furthermore, these resonances may not be detected through
standard time domain validation and require engineering analysis to identify and
resolve.
Impedance vs. Frequency, Z(f) performance simulations of the power delivery network
is a strongly recommended method to identify and resolve these impedances, in
addition to meeting the time domain load line in Section 2.2 and Section 2.3. The
decoupling selection needs to be analyzed to ensure that the impedance of the
decoupling is below the load line target up to the F
in Figure 2-3. Frequency domain load line and overshoot compliance is expected across
the 0 Hz to FBREAK bandwidth. The power delivery frequency response is largely
BREAK (2 MHz) frequency as defined
16 315889-002
Output Voltage Requirements
dependent upon the selection of the bulk capacitors, ceramic capacitors, power plane
routing and the tuning of the PWM controller’s feedback network. This analysis can be
done with LGA771-V2 VTT tool impedance testing or through power delivery simulation
if the designer can extract the parasitic resistance and inductance of the power planes
on the motherboard along with good models for the decoupling capacitors.
Measured power delivery impedance should be within the tolerance band shown in
Figure 2-3. The tolerance band is defined for the VTT impedance measurement only.
For load line compliance, time domain validation is required and the VR tolerance band
must be met at all times. Above 500 kHz, the minimum impedance tolerance is not
defined and is determined by the MLCC capacitors required to get the ESL low enough
to meet the load line impedance target of the F
tolerance drops to the load line target impedance. Any resonance point that is above
the ZMAX line needs to be carefully evaluated with the time domain method by applying
transient loads at that frequency and looking for V
the impedance profile up to FBREAK is important to ensure the package level decoupling
properly matches the motherboard impedance. After FBREAK, the impedance
measurement is permitted to rise at an inductive slope. The motherboard VR designer
does not need to design for frequencies over F
package decoupling takes over in the region above FBREAK.
Each of these design elements should be fully evaluated to create a cost optimized
solution, capable of satisfying the processor requirements. Experimental procedures for
measuring the Z(f) profile will be included (shortly) in the next revision of the
EVRD_VRM11_0_LL_dVID LGA771_775-V2 VTT Tester-UG.pdf Test Methodology User’s
Guide using the VTT. Additional background information regarding the theory of
operation is provided in Appendix A.
BREAK frequency. At 700 kHz, the ZMAX
MAX or VMIN violations. Maintaining
BREAK as the Intel Microprocessor
Figure 2-3. Power Distribution Impedance vs. Frequency
Zone 1
PWM Droop control
& compensation BW
Z
LL Max
Z target = Z
Z
LL
LL Min
VR BW
500 kHz
Notes:
1. Zone 1 is defined by the VR closed loop compensation bandwidth (VR BW) of the voltage regulator.
Typically 30-40 kHz for a 300 kHz voltage regulator design
2. Zones 2 & 3 are defined by the output filter capacitors and interconnect parasitic resistance and
inductance. The tolerance is relaxed over 500 kHz allowing the VR designer freedom to select output filter
capacitors. The goal is to keep Z(f) below Z
bulk cap values, type and quantity of MLCC capacitors. The ideal impedance would be between Z
Z
LLMin, but this may not be achieved with standard decoupling capacitors.
LL up to FBREAK (2 MHz) and as flat as practical, by selection of
Zone 2
Output Filter
Bulk & MLCC
700 kHz
F
Zone 3
Inductive effects
MLCC ESL +
Socket
Hz
break
LL and
315889-002 17
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