Huawei FusionServer Pro CH121 V5 User Manual

FusionServer Pro CH121 V5 Compute Node V100R005
User Guide
Issue 06
Date 2019-08-10
HUAWEI TECHNOLOGIES CO., LTD.
Copyright © Huawei Technologies Co., Ltd. 2019. All rights reserved.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang Shenzhen 518129 People's Republic of China
Website: http://e.huawei.com
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FusionServer Pro CH121 V5 Compute Node User Guide
Purpose
This document describes the CH121 V5 compute node (CH121 V5) in terms of its components, common operations, basic configuration, hardware installation, troubleshooting, software and configuration utilities, electrostatic discharge (ESD) prevention, and product specifications.

About This Document

About This Document
Intended Audience
This document is intended for:
l Enterprise administrators l Enterprise end users
Symbol Conventions
The symbols that may be found in this document are defined as follows:
Symbol
Description
Indicates an imminently hazardous situation which, if not avoided, will result in death or serious injury.
Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury.
Indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not avoided, could result in equipment damage, data loss, performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal injury.
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FusionServer Pro CH121 V5 Compute Node User Guide
Symbol Description
Change History
About This Document
Calls attention to important information, best practices and tips.
NOTE is used to address information not related to personal injury, equipment damage, and environment deterioration.
Issue
06 2019-08-10
05 2018-12-04
04 2018-10-22
03 2018-05-14
02 2017-12-28
01 2017-10-12
Date Description
l Added the support for Cascade Lake processors.
l Modified information about memory
compatibility.
l Modified technical specifications.
l Added procedure for installing an M.2 FRU. l Added procedure for installing the supercapacitor.
l Added procedure for installing an NVMe drive. l Added procedure for installing the BIOS battery. l Added information about the Avago SAS3408 and
Avago SAS3004 iMR RAID controller cards.
l Modified the memory module installation
guidelines.
l This issue is the first official release.
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FusionServer Pro CH121 V5 Compute Node User Guide Contents

Contents

About This Document.....................................................................................................................ii
1 Overview......................................................................................................................................... 1
1.1 Overview........................................................................................................................................................................ 1
1.2 Physical Structure........................................................................................................................................................... 3
1.3 Logical Structure ........................................................................................................................................................... 4
2 Hardware Description.................................................................................................................. 5
2.1 Front Panel......................................................................................................................................................................5
2.1.1 Appearance.................................................................................................................................................................. 5
2.1.2 Indicators and Buttons................................................................................................................................................. 6
2.1.3 Ports............................................................................................................................................................................. 8
2.1.4 Installation Positions....................................................................................................................................................8
2.2 Processor.........................................................................................................................................................................9
2.3 Memory........................................................................................................................................................................ 10
2.3.1 Memory Identifier......................................................................................................................................................10
2.3.2 Memory Subsystem Architecture.............................................................................................................................. 11
2.3.3 Memory Compatibility.............................................................................................................................................. 12
2.3.4 Memory Installation Guidelines................................................................................................................................ 15
2.3.5 Memory Installation Positions...................................................................................................................................15
2.3.6 Memory Protection Technologies.............................................................................................................................. 17
2.4 Storage.......................................................................................................................................................................... 17
2.4.1 Drive Configurations................................................................................................................................................. 17
2.4.2 Drive Numbering.......................................................................................................................................................17
2.4.3 Drive Indicators......................................................................................................................................................... 18
2.4.4 RAID Controller Card............................................................................................................................................... 20
2.5 Network........................................................................................................................................................................ 20
2.5.1 LOMs.........................................................................................................................................................................20
2.6 I/O Expansion............................................................................................................................................................... 21
2.6.1 PCIe Cards.................................................................................................................................................................21
2.6.2 PCIe Slot Description................................................................................................................................................ 22
2.7 Boards...........................................................................................................................................................................23
2.7.1 Mainboard..................................................................................................................................................................23
3 Basic Operations.......................................................................................................................... 25
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3.1 Power-Off Procedure....................................................................................................................................................26
3.2 Power-On Procedure.....................................................................................................................................................27
3.3 Removing a CH121 V5................................................................................................................................................ 28
3.4 Installing a CH121 V5..................................................................................................................................................31
3.5 Removing the Cover.....................................................................................................................................................35
3.6 Installing the Cover...................................................................................................................................................... 35
3.7 Removing the Air Ducts............................................................................................................................................... 36
3.8 Installing the Air Duct.................................................................................................................................................. 37
3.9 Removing the PCIe Card Panel.................................................................................................................................... 39
3.10 Installing the PCIe Card Panel....................................................................................................................................40
3.11 Removing a PCIe Card............................................................................................................................................... 41
3.12 Installing a PCIe Card.................................................................................................................................................43
3.13 Removing a SAS/SATA Drive....................................................................................................................................46
3.14 Installing a SAS/SATA Drive.....................................................................................................................................47
3.15 Removing an NVMe Drive.........................................................................................................................................49
3.16 Installing an NVMe Drive ......................................................................................................................................... 62
4 Installation and Configuration................................................................................................. 71
4.1 Installation Environment Requirements....................................................................................................................... 71
4.1.1 Space and Airflow Requirements.............................................................................................................................. 71
4.1.2 Temperature and Humidity Requirements................................................................................................................. 71
4.1.3 Cabinet Requirements................................................................................................................................................72
4.2 Hardware Installation................................................................................................................................................... 72
4.2.1 Installation Overview................................................................................................................................................ 72
4.2.2 Unpacking the Compute Node.................................................................................................................................. 73
4.2.3 Installing Optional Parts............................................................................................................................................ 74
4.2.4 Installing the Compute Node.....................................................................................................................................75
4.2.5 Connecting to Network..............................................................................................................................................75
4.3 Initial Configuration..................................................................................................................................................... 75
4.3.1 Default Information................................................................................................................................................... 75
4.3.2 Configuration Overview............................................................................................................................................ 77
4.3.3 Changing Initial Passwords....................................................................................................................................... 78
4.3.3.1 Changing the Initial Password of the Default iBMC User..................................................................................... 78
4.3.4 Checking the Compute Node.....................................................................................................................................80
4.3.5 Setting the iBMC IP Address.................................................................................................................................... 82
4.3.6 Configuring RAID.....................................................................................................................................................83
4.3.7 Configuring the BIOS................................................................................................................................................83
4.3.7.1 Entering the BIOS.................................................................................................................................................. 84
4.3.7.1.1 Entering the BIOS (Skylake)...............................................................................................................................84
4.3.7.1.2 Entering the BIOS (Cascade Lake)..................................................................................................................... 86
4.3.7.2 Setting the System Boot Sequence......................................................................................................................... 88
4.3.7.3 Setting PXE for a NIC............................................................................................................................................ 89
4.3.7.4 Setting the BIOS Password.....................................................................................................................................90
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4.3.7.5 Selecting a Language..............................................................................................................................................90
4.3.7.6 Restarting the Compute Node.................................................................................................................................91
4.3.8 Installing an OS......................................................................................................................................................... 91
5 Optional Part Installation.......................................................................................................... 93
5.1 Precautions....................................................................................................................................................................93
5.2 Optional Parts............................................................................................................................................................... 93
5.2.1 Installing an M.2 FRU............................................................................................................................................... 93
5.2.2 Installing the Screw-in RAID Controller Card..........................................................................................................95
5.2.3 Installing the Avago SAS3004iMR PCIe RAID Control Card................................................................................. 97
5.2.4 Installing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card................................................... 98
5.2.5 Installing the Supercapacitor..................................................................................................................................... 98
5.2.6 Installing a Mezzanine Card.................................................................................................................................... 101
5.2.7 Installing a Processor...............................................................................................................................................103
5.2.8 Installing a Memory Module................................................................................................................................... 110
5.2.9 Installing the TPM................................................................................................................................................... 113
6 Software and Hardware Compatibility.................................................................................115
7 Troubleshooting........................................................................................................................ 116
8 Software and Configuration Utilities....................................................................................117
8.1 Upgrading the System.................................................................................................................................................117
8.2 MM910....................................................................................................................................................................... 118
8.3 iBMC.......................................................................................................................................................................... 119
8.4 BIOS........................................................................................................................................................................... 120
8.5 FusionServer Tools uMate.......................................................................................................................................... 121
9 Safety Information.................................................................................................................... 123
9.1 Safety Instructions...................................................................................................................................................... 123
9.2 Maintenance and Warranty......................................................................................................................................... 126
10 ESD.............................................................................................................................................127
10.1 Preventing Electrostatic Discharge ..........................................................................................................................127
10.2 Grounding Methods to Prevent Electrostatic Discharge.......................................................................................... 127
11 Product Specifications............................................................................................................ 129
11.1 Technical Specifications........................................................................................................................................... 129
11.2 Environmental Specifications...................................................................................................................................132
11.3 Physical Specifications............................................................................................................................................. 133
12 Common Operations...............................................................................................................134
12.1 Querying the iBMC IP Address................................................................................................................................134
12.2 Logging In to the iBMC WebUI............................................................................................................................... 135
12.3 Logging In to the MM910 WebUI............................................................................................................................ 139
12.4 Collecting Log Information on the MM910 WebUI.................................................................................................144
12.5 Logging In to a Compute Node Using MM910 SOL...............................................................................................145
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12.6 Managing the E9000 Server Using the Local KVM................................................................................................ 146
12.6.1 Logging In to the MM910 CLI..............................................................................................................................146
12.6.2 Logging In to the Operating System of a Compute Node..................................................................................... 147
12.6.3 Mounting the DVD Drive to a Compute Node......................................................................................................148
12.6.4 Logging In to a Compute Node or a Switch Module over SOL............................................................................149
12.7 Logging In to the Desktop of a Server..................................................................................................................... 151
12.7.1 Using the Remote Virtual Console........................................................................................................................151
12.7.1.1 iBMC.................................................................................................................................................................. 151
12.7.1.2 MM910............................................................................................................................................................... 154
12.7.2 Using the Independent Remote Console............................................................................................................... 155
12.7.2.1 Windows.............................................................................................................................................................155
12.7.2.2 Ubuntu................................................................................................................................................................ 157
12.7.2.3 macOS................................................................................................................................................................ 159
12.8 Logging In to the CLI...............................................................................................................................................161
12.8.1 Logging In to the CLI Using PuTTY over a Network Port...................................................................................161
12.9 VMD Management................................................................................................................................................... 163
12.9.1 Enabling VMD...................................................................................................................................................... 163
12.9.2 Disabling VMD..................................................................................................................................................... 164
12.10 Clearing Data from a Storage Device.....................................................................................................................164
A More Information..................................................................................................................... 167
A.1 Technical Support...................................................................................................................................................... 167
A.2 Product Information...................................................................................................................................................168
A.3 Product Configuration Resources.............................................................................................................................. 168
A.4 Maintenance Tools..................................................................................................................................................... 169
B Appendix.................................................................................................................................... 170
B.1 Product SN................................................................................................................................................................. 170
B.2 RAS Features............................................................................................................................................................. 171
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FusionServer Pro CH121 V5 Compute Node User Guide

1.1 Overview

1.2 Physical Structure
1.3 Logical Structure

1 Overview

1 Overview
1.1 Overview
The CH121 V5 is a half-width compute node powered by Intel® Xeon® Scalable processors. It delivers supreme computing power, large memory capacity, and outstanding scalability.
The CH121 V5 provides dense computing capability and an ultra-large memory. It is optimized for virtualization, cloud computing, high-performance computing, and compute­intensive enterprise applications.
The CH121 V5 compute nodes are installed in an E9000 chassis and are centrally managed by the management module.
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FusionServer Pro CH121 V5 Compute Node User Guide
Figure 1-1 CH121 V5
1 Overview
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FusionServer Pro CH121 V5 Compute Node User Guide

1.2 Physical Structure

Figure 1-2 CH121 V5 physical structure
1 Overview
1 (Optional) HHHL PCIe riser
2 (Optional) HHHL PCIe card
module
3 (Optional) M.2 SSDs 4 (Optional) USB flash drive
5 (Optional) TPM 6 Screw-in RAID controller
card
7 (Optional) Supercapacitor 8 Heat sinks
9 Mainboard 10
11
Drives
a
12
(Optional) M.2 FRUs
(Optional) M.2 adapter
b
b
13 Drive cage 14 Processors
15 Mezzanine card 16 BIOS battery
17 Memory modules - -
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FusionServer Pro CH121 V5 Compute Node User Guide
l a: The drive slots support 2.5-inch SAS/SATA/NVMe drives and M.2 modules and
mixed configuration of them.
l b: An M.2 module is a 2.5-inch drive module that consists of one M.2 adapter and two
M.2 FRUs.

1.3 Logical Structure

Figure 1-3 CH121 V5 logical structure
1 Overview
l The server supports one or two Intel® Xeon® Scalable processors. l The server supports up to 24 memory modules. l The CPUs (processors) interconnect with each other through two UPI links at a speed of
up to 10.4 GT/s.
l The mezzanine cards connect to the processors through PCIe buses to provide service
ports.
l The Platform Controller Hub (PCH) has a built-in MAC chip and provides two 10 Gbit/s
ports.
l The storage module, consisting of a RAID controller card and a drive backplane,
connects to the CPUs through PCIe buses.
l The BMC provides device management functions, such as compute node power control,
slot number acquisition, PSU detection, and KVM over IP.
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FusionServer Pro CH121 V5 Compute Node User Guide

2.1 Front Panel

2.2 Processor
2.3 Memory

2 Hardware Description

2 Hardware Description
2.4 Storage
2.5 Network
2.6 I/O Expansion
2.7 Boards
2.1 Front Panel

2.1.1 Appearance

Figure 2-1 Front view (with an M.2 module)
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FusionServer Pro CH121 V5 Compute Node User Guide
2 Hardware Description
1 Slide-out label plate (with an
SN label)
3 Ejector release button 4 Ejector lever
5
7 M.2 FRU 8 M.2 adapter
9
l a: The drive slots support 2.5-inch SAS/SATA/NVMe drives and M.2 modules and
mixed configuration of them.
l b: An M.2 module is a 2.5-inch drive module that consists of one M.2 adapter and two
M.2 FRUs.
2.5" drive
M.2 module
a

2.1.2 Indicators and Buttons

Positions
Figure 2-2 Indicators and buttons on the front panel
2 PCIe panel
6 Model
b
- -
1
3 Health status indicator - -
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Power button/indicator 2 UID button/indicator
FusionServer Pro CH121 V5 Compute Node User Guide
Description
Table 2-1 Indicators and buttons on the front panel
2 Hardware Description
Silkscreen Indicator/
Button
Power button/ indicator
UID UID button/
indicator
Description
Power indicator:
l Off: The device is not powered on. l Steady yellow: The device is powered on. l Blinking yellow: The power button is locked. The
power button is locked when the iBMC is starting. l Steady green: The device is ready to power on. Power button: l When the device is powered on, you can press this
button to gracefully shut down the OS. l When the device is powered on, holding down this
button for 6 seconds will forcibly power off the
device. l When the power indicator is steady green, you can
press this button to power on the device.
The UID button/indicator helps identify and locate a device.
UID indicator:
l Off: The device is not being located. l Blinking blue: The device has been located and is
differentiated from other devices that have also
been located. l Steady blue: The device is being located. UID button: l You can turn on or off the UID indicator by
pressing the UID button or by using the iBMC or
MM910 CLI or WebUI. l You can press this button to turn on or off the UID
indicator. l You can press and hold down this button for 4 to 6
seconds to reset the iBMC.
HLY Health status
indicator
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l Off: The device is powered off or is faulty. l Blinking red at 1 Hz: A major alarm has been
generated for the device. l Blinking red at 5 Hz: A critical alarm has been
generated for the device, or the device is not
securely installed. l Steady green: The device is operating properly.
FusionServer Pro CH121 V5 Compute Node User Guide

2.1.3 Ports

Port Positions
Figure 2-3 Ports on the front panel
2 Hardware Description
1 USB 3.0 ports 2 -
Port Description
Port
USB port USB 3.0 2 Used to connect to a USB device.
Type Quantity Description

2.1.4 Installation Positions

The CH121 V5 is installed in a half-width slot in the front of the E9000 chassis. An E9000 chassis can house a maximum of 16 CH121 V5 compute nodes.
NOTICE
Before connecting an external USB device, check that the USB device functions properly. The server may operate abnormally if an abnormal USB device is connected.
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FusionServer Pro CH121 V5 Compute Node User Guide
Figure 2-4 Installation positions
2 Hardware Description

2.2 Processor

l The server supports one or two processors. l If only one processor is required, install it in socket CPU1. l The same model of processors must be used in a server. l Contact your local Huawei sales representative or use the Intelligent Computing
Compatibility Checker to determine the components to be used.
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FusionServer Pro CH121 V5 Compute Node User Guide
Figure 2-5 Processor positions
2 Hardware Description

2.3 Memory

2.3.1 Memory Identifier

You can determine the memory module properties based on the label attached to the memory module.
Figure 2-6 Memory identifier
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FusionServer Pro CH121 V5 Compute Node User Guide
callout Description Definition
2 Hardware Description
1 Capacity of the memory module.
2 Number of ranks of the memory
module.
3 Data width on the DRAM.
4 Type of the memory interface.
5 Maximum memory speed.
l 8 GB l 16 GB l 32 GB l 64 GB l 128 GB
l 1R: single-rank l 2R: dual-rank l 4R: quad-rank l 8R: octal-rank
l X4: 4-bit l X8: 8-bit
l PC3: DDR3 l PC4: DDR4
l 2133 MT/S l 2400 MT/S l 2666 MT/S l 2933 MT/S
6 Column Access Strobe (CAS)
latency.
7 DIMM type.

2.3.2 Memory Subsystem Architecture

The CH121 V5 provides 24 memory slots. Each processor integrates six memory channels.
Install the memory modules in the primary memory channels first. If the primary memory channel is not populated, the memory modules in secondary memory channels cannot be used.
Table 2-2 Memory channels
CPU
CPU 1 1A (primary) DIMM000(1A1)
Memory Channel Memory Slot
1A DIMM001(1A2)
1B (primary) DIMM010(1B1)
l P: 15 l T: 17
l R: RDIMM l L: LRDIMM
1B DIMM011(1B2)
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FusionServer Pro CH121 V5 Compute Node User Guide
CPU Memory Channel Memory Slot
CPU 2 2A (primary) DIMM100(2A1)
2 Hardware Description
1C (primary) DIMM020(1C1)
1C DIMM021(1C2)
1D (primary) DIMM030(1D1)
1D DIMM031(1D2)
1E (primary) DIMM040(1E1)
1E DIMM041(1E2)
1F (primary) DIMM050(1F1)
1F DIMM051(1F2)
2A DIMM101(2A2)
2B (primary) DIMM110(2B1)

2.3.3 Memory Compatibility

Observe the following rules when configuring DDR4 memory modules:
2B DIMM111(2B2)
2C (primary) DIMM120(2C1)
2C DIMM121(2C2)
2D (primary) DIMM130(2D1)
2D DIMM131(2D2)
2E (primary) DIMM140(2E1)
2E DIMM141(2E2)
2F (primary) DIMM150(2F1)
2F DIMM151(2F2)
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FusionServer Pro CH121 V5 Compute Node User Guide
l A server must use the same model of DDR4 memory modules, and all the memory
modules operate at the same speed, which is the smallest value of:
l Memory speed supported by a processor l Maximum operating speed of a memory module
l The DDR4 memory modules of different types (RDIMM and LRDIMM) cannot be used
together.
l Contact your local Huawei sales representative or use the Intelligent Computing
Compatibility Checker to determine the components to be used.
l The memory can be used with Intel® Xeon® Scalable Skylake and Cascade Lake
processors. The maximum memory capacity supported varies depending on the processor model.
– Skylake processors
n M processors: 1.5 TB/socket n Other processors: 768 GB/socket
2 Hardware Description
– Cascade Lake processors
n L processors: 4.5 TB/socket n M processors: 2 TB/socket n Other processors: 1 TB/socket
l The total memory capacity is the sum of the capacity of all DDR4 memory modules.
The total memory capacity cannot exceed the maximum memory capacity supported by the CPUs.
l Use the Intelligent Computing Compatibility Checker to determine the capacity type
of a single memory module.
l The maximum number of memory modules supported by a server varies depending on
the CPU type, memory type, rank quantity, and operating voltage.
NOTE
Each memory channel supports a maximum of 8 ranks. The number of memory modules supported by each channel varies depending on the number of ranks supported by each channel:
Number of memory modules supported by each channel ≤ Number of ranks supported by each memory channel/Number of ranks supported by each memory module
l A memory channel supports more than eight ranks for LRDIMMs.
NOTE
A quad-rank LRDIMM generates the same electrical load as a single-rank RDIMM on a memory bus.
l DDR4 memory modules of different specifications (capacity, bit width, rank, and height)
can be used together for capacity expansion purposes. However, the memory Reliability, Availability, and Serviceability (RAS) features may be affected.
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FusionServer Pro CH121 V5 Compute Node User Guide
Observe the following rules when you need to use different types of memory modules in a compute node:
RDIMMs and LRDIMMs cannot be used together.Do not use 128 GB memory modules together with memory modules of other
capacities.
– If memory modules with different rank quantities need to be installed in the same
channel, install the memory modules with more ranks in slots farther away from the CPU.
For example, install the dual-rank memory module in slot 1A1 and the single-rank memory module in slot 1A2.
– Memory modules of different speeds can be mixed in any way. However, the
memory speed is the lowest speed of the memory modules configured.
– RAS features, such as memory mirroring, single device data correction (SDDC),
SDDC+1, and double device data correction (DDDC), are not supported if x4 and x8 memory modules are used together.
Table 2-3 DDR4 memory specifications
2 Hardware Description
Parameter
Specifications
Rank Single rank Dual rank Quad rank Octal rank
Rated speed (MT/s)
2933
a
2933
a
2666 2666
Operating voltage (V) 1.2 1.2 1.2 1.2
Maximum number of DDR4 memory modules in a node
Maximum capacity per
24 24 24
b
16 32 64 128
24
c
DDR4 memory module (GB)
Maximum DDR4 memory
384 768 1536
3072
c
capacity of the node (GB)
Maximum operating speed (MT/s)
One DDR4 memory module per channel
Two DDR4
a
2933
2666 2666 2666 2666
2933
a
2666 2666
memory modules per channel
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FusionServer Pro CH121 V5 Compute Node User Guide
Parameter Specifications
l a: If the Cascade Lake processor is used, the rated speed and maximum operating speed
of the RDIMM can reach 2933 MT/s. If the Skylake processor is used, the rated speed and maximum operating speed of a DDR4 memory module can reach 2666 MT/s only.
l b: The maximum number of DDR4 memory modules is based on dual-processor
configuration. The value is halved for a server with only one processor.
l c: The maximum DDR4 memory capacity varies depending on the processor type. The
value listed in this table is based on the assumption that twenty-four 128 GB DDR4 memory modules are configured.

2.3.4 Memory Installation Guidelines

l Observe the following when configuring DDR4 memory modules:
Install memory modules only when corresponding processors are installed.Do not install LRDIMMs and RDIMMs in the same server.Install filler memory modules in vacant slots.
l Observe the following when configuring DDR4 memory modules in specific operating
mode: – Memory sparing mode
n Comply with the general installation guidelines. n Each memory channel must have a valid online spare configuration. n The channels can have different online spare configurations. n Each populated channel must have a spare rank.
Memory mirroring mode
n Comply with the general installation guidelines. n Install memory modules for channels 1 and 2 or channels 3 and 4. The
memory modules installed must be identical in size and organization.
n For a multi-processor configuration, each processor must have a valid memory
mirroring configuration.
– Memory scrubbing mode
n Comply with the general installation guidelines.
2 Hardware Description

2.3.5 Memory Installation Positions

A CH121 V5 supports a maximum of 24 DDR4 memory modules. Balanced memory configuration is recommended for optimal memory performance.
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FusionServer Pro CH121 V5 Compute Node User Guide
Figure 2-7 Memory slots
Figure 2-8 DDR4 memory installation guidelines (1 processor)
2 Hardware Description
Figure 2-9 DDR4 memory installation guidelines (2 processors)
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FusionServer Pro CH121 V5 Compute Node User Guide

2.3.6 Memory Protection Technologies

The following memory protection technologies are supported:
l ECC
l Full mirroring
l Address range mirroring
l Rank sparing mode
l Faulty DIMM isolation
l Memory thermal throttling
l Memory address parity protection
l Adaptive double device data correction (ADDDC)
l Memory demand/patrol scrubbing
l Data scrambling
l ADDDC+1
2 Hardware Description

2.4 Storage

2.4.1 Drive Configurations

Table 2-4 Drive configurations
Configuration
Front drives
l a: Only 2.5-inch drives fit into the front slots. l b: Mixed configuration of M.2 modules and SAS/SATA/NVMe drives is supported. l Contact your local Huawei sales representative or use the Intelligent Computing
Compatibility Checker to determine the components to be used.
a
Maximum Drives Drive Management
Mode
b
2 l Slots 0 and 2 support
SAS/SATA/NVMe drives.
l M.2 FRUs can be
installed only in slots 0 to 3.
1 x RAID controller card

2.4.2 Drive Numbering

l SAS/SATA/NVMe drives
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FusionServer Pro CH121 V5 Compute Node User Guide
Figure 2-10 Drive numbering
l M.2 FRU
Figure 2-11 Drive numbering
2 Hardware Description

2.4.3 Drive Indicators

SAS/SATA Drive Indicators
Figure 2-12 SAS/SATA drive indicators
Table 2-5 Description of SAS/SATA drive indicators
Green Indicator
Steady on Off The drive is in position.
Blinking at 4 Hz Off Data is being read or written normally, or
Steady on Blinking at 1 Hz The drive is being located.
Blinking at 1 Hz Blinking at 1 Hz The data on the secondary drive is being
Yellow Indicator Description
data on the primary drive is being rebuilt.
rebuilt.
Off Steady on A member drive in the RAID array is
removed.
Steady on Steady on The drive is faulty.
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FusionServer Pro CH121 V5 Compute Node User Guide
M.2 FRU Indicators
Figure 2-13 M.2 FRU indicators
Table 2-6 M.2 FRU indicator description
2 Hardware Description
Indicator
M.2 FRU fault indicator
M.2 FRU activity indicator
NVMe SSD Indicators
Figure 2-14 NVMe SSD indicators
Description
l Off: The M.2 FRU is running properly. l Blinking yellow: The M.2 FRU is being located, or RAID
is being rebuilt.
l Steady yellow: The M.2 FRU is faulty or not detected.
l Off: The M.2 FRU is not in position or is faulty. l Blinking green: Data is being read, written, or
synchronized.
l Steady green: The M.2 FRU is inactive.
l If the VMD function is enabled and the latest Intel RSTe driver is installed, NVMe SSDs
support surprise hot swap.
Table 2-7 NVMe SSD indicators (VMD enabled)
Green Indicator
Off Off The NVMe SSD cannot be detected.
Steady green Off The NVMe SSD is working properly.
Blinking green at 2HzOff Data is being read from or written to the
Off Blinking yellow at
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Yellow Indicator Description
NVMe SSD.
The NVMe SSD is being located.
2 Hz
FusionServer Pro CH121 V5 Compute Node User Guide
Green Indicator Yellow Indicator Description
2 Hardware Description
Off Blinking yellow at
8 Hz
Steady green/Off Steady yellow The NVMe SSD is faulty.
l If the VMD function is disabled, NVMe SSDs support only orderly hot swap.
Table 2-8 NVMe SSD indicators (VMD disabled)
Green Indicator
Off Off The NVMe SSD cannot be detected.
Steady green Off The NVMe SSD is working properly.
Blinking green at 2HzOff Data is being read from or written to the
Off Blinking yellow at
Off Blinking yellow at
Steady green/Off Steady yellow The NVMe SSD is faulty.
Yellow Indicator Description
2 Hz
0.5 Hz
The data on the secondary NVMe drive is being rebuilt.
NVMe SSD.
The NVMe SSD is being located or hot­swapped.
The hot removal process is complete, and the NVMe SSD is removable.

2.4.4 RAID Controller Card

The RAID controller card supports RAID configuration, RAID level migration, and drive roaming.
l Contact your local Huawei sales representative or use the Intelligent Computing
Compatibility Checker to determine the components to be used.
Table 2-9 RAID levels supported by the CH121 V5
RAID Level
RAID 0 Low High High 2 100%
RAID 1 High Low Low 2 50%
Reliability Read

2.5 Network

Performan ce
Write Performan ce
Minimum Number of Drives
Drive Utilization

2.5.1 LOMs

The LOM is a network interface module (X722) integrated in the PCH. It can be connected to an I/O module (switch module). The LOM provides two 10GE network ports for connecting
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FusionServer Pro CH121 V5 Compute Node User Guide
to the Base network ports of the switch modules in slots 2X and 3X. The LOM supports Wake on LAN (WOL) and PXE functions.
Figure 2-15 Connections between the LOM and I/O modules
2 Hardware Description
NOTE
l In addition to the LOM, the compute node connects to the Fabric ports of the switch modules
through the network ports on mezzanine cards.
l Powering off the compute node forcibly will make the WOL function of the LOM ports invalid. l If flow control is enabled for a LOM port, the switch module connected to the LOM port must also
have flow control enabled.
Table 2-10 I/O modules supported by the LOM
I/O Module
CX916 2X/3X -
CX920 2X/3X -
I/O Module Slot
1E/4E × The LOM cannot communicate
1E/4E × The LOM cannot communicate
LOM Remarks
with the I/O modules in slots 1E and 4E.
with the I/O modules in slots 1E and 4E.

2.6 I/O Expansion

2.6.1 PCIe Cards

l The server supports a range of PCIe cards to provide diverse expandability and ease of
peripheral connections.
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FusionServer Pro CH121 V5 Compute Node User Guide
l Contact your local Huawei sales representative or use the Intelligent Computing
Compatibility Checker to determine the components to be used.

2.6.2 PCIe Slot Description

NOTE
The PCIe slots mapping to a vacant CPU socket are unavailable.
Table 2-11 PCIe slot description
2 Hardware Description
PCIe Slot
RAID control
Displ ay on BMC
\ CPU 1 PCIe
CPU PCIe
Stand ards
3.0 ler card
LOM \ CPU 1 PCIe
3.0
Mezz1 \ CPU 1 PCIe
3.0
Conne ctor Width
Bus Width
Port No.
Ro ot Por t (B/ D/ F)
x8 x8 Port1A 17:
00. 00
x8 x8 Port1C 17:
02. 00
x16 or two x8
x16 or two x8
Port2A or (Port2 A+Port 2C)
3a:
00. 0
3a:
02. 0
De vic e (B/ D/F )
18:0
0.00
1c:
00.0 0
3b:
00.0 3c:
00.0
Slot Size
-
-
-
Mezz2 \ CPU 2 PCIe
3.0
PCIe Riser1
PCIe riser
CPU 1 PCIe
3.0
card 1
NVMe SSD0
disk 0 CPU 2 PCIe
3.0
x16 or two x8
x16 or two x8
Port2A or (Port 2A +Port2 C)
ae:
00. 0
ae:
02. 0
x16 x16 Port3A 5d:
00. 0
x4 x4 Port1C 85:
02.
af:
00.0 b0:0
0.0
5e:
00.0
86:0
0.0
-
HHHL
2.5" drive
00
NVMe SSD2
disk 2 CPU 2 PCIe
3.0
x4 x4 Port1D 85:
03.
87:0
0.0
2.5" drive
00
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