HP StorageWorks 2300 User Manual
user’s guide
hp StorageWorks
disk system 2300
Edition E0902
Notice
© Hewlett-Packard Company, 2002. All rights
reserved.
A6490-96014
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1 Product Description 11
General Description 11
Features 13
Status Indicators 15
Power/Standby Switch 16
High Availability 16
Clustering (NT) 16
Upgradability 16
Environmental Services 17
Hardware Event Monitoring 17
Components 18
Disk Modules and Disk Module Filler Panels 18
BCCs and BCC Filler Panels 19
Power Supply/Fan Modu le 22
Hardware/Software Requirements 24
Topologies 27
Definitions 33
High availability (HA) 33
Hot-pluggable 33
JBOD 33
LVD 33
PDU and PDRU 33
Ultra160 SCSI 34
contents
2 Installation 35
Preparation 36
Electrical Requirements 36
Choosing PDUs 37
3
Installing PDUs 39
Software Requirements 42
Auto-Termination 43
Step 1: Gather Tools 44
Step 2: Unpack the Product 44
Step 3: Install the device 47
Installing the Storage Device into a Rack System/E 47
Installing the storage device into an HP Computer Cabinet 56
Installing the Storage Device into a Rittal-Style Rack 64
Install the Disk System 70
Step 4: Install BCCs 71
Step 5: Set DIP Switches 74
Step 6: Connect SCSI and Power Cables 75
Step 7: Install Disk Modules 78
Step 8: Turn on the Disk System 80
Step 9: Verify Devices on the Host 81
Sample IOSCAN 81
Where do you go from here? 82
3 Configuration 83
Viewing a Disk System in IOSCAN 84
Sample IOSCAN 84
Setting DIP Switches 85
Rationale 87
Disk Addressing 88
Disk Slots and Addressing 89
Setting Up the Hardware Event Monitor 90
Aliasing Devices (HP-Qualified Only) 90
Updating Firmware (HP-Qualified Only) 9 1
Command View SDM 91
Supported Operating Systems 92
Installing CommandView SDM 92
HP TopTools 93
Supported Operating Systems 93
Installing HP TopTools 5.0 93
4
4 Troubleshooting 95
Overview 96
Event Notification (HP-UX Systems) 97
HP Command View SDM 100
TopTools 100
Status LEDs 101
Isolating Faults 104
5 Removal and Replacement 107
Disk Module 110
Preparation (HP-UX 11.XX) 1 10
To Determine If a Volume Group or Physical Volume Group Is
Active 111
To Determine If the Physical Volume Is Attached 111
To Replace Attached Physical Volumes 112
To Replace Unattached Physical Volumes 114
NT 114
Windows 2000 115
Tools 115
Procedure 115
BCC 119
Tools 119
Procedure 119
BCC Filler Panel 122
Power Supply 123
Tools 123
Procedure 123
Disk System 125
Tools 125
Procedure 125
Top Cover (HP-Qualified Only) 128
Tools 128
Procedure 128
Midplane (HP-Qualified Only) 130
Tools 130
Procedure 130
5
Deskside Base/External Covers (HP-Qualified Only) 133
Powering Down the Disk System 133
Removing the deskside b ase and external covers fr om the disk system 133
Tools 133
Procedure 133
Reinstalling the deskside base and external covers on the disk system. 138
6 Reference 141
Product Models 141
Upgrade Products 142
PDU/PDRU Products 143
Replaceable Parts 144
Specifications 145
Dimensions 145
Weight 145
AC Power Input 146
DC Power Output 146
Heat Output 146
Environment 146
Acoustics 147
Safety Certifications 147
EMC Compliance 147
Regulatory Statements 148
A. FCC Statement (For U.S.A. Only) 148
B. IEC Statement (Worldwide) 148
C. Spécification ATI Classe A (France) 148
D. Product Noise Declaration (Germany) 149
E. VCCI Statement (Japan) 150
Harmonics Conformance (Japan) 150
F. BCIQ EMC Statement (Taiwan) 150
G. Declaration of Conformity 151
Product Web Site 152
Related Doc uments 152
6
figures
Figure 1 Disk System - Racked Views 14
Figure 2 Disk System Deskside Views 15
Figure 3 Disk Module 19
Figure 4 BCC 20
Figure 5 BCC Filler Panel 21
Figure 6 Power Supply/Fan Module 22
Figure 7 Basic Configuration - Single Host, Single Disk System 28
Figure 8 Single Host, Split Bus Configuration 29
Figure 9 Single Host PV-Links Configuration 30
Figure 10 Two Host Non-High Availability Configuration 31
Figure 11 Two Host High Availability Configuration 32
Figure 12 PDRU Placement in 1.6-Meter Rack 40
Figure 13 PDRU Placement in a 2.0-Meter Rack 41
Figure 14 Host Bus Adapter HP A5149A 43
Figure 15 Disk System Accessories 45
Figure 16 Disk System ContentsDisk System Contents 46
Figure 17 HP Rack System/E Rail Kit Contents 48
Figure 18 HP Rack System/E Installation Overview 49
Figure 19 Locating the site for the device installation in a System/E
Rack 51
Figure 20 Installing clipnuts for an HP Rack System/E 51
Figure 21 Installing rails in an HP Rack System/E 52
Figure 22 Installing the enclosure clipnut
53
Figure 23 Installing the storage device in the Rack System/E 54
Figure 24 Installing enclosure rail clamps in an HP Rack
System/E 55
Figure 25 HP Computer Cabinet Rail Kit Contents 56
Figure 26 HP Computer Cabinet Installation Overview 57
Figure 27 Locating the site for the device installation in an HP
Computer Cabinet 58
Figure 28 Installing rail clip nuts in the HP Computer Cabinet 59
Figure 29 Installing rails in the HP Computer Cabinet 60
7
Figure 30 Installing enclosure retention clipnuts in an HP Computer
Cabinet 61
Figure 31 Installing the storage device in an HP Computer Cabinet 62
Figure 32 Installing a filler panel in an HP Computer Cabinet 63
Figure 33 Rittal-Style Rail Kit Contents 64
Figure 34 Rail Alignment 65
Figure 35 Front Screw Installation 66
Figure 36 Rear Slide Extension 67
Figure 37 Center Nut Tightening 67
Figure 38 Installing a Disk System into the Rittal-Style Rack 68
Figure 39 Moving a Disk System Retention Bracket 69
Figure 40 Bolting the Disk System to the Front Column of the Rack 69
Figure 41 BCC Installation 72
Figure 42 BCC Filler Panel 73
Figure 43 BCC DIP Switches 74
Figure 44 Wiring Scheme for 1.6-Meter Rack 76
Figure 45 Wiring Scheme for 2.0-Meter Rack 77
Figure 46 Disk Module Installation 78
Figure 47 On/Off Switch and System LEDs 80
Figure 48 DIP Switches 86
Figure 49 Disk Module Slots and SCSI Addresses 89
Figure 50 Sample Hardware Event Notification 99
Figure 51 LED Status Indicators 101
Figure 52 Disk System Field Replaceable Units (FRUs) 108
Figure 53 Disk Module Removal 117
Figure 54 BCC Removal and Replacement 120
Figure 55 BCC DIP Switches 121
Figure 56 BCC Filler Panel Installation 122
Figure 57 Power Supply Removal and Replacement 124
Figure 58 Disk System Removal and Replacement 126
Figure 59 Top Cover Assembly 129
Figure 60 Midplane Assembly 132
Figure 61 End Cap Removal and Replacement 134
Figure 62 Base Removal and Replacement 135
Figure 63 Base Removal from Chassis 136
Figure 64 Removal from Cover 137
Figure 65 Installing Disk System into Cover 138
Figure 66 Installing Base to Cover and Chassis 139
Figure 67 End Cap Replacement 140
8
tables
Table 1 Inrush (Surge) Current and Duration 36
Table 2 Maximum Operating Current 36
Table 3 Recommended PDU/PDRUs for Multiple Disk Systems in
HP Computer Cabinets 38
Table 4 Recommended PDU/PDRUs for Multiple Disk Systems in
HP System/E Racks 38
Table 5 Disk System Accessories 44
Table 6 Dis k System Conte nts 46
Table 7 Rail Positions for Sequential Disk Systems 50
Table 8 DIP Switch Settings 85
Table 9 DIP Switch Usage 87
Table 10 Disk and BCC SCSI Addresses for Full and Split Bus
Modes 88
Table 11 LED Functions 102
Table 12 Troubleshooting Table 104
Table 13 JBOD Enclosure Field Replaceable Units 109
Table 14 Upgrade Products 142
Table 15 PDU/PDRU Products 143
Table 16 Replacement and Exchange Part Numbers 144
Table 17 Product Weights 145
9
10
Product Description
General Description
Hewlett-Packard’s StorageWorks Disk System 2300 (referred to in this guide as
the disk system) is a high-availability Ultra160 SCSI storage product. Dual SCSI
ports on dual bus co ntrolle rs pr ovide LVD connections to the ho st. Fo urteen slots
accept high-speed, high-capacity LVD SCSI disks connected to an LVD
midplane. Maximum data throughput is 160 Mbytes/sec. Thirteen disk systems
fill a 2-meter System/E rack. Filled with 18-Gbyte disks, the 2-meter Rack
System/E yields 3.3 Terabytes of storage; with 36-Gbyte disks, 6.6 Terabytes of
storage and with 73-Gbyte disks, 13.3 Terabytes.
Modular and redundant components are easy to upgrade and maintain. Disks,
power supply/fan modules, and bus control cards (BCCs) are replaceable parts
that plug into individual slots in the front and back of the disk system. Redundan t
power supply/fan modules, and BCCs can be removed and replaced without
interrupting storage operations. Disks also can be replaced with the system on
and with only the affected file systems taken off-line. Hewlett-Packard technical
support is optional for these procedures.
1
Special electronics and HP-UX software enable remote monitoring and
diagnostics. Sensors on the BCCs monitor the disk system environment,
including temperature, voltage, fan speed, and component status. HewlettPackard’s Command View SDM reports any changes in environmental status to
user-defined locations. Standard HP-UX diagnostic utilities also report
environmental data for enhanced troublesho oti ng.
Product Description 11
HP Command View SDM (Software Device Manager) software is designed to
provide storage management for HP dis k systems. This software, available on the
HP Command View SDM CD-ROM, provides simple, yet sophisticated device
management tools for t he disk s ystem. HP Command View SDM is supported on
the following:
■ HP-UX 11.00 (see Support Plus web site for the required patches)
■ HP-UX 11.11 (see Support Plus web site for the required patches)
■ Windows NT 4.0 (Service Pack 6a or greater)
■ Windows 2000 (Service Pack 1 or greater)
■ Linux Red Hat 7.2
HP T opT o ols is a web-based, devi ce management tool that enables administrator s
and MIS managers to use a web browser to obtain information about devices on
their network. It provides specific management to the following HP products:
■ HP Vectra and Brio Desktops
■ HP Kayak and Visualize Workstations
■ HP Omnibook Notebooks
■ HP Netservers
■ HP Procurve and AdvanceStack networking devices
■ HP LaserJet and JetDirect products
12 Product Description
■ HP Jornada PC Companions
■ HP StorageWorks products
■ HP Network Attached Storage (NAS) products
■ HP-UX systems with EMS
■ Windows systems
Features
Product Description
The disk system occupies 3 EIA units in a standard 19-inch rack. Disk drives
mount in the front of the system. Redundant power supplies, and BCCs mount in
the back. See Figure 1 and Figure 2 below. For disk slots and SCSI addressing,
see Figure 49.
Product Description 13
14 Product Description
Status Indicators
Product Description
LEDs on the disk system enable you to detect and replace failed components and
so prevent or minimize users’ downtime. For additional information about LEDs,
see Chapter 4, Troubleshooting.
On the front of the disk system, a pair of LEDs indicates the status of the disk
system, and an LED for each slot shows disk I/O activity:
■ The system power LED (B in Figure 1) indicates that power is on or off.
■ The system fault LED (C in Figure 1) indicates whether or not a fault has
occurred anywhere in the disk system.
■ At the bottom of each disk module, the left LED (F in Figure 1 ) indicates the
presence of I/O activity on the disk.
■ The second LED on each disk module (E in Fig ure 1) can be flashed to help a
customer engineer (CE) locate the disk for physical inspection or removal.
■ The second LED is also used as a fault indicator for that specific disk module.
LEDs (I and K in Figure 2) on the back of the disk system indicate the status of
replaceable components and the SCSI bus: See Chapter 4, Troubleshooting, for
specific LED information.
Product Description 15
Power/Standby Switch
Located at the upper right corner of the fron t of the disk system, the power switch
(D in Figure 1) interrupts DC power from the power supplies to the BCCs and
other internal components. Input AC power to the power supplies is controlled by
the power cords and the AC source.
High Availability
High availability is a general term describing computer systems that are designed
to minimize planned and unp lan ned dow n t ime. The di sk s ys tem supports current
systems’ high availability requirements through the following feat ures:
■ Hot-pluggable, high-capacity, high-speed disks
■ Redundant, hot-pluggable, user-replaceable power supplies and BCCs
■ Online firmware upgrades
■ Hardware event monitoring and real-time error reporting
Clustering (NT)
The HP Disk System 2300 is Microsoft® Cluster certified for a variety of
solutions. For specific information about supported configurations, see the
Hewlett-Packard Company or Microsoft web pages:
http://hp.com
http://microsoft.com
Upgradability
16 Product Description
You can increase disk system storage capacity by:
■ Replacing disk drives with higher-capacity disk drives
■ Adding disks in unused slots
None of these actions require shutting down the product, but some may require
the use of system utilities to manage file systems.
Upgrade BCC and disk fi rmware usin g an on-line download function. See
Chapter 3, Upda ting Firmware.
Environmental Services
Environmental services circuitry monitors the following elements:
■ Fan rotation
■ Power supply output
■ Power supply status (fan status)
■ Disk drive status, presence
■ BCC status
■ Temperature
■ Self-test results
Each BCC reports the status of all elements in the disk system, even if the BCC
does not have direct access to the element.
Additionally, the EEPROM on each BCC stores 2 Kbytes of configuration
information and user-def ined data, includin g the manufacturer serial n umber , and
product number.
Hardware Event Monitoring
A hardware event monitor monitors the disk system and reports change s in
environmental status to Hewlett-Packard’s Event Monitoring System (EMS) for
HP-UX. Hardware event monitoring is an important tool for implementing high
availability. Using hardware event monitors, you can virtually eliminate
undetected hardware failures that interrupt system operation or cause data loss.
The EMS Hardware Monitors User’s Guide is available in Ado be
format on the HP document web site, http://www.docs.hp.com/hpux/systems/.
®
Acrobat®
Product Description
Product Description 17
Components
User-replaceable components enable high availability and easy maintenance.
This section describes the following components:
■ Disks and disk fillers
■ BCCs and BCC fillers
■ Power supply/fan modules
Disk Modules and Disk Module Filler Panels
Disk modules, shown in Figure 3, contain 3.5-inch Low Profile Ultra 3 LVD
disks.
The disk module’s components are protected by a metal grill on the disk
module’s bottom side.
WARNING Disks require careful handling and ESD precautions.
The plastic parts of the disk are safe to touch:
■ Extractor handle (A in Figure 3)
■ Latch tab (B)
You may also safely touch the top and bottom of the disk module without
damaging the disk module .
18 Product Description
A metal grill protects exposed circuits against damage when the disk module is
laid circuit-side down on a flat surface.
The initial disk options for this product are 18-GByte, 36-GByte, and 73-Gbyte
10 K RPM disk drives. 18-GByte and 36-GByte 15 K RPM disk drives are also
supported. A label on the disk carrier shows the storage capacity and rotational
speed of the installed disk. Obtain information about the latest disk options from
HP sales representatives.
Caution Fillers must be installed in unused slots in order to maintain even
cooling for the installed disk modules.
BCCs and BCC Filler Panels
BCCs (Bus Control Cards) plug into two slots in the back of the disk system.
Each BCC connects to both LVD (low voltage differential) buses inside the disk
system. In full bus mode (DIP switch 1 set to “|”), both BCCs have access to all
installed disks. The two SCSI buses are bridged. If either BCC fails and LVM
primary and alternate paths are defined, data can be accessed through the other
BCC. In split bus mode (DIP switch 1 set to “0”), the left BCC (as viewed from
the rear of the disk system), is on the high numbered bank (with disk slots 8, 9,
10, 11,12, 13, and 14) and the ri gh t BC C is o n t h e l ow n umb ered bank (with disk
slots 0, 1, 2, 3,4, 5, and 6) of disk slots. See Figure 1.
Product Description
Two SCSI ports (B in Figure 4) on each BCC provide dual LVD connections to
the same or separate hosts. If a host is connected to one of the BCC ports, an
LVD terminator must be connected to the other port on that BCC.
Product Description 19
20 Product Description
Other features of the BCC are:
■ LEDs (C) indicating BCC status and bus configuration
■ DIP switches (D) on the rear panel:
1 Bus Mode (full or split bus)
2 Monitor Mode (SAF-TE or SES)
■ Locking thumbscrews (E)
■ Cam levers (F)
BCC circuitry provides the following functions:
■ Bus configuration (see “Setting DIP Switches” in Chapter 3)
■ Bus expansion (LVD)
■ SCSI environmental services (see page 17)
■ System fault detection
A BCC filler panel (Figure 5) replaces the second BCC when redundancy is not
required.
Caution The BCC filler panel maintains even cooling inside the disk
system when the second BCC is not present. A BCC filler panel
must be installed if the BCC is removed.
Product Description
Product Description 21
Power Supply/Fan Module
Redundant, hot-pluggable 340-watt power supplies convert wide-ranging AC
voltage from an external main to stable DC output and deliver it to the midplane.
Each power supply has an internal fan, an AC receptacle (A in Figure 6), two
ejector handles (D) with thumbscrews (C), and 2 LEDs (B). Internal control
prevents the rear DC output connector from becoming ener gi zed when the power
supply is removed from the disk system.
22 Product Description
Power supplies share the load reciprocally; that is, each supply automatically
increases its output to compensate for reduced output from the other, and vice
versa. If one power supply fails, the other delivers the entire load.
Internal circuitry triggers a fault when the internal fan or other part fails. At the
same time, the power fault LED (amber) illuminates, and, if enabled, the
hardware event monitor sends an event message. The power supply fan remains
on if other parts fail in order to maintain cooling air flow through the system. If
the fan fails, the power supply shuts down. The fan in the other working power
supply will increase to full speed to compensate for the failed fan. The failed
power supply/fan module must be removed and the replacement power supply/
fan module installed within two minutes. In the event of a failure, if a
replacement fan module/power supply is not available, leave the failed power
supply/fan module installed until you are ready to replace it. This should be done
to maintain proper cooling for the disk system.
Internal circuitry senses fan motion and triggers a fault when the speed of the
power supply’s internal fan falls below a critical level. At the same time, the LED
turns amber, and , if en abled, the hardware event monitor sends an event message.
Product Description
Product Description 23
Hardware/Software Requirements
The disk system is supported on the following operating systems:
■ HP-UX 11.00 with HWE 0302 (March 2002 Patch bundles) or greater
■ HP-UX 11.11 with HWE 0302 (March 2002 Patch bundles) or greater
■ Linux Red Hat 6.2, 7.0, 7.1
■ Windows NT 4.0 (Advanced Server, Enterprise Edition)
■ Windows 2000 (Server and Adva nced Server)
■ Microsoft Windows.Net (Serve r and Advanc ed Server)
■ SCO UnixWare 7.11
■ SCO OpenServer 5.06
■ HP MPE/iX 7.0
The following SCSI host bus adapters (HBAs) support the Disk System 2300:
■ A4999A, Ultra2 Low Voltage Differential SCSI Host Bus Adapter for B-,
C-, J-, and X-Class systems
■ A5140A Single Port Ultra 2 S CSI HBA Host bus adapt er for A-, L- , V-Class,
and Superdome.
■ A5149A, Single Port Ultra 2 SCSI HBA (PCI bus) Host bus adapter for
rp54X0, rp7400, rp7410, and rp8400 servers and A-, N-, L-, V-Class, and
Superdome systems (Full length card ).
24 Product Description
■ A5150A, Dual Port Ultra 2 SCSI (PCI bus) Host bus adapter for rx4610 and
rx9610 servers and A -, N- , L- , V-Class, and Superdom e sy st ems (F ull l eng th
card).
■ A5159A, Dual Part FWD SCSI PCI Host bus adapter for rx4610 and rx9610
servers
■ A5838A, Dual-Port 100Base-T/Dual-Port Wide Ultra2 Host bus adapter for
A-, N-, L-, V-Class, and Superdome systems.
■ A5856A, RAID 4Si - 4-Port Ultra2 LVD/SE RAID Host bus adapter for
rp54X0, rp7400, rp7410, and rp8400 servers, and A-, N-, L-, V-Class, and
Superdome systems.
■ A6828A, Single Port Ultra 160 SCSI HBA (PCI bus) Host bus adapter for
rp54X0, rp7400, rp7410, and rp8400 servers, and A-, N-, L-, V-Class, and
Superdome systems (Full length card ).
■ A6829A, Dual Port Ultra160 SCSI (PCI bus) adapter Host bus adapter for
rp54X0, rp7400, rp7410, and rp8400 servers and A-, N-, L-, V-Class, and
Superdome systems (Full length card).
The following host bus adapters are supported on HP Netservers:
■ C7430A, PCI Ultra2 wide Host bus adapter
■ D5025A, HP Ultra/Wide SCSI Host bus adapter for Netservers
■ D9161A, NetRAID 4M/64MB Cache Host bus adapter for HP Netservers
■ D9351A, NetRAID 4M/128MB Cache Host bus adapter for HP Netservers
■ P3413A, Single port Ultra160 SCSI Host bus adapter for HP Netservers
Product Description
Product Description 25
The following HP Netserver models are supported by the Disk System 2300:
■ rc7100
■ tc7100
■ tc 6100
■ tc4100
■ tc3100
■ rx4610
■ LXr8000
■ LXr8500
■ LH3/LH3r
■ LH4/LH4r
■ LH3000/LH3000r
■ LH6000/LH6000r
■ LC2000/LC2000r
■ LT6000
■ LPr
■ LP1000r
■ LP2000r
26 Product Description
■ E45/E50
■ E55/E60
■ E200/E200se
■ E800
The following host bust adapters are not supported at this time:
■ D2140A, NetRAID 1Si Host bus adapter
■ D5955A, NetRAID 3Si Host bus adapter
■ P3410A, NetRAID 1M Ultra160 SCSI Host bus adapter with 64MB
■ P3411A/B, NetRAID 2M Ultra160 SCSI Host bus adapter with 64MB
■ P3475A/B, NetRAID 2M Ultra160 SCSI Host bus adapter with 128MB
Topologies
Product Description
The disk system supports high availability through redundan t comp onent s an d
redundant connections to redundant hosts. Each SCSI port on a BCC can be
connected to a different host bus adapter in the same or different hosts. Internal
mirroring within the disk system is also poss ible.
Basic high availability topologies are described on the following pages. For
information about specific supported topologies, consult an HP sales
representative.
This disk system can hold up to 14 disk modules. The maximum number of disk
modules can be installed in either Full Bus Mode or Split Bus Mode. However,
host and disk drive addressing must be closely managed.
Full Bus Mode
The maximum of 14 disk modules can be supported in Full Bus Mode provided
there there is only one host bus adapter (HBA) connection and the HBA has the
SCSI address of 7.
If more than one host connection is required, the slot with the SCSI address
corresponding to the SCSI address of the additional host must not have a disk
module installed in it to avoid bus contention. For example, if two connections
are made to a Disk System 2300 with HBAs having SCSI addresses of 6 and 7,
then SCSI ID 6 (slot 7)must not have a disk module installed in it.
Note SCSI address 15 should never be used by an HBA when
connecting to a Disk System 23 00 because this address is reserved
on the SCSI bus for the enclosure services microprocessor.
Connecting one disk system to redundant hosts achieves system level high
availability. A single host bus adapter in each host is connected to a dif ferent port
in the disk system. W ith the disk system in full bu s mode (s witch 1 on ), each host
can reach all the disks. If the right BCC (viewed fr om the r ear of the disk system)
fails in this topology, there is still one path to the disks through BCC B. With the
disk system i n split bus mode (two internal busses), the Disk System 2300
supports data mirroring between the two internal busses with in the same disk
system. All connections from the host to the disk system are SCSI LVD cables.
Product Description 27
Another type of high availability topology connects mirrored disk system s to
redundant hosts. Dual host bus adapters in each host are connected to mirrored
disk systems. W ith the disk s ystems in fu ll bus mo de (switch 1 on), each hos t can
reach all disks in both disk systems. If one of the disk systems fails in this
topology, all hosts will still have access to the data on the mirrored disk system.
All connections from the host to the disk system are SCSI LVD cables.
28 Product Description
Due to SCSI ID limitations, daisy chaining of the Disk System 2300 is not
supported. The maximum storage capacity with this type of configuration is
approximately one Terabyte. This configuration does not provide any redundant
paths to the data, however there is some hardware redundancy provided by the
disk system hardware (i.e . power supply/fan modules and BCCs). T hi s
configuration can be used for boot, root, swap, or file system storage. Using
Mirror/UX software, one or more mirrors can be created on the same hardware
path to provide a basic level of data p rotection.
In figures 7 through 11, any BCC shown with only one cable connection should
be understood to have a terminator attached to the other SCSI connector.
The disk system can be connected to a single host with two host bus adapters
(HBAs) in a split bus configuration. See Figure 8. Each HBA will do reads and
writes to a maximum of seven disks. This confi gu rati on can prov ide a maxi mum
capacity of approximately 1.1 Terabytes. This configuration can also do basic
mirroring across different hardware paths, still providing a maximum data
capacity of approximately 0.5 Terabytes. This configuration can also yield a
maximum performance of 320 MB/s, since each BCC card is capable of 160MB/
s performance in a split bus mode.
Product Description
Product Description 29
Data path redundancy can be secured with the configuration shown in Figure 9.
Using an additional host bus adapter (HBA) and the LVM s oftware, alternate
links can be created, providing a redundant path to data for each disk system. In
addition, a separate mirror path can be created for data protection. This
configuration provides protection against any single component failure (i.e.,
cables, HBAs, disks). Figure 9 depicts connecting two disk systems to a single
host.
The only limit on the number of disk systems per system is the maximu m number
of supported HBAs. For large configuration, it is recommended that multiple
CPUs have large amounts of memory to handle the system load. Each disk
system in this configuration is capable of 160MB/s performance. Due t o SCSI ID
limitations, a maximum of 13 disks is supported per disk system (13 disks + 2
HBAs + 1 SES = 16 SCSI IDs).
30 Product Description
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