HP RP9 G1 9115, RP9 G1 9118 Disassembly Instructions Manual

Product End-of-Life Disassembly Instructions

Product Category: External Options

Marketing Name / Model
[List multiple models if applicable.]

HP RP9 G1 AiO Retail System, Model 9115

1.0 Items Requiring Selective Treatment

Item Description

Notes

Quantity of
items
included in
product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

1

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style
batteries

1

Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.

0

Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm

Includes background illuminated displays with gas
discharge lamps

LED
Cathode Ray Tubes (CRT)

0

Capacitors / condensers (Containing PCB/PCT)

0

Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height

0
External electrical cables and cords

DC Cable for External Power Supply

0

Gas Discharge Lamps

0

Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

0

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

EL-MF877-00 Page 1
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 2
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of
items
included in
product

Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

0
Components and waste containing asbestos

0

Components, parts and materials containing refractory
ceramic fibers

0

Components, parts and materials containing
radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.

Tool Description

Tool Size (if
applicable)

Philips Screwdriver

T15 2.55-

3.00kgf.cm

Slotted Screwdriver

2# 2.55-

3.00kgf.cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:

1. Removed the base by loosening the latch.

2. Tore off the label of the case.

3. Pried open the case.

4. Removed the plastic frame.

5. Removed the metal sheet and tape of the plastic frame.

6. Loosened 10 screws of the case.

7. Removed the plastic case.

8. Removed the metal parts of the case.

9. Removed the metal frame.

10. Removed the metal frame by loosening 5 screws.

11. Removed the fan by loosening 3 screws.

12. Removed the metal frame for HDD by loosening 2 screws.

13. Removed the plastic parts of the metal frame by loosening 4 screws.

14. Removed the button cell.

15. Removed the side of PCB assembly by loosening 3 screws.

16. Removed the cable of the PCB assembly.

17. Removed the speaker.

18. Removed the antenna by loosened 2 screws.

19. Tore off sticker of the metal frame.

20. Loosened 9 screws of the PCB assembly.

21. Removed the PCB assembly.