HP RP9 G1 9015, RP9 G1 9018 Disassembly Instructions Manual
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP RP9 G1 AiO Retail System, Model 9015
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps N/A
2
Cathode Ray Tubes (CRT)
N/A
0
Capacitors / condensers (Containing PCB/PCT)
N/A
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
N/A
0
External electrical cables and cords
N/A
1
Gas Discharge Lamps
N/A
0
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
N/A
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. N/A
0
Components and waste containing asbestos
N/A
0
Components, parts and materials containing
refractory ceramic fibers
N/A
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatme nt, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within t he product which require selective treatment in the right column, as
applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point whe re components
Tool Description
Tool Size (if
applicable)
T15 2.55-
3.00kgf.cm
2# 2.55-
3.00kgf.cm
Knife
Side Cutter
Star key wrench
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
Hexagonal Screwdriver (T15)
Philips Screwdriver
Slotted Screwdriver
3.1 List the basic steps that should typically be f oll owed to remove components and materials requi ring selective treatment:
1. Disassembly process – Removing Back Cover
2. Disassembly process – Installing Wireless Card
3. Disassembly process –Installing DIMM
4. Disassembly process – Do not remove the HDD cage
5. Disassembly process -Remove the HDD cage
6. Disassembly process (CPU Installing)
7. Disassembly process (Installing back cover bracket)
8. Disassembly process (Assemble MCR, webcam, BIO reader (If necessary)
9. Disassembly process (MSR,Webcam,BIO)
10. Disassembly process (Assemble back cover)
11. Compact Stand Assembling (Without Power Supply)
12.
3.2 Optional Graphic. If the disassembly process is complex , insert a graphic illustration below to identify the items
contained in the product that require selective t reatment (with descriptions and arrows identifying locations).
1.Description of the sample submitted for assessment
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Disassembly process (Removing Back Cover)
Product view
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
and 9.
Disassembly process (Installing Wireless Card)
Push the button on the middle bezel to
each side，see photo 1
Disassemble the
bracket, see photo 4
Disassemble the back cover by pulling
it upward and cover See photo 2.
Disassemble the bracket by the red
circle marked position and take off
the bracket, see photo 5
Take off the rear cover, see photo 3
Lift up the bracket,see photo 6
Pressing the visa cover hook and push
it to the direction show in the photo 7,8
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Install the wireless card atan angle of
45 degree.See photo 1
Screwdriver)See photo 2
Disassembly process (Installing DIMM)
at an angle of 45 degree.See photo 1
Disassembly process (Do not remove the HDD cage)
Fasten WIFI screw*1pcs as show in
photo 21.5 + /-0.2Kgf.cm Screw
driver: #1(Crosshead
Using pressing fixture to insert
cable in location“2”.Routing the
cable See photo3&4 Using pressing
fixture to insert cable in location“
1”.Routing the cable See photo3&4
Final cable routing for WLAN (
Photo 4)
Press the DIMM to confirm the DIMM
Take the DIMM and insert in DIMM slot
insert rightly See photo 2
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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