HP RP7405, RP7410 User Manual

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User Guide

hp rp7405/7410 Servers

Third Edition

Manufacturing Part Number: A6752-96008

21102

USA

Legal Notices

The information in this document is subject to change without notice.

Hewlett-Packard makes no warranty of any kind with regard to this manual, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. Hewlett-Packard shall not be held

liable for errors contained herein or direct, indirect, special, incidental or consequential damages in connection with the furnishing, performance, or use of this material.

Restricted Rights Legend. Use, duplication or disclosure by the U.S. Government is subject to restrictions as set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227-7013 for DOD agencies, and subparagraphs (c) (1) and (c) (2) of the Commercial Computer Software Restricted Rights clause at FAR 52.227-19 for other agencies.

HEWLETT-PACKARD COMPANY 3000 Hanover Street Palo Alto, California 94304 U.S.A.

Reproduction, adaptation, or translation of this document without prior written permission is prohibited, except as allowed under the copyright laws.

1. Introduction

hp rp7405/rp7410 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

System Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

I/O Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

hp rp7405 Servers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Detailed hp rp7405/rp7410 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Cells and nPartitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

System Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

I/O Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2. Installation

Unpacking the Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Unpacking a Racked Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Unpacking a Non-Racked Server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Installing Server Into the Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Installing the Cable Management Arm (CMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Installing Add-On Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Connecting AC Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

MP Core I/O Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

MP/SCSI Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

LAN/SCSI Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Management Processor Access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Setting Up the CE Tool (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Standby Power and Logging in to the MP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Configuring LAN Information for the MP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Verifying Presence of the Cell Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Powering On the hp rp7405/rp7410 Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Selecting a Boot Partition using the Management Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Verifying the System Configuration using Boot Console Handler (BCH) . . . . . . . . . . . . . . . . . . . . . . . 46

Booting HP-UX using Boot Console Handler (BCH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Contents

3. Troubleshooting

Common Installation Problems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

The Server Does Not Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

The Server Powers On But Then Shuts Down with a Fault Light . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

hp rp7405/rp7410 LED Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

4. Removal and Replacement

Shutting Down nPartitions and Powering Off Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . 58

Shutting Down an nPartition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Powering Off Hardware Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Removing and Replacing the Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Removing the Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

iii

Contents

Replacing the Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Removing and Replacing a Disk Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Removing a Disk Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Replacing a Disk Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Removing and Replacing a CD/DVD Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Removing a CD/DVD Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Replacing a CD/DVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Removing and Replacing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Removing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Replacing a Front Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Removing and Replacing a Rear Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Removing a Rear Smart Fan Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Replacing a Rear Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Removing and Replacing a PCI Smart Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Removing a PCI Smart Fan Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Replacing a PCI Smart Fan Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Removing and Replacing a Bulk Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Removing a BPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Replacing a BPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Removing and Replacing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Removing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Replacing a PCI Power Module (Brick) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Removing and Replacing the PCI Voltage Regulator Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Removing PCI VRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Replacing the PCI VRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Removing and Replacing a PCI Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Removing and Replacing a PCI Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Removing and Replacing the Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Removing the Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Replacing the Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Removing and Replacing a MP/SCSI Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Removing a MP/SCSI board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Replacing a MP/SCSI Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

A. Replaceable Parts

B. System Specifications

Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

System AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Temperature and Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Cooling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Typical Power Dissipation and Cooling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Acoustic Noise Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Air Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

C. Site Preparation

Electrical Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Electrical Load Requirements (Circuit Breaker Sizing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Power Quality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Sources of Electrical Disturbances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Power System Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Distribution Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Wire Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Raceway Systems (electrical conduits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Building Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Power Routing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Grounding Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Power Distribution Safety Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Cabinet Performance Grounding (High frequency Ground). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Equipment Grounding Implementation Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

System Installation Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Wiring Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Data Communications Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Environmental Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Computer Room Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Basic Air Conditioning Equipment Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Air Conditioning System Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Air Conditioning System Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Basic Air Distribution Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Air Conditioning System Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Humidity Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Air Conditioning Ducts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Dust and Pollution Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Electrostatic Discharge (ESD) Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Computer Room Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Fire Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Lighting Requirements for Equipment Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Facility Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Floor Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Space Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Delivery Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Operational Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Zinc Particle Contamination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

Contents

Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Contents

Tab les

Table 1. Revisions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .viii

Table 1-1. hp rp7405 Servers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 1-2. hp rp7405-to-rp7410 Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 1-3. hp rp7405/rp7410 DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 1-4. PCI Slot Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 2-1. hp rp7405/rp7410 DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table 3-1. Front Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table 3-2. BPS LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Table 3-3. PCI Power Supply LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Table 3-4. System, Standby, and I/O Fan LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Table 3-5. SINC POST LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Table 3-6. OL* LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Table 3-7. OL* LEDs States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Table 3-8. MP Core I/O LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Table 3-9. LAN/SCSI LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Table 4-1. Front Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Table 4-2. Rear Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Table 4-3. Smart Fan Assembly LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Table 4-4. PCI Power Module LED Indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Table A-1. hp rp7405/rp7410 Field Replaceable Unit (FRU) List . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Table B-1. hp rp7405/rp7410 Server Dimensions and Weights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Table B-2. hp rp7405/rp7410 Component Weights. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Table B-3. Power Cords . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Table B-4. AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Table B-5. System Power Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Table B-6. Typical hp rp7405/rp7410 Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Table C-1. Computer Room Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Table C-2. Effect of Humidity on ESD Charge Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Table C-3. Floor Loading Term Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Table C-4. Typical Raised Floor Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

vii

Table s

viii

Figures

Figure 1. Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Figure 2. Japanese RFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii

Figure 3. Korean RFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii

Figure 4. Taiwan Area EMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiv

Figure 5. C-Tick Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvi

Figure 1-1. hp rp7405/rp7410 Server (front view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Figure 1-2. hp rp7405/rp7410 Server (without front bezel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Figure 1-3. hp rp7410 8-Way Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 1-4. Cell Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 1-5. Cell Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 1-6. Memory Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 1-7. Internal Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 1-8. System Backplane Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 1-9. I/O Subsystem Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 1-10. Right-Front View of hp rp7405/rp7410 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 1-11. Left-Rear View of hp rp7405/rp7410 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 2-1. Removing the Polystraps and Cardboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 2-2. Removing the Shipping Bolts and Plastic Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 2-3. Preparing to Roll Off the Pallet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 2-4. Securing the Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 2-5. RONI Lifter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 2-6. Server with Shipping Box Removed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 2-7. Remove Cushions for Lift Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 2-8. Raising a Server Off the Pallet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 2-9. Lifting the Server to the Rack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 2-10. Positioning the Lift handles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 2-11. Inserting the Pins Into the Rack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 2-12. Lift Handles Mounted . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 2-13. Lifting the Server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 2-14. Cable Management Arm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 2-15. Attaching CMA to Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 2-16. Attaching CMA to the Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 2-17. Embedded Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 2-18. Cell Board (Two processors and CC Shown) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Figure 2-19. DIMM Loading Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 2-20. Power Cord Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 2-21. Power Source vs. Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 2-22. Front Panel Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 2-23. MP Main Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 2-24. The lc Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 2-25. The ls Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Figure 2-26. The du Command Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 4-1. Top Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Figures

Figure 4-2. Top Cover Retaining Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Figure 4-3. Disk Drive Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Figure 4-4. Disk Drive Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Figure 4-5. CD/DVD Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Figure 4-6. CD/DVD Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Figure 4-7. CD/DVD Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Figure 4-8. Front Smart Fan Assembly Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Figure 4-9. Front Fan Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Figure 4-10. Rear Smart Fan Assembly Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Figure 4-11. Rear Fan Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Figure 4-12. PCI Smart Fan Assembly Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Figure 4-13. PCI Smart Fan Assembly Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Figure 4-14. BPS Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Figure 4-15. BPS Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Figure 4-16. PCI Power Module Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Figure 4-17. PCI Power Module Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Figure 4-18. Locating the VRMs on PCI Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Figure 4-19. PCI Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Figure 4-20. PCI Gate Detail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Figure 4-21. Locating Internal Disks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Figure 4-22. Locating the Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Figure 4-23. Mass Storage Backplane. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Figure 4-24. MP/SCSI Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Figure 4-25. MP/SCSI Detail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Figure B-1. Airflow Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Figure C-1. Raised Floor Ground System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Figure C-2. Cabinet Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Figure C-3. Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Preface

Revision History

Table 1 Revisions

Revision Part Number Release Date Description

Third A6752-96008 November 2002 Corrected power cord and power reqirements section.

Corrected DIMM oading order. Other general corrections.

Second A6752-96002 August 2002 Changed title, revised entire book

First A6752-91001 February 2002 Initial release

viii

Notational Conventions

WARNING Warnings highlight procedures or information necessary to avoid injury to

personnel. The warning should tell the reader exactly what will result from what actions and how to avoid them.

CAUTION A caution highlights procedures or information necessary to avoid damage to equipment,

damage to software, loss of data, or invalid test results.

NOTE A note highlights supplemental information.

Safety and Regulatory

Regulatory Model: RSVLA-0102

For your protection, this product has been tested to various national and international regulations and standards. The scope of this regulatory testing includes electrical/mechanical safety, radio frequency interference, acoustics, and know hazardous materials.Where applicable, approvals obtained from third-party test agencies are shown on the product label.

Safety in Material Handling

WARNING Do not lift the cabinet manually. To avoid physical injury you must use a mechanical

lifting device.

WARNING Use care when working with hazardous voltages. This equipment may be configured

with dual input line sources. Hazardous voltages and energy maybe present even after the removal of a single input source. Trained service personnel must follow the service guidelines.

WARNING Do not stand in front of the equipment as it is rolled off the pallet onto the ramps.

When removing the equipment from the shipping pallet, follow the guidelines specified in the Installation Procedures section of the appropriate equipment guides.

Figure 1 Declaration of Conformity

USA Radio Frequency Interference FCC Notice

The Federal Communications Commission (in 47 CFR Part 15 subpart B) has specified that the following notice be brought to the attention of the users of this product.

NOTE This equipment has been tested and found to comply with the limits for a Class A digital

device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

The user is cautioned that changes or modifications not expressly approved by Hewlett-Packard could result in the equipment being noncompliant with FCC Class A requirements and void the user’s authority to operated the equipment.

Japanese Radio Frequency Interference VCCI

This equipment is in the Class A category information technology equipment based on the rules of Voluntary Control Council For Interference by Information Technology Equipment (VCCI). When used in a residential area, radio interference may be caused. In this case, user may be required to take appropriate corrective actions.

Figure 2 Japanese RFI

xii

Korean RFI Statement

Certification Number: E - AAAAA - BB - CCCC

• E: EMC registration

• AAAAA: equipment codes (RRL notice, 2000.10.26)

• BB: certification year

• CCCC: registration number

Figure 3 Korean RFI

Translation

Class A Equipment:

Please note that this equipment has been approved for business purpose with regards to electromagnetic interference, if purchased un error for use in residential area, you may wish to exchange the equipment where you purchase it.

Class B Equipment:

Please note that this equipment has been approved for non-business with regards to electromagnetic interference. So, this equipment can be allowed to use all area as well as residential area.

European Union RFI Statement

This is a Class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.

Canada RFI Statement

This Class A digital apparatus complies with Canadian ICES-003.

Notice relative aux interférences radioélectriques (Canada)

Cet appareil numéric de la classe A est conforme à la norme NMB-003 du Canada.

xiii

BSMI (Taiwan Area)

This product is fully compliant to CNS 13438 (CISPR 22: 1993) Class A. The EMC label is in the form shown in Figure 4.

Figure 4 Taiwan Area EMC

NOTE Electrical practices and suggestions in this guide are based on North American practices. For

countries outside North America, local electrical codes will take precedence over North American electrical codes.

An example would be the recommendation that the PE (protective earthing) conductor be green with yellow stripes. This requirement is a North American directive and does not override the local code requirements for a country outside North America.

Throughout this manual, the [LAHJ] acronym will be used to indicate Local Authority Has Jurisdiction.

Acoustics (Germany)

Acoustic Noise (A-weighted Sound Pressure Level LpA) measured at the bystander position, normal operation, to ISO 7779: LpA = 59 dB.

Geräuschemission (Deutschland)

Lärmangabe (Schalldruckpegel LpA) gemessen am fiktiven Arbeitsplatz bei normalem Betrieb nach DIN 45635, Teil 19: LpA = 59 dB.

IT Power System

This product has not been evaluated for connection to an IT power system (an AC distribution system having no direct connection to earth according to IEC 60950).

TT, TN-C, and TN-C-S Power Systems

These products should not be connected to power systems that switch open the return lead when the return lead also functions as the protective earth (PE). A separate PE ground wire must be connected to the equipment at the designated PE terminal tie point.

xiv

Installation Conditions

See installation instructions before connecting this equipment to the input supply.

Voir la notice d’installation avant de raccorder au réseau.

WARNING NORDIC Class 1 Equipment

Denmark: Før tilslutning af de øvrige ledere, se medfølgende installationsvejledning.

WARNING NORDIC Class 1 Equipment

Sweden: Apparaten skall anslutas till jordat uttag, när den ansluts till ett nätverk.

Network Connected Equipment

The installation must provide a ground connection for the network equipment.

CAUTION Sweden: Apparaten skall anslutas till jordat uttang när deb abskuts till ett nätverk.

CAUTION Norway: Apparaten skall anslutas till jordat uttang nar deb abskuts till ett natverk.

Lithium Battery Caution

WARNING Observe the correct polarity when changing the lithium battery. There is a danger of

explosion if battery is installed incorrectly.

Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions and local disposal requirements.

IMPORTANT Switzerland: Annex 4.10 of SR 814.013 applies to batteries.

Australian C-Tick Label

Figure 5 C-Tick Label

xvi

Laser Safety

NOTE If a Fibre Channel I/O card is present, the following laser safety statement applies.

This product contains a laser internal to the Optical Link Module (OLM) for connection to the Fibre communications port.

In the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in the Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is indicated by a label on the plastic OLM housing.

Outside the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in IEC 60825-1:1993 and EN 60825-1:1994, including Amendment 11:1996.

NOTE If a DVD is present, the following laser safety statement applies.

This product contains a laser internal to the Digital Versatile Disc (DVD) housing.

In the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in the Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is indicated by a label on the DVD housing.

Outside the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in IEC 60825-1:1993+A1 and EN 60825-1:1994+A11.

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1 Introduction

The hp rp7410 is a member of Hewlett-Packard’s business-critical computing platform family: a mid-range, mid-volume server, positioned as an upgrade to the current N-Class product in the PL-1X product line. It provides increased performance over its predecessor but in a smaller volume. Its shallower depth allows it to fit in a standard rack. In addition to the hp rp7410, Hewlett-Packard offers a series of cost-effective servers based on the hp rp7410 with somewhat less performance. See “hp rp7405 Servers” on page 5.

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Introduction

hp rp7405/rp7410 Overview

The hp rp7405/rp7410 is a 10U, 8-way SMP, rack-mount server that accommodates up to 32 GB of memory (64 GB available at a later date); PCI-4X I/O; and internal peripherals including disks and DVD/tape. Its high availability features include N+1 hot-pluggable fans and power, redundant power cords, and hot-pluggable PCI cards and internal disks. It uses the PA8700 PA-RISC processors.

Figure 1-1 hp rp7405/rp7410 Server (front view)

Chapter 1

Figure 1-2 hp rp7405/rp7410 Server (without front bezel)

Introduction

hp rp7405/rp7410 Overview

Improvements over its predecessor, N4000, include:

• Better availability and up time

• Depth optimized (shallower, fewer racking issues)

• Performance density increase

• Performance increase

• Internal removable media

• More internal disks

• Optimal power cord quantity (2 min., 4 max)

• Enabled for cell hot-plug, dual-partition, dual and/or redundant MP Core I/O

• More PCI slots (up to 16)

• Upgradeable to PCI-X

• Superset of MP Core I/O functionality

Cell Board

The cell board contains the processors, main memory, and the CC ASIC that interfaces the processors and memory to the off-board I/O. The CC provides a crossbar connection, which allows communication with other cell boards in the system. It connects to the PDH and SINC hardware. Each cell board holds up to 16 DIMMS. There can be one or two cell boards installed in a server. The cell boards have hot-plug capability.

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Introduction

hp rp7405/rp7410 Overview

System Backplane

The system backplane comprises the system clock generation logic, the system reset generation logic, DC-to-DC converters, power monitor logic, and two Local Bus adaptor (LBA) link-to-PCI converter ASICs. It also includes connectors for attaching the cell boards, PCI backplane, MP Core I/O MP/SCSI boards, SCSI cables, bulk power, chassis fans, front panel display, intrusion switches, and the system scan card. Unlike Superdome or the rp8400, there are no XBC chips on the system backplane. The “crossbar-less” back-to-back

CC connection increases performance and reduces costs.

There are only two sets of cell board connectors, because the server has only two cells

Also, only half of the MP Core I/O board set connects to the system backplane. The MP/SCSI boards plug into the backplane, while the LAN/SCSI boards plug into the PCI Backplane.

I/O Subsystem

All of the I/O is integrated into the system by way of the PCI busses. The CC on each cell board communicates with one SBA over the SBA link. The SBA link consists of both an inbound and an outbound link with an effective bandwidth of approximately 1 GB/sec. The SBA converts the SBA link protocol into “ropes”. SBA can support up to 16 of these high-speed bi-directional links for a total aggregate bandwidth of approximately 4 GB/sec. The LBA acts as a bus bridge, supporting either one or two ropes, and capable of driving either

PCI-2x Turbo (33 MHz x 64 bits) or PCI-4 Twin Turbo (66 MHz x 64 bits) respectively.

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Introduction

hp rp7405 Servers

Hewlett-Packard offers a cost-effective server based on the hp rp7410 by employing a reduced number of processors, memory, core I/O, or power supplies as indicated in Table 1-1.These servers provide a somewhat reduced performance than the fully functional hp rp7410 servers.

Table 1-1 hp rp7405 Servers

Server Product Number Description

rp7405 2-way system A7111A Includes rp7405 SMP base system, two 650-MHz PA-RISC

processors, 4-GB memory (2 x 2GB memory modules), two 73-GB 10k internal disks, one DVD drive, one cell board, one core I/O, and two power supplies

rp7405 4-way system A7112A Includes rp7405 SMP base system, four 650-MHz PA-RISC

processors, 8-GB memory (4 x 2 GB memory modules), four 73-GB 10k internal disks, one DVD drive, two cell boards, two core I/O, and two powers supplies

rp7405 8-way system A7113A Includes rp7405 SMP base system, eight 650-MHz PA-RISC

processors, 16-GB memory (8 x 2 GB memory modules), four 73-GB 10k internal disks, one DVD drive, two cell boards, two core I/O, and two power supplies

These servers may be upgraded with additional processors/cell boards, memory, core I/O, etc. according to the corporate price list.

In addition, these servers may be upgraded to fully functional hp rp7410 servers with the kits given in Tab le 1- 2 .

Table 1-2 hp rp7405-to-rp7410 Upgrades

Kit Description Upgrade Part Number

Upgrade kit from 2-way rp7405 to rp7410 750 MHz upgrade A7144A

875 MHz upgrade A7145A

Upgrade kit from 4-way rp7405 to rp7410 750 MHz upgrade A7146A

875 MHz upgrade A7147A

Upgrade kit from 8-way rp7405 to rp7410 750 MHz upgrade A7148A

875 MHz upgrade A7149A

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Introduction

Detailed hp rp7405/rp7410 Description

Figure 1-3 hp rp7410 8-Way Block Diagram

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

Cell Board

The cell board contains the processors, main memory, and the cell controller (CC) ASIC that interfaces the processors and memory to the off-board I/O. Shown in Figure 1-4 is the CC. This is the heart of the cell board. The CC provides a crossbar connection, which allows communication with other cell boards in the system. It connects to the PDH and SINC hardware. Each cell board holds up to 16 DIMMs. There can be one or two cell boards installed in an system. The cell boards have hot-plug capability.

Figure 1-4 Cell Controller

Figure 1-5 Cell Board

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

The hp rp7405/rp7410 has a 48V distributed power system and receives the 48V power from the system backplane board. The cell board contains DC-to-DC converters to generate the required voltage rails. The DC-to-DC converters on the cell board do not provide N+1 redundancy.

The cell board contains several major buses including:

• Runway buses for each of the four processors

• Two memory buses (one going to each half of the main memory array)

• Incoming and outgoing I/O bus that goes off board to a SBA chip

• Incoming and outgoing crossbar bus that goes off board to the other cell boards

• PDH bus that goes to the PDH/SINC circuitry

All of these buses come together at the CC chip.

Due to space limitations on the cell board the PDH/SINC circuitry resides on a riser board that plugs at a right angle into the cell board. The cell board also includes clock circuits, test circuits and de-coupling capacitors.

Figure 1-6 shows a simplified view of the memory subsystem. It consists of two independent access paths, each path having its own address bus, control bus, data bus, and DIMMs. In practice, the CC runs the two paths 180 degrees out of phase with respect to each other to facilitate pipelining in the CC. Address and control signals are fanned out through register ports to the SDRAMs on the DIMMs.

Data transferred between the CC and SDRAM passes through custom VLSI circuits (M2) that are bit-sliced; four form one 72-bit CC memory data bus. These circuits perform speed and width conversion between the SDRAM and MID busses. They also perform the write (tag update) portion of a read-modify-write (RMW) access. The CC memory data busses are bi-directional and run at 250 MT/s (million transfers per second). These links are self-clocked in that a pair of clock strobes is passed along with the data so that phase realignment can be done by the receiver.

Figure 1-6 Memory Subsystem

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Introduction

Detailed hp rp7405/rp7410 Description

PDH Riser Board

The PDH riser board is a daughter card for the cell board. It contains a micro-processor memory interface microcircuit, processor-dependent hardware (PDH) including the processor dependant code (PDC) Flash memory, and a manageability micro-controller, called SINC, with associated circuitry. The PDH obtains cell board configuration information from cell board signals and from the cell's LPM. See the PDH Riser Board ERS for operational details.

The memory interface microcircuit is the heart of the PDH. It provides the CC access to the PDH space by a 4-bit, 50-75 MHz bus. This microcircuit also supports an interrupt mechanism to the CC that can interrupt a processor for the PDH. It provides access to the FLASH ROM and scratch RAM memory chips together with

the external registers and an interface to an I the system. It also controls system reset and initialization signals, as well as the low-level debugger (LDB) port, UART, semaphore register, and GPIO pins. It is the primary master for a Serial Presence Detect bus.

The PDH supports up to 4 MB of address space for ROM (FLASH) to hold the PDC firmware.

The non-volatile memory and scratch RAM have been combined and placed in a 512KB battery-backed SRAM

DIMMs

Custom designed by Hewlett-Packard, each DIMM contains 36x4 SDRAM memory components similar to PC-133 memory but qualified to run at 125MHz. They have an low-voltage TTL interface. The CEC does not support traditional DRAMs.

C micro controller (SINC) that monitors sensors throughout

The hp rp7405/rp7410 supports DIMMs with 128, 256, 512, and 1024 Mbit devices. Table 1-3 shows each DIMM supported with its associated capacity, the resulting total system capacity, and the memory component density.

DIMMs must be loaded in sets of four at specific locations. For best performance, loading sets of eight DIMMs is recommended.

Table 1-3 hp rp7405/rp7410 DIMMs

DIMM Capacity Total Capacity Memory Component Density

512 Mbyte 16 Gbytes 128 Mbit

1G Byte 32 Gbytes 256 Mbit

Main Memory Performance Latency to main memory is an important parameter in determining overall system performance. With memory busses running at 125 MHz, the latency for a page hit is 8.5 cycles (68ns), the latency for a page closed is 11.5 cycles (92ns), and the latency for a page miss is 14.5 cycles (116ns).

Cells and nPartitions

NOTE In the following discussion, the term “cell” refers to a cell board.

A cell board that has an I/O link to a bootable device and a console (usually supplied by an MP Core I/O card) is a potential boot cell. The cell that contains the boot console I/O path is the called the root cell. Both cells are potential root cells. The primary or default root cell in a single nPartition system is the bottom cell (cell 1).

An nPartition (also called a Protection Domain) is a cell(s) running the same OS and sharing processes and memory space among the components. Each nPartition must have one root cell and may have both. The hp rp7405/rp7410 has only two possible nPartition configurations: single or dual. The additional cell that may be part of the nPartition does not require I/O links nor MP Core I/O cards.

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Introduction

Detailed hp rp7405/rp7410 Description

In the single nPartition case, if two cells are present, either cell may be the root cell, assuming the both cells have MP Core I/O functionality present. If only one cell is present, that cell is the root cell (and should be cell

1).

In the dual nPartition case (two cells required), each nPartition consists of one cell, and each cell must be a root cell. The ability to interconnect two cells in one nPartition or isolate the cells in a dual nPartition system provides system configuration flexibility. System partitioning is configured by the system management processor.

Internal Disk Devices for hp rp7405/rp7410

As Figure 1-4 shows, in an hp rp7405/rp7410 cabinet the top internal disk drives connect to cell 1 through the MP Core I/O for cell 1 (for 1/0/0/3/0.6) and the LAN/SCSI card in slot 1_8 (I/O chassis 1 slot 8, for 1/0/1/0/0/1/1.6). Both of the bottom disk drives (0/0/0/3/0.6 and 0/0/0/3/0.5) connect to cell 0 through the MP core I/O for cell 0. A CD/DVD-ROM drive or DAT drive connects to cell 1 through the core I/O card for cell 1, thus it can be accessed through the cell 1 nPartition only.

Figure 1-7 Internal Disks

Drive 1-1 Path: 1/0/0/3/0.6

Drive 1-2 Path: 1/0/1/0/0/1/1.6

Removable media path DVD: 1/0/0/3/1.2 DAT: 1/0/0/3/1.3

Drive 0-2 Path: 0/0/0/3/0.5

Drive 0-1 Path: 0/0/0/3/0.6

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Introduction

Detailed hp rp7405/rp7410 Description

System Backplane

The system backplane comprises the system clock generation logic, the system reset generation logic, DC-to-DC converters, power monitor logic, and two LBA link-to-PCI converter ASICs. It also includes connectors for attaching the cell boards, PCI backplane, MP Core I/O MP/SCSI boards, SCSI cables, bulk power, chassis fans, front panel display, intrusion switches, and the system scan card.

Figure 1-8 System Backplane Block Diagram

System backplane

MP Core I/O MP/SCSI

PCI backplane

Cell board 0

MP Core I/O MP/SCSI

Cell board 1

Cell boards are perpendicular to the system backplane.

Bulk power supply

Only half of the MP Core I/O board set connects to the system backplane. The MP/SCSI boards plug into the backplane, while the LAN/SCSI boards plug into the PCI backplane.

Clocks and Reset

The system backplane contains reset and clock circuitry that propagates through the whole system. The central clocks drive all major chip set clocks. Therefore, these circuits represent a system wide single point of

failure.

I/O Subsystem

The cell board-to-I/O path runs from the CC to the SBA, from the SBA to the ropes, from the ropes to the LBA, and from the LBA to the PCI buses. The CC on each cell board communicates with one SBA over the SBA link. The SBA link consists of both an inbound and an outbound link with an effective bandwidth of approximately 1 GB/sec. The SBA converts the SBA link protocol into “ropes.” The SBA can support up to 16 of these high-speed bi-directional rope links for a total aggregate bandwidth of approximately 4 GB/sec. The LBA acts as a bus bridge, supporting either one or two ropes and capable of driving either PCI-2x Turbo (33 MHz x 64 bits) or PCI-4 Twin Turbo (66 MHz x 64 bits) respectively

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

Figure 1-9 I/O Subsystem Architecture

The server supports two internal SBAs. The SBAs generate 32 rope busses (16 per SBA). The 32 available internal rope busses are divided in the following manner:

• Two ropes are routed as single rope bundles to support PCI-2x Turbo (264 MB/sec. bandwidth, 64-bit transfers at 33 MHz) for the MP Core I/O boards for SCSI/LAN.

• Two ropes are routed as single rope bundles to two LBAs to support two slots operating at PCI-2x for MP/SCSI.

• The remaining 28 ropes are bundled in two rope pairs to 14 LBAs to support 14 slots operating at PCI-4x (528 MB/sec., 64-bit transfers at 66 MHz).

The hp rp7405/rp7410 uses Hewlett-Packard’s proprietary adaptive signaling concept, also known as the Universal PCI slot concept (not to be confused with the Universal PCI card). Circuitry on the backplane senses a standard connector, keyed for 5V, to determine the type of the cards inserted. The circuitry controls the voltage rail supplied to the connector for powering the card’s I/O pads, VIO. The card can either be of the 5V only, or universal type. 5V only cards require VIO to be 5V, whereas universal cards operate 5V as well as

3.3V. To take advantage of the 66-MHz potential of universal cards, one must operate those cards at 3.3V. The

control circuitry on the backplane, therefore, provides 5V to the slot when a 5V-only card is present, or 3.3V when a universal card is present. Firmware controls the setting of the slot’s clock rate.

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

This concept allows maximum connectivity for mainstream 5V-only, 33 MHz, 32 bit (PCI-1x) and 64-bit (PCI-2x) cards, as well as full I/O bandwidth utilization through the use of 64-bit, 66 MHz (PCI-4x) universal cards.

Table 1-4 PCI Slot Types

Slot# Device:

0_1 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_2 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_3 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_4 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_5 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_6 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_7 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

0_8 PCI-2x, Turbo 64-bit, 33 MHz, Adaptive Signaling, 5V connector, Hot Swap Slot.

1_1 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_2 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_3 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_4 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_5 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_6 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_7 PCI-4x, Twin Turbo 64-bit, 66 MHz, 3.3V-only, 3.3V connector, Hot Swap Slot.

1_8 PCI-2x, Turbo 64-bit, 33 MHz, Adaptive Signaling, 5V connector, Hot Swap Slot.

MP/SCSI MP Core I/O Board

The hp rp7405/rp7410 accommodates two sets of MP Core I/O functionality. Each MP Core I/O board set consists of a MP/SCSI board and a Procurium LAN/SCSI board. At least one MP/SCSI board is required (independent of partitions) An additional MP/SCSI board can be added as well (and is required in a dual partition system). Both MP/SCSI boards are oriented vertically and plug into the system backplane. The

MP/SCSI board incorporates a dual Ultra160 SCSI controller and is hot pluggable.

Procurium LAN/SCSI Board

At least one Procurium LAN/SCSI board is required for the minimum system configuration; two are required in a dual partition system. The Procurium board is a standard PCI form factor card with PCI card edge connectors. The PCI backplane has one slot location reserved for the required Procurium board and another that can accommodate either a Procurium board or any other supported add-in PCI card. The Procurium board is hot pluggable.

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

Mass Storage (Disk) Backplane

Internal mass storage connections (to disks) are routed on the mass storage backplane, having connectors and termination logic. All disks are hot pluggable. The hp rp7405/rp7410 accommodates one internal removable media device. Therefore, only one power connector for a removable media device is required on the mass storage backplane. The mass storage backplane incorporates a circuit that allows power to the internal removable media device to be programmatically cycled.

Package Description

Dimensions

The dimensions of the hp rp7405/rp7410 are as follows:

• Width: 44.45 cm (17.5 inches), constrained by EIA standard 19 inch racks.

• Depth: Defined by cable management constraints to fit into standard 36 inch deep racks (Rittal/Compaq, Rosebowl I):

25.5 inches from front rack column to PCI connector surface:

26.7 inches from front rack column to MP Core I/O connector surface

30 inches overall package dimension, including 2.7 inches protruding in front of the front rack columns.

• Height: 10U – 5.4 cm = 43.91 cm (17.287 inches). This is the appropriate height for a product that consumes 10U of rack height while allowing adequate clearance between products directly above and below this product. Fitting four server units per 2 m rack and upgrade of current 10U height products in the future are the main height constraints.

System Chassis

The mass storage section located in the front allows access to removable mass storage devices without removal of the bezel (not shown.) This is especially helpful when the system is mounted in the lowest position in a rack. The mass storage bay accommodates one 5.25-inch removable media device and up to four 3.5-inch hard drives. The front panel display board, containing LEDs and the system power switch, is located directly above the 5.25-inch removable media bay.

Below the mass storage section and behind a removable bezel are two PCI DC-to-DC power converters.

The bulk power supply section is partitioned by a sealed metallic enclosure located in the bottom of the package. This enclosure houses the 2N fully redundant BPSs.

Chapter 1

Figure 1-10 Right-Front View of hp rp7405/rp7410

Front panel

display board

Introduction

Detailed hp rp7405/rp7410 Description

PCI cards

Cell boards

PCI DC-to-DC

converters

Bulk powers supplies

The PCI I/O card section, located towards the rear, is accessed by removing the top cover.

The PCI OLR fan modules are located in front of the PCI cards. These six 9.2 cm fans are housed in plastic carriers. They are configured in two rows of three fans.

The MP/SCSI MP Core I/O boards are positioned vertically at the rear of the chassis.

The PCI card bulkhead connectors are located in the top rear portion of the product volume.

Four OLR system fan modules, externally attached to the chassis, are 15 cm (6.5-inch) fans. Two fans are mounted on the front surface of the chassis and two are mounted on the rear surface.

Redundant line cords attach to the floating AC connector module at the bottom rear. Two 20-amp cords are required to power the server. Two additional line cords provide redundancy.

Slide

A cable harness that connects from the rear of the BPSs to the system backplane provides DC power distribution.

Access the system backplane is accomplished by removing the left side cover. The system backplane inserts by a guide/insertion mechanism using a single large jack screw assembly.

SCSI ribbon-cable assemblies route from the mass storage area to the backside of the system backplane and to the Procurium PCI MP Core I/O card.

Chapter 1

Introduction

Detailed hp rp7405/rp7410 Description

Cell boards are accessed from the right side of the chassis behind a removable side cover.

Figure 1-11 Left-Rear View of hp rp7405/rp7410

System backplane

MP Core I/O MP/SCSIs

Chapter 1

2 Installation

Chapter 2

Installation

Unpacking the Server

Hewlett-Packard shipping containers are designed to protect their contents under normal shipping conditions. After the equipment arrives, carefully inspect each carton for signs of shipping damage. A tilt indicator is installed on each carton shipped. The beads in the indicator will roll to the upper position if the container has been tilted to an angle that could cause equipment damage. The tilt indicator itself will have two windows and each window under normal conditions will show four beads present. If a carton has been mishandled, accidentally dropped, or knocked against something, the tilt indicator will indicate missing beads. If damage is found, document the damage with photographs and contact the transport carrier immediately.

Examine the server cabinet for visible shipping damage. After unpacking the cabinet, check for damage that may have been obscured by the shipping container. If damage is found after visual inspection, document the damage with photographs and contact the transport carrier immediately.

If the equipment has any damage, a damage claim form must be obtained by the customer from the shipping representative. The customer should complete the form and return it to the shipping representative.

NOTE The server may come already racked, or ready for rack installation.

Unpacking a Racked Server

This section contains information pertaining to unpacking the cabinet.

WARNING Wear protective glasses while cutting the plastic bands around the shipping

container. These bands are under tension. When cut, they can spring back and cause serious eye injury.

NOTE Position the pallet allowing for enough space to roll the cabinet off the pallet before starting.

Remove the cabinet using the following procedure:

Step 1. Cut the polystrap bands around the shipping container.

Step 2. Lift the cardboard top cap from the shipping box. See Figure 2-1.

Step 3. Remove the corrugated wrap from the pallet.

Step 4. Remove the packing materials.

Chapter 2

Installation

Unpacking the Server

CAUTION The plastic wrapping material should be cut off rather than pulled off. Pulling the

plastic covering off represents an ESD hazard.

Figure 2-1 Removing the Polystraps and Cardboard

Chapter 2

Installation

Unpacking the Server

Step 5. Remove four bolts holding down the ramps and remove the ramps. See Figure 2-2.

Figure 2-2 Removing the Shipping Bolts and Plastic Cover

Chapter 2

Unpacking the Server

Step 6. Remove the six bolts from the base attaching the rack to the pallet. See Figure 2-3.

Figure 2-3 Preparing to Roll Off the Pallet

Installation

WARNING Make sure that the leveling feet on the rack are raised before you roll the

rack down the ramp and any time you roll the rack on the casters. Use caution when rolling the cabinet off the ramp. A single server in the cabinet weighs approximately 400 pounds. It is strongly recommended that two people roll the cabinet off the pallet.

Chapter 2

Installation

Unpacking the Server

Securing the Cabinet

Once in position, secure and stabilize the cabinet using the leveling feet at the corners of the base and install the anti-tip mechanisms on the bottom front and rear of the rack.

Figure 2-4 Securing the Cabinet

Unpacking a Non-Racked Server

NOTE Hewlett-Packard recommends the use of a lifter, such as a RONI Company model 17000 SP 400

lifting device, when moving a non-racked system, shown in Figure 2-5. If no lifter is available, install the lift handle panels provided with the system.

Unloading with a Lifter

Use the following procedure to unload the server from the pallet using a lifter.

WARNING Use caution when using a lifter. Because of the weight of the server, it must be

centered on the lifter forks before raising it off the pallet to avoid injury.

Never extend more than one server from the same cabinet while installing or servicing either an hp rp7405/rp7410 or another server product. Failure to follow these instructions could result in the cabinet tipping over.

Chapter 2

Figure 2-5 RONI Lifter

Installation

Unpacking the Server

Step 1. Follow the instructions on the outside of the server packaging to remove the banding and carton top

from the server pallet.

Figure 2-6 Server with Shipping Box Removed

Step 2. Remove all cartons from the pallet leaving only the server.

Chapter 2

Installation

Unpacking the Server

Step 3. Observe Figure 2-7. Remove the two foam cushion for lift access.

Figure 2-7 Remove Cushions for Lift Access

Remove cushion

Clearance for RonI lift is 28”x5”

Step 4. Insert the lifter forks under the server.

Step 5. Carefully roll the lift forward until it is fully positioned against the side of the server.

Chapter 2

Step 6. Slowly raise the server off the pallet until it clears the pallet cushions.

Figure 2-8 Raising a Server Off the Pallet

Installation

Unpacking the Server

Step 7. Roll the lifter and server away from the pallet. Do not raise the server any higher than necessary

when moving it over to the rack.

Figure 2-9 Lifting the Server to the Rack

NOTE If you are installing the system in a rack, refer to the hp J1530A Rack Integration Kit

Installation Guide.

Chapter 2

Installation

Unpacking the Server

Unloading with Lift Handle Panels

WARNING Use this procedure only if no Hewlett-Packard approved lift is available. This

procedure should only be attempted by two (2) authorized Hewlett-Packard service people.

Before attempting this procedure, it is recommended that you first remove all Cell Boards and AC power supplies. Instructions for removing these components can be found in the Removal and Replacement chapter of the service manual. Check with local safety regulations before attempting to move the system using the lift handle panels.

Failure to observe these precautions can cause serious injury to personnel or damage to equipment.

CAUTION Unpack the server in an ESD safe environment. Observe all ESD safety precautions before

attempting this procedure. Failure to follow ESD safety precautions could result in damage to the server.

Step 1. Remove both side covers. If present, remove the front panel.

Step 2. Locate lift handles and remove from storage plate.

Step 3. Orient lift handle panels such that when installed, the handles hang downward at 90 degrees and

lock in a horizontal position during lifting.

Figure 2-10 Positioning the Lift handles

Chapter 2

Installation

Unpacking the Server

Step 4. With one handle in each hand, install the pin end of the panel into the backside of the front rack

mount ears on the chassis.

Figure 2-11 Inserting the Pins Into the Rack

Step 5. Pull the spring plunger out, move the handles apart and install the shoulder washer end of the

panel into the keyway feature.

Figure 2-12 Lift Handles Mounted

Chapter 2

Installation

Unpacking the Server

Step 6. Continue to pull the handles apart until the spring plunger snaps into final position. The spring

plunger will drop down into the recess position.

Step 7. Check that the handles are secure by pressing the handles together and moving back and forth.

Check to see if lift handle panel breaks free of chassis.

Step 8. Repeat the steps above for the other handle

Step 9. To lift the server, rotate the handles 90 degrees to horizontal position.

NOTE If you are installing the system in a rack, refer to the installation guide, hp J1530A,

rack installation kit (lower case intended).

Step 10. After moving the server, remove the lift handle panels from the chassis and reinstall the server

covers and front bezel. Refer to installation guide, hp J1530A, rack installation kit (lower case intended).

Figure 2-13 Lifting the Server

Installing Server Into the Rack

Any hp rp7405/rp7410 server that is to be installed into a rack is shipped with equipment slides. With every set of slides comes an installation guide: installation guide, hp J1530A, rack installation kit (lower case intended). Follow the steps in this installation guide to determine where and how to place the server into the rack.

Chapter 2

Installation

Unpacking the Server

Installing the Cable Management Arm (CMA)

Once the server is installed in the rack, the CMA must be installed on the rear of the server. Follow the instructions for installing the CMA can be found in the installation guide, hp J1530A, rack installation kit (lower case intended).

Figure 2-14 Cable Management Arm

Cable Management Arm

Step 1. Attach CMA to the rack using T-25 Torx screws.

Figure 2-15 Attaching CMA to Rack

Chapter 2

Installation

Unpacking the Server

Step 2. Attach the other end of the CMA to the server using the thumb screws that came with the CMA.

Figure 2-16 Attaching CMA to the Server

Installing Add-On Products

This section explains load orders and dependencies for add-on products. For physical installation procedures, refer to that components replacement procedure in Chapter 4, “Removal and Replacement.”

If installing add-on products to an existing server, follow operating system backup and shutdown procedures before powering off the server.

Cell Boards

The server requires at least one cell board to operate. Install the first cell board slot 1 (lower slot) and the second cell board in slot 0 (upper). Cell Board 0 enables the PCI cards in Chassis 0 and Cell Board 1 enables

the PCI cards in Chassis 1.

MP Core I/O Cards

MP Core I/O consists of two cards that must be installed in pairs: the MP/SCSI and the LAN/SCSI.

The first (primary) set of MP Core I/O cards is installed as follows: MP/SCSI in MP/SCSI slot 1 (lower slot) and LAN/SCSI in PCI slot 8 of Chassis 1 (from the rear, the extreme right-hand PCI slot).

The second set of MP Core I/O cards is installed as follows: MP/SCSI in MP/SCSI slot 0 and LAN/SCSI in PCI slot 1 of Chassis 0. Cell Board 0 is required to enable the MP/SCSI slot 0 (upper slot) and LAN/SCSI slot 1 in

Chassis 0 (from the rear, the extreme left-hand PCI slot).

Chapter 2

Installation

Unpacking the Server

Embedded Disks

The hp rp7405/rp7410 server can operate in the diskless (LAN boot) mode. If disks are to be installed, the top two disks are driven by the primary MP Core I/O set. Install the first embedded disk in the top left location. Install the second embedded disk in the top right location.

Figure 2-17 Embedded Disks

Drive 1-1 Path: 1/0/0/3/0.6

Drive 1-2 Path: 1/0/1/0/0/1/1.6

Drive 0-2 Path: 0/0/0/3/0.5

Drive 0-1 Path: 0/0/0/3/0.6

Chapter 2

Installation

Unpacking the Server

Processors

Each cell board can hold up to four processors. Processor slots are numbered 0-3. Install processors in ascending order: slot 0, 1, 2, and 3. It is not necessary to balance the number of processors across both cell boards.

Figure 2-18 Cell Board (Two processors and CC Shown)

Cell Controller

Processor 1

Processor 0

DIMMs

Each cell board can hold up to four quads (or ranks) of DIMMs. A rank is a group of four DIMMs. Each DIMM within a rank must be the same capacity. The slots within each rank are numbered a,b,c,d. Install DIMMs in ascending order: rack 0, 1, 2 and 3. It is not necessary to balance the number of DIMMs across both cell

boards. For Example: one rank = slots 0a, 0b, 0c and 0d.

Valid Memory Configurations DIMMs must be loaded in sets of four at specific locations. For best performance, loading sets of 8 DIMMs is recommended.

Processor 3

Processor 2

Table 2-1 hp rp7405/rp7410 DIMMs

DIMM Capacity Total Capacity Memory Component Density

512 Mbyte 16 GBytes 128 Mbit

1G Byte 32 Gbytes 256 Mbit

The hp rp7405/rp7410 is capable of supporting as little as 2 Gbytes of main memory using four 512 MByte DIMMs and one cell board and as much as 32 Gbytes using all 16 DIMM slots on both cell boards with 1GB

DIMMs.

Chapter 2

Installation

Unpacking the Server

Different densities of main DIMMs can be mixed within a system, but each set of four DIMMs must be identical. A set of DIMMs is defined as the group of four DIMMs that must be loaded together on a cell board. Each cell board has four sets of DIMM slots, and they must be populated in order. Figure 2-19 shows the order in which the DIMM slots must be populated.

Figure 2-19 DIMM Loading Sequence

Block 1 shows the minimum memory configuration per cell board. Each cell board, therefore, could have up to four different density DIMMs (if there were that many), as long as each set of four are identical. Box 2 and Box 4 show the more optimal memory configurations, because loading DIMMs in sets of eight takes advantage of the pipelined structure of the memory interface of the CC.

Chapter 2

Installation

Connecting AC Input Power

The hp rp7405/rp7410 has five line cord configurations:

• All four line cords

• Cords A0 and A1 only

• Cords B0 and B1 only

• Cords A0 and B0 only

• Cords A1 and B1 only

A single-line-cord configuration is not allowed.

Figure 2-20 Power Cord Configuration

A0 A1 B0 B1

The power cord configuration is passed to the operating system using the pwrgrd (Power Grid) command. Each of the five selections in the pwrgrd command matches one of the configurations. The appropriate option should be selected for the actual line cord configuration. With the correct configuration selected, the LEDs should be green. when the pwrgrd command is invoked, the following menu is displayed.

IMPORTANT Options 1 and 2 are for Hewlett-Packard internal use only. Do not select these options.

prompt> pwrgrd Power grid configuration preference.

1. Grid A only (Cords A0,A1 required)

2. Grid B only (Cords B0,B1 required)

3. Grids A & B (Cords A0,A1,B0,B1 required)

4. Cords A0 & B0 only

5. Cords A1 & B1 only

Select Option:

Chapter 2

Installation

Connecting AC Input P ower

If two separate power sources are available, the two power supplies can be plugged into the separate power sources, increasing system reliability should one power source fail.

Figure 2-21 Power Source vs. Power Distribution

BPS 0 BPS 1

220 VAC*

Rear of Cabinet

*180-269 VAC

WARNING Voltage is present at various locations within the server whenever a power source is

connected. This voltage is present even when the main power switch is in the off position. Failure to observe this warning could result in personal injury or damage to equipment.

NOTE System firmware will prevent boot when a single power cord configuration is detected.

Chapter 2

Installation

MP Core I/O Connections

Each hp rp7405/rp7410 can have up to two MP Core I/O board sets installed. This allows for two partitions to be operating, or allows for MP Core I/O redundancy in a single partition configuration. Each MP Core I/O board set consists of two boards: the MP/SCSI board and the LAN/SCSI board. The MP/SCSI board is oriented vertically and accessed from the back of the server. The LAN/SCSI is accessed from the PCI expansion card bay. Only the primary MP core I/O board set (MP/SCSI slot 1 & LAN/SCSI slot 8, Chassis 1) is required for a single partition implementation. The secondary MP/SCSI board is not necessary for full operation, however, without the secondary MP/SCSI board only two internal disks can be accessed.

MP/SCSI Connections

The MP/SCSI board is required to update firmware, access the console, turn partition power on/off, access all but one of the internal peripherals, and utilize other features of the system.

Connections to the MP/SCSI board include the following:

• DB25 Connector; via the M cable.

This RS232 connector provides connections for a local console, external modem, and a UPS. The server end of the M cable terminates in a DB25 connector. The opposite side of the cable terminates in 3 DB9 connectors labeled CONSOLE, UPS, and REMOTE.

• 10/100 Base-T LAN RJ45 connector (for LAN and Web Console access).

This LAN uses standby power and is active when AC is present and the front panel power switch is off.

• Internal LVD Ultra 160 SCSI channel for connections to internal mass storage.

• Internal SE Ultra SCSI channel for connection to internal removable media device.

LAN/SCSI Connections

The LAN/SCSI board is a PCI form factor card that provides the basic external I/O connectivity for the system.

Connections to the LAN/SCSI board include the following:

• PCI-X to PCI-X Bridge for multi-device compatibility

• Internal LVD Ultra 160 SCSI channel for connections to internal mass storage.

• External LVD Ultra 160 SCSI channel connected to a 68-pin VHDCI connector

• 10/100/1000 Base-T LAN RJ45 connector.

The primary LAN interface is located on the LAN/SCSI board installed in the rightmost slot when viewing the system from the back.

Management Processor Access

NOTE In order to access the Management Processor for the initial installation, the M cable must first

be connected to the DB25 connector located on the Primary MP/SCSI board. The Primary MP/SCSI board is located in the lower MP/SCSI board slot.

Chapter 2

Installation

MP Core I/O Connections

Setting Up the CE Tool (PC)

The CE Tool is usually a laptop. It allows communication with the Management Processor (MP) in the hp rp7405/rp7410. The MP monitors the activity of either a one partition or a multiple partition configuration.

During installation, communicating with the MP enables such tasks as:

• Verifying that the components are present and installed correctly

• Setting LAN IP addresses

• Shutting down cell board power

Communication with the MP is established by connecting the CE Tool to the Local RS-232 port on the MP Core I/O card.

Setting CE Tool Parameters

After powering on the CE Tool, ensure the communications settings are as follows:

• 8/none (parity)

• 9600 baud

• na (Receive)

•na (Transmit)

Chapter 2

Installation

MP Core I/O Connections

If the CE Tool is a laptop using Reflection 1, check or change these communications settings using the following procedure:

1. From the Reflection 1 Main screen, pull down the Connection menu and select Connection Setup.

2. Select Serial Port.

3. Select Com1.

4. Check the settings and change, if required.

Go to More Settings to set Xon/Xoff. Click OK to close the More Settings window.

5. Click OK to close the Connection Setup window.

6. Pull down the Setup menu and select Terminal (under the Emulation tab).

7. Select any HP terminal type.

Preferred types are HP70092, HP70096 or HP70094, HP70098, VT100.

8. Click Apply.

This option is not highlighted if the terminal type you want is already selected.

9. Click OK.

Connecting the CE Tool to the Local RS-232 Port on the MP

This connection allows direct communications with the MP. Only one window can be created on the CE Tool to monitor the MP. When enabled, it provides direct access to the MP and any partition.

Use the following procedure to connect the CE Tool to the Local RS-232 Port on the MP:

1. Connect one end of a null modem cable (9-pin to 9-pin) (Part Number 5182-4794) to the M cable connector labeled CONSOLE.

2. Connect the other end of the RS-232 cable to the CE Tool.

Standby Power and Logging in to the MP

After connecting the serial device, it is possible to login to the Management Processor (MP). Housekeeping power (also known as standby power) is generated as soon as AC power is applied to the server. Because the MP uses standby power, it is possible to login to the MP even when the power switch is in the OFF position. The power switch is a DC power switch that controls +48v DC.

Before powering up the hp rp7405/rp7410 server for the first time:

1. Verify that the AC voltage at the input source is within specifications for each hp rp7405/rp7410 being installed.

2. If not already done so, power on the serial display device.

The preferred tool is the CE tool running Reflection 1.

To power up the MP, set up a communications link, and login to the MP:

1. Connect the server to AC power.

Chapter 2

Installation

MP Core I/O Connections

On the front of the hp rp7405/rp7410, a solid green Standby Power, a solid green MP Present, and a flashing amber Attention light will illuminate after about 30 seconds.

Figure 2-22 Front Panel Display

2. Check the bulk power supply LED for each BPS.

When on, the breakers distribute power to the BPSs. AC power is present at the BPSs:

• When power is first applied. Note the BPS LEDs will be flashing amber.

• After 30 seconds has elapsed. Note the flashing amber BPS LED for each BPS becomes a flashing

green LED

Refer to power cord policies to interpret LED indicators.

3. Login to the MP: a. Enter Admin at the login prompt. This term is case sensitive.

It takes a few moments for the MP prompt to appear. If it does not, make sure the laptop serial device settings are correct: 8 bits, no parity, 9600 baud, and na for both Receive and Transmit. Then, try again.

b. Enter Admin at the password prompt. This term is case sensitive.

Chapter 2

Installation

MP Core I/O Connections

The MP Main Menu appears:

Figure 2-23 MP Main Menu

MP login: Admin MP password:

Welcome to the

rp7410

Management Processor

MP MAIN MENU:

CO: Consoles VFP: Virtual Front Panel CM: Command Menu CL: Console Logs SL: Show chassis Logs HE: Help X: Exit Connection

MP>

Configuring LAN Information for the MP

To set the MP LAN IP address:

1. At the MP Main Menu prompt (MP>), enter cm. From the MP Command Menu prompt (MP:CM>), enter lc (for LAN configuration).

The screen displays the default values and asks if you want to modify them. It is a good idea to write down the information, as it may be required for future troubleshooting.

NOTE If the Command Menu is not shown, enter q to return to the MP Main Menu, then enter cm

Chapter 2

Enter lc and press the Return key. The following screen appears:

Figure 2-24 The lc Command Screen

Installation

MP Core I/O Connections

NOTE The value in the “IP address” field has been set at the factory. The customer must provide

the actual LAN IP address.

2. At the prompt, Do you want to modify the configuration for the customer LAN?, enter y.

The current IP address is shown; then the following prompt appears: Do you want to modify it? (Y/[N])

3. Enter y.

4. Enter the new IP address.

The customer shall provide this address for network interface 0.

5. Confirm the new address.

6. Enter the MP Network name.

This is the host name for the customer LAN. The name can be as many as 64 characters, and include alpha numerics, - (dash), _ (under bar),. (period), or a space. It is recommended that the name be a derivative of the complex name. For example, Acme.com_MP.

7. Enter the LAN parameters for Subnet mask and Gateway address.

This information shall come from the customer.

8. Once step 7 is completed, the system will indicate the parameters have been updated and return to the MP Command Menu prompt (MP:CM>)

9. To check the LAN parameters and status, enter the ls command at the MP Command Menu prompt (MP:CM>).

Chapter 2

Installation

MP Core I/O Connections

10. A screen similar to the following will appear allowing verification of the settings:

Figure 2-25 The ls Command Screen

To return to the MP main menu, enter ma. To exit the MP, enter x at the MP main menu.

Verifying Presence of the Cell Boards

To perform this activity, either connect to the management processor (MP) using a console or connect the CE Tool (laptop) to the RS-232 Local port on the MP.

After login to the MP, verify that the MP detects the presence of all the cells installed in the cabinet. It is important for the MP to detect the cell boards. If it does not, the partitions will not boot.

To determine if the MP detects the cell boards:

1. At the MP prompt, enter cm .

This displays the Command Menu. Among other things, the Command Menu allows one to view or modify the configuration and/or look at utilities controlled by the MP.

To look at a list of the commands available, enter he. You may have to press Enter to see more than one screen of commands. Use the Page Up and Page Down keys to view the previous or next screen of commands. To exit the Help Menu, enter q.

2. From the command prompt (MP:CM>), enter du.

Chapter 2

Installation

MP Core I/O Connections

The du command displays the MP Bus topology. A screen similar to the following appears:

Figure 2-26 The du Command Screen

3. There will be an asterisk (*) in the column marked MP.

4. Verify that there is an asterisk (*) for each of the cells installed in the cabinet, by comparing what is in the Cells column with the cells physically located inside the cabinet.

Figure 5-9 shows that cells are installed in slots 0 and 1. In the cabinet, there should be cells physically located in slots 0 and 1.

Chapter 2

Installation

Powering On the hp rp7405/rp7410 Server

After powering on the Management Processor (MP) (+3.3 V HKP), and checking that the MP detects the presence of the cell boards, power up the server.

If using a LAN crossover cable with the laptop, review server activity for each partition configured, as it powers up and boots. Windows can be opened for the complex and for each partition. It is recommended that at least two windows be opened.

• A window showing all activity in the complex. Following the installation procedure in this manual, will have a window open already on the laptop.

To display activity for the complex:

1. If not already done, open a separate Reflection 1 window and connect to the MP.

2. From the MP Main Menu, select the VFP command with the s option.

• A window showing activity for a single partition.

To display activity for each partition as it powers up:

1. Open a separate Reflection 1 window and connect to the MP.

2. Select the VFP command and choose the partition desired to view.

There should be no activity on the screen at this point in the installation process.

NOTE More than one window cannot be opened using a serial display device.

To power on the server:

1. Switch the power switch at the front of the server to On. The following events occur:

• Power is applied to the server.

• Processor Dependent Code (PDC) starts to run on each cell.

• Cell self test executes.

• Hardware initializes for the server.

• Console communication is established.

2. When activity on the Reflection 1 screen stops, return to the MP Main Menu by typing Ctrl-B.

3. Enter co to enter console mode.

4. Enter the partition number of the partition to boot.

5. Press Enter.

Chapter 2

Installation

Selecting a Boot Partition using the Management Processor

At this point in the installation process, the hardware is set up, the Management Processor (MP) is connected to the LAN, the AC and DC power have been turned on, and the selftest is completed. Now the configuration can be verified.

After DC is powered on and the selftest is complete, use the MP to select a boot partition.

1. From the MP Main Menu, enter cm.

2. From the MP Command Menu, enter bo.

3. Select the partition to boot. Partitions may be booted in any order.

4. Return to the MP Main menu by typing ma from the MP Command menu

5. Exit the MP by typing co at the MP Main Menu.

Exiting the MP should automatically bring you to the Boot Console Handler Main menu.

Chapter 2

Installation

Verifying the System Configuration using Boot Console Handler (BCH)

From the BCH main menu, type in to go the Information Menu. Use the corresponding command from the menu to verify the type and quantity of processors, memory and I/O cards:

• PR (Processors)

• ME (Memory)

• IO (Check the PCI Device Information to determine if the values match the devices installed in the server)

Once the parameters have been verified, use the ma command to return to the BCH Main Menu.

Chapter 2

Installation

Booting HP-UX using Boot Console Handler (BCH )

Booting HP-UX using Boot Console Handler (BCH)

If Instant Ignition was ordered, HP-UX will have been installed in the factory at the Primary Path address. If HP-UX is at a path other than the Primary Path, use the pa (path) command (from the Configuration Menu) to set boot path.

1. Main Menu: Enter command or Menu> co

2. Configuration Menu> pa pri xx/xx/xx

3. Configuration Menu> ma

Once the Primary Path has been set, use the bo (boot) command (from the Main Menu) to boot HP-UX.

1. Main Menu: Enter command or Menu> bo pri

2. The following prompt appears:

Do you wish to stop at the ISL prompt prior to booting (y/n)?

Enter n.

NOTE If the partition fails to boot, or if the server was shipped without instant ignition, you may have

to boot from a DVD that contains the operating system and other necessary software.

Chapter 2

Installation

Booting HP-UX using Boot Console Handler (BCH)

Chapter 2

3 Troubleshooting

Chapter 3

Troubleshooting

Common Installation Problems

The following sections contain general procedures to help you locate installation problems.

CAUTION Replace the top cover before operating the server, even for a short time. Otherwise, overheating

can damage chips, boards, and mass storage devices. However, you can safely remove the PCI access panel while the server is running to remove and replace PCI hot-plug boards. For any other service activity requiring access to the processor baseboard or I/O backplane, power down the server and observe all safety precautions.

Most problems are the result of incorrect system and SCSI subsystem configurations.

To troubleshoot an installation problem, perform the following checks in the order given:

1. Check all cable and power connections, including those in the rack, etc.

2. Ensure the server is configured properly.

Check the Setup Utility. If the error is a network-related problem, determine if the server has enough memory and hard disk drive capacity.

3. Verify all cables and boards are securely plugged into the appropriate connectors or slots.

4. Remove all extra options such as disk drives one at a time, checking its affect on the server.

5. Unplug the power cord, wait 20 seconds, plug the power cord in again, and restart the server.

6. If you suspect a hardware error, follow these steps:

a. Log users off the LAN and power down the server.

b. Extend the server out of the rack and remove the top cover.

c. Simplify the hp rp7405/rp7410 to the minimum configuration.

The minimum configuration consists of the following:

•One cell

• Two processors

• One quad of memory DIMMS (size 256MB or larger)

• One MP/SCSI card

• One LAN/SCSI card

•System Backplane

• PCI Backplane

•One BPS

•Two PCI power modules

• Two power cords.

7. Remove all third-party options, and reinstall each one, one at a time, checking the server after each installation.

8. Replace the top cover and reconnect the power cord and other cables.

Chapter 3

Troubleshooting

Common Installation Problems

9. Boot the server and if it does not function properly, refer to the following procedures.

The Server Does Not Power On

Use these steps to check for power related problems:

1. Check each bulk power supply’s (BPS) LED.

The LED is located in the lower left hand corner of the power supply face. Table 3-2 shows the states of the LEDs.

2. Check that the power supply and both power cords are plugged in to the chassis.

The Server Powers On But Then Shuts Down with a Fault Light

Use this checklist to check for the following problems when the server powers on and then off:

1. Check that a conductive item has not been dropped or left inside the server chassis.

2. Check the connections on all boards.

3. Check the system backplane for bent pins.

hp rp7405/rp7410 LED Indicators

The server has LEDs that indicate the health of the server. This section defines those LEDs.

Front Panel LEDs

There are seven LEDs located on the front panel.

Tab l e 3- 1 Fr ont Pan e l LE Ds

LED Driven By State Description

Bulk Power Good GPM On Green 48V Good (LED works even if SP is not installed, or

installed and not active)

Off 48V Off

Standby Power Good GPM On Green 3.3V SB Good (LED works even if SP is not

installed, or installed and is not active)

Off 3.3V Off

SP Active GPM On Green At least one SP is installed and Active

Off No SPs are installed or at least one is installed but

not active

Remote SP via GPM On Green Dial-in (remote) console enabled

Off Dial-in (remote) console is disabled, or SP not

installed, or SP installed and not active

Attention SP via GPM Flash Yellow Chassis log alert unread

Off No alert, or SP not installed, or SP installed and not

active

Chapter 3

Troubleshooting

Common Installation Problems

Table 3-1 Front Panel LEDs (Continued)

LED Driven By State Description

Run PDC/SP via

GPM

Faul t PDC / S P v i a

GPM

Bulk Power Supply LEDs

There is a single three-color LED on each bulk power supply.

On Green One or more partition running

Off No partition running, or SP not installed, or SP

installed and not active

Flash Red One or more Partitions have reported a fault

Off No Partitions running, or SP not installed, or SP

installed and not active

Tab l e 3- 2 BP S L EDs

LED Indication Description

Blink Green BPS in standby state and no faults or warnings

Green BPS in run state (48 volt output enabled) and no faults or

warnings

Blink Yellow BPS in standby or run state and warning(s) present but no faults

Yellow BPS in standby state and recoverable fault(s) present but no

non-recoverable faults

Blink RED BPS state may be unknown, non-recoverable fault(s) present

Red Not Used (therefore BPS Failure)

Off BPS state unknown, (therefore BPS Fault or Failure)

PCI Power Supply LEDs

There are three LEDs on the PCI power supply. Green and yellow LEDs follow OL* operation. A multi-color LED reports warnings and faults.

Table 3-3 PCI Power Supply LEDs

LED Driven By State Description

Power Each Supply On Green All output voltages generated by the power

supply are within limits.

Off Output voltages are turned off

Attention SP via PCI LPM Yellow See Table 3-7.

Chapter 3

Common Installation Problems

Table 3-3 PCI Power Supply LEDs (Continued)

LED Driven By State Description

Fault Each Supply Flash Yellow The temperature within the power supply is

above the lower threshold.

On Yellow The temperature of the power supply is

approaching the thermal limit

Flash Red Power supply has shut down due to an over

temperature condition, a failure to regulate the power within expected limits, or a current-limit condition.

On Red Not Used

Off No Faults

System, Standby, and I/O Fan LEDs

There is a single three-color LED on each System, Standby, and I/O Fan.

Table 3-4 System, Standby, and I/O Fan LEDs

Troubleshooting

LED Driven By State Description

Fan Status Fan On Green Normal

Flash Yellow Predictive Failure

Flash Red Failed

Off No Power

SINC POST LEDs

The four SINC POST LEDs (Green) display the current state of the SINC firmware.

Table 3-5 SINC POST LEDs

LED Driven By State Description

SINC POST SINC Off 3.3V SB Off

All On SINC is reset or dead

0x1-0xE SINC POST State

Chapter 3

Troubleshooting

Common Installation Problems

OL* LEDs

Table 3-6 OL* LEDs

Location LED Driven By State Description

Chassis Beside Cell and On Cell

PCI OL* Board PCI Slot Power LBA On Green Slot is powered

MP Core I/O Panel

PCI/Cell LED OL*

Cell Board Power Cell LPM On Green 3.3V SB and Cell_Pwr_Good

3.3V SB off, or 3.3V SB on and no Cell_Pwr_Good

Cell Attention SP via GPM Yellow See Table 3-7.

Off Slot is not powered

PCI Slot Attention LBA Off Normal

Yel l ow S e e Ta bl e 3 -7 .

PCI Slot Power LBA On Green Core is powered

Off Core is not powered

PCI Slot Attention LBA Off Normal

Yel l ow S e e Ta bl e 3 -7 .

Table 3-7 OL* LEDs States

State

Power

(Green)

Attention (Yellow)

Normal Operation (powered) On Off

Fault Detected, power on On Flashing

Slot Selected, power on, NOT Ready for OL* On On

Power off or Slot Available Off Off

Fault Detected, power off Off Flashing

Ready for OL* Off On

MP Core I/O LEDs

The MP Core I/O LEDs are located on the MP Core I/O Panel.

Table 3-8 MP Core I/O LEDs

LED Driven By State Description

Management Processor Power Good

3.3SB On Green 3.3V SB is on

Off 3.3V SB off

Chapter 3

Table 3-8 MP Core I/O LEDs (Continued)

LED Driven By State Description

Troubleshooting

Common Installation Problems

Management Processor Active

Management Processor POST

MP LAN 100BT SP LAN Controller On Green SP LAN in 100BT Mode

MP LAN 10BT SP LAN Controller On Green SP LAN in 10BT Mode

MP LAN Link OK SP LAN Controller On Green SP LAN Link OK

MP LAN Activity SP LAN Controller On Green SP LAN Data Activity

System SCSI Diffsense System SCSI Controller On Green On=LVD, Off=Single Ended

System SCSI TermPower System SCSI Controller On Green Terminators are powered

SelfTest On Yellow Yellow during POST of failure

LAN/SCSI (PCI Slot) LEDs

The LAN/SCSI LEDs are located on the PCI Panel.

SP On Green Service Processor on this MP

Core I/O Board is managing box.

Off SP is not managing box.

SP Off SP is reset or off

0x1-0xF Green SP POST Code

Table 3-9 LAN/SCSI LEDs

LED Driven By State Description

System LAN 1000BT System LAN Controller On Green System LAN in 1000BT Mode

System LAN 100BT System LAN Controller On Green System LAN in 100BT Mode

System LAN 10BT System LAN Controller On Green System LAN in 10BT Mode

System LAN Link OK System LAN Controller On Green System LAN link OK

System LAN Activity System LAN Controller On Green System LAN Data Activity

System LAN Full Duplex System LAN Controller On Green System LAN in full duplex mode

System SCSI Diffsense System SCSI

Controller

System SCSI TermPower System SCSI

Controller

On Green On=LVD, Off=Single ended

On Green Terminators are powered

Chapter 3

Troubleshooting

Common Installation Problems

Chapter 3

4 Removal and Replacement

Chapter 4

Removal and Replacement

Shutting Down nPartitions and Powering Off Hardware Components

When you remove and replace hardware you may need to shut down one or more nPartitions on the server. In some cases you also will need to power off hardware components as part of the remove and replace procedure.

This section gives details on how to ensure that an nPartition is properly shut down, and it also describes how to power off (and power on) hardware components.

Shutting Down an nPartition

This procedure is for checking an nPartition’s boot status and, if needed, shutting down HP-UX on the nPartition.

Step 1. Advise the customer that the system (one or more nPartitions) must be shut down for repairs.

Ensure that the customer has a current backup, and inform the customer of the anticipated downtime.

Step 2. Login to the server’s service processor (MP).

Step 3. Use the Virtual Front Panel (VFP) to view the current state of the nPartition that you will shut

down. From the MP Main menu, enter VFP to access the Virtual Front Panel menu, and select the

nPartition whose boot state you want to view.

Control-b (^B) to exit the VFP display.

Type

• If an nPartition has booted HP-UX, or if it is in the process of launching HP-UX, you must shut down HP-UX on the nPartition.

When HP-UX is running on an nPar, its VFP displays “HP-UX heartbeat” with a blinking asterisk (*) to indicate its interactivity.

In this case, proceed with the next step.

• If the nPartition is at its Boot Console Handler (BCH) interface, then HP-UX has already been shut down.

• If the nPartition currently is booting, then you should wait for it to reach the BCH interface and—if necessary—interrupt auto-boot when you see the “Attempting to boot” and “To discontinue, press any key within 10 seconds” messages.

If the nPartition is at the BCH menu interface then HP-UX is shut down. Otherwise, proceed with the next step to shut down HP-UX.

Step 4. From the MP Main menu, enter CO and select the console for the nPartition you plan to shut down.

You should have access to the HP-UX login prompt (or command line) when using the nPartition’s console. If you have no interactivity at the console, HP-UX may be halted or hung.

Step 5. At the nPartition’s console, login to HP-UX and shut down the operating system.

After making arrangements with the customer, issue the shutdown command to shut down and halt HP-UX on the nPartition.

Chapter 4

Removal and Replacement

Shutting Down nPartit ions and Poweri ng Off Hardware Components

For example, the shutdown -h 240 command will shut down and halt HP-UX on the nPartition after waiting for a grace period of four minutes (240 seconds).

To reboot the nPartition after it is halted, use the MP Command menu’s RS command to restart the nPartition. (This allows the nPartition to reset and boot to its BCH interface; if auto-boot is configured it also boots HP-UX.)

Powering Off Hardware Components

This procedure is for powering off and powering on components that are to be removed and replaced.

Step 1. Login to the server’s service processor (MP).

Step 2. If the component you will power off is assigned to an nPartition, then use the Virtual Front Panel

(VFP) to view the current boot state of the nPartition.

HP-UX on the nPartition must be shut down before you power off any of the hardware assigned to the nPartition.

Once you are certain the nPartition is not running HP-UX, you can power off components that belong to the nPartition.

Refer to the procedure Shutting Down an nPartition for details on determining the nPartition boot state and shutting down HP-UX.

Step 3. Access the MP Command menu.

From the MP Main menu enter CM to access the Command menu.

Step 4. Use the MP Command menu’s PS command to check details about the hardware component you

plan to power off. The PS command enables you to check the status of the cabinet, system backplane, MP Core I/O,

PCI power domains — or bricks — in the I/O card cage, and cells.

Step 5. Use the MP Command menu’s PE command to power off the hardware component.

Using the PE command you can power on or off the cabinet (including all cells and I/O in the cabinet), individual cells, or PCI power domains (bricks).

Using the Command menu’s PE command to manage cabinet power is equivalent to using the front panel power switch.

Step 6. If you need to disable all power in the entire cabinet, you also must disconnect all power cords in

order to disable all housekeeping power.

NOTE Ensure that all power cords are labeled to indicate which receptacle each cord plugs

into. Because of power redundancy capabilities it is important that each power cord plugs into its proper receptacle.

Also, ensure that the cabinet power has been turned off before disconnecting any power cords.

Step 7. Perform the hardware removal and replacement procedure for the powered off component.

Step 8. If needed, reconnect all power cords to the receptacles where they belong.

Chapter 4

Removal and Replacement

Shutting Down nPartitions and Powering Off Hardware Components

Step 9. Use the MP Command menu’s PE command to power on the hardware component that you powered

off.

Step 10. Use the MP Command menu’s PS command to confirm the status of the newly replaced component.

NOTE You may need to allow time for some components to complete power on self tests

(POST) before a complete status is available.

Chapter 4

Removal and Replacement

Removing and Replacing the Top Cover

It is necessary to remove and replace one or more of the covers to access the components within the server chassis.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-1 Top Cover

Chapter 4

Removal and Replacement

Removing and Replacing the Top Cover

Removing the Top Cover

Figure 4-2 Top Cover Retaining Screws

Step 1. Loosen the retaining screws securing the cover to the rear of the chassis.

Step 2. Slide the cover toward the rear of the chassis.

Step 3. Lift the cover up and away from the chassis.

Replacing the Top Cover

Step 1. Slide the cover into position. It should easily slide into position; however, a slow firm pressure will

be needed to properly seat the cover.

Step 2. Tighten the retaining screws securing the cover to the chassis.

Chapter 4

Removal and Replacement

Removing and Replacing a Disk Drive

The disk drives are located in the front of the chassis. The nPartition must be shutdown to remove or replace the drive that serves as the boot disk. Refer to “Shutting Down nPartitions and Powering Off Hardware Components” for more information. The remainder of the internal disk drives are hot pluggable.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-3 Disk Drive Location

Chapter 4

Removal and Replacement

Removing and Replacing a Disk Drive

Removing a Disk Drive

Figure 4-4 Disk Drive Detail

Step 1. Disengage the front locking latch on the disk drive by pushing the release tab to the right and the

latch lever to the left.

Step 2. Pull forward on the front locking latch and carefully slide the disk drive from the chassis.

Replacing a Disk Drive

NOTE Sometimes using the diskinfo and ioscan commands will produce encached data. To resolve

this, these commands should be run when the disk drive is removed.

Step 1. Before installing the disk drive, enter the following command:

#diskinfo -v /dev/rdsk/cxtxdx

Step 2. Enter the following command:

#ioscan -f

The response message after running this command is:

NO_HW

Step 3. Make sure the front locking latch is open, then position the disk drive in the chassis.

Step 4. Slide the disk drive into the chassis; a slow firm pressure will be needed to properly seat the

connection.

Step 5. Depress the front locking latch to secure the disk drive in the chassis.

Step 6. Spin up the disk by entering one of the following commands:

#diskinfo -v /dev/rdsk/cxtxdx #ioscan -f

Chapter 4

#pvcreate #vgcfgrestore

Removal and Replacement

Removing and Replacing a Disk Drive

Chapter 4

Removal and Replacement

Removing and Replacing a CD/DVD Drive

The CD/DVD is located in the front of the chassis. The system power to this component must be removed before attempting to remove or replace it. Refer to “Shutting Down nPartitions and Powering Off Hardware Components” for more information.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-5 CD/DVD Location

CD/DVD

Chapter 4

Removing a CD/DVD Drive

Figure 4-6 CD/DVD Detail

Removal and Replacement

Removing and Replacing a CD/DVD Drive

Step 1. To remove the CD/DVD, depress the front locking latch to loosen the drive from the chassis.

Step 2. Disengage the cables from the rear of the CD/DVD.

Step 3. Slide the drive from the chassis.

Chapter 4

Removal and Replacement

Removing and Replacing a CD/DVD Drive

Replacing a CD/DVD

Figure 4-7 CD/DVD Detail

Step 1. Connect the cables to the rear of the CD/DVD.

Step 2. Slide the drive in the chassis.

CAUTION Before attempting to install the drive into the chassis, position the data cable over

the top of the drive in order to avoid pinching the cable during installation.

Step 3. The drive easily slides into the chassis; however, a slow firm pressure is needed to properly seat the

drive.

Step 4. Depress the front locking latch to secure the disk drive in the chassis.

Chapter 4

Removal and Replacement

Removing and Replacing a Front Smart Fan Assembly

The Front Smart Fan Assembly is located in the front of the chassis. The fan assembly is a hot swappable component.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-8 Front Smart Fan Assembly Locations

FAN 0

LED

Front View

LED

FAN 1

Table 4-1 Front Smart Fan Assembly LED Indications

LED

State

On Green Fan is at speed and in sync or not at speed less than 6 seconds

Flash Yellow

Flash Red Fan failed/stalled or has run slow or fast for greater than 6 seconds

Off Fan is not installed or no power is applied to fan

Fan is not keeping up with speed/sync pulse for greater than 6 seconds

Meaning

Chapter 4

Removal and Replacement

Removing and Replacing a Front Smart Fan Assembly

Removing a Front Smart Fan Assembly

Figure 4-9 Front Fan Detail

Step 1. Push the Fan Release Pin away from the fan.

Step 2. Slide the fan away from the connector.

Step 3. Pull the fan away from the chassis.

Replacing a Front Smart Fan Assembly

Step 1. Position the fan assembly on the chassis fan guide pins.

Step 2. Slide the fan into the connector.

Step 3. Verify that the Fan Release Pin is in the locked position.

NOTE The fan LED should show fan is operational (green).

Chapter 4

Removal and Replacement

Removing and Replacing a Rear Smart Fan Assembly

The Rear Smart Fan Assembly is located in the rear of the chassis. The Fan assembly is a hot swappable component.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-10 Rear Smart Fan Assembly Locations

FAN 2

FAN 3

Rear View

LED

Table 4-2 Rear Smart Fan Assembly LED Indications

LED

State

On Green Fan is at speed and in sync or not at speed less than 6 seconds

Flash Yellow

Flash Red Fan failed/stalled or has run slow or fast for greater than 6 seconds

Off Fan is not installed or no power is applied to fan

Fan is not keeping up with speed/sync pulse for greater than 6 seconds

Meaning

Chapter 4

Removal and Replacement

Removing and Replacing a Rear Smart Fan Assembly

Removing a Rear Smart Fan Assembly

Figure 4-11 Rear Fan Detail

Step 1. Push the Fan Release Pin away from the fan.

Step 2. Slide the fan away from the connector.

Step 3. Pull the fan away from the chassis.

Replacing a Rear Smart Fan Assembly

Step 1. Carefully position the fan assembly on the chassis fan guide pins.

Step 2. Slide the fan into the connector.

Step 3. Verify that the Fan Release Pin is in the locked position.

NOTE A green fan LED indicates the fan is operational.

Chapter 4

Removal and Replacement

Removing and Replacing a PCI Smart Fan Assembly

The PCI Smart Fan Assembly is located in the rear of the PCI cardcage. The Fan assembly is a hot swappable component.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-12 PCI Smart Fan Assembly Location

Tab l e 4- 3 Sm ar t Fan Asse mbl y LED Ind ica t ion s

LED

State

On Green Fan is at speed and in sync or not at speed less than 6 seconds

Flash Yellow

Flash Red Fan failed/stalled or has run slow or fast for greater than 6 seconds

Off Fan is not installed or no power is applied to fan

Fan is not keeping up with speed/sync pulse for greater than 6 seconds

Meaning

Chapter 4

Removal and Replacement

Removing and Replacing a PCI Smart Fan Assembly

Removing a PCI Smart Fan Assembly

Figure 4-13 PCI Smart Fan Assembly Detail

Step 1. Securely grasp the two thumb holds on the fan assembly.

NOTE The two right side fans, as viewed from the front, are located very close to the

chassis. It may be necessary to use a tool such as a flatblade screwdriver to assist in removing them.

Step 2. Slide the fan upward from the chassis.

Replacing a PCI Smart Fan Assembly

Step 1. Carefully position the fan assembly in the chassis.

Step 2. The fan easily slides into the chassis; however, a slow firm pressure will be needed to properly seat

the connection.

NOTE A green fan LED indicates the fan is operational.

Chapter 4

Removal and Replacement

Removing and Replacing a Bulk Po wer Supply

Removing and Replacing a Bulk Power Supply

The bulk power supply is located in the front of the chassis. The BPS is a hot swappable component.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-14 BPS Location

BPS Locations

IMPORTANT When a BPS is pulled from the server and then immediately re-inserted, the server can report

an overcurrent condition and shut down.

Chapter 4

Removal and Replacement

Removing and Replacing a Bulk Power Supply

Removing a BPS

Figure 4-15 BPS Detail

Step 1. Pull the extraction levers located on the upper front outer portion of the BPS.

Step 2. Slide the BPS forward using the extractions levers to remove it from the chassis.

Replacing a BPS

Step 1. Verify that the extraction levers are in the open position, then insert the BPS into the empty slot.

NOTE The BPS easily slides into the chassis; however, a slow firm pressure will be needed

to properly seat the connection.

Step 2. Ensure the BPS has seated by closing the extraction levers.

NOTE BPS LED should show BPS operational and no fault. BPS LED should be GREEN.

Chapter 4

Removal and Replacement

Removing and Replacing a PCI Power Mod ule (Brick)

Removing and Replacing a PCI Power Module (Brick)

The PCI power module is located in the front of the chassis. The PCI power module is a hot pluggable component.

CAUTION Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD

safety precautions could result in damage to the server.

Figure 4-16 PCI Power Module Location

Table 4-4 PCI Power Module LED Indications

LED LED State Meaning

Power LED (Green)

Off Power module failure

On Normal operation

Fault LED (Multi-color) Off Normal operation

Blink amber Module internal failure

PCI Power Modules

Chapter 4

Amber Module internal failure

Bink red Module internal failure

Removal and Replacement

Removing and Replacing a PCI Power Module (Brick)

Removing a PCI Power Module (Brick)

Figure 4-17 PCI Power Module Detail

Step 1. Securely grasp the handle on the front of the power module.

Step 2. Firmly depress the securing thumb latch.

Step 3. Slide the module from the chassis.

Replacing a PCI Power Module (Brick)

Step 1. Carefully position the power module in the chassis and depress the thumb latch.

Step 2. The module easily slides into the chassis; however, a slow firm pressure will be needed to properly

seat the connection.

Step 3. Release the thumb latch.

NOTE PCI power module LED should show power module is operational and the green LED

should be on.

Chapter 4

HP RP7405, RP7410 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Introduction

hp rp7405/rp7410 Overview

Cell Board

System Backplane

I/O Subsystem

hp rp7405 Servers

Detailed hp rp7405/rp7410 Description

Cell Board

Figure 1-4 Cell Controller

Figure 1-5 Cell Board

PDH Riser Board

DIMMs

System Backplane

Clocks and Reset

I/O Subsystem

MP/SCSI MP Core I/O Board

Procurium LAN/SCSI Board

Package Description

Dimensions

System Chassis

2 Installation

Unpacking a Racked Server

Securing the Cabinet

Unpacking a Non-Racked Server

Unloading with a Lifter

Figure 2-5 RONI Lifter

Unloading with Lift Handle Panels

Installing Server Into the Rack

Installing Add-On Products

Cell Boards

MP Core I/O Cards

Embedded Disks

Processors

DIMMs

MP Core I/O Connections

MP/SCSI Connections

LAN/SCSI Connections

Management Processor Access

Setting Up the CE Tool (PC)

Setting CE Tool Parameters

Connecting the CE Tool to the Local RS-232 Port on the MP

Standby Power and Logging in to the MP

Verifying Presence of the Cell Boards

Powering On the hp rp7405/rp7410 Server

Selecting a Boot Partition using the Management Processor

Verifying the System Configuration using Boot Console Handler (BCH)

Booting HP-UX using Boot Console Handler (BCH )

3 Troubleshooting

Common Installation Problems

The Server Does Not Power On

The Server Powers On But Then Shuts Down with a Fault Light

hp rp7405/rp7410 LED Indicators

Front Panel LEDs

Bulk Power Supply LEDs

PCI Power Supply LEDs

System, Standby, and I/O Fan LEDs

SINC POST LEDs

OL* LEDs

PCI/Cell LED OL*

MP Core I/O LEDs

LAN/SCSI (PCI Slot) LEDs

4 Removal and Replacement

Shutting Down nPartitions and Powering Off Hardware Components

Shutting Down an nPartition

Powering Off Hardware Components

Removing and Replacing the Top Cover

Removing the Top Cover

Replacing the Top Cover

Removing a Disk Drive

Replacing a Disk Drive

Removing and Replacing a CD/DVD Drive

Removing a CD/DVD Drive

Replacing a CD/DVD

Removing and Replacing a Front Smart Fan Assembly

Removing a Front Smart Fan Assembly

Replacing a Front Smart Fan Assembly