HP ProLiant DL360 G10 Disassembly Instructions Manual

Product Category: Servers

Marketing Name / Model
[List multiple models if applicable.]

HPE ProLiant DL360 Gen10

1.0 Items Requiring Selective Treatment

Item Description

Notes

Quantity
of items
included
in
product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

7

Batteries

All types including standard alkaline and lithium
coin or button style batteries

2

Mercury-containing components

For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries

0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm

Includes background illuminated displays with
gas discharge lamps

0
Cathode Ray Tubes (CRT)

0

Capacitors / condensers (Containing PCB/PCT)

0

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

5
External electrical cables and cords

0

Gas Discharge Lamps

0

Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)

0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

NA
Components and waste containing asbestos

0

Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,
as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

MF877-00 Page 1
Template Revision A

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity
of items
included
in
product

Components, parts and materials containing
refractory ceramic fibers

0

Components, parts and materials containing
radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

Tool Description

Tool Size (if
applicable)

Description #1 Screwdriver Bits

(T-10)

Description #2 Screwdriver Bits

(T-15)

Description #3 Screwdriver Bits

(T-30)

Description #4 Screwdriver Bits

Sleeve

Description #5

3.0 Product Disassembly Process

components and materials requiring selective treatment can be removed.

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:

1.

MF877-00 Page 2
Template Revision A

HPE instructions for this template are available at MF877-01

2.

3.

4.

5.

6.

MF877-00 Page 3
Template Revision A

HPE instructions for this template are available at MF877-01