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HP ProLiant DL320 Generation 5p Server Maintenance and Service Guide
Part Number 451840-005
October 2008 (Fifth Edition)
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© Copyright 2007, 2008 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation.
Intel, Xeon, Pentium, Celeron, and Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
Intended audience
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of
computer equipment and trained in recognizing hazards in products with hazardous energy levels and
are familiar with weight and stability precautions for rack installations.
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Contents
Customer self repair...................................................................................................................... 5
Parts only warranty service ......................................................................................................................... 5
Illustrated parts catalog ............................................................................................................... 16
Mechanical components........................................................................................................................... 16
System components .................................................................................................................................20
Removal and replacement procedures........................................................................................... 25
Required tools......................................................................................................................................... 25
Safety considerations............................................................................................................................... 25
Preventing electrostatic discharge..............................................................................................................25
Symbols on equipment............................................................................................................................. 25
Rack warnings ........................................................................................................................................ 26
Server warnings and cautions ................................................................................................................... 27
Preparation procedures............................................................................................................................ 27
Power down the server................................................................................................................... 27
Remove the server from the rack...................................................................................................... 28
Remove the secondary access panel ................................................................................................28
Primary access panel............................................................................................................................... 29
Hard drive blank..................................................................................................................................... 29
Hard drive.............................................................................................................................................. 30
DIMMs................................................................................................................................................... 31
Processor air baffle.................................................................................................................................. 32
Fan assembly.......................................................................................................................................... 32
Cache battery......................................................................................................................................... 33
Optical drive .......................................................................................................................................... 34
Optical drive (12.7 mm)................................................................................................................. 34
Optical drive (9.5 mm)................................................................................................................... 35
Bezel..................................................................................................................................................... 36
Front I/O assembly ................................................................................................................................. 38
Hard drive cage...................................................................................................................................... 39
SAS/SATA backplane ............................................................................................................................. 40
PCI riser board assembly.......................................................................................................................... 41
PCI Express or PCI-X riser board................................................................................................................ 42
Expansion boards ................................................................................................................................... 43
Power supply.......................................................................................................................................... 44
Heatsink................................................................................................................................................. 44
Processor ...............................................................................................................................................46
Dedicated iLO connector module............................................................................................................... 50
System board ......................................................................................................................................... 51
Battery................................................................................................................................................... 57
Diagnostic tools.......................................................................................................................... 58
Troubleshooting resources ........................................................................................................................58
HP Insight Diagnostics.............................................................................................................................. 58
HP Insight Diagnostics survey functionality .................................................................................................. 58
Manual ROMPaq disaster recovery ........................................................................................................... 59
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Integrated Management Log ..................................................................................................................... 59
Array Diagnostic Utility ............................................................................................................................ 60
HP Systems Insight Manager..................................................................................................................... 60
USB support and functionality ................................................................................................................... 60
USB support.................................................................................................................................. 60
Internal USB functionality................................................................................................................ 60
Component identification............................................................................................................. 62
Front panel components ........................................................................................................................... 62
Front panel components (standard configuration)............................................................................... 62
Front panel components (optional hard drive cage configuration) ........................................................63
Front panel LEDs and buttons .................................................................................................................... 64
Front panel LEDs and buttons (standard configuration)........................................................................ 64
Front panel LEDs and buttons (optional hard drive cage configuration) .................................................65
SATA device numbers.............................................................................................................................. 66
SATA device numbers (standard configuration).................................................................................. 66
SATA device numbers (optional hard drive cage configuration)...........................................................67
Rear panel components............................................................................................................................ 67
PCI expansion slot definitions.................................................................................................................... 68
Rear panel LEDs...................................................................................................................................... 68
System board components........................................................................................................................ 69
System maintenance switch............................................................................................................. 70
NMI functionality........................................................................................................................... 71
System board LEDs .................................................................................................................................. 71
System LEDs and internal health LED combinations....................................................................................... 72
Internal USB connector............................................................................................................................. 73
Fan locations .......................................................................................................................................... 74
Cabling ..................................................................................................................................... 75
Cabling overview.................................................................................................................................... 75
Server cabling ........................................................................................................................................75
Embedded SATA controller cabling ...........................................................................................................75
Embedded SATA controller cabling (standard configuration)............................................................... 75
Embedded SATA controller cabling (optional hard drive cage configuration) ........................................ 76
Optional SAS controller cabling................................................................................................................ 76
Optional SAS controller cabling (standard configuration).................................................................... 76
Optional SAS controller cabling (optional hard drive cage configuration) ............................................. 77
Battery cabling for BBWC ........................................................................................................................78
BBWC battery cabling to an optional controller in slot 4..................................................................... 78
BBWC battery cabling to an optional controller in slot 5..................................................................... 78
Optional internal USB cabling................................................................................................................... 79
Specifications............................................................................................................................. 80
Environmental specifications ..................................................................................................................... 80
Server specifications................................................................................................................................ 80
Acronyms and abbreviations........................................................................................................ 82
Index......................................................................................................................................... 84
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Customer self repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow
for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP
service providers or service partners) identifies that the repair can be accomplished by the use of a CSR
part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:
• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.
• Optional—Parts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may not be
additional charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer
warranty, HP requires that an authorized service provider replace the part. These parts are identified as
"No" in the Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography
permits. If assistance is required, you can call the HP Technical Support Center and a technician will help
you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a
defective part must be returned to HP. In cases where it is required to return the defective part to HP, you
must ship the defective part back to HP within a defined period of time, normally five (5) business days.
The defective part must be returned with the associated documentation in the provided shipping material.
Failure to return the defective part may result in HP billing you for the replacement. With a customer self
repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For
the North American program, refer to the HP website (http://www.hp.com/go/selfrepair
Parts only warranty service
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only
warranty service, HP will provide replacement parts free of charge.
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.
).
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client)
afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant
la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut
être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces
CSR:
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• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront
facturés.
• Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont
également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous
demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type
de garantie applicable à votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit
effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue
illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance
téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de
rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous
devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation
doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se
réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte
l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à
utiliser.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair
).
Service de garantie "pièces seules"
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de
rechange fournies par HP ne sont pas facturées.
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez
à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di
assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente
al cliente per la sostituzione. Vi sono due categorie di parti CSR:
• Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida
la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
• Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di
componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP,
potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
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NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare
la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti
sono identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di
un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP
specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente
difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio
da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e
resa e sceglie il corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair
Servizio di garanzia per i soli componenti
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di
garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.
).
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione
da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di
spedizione e di manodopera per il servizio.
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und
höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP
Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden
kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien
unterteilt:
• Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie
den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten
für diesen Service berechnet.
• Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen
lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen
Garantiebedingungen zusätzliche Kosten anfallen.
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen
einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center
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anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden
muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung
stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf
und bestimmt den Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair
).
Parts-only Warranty Service (Garantieservice
ausschließlich für Teile)
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice
ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile
kostenlos zur Verfügung.
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer
Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de
realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los
proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el
uso de un componente CSR, HP le enviará dicho componente directamente para que realice su
sustitución. Los componentes CSR se clasifican en dos categorías:
• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si
solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los
gastos de desplazamiento y de mano de obra de dicho servicio.
• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo,
si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del
tipo de servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para
que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios
autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra
"No" en el catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega
en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al
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Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de
materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos
deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje
de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En
el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío
y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase
en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica,
visite la página web de HP siguiente (http://www.hp.com/go/selfrepair
).
Servicio de garantía exclusivo de componentes
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según
las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto
sin cargo adicional alguno.
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes
por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que
hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner)
bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
• Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.
• Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te
vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type
garantieservice voor het product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
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periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde
onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair
Garantieservice "Parts Only"
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen
van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.
).
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o
reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao
cliente. Existem duas categorias de peças CSR:
• Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua
essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
• Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas
para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a
cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após
o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte
técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a
peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for
necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente
cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no
material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de
reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e
determina a transportadora/serviço postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com
o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair
).
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Serviço de garantia apenas para peças
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos
do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma
taxa.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
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Illustrated parts catalog
Mechanical components
Item Description Spare part number Customer self
1 Primary access panel 454347-001 Mandatory1
2 9.5-mm optical drive bracket* 460014-001 Mandatory1
3 PCI riser board assembly 458749-001 Mandatory1
4 2-bay hard drive cage with (optical drive blank) 458751-001 Mandatory1
5 4-bay hard drive cage with (optical drive blank) 458750-001 Mandatory1
6 Front I/O assembly 457870-001 Mandatory1
7 Miscellaneous plastics and hardware kit 459732-001 Mandatory1
a) Processor air baffle — —
b) Left bezel (4-bay hard drive cage model) — —
c) Right bezel (4-bay hard drive cage model) — —
d) Bezel (2-bay hard drive cage model)* — —
e) Air blocker — —
f) Foam cable guide* — —
repair (on page 5)
Illustrated parts catalog 16
Page 17
Item Description Spare part number Customer self
repair (on page 5)
8 Media bay blank kit 459187-001 Mandatory1
g) Processor backplate* — —
(a) Hard drive blank* — —
(b) Optical bay blank (12.7 mm)* — —
(c) Optical bay blank (9 mm)* — —
Cables
9 Primary SATA hard drive cable* 460007-001 Mandatory1
10 Secondary SATA hard drive cable* 460008-001 Mandatory1
11 SAS/SATA cable, 4:1* 460009-001 Mandatory1
12 Front USB cable* 452338-001 Mandatory1
13 Internal USB cable* 454336-001 Mandatory1
14 Hard drive backplane interconnect cable* 460010-001 Mandatory1
15
Power cable*
Miscellaneous
142258-001
Mandatory
1
16 Rack-mounting hardware kit* 461513-001 Mandatory1
*Not shown
1
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
2
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the
type of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires
that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts
Catalog.
1
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP
de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn
Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
Illustrated parts catalog 17
Page 18
2
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten
anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu
erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit
„No“ bzw. „Nein“ gekennzeichnet.
1
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de
mano de obra de dicho servicio.
2
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía
correspondiente al producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el
usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de
componentes.
1
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen
te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
1
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
2
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a
garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a
marca “No” (Não), no catálogo de peças ilustrado.
Illustrated parts catalog 18
Page 19
Illustrated parts catalog 19
Page 20
System components
Item Description Spare part number Customer self repair
(on page 5)
17 Processor — —
2
a) 1.60-GHz Intel® Celeron® C420, 512-KB L2
cache*
b) 2.00-GHz Intel® Celeron® C440, 515-KB L2
cache*
c) 2.00-GHz Intel® Core™2 E4400, 2-MB L2
cache*
d) 2.40-GHz Intel® Core™2 E4600, 2-MB L2
cache*
e) 1.80-GHz Intel® Pentium® E2160, 1-MB L2
cache*
f) 3.00-GHz Intel® Pentium® E3110, 6-MB L2
cache*
g) 3.16-GHz Intel® Pentium® E3120, 6-MB L2
cache, 65W*
h) 2.66-GHz Intel® Pentium® X3330, 6-MB L2
cache*
i) 3.00-GHz, Intel® Pentium® X3370, 12-MB L2
cache*
j) 2.33-GHz Intel® Xeon® 3065, 4-MB L2
cache*
454523-001 Optional
454524-001 Optional2
454528-001 Optional2
462569-001 Optional2
455623-001 Optional2
463509-001 Optional2
493930-001 Optional2
493929-001 Optional2
493928-001 Optional2
454525-001 Optional
2
Illustrated parts catalog 20
Page 21
Item Description Spare part number Customer self repair
(on page 5)
2
18 PC2-6400 ECC RoHS DIMM — —
k) 2.66-GHz Intel® Xeon® 3075, 4-MB L2
cache*
l) 2.13-GHz Intel® Xeon® X3210, 8-MB L2
cache*
m) 2.40-GHz Intel® Xeon® X3220, 8-MB L2
cache*
n) 2.50-GHz Intel® Xeon® X3320, 6-MB L2
cache*
o) 2.66-GHz Intel® Xeon® X3350, 12-MB L2
cache*
p) 2.83-GHz Intel® Xeon® X3360, 12-MB L2
cache*
a) 512-MB* 459931-001 Mandatory
454526-001 Optional
457020-001 Optional
454529-001 Optional2
463508-001 Optional2
463507-001 Optional2
469859-001 Optional2
2
1
19 Fan assembly 457873-001 Mandatory1
20 Power supply, 400-W 460004-001 Mandatory1
21 Heatsink 480901-001 Mandatory1
22 System board 454510-001 Optional2
23 SAS/SATA backplane, primary (2-bay and 4-bay
24 SAS/SATA backplane, secondary (4-bay hard
25 PCIe x8 riser board* 454512-001 Optional2
26 PCIe x1 riser board* 454511-001 Optional2
27 PCI-X riser board* 454517-001 Optional2
28 SATA-PATA interposer board* 454515-001 Optional2
29 Dedicated iLO connector module 454519-001 Optional2
b) 1-GB* 459932-001 Mandatory1
c) 2-GB* 460424-001 Mandatory
System components
Boards
hard drive cage models)
drive cage models only)*
454513-001 Optional2
454514-001 Optional2
1
30 Optical drives — —
Mass storage devices
a) DVD-RW drive, 12.7-mm (2-bay hard drive
cage models only)*
b) DVD-ROM drive, 12.7-mm (2-bay hard drive
cage models only)*
c) DVD-ROM drive, 9.5-mm (4-bay hard drive
cage models only)*
399403-001 Mandatory1
397930-001 Mandatory1
436951-001 Mandatory1
Illustrated parts catalog 21
Page 22
Item Description Spare part number Customer self repair
(on page 5)
d) DVD-Combo drive, 9.5-mm (4-bay hard drive
cage models only)*
e) DVD-RW drive, 12.7mm 481429-001 Mandatory1
436952-001 Mandatory1
f) DVD-ROM drive, 12.7mm 481428-001 Mandatory1
31 SATA hard drives — —
a) 80-GB, 7200-rpm* 397551-001 Mandatory1
b) 160-GB, 7200-rpm* 397552-001 Mandatory1
c) 250-GB, 7,200-rpm* 397553-001 Mandatory1
d) 500-GB, 7,200 rpm* 395501-001 Mandatory1
e) 750-GB, 7,200-rpm* 432401-001 Mandatory1
32 SAS hard drives — —
a) 36-GB, 10,000-rpm* 376593-001 Mandatory1
b) 72-GB, 10,000-rpm* 376594-001 Mandatory1
c) 72-GB, dual-port, 15,000-rpm* 389343-001 Mandatory1
d) 146-GB, 10,000-rpm* 376595-001 Mandatory1
e) 146-GB, dual-port, 15,000-rpm* 389344-001 Mandatory1
f) 300-GB, dual-port, 15,000-rpm* 416248-001 Mandatory1
Miscellaneous
33 System battery* 234556-001 Mandatory1
34 Cache battery* 398648-001 Mandatory1
*Not shown
1
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be
charged for the travel and labor costs of this service.
2
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the
type of warranty service designated for your product.
3
No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires
that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts
Catalog.
1
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP
de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
2
Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
3
No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.
1
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
2
Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.
Illustrated parts catalog 22
Page 23
3
No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un “No” nel Catalogo illustrato dei componenti.
1
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn
Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.
2
Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten
anfallen.
3
No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu
erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit
„No“ bzw. „Nein“ gekennzeichnet.
1
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de
mano de obra de dicho servicio.
2
Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía
correspondiente al producto.
3
No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el
usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de
componentes.
1
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen
te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
3
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
1
Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
2
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.
3
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a
garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a
marca “No” (Não), no catálogo de peças ilustrado.
Illustrated parts catalog 23
Page 24
Illustrated parts catalog 24
Page 25
Removal and replacement procedures
Required tools
You need the following items for some procedures:
• T-10/T-15 Torx screwdriver (included with the server)
• HP Insight Diagnostics software ("HP Insight Diagnostics" on page 58)
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the
system or handling parts. A discharge of static electricity from a finger or other conductor may damage
system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the
device.
To prevent electrostatic damage:
• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry.
• Always be properly grounded when touching a static-sensitive component or assembly.
Symbols on equipment
The following symbols may be placed on equipment to indicate the presence of potentially hazardous
conditions.
This symbol indicates the presence of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.
This symbol indicates the presence of electric shock hazards. The area contains no
user or field serviceable parts. Do not open for any reason.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure.
Removal and replacement procedures 25
Page 26
This symbol on an RJ-45 receptacle indicates a network interface connection.
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,
do not plug telephone or telecommunications connectors into this receptacle.
This symbol indicates the presence of a hot surface or hot component. If this surface is
contacted, the potential for injury exists.
WARNING: To reduce the risk of injury from a hot component, allow the surface to
cool before touching.
This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.
WARNING: To reduce the risk of personal injury or damage to the equipment,
observe local occupational health and safety requirements and guidelines for manual
material handling.
49-109 kg
100-240 lb
These symbols, on power supplies or systems, indicate that the equipment is supplied
by multiple sources of power.
WARNING: To reduce the risk of injury from electric shock, remove all power cords
to completely disconnect power from the system.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling jacks are extended to the floor.
• The full weight of the rack rests on the leveling jacks.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a
rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U
rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and
may become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always
handle the rack from both sides.
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately
stabilize the rack before extending a component outside the rack. Extend only one component
at a time. A rack may become unstable if more than one component is extended.
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately
secured at the top and bottom to the building structure.
Removal and replacement procedures 26
Page 27
Server warnings and cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed against
it. Pay particular attention to the plug, electrical outlet, and the point where the cord
extends from the server.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the
following procedures:
• Power down the server (on page 27).
If you must remove a server from a rack, power down the server.
• Remove the server from the rack (on page 28).
To access internal server components, remove the server from the rack.
• Remove the secondary access panel (on page 28).
Power down the server
To access some internal server components, remove the secondary access panel.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some
internal circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1. Back up the server data.
2. Shut down the operating system as directed by the operating system documentation.
Removal and replacement procedures 27
Page 28
NOTE: If the operating system automatically places the server in Standby mode, omit the next
step.
3. Press the Power On/Standby button to place the server in Standby mode. When the server activates
Standby power mode, the system power LED changes to amber.
IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front or rear panels.
In a rack environment, this feature facilitates locating a server when moving between the front
4. Disconnect the power cords.
and rear of the rack.
The system is now without power.
Remove the server from the rack
WARNING: The server is not attached to the rack mounting rails. To avoid potential damage
to the server and personal injury, always support the server with both hands when removing it
from the rack.
To remove the server from an HP, Compaq branded, telco, or third-party rack:
1. Power down the server (on page 27).
2. Disconnect all peripheral cables and power cords from the server rear panel.
3. Loosen the thumbscrews that secure the server faceplate to the front of the rack.
4. Remove the server from the rack. For more information, see the documentation that ships with the
rack mounting option.
5. Place the server on a sturdy, level surface.
Remove the secondary access panel
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
Removal and replacement procedures 28
Page 29
4.
Using a T-10 Torx screwdriver, remove the secondary access panel.
To replace the component, reverse the removal procedure.
Primary access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Loosen the captive T-15 Torx thumbscrew securing the access panel to the server.
4. Slide the access panel toward the rear of the server, then lift it from the server.
lead to thermal damage.
Hard drive blank
Remove the component as indicated.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
Removal and replacement procedures 29
Page 30
To replace the component, reverse the removal procedure.
Hard drive
IMPORTANT: Hot-plug capability and drive LED support are only available when a supported
To remove the component:
1. Back up all data on the hard drive.
2. Power down the server (on page 27).
3. Remove the hard drive.
optional controller is installed in the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
Removal and replacement procedures 30
Page 31
To replace the component, reverse the removal procedure.
When adding hard drives to the server, observe the following general guidelines:
• The system automatically sets all drive numbers.
• If only one hard drive is used, install it in the bay with the lowest drive number.
• Drives must be the same capacity to provide the greatest storage space efficiency when drives are
grouped together into the same drive array.
Optional storage controllers provide support for hot-plug capability and drive LEDs. Controller options
are:
• The embedded controller supports non-hot-plug SATA hard drives. Drive LEDs are not supported.
• Optional SATA controllers support hot-plug SATA hard drives and drive LEDs.
• Optional SAS controllers support hot-plug SAS or SATA hard drives and drive LEDs.
NOTE: ACU does not support mixing SAS and SATA drives in the same logical volume.
DIMMs
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Open the DIMM slot latches.
5. Remove the DIMM.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 31
Page 32
Processor air baffle
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the air baffle.
To replace the component, reverse the removal procedure.
Fan assembly
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Disconnect the system fan cable from the system board.
Removal and replacement procedures 32
Page 33
5.
Remove the fan assembly.
To replace the component, reverse the removal procedure.
Cache battery
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Disconnect the cache battery cable ("Battery cabling for BBWC" on page 78).
6. Remove the cache battery.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 33
Page 34
Optical drive
Optical drive (12.7 mm)
This procedure documents replacement of an optical drive in servers equipped with a two-bay hard drive
cage.
To remove the component:
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Disconnect cables from the hard drive cage ("Cabling overview" on page 75).
6. Remove the 12.7-mm optical drive carrier.
all bays are populated with either a component or a blank.
Removal and replacement procedures 34
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7.
Remove the interposer board.
8. Remove the 12.7-mm optical drive from the optical drive carrier.
To replace the component, reverse the removal procedure.
Optical drive (9.5 mm)
This procedure documents replacement of an optical drive in servers equipped with a four-bay hard drive
cage.
To remove the component:
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
all bays are populated with either a component or a blank.
Removal and replacement procedures 35
Page 36
3.
Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Disconnect cables from the hard drive cage ("Cabling overview" on page 75).
6. Remove the 9.5-mm optical drive assembly.
7. Remove the interposer board and bracket.
To replace the component, reverse the removal procedure.
Bezel
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove all hard drive blanks ("Hard drive blank" on page 29).
4. Remove all hard drives ("Hard drive" on page 30).
Removal and replacement procedures 36
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5.
Remove the serial label pull tab by extending it, and then pressing on the underside to release it
from the chassis.
6. Remove the bezel:
o Two-bay models
Removal and replacement procedures 37
Page 38
o
Four-bay models
To replace the component, reverse the removal procedure.
Front I/O assembly
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Remove the bezel ("Bezel" on page 36).
6. Disconnect the front I/O assembly cable.
Removal and replacement procedures 38
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7.
Remove the front I/O assembly.
To replace the component, reverse the removal procedure.
Hard drive cage
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Disconnect the front panel/LED cable from the system board. ("Cabling overview" on page 75)
6. Disconnect the hard drive cables from the system board.
7. Disconnect cables from any other devices installed in the hard drive cage, if installed.
8. Remove all hard drives ("Hard drive" on page 30).
9. Remove all hard drive blanks ("Hard drive blank" on page 29).
10. Remove the optical drive, if installed ("Optical drive" on page 34).
11. Remove the front I/O assembly ("Front I/O assembly" on page 38).
12. Remove the hard drive cage.
Removal and replacement procedures 39
Page 40
o
Two-bay models
o Four-bay models
13. Remove the SAS/SATA backplane ("SAS/SATA backplane" on page 40).
To replace the component, reverse the removal procedure.
SAS/SATA backplane
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Disconnect the hard drive cables from the system board.
Removal and replacement procedures 40
Page 41
6.
Disconnect cables from any other devices installed in the hard drive cage, if installed.
7. Remove the cache battery, if installed ("Cache battery" on page 33).
8. Remove all hard drives ("Hard drive" on page 30).
9. Remove the hard drive cage ("Hard drive cage" on page 39).
10. Remove the backplane:
o Two-bay models
o Four-bay models
To replace the component, reverse the removal procedure.
PCI riser board assembly
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI riser board assembly.
Removal and replacement procedures 41
Page 42
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Disconnect any internal or external cables connected to any existing expansion boards.
5. Remove the PCI riser board assembly.
To replace the component, reverse the removal procedure.
PCI Express or PCI-X riser board
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 41).
5. Remove the expansion board ("Expansion boards" on page 43).
Removal and replacement procedures 42
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6.
Remove the riser board.
To replace the component, reverse the removal procedure.
Expansion boards
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 41).
5. Remove any installed expansion boards.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 43
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Power supply
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Disconnect the removable media and hard drive power cables from the hard drive backplane.
5. Disconnect the auxiliary power supply cable and the main power supply cable from the system
board.
6. Remove the power supply.
To replace the component, reverse the removal procedure.
Heatsink
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the air baffle ("Processor air baffle" on page 32).
5. Loosen the four screws securing the heatsink:
a. Loosen each screw three or four turns in the counterclockwise direction.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Heatsink retaining screws should be loosened in diagonally opposite pairs (in an
"X" pattern).
Removal and replacement procedures 44
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b.
Fully loosen the screws to free the heatsink, being careful not to remove the screw assemblies
from the heatsink.
6. Remove the heatsink.
To replace the component:
IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is
properly oriented.
1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol
to evaporate before continuing.
CAUTION: After the cover is removed, do not touch the thermal interface media.
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the
heatsink is removed from the processor after it has been installed.
Removal and replacement procedures 45
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2.
Remove the protective cover from the heatsink.
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite
pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board,
connectors, or screws. Use the wrench supplied with the system to reduce the possibility of
3. Install the heatsink.
overtightening the screws.
4. Install the air baffle ("Processor air baffle" on page 32).
5. Install the access panel ("Primary access panel" on page 29).
Processor
To remove the component:
Removal and replacement procedures 46
Page 47
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or
cache sizes.
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the air baffle ("Processor air baffle" on page 32).
5. Remove the heatsink ("Heatsink" on page 44).
6. Open the processor retaining latch and the processor socket retaining bracket.
7. Using your fingers, remove the failed processor.
To replace the component:
Removal and replacement procedures 47
Page 48
IMPORTANT: Be sure the processor remains inside the processor installation tool.
1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.
2. Align the processor installation tool with the socket and install the spare processor.
CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides
on the processor and socket to properly align the processor with the socket. Refer to the server
hood label for specific instructions.
Removal and replacement procedures 48
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3.
Press down firmly until the processor installation tool clicks and separates from the processor, and
then remove the processor installation tool.
4. Close the processor retaining latch and the processor socket retaining bracket.
5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to
evaporate before continuing.
Removal and replacement procedures 49
Page 50
6.
Apply all the grease to the top of the processor in one of the following patterns to ensure even
distribution:
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite
pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board,
connectors, or screws. Use the wrench supplied with the system to reduce the possibility of
7. Install the heatsink.
overtightening the screws.
8. Install the air baffle ("Processor air baffle" on page 32).
9. Install the access panel ("Primary access panel" on page 29).
Dedicated iLO connector module
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
Removal and replacement procedures 50
Page 51
3.
Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the iLO connector module.
To replace the component, reverse the removal procedure.
System board
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
4. Remove the secondary access panel (on page 28).
5. Remove the PCI riser board assembly ("PCI riser board assembly" on page 41).
6. Remove all DIMMs ("DIMMs" on page 31).
7. Remove the air baffle ("Processor air baffle" on page 32).
8. Remove the fan assembly ("Fan assembly" on page 32).
9. Disconnect the power supply cables from the system board ("Server cabling" on page 75).
10. Disconnect the SATA hard drive cables from the system board ("Cabling" on page 75).
11. Disconnect the hard drive cage cables and the front panel/LED cable from the system board
("Cabling overview" on page 75).
12. Remove the dedicated iLO connector module, if installed ("Dedicated iLO connector module" on
page 50).
13. Remove the heatsink ("Heatsink" on page 44).
Removal and replacement procedures 51
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14.
Open the processor retaining latch and the processor socket retaining bracket on the failed system
board.
15. Using your fingers, remove the processor from the failed system board.
CAUTION: To avoid damage to the system board:
• Do not touch the processor socket contacts.
• Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.
CAUTION: To avoid damage to the processor:
• Handle the processor only by the edges.
16. Remove the seven T-15 screws securing the failed system board.
• Do not touch the bottom of the processor, especially the contact area.
Removal and replacement procedures 52
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17.
Remove the failed system board.
To replace the system board:
1. Install the spare system board in the server.
2. Prepare the processor socket on the spare system board:
a. Open the processor retaining latch and the processor socket retaining bracket.
Removal and replacement procedures 53
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b.
Remove the processor socket protective cover.
3. Install the processor socket cover onto the processor socket of the failed system board.
4. Install the processor on the spare system board.
CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides
on the processor and socket to properly align the processor with the socket. Refer to the server
hood label for specific instructions.
CAUTION: Always install the processor parallel to the system board to avoid damage to the
pins.
Removal and replacement procedures 54
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5.
Close the processor retaining latch and the processor socket retaining bracket.
6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.
Allow the alcohol to evaporate before continuing.
7. Apply all the grease to the top of the processor in one of the following patterns to ensure even
distribution:
CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite
pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board,
connectors, or screws. Use the wrench supplied with the system to reduce the possibility of
overtightening the screws.
Removal and replacement procedures 55
Page 56
8.
Install the heatsink.
IMPORTANT: To ensure proper cooling, be sure the processor air baffle is installed at all times
(if applicable).
9. Install all components removed from the failed system board.
IMPORTANT: Install all components with the same configuration that was used on the failed
system board.
10. Install the secondary access panel ("Remove the secondary access panel" on page 28).
11. Install the primary access panel ("Primary access panel" on page 29).
12. Power up the server.
After you replace the system board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
2. Select the Advanced Options menu.
3. Select Serial Number. The following warning is displayed:
Warning: The serial number should ONLY be modified by qualified service
personnel. This value should always match the serial number located on
the chassis.
4. Press the Enter key to clear the warning.
5. Enter the serial number.
6. Select Product ID. The following warning is displayed.
Warning: The Product ID should ONLY be modified by qualified service
personnel. This value should always match the Product ID located on the
chassis.
7. Enter the product ID and press the Enter key.
8. Press the Esc key to close the menu.
9. Press the Esc key to exit RBSU.
10. Press the F10 key to confirm exiting RBSU. The server will automatically reboot.
Removal and replacement procedures 56
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Battery
If the server no longer automatically displays the correct date and time, you may need to replace the
battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
• Replace only with the spare designated for this product.
To remove the component:
1. Power down the server (on page 27).
2. Remove the server from the rack (on page 28).
3. Remove the primary access panel ("Primary access panel" on page 29).
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the expansion boards.
4. Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default
configuration. After replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Removal and replacement procedures 57
Page 58
Diagnostic tools
Troubleshooting resources
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and
comprehensive courses of action for fault isolation and identification, error message interpretation, issue
resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a
language:
• English (http://www.hp.com/support/ProLiant_TSG_en)
• French (http://www.hp.com/support/ProLiant_TSG_fr)
• Italian (http://www.hp.com/support/ProLiant_TSG_it)
• Spanish (http://www.hp.com/support/ProLiant_TSG_sp)
• German (http://www.hp.com/support/ProLiant_TSG_gr)
• Dutch (http://www.hp.com/support/ProLiant_TSG_nl)
• Japanese (http://www.hp.com/support/ProLiant_TSG_jp)
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify
server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the
OS is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and
Linux versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website
(http://www.hp.com/servers/diags
).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 58) provides survey functionality that gathers critical hardware and
software information on ProLiant servers.
This functionality supports operating systems that may not be supported by the server. For operating
systems supported by the server, see the HP website (http://www.hp.com/go/supportos
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
).
Diagnostic tools 58
Page 59
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can
be installed through the HP PSP.
NOTE: The current version of SmartStart provides the memory spare part numbers for the
server. To download the latest version, see the HP website (http://www.hp.com/support
Manual ROMPaq disaster recovery
1. Create a ROMPaq diskette. For more information, see the HP website
(http://www.hp.com/support
2. Power down the server (on page 27).
3. Insert the ROMPaq diskette.
4. Set S1, S4, S5, and S6 of the system maintenance switch to On.
5. Power up the server.
o If the diskette is valid, the server generates two short beeps to indicate that the server is in
disaster recovery mode.
o If the diskette is invalid or not inserted, the server continues to beep.
6. Wait while the ROMPaq diskette flashes the system ROM image:
).
).
o If successful, the server generates two short beeps.
o If unsuccessful, the server generates a sequence of descending audible beeps. Repeat the
disaster recovery process.
7. Power down the server (on page 27).
8. Remove the ROMPaq diskette.
9. Set S1, S4, S5, and S6 of the system maintenance switch to Off.
10. Power up the server.
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each
event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
• From within HP SIM ("HP Systems Insight Manager" on page 60)
• From within Survey Utility
• From within operating system-specific IML viewers
o For NetWare: IML Viewer
o For Windows®: IML Viewer
o For Linux: IML Viewer Application
• From within the iLO 2 user interface
• From within HP Insight Diagnostics (on page 58)
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.
Diagnostic tools 59
Page 60
Array Diagnostic Utility
The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage
controllers and disk drives. This report provides vital information to assist in identifying faults or conditions
that may require attention. ADU can be accessed from the SmartStart CD or downloaded from the HP
website (http://www.hp.com
).
HP Systems Insight Manager
HP SIM is a web-based application that allows system administrators to accomplish normal administrative
tasks from any remote location, using a web browser. HP SIM provides device management capabilities
that consolidate and integrate management data from HP and third-party devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or
the HP SIM website (http://www.hp.com/go/hpsim
processors, SAS and SATA hard drives, and memory modules.
).
USB support and functionality
USB support (on page 60)
USB support
Internal USB functionality (on page 60)
HP provides both standard USB support and legacy USB support. Standard support is provided by the
operating system through the appropriate USB device drivers. HP provides support for USB devices before
the operating system loads through legacy USB support, which is enabled by default in the system ROM.
HP hardware supports USB version 1.1 or 2.0, depending on the version of the hardware.
Legacy USB support provides USB functionality in environments where USB support is normally not
available. Specifically, HP provides legacy USB functionality for:
• POST
• RBSU
• Diagnostics
• DOS
• Operating environments which do not provide native USB support
For more information on ProLiant USB support, refer to the HP website
(http://h18004.www1.hp.com/products/servers/platforms/usb-support.html
).
Internal USB functionality
An internal USB connector is available for use with USB drive keys only. The internal connector shares the
same bus with the front external USB connector, and connecting a device to both the front internal and
front external USB connectors is not supported. This solution provides for use of a permanent boot drive
Diagnostic tools 60
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from a USB drive key installed in the front internal connector, avoiding issues of clearance on the front of
the rack and physical access to secure data.
For additional security, you can individually disable the front, rear, and internal USB connectors through
RBSU. Disabling the rear USB connectors in RBSU disables both rear USB ports.
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Component identification
Front panel components
Front panel components (standard configuration)
Item Description
1 Hard drive bay 1
2 Hard drive bay 2
3 Serial label pull tab
4 12.7-mm optical drive bay
5 USB connectors (2)
6 Power On/Standby button and system power LED
Component identification 62
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Front panel components (optional hard drive cage configuration)
Item Description
1 Hard drive bay 1
2 Hard drive bay 2
3 9.5-mm optical drive bay
4 Hard drive bay 3
5 Serial label pull tab
6 USB connectors (2)
7 Hard drive bay 4
8 Power On/Standby button and system power LED
Component identification 63
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Front panel LEDs and buttons
Front panel LEDs and buttons (standard configuration)
Item Description Status
1 12.7-mm optical drive
activity LED
2 UID button/LED Blue = Identification is activated.
3 Internal health LED Green = System health is normal.
4 NIC 1 link/activity LED Green = Network link exists.
5 NIC 2 link/activity LED Green = Network link exists.
Green = Drive activity is normal.
Amber = Drive failure has occurred.
Off = No drive activity exists.
Flashing blue = System is being remotely managed.
Off = Identification is deactivated.
Amber = System health is degraded. To identify the component in
a degraded state, see "System board LEDs (on page 71)."
Red = System health is critical. To identify the component in a
critical state, see "System board LEDs (on page 71)."
Off = System health is normal (when in standby mode).
Flashing green = Network link and activity exist.
Off = No network link exists.
If power is off, view the LEDs on the RJ-45 connector. See "Rear
panel LEDs (on page 68)."
Flashing green = Network link and activity exist.
Off = No network link exists.
If power is off, the front panel LED is not active. View the LEDs on
the RJ-45 connector. See "Rear panel LEDs (on page 68)."
Component identification 64
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Item Description Status
6 Drive activity LED Green = Drive activity is normal.
Amber = Drive failure has occurred.
Off = No drive activity exists.
7 Power On/Standby button
and system power LED
Green = System is on.
Amber = System is shut down, but power is still applied.
Off = Power cord is not attached or power supply failure has
occurred.
Front panel LEDs and buttons (optional hard drive cage configuration)
Item Description Status
1 UID button/LED Blue = Identification is activated.
Flashing blue = System is being remotely managed.
Off = Identification is deactivated.
2 Internal health LED Green = System health is normal.
Amber = System health is degraded. To identify the component in
a degraded state, see "System board LEDs (on page 71)."
Red = System health is critical. To identify the component in a
critical state, see "System board LEDs (on page 71)."
Off = System health is normal (when in standby mode).
3 NIC 1 link/activity LED Green = Network link exists.
Flashing green = Network link and activity exist.
Off = No network link exists.
If power is off, view the LEDs on the RJ-45 connector. See "Rear
panel LEDs (on page 68)."
Component identification 65
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Item Description Status
4 NIC 2 link/activity LED Green = Network link exists.
Flashing green = Network link and activity exist.
Off = No network link exists.
If power is off, the front panel LED is not active. View the LEDs on
the RJ-45 connector. See "Rear panel LEDs (on page 68)."
5 Drive activity LED Green = Drive activity is normal.
Amber = Drive failure has occurred.
Off = No drive activity exists.
6 Power On/Standby button
and system power LED
Green = System is on.
Amber = System is shut down, but power is still applied.
Off = Power cord is not attached or power supply failure has
occurred.
SATA device numbers
SATA device numbers (standard configuration)
Component identification 66
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SATA device numbers (optional hard drive cage configuration)
Rear panel components
For this server model, PCI expansion slots 1-3 and 6-7 are reserved.
Item Description
1 Power cord connector
2 Mouse connector
3 10/100/1000 NIC 2 connector
4 USB connectors (2)
5 Serial connector
6 PCI Express expansion slot 5, low profile, half-length
7 PCI Express expansion slot 4, (optional PCI-X), full-length
Component identification 67
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Item Description
8 UID button/LED
9 Video connector
10 Dedicated iLO 2 management port (optional)
11 10/100/1000 NIC 1/shared iLO 2 management port
12 Keyboard connector
PCI expansion slot definitions
For this server model, PCI expansion slots 1-3 and 6-7 are reserved.
Slot Type Length Connector Interconnect
4 PCI Express Full x8 x8
4 Optional PCI-X Full 133 MHz/3.3. V 64 bit
5 PCI Express* Half x8 x1
*x8 PCI Express cards are supported, but will run at x1 speeds.
Rear panel LEDs
Item Description Status
1 NIC/iLO 2 activity Green or flashing green = Activity exists.
2 NIC/iLO 2 link Green = Link exists.
Off = No activity exists.
Off = No link exists.
Component identification 68
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System board components
For this server, some system board slots and connectors are reserved.
Item Description
1 DIMM slot 1 (bank A)
2 DIMM slot 2 (bank B)
3 DIMM slot 3 (bank A)
4 DIMM slot 4 (bank B)
5 Processor socket
6 Reserved
7 System power connector
8 Processor power connector
9 Fan 1 connector
10 Fan 2 connector
11 Fan 3 connector
12 Front USB cable connector
13 SATA connector 2 (hard drive)
14 Front panel LED connector
15 NMI jumper
16 Reserved
17 System maintenance switch
18 Fan 4 connector
19 System battery
20 SATA connector 4 (hard drive)
21 SATA connector 6 (optical drive)*
22 Reserved
Component identification 69
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Item Description
23 Reserved
24 SATA connector 5 (optical drive)*
25 Internal USB option connector
26 Reserved
27 SATA connector 3 (hard drive)
28 SATA connector 1 (hard drive)
29 Parallel option connector
30 Serial option connector
31 Reserved
32 PCI Express expansion slot 4
33 PCI Express expansion slot 5**
34 Reserved
35 Reserved
36 Reserved
37 Dedicated iLO2 optional module connector
* The server supports one optical drive that can be connected to either SATA connector 5 or SATA connector 6.
**x8 PCI Express cards are supported, but will run at x1 speeds.
System maintenance switch
Position Default Function
S1 Off Off = iLO 2 security is enabled
On = iLO 2 security is disabled
S2 Off Off = Normal operation
On = RBSU will not commit any
configuration changes*
S3 Off Reserved
S4 Off Reserved
S5 Off Off = Power-on password enabled
On = Power-on password disabled*
S6 Off Off = Normal operation
On = BIOS will clear CMOS and
NVRAM*
S7 Off Reserved
S8 Off Reserved
* "On" activates the function.
Component identification 70
Page 71
NMI functionality
An NMI crash dump enables administrators to create crash dump files when a system is hung and not
responding to traditional debug mechanisms.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in
operating systems, device drivers, and applications. Many crashes freeze a system, and the only
available action for administrators is to cycle the system power. Resetting the system erases any
information that could support problem analysis, but the NMI feature preserves that information by
performing a memory dump before a hard reset.
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do any
of the following:
• Short the NMI jumper pins
• Press the NMI switch
• Use the iLO Virtual NMI feature
For additional information, see the whitepaper on the HP website
(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf
).
System board LEDs
Item LED description Status
1 Processor error Amber = A multibit error has occurred.
2 PPM failure Amber = PPM has failed.
3 Fan 1 failure Amber = Fan 1 has failed or is missing.
Off = Normal
Off = Normal
Off = Normal
Component identification 71
Page 72
Item LED description Status
4 Fan 2 failure Amber = Fan 2 has failed or is missing.
Off = Normal
5 Fan 3 failure Amber = Fan 3 has failed or is missing.
Off = Normal
6 PCI fan failure Amber = PCI fan has failed or is missing.
Off = Normal
7 Overtemperature Amber = System has reached a cautionary or
critical temperature level.
8 DIMM 4 failure Amber = DIMM has failed or is missing.
Off = Normal
9 DIMM 3 failure Amber = DIMM has failed or is missing.
Off = Normal
10 DIMM 2 failure Amber = DIMM has failed or is missing.
Off = Normal
11 DIMM 1 failure Amber = DIMM has failed or is missing.
Off = Normal
12 Reserved —
System LEDs and internal health LED combinations
When the internal health LED on the front panel illuminates either amber or red, the server is experiencing
a health event. Combinations of illuminated system LEDs and the internal health LED indicate system
status.
The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may
report server status differently than the health LEDs because the software tracks more system attributes.
System LED and
Color
Processor failure
(amber)
PPM failure (amber) Red PPM has failed.
DIMM failure, slot X
(amber)
Internal Health
Status
LED Color
Red One or more of the following conditions may exist:
• Processor has failed.
• Processor is not installed in the socket.
• Processor is unsupported.
• ROM detects a failed processor during POST.
Amber Processor is in a pre-failure condition.
Red
• DIMM in slot X has failed.
• DIMM in slot X is an unsupported type, and no valid
memory exists in another bank.
Component identification 72
Page 73
System LED and
Color
DIMM failure, all slots
in one bank (amber)
Overtemperature
(amber)
Fan module (red) Red The minimum fan requirements are not being met in one or
Power supply signal
interlock (amber)
Internal Health
LED Color
Amber
Red No valid or usable memory is installed in the system.
Amber The Health Driver has detected a cautionary temperature
Red The server has detected a hardware critical temperature
Red The power supply signal cable is not connected to the
Internal USB connector
Status
• DIMM in slot X has reached single-bit correctable error
threshold.
• DIMM in slot X is in a pre-failure condition.
• DIMM in slot X is an unsupported type, but valid
memory exists in another bank.
level.
level.
more of the fan modules. One or more fans have failed or
are missing.
system board.
For more information, see "Internal USB functionality (on page 60)."
Component identification 73
Page 74
Fan locations
Standard configurations include either three or four fans.
Component identification 74
Page 75
Cabling
Cabling overview
This section provides guidelines that help you make informed decisions about cabling the server and
hardware options to optimize performance.
Server cabling
CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or air flow can be blocked.
IMPORTANT: Route the cables without blocking the airflow or other installed components. Use
the cable clips installed in the chassis to manage cable routing.
Embedded SATA controller cabling
Embedded SATA controller cabling (standard configuration)
CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or air flow can be blocked.
Cabling 75
Page 76
Embedded SATA controller cabling (optional hard drive cage configuration)
CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or air flow can be blocked.
Optional SAS controller cabling
Optional SAS controller cabling (standard configuration)
CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or air flow can be blocked.
Cabling 76
Page 77
Optional SAS controller cabling (optional hard drive cage configuration)
CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or air flow can be blocked.
Cabling 77
Page 78
Battery cabling for BBWC
BBWC battery cabling to an optional controller in slot 4
BBWC battery cabling to an optional controller in slot 5
Cabling 78
Page 79
Optional internal USB cabling
Cabling 79
Page 80
Specifications
Environmental specifications
Specification Value
System inlet temperature1
Operating 10°C to 35°C (50°F to 90°F)
Non-operating -30°C to 60°C (-22°F to 140°F)
Maximum rate of temperature
change
Operating
Non-operating 20°C/hr (36°F/hr)
Relative humidity
(noncondensing)
Operating 10% to 90%
Non-operating 5% to 95%
Maximum wet bulb temperature
(non-condensing)
Operating 28°C (82.4°F)
Non-operating 38.7°C (101.7°F)
Altitude
Operating2 3,050 m (10,000 ft)
Non-operating 9144 m (30,000 ft)
Maximum rate of altitude
change
1
All temperature ratings shown are for sea level. An altitude derating of 1°C per 305 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
2
The type and number of options installed can limit the upper limit.
3
System performance may be reduced if operating with a fan fault or above 30ºC (86ºF).
2,3
10°C/hr (18°F/hr)
457 m/min (1,500 ft/min)
Server specifications
Specification Value
Dimension
Height 4.32 cm (1.70 in)
Depth 68.20 cm (26.85 in)
Width 44.80 cm (17.64 in)
Specifications 80
Page 81
Specification Value
Weight (maximum
configuration: all hard
drives, power supplies, and
processors installed)
Weight (minimum
configuration: one hard
drive, power supply, and
processor installed)
Input requirement
1
Rated line voltage 90 VAC to 264 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current 6.5 A (100 VAC)
Rated input power 527 W (115/230 V
BTUs per hour 1836 BTU (100 VAC)
Power supply output
Rated steady-state power 400 W (100 VAC)
15.20 kg (33.50 lb)
11.79 kg (26.0 lb)
3 A (200 VAC)
RMS
1706 BTU (200 VAC)
400 W (200 VAC)
)
Maximum peak power 400 W (100 VAC)
400 W (200 VAC)
Acoustic noise2
Idle L
Operating L
1
The limits apply when operated in an ambient environment temperature of +23.0°C ± 2° (+73.4°F ± 2°).
2
Average A-Weighted sound power levels (L
pressure levels (L
) in a 23°C ambient environment, measured in accordance with ISO 7779 (ECMA
pAm
WAd—
L
—44.1dB
pAm
—6.34 B
WAd
L
—44.4 dB
pAm
6.30 B
) and average bystander position A-Weighted sound
WAd
74) and declared in accordance with ISO 9296 (ECMA 109). Acoustic noise levels are maximum
measurements with four fans installed.
Specifications 81
Page 82
Acronyms and abbreviations
ACU
Array Configuration Utility
BIOS
Basic Input/Output System
iLO
Integrated Lights-Out
LED
light-emitting diode
NIC
network interface controller
NMI
non-maskable interrupt
NVRAM
non-volatile memory
PCI
peripheral component interface
PCI Express
Peripheral Component Interconnect Express
PCI-X
peripheral component interconnect extended
POST
Power-On Self Test
PPM
processor power module
Acronyms and abbreviations 82
Page 83
RBSU
ROM-Based Setup Utility
ROM
read-only memory
SAS
serial attached SCSI
SATA
serial ATA
SCSI
small computer system interface
SIM
Systems Insight Manager
UID
unit identification
USB
universal serial bus
Acronyms and abbreviations 83
Page 84
Index
1
12.7-mm optical drive 34
9
9.5-mm optical drive 35
A
access panel 28, 29
additional information 58
ADU (Array Diagnostic Utility) 60
air baffle 32
Array Diagnostic Utility (ADU) 60
diagnostics utility 58
DIMM slot LEDs 71
DIMMs 31
disaster recovery 59
Disaster Recovery, ROMPaq 59
drive bays 62
E
electrostatic discharge 25
embedded SATA controller cabling 75
environmental specifications 80
expansion board 43
expansion slots 67
external health LED 64
B
battery 33, 57, 71
BBWC cabling 78
bezel 36
blue screen event 71
buttons 62
C
cabling 75, 76, 78, 79
cabling, BBWC 75, 78
cabling, embedded SATA controller 75, 76
cabling, internal USB 79
cabling, optional SAS controller cabling 76
cabling, server 75
cache battery 33
cautions 27
component identification 62, 71
components 16, 20, 62
connectors 62
crash dump analysis 71
CSR (customer self repair) 5
customer self repair (CSR) 5
D
dedicated iLO2 optional module connector 67
device numbers 66, 67
diagnostic tools 58
F
fan assembly 32
fan LED 71
fans 74
features 62
front I/O assembly 38
front panel buttons 64
front panel components 62, 63
front panel LEDs 64, 65
H
hard drive blanks 29
hard drive cage 39
hard drives 62
health LEDs 64, 71, 72
heatsink 44
HP Insight Diagnostics 58
HP ProLiant Essentials Foundation Pack 60
HP Systems Insight Manager, overview 60
I
IML (Integrated Management Log) 59
Insight Diagnostics 58
Integrated Management Log (IML) 59
internal health LED 64
internal USB cabling 79
internal USB connector 73
Index 84
Page 85
L
LEDs 62, 64, 71, 72
LEDs, front panel 64
LEDs, hard drive 64
LEDs, NIC 68
LEDs, rear panel 68
LEDs, system board 71
LEDs, troubleshooting 72
M
management tools 58
mechanical components 16
memory dump 71
N
NIC LEDs 64, 68
NMI switch 71
O
operating system crash 71
optical device 62
optical drive 34
optional SAS controller cabling 76
overtemperature LED 71
P
SAS/SATA backplane 40
SATA backplane 40
SATA drives 66
secondary access panel 28
serial label pull tab 62
Server cabling 75
specifications, environmental 80
static electricity 25
switches 71
symbols on equipment 25
system battery 57
system board 51
system board battery 57
system board components 69
system board LEDs 71
system components 20
system maintenance switch 70, 71
Systems Insight Manager 60
T
troubleshooting 58
U
UID LED 27, 64, 71
USB connectors 62
USB support 60
utilities 58
part numbers 16, 20
PCI Express 67
PCI Express riser boards 42
PCI riser board 41
power LEDs, system 64
Power On/Standby button 27, 62, 64
power supplies 44
powering down 27
primary access panel 29
processor 46
processor air baffle 32
R
rack warnings 26
rear components 67
rear panel LEDs 68
resetting the system 71
ROMPaq Disaster Recovery 59
S
safety considerations 25
W
warnings 27
Index 85
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