HP PROLIANT DL320 G4 User Manual

HP ProLiant DL320 Generation 4 Server Maintenance and Service Guide

March 2006 (Second Edition)
Part Number 394178-002

© Copyright 2005, 2006 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft, Windows, and Windows NT are U.S. registered trademarks of Microsoft Corporation.
Windows Server 2003 is a trademark of Microsoft Corporation.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Linux is a U.S. registered trademark of Linus Torvalds.
March 2006 (Second Edition)
Part Number 394178-002

Audience assumptions

This guide is for an experienced service technician. HP assumes you are qualified in the servicing of
computer equipment and trained in recognizing hazards in products with hazardous energy levels and
are familiar with weight and stability precautions for rack installations.

Contents

Customer self repair...................................................................................................................... 5

Parts only warranty service .........................................................................................................................5

Illustrated parts catalog ............................................................................................................... 15

Mechanical components........................................................................................................................... 15

System components .................................................................................................................................18

Removal and replacement procedures........................................................................................... 23

Safety considerations............................................................................................................................... 23

Preventing electrostatic discharge.............................................................................................................. 23

Symbols on equipment............................................................................................................................. 24

Rack warnings ........................................................................................................................................ 24

Server warnings and cautions ................................................................................................................... 25

Preparation procedures............................................................................................................................ 25

Extend the server from the rack........................................................................................................ 26

Power down the server................................................................................................................... 26

Remove the server from the rack...................................................................................................... 27

Access panel .......................................................................................................................................... 27

Hard drives ............................................................................................................................................ 27

Hard drive blanks.................................................................................................................................... 29

Front bezel ............................................................................................................................................. 29

SAS/SATA backplane board.................................................................................................................... 30

Fan assembly..........................................................................................................................................31

BBWC battery ........................................................................................................................................ 32

Media cage ........................................................................................................................................... 33

Optical drive .......................................................................................................................................... 33

Diskette drive.......................................................................................................................................... 34

Power button/LED board.......................................................................................................................... 35

PCI riser board assembly.......................................................................................................................... 36

Expansion boards ................................................................................................................................... 36

Storage controller....................................................................................................................................37

PCI Express riser board............................................................................................................................ 38

DIMMs................................................................................................................................................... 39

Memory options ............................................................................................................................ 39

DIMM installation guidelines........................................................................................................... 39

Interleaving and non-interleaving memory configuration ..................................................................... 40

Power supply.......................................................................................................................................... 40

Processor ...............................................................................................................................................41

System board ......................................................................................................................................... 42

Battery................................................................................................................................................... 44

Cabling ..................................................................................................................................... 45

Cabling overview.................................................................................................................................... 45

Embedded SATA controller cable routing ...................................................................................................45

Optional SAS/SATA controller cable routing ..............................................................................................46

Slot 2........................................................................................................................................... 46

Slot 1........................................................................................................................................... 46

Media cage cables.................................................................................................................................. 47

Diagnostic tools.......................................................................................................................... 48

Troubleshooting resources ........................................................................................................................48

SmartStart software ................................................................................................................................. 48

Contents 3

SmartStart Scripting Toolkit....................................................................................................................... 49

HP Instant Support Enterprise Edition.......................................................................................................... 49

HP ROM-Based Setup Utility ..................................................................................................................... 49

ROMPaq utility........................................................................................................................................ 50

Online ROM Flash Component Utility.........................................................................................................50

Integrated Management Log ..................................................................................................................... 50

Integrated Lights-Out 2 technology............................................................................................................. 51

Automatic Server Recovery ....................................................................................................................... 51

HP Systems Insight Manager.....................................................................................................................51

HP Insight Diagnostics.............................................................................................................................. 51

USB support ...........................................................................................................................................52

Internal USB functionality..........................................................................................................................52

Survey Utility .......................................................................................................................................... 52

Array Diagnostic Utility ............................................................................................................................ 53

Component identification............................................................................................................. 54

Front panel components ........................................................................................................................... 54

Front panel LEDs and buttons .................................................................................................................... 55

Rear panel components............................................................................................................................56

Rear panel LEDs and buttons..................................................................................................................... 57

System board components........................................................................................................................ 58

System maintenance switch.............................................................................................................58

NMI switch................................................................................................................................... 59

System board LEDs ..................................................................................................................................59

System LEDs and internal health LED combinations....................................................................................... 60

Internal USB connector.............................................................................................................................61

SATA and SAS device numbers................................................................................................................. 62

Fan assembly location.............................................................................................................................. 62

Specifications............................................................................................................................. 63

Server specifications................................................................................................................................ 63

Environmental specifications ..................................................................................................................... 64

DDR2 SDRAM DIMM specifications ...........................................................................................................64

1.44-MB diskette drive specifications .........................................................................................................64

SAS hard drive specifications ................................................................................................................... 65

SATA hard drive specifications ................................................................................................................. 65

Acronyms and abbreviations........................................................................................................ 66

Index......................................................................................................................................... 69

Contents 4

Customer self repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow
for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP
service providers or service partners) identifies that the repair can be accomplished by the use of a CSR
part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these

parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for

customer self repair. If, however, you require that HP replace them for you, there may or may not be
additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer
warranty, HP requires that an authorized service provider replace the part. These parts are identified as
"No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography
permits. If assistance is required, you can call the HP Technical Support Center and a technician will help
you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a
defective part must be returned to HP. In cases where it is required to return the defective part to HP, you
must ship the defective part back to HP within a defined period of time, normally five (5) business days.
The defective part must be returned with the associated documentation in the provided shipping material.
Failure to return the defective part may result in HP billing you for the replacement. With a customer self
repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For
the North American program, refer to the HP website (http://www.hp.com/go/selfrepair

Parts only warranty service

Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only
warranty service, HP will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client)
afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant
la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut
être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces
CSR:

).

Customer self repair 5

•

Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront
facturés.

• Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont

également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous
demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type
de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit
effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue
illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance
téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de
rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous
devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation
doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se
réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte
l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à
utiliser.

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair

).

Service de garantie "pièces seules"

Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de
rechange fournies par HP ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez
à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di
assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente
al cliente per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida

la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

• Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di

componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP,
potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare
la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti
sono identificate da un "No" nel Catalogo illustrato dei componenti.

Customer self repair 6

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di
un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP
specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente
difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio
da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e
resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair

Servizio di garanzia per i soli componenti

La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di
garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione
da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di
spedizione e di manodopera per il servizio.

).

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und
höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP
Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden
kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien
unterteilt:

• Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie

den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten
für diesen Service berechnet.

• Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen
lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen
Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen
einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR­Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden
muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung

Customer self repair 7

stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf
und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair

).

Parts-only Warranty Service (Garantieservice
ausschließlich für Teile)

Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice
ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile
kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer
Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de
realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los
proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el
uso de un componente CSR, HP le enviará dicho componente directamente para que realice su
sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si

solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los
gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos

componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo,
si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del
tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para
que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios
autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra
"No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega
en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de
materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos
deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje
de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En
el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío
y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Customer self repair 8

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase
en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica,
visite la página web de HP siguiente (http://www.hp.com/go/selfrepair

).

Servicio de garantía exclusivo de componentes

La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según
las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto
sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes
por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que
hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner)
bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:

• Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze

onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.

• Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te
vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type
garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde
onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website
(http://www.hp.nl/services/servicepartners

).

Customer self repair 9

Garantieservice "Parts Only"

Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen
van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening
gebracht.

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o
reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao
cliente. Existem duas categorias de peças CSR:

• Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua

essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas

para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a
cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após
o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte
técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a
peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for
necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente
cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no
material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de
reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e
determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com
o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair

).

Serviço de garantia apenas para peças

A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos
do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma
taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Customer self repair 10

Customer self repair 11

Customer self repair 12

Customer self repair 13

Customer self repair 14

Illustrated parts catalog

In this section

Mechanical components ......................................................................................................................... 15

System components ................................................................................................................................ 18

Mechanical components

Item Description Spare part number

1 Access panel 398440-001 Mandatory1
2 Bezel (see Miscellaneous plastics kit, item 25) — Mandatory1
3

4 PCIe riser board assembly with bracket 398439-001 Optional2

1

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

charged for the travel and labor costs of this service.

2

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,
however, you require that HP replace them for you, there may or may not be additional charges, depending on the
type of warranty service designated for your product.

3

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires
that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts
Catalog.

1

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP
de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Serial label pull tab (see Miscellaneous plastics kit,
item 26)

— Mandatory1

Customer self repair
(on page 5)

Illustrated parts catalog 15

2

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

3

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

1

Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

2

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.

3

No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un “No” nel Catalogo illustrato dei componenti.

1

Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn
Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

2

Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten
anfallen.

3

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu
erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit
„No“ bzw. „Nein“ gekennzeichnet.

1

Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de
mano de obra de dicho servicio.

2

Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía
correspondiente al producto.

3

No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el
usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de
componentes.

1

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen
te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

2

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

3

No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

1

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

2

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.

3

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a
garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a
marca “No” (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 16

Illustrated parts catalog 17

System components

Item Description Spare part number

Customer self repair (on
page 5)

System components

5 Fan assembly 398442-001 Mandatory1

Power

6 450-W power supply 394982-001 Optional2

Boards

7 Power button/LED board 378627-001 Mandatory1

8 System board — —

a) System board 398437-001 Optional2
b) System board (4M processors) 415626-001 Optional2

9 SAS/SATA backplane 398438-001 Optional2

10 Processors — —

a) 2.8-GHz Intel® Pentium® D 820 processor, 2-

398444-001 Optional

2

MB L2 cache*
b) 3.0-GHz Intel® Pentium® D 830 processor, 2-

398445-001 Optional

2

MB L2 cache*
c) 3.2-GHz Intel® Pentium® D 840 processor, 2-

398446-001 Optional

2

MB L2 cache*
d) 2.93-GHz Intel® Celeron® D 341 processor,

378619-001 Optional

2

2-MB L2 cache*
e) 2.8-GHz Intel® Pentium® D 920 processor,

410612-001 Optional

2

4-MB L2 cache*

Illustrated parts catalog 18

Item Description Spare part number

Customer self repair (on
page 5)

f) 3.0-GHz Intel® Pentium® D 930 processor, 4-

410613-001 Optional

2

MB L2 cache*
g) 3.2-GHz Intel® Pentium® D 940 processor,

410615-001 Optional

2

4-MB L2 cache*
h) 3.0-GHz Intel® Pentium® 4 630 processor, 2-

392168-001 Optional

2

MB L2 cache*
i) 3.4-GHz Intel® Pentium® 4 650 processor, 2-

398388-001 Optional

2

MB L2 cache*
j) 3.6-GHz Intel® Pentium® 4 660 processor, 2-

398389-001 Optional

2

MB L2 cache*
11 Heatsink 378622-001 Optional2
12 Memory* — —

a) 512-MB, PC2-4200 DDR ECC Registered

392176-001 Mandatory

DIMM

b) 1-GB, PC2-4200 DDR ECC Registered DIMM 398955-001 Mandatory1

b) 2-GB, PC2-4200 DDR ECC Registered DIMM 398956-001 Mandatory1
13 PCI-X riser board 409451-001 Optional2

Mass storage devices
14 Media cage (not spared) —

15 CD-ROM drive* 390629-001 Mandatory1
16 DVD-ROM drive* 383981-001 Mandatory1
17 DVD-RW drive* 398663-001 Mandatory1
18 Diskette drive* 390530-001 Mandatory1
19 SATA hard drives — —

a) 80-GB 397551-001 Mandatory1

b) 160-GB 397552-001 Mandatory1

c) 250-GB 397553-001 Mandatory1

d) 500-GB 395501-001 Mandatory1
20 SAS hard drives* — —

Miscellaneous

a) 36-GB 376593-001 Mandatory1

b) 72-GB 376594-001 Mandatory1

c) 146-GB 376595-001 Mandatory1

21 Power cord* 378675-001 Mandatory1
22 Replacement battery, 3-V lithium* 234556-001 Mandatory1
23 SATA cable kit* 378629-001 Optional2
24 Cable kit* 378628-001 —

a) Hard drive cable — Mandatory1

b) Optical device cable — Mandatory1

c) Diskette drive cable — Mandatory1

1

Illustrated parts catalog 19

Item Description Spare part number

Customer self repair (on
page 5)

d) USB cable — Mandatory1
25 Cable management arm kit* 360105-001 Mandatory1

26 Miscellaneous plastics kit 378632-001 —

a) Bezel* — Mandatory1

b) PCI card guide* — No3

c) Bezel screws* — Mandatory1

d) Air baffle — Mandatory1

e) Pull tab* — Mandatory1
27 Rack mounting hardware kit* 360104-001 Mandatory1

*Not shown

1

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

charged for the travel and labor costs of this service.

2

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,

however, you require that HP replace them for you, there may or may not be additional charges, depending on the
type of warranty service designated for your product.

3

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires

that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts
Catalog.

1

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP

de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

2

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également

conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer
ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

3

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour

que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé.
Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

1

Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la

riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

2

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti

progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese
addizionali a seconda del tipo di garanzia previsto per il prodotto.

3

No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la

garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un “No” nel Catalogo illustrato dei componenti.

1

Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn

Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

2

Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten
anfallen.

3

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu

erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit
„No“ bzw. „Nein“ gekennzeichnet.

1

Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a

HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de
mano de obra de dicho servicio.

Illustrated parts catalog 20

2

Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos

componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que
HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía
correspondiente al producto.

3

No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el

usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la
sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de
componentes.

1

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen

te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

2

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

3

No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de

garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

1

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas

peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

2

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o

reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa
adicional, dependendo do tipo de serviço de garantia destinado ao produto.

3

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a

garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a
marca “No” (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 21

Illustrated parts catalog 22

Removal and replacement procedures

In this section

Safety considerations.............................................................................................................................. 23

Preventing electrostatic discharge............................................................................................................. 23

Symbols on equipment............................................................................................................................ 24

Rack warnings ....................................................................................................................................... 24

Server warnings and cautions.................................................................................................................. 25

Preparation procedures........................................................................................................................... 25

Access panel ......................................................................................................................................... 27

Hard drives ........................................................................................................................................... 27

Hard drive blanks................................................................................................................................... 29

Front bezel ............................................................................................................................................ 29

SAS/SATA backplane board................................................................................................................... 30

Fan assembly......................................................................................................................................... 31

BBWC battery ....................................................................................................................................... 32

Media cage........................................................................................................................................... 33

Optical drive ......................................................................................................................................... 33

Diskette drive......................................................................................................................................... 34

Power button/LED board......................................................................................................................... 35

PCI riser board assembly ........................................................................................................................ 36

Expansion boards .................................................................................................................................. 36

Storage controller................................................................................................................................... 37

PCI Express riser board........................................................................................................................... 38

DIMMs.................................................................................................................................................. 39

Power supply......................................................................................................................................... 40

Processor .............................................................................................................................................. 41

System board......................................................................................................................................... 42

Battery .................................................................................................................................................. 44

Safety considerations

Before performing service procedures, review all the safety information.

Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up the
system or handling parts. A discharge of static electricity from a finger or other conductor may damage
system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the
device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

Removal and replacement procedures 23

•

Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous
conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open
this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no
user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open
this enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,

do not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is
contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to
cool before touching.

This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment,
observe local occupational health and safety requirements and guidelines for manual
material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied
by multiple sources of power.

49-109 kg
100-240 lb

WARNING: To reduce the risk of injury from electric shock, remove all power
cords to completely disconnect power from the system.

Rack warnings

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure

that:

Removal and replacement procedures 24

• The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizing feet are attached to the rack if it is a single-rack installation.

• The racks are coupled together in multiple-rack installations.

• Only one component is extended at a time. A rack may become unstable if more than

one component is extended for any reason.

WARNING: To reduce the risk of personal injury or equipment damage when unloading

a rack:

• At least two people are needed to safely unload the rack from the pallet. An empty
42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft)
tall, and may become unstable when being moved on its casters.

• Never stand in front of the rack when it is rolling down the ramp from the pallet.
Always handle the rack from both sides.

WARNING: To reduce the risk of personal injury or damage to the equipment,

adequately stabilize the rack before extending a component outside the rack. Extend
only one component at a time. A rack may become unstable if more than one component
is extended.

WARNING: When installing a server in a telco rack, be sure that the rack frame is

adequately secured to the top and bottom of the building structure.

Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Do not disable the power cord grounding plug. The grounding plug is an important
safety feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

• Unplug the power cord from the power supply to disconnect power to the equipment.

• Do not route the power cord where it can be walked on or pinched by items placed

against it. Pay particular attention to the plug, electrical outlet, and the point where
the cord extends from the server.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and

the internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating

the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the
following procedures:

• Extend the server from the rack, if applicable ("Extend the server from the rack" on page 26).

If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack
cabinet, you can use the locking feature of the rack rails to support the server and gain access to
internal components.

Removal and replacement procedures 25

For more information about telco rack solutions, refer to the RackSolutions.com website
(http://www.racksolutions.com/hp

• Power down the server (on page 26).

).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the
server.

• Remove the server from the rack (on page 27).

If the rack environment, cabling configuration, or the server location in the rack creates awkward
conditions, remove the server from the rack.

Extend the server from the rack

NOTE: If the optional cable management arm option is installed, you can extend the server without

powering down the server or disconnecting peripheral cables and power cords. These steps are only
necessary with the standard cable management solution.

1. Power down the server (on page 26).

2. Disconnect all peripheral cables and power cords from the server rear panel.

3. Loosen the thumbscrews that secure the server faceplate to the front of the rack.

4. Extend the server on the rack rails until the server rail-release latches engage.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the

rack is adequately stabilized before extending a component from the rack.

WARNING: To reduce the risk of personal injury, be careful when pressing the server

rail-release latches and sliding the server into the rack. The sliding rails could pinch your
fingers.

5. After performing the installation or maintenance procedure:
a. Slide the server fully into the rack.
b. Secure the server by tightening the thumbscrews.

6. Connect all peripheral cables and power cords.

Power down the server

WARNING: To reduce the risk of personal injury, electric shock, or damage to the

equipment, remove the power cord to remove power from the server. The front panel
Power On/Standby button does not completely shut off system power. Portions of the
power supply and some internal circuitry remain active until AC power is removed.

IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.

1. Back up the server data.

2. Shut down the operating system as directed by the operating system documentation.

3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on

the front and rear panels of the server.

4. Press the Power On/Standby button to place the server in standby mode. When the server activates

standby power mode, the system power LED changes to amber.

5. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button.

6. Disconnect the power cords.

The system is now without power.

Removal and replacement procedures 26

Remove the server from the rack

To remove the server from an HP, Compaq branded, telco, or third-party rack:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Disconnect the cabling and remove the server from the rack. For more information, refer to the

documentation that ships with the rack mounting option.

4. Place the server on a sturdy, level surface.

Access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and

the internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating

the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

To remove the component:

1. Power down the server (on page 26) if the standard cable management solution is installed.

NOTE: If the optional cable management arm is installed, you can extend the server and perform hot-plug

installation or maintenance procedures without powering down the server.

2. Extend or remove the server from the rack ("Remove the server from the rack" on page 27).

3. Use a screwdriver to loosen the captive screw on the rear of the server.

4. Slide the access panel back and lift it off the server.

To replace the component, reverse the removal procedure.

Hard drives

To remove the component:

1. Back up all data on the hard drive.

2. Power down the server (on page 26).

Removal and replacement procedures 27

3.

Remove the hard drive.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays

are populated with either a component or a blank.

To replace the component, reverse the removal procedure.
When adding hard drives to the server, observe the following general guidelines:

• The system automatically sets all drive numbers.

• If only one hard drive is used, install it in the bay with the lowest drive number.

• Drives must be the same capacity to provide the greatest storage space efficiency when drives are

grouped together into the same drive array.

Optional storage controllers provide support for hot-plug capability and drive LEDs. Controller options
are:

• The embedded controller supports non-hot-plug SATA hard drives. Drive LEDs are not supported.

• Optional SATA controllers support hot-plug SATA hard drives and drive LEDs.

• Optional SAS controllers support hot-plug SAS or SATA hard drives and drive LEDs.

NOTE: ACU does not support mixing SAS and SATA drives in the same logical volume.

Removal and replacement procedures 28

Hard drive blanks

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays

are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

Front bezel

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it

from the chassis.

4. Remove the access panel.

5. Remove all hard drives (on page 27) and hard drive blanks (on page 29).

Removal and replacement procedures 29

6.

Remove the media cage (on page 33).

7. Use the T-15 Torx screwdriver to loosen the two screws on each side of the front bezel.

NOTE: The T-15 Torx screwdriver is shipped with the server and can be located on the rear panel.

8. Slide the bezel to the left, release the USB cover by gently lifting the plastic latch, and then detach

the bezel.

To replace the component, reverse the removal procedure.

SAS/SATA backplane board

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Disconnect the hard drive cables and power cables.

5. Remove all hard drives (on page 27) and hard drive blanks (on page 29).

Removal and replacement procedures 30

6.

Remove the SAS/SATA backplane board.

To replace the component, reverse the removal procedure.

Fan assembly

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the air baffle.

5. Disconnect the fan cables from the system board.

Removal and replacement procedures 31

6.

Remove the fan assembly.

To replace the component, reverse the removal procedure.

BBWC battery

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the fan assembly ("Fan assembly" on page 31).

5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables"

on page 47).

6. Remove the BBWC battery.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 32

Media cage

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays

are populated with either a component or a blank.

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the fan assembly ("Fan assembly" on page 31).

5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables"

on page 47).

6. Remove the BBWC battery (on page 32), if necessary.

7. Remove the media cage.

To replace the component, reverse the removal procedure.

Optical drive

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays

are populated with either a component or a blank.

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the fan assembly ("Fan assembly" on page 31).

5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables"

on page 47).

6. Remove the BBWC battery (on page 32), if necessary.

7. Remove the media cage ("Media cage" on page 33).

Removal and replacement procedures 33

8.

Remove the optical drive.

To replace the component, reverse the removal procedure.

Diskette drive

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays

are populated with either a component or a blank.

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the fan assembly ("Fan assembly" on page 31).

5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables"

on page 47).

6. Remove the BBWC battery (on page 32), if necessary.

7. Remove the media cage (on page 33).

Removal and replacement procedures 34

8.

Remove the diskette drive.

To replace the component, reverse the removal procedure.

Power button/LED board

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the fan assembly (on page 31).

5. Disconnect cables from any devices installed in the media cage, if necessary ("Media cage cables"

on page 47).

6. Remove the BBWC battery (on page 32), if necessary.

7. Remove the media cage ("Media cage" on page 33).

8. Remove the power button/LED board.

Removal and replacement procedures 35

To replace the component, reverse the removal procedure.

PCI riser board assembly

To remove the component:

CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all

AC power cords before removing or installing the PCI riser board assembly.

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Disconnect any internal or external cables connected to any existing expansion boards.

5. Remove the PCI riser board assembly.

To replace the component, reverse the removal procedure.

Expansion boards

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).

Removal and replacement procedures 36

5.

Remove the expansion board.

To replace the component, reverse the removal procedure.

Storage controller

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Disconnect the storage controller cable.

5. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).

Removal and replacement procedures 37

6.

Remove the storage controller.

To replace the component, reverse the removal procedure.

PCI Express riser board

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).

5. Remove the expansion board ("Expansion boards" on page 36).

6. Remove the PCI Express riser board.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 38

DIMMs

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

4. Open the DIMM slot latches.

5. Remove the DIMM.

To replace the component, reverse the removal procedure.

Memory options

You can expand server memory by installing PC4200 DDR2 unbuffered SDRAM DIMMs. The system
supports up to four ECC DDR2 SDRAM DIMMs.

NOTE: By default, the server is set to Advanced ECC Support. Refer to "HP ROM-Based Setup Utility (on

page 49)" for more information.

The server supports standard memory configuration for maximum performance with up to 8 GB of active
memory (four 2-GB memory modules).

DIMM installation guidelines

Observe the following guidelines when installing additional memory:

• DIMMs installed in the server must be unbuffered DDR2 SDRAM, 2.5 V, 64 bits wide, and ECC.

• All DIMMs installed must be the same speed (DDR2 PC4200). Do not install DIMMs supporting

different speeds.

• If only a single DIMM is installed, HP recommends installing it in slot 1A.

BIOS detects the DIMM population and sets the system as follows:

• Single-bank mode: DIMMs installed in one bank only.

• Dual-bank interleaved mode: DIMMs installed in both banks with equal bank capacities.

Removal and replacement procedures 39

The following table lists some, but not all, possible configurations. For best performance, HP recommends
dual-bank interleaved mode configurations.

Slot 1A Slot 2A Slot 3B Slot 4B Total memory Mode

512 MB — — — 512 MB Single-bank
512 MB — 512 MB — 1 GB Dual-bank interleaved
1 GB — — — 1 GB Single-bank
1 GB — 1 GB — 2 GB Dual-bank interleaved
1 GB 1 GB 1 GB 1 GB 4 GB Dual-bank interleaved

Interleaving and non-interleaving memory configuration

The server supports interleaving and non-interleaving memory configurations. Interleaving memory
increases bandwidth by enabling simultaneous access to multiple blocks of data. For example, to overlap
read-writes, the server divides the system memory between pairs of DIMMs, and then writes to and reads
from each DIMM concurrently. For an interleaving configuration, always install identical DIMMs in pairs.
For a non-interleaving configuration, install a single DIMM in slot 1 only.

Power supply

To remove the component:

1. Power down the server (on page 26).

2. Remove the server from the rack (on page 27).

3. Remove the access panel.

4. Undo the cable clip and lift the cables to access the front screw.

5. Remove the three screws that secure the power supply unit to the chassis.

6. Disconnect the removable media and hard drive power cables.

7. Disconnect the auxiliary power supply cable and the main power supply cable from the system

board by pressing each locking tab on the side of the connector and pulling upwards.

Removal and replacement procedures 40

8.

Lift the power supply from the server.

To replace the component, reverse the removal procedure.

Processor

To remove the component:

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and

the internal system components to cool before touching them.

CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the

heatsink. The processor, heatsink, and retaining clip make up a single assembly.

CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache

sizes. Refer to the label on the processor heatsink for a description of the processor.

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 26).

3. Remove the access panel.

CAUTION: Always use a new heatsink when replacing processors. Failure to use new components can

cause damage to the processor.

4. Loosen the four screws securing the heatsink.
a. Loosen each screw three or four turns in the counterclockwise direction.
b. Fully loosen the screws to free the heatsink, being careful not to remove the screw assemblies

from the heatsink.

CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs (in an

"X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the
wrench supplied with the system to reduce the possibility of overtightening the screws.

Removal and replacement procedures 41

5.

Remove the heatsink.

6. Open the processor retaining clip and bracket, and remove the processor.

To replace the component, reverse the removal procedure.

IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is properly

oriented.

System board

To remove the component:

1. Power down the server (on page 26).

2. Remove the server from the rack (on page 27).

3. Remove the access panel.

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 36).

5. Remove all DIMMs ("DIMMs" on page 39).

6. Remove the fan assembly ("Fan assembly" on page 31).

Removal and replacement procedures 42

7.

Disconnect the power supply cables from the system board ("Power supply" on page 40).

8. Disconnect the SATA hard drive cables from the system board ("Cabling" on page 45).

9. Disconnect the media cage cables from the system board ("Media cage cables" on page 47).

10. Remove the processor ("Processor" on page 41).

11. Remove the screws securing the system board.

12. Remove the system board.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 43

Battery

If the server no longer automatically displays the correct date and time, you may need to replace the
battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium

pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack
is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or

water.

• Replace only with the spare designated for this product.

To remove the component:

1. Power down the server (on page 26).

2. Extend or remove the server from the rack ("Remove the server from the rack" on page 27).

3. Remove the access panel.

4. Remove the PCI riser cage ("PCI riser board assembly" on page 36).

CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all

AC power cords before removing or installing the PCI riser cage.

5. Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After

replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an

authorized service provider.

Removal and replacement procedures 44

Cabling

In this section

Cabling overview................................................................................................................................... 45

Embedded SATA controller cable routing.................................................................................................. 45

Optional SAS/SATA controller cable routing............................................................................................. 46

Media cage cables................................................................................................................................. 47

Cabling overview

This section provides guidelines that help you make informed decisions about cabling the server and
hardware options to optimize performance.

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be

pinched or air flow can be blocked.

IMPORTANT: Route the cables without blocking the airflow or other installed components. Use the cable

clips installed in the chassis to manage cable routing.

Embedded SATA controller cable routing

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be

pinched or air flow can be blocked.

Cabling 45

Optional SAS/SATA controller cable routing

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be

pinched or air flow can be blocked.

Slot 2

Slot 1

Cabling 46

Media cage cables

Item Description

1 Diskette drive cable
2 Media cage power cable
3 Optical drive cable
4 Internal USB cable
5 Power button/LED cable

Cabling 47

Diagnostic tools

In this section

Troubleshooting resources ....................................................................................................................... 48

SmartStart software ................................................................................................................................ 48

SmartStart Scripting Toolkit...................................................................................................................... 49

HP Instant Support Enterprise Edition ........................................................................................................ 49

HP ROM-Based Setup Utility .................................................................................................................... 49

ROMPaq utility....................................................................................................................................... 50

Online ROM Flash Component Utility ....................................................................................................... 50

Integrated Management Log.................................................................................................................... 50

Integrated Lights-Out 2 technology ........................................................................................................... 51

Automatic Server Recovery...................................................................................................................... 51

HP Systems Insight Manager.................................................................................................................... 51

HP Insight Diagnostics............................................................................................................................. 51

USB support .......................................................................................................................................... 52

Internal USB functionality......................................................................................................................... 52

Survey Utility.......................................................................................................................................... 52

Array Diagnostic Utility........................................................................................................................... 53

Troubleshooting resources

The HP ProLiant Servers Troubleshooting Guide provides simple procedures for resolving common
problems as well as a comprehensive course of action for fault isolation and identification, error message
interpretation, issue resolution, and software maintenance.

To obtain the guide, refer to any of the following sources and then select the HP ProLiant Servers
Troubleshooting Guide:

• The server-specific Documentation CD

• The Business Support Center on the HP website (http://www.hp.com/support). Navigate to the

server technical support page. Under self-help resources, select ProLiant Troubleshooting
Guide.

• The Technical Documentation website (http://www.docs.hp.com). Select Enterprise Servers,

Workstations and Systems Hardware, and then the appropriate server.

SmartStart software

SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent
way to deploy server configuration. SmartStart has been tested on many ProLiant server products,
resulting in proven, reliable configurations.

SmartStart assists the deployment process by performing a wide range of configuration activities,
including:

• Configuring hardware using embedded configuration utilities, such as RBSU and ORCA

Diagnostic tools 48

•

Preparing the system for installing "off-the-shelf" versions of leading operating system software

• Installing optimized server drivers, management agents, and utilities automatically with every

assisted installation

• Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 51)

• Installing software drivers directly from the CD. With systems that have internet connection, the

SmartStart Autorun Menu provides access to a complete list of ProLiant system software.

• Enabling access to the Array Configuration Utility, Array Diagnostic Utility (on page 53), and Erase

Utility

SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about
SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website
(http://www.hp.com/servers/smartstart

).

SmartStart Scripting Toolkit

The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended automated
installation for high-volume server deployments. The SmartStart Scripting Toolkit is designed to support
ProLiant BL, ML, and DL servers. The toolkit includes a modular set of utilities and important documentation
that describes how to apply these new tools to build an automated server deployment process.

Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard server
configuration scripts. These scripts are used to automate many of the manual steps in the server
configuration process. This automated server configuration process cuts time from each server deployed,
making it possible to scale server deployments to high volumes in a rapid manner.

For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website
(http://www.hp.com/servers/sstoolkit

).

HP Instant Support Enterprise Edition

ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a
feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to
identify and prevent potential critical problems. Through remote diagnostic scripts and vital system
configuration information collected about your systems, ISEE enables fast restoration of your systems.
Install ISEE on your systems to help mitigate risk and prevent potential critical problems.

For more information on ISEE, refer to the HP website
(http://www.hp.com/hps/hardware/hw_enterprise.html

).
To download HP ISEE, visit the HP website (http://www.hp.com/hps/hardware/hw_downloads.html
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide

(ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf

HP ROM-Based Setup Utility

RBSU, an embedded configuration utility, performs a wide range of configuration activities that may
include:

• Configuring system devices and installed options

• Displaying system information

• Selecting the primary boot controller

• Configuring memory options

).

).

Diagnostic tools 49

•

Language selection

For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the Documentation
CD or the HP website (http://www.hp.com/servers/smartstart

).

ROMPaq utility

Flash ROM enables you to upgrade the firmware (BIOS) with system or option ROMPaq utilities. To
upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system.

The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM
revisions. This procedure is the same for both system and option ROMPaq utilities.

For more information about the ROMPaq utility, refer to the HP website
(http://www.hp.com/servers/manage

).

Online ROM Flash Component Utility

The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or
controller ROM images across a wide range of servers and array controllers. This tool has the following
features:

• Works offline and online

• Supports Microsoft® Windows NT®, Windows® 2000, Windows Server™ 2003, Novell Netware,

and Linux operating systems

IMPORTANT: This utility supports operating systems that may not be supported by the server. For

operating systems supported by the server, refer to the HP website (http://www.hp.com/go/supportos

• Integrates with other software maintenance, deployment, and operating system tools

• Automatically checks for hardware, firmware, and operating system dependencies, and installs only

the correct ROM upgrades required by each target server

To download the tool and for more information, refer to the HP website
(http://h18000.www1.hp.com/support/files/index.html

).
For OS-specific procedures, refer to the HP Online ROM Flash User Guide on the HP website

(http://h18023.www1.hp.com/support/files/server/us/romflash.html

).

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each
event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM ("HP Systems Insight Manager" on page 51)

• From within Survey Utility (on page 52)

• From within operating system-specific IML viewers

• For NetWare: IML Viewer

• For Windows®: IML Viewer

• For Linux: IML Viewer Application

• From within the iLO 2 user interface

• From within HP Insight Diagnostics (on page 51)

).

Diagnostic tools 50

For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.

Integrated Lights-Out 2 technology

The iLO 2 subsystem is a standard component of selected ProLiant servers that provides server health and
remote server manageability. The iLO 2 subsystem includes an intelligent microprocessor, secure memory,
and a dedicated network interface. This design makes iLO 2 independent of the host server and its
operating system. The iLO 2 subsystem provides remote access to any authorized network client, sends
alerts, and provides other server management functions.

Using iLO 2, you can:

• Remotely power up, power down, or reboot the host server.

• Send alerts from iLO 2 regardless of the state of the host server.

• Access advanced troubleshooting features through the iLO 2 interface.

• Diagnose iLO 2 using HP SIM through a web browser and SNMP alerting.

For more information about iLO 2 features, refer to the iLO 2 documentation on the Documentation CD or
on the HP website (http://www.hp.com/servers/lights-out

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such
as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System
Management driver, also known as the Health Driver, is loaded. When the operating system is
functioning properly, the system periodically resets the timer. However, when the operating system fails,
the timer expires and restarts the server.

).

ASR increases server availability by restarting the server within a specified time after a system hang or
shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated
pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or
through RBSU.

HP Systems Insight Manager

HP SIM is a web-based application that allows system administrators to accomplish normal administrative
tasks from any remote location, using a web browser. HP SIM provides device management capabilities
that consolidate and integrate management data from HP and third-party devices.

IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for processors,

SAS and SCSI hard drives, and memory modules.

For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or
the HP SIM website (http://www.hp.com/go/hpsim

).

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server management tool, available in both offline and online
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify
server installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the
OS is not running. To run this utility, launch the SmartStart CD.

Diagnostic tools 51

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and
Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, refer to the HP website
(http://www.hp.com/servers/diags

USB support

HP provides both standard USB support and legacy USB support. Standard support is provided by the
operating system through the appropriate USB device drivers. HP provides support for USB devices before
the operating system loads through legacy USB support, which is enabled by default in the system ROM.
HP hardware supports USB version 1.1 or 2.0, depending on the version of the hardware.

Legacy USB support provides USB functionality in environments where USB support is normally not
available. Specifically, HP provides legacy USB functionality for:

• POST

• RBSU

• Diagnostics

• DOS

• Operating environments which do not provide native USB support

).

For more information on ProLiant USB support, refer to the HP website
(http://h18004.www1.hp.com/products/servers/platforms/usb-support.html).

Internal USB functionality

An internal USB connector is available for use with USB drive keys only. The internal connector shares the
same bus with the front external USB connector, and connecting a device to both the front internal and
front external USB connectors is not supported. This solution provides for use of a permanent boot drive
from a USB drive key installed in the front internal connector, avoiding issues of clearance on the front of
the rack and physical access to secure data.

For additional security, you can individually disable the front, rear, and internal USB connectors through
RBSU. Disabling the rear USB connectors in RBSU disables both rear USB ports.

Survey Utility

Survey Utility, a feature within HP Insight Diagnostics (on page 51), gathers critical hardware and
software information on ProLiant servers.

This utility supports operating systems that may not be supported by the server. For operating systems
supported by the server, refer to the HP website (http://www.hp.com/go/supportos

If a significant change occurs between data-gathering intervals, the Survey Utility marks the previous
information and overwrites the Survey text files to reflect the latest changes in the configuration.

).

Survey Utility is installed with every SmartStart-assisted installation or can be installed through the HP PSP.

Diagnostic tools 52

Array Diagnostic Utility

ADU is a tool that collects information about array controllers and generates a list of detected problems.
ADU can be accessed from the SmartStart CD ("SmartStart software" on page 48) or downloaded from
the HP website (http://www.hp.com

).

Diagnostic tools 53

Component identification

In this section

Front panel components .......................................................................................................................... 54

Front panel LEDs and buttons................................................................................................................... 55

Rear panel components........................................................................................................................... 56

Rear panel LEDs and buttons ................................................................................................................... 57

System board components....................................................................................................................... 58

System board LEDs................................................................................................................................. 59

System LEDs and internal health LED combinations ..................................................................................... 60

Internal USB connector............................................................................................................................ 61

SATA and SAS device numbers ............................................................................................................... 62

Fan assembly location ............................................................................................................................ 62

Front panel components

Item Description

1 Serial label pull tab
2 Hard drive bay 1
3 Hard drive bay 2
4 Diskette drive bay
5 Optical drive bay
6 Front USB port
7 Power On/Standby button and system power LED

Component identification 54

Front panel LEDs and buttons

Item Description Status

1 UID button/LED Blue = Identification is activated.

Flashing blue = System is being remotely managed.
Off = Identification is deactivated.

2 Internal health LED Green = System health is normal.

Amber = System is degraded. To identify the component in a
degraded state, refer to system board LEDs (on page 59).

Red = System critical. To identify the component in a critical state,
refer to system board LEDs (on page 59).

Off = System health is normal (when in standby mode).

3 NIC 1 link/activity LED Green = Network link exists.

Flashing green = Network link and activity exist.
Off = No link to network exists.
If power is off, view the LEDs on the RJ-45 connector for status by

referring to the rear panel LEDs ("Rear panel LEDs and buttons"
on page 57).

4 NIC 2 link/activity LED Green = Network link exists.

Flashing green = Network link and activity exist.
Off = No link to network exists.
If power is off, the front panel LED is not active. View the LEDs on

the RJ-45 connector for status by referring to the rear panel LEDs
("Rear panel LEDs and buttons" on page 57).

5 Drive activity LED Green = Drive activity is normal.

Amber = Drive failure occurred.
Off = No drive activity.

6

Power On/Standby button
and system power LED

Green = System is on.
Amber = System is shut down, but power is still applied.
Off = Power cord is not attached, power supply failure has

occurred, no power supplies are installed, facility power is not
available, or the DC-to-DC converter is not installed.

Component identification 55

Rear panel components

Item Description

1 PCI Express expansion slot, (optional PCI-X, full-length)
2 PCI Express expansion slot 1, low-profile, half-length

3 Power supply
4 UID button/LED
5 10/100/1000 NIC 2
6 10/100/1000 NIC 1
7 iLO 2 management port
8 Serial connector
9 Keyboard connector
10 Mouse connector
11 Video connector
12 USB connectors (2)

Component identification 56

Rear panel LEDs and buttons

Item Description Status

1 iLO 2 activity Green = Activity exists.

Flashing green = Activity exists.
Off = No activity exists.

2 iLO 2 link Green = Link exists.

Off = No link exists.

3 10/100/1000

NIC 1 activity

Green = Link exists.
Flashing green = Activity exists.
Off = No link exists.

4 10/100/1000

NIC 1 link

5 10/100/1000

NIC 2 activity

Green = Link exists.
Off = No link exists.
Green = Activity exists.
Flashing green = Activity exists.
Off = No activity exists.

6 10/100/1000

NIC 2 link

Green = Link exists.
Off = No link exists.

Component identification 57

System board components

Item Description Item Description

1 System maintenance switch 12 Fan 2 connector
2 NMI switch 13 Fan 1 connector
3 Battery 14 Main power connector
4 Hard drive connector 1 15 Processor socket

5 Hard drive connector 2 16 Auxiliary power connector
6

Front panel LED board

connector
7 Front USB connectors (2) 18 DIMM slot 3 (bank B)
8 Fan 4 connector 19 DIMM slot 2 (bank A)
9 Optical drive connector 20 DIMM slot 1 (bank A)

10 Diskette drive connector 21 PCI Express x8 connector

11 Fan 3 connector 22

System maintenance switch

Position Default Function

S1 Off Off = iLO 2 security is enabled

S2 Off Off = Normal operation

S3 Off Reserved
S4 Off Off = Normal operation

17 DIMM slot 4 (bank B)

PCI Express x8 connector or
optional PCI-X 133-MHz
connector

On = iLO 2 security is disabled

On = RBSU will not commit any
configuration changes *

On = Override RBSU setting and
enable diskette boot *

Component identification 58

Position Default Function

S5 Off Off = Power-on password enabled

S6 Off Off = Normal operation

S7 Off Reserved

S8 Off Reserved

* "On" activates the function.

NMI switch

The NMI switch allows administrators to perform a memory dump before performing a hard reset. Crash
dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in
operating systems, device drivers, and applications. Many crashes freeze a system, requiring you to do a
hard reset. Resetting the system erases any information that would support root cause analysis.

On = Power-on password disabled *

On = BIOS will clear CMOS and
NVRAM *

Systems running Microsoft® Windows® operating systems experience a blue screen trap when the
operating system crashes. When this happens, Microsoft® recommends that system administrators
perform an NMI event by pressing a dump switch. The NMI event enables a hung system to become
responsive again.

System board LEDs

Item Description Status

1 Processor Amber = Processor has failed.

Off = Processor is operating normally.

2 Overtemperature

Amber = System has reached a cautionary or
critical temperature level.

Off = Temperature is OK.

Component identification 59

Item Description Status

3 PCI riser interlock Amber = PCI riser cage not seated.

Off = PCI riser cage is seated.

4 Power supply signal

Amber = Power supply signal cable is not
connected.

Off = Power supply signal cable is connected.

5 System fan module Amber = One fan in this module has failed.

Red = Multiple fans in this module have
failed.

Off = All fans in this module are operating
normally.

6 PPM Amber = PPM has failed.

Off = PPM is operating normally.

7 DIMM 4 Amber = DIMM has failed.

Off = DIMM is operating normally.

8 DIMM 3 Amber = DIMM has failed.

Off = DIMM is operating normally.

9 DIMM 2 Amber = DIMM has failed.

Off = DIMM is operating normally.

10 DIMM 1 Amber = DIMM has failed.

Off = DIMM is operating normally.

System LEDs and internal health LED combinations

When the internal health LED on the front panel illuminates either amber or red, the server is experiencing
a health event. Combinations of illuminated system LEDs and the internal health LED indicate system
status.

The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may
report server status differently than the health LEDs because the software tracks more system attributes.

System LED and Color

Processor failure
(amber)

PPM failure (amber) Red PPM has failed.
DIMM failure, slot X

(amber)

Internal Health

Status

LED Color

Red One or more of the following conditions may exist:

• Processor has failed.

• Processor failed over to the offline spare.

• Processor is not installed in the socket.

• Processor is unsupported.

• ROM detects a failed processor during POST.

Amber Processor is in a pre-failure condition.

Red • DIMM in slot X has failed.

• DIMM in slot X is an unsupported type, and no valid

memory exists in another bank.

Component identification 60

System LED and Color

Internal Health

Status

LED Color

Amber

• DIMM in slot X has reached single-bit correctable

error threshold.

• DIMM in slot X is in a pre-failure condition.

• DIMM in slot X is an unsupported type, but valid

memory exists in another bank.

DIMM failure, all slots

Red No valid or usable memory is installed in the system.

in one bank (amber)
Overtemperature

(amber)

Amber

Red

The Health Driver has detected a cautionary temperature
level.

The server has detected a hardware critical temperature

level.
Riser interlock (amber) Red The PCI riser board assembly is not seated.
Fan module (amber) Amber A redundant fan has failed.
Fan module (red) Red

The minimum fan requirements are not being met in one or

more of the fan modules. One or more fans have failed or

are missing.
Power supply signal

Red

interlock (amber)

The power supply signal cable is not connected to the

system board.

Internal USB connector

For more information, refer to "Internal USB functionality (on page 52)."

Component identification 61

SATA and SAS device numbers

Item Description

1 Device 1
2 Device 2

Fan assembly location

Component identification 62

Specifications

In this section

Server specifications............................................................................................................................... 63

Environmental specifications.................................................................................................................... 64

DDR2 SDRAM DIMM specifications.......................................................................................................... 64

1.44-MB diskette drive specifications........................................................................................................ 64

SAS hard drive specifications .................................................................................................................. 65

SATA hard drive specifications ................................................................................................................ 65

Server specifications

Specification Value

Dimension

Height 4.32 cm (1.70 in)
Depth 60.96 cm (24 in)
Width 42.62 cm (16.78 in)
Weight (maximum) 12.27 kg (27.0 lb)
Weight (no drives installed) 10.91 kg (24.0 lb)

Input requirement

Rated line voltage 90 VAC to 264 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current

Rated input power

BTUs per hour 1710

Power supply output

Rated steady-state power 450 W
Acoustic Noise*
Sound power, L
Idle 6.3 Bels
Operating 6.6 Bels
Bystander sound pressure,

L

pAm

Idle 46 dBA
Operating 49 dBA

*The limits apply when operated in an ambient environment temperature of +23°C ± 2° (+73.4°F ± 2°).

WAd

6.0 A (100 to 120 VAC) to

3.0 A (200 to 240 VAC)
486 W at 115 V (assume 350 W

output)
479 W at 230 V (assume 350 W

output)

Specifications 63

Environmental specifications

Specification Value

Temperature range* —

Operating 10°C to 35°C (50°F to 95°F)
Shipping -40°C to 70°C (-40°F to 158°F)
Maximum wet bulb temperature 28°C (82.4°F)

Relative humidity
(noncondensing)**

—

Operating 10% to 90%
Non-operating 5% to 95%

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to
3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 KPa.

DDR2 SDRAM DIMM specifications

CAUTION: Be sure to install DIMMs in the proper configuration. Refer to the Documentation CD.

Item Description

Size* 512-MB, 1-GB, 2-GB
Width 64 bits

*Use only 512-MB, 1-GB, or 2-GB, 72-bit wide, 1.8-V, PC2-4200 Unbuffered ECC DDR2 DIMMs. Use HP DDR2
DIMMs only.

1.44-MB diskette drive specifications

Specification Value

Dimensions
Height 12.7 mm (0.5 in)
Width 96 mm (3.8 in)
Depth 130 mm (5.1 in)
LEDs (front panel) Green = On

Read/write capacity per
diskette

High density 1.44 MB
Low density 720 KB
Drives supported 1
Drive height One-third height
Drive rotation 300 rpm
Transfer rate
High 500 Kb/s
Low 250 Kb/s
Bytes/sector 512

Specifications 64

Specification Value

Sectors per track (high/low) 18/9
Tracks per side (high/low) 80/80
Access times
Track-to-track (high/low) 3 ms/6 ms
Average (high/low) 169 ms/94 ms
Setting time 15 ms
Latency average 100 ms
Cylinders (high/low) 80/80
Read/write heads 2

SAS hard drive specifications

Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive

Capacity 36,420 MB 73,408 MB 146,815 MB
Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.0 in)
Interface SAS SAS SAS
Transfer rate 3 Gb/sec 3 Gb/sec 3 Gb/sec
Rotational speed 15,000 rpm 15,000 rpm 15,000 rpm
Bytes per sector 512 512 512
Logical blocks 71,132,959 143,374,737 286,749,487
Operating temperature

10º to 35º C (50º to 95º
F)

10º to 35º C (50º to 95º
F)

10º to 35º C (50º to 95º F)

SATA hard drive specifications

Item 80-GB SATA 160-GB SATA 250-GB SATA 500-GB SATA

Capacity 80,026 MB 160,041 MB 250,059 MB 500,107 MB
Height

2.611 cm (1.028

in)
Interface Serial ATA Serial ATA Serial ATA Serial ATA
Transfer rate 1.5 Gb/sec 1.5 Gb/sec 1.5 Gb/sec 1.5 Gb/sec
Rotational speed 7,200 rpm 7,200 rpm 7,200 rpm 7,200 rpm
Bytes per sector 512 512 512 512
Logical blocks 156,301,488 312,581,808 488,397,168 976,773,168
Operating

temperature

5º to 55º C

(41º to 131º F)

2.611 cm (1.028
in)

5º to 55º C
(41º to 131º F)

2.611 cm (1.028
in)

5º to 55º C
(41º to 131º F)

2.611 cm (1.028 in)

5º to 55º C
(41º to 131º F)

Specifications 65

Acronyms and abbreviations

ABEND

abnormal end

ACU

Array Configuration Utility

ADU

Array Diagnostics Utility

ASR

Automatic Server Recovery

BIOS

Basic Input/Output System

CSR

Customer Self Repair

DDR

double data rate

DIMM

dual inline memory module

ECC

error checking and correcting

iLO

Integrated Lights-Out

IML

Integrated Management Log

ISEE

Instant Support Enterprise Edition

Acronyms and abbreviations 66

LED

light-emitting diode

NIC

network interface controller

NMI

non-maskable interrupt

NVRAM

non-volatile memory

ORCA

Option ROM Configuration for Arrays

OS

operating system

PCI

peripheral component interface

PCI Express

peripheral component interconnect express

PCI-X

peripheral component interconnect extended

PCIe

peripheral component interconnect express

POST

Power-On Self Test

PPM

processor power module

PSP

ProLiant Support Pack

RAM

random access memory

Acronyms and abbreviations 67

RBSU

ROM-Based Setup Utility

ROM

read-only memory

SAS

serial attached SCSI

SATA

serial ATA

SCSI

small computer system interface

SDRAM

synchronous dynamic RAM

SIM

Systems Insight Manager

SNMP

Simple Network Management Protocol

UID

unit identification

USB

universal serial bus

Acronyms and abbreviations 68

Index

A

access panel 27
ADU (Array Diagnostic Utility) 53
Array Diagnostic Utility (ADU) 53
ASR (Automatic Server Recovery) 51, 66
Automatic Server Recovery (ASR) 51, 66
Autorun menu 48

B

battery 44, 59
battery-backed write cache battery pack 32
bezel, server 29
BIOS upgrade 50
blue screen event 59
buttons 54

C

cables 45, 46, 47
cabling 45, 46, 47
cautions 25
CD-ROM drive 33, 54
component identification 15, 18, 54, 57, 58, 59
components 15, 18, 54
connectors 54
controller 45, 46
crash dump analysis 59
CSR (customer self repair) 5
customer self repair 5

E

electrostatic discharge 23
environmental specifications 64
expansion board 36, 45, 46
extending server from rack 26
external health LED 54, 55

F

fan assembly 31
fan assembly, replacing 31
fan LED 59
fans 62
features 54
flash ROM 50
front panel components 54
front panel LEDs 55

H

hard drive blanks 29
hard drive, replacing 27
hard drives 27, 54
health driver 51
health LEDs 55, 59
HP Insight Diagnostics 51
HP ProLiant Essentials Foundation Pack 51
HP Systems Insight Manager, overview 51

I

D

device numbers 62
diagnostic tools 48, 50, 51, 52
DIMM installation guidelines 39
DIMM slot LEDs 59
DIMMs 39, 40
diskette drive 34, 54, 64
drive bays 54
DVD-ROM drive 54

illustrated parts catalog 15
iLO (Integrated Lights-Out) 51, 66
IML (Integrated Management Log) 50
Insight Diagnostics 51
Instant Support Enterprise Edition 49
Integrated Lights-Out (iLO) 51, 66
internal health LED 54, 55, 60
Internal USB connector 61

L

LEDs 54, 55, 57, 59, 60, 61

Index 69

M

management tools 48
media cage 33, 47
memory 39, 40
memory dump 59
memory, interleaving 40

N

network connector LEDs 57
NIC LEDs 54, 55
NMI switch 59

O

Online ROM Flash Component Utility 50
operating system crash 59
optical device 33, 54
overtemperature LED 59

P

PCI Express 38
PCI Express riser boards 38
PCI riser board assembly 36
PCI riser interlock LED 59
power button/LED board 35
power LEDs, system 55, 59
Power On/Standby button 26, 54, 55
power supplies 57
power supplies, removing 40
power supply LEDs 57, 59, 60
powering down 26
PPM failure LEDs 59
processor 41
processor failure LEDs 59

S

safety considerations 23
SATA backplane 30
scripted installation 49
serial connector 58
serial label pull tab 29
SmartStart autorun menu 48
SmartStart Scripting Toolkit 49
SmartStart, overview 48
spare part numbers 15, 18
specifications 63, 64, 65
specifications, environmental 64
specifications, server 63
static electricity 23
storage controller 37, 46
support packs 48
Survey Utility 52
symbols on equipment 24
system board 44, 58
system board battery 44
system board components 58
system board LEDs 59, 60
system maintenance switch 58, 59
Systems Insight Manager 51

T

tools 48

U

UID LEDs 26, 54, 55, 57
USB support 52
utilities 48, 49, 50, 51, 52, 53
utilities, deployment 49

R

RBSU (ROM-Based Setup Utility) 49
rear panel buttons 57
rear panel components 57
rear panel LEDs 57
remote support and analysis tools 49
removal and replacement procedures 23
removing server from rack 27
removing the access panel 27
resetting the system 59
RJ-45 network connector LEDs 57
ROM-Based Setup Utility (RBSU) 49
ROMPaq utility 50

W

warnings 25
warranty 5, 15, 18

Index 70