external Op€ration with control codes, escape sequences,
above
is
60 cps
PORT 1 ASYNCHRONOUS/SYNCHRONOUS INTERFAGE
RS-232-C;Iully @mpatible
and/or reverse channel
Accessory
point
(13267A
U S only)
TRANSMISSION MODES: Full or half-duplex, asynchronous, synchronous
PORT 2 ASYNCHRONOUS/SYNCHRONOUS INTERFACE
RS-232-C; fully
channel and/or reverse channel in half-duplex CCITT V 24,
control ot external
TRANSMISSION MODES: Full or hall-duplex, asynchronous, synchronous
support
OPERATING MODES
block
PARITY:
POWER REOUIREMENTS
INPUT VOLTAGE: 1OO112OV (+5o/o,
with Oplion 0501 1 5V
POWEF
with Option 050 120W
mm x 215 mm
SIZE: 24 mm x 35 mm
to 2K bytesJeduces
contiguration
4800
HP Multipoint
Selectable;
CONSUMPTION:75W
memory
Full ASCII
pad;
auto-repeat;
1 34
0,
5,
may require CPU supplied delays or
Full
24 x 80
pods provide
first
terminal, and
compatible
printer
(BOTH
even, odd,
(6
in x 8 5 in) diagonal
lines x 80 columns
msssage/status lines
7 x 1 1
raster scan
large
characters,
Inverse video,
(50
Hz optional)
119
(banery
keyboard; eight screen-labeled
code
Data
1 50, 200, 300, 600, 1 200, 1 800,
line character screen copies in
with Bell 103A, 202ClD/S/T
in half-duplex CCITT
current
with Bell 103A modems, 202ClD/S/T modems Choice of main
polled protocol)
POFTS): On-line; off-line;
none,
(1920
enhanced dot
(094in
displayable control codes,
Finnish/Swedish, Danish/Norwegian,
lor insert
underline,
lines including a delault datacomm
memory to 80 characters by
powered)
rollover;
N-key
Communications
loop (132664),
132684
daisy-chain
1
0,
General
10Ol22Ol24Ov
(+5o/",
+
1 O/o - 25%)l 230V
|
measurement 262
characters)
matrix with inlelstitial dotsi
x
138 in)
detached
handshakes Typical
V 24 hardware
asynchlonous or synchronous
10o/o)
-107o't
25th and
mode
blink, security
107 lines ) 128 bytes non-
with 1 2-m
2000, 2400,
integral
18
seconds
(50
modems Choice ol
handshaking available
terminal 3O0 Baud
(25
hardware handshaking for
character,
Hzl!5o/o')
ar 60
at 50 Hz
+ 1
Ooh,
|
mm
26th tor labeling
extended line drawing
bulfer
ksys; cursor controls;
(4
cable Optional
fi)
K keycaps
and U
4800,
9600 baud and
printer,
or baud rales
printer
PIN): EIA slandard
main
Modem 13268A
PIN): EIA standard
line modify,
( 15%)
1 5olo
at 50/60
)
(10
4 in)
x
15
9
dot
French,
(Butter
ex-
throughput
channel
mulli-
(does
line
and
Hz ( t
5%)
ENVIRONMENTAL
PRODUCT
PHYSICAL
ORDERING
not
CONOITIONS
TEMPERATURE,
+ 1 40"F)
Operating: 0 to
WITH OPTION 050:
HUMIDITY: 5 to 95%
WITH OPTION
ALTITUDE: Non-Operating:
VIBRATION AND SHOCK:
Product meets the
and/or otfice equipmont
Germany-VDE,
orsPLAY
With Option 050:
KEYBOARD
DISPLAY
187 x 173
KEYBOARD
26264 Display Station
Option
001
0O2
003
004
005
OOO
013
O14
015
016
O5O
2O'l Malh
tDeletes
MANUFACTURING
FBEE
+55'C
Operating:
(non-condensing)
050: 5 to 80o/.
Sea level lo
Operating:
SAFETY
requirements of the
Switzerland-SEv,
SPECIFICATIONS
MONTTOR
Finnish/Swedish character
Danish/Nomegian
French character
German
United
Spanish
240V, 50
100V, 60
220V, 50
100V.
Integral
U S
WEIGHT: 16 8 k9
19 0
WEIGHT: 2 0
MONITOR
INFORMATION:
DIMENSIONS:
in);
665
DIMENSIONS:
1 19 lines display
by
ooeration
character
Kingdom charactel
Language character
Hz operation
Hz
operalion
Hz
oDeration
Hz operation
50
torms
8Yr-inch-wide
using
and Large Character
oPlion)
keyboard and
OIVISION:
AMBIENT: Non-Operating:
SPACE
(+32
Sea level to
Vibration: 0 38 mm
Shock: 20
Type tested to
original shipping
in the
(42
kg
kg
mm D
ASCII
character set
set and
set and
copy
includes math and
'F)
to + 1 31
+5
to
(non-condensing)
4572
g,
following countlies:
U
(37 lb)
lb)
(a
a lb)
380 mm
(262
in)
including
430 mmW
keyboald with numeric
memory, serial
set and
keyboardf
keyboardt
set and
set and
printer,
lhermal
paper
sels
TERMINALS
DATA
East Arques
974
Sunnvvale.
-40
(+41
+40"C
15240
metres
1 1 ms, % sine
tollowing safety agencies
K
x
and keyboardt
(Standard with
Calilornia
to +104"F)
(50,000
metres
(15,000
tt)
pp,
(0
in)
015
quality
for normal
container
-BSl,
190 mm O
keyboardt
keyboardt
Canada-CSA,
United States-U
W x 475 mm D
keyboard
x
75mm H
pad,
port,
l/O
60
keyboardt
120
characlers-per-second
any
large
character
DIVISION
Avenue
9'1086 U
tt)
to
5
shipping
80 characler $4150
Hz, 1 10
language 265
sets
S A
+60rc
to
Hz, 3 axis
55
and handling
for
EDP equipmenl
Finland-FEl,
L
x
440 mm H
(17 x 75 x 30in)
Prlces in
u.s.A.
volt
(-40
(150
265
265
265
265
zo)
1210
to
in
x
Srinivas
configuration
Tom
for
ing
proper
12
Sukumar
menus. Special
Anderson
windows and
the
efforts of
operation
lewrerr-pncKARD JOURNAL
for his help
Gary
of the
performed
workspaces
Lum and
2626,{
MAROI 198j
the detailed
appreciation
in
defining
in the 2626A.
Frank Santos
deserve special
design
is
user interface
the
The untir-
in verifying
mention.
of the
given
to
Reference
1. W.M. Newman
ciples of
28. McGraw-Hill
Interactive Computer
and R.F. Sproull,
Graphics, Second
Book company,
"flser Interface Design," Prin-
Edition, Chapter
York, 1979.
New
Hardware
and Firmware
Support for
Four
virtual
by Srinivas
HE
26264 DISPLAY
CRT terminal
2645A
the
ing capabilities
can function as up
video
SOS
display
A fast
drawing characters
The 2626A represents
display terminal
guided
r 2645A-compatible
tablished customer
that all host applications
for
Improvement
r
needs
tage
feature
r Ease
that are
of the terminal's
the
to all terminal features.
be
means
current
Ease
r
ability.
Firmware
The
hardware
memory).
modularity.
firmware
sics in
hardware
overly burdened
The firmware
the main
the keyboard intrinsics,
printer
features,
All input
is
done by
Traditionally,
The
for its
terminal has
tified:
controller chip, 80K bytes
RAM
character
its
design
the 2645A
ofincreasingly
of new
set was required.
ofuse. There
tedious
design of forms.
set by the user. Instead,
of configuring
state.
of manufacturing,
Design
terminal's feature
and firmware (microprograms
One
This is
interfaces.
the 2626A
and the
code, the
intrinsics.
thereby
processing
the main
26264 has
needs. In
rerminals
Sukumar and
with
Terminal's feature
and
dual
to four virtual
and 2K bytes
ROM
containing ASCII
is
capabilities. The following
and development:
feature
base, it
function
price/performance
in
technology, a
are many
use
to
control
The HP 2626,{
of the main
achieved
The
provide
main code
with the hardware
inthe
2626,\ is
operating
The
main code
providing
beyond
code.
terminals
a simple
studying
perform,
to
John D. Wiese
STATION is
features
communications ports,
of
a
standard
a significant
as well as
sophisticated users
significant
and require
sequences. A
There
menus
the terminal and
reliability,
is
set
goals
firmware
the datacomm
the 26264
do not have
operating
the various
the following
that form
set.
With
terminals.
ROM, SZK
of
program
set. Because
was considered
and
useful features
provided
of the firmware
by a
the interface
so that the
divided into
system,
the interrupt
RAM for variables.
and extended line
feature.
contribution
device drivers
with the 2626A.
ratio.
enhancement
a detailed
provides
are
hardware
no
provide
and
by
stored
clear specification
modules
main code is
aspects
the display intrinsics,
intrinsics,
controls
all the terminal's
with its
an
operating
system
functions
tasks can be iden-
of
good
a combination
service routines
that
in
a sophisticated
a superset
its
window-
the 2626,4,
It
has
objectives
HP's large
mandatory
developed
To meet
and
take advan-
in
the
knowledge
example is
easier
straps
a highly visible
displaying its
easy
in
read-only
design
called intrinbetween
of the design.
six
major
personality.
is
adequate
of
a custom
bytes
of
to CRT
es-
the
of the
26454
access
to
service-
of
was
of the
the
not
parts:
and
the
system.
that the
one
r
r Datacomm
r
r
r
r
The
trol the execution
responding
scheduled
the absence
until it
or YIELDing. That is,
takes control away from
WAITS
another task has been
that
fashion
checked when
which
or
associated
burst from
YIELD
in
fore YIELDing,
processed.
fers
YIELD
of windows
display
screen
play
screen
workspaces,
able from
119
number
This
workspace/window
datacomm
workspace.
datacomm
Displ
Input from
Keyboard input
Block
mode
the ENTER key is hit.
Device
port
User
ters is
A
How long
function
a burst. The
Interwoven
Each
transfers. Data is
to
devices like workspaces
softkey
processed
operating system
in
task
the 26264
or executing. If
gives
or YIELDs,
it
encounters. It
such that
give
to
with
that
processing
after
Tasks
WAIT
after
after
memory
window. Traditionally
memory in
is
that
B0 to 160
lines
of B0
of lines
task in
association
port
Thus
ports
ay
datacomm
output(s)
process.
processing.
when a softkey is
on
of these
to interrupts
may be in
a hardware
of
up control
the
the operating
scheduled
examines
the
the search is
control.
remains
a task
associated
but
the complete
processing
into
and
currently
with the
the terminal
to a workspace
with
I/O
devices WAIT
device have been processed.
a
datacomm
the keyboard
controlling BLOCK
this
workspaces.
that can be
a terminal
visible.
number
characters. The
characters.
available
is
established
configuration,
the 262.6A
and the
Station
port(s)
A block
to the operating
operating system
last
certain fixed
one line
multitasking
of
data
transferred from
and
A user-defined
the HP 2626A
tasks as the
from its I/O ports.
one of three
a
is
task
currently executing, in
interrupt it
an
executing task. After
system looks
and
all tasks in a round-robin
task executed is
made to find
in
control
the
task.
after all
process
tasks
YIELDs
mode and device
data transfer is
of display memory.
A
workspace
associated
a workspace
and a window is
The 26264,
of columns in
total in
As the line
decreases
is
can
keyboard
proportionally.
associated
through
and
the keyboard
process
simultaneously.
is
transmitted when
the
datacomm
printers.
string of charac-
pressed.
is
designed to con-
system
executes the
depends
For
number
after each character
system
width increases
which
(terminal)
states: waiting,
remains in
system by WAITing
never
another task
example, all
the characters in
But
256
done. But
with
has four possible
each configur-
all workspaces is
with a workspace.
inputs
control
specifically
the task
to
first
the last
the
on
device
these tasks
characters
of
characters be-
is
the concept
is
a block
a display
is
all of
the 24-line
the
terminal
can attach
to another
from
is
if
see
one
task
to
tasks
trans-
they
of
dis-
the
a
both
a
I\,4ARCH
198l
HEWLETT.PACKARO
IOUNNII.
13
--)
FBRr
VDF
HDF
Flg.1.
The 2626A display section
is controlled by the
(VCC).
chip
grated
sectrbn
This large-scale inte-
citcuit makes the display
very
simple
video
conttol
Terminal
The display
video controller
ory.
into them.
operate
device
device
the character
involves displaying
function associated
classified
r
r
r
r
r
r
Intrinsics
intrinsics are designed
(see
These also
have the workspace/window
point
At any
the currently
on
becomes active,
gets
activated
is executed
into six major
related
characters
of
cursor
of
of
functions
Configuration
Configuration
Screen
Display
Control of
Display memory
page
article,
in
the
and the
character
the
it. The display
with
16) and the
all the
time
workspnce.
active
workspace
function
in
workspace,
that
or executing
groups:
workspaces
windows
like
scrolling
movement
partitioning, allocation
tion.
The
keyboard
that the
various
Swedish,
supported
keyboard.
dependent
tions and data
The
datacomm
intrinsics are completely
keyboard options
French, Spanish and
in
addition to
The keyboard
Katakana keyboards
the
standard
intrinsics
aspects of the keyboard
needed
by the main code.
intrinsics
provide
like the
from
the main code and the datacomm
character
That is, the main code does
whether the current datacomm
point
context area that
The
same code can
ports
interface independent of the current
not have to know
configuration
or multipoint.
point-to-point
is
configured
The datacomm code operates
is
up during terminal
set
is completely
driver
be used
as a
for
ports
both
printer port.
interface
to
with the
display
concepts
functional
intrinsics
Whenever
associated
to be
with that
performed
whether
control
the
inbinsics can
and dealloca-
table-driven,
Danish,
German,
typewriter-style
isolate the
the
interface between
the
hardware-
logical opera-
hardware. This
protocol.
at any
point-to-
is
using a
configuration.
reentrant so that the
when one of the
even
mem-
built
can
U.S.
is a
point
print
The
face, which
the
sent to
printer
video
controller
can
screen
a
printing
printhead.
by
blank characters
it
Hardware Design
be
To
meet
manufacture,
printed
terminal
interconnections,
of
terminal easy
nal can
replaced.
The
so
be
terminal
sections:
datacomm
section.
vice chosen
input/output oriented
MCC1 called the
and outputs.
program
The
words)
stack
and
and
terminal
cluded.
is off.
The datacomm
ports. Port 1
half-duplex,
or
in
mechanism
used
26264 has a dot
the
requires that all character dot
printer
from the main
are the same character
to display
printed.
be
the characters
of
Thus some
goals
the
The
optimization
print
to
and
of reliability, serviceability
code. The dots sent to the
dots that are used
the data.
Thus
printer
as well as the
in both
the terminal elechonics
This
power
supply,
structure
minimizes the
circuit
boards: the
logic boards.
increasing reliability and making
to build and service.
be easily
isolated and the
Any
faulty module
logic board can be divided
its memory, the two
the microprocessor
and
interfaces, the keyboard scanner,
The microprocessor
for its speed, low
is a 16-bit HP CMOS SOS de-
power
instruction set.
MCs, which
memory consists
tK words of static
frequently used
for
configuration,
powered
It is
section
supports
point-to-point
by a battery
synchronous
has TTL
of ten
RAM, which
variables.
a 256x4-bit
when the terminal
consists
of two
or
multipoint
or
inter-
by
the
on the
be
information
everything
intrinsics control the
position
of the
is done to skip over
directions.
and ease
of
are on only three
the
sweep,
and
number
the
problem
in a termi-
quickly
four major
into
and the display
dissipation,
is
It
a modified
compatible
64K-bit
ROMs
is used
preserve
To
CMOS
RAM
and
inputs
(a0K
for the
the
in-
is
power
identical
nearly
asynchronous,
full-
communica-
14 rewurr-prcKARD
JoURNAL
MARoH
1981
protocols.
tions
external
300 baud
full-duplex, point-to-point
quires
more control
tocols, both
that a single firmware
ports.
Both
It
provides power
also
datacomm
pods
modem). Port 2
lines
ports
appear identical
ports
use a universal
(current
supports
datacomm. Although
to support its additional
driver
can be used
nous receiver/transmitter (USART)
face
chips to
To relieve
ning the keyboard, the
microcomputer. It
16 input/output
programmed
It is
bouncing
a key has been
both the keycode
and
control). Each
either
also be locked
processor
over, so
Iost. Besides
a
small speaker in
tion of the
provide
the MCS
an RS-232-C
of the time-consuming
keyboard is
1K
has
lines
bytes
and an
to scan the
changes
in
the state
pressed,
and the
it
interrupts
state of the
key can be
slow
or
when
fast,
or nonrepeating. Individual
so
out
pressed.
will
they
The scanner
overlapping keystrokes
scanning
the
keyboard, the
the keyboard.
programmable
are
tone
of
eight-bit
keyboard, detecting
of all keys. When it finds
programmed
not be reported
of a
The
from
to support a family
loop,
multipoint, and
only asynchronous,
Port 1
to
the microprocessor
to service both
synchronous
asynchro-
and appropriate inter-
interface.
task of scan-
scanned by a
ROM,
interface
single-chip
64 b],'tes
to the MC5.
of
RAM,
and
the MC5
qualifier
and reports
keys
to be repeating,
keys can
to the main
provides
fast
N-key roll-
typist will
not be
scanner also drives
frequency
the main
and
dura-
processor.
re-
pro-
so
de-
that
(shift
ables its
of
memory.
a
signal to the
The
tested and repaired.
the
terminal is
on the
person
replacing
board is
Acknowledgments
Prem
provided
intrinsics
Hill.
fohn
system. Brodie
ing it
and
thank
Reference
1.
B.E. Forbes, "Silicon-on-Sapphire
High-Speed
A|trLI 7977.
address
The VCC
terminal processor
CRT. The
to a
this component
replaced
Kapoor
a lot
were written
wrote
/anelle
bus
then
MCs
that
An
turned
error
particular
with
was
the
guidance
of
Grant Head
Keast
and Bill
printer
the
Bedke
and
Single-Chip
and
on. Any
socketed
enables
cycles
the operation
board
extensive
messages generally
does
a new
project
to the lab
by Chris
was
intrinsics.
Ed Tang
Processor,"
the
the
memory
is
is
designed
self-test is run
detected
component
fix
not
the
one.
manager
team.
Vandever,
responsible
Rytand
helped
We would
for
their
Technology
Hewlett-packard
MCb
complete.
errors
to address
and
to be
whenever
are displayed
point
the repair
that
has failed. If
problem,
for
the 2626,{
The
datacomm
Sara Hilbert
for
the
operating
him in
also
contributions.
the
returns
easily
then
the
and
and
design-
like
to
produces
Iournal.
a
Display Section
The
display section is
be
displayed,
vertical
and
supplying
sending the necessary video,
drive signals
croprocessor for
block
diagram
The display
control
The VCC
RAM,
which is used
of the display
section is
(VCC)
chip
controls and refreshes
character ROMs
access time
character
(upper-
set
characters) and
set.
Optional sets include
The VCC
display
memory and
memory by
characters
begins
fetching
address.
character and
address for
by
VCC,
the
character
hancements
When
update
the
addresses
RAM.
The VCC
VCC
does not need
t50
of
The
sets.
and lower-case
an extended
reads its
the MC5. The pointer
to be displayed.
characters
As each
the character
the character ROMs.
then
ROMs. The VCC
and
the MCS
pointer
the desired location
holds
during horizontal
responsible for
to the sweep
character
use by
the optional
dot
to
information
section is
based
on the CMOS SOS video
described in
the article
the
to store
are 3zK-bit
ns. Each
2626A
data and
CMOS SOS
pair
of
has the full rZ8-character
Roman,
line
numerals
drawing set as its
math and
configuration information
also reads
pointer
a
list
VCC
The
picks
and their
is
word
read from
set select bits
The
enhancements
the dots for
the character
modifies
shifts them
needs
lists
to use
vertical
or
out to
the sweep.
to access the
read
or to
off the MCS
or
as
though
until the next
the display memory
retrace).
storing
the data
horizontal
refresh
the
display,
to the
thermal
shown
16Kx16-bit
printer.
in Fig.
page
on
dynamic
enhancements. The
devices with
ROMs
contains two
ASCII
and control
standard
large
characters.
from
Iist
stored in
points
to rows
pointer
up
a
enhancements
at that
display memory,
are used
are
are read from
the dots with
the en-
display memory
write
data,
it
were
it
simply
normal
time the
(usually
The VCC
then
and
mi-
1.
1.6.
an
the
the
of
and
the
as an
read
the
to
dis-
to
A
Srinivas Sukumar
Srinivas Sukumar
gree
rn
electrical engineering
toria Jubilee
bay in 1973 and his MS
trical
engineering
State University in 1975 Aftertwo
of software design
tion
systems,
contributed to the
the 2626A Display
project
manager with HP's
nals Division Born rn Bombay,
is
married and now
California He
dening,
John D. Wiese
Born in
received
ford
the
sign
and the 2313A Analog/Digital
tem,
the 22404
Processor,
board and selttest
Display
manager with HP's
sion,
ing,
has
California
and table tennis
Norman,
his BSEE
University in
year
same
for
the 25704
hardware
Station, He's now
John enjoys
the
and
two children, and
received
Technical Institute
degree
from
Washington
for
medical
joined
he
enjoys
He's
and
Measurement and
and
study
HP in
firmware
He's now
Statton,
Data
lives
in Sunnyvale,
racquetball,
Oklahoma,
1969 and
design of the
Data Terminals Divi-
volleyball,
of
John
from
degree
done hardware
Coupler/Controller
firmware
code
for
a
wine
He's married,
lives in
joined
backpack-
his BE de-
from
informa-
1977 and
design
Srinivas
Subsys-
design
Control
processor
the 26264
proiect
Palo Alto,
Vicin Bomin
elec-
years
of
a
Termi-
gar-
Wiese
Stan-
HP
de-
for
I.,4ARCH
]98l
HEWLETT-PACKARO
IOURNNT 15
A Silicon-on-sapphire
Integrated
Controller
Video
by
Jean-Claude
2626A DISPLAY
HE
sonality
display
tant
legibility
ter
blank
and
requirements
Other
low cost,
In
operating
and
support of
at a 24.90-kHz
rate was chosen.
inscribed within
fully
encoded so
dot space
for
The screen
The
display
tiguous
screen
upper screen,
easily done
demarcation
Roy
seen through
is best
design
quality, hardware-supported
and
filling,
by
and
are ease
power
low
these
The
character
a 9-dot-by-15-line
individual dots
that
increased character
format consists
may be configured so
rows starting
and the remainder
having the
row
that
indicates
This allows flexible and
ing into logical blocks.
firmware reserves
bottom two rows
Horizontal
lower
or the
upper and
lower window screen count
these and the
ware to divide
To ease the
programmable demarcation
user, a
the
by firmware. This line
position,
its
and
the upper
for the softkey
screen splitting
can
screen
demarcation
the screen
task of discriminating
coincides with the demarcation
thickness,
STATION'S
multifaceted
its display'
very
objectives
horizontal
are
and
manufacture,
of
vertical
consumption.
objectives
line
a raster-scan
rate and a
is 7 dots
size
cell.
Interstitial
can be shifted
resolution.
26 rows of
of
any number
that
from
top
the
lower screen.
the
2626A firmware set
where
the
efficient
vertical
In normal operation
24 rows
for
labels.
within either the
be
by configuring
done
parameters. Using
possible for
it is
row
four independent
into
between
line can
and intensity
impor-
The
high
charac-
windowing
scrolling.
reliability,
displayl
25.7775-MHz
by
1 1
scan
lines
dots
one-half
B0 characters.
of con-
constitute
This
value for the
a
is to occur'
split
partition-
screen
26264
the
user and the
the
upper screen
the display's
firm-
the
windows.
windows
be
turned
are controlled
per-
dot
are
the
for
on
row,
by
means
appropriate
of
right border may
Ieft and right
activated on
windows.
a row basis
further screen
The two types
are a blinking
Cursor
are
cell
words.
visually
internally comparing
by
for each
multivibrator
underscore
blinking,
type,
all
selected
Moving the cursor
easier
frame and
if
The display system
blink, underline,
enhancements.
is
ting capability
from white-on-black to
of 1 2B characters each
character
sets
Finally, an internal dot and
can be
during
through
invoked to simplify
manufacture.
configuration
configuration constants.
be
turned
on at the
Finally, a bottom border
for
splitting
in the
of cursor supported
and a
and underscore
by
firmware through
the
inhibits
to track
for the terminal
the old and
firing a blink-inhibiting
they differ.
supports ten
inverse video, half-bright,
In
addition,
allows
a
the user to change the
black-on-white
crosshatch
tcrminal setup
All of these
parameters
memory.
To make this display system
felt that
integration
was mandatory. Since
available CRT controller exists with this
repertoire
Iarge
was
developed.
2626A's
display system are
exception
of
features, a
of
new
All the circuits
included in
a crystal oscillator, character
Similarly,
interface
between the
may be
each
window to
allow for
vertical direction.
full
character
by
the display
position
system
cell rectangle.
within the
cursor control
its blinking to make
This is
user.2
new cursor
done
positions
digital one-shot
combinations of
and
the
security
full-screen background set-
entire display
vice versa. Four
or
be
can
accommodated.
pattern generator
and alignment
features are available
and entries
practical
video
required
in the display
reliable,
and
no
commercially
flexibility
control
chip
to support the
the chip
ROMs,
it
(VCC)
with
display
was
and
the
a
it
16
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Fig. 1.
Block diagram
(VCC).
chip
control
locked state
ers are driven
from
lines are control Daths)
the
display
machines and
parameters
by
memory
of the
Several
video
intet-
count'
read
(black
memory, sweep circuits,
The reasons
complexity of
have required
ages and
This logic
Custom
about
integration
29
The decision
sapphire
power,
low
Video
ControlChip
VCC
The
firmware
used not only
products
for integration are compelling.
this
approximately
775
used
have
would
of board
cm2
to
(SOS) process3
static operation,
has a
to allow a
in
without
hancement and all
DMA
capability.
VCC is implemented as a hierarchy of
The
machines and counters
state
The
master
parameters
block diagram of the
sequencer,
control
simplified
the overall operation
master sequencer
generator
configuration
representing
information from the
sequencer controls
dow counter,
reads the
and loads the
raster-defining
sent
screen
activity
pointers
and the memory controller.
hard
configuration
values into the chip's
rows
and columns
the master sequencer
and characters
ing horizontal retrace
per
frame
cycle and
cursor
The address
ing range of
performs
ing,
hard
goes
it
reads
position
toK words. Under
the operations
and
memory
soft
display
through
such dynamic
and
counter is
configuration
a delay
chip, the equivalent
22o
of
cm2
six-layer
dissipated
resulted
in
one component
area and dissipates
implement the
based on SOS's
was
and reasonable
flexible
variety
the
of screen
26264
structure
but also
any redesign.
processing,
dot
driven
from
read
a complex state machine,
VCC. The algorithm of
the
of
is driven
both by
the current state ofthe
the address
area of the
parameters
(see
from
the display
it
controls memory
a soft
vertical
the
14
bits
row
of
refreshing, and the addressing
memory areas.
The memory controller arbitrates
shared
out the
display
memory.
processor
access only during
processor
ted by the
use
cessor accesses.
dates,
processor
following
The video
processors.
mation
command the
processor,
mechanism is
of this
Another
involves blanking
desires the memory until the start of the
release of the
the
logic consists ofseparate dot
These accept the character enhancement
read from
information read from
processors generate
In
normal operation
during on-screen columns
horizontal and vertical retrace. Under
VCC
may allow itself to
which causes screen
interleaving
the
use, helpful
the entire frame
memory.
the display
memory and the character dot
the character
the two
line, and a bus switch.
Given the
TTL logic would
in
integrated circuit
printed
approximately
circuit
15
that requires
900
only
VCC in HP's silicon-on-
high speed,
density.
configurable
formats. Thus
in
It
supports
it may be
terminal
other
character en-
and has its own
interlocked
by
configuration
shown
from the
memory.
in
the display
VCC is
qualifiers
screen
firmware.
counter, the
registers.
such as the
1). During on-screen
Table
coordinates the
The master
vertical win-
At
chip
display
These repre-
number of
fetching of
turn-on
memory
memory and dur-
refreshing, Once
configuration
information
window
wide,
master sequencer
pointer
processor
housekeeping
the current
as
width.
giving it
an
control
and character
access of the
VCC
the
and allows
preemp-
be
blanking. One
VCC and
of
for
whole-screen
from
the time
and enhancement
ROMs.
video
Together these
signals
representing
pack-
board.
watts.
mW'
by
built-in
and
A
Fig. 1.
controls
the
raster
by
and
it
address-
it
fetch-
the
of
locks
pro-
up-
the
frame
infor-
Hexadeclmal
Address
VHRC
0
1
AC
2
CHDR
SHDR
3
(0)
4
SR
5
(0)
6
(0)
7
(0)
E
9
ssL
(0)
A
(0)
B
c
RL
10
cRow
11
ccoL
12
cc
DC
13
DLC
14
15
SLD
16
SLOR
17
DR
1E
ESL
VR
19
1A LSEA
1B USEA
1C
LSHM
1D USHM
1E
LSVW
lF
USVW
2cl22
(0)
23
(0)
24
full-bright
the sweep
The dot
and
assembly.
timing
25.771.5-MHz
internal
by the
timing
video logic's
t
I
I
Row
Pointer
List
I
I
t
Fig. 2.
The display
pointer
a
Variable
Active Columns
Clear
Set
(not
Number of
(not
(not
(not
Starter
(reversed
(reserved
Scan
Cursor Row
Cursor Column
Cursor Control
Display Control
Demarkation
Demarkation Line Starting
Demarkation
7 MHz, and
modes.
dominate
mon
low-pass traps
sufficient
quency,
way to
One
trated
the output
the oven.
Suppression
Mode
crystal
modes.
C-mode
B-mode
10 MHz,
the next
below that are the
In
all overtone
if
are not suppressed.
they
high-pass
mode-suppression
or tanks.
to suppress
such as
the third-overtone
implement
in Fig, 7. The capacitive
with a series-parallel
oven
is about B2t.
and
amplifier
is
capable
The crystal we
resonance at
resonance
mode is the
crystals,
The high-pass
any
bandpass mode suppression
network.
ponent values, the conditions
a selected
over
circuits
quencies
shunt
one
it is not
tive,
oscillation.
the series-parallel
again,
is
lation
band
offrequencies.
for low,
middle, and high
the series-parallel
arm inductive
possible
to
At high frequencies
possible
because of the
and the other shunt
produce
network
temperature
depends
Because
of their
and the oven
resonating
of
is
use
cut
10.0 MHz.
is
above
this
at
fundamental
fundamental
strong
fundamental
the
This leads
techniques,
techniques
modes above the
B mode at
arm C3
shunt
properly
With
for oscillation
Fig. 8
will occur
shows
frequencies.
network looks
inductive.
in-phase
the result
looks
mixed
is similar.
inductive.
capacitive
on
power
controller
in
many
for
a third-
The
third-
10.9 MHz.
A mode
B and C
modes
to the com-
such
are not
desired
MHz.
10.9
is illus-
replaced
is
chosen
com-
equivalent
low fre-
At
With
arm capaci-
feedback
No
oscil-
and
the
are
at
will
as
fre-
only
for
Here
in-
ductive
shunt arms.
both shunt arms
producing
has a
tal
has
enough
proper
the
resonant mode
gain,
Phase Noise
When considering
think
convenient
oscillating
properly
to
loop section
designed,
Fig. 6. B/ock diagram
looo
lator
At frequencies
are capacitive
phase
inside
the circuit
phase noise of
the
oscillator
of the
and a buffer
buffer amplifier
the
ot the
includes a
1}-MHz
inside the
the circuit
and
for oscillation.
shift
the
will
passband
oscillate.
having
as
amplifier
section
1081 l AlB Oscillator
quartz
SC-cut
passband
is capable
Ifthe crys-
and the
an oscillator,
parts,
two
section.
contributes
The oscil-
crystal
of
loop
it is
an
If
1981 HEWLETT-PACKARO
I\,IARCH
IOUNruNT
23
!
Flg.7.
The SC-cut
mode-suppressed to
gram
same
1/f
only
section
It is
and white
contributes only 1/f3 and 1/f2
filter action of the crystal that
the
factor in the
method of extracting the
The
is very important in
loop
the crystal
clean signal. A
in Fig.
shown
Oscillator.
that the
crystal
a standard Colpitts-type oscillatot
shows
oscillator
oscillating loop section.
very good
is
a
simple way to extract the signal
9a;
A capacitor is
current flows through the capacitor.
voltage across the capacitor
is
and
current
the oscillator
the crystal.
capacitor
good
signal-to-noise ratio
output
voltage is to decrease the capacitance.
output
becomes a
value
the
Fig,8.
Fig.7
passband
used to drive the
loop
output voltage level
The
impedance and the crystal
voltage is
problem,
of the
Equivalent circuits
low
Top:
equ
crystal in
allow only
with mode suppresslon-
phase
noise and the oscillating
achieving
filter, the
this method
placed
is
(except
noise
in
the buffer stage,
desirable. One way to
because as this capacitor
tuning
capacitance,
lor the mode-suppression
high-frequency equivalent
and
iv
al ent ci
rcu
it.
1O811AlB
the
C-mode
phase
operation.
noise
provides
from
signal
good phase
current
crystal
was
in
in
used
with the crystal
series
the
proportional
buffer amplifier
noise)
crystal
proportional
is
drive
increase the
it
severely
Oscillator
This
(top)
dia-
and
loop
processes.
the extra
the
noise.
1/f2
oscillating
Since
is a very
cleanly
10544A/B/C
The
the
to
crystal
AII
stage.
is filtered by
to the
current.
For
a large loop
loop
However, this
approaches
restricts
circuit
circuit. Bottom:
is
the
Fig.9.
Phase noise is sensltive to
from the oscillator
signal
tuning
tuning
(b)
lmproved
range. A compromise
range and noise
1081 l
In the 10811A/B Oscillator,
is
The circuit, shown
made small without
so
rent
is run
crystal
capacitor
the amplifier
sees
small
through
current
from the tuning circuits since
compared
in Fig. 9b, allows the capacitor
affecting the
a common
to
the
as an
to the crystal
the crystal Q significantly.
a
in
series
get
a large loop output
voltage
the
chosen,
Oven
important
An
normal operating
105448,
a linear controller
with
ambient
heater, at
tive
pass
the
power
This
power-efficient
in the control
switching
ceptable
combines
winding and
Power
the tuning circuit,
with
is the crystal
giving
a crystal dissipation of 50
Consumption
oven design
power
while still using
temperature of
25t
about
transistor
located on the outside of
is effectively
design
transistor
give
does
in some applications.
best
the
both designs by
of
using two
with direct current only
bolted to
voltage V1
is used to limit the warmup current
ot
for the main
The thermal
oven cavity.
the
proportional to
control
oven
resistance between
the
required
is
method
to
AlB
(a)
Method used in the 1 0544AlBlC
method
requirements.
a new approach
tuning. The crystal
base stage,
capacitor.
The amplifier
which
the oscillating
(r'"
impedance of
resistance, so
Since
the
it
may
+ r'66/B). This
it does not
capacitor
be made
voltage. The other factor
current.
A value
ptW.
requirement was to
consumption
below that of
a linear conholler.
requires
25t.
that
by
spurious
4.5 W of oven
Because
half of this
wasted.
keeps
The
power
switching
frequencies that
The
this oven
power
is dissipated
10544A
consumption
at 3 kHz.
10811A/B Oscillator
eliminating
control
[Fig.
R1, a
the heater
transistors
10). Heaters
small
to
resistor, develops
current.
provide
and
loop.
the
oven cavity
of extracting the
balance the
was taken.
to
cur-
feeds the
isolates
loop
affect
longer
is no
quite
low to
affecting
1
was
mA
of
reduce the
The 105448
power
in
a resis-
uses
package.
the
uses a more
low
However,
are unac-
the heater
heat the
Q1
This
and
oven
Q2
voltage
feedback
tempera-
be
the
is
the
an
in
the
are
a
24
newlerr-pecKARD JoURNAL
1981
MARCH
Fig. 10.
transislors
power
and the ambient
ture
the 105448.
the oven
slightly
lator
compared
assembly,
thicker.
draws
that
to
AIB
1081 1
consumption
heat
the oven
oven controller
ls /ess than two
temperature
was
This
accomplished
thus allowing the
result
The
less than two
4.0 W for
block diagram
using direct current only.
25o/o higher than that
is
by reducing the size
these efforts
of
watts in still air at
7o544BlC and
the
105444.
Warmup Time
The warmup time
function of the thermal
warmup time
The
a BT-cut crystal,
5x10-e of the
the SC-cut crystal
cause
transients,
governed
components
oven
improve heat transfer to the electronics,
to
bly
the
by
assembly.
is
as compact
and, of
made of die-cast
10544B
capacitance
The
the two
oven
is
made of
per
most temperature-sensitive
printed
When
cavity.
components are surrounded
the above conditions,
for most crystal
behavior of the
as 20 minutes
V"" : 20V
for the
is
specified
24-hour
transient
7O544AlBlC Oscillator,
value for
is much less sensitive
for
warmup time
most temperature-sensitive
the
10811A/B
the
course, the thermal
To minimize total
possible.
as
thermal capacitance,
The
oven cavity
aluminum, while the oven
copper.
unit
Aluminum has a lower thermal
volume
than copper
components
boards, which are
circuit
the two
lids are screwed
by heated aluminum
the 10811A/B warmup
watts in
still
insulation to be
foam
is an
2.6
oscillators
(8
Oscillator
capacitance of
the oven
cavity
factor
by a
are located on
folded
in
Two heater
Overall
air at 257
oscil-
oven
25'C,
W for the
is
mainly
crystal.
which uses
within
to
watts).
Be-
to thermal
electronic
the
and
assem-
lids are
and
in the
0.7,
of
into
the
place,
these
For
walls.
time
specified as
Because
heater current Ig must be limited during warmup.
the
is
accomplished
is
applied to the oven,
tending to turn
from
Rl.
Since
forms
resistance. This was done to allow
to be used
is
used.
10
minutes.
power
transistors are used
by
R1, R4 and Rs in
U1,
U2's
U1
on.
Q2
to make
Q2
V1 : V3,
V3 is a linear function of
Q1
and
into what appears to be a
Q2
output
sinks
and therefore
for
Fig.
is
approximately
just
enough
limits
V"", this circuit trans-
the 10811A/B Oscillator
in
applications
where
10saaA/B/C Oscillator
the
The 10544A/B/C uses a 47Q resistive
the
winding.
Temperature Coefficient
The reason for
enclosing
duce the effect of ambient
an oscillator
temperature fluctuations on the
temperature-sensitive components
of the ability to do this
sure
gain
is
defined
(Tf
ature
in
region
thermal
improved
has an
more
temperature-sensitive than any other component
10811A/B
the
ponents
perience
as the ratio of the change
resultant change
to the
the oven that
:
gain
4TA/4T6.
temperature coefficient,
Oscillator.
of the oscillator
the same
is
termed
it is
desired
Even
though the SC-cut
This means that
including
temperature change, the
change in frequency due to the crystal
in
an oven
in
the oscillator.
thermal
in
ambient
in
temperature
to control
it is
if
the crystal
would be ten times
more than that due to any other component.
the thermal
the thermal
both areas to contribute equally to the oscillator's tempera-
in
ture coefficient.
of
The
ing
to the difference between the actual crystal operating
temperature
gain
to the crystal
gain
to the
temperature coefficient of the crystal
and
the turnover
crystal. Turnover temperature
the derivative of crystal
temperature
is zero, that
a
(See Fig.
perature very
Most
crystal oscillators
is
temperature. A
in which changes in
to turns of this
frequency
the
the oven temperature
page
1
on
close
time-consuming
potentiometer.
change
22.) It is desirable to set the oven temto the crystal
the oscillator
per
is
mustbe
rest
of the oscillator electronics
ten
times
temperature of that
is
temperature at
the
frequency with respect to crystal
is,
daf/f
:0'
dr
turnover temperature.
variable
use a
resistor to set
process
must be
frequency are compared
process
This
continues
turn is small enough.
considered
matched with the crys-
tal's turnover temperature.
In
10811A/B,
the
and
the
SC-cut
allows the oven
the combination of
crystal's
temperature
fixed resistor. Avoiding
makes the
10811A/B
the
lower sensitivity to temperature
be
to
long
the
first field-repairable HP
high thermal
merely by installing a
set
temperature-set
oscillator.
Thermal Gain
is
To
achieve a
high
thermal
gain
particular
a
to
heat sources
This
When V""
10.
base current
Is
V3
to
fixed heater
heater
is
to
A mea-
gain.
Thermal
temper-
of the
(T6).
Thus
crystal
ten times
still
all of the
com-
were to ex-
resultant
lt follows
greaterthan
varies
accord-
particular
which
the oven
followed
until
point
At
this
process
crystal
region
V"",
+
re-
in
that
for
gain
in a
N,4ARCH 1981
".-r...
r:;::;r;:-:t
;
Flexible
Crystal
Circuit Packaging
Oscillator
of a
Design
scheme included
manufacturing
oscillator
mance
electronic
selectively
layout
10544NB|C
these oscillators is
backbone
circuit boards,
tions The
crystal
cilcuits
Oven Control
Fig.
older 10544A
Oscillator
The use of flex
oscillator
production
obtained
per
treated
connector
by manual or automatic means At
soldered and cleaned
transferred to the
plete
problems
specification, they
transported to a machine
flex
objectives
employs a new
support electronics
packaging
stiffened
of this oscillator is
A
of the new
oscillator and AGC
oven, thereby
Board
Boardl/O
AGC
1 0544A
1.
Cross-sections of the new 1081 1
Assembly
makes it
sequence is
from
panel,
functional
circuits
a manufacturer in
as
with a removable
Then the
are detected, such as solder bridging
from
for
greater
cost,
and easier
takes
flexible
block dragram illustrating
shown in Fig.
oscillator lt incorporates
the l/O
minimizing
circuitry
ideally suited
illustrated in Fig
panels
electrical
check
are reparred
panel.
the
1081 1A/B
the
electrical
crystal technology
and a radically
a new
circuitry. The
much the
connector and
board
Connector AGC Board
Oscillato.
Board
Thermal Insulation
packaging
for high-volume
follows First,
as
solder
are
The
loaded
tester This instrument
to the circuitry and
at this
that separates the
From here,
by James H.
Oscillator
performance,
assembly and repairability
new
radical
and
operation and basic
same as
the basic similarities
1 The flex
the various interconnec-
are
enclosed
thermal
effects
A Oscillator
in
the construction of the new
panels
2 The
resist
loaded with
this
the
five
of
panels
in such areas as the l/O
components either
point,
the
soldered
and
components
point
The
indrvidual
individual
the
packaging
decreased
printed
a die-cast
Board
and the
circuits are
are
panels
gives
a com-
parts
or
are then
oscillator
oscillator
perfor-
earlier
The
wave
lf any
out of
flex
with higher
oven design The
approach, one
that of the
ctrcutt forms
the three
within
on these critical
Oven Control
10811A
production.
flex
complete circuits
are selectively
panels
panels
This
of
of
the
are
Steinmetz
Fig, 2.
Flex
circuits come
soldered, and tested before being separated
circuits are loaded into
ooeration
The final
crystal oven,
ing
folded
athermal insulation
which are
folded
assembly Two leads
to
the oven
slid
position
lator
sembly
The
the
except that it
The interconnection
significantly improved
sculptured flexible
soldered
a simple
edge-card
are removed
flex
double use
increased
son between
Benefits
The
substantial
area has
longer
assembly
the
into
package
leaves
soldering the
oven covers
over the top of the
two Darlington
from
down
the outer housing
assembly
sequences
1 081 1 A,
use
required
the
control board. In
Another
thermal
and
described
l/O
has fiitered
to the various
connector
connector
by
a simple
the oven
of the
production
the.10544C
flex
of
decrease in
been reduced
This
consists of
into
spacer At
oven control
f rom the
the outer cover is installed,
are
The B model is
circuit
on the
and its
control board,
same
volume
circuits
live
trays and transported
crystal
place
oven assembly and
this
transistors in fO-220
oven's
this configuration,
and
the
insulator
illustrated in
above, has an
power
of the new B
over
that of the 10544C
(SFC)
connections
oven
associated flexible
cutting
flex
circuit assembly,
and reduced
and the 108118 is
in
this
the labor required
since
some
design also
panel
to a
installing
leads
to the board and screw-
The oven
point,
the
board and fastened
thermistor are
l/O
connector is fastened into
is installed
Fig.
edge-card
electrically
and
coaxial
model
interconnect
on the outer
control board The
operation at
This technique
new
oscillator has resulted in
pads
allows
and are
to the
flex
the
control board
separated lrom
heaters forthe
on top ol the oscil-
3
the
signal connections
oscillator
This interconnect
the
unit
costs. A compari-
shown in Fio 4
for
assembly Board
and
connectors
a complete
loaded,
final
assembly
circuit into
packages,
to the oven
then soldered
the assembly is
These final
connector
same as the A
by
employing a
cover and runs
A version's
interconnection
point
where
allows
thereby
allowing
electrical
is
oven,
l/O
for
are no
the
then
it
by
are
as-
for
was
to
the
the
is
a
26 Hewrerr
pACKARD
JouRNAL N.4ARcFl 1981
4,
Fig.
1081 1B
10544C
The sculptured
(left)
is a
signrficant
(right)
flexible
interconnect of the
circuit
improvement over the
older
Fig.3.
Final
assembly
flex
check of the
has
been
assembly before
greatly
simplified,
trically assembled and still be
lAlB
of 1081
final
since the oscillator can
folded
troubleshooting
Flex
circuitry
inpuVoutput, This is accomplished by
tor for
over the edge-card
before the
eliminates the
l/O
the TO-220
lamination
need to
Furthermore,
heater
interconnections
from the
out
oven control
transistors, which have been
gers,
formed
separated
capacitor
can be
course,
folded in
are
A
benefit
side
by matching circular
by the base dielectric
looks
formed in
but since rigid boards are
be considerably
possible
made it
to include an edge-card connec-
stiffener board
flex
of the
solder
flex
the
transistors
actually
are
circuit
or otherwise connect
circuitry simplif
for the
fingers
board At the
previously
a 180'arc and mounted
flex
the
of
like
a component
this
circuitry is that capacitors
pads
on
pad
way
rigid
on
thicker the capacitor
larger
printed
Ilesign Problems
problem
A
oscillator was the
region This
structed
strength The
that occurred early
flex
can be an
polyimide
a
of
problem
circuit's tearing
inherent limitation with a flex circuit
material because of
was rectified
interconnection interfaces
in
the
to
the stiffener
the techniques used to blank out the
ufacturing Another
conductor traces
nect
the IO-220 heater transistors This
increasing
nate,
the
in
effect creating
problem
in
the
pad
area encapsulated within the
encountered was the cracking of
pad
area of the
its
strain relief,
own
Oscillator
assembly,
Repairability
remain
it is
that
out so
(onto
accessible
folding
the
component side)
the
flex circuit
to the stiffener board
package
to a
ies the interconnection
llator's
osc
flex circuitry that extend
of
final
soldered
both sides of
As illustrated
without a hole
oven
assembly
to the
to the
oven
the
in Fig
Capacitors
stage, the
circuit boards too,
pads
development of
within
its relatively
by using
boards and
flex
circuit
flex
problem
interconnect
lhe
low
larger radii at the
improving
during
fingers
that Intercon-
was solved
flex
circuit
elec-
for
This
of
These
fin-
flex
can be
circuitry
5, this
of
must
this new
con-
shear
its man-
by
lami-
The most difficult
problem
was
ultimately traced
to
stray capacitance between two overlapping traces . Because of the
sensitivity of the
capacitance
frequency
prevrous
thicker: 1 57
theoretical model
capacitance
picofarads,
and K is dielectrrc
dielectric thickness, the
oscillator's electrrcal design,
critical
problem
This
since
parts
of the circuitry can
had
the
material was considerably
base
not been encountered
within
change
designs,
mm versus the new base thickness of 0 03
for
such a
equation,
situation
C:0
OBBsBKp/t,
can be
where
A is area in cmz, t is drelectric thrckness in centrmetres,
lt
constant
greater
be seen
can
the capacitance
solution was to decrease the capacitor area, since
practical
technology allowed
'An
another
to change any of the other
for
the
is
trace
overlapping
trace on the other
Fig.5.
Sfray
flexible substrate
thin
lapping traces
(circular
simply
side
capacitance
When needed, capacitors
without hole)
area
local necking
a lrace on one srde
between oveilapping
reduced
is
necking down the
by
any changes
result
predicted
is
capacitance
C
the smaller the
that
Therefore,
it
parameters
Flex
down of the trace
of a circuit
board
traces
are easily
inherent
in
mm The
from the
the
was not
circuit
in
the
that crosses
on the
over-
formed
in
a
in
in
MARcH
198i HEWLETT
pACKARD.rornl'raL
27
region
of the crossovers, as illustrated in Fig.
are approximately 0 1 3 mm
Acknowledgments
Richard Liszewski
implementation
contributed to
for
the
goes
circuit
Refercnce
1 J Sleinmetz,
Packaging
production
original
to Bob
"Flex
Production
and
of the
design concept
Circuitry
wide instead
contributed to the design and
flex
circuit.
implementation
Wilson
Packaging
Conference,
neck-downs
5. The
of the standard 0
Jeny
Curran and
of the 10811A/8.
for
the oven
ol a Crystal Oscillator," National Electronic
February 1980
housing and
production
Dave
Gottwals
38 mm
Credit
flex
sional engineer in
CSPE Jim
not
rebuilding
far
is
from
wrecked
married,
Palo
James H.
Jim
supervisor with HP's
vision
receiving
University
responsibilities
special machine
turing
for
Rubidium
crystal
two
named
on a device
California and
Alto, his
cars, remodeling
scheme. He's
has
a
son, and lives rn
birthplace.
Steinmetz
Steinmetz
joined
He
his
BSME
of California
engineering,
displays,
a member
and
frequency
oscillators. He's
papers
on
inventor
package
of ASME,
Los
His
special
home,
his
product
is a
Santa
HP in
1973
degree
at Davis His
HP
at
have included
design,
manufac-
package
product
design for
references
flex
a registered
authored
circuitry and is
pending
on a
interconnect
NSpE,
Altos,
California,
interests
and
traveling.
design
Clara
after
from
design
patent
profes-
and
include
Di-
the
and
structure,
gains
elechical)
gain
resulting
by the change in
thermistor
be
about 10s.
ambient
crystal
the thermal
two
between
gain
the
these
more
the thermal
gain,
loop
thermal
fined, it
tor, and
AT".61"rry'ATcrystal,
Normally,
heat for
mechanically
desired
mechanical
behavior
have
the
the
crystal.
eral trials
crystal,
that,
gain
adjusting
such as the crystal
must be considered:
and
the mechanical gain.
can be
defined
from
a change in
thermistor
is
separate from
very
made
large,
The
mechanical
temperature
temperature. The
properties
heaters, and
the
mechanical gain
is
dependent
mechanical
If it
two.
than
ten times
is
This
gain
is
gain
then was
crystal
upon
gain
can be assured
gain
approximately
the case in
designed
1000.
of
necessary
such that
would
when
one
an
oven, the
reananged
mechanical
change
of the
oven enough
to be
repeated. With
power
dissipated in
result
same
With
the
as
first
were required
and heaters
it
took
several hours
approximately
of
the ratio
of resistors
in
the oven
the controller
loop
The
as the
change in
thermistor
heater
temperature divided
temperature,
the
heater. This gain
and
in the 10B11A/B
gain
is
defined as
divided by
resulting
the
mechanical gain
of the structure,
the location
thermistor location. The
and
both
and can
greater
thermal
the controller
be
no
that the
than the
gain
larger
than the smaller of
controller loop
desired thermal
equals the mechanical
the 10811A/B,
to be 100
Therefore,
to locate
the mechanical
be greater
heater
crystal
on
a trial-and-error
gain
is
obtained. If
occurs,
this
that
two heaters,
the two heater
physically
prototype
initially
in
the
aluminum
fine
to
10,000.
times
winding
This fine
R2 and
since
the
desired minimum
with
the controller
the heaters, thermis-
gain
than 1O00.
is
the only source
and
thermistor must
later in
may change
the above
adjusting
transistors achieves
moving
the thermistor
10811A/B
locate
to
oven housing.
tune the oven
tuning was
R3
cavity, two loop
gain (partially
controller loop
temperature
assuming the
can easily
Oscillator it is
the
change
in
change in
is a function
of
of the
difference
is
that thermal
gain
loop
and
gain
gain,
the controller
de-
to
the crystal,
be
basis until
the
the design a
the thermal
process
the
would
ratio
or
Oscillator,
the
sev-
thermistor,
After
to a thermal
done by
(Fig.
10). Later,
when
design
R3 was
thermal
crystal for
1000.
Mechanical
A combination
cept is used
printed
KaptonTM
fiberglass
mechanical
in
the flexible
tially
is
cut-away
boards
are
cut with a
While
boards
the conventional
During
quired
connector, the
of
the
oven are all inherently
flexible
Acknowledgments
We
ager for
of
valuable
References
1. R.
Using
Frequency
2. R. Burgoon
lator using
Frequency
more oscillators
identical
used.
No further
gain
of these
all
of these
to
the
were
constructed
prototype,
attempts
other
ovens.
ovens
was measured
Aspects
rigid-flexible
in
the 10811A/B
circuit
board is
and
copper laminate
stiffener.
support
laminate.
part
of a single large
constructed
The
stiffener
since all
Since
sheet,
tabs temporarily
to the remaining
pair
still
connected
are loaded
support board.
of side
to the
with
components
cutters
support board,
manner.
the assembly
interconnect
to
procedure,
any ofthe fourrigid
oven controller
interconnected
printed
would like
the
technical
Burgoon
circuit
board concept.
to
thank Mike Fischer,
Precision
Frequency
consulting.
and R. Wilson,
"Design Aspects
the SC Cut Crystal," Proc.
Control,
the
Control,
pp
411-416,
and R. Wilson,
SC
Cut Crystal,"
pp
406-410,
"Performance
Proc.
the
same ratio
were
made to
The
thermal
printed
Oscillator
of a flexible
cemented to a
is required
traces and
the stiffener
possible
it
is
connecting
Later
to release
and wave-soldered
no hand wiring is
board, and
Sources
33rd Annual
1979.
33rd Annual
1929.
using
a mechanical
R2
of
optimize
gain
to
greater
to be
circuit board
(see page
26). The
five-layer
standard G10
only for
pads
are
contained
boards are ini-
to leave
individual
the
on, these tabs
boards.
the
individual
the
boards. The
the two boards in
with
this
R&D
section man-
group,
of an
for
Oscillator
Symposium on
Results
of an
Symposium on
and
the
the
than
con-
small
in
re-
edge
rigid-
his
Oscil-
28 newrEn-pncKARD JouRNAL t\,4ABcH 198i
Norwegian and Spanish
speaks
genealogy
and
Robert Burgoon
J.
Burgoon is
Rob
1081 1A/B
BSEE
degree
Polytechnic University
State
and his MSEE degree
Obispo
from
Californra
With
Jose
project
Oscillator
in
1968
State University
HP
since
as design engineer
for
group
IEEE, has
ticles, and
pending patents
Virginia,
ter, and
precision
several
products
authored
is listed as an
Rob
lives
and enjoys
He's a member of the
Born in Norfolk,
is
married,
in
San Jose, Calitornia
vol eyball,
leader
He
received
from
California
at
he's
1970,
project
and
frequency
papers
four
invenlor
has a daugh-
racquetball,
for
the
his
San Luis
in 1970
at San
served
leader
sources
ar-
and
two
on
He
L. Wilson
Robert
Bob Wilson
electrical
science
fromthe
ing HP
crystal oscillator
1
081
aging
now
precision
for
has
received his
engineering
in 1973 and
University
he
in 1975,
oven,
project,
1 A/B
production
system
for the 1081
engineering
frequency
co-authored
and computer
his MSEE
of Santa Clara
designed
worked on
designed
and
papers
two
SC-cut crystal oscillator
Bob
patent
grew
up
He lives in Santa
and enloys
making
and one
in
inventor on one
patent
Bay, Oregon
Coos
Clara, California
ing, sailing, and
BS
degree
in 1975
Join-
precision
a
a new
He's
1A,/B
supervisor
sources
the
on
is
and
named
pending
Corvallis
scuba div-
furniture
in
the
Bob
and
FREOUENCY STABILITY
LONG TERM
<.1x10
SHORT TERM:
AveragingTime Siability
ENVIRONMENTAL
TEMPEFTATURE:
7'l'C range
OPEFIATING
STORAGE:
LOAD:
change
POWER SUPPLYj
RIPPLE:
OVEN:
GFAVITATIONAL
MAGNETIC
HUMIOITY
SHOCK
ALTITUDE
WARMUP:
Notes l and 2
ADJUSTMENT:
COARSE
ELECTRONIC
OUTPUT:
FFIEQUENCY: 10
VOLTAGE:
(Aging
Rate):
tlyear
for
continuous operation.
Reler to tables below
Time Domain Stability
' fsecondsl
e
"
10
ro2 1srto
10 5,10
A 1t
10" 5.10
1 1t
10'
c
10- 1.10
<5x10
(survrval):
-5
Vdc to
15.10
1
5'10
SENSITIVITY:
<q
5x 10-9 over a
55"C to +71'C
-55"C
to
10
tor a r'10% chanqe in so.ohm
load
in 1-ko
<2xto-10
<
90 dBc spurs
'"
tor
1 / 10-
FIELD:
FIELD: <-90
(typical):
1x1O 9 for 95% RH at
g,
30
(typical):
2x10 v for O lo 5O,OOOJt
1O min. after turn-on
FHEOUENCY RANGE:
FREQUENCY CONTROL
+5 Vdc
MHz
t0 05
0 55
(see
definition
<5xtO
ol terms)
1o/day
after 24-hour warm-up
Frequency Domain
for a
>t1x10
-55'C
170
sinewave.
5x1O-Y of
Oliset trom Signal
r
[Hz]
roo
1 ot
to?
ro3
toa
to 71"C ranqe
load
change in oscillator
voltage.
(turn.over).
to 0 1 millitesla
4O'C
final value, at
6
(i1o
(EFC):
Hz) with
>1 x
10-'
1V rms t2o7o, inlo
(i)
,r.,
I
-ln
"
11
-1t
-
-
-
-
11
+85"C
from 10 mV rms ripple on o$illalor supply
'10o6
change in oven supply
<4x
10 v for 29 static shift
dBc sidebands due
1 1 ms, 1/2
within
v rms Into 50 ohms
SPECIFICATIONS
HP Model
See Note
Stability
Phase Noise
c1t;
laadr
-90
<z
t0 9 over a O'C
5x
10
-:5xto
supply voltage
voltage at 100 Hz
gauss)
(1
rms
25'C and 20
18
turn control.
(1
Hz) total, control
1k ohms
10811A/B
1
Ratio
F7l
120
r4o
1s7
160
t25"k
10( a
at 100 Hz
Vdc
range
Crystal Oscillator
HARMONIC DISTORTION:
SPURIOUS
bands
POWER REOUIREMENTS;
OSCILLATOR
OVEN
drops
CONNECTORS:
1
081
1
081
Inc
SfZE:72
WEIGHT: 0
PRICES
to
DEFINITION OF
LONG-TEBM
the
duce
changes due
TIME DOMAIN
quency
width
FREQUENCY DOMAIN
signal
a spectrum
See
See
NOTES:
1
2 Final
MANUFACTURING OIVISION:
PHASE I\{ODULATION:
10 Hz to 25
CIRCUIT:
to a typical
1 A: Mates with CINCH
1 B: Solder terminals
#700156
mm x 52 mm
IN U.S.A.:
fractional
the etfects
is 100 kHz
ratio
"NBS-Monograph
For
oscillator
value
kHz)
CIRCUIT:
20 to 30
value ol 2 OW
or equival6nt
x
(11
31 kg
oz)
Ouantities
1-4
5-9
'lo-24
25-49
TERMS:
FREOUENCY STABILITY
lrequency change
of
to environmental
STABILITY
fluctuations due
per
Hz of bandwidth
analyzer display
off-trme less than
is delined
more than 25 dB
Down
Down more than
11
135 Vdc 30
Oto
Vdc; turn-on
250-1 5-30-21
and SMB
62 mm
random noise
or(z)
to
STABILITY
1 40" tor measurement
as frequency 24
load is
at 25'C in still air
(HP 1
0
Snap-on connectors
(not
supplied)
(2-13116
in x 2-'ll32in
108114
$800
$768
$736
5672
is delined as
with time
to an
elfects must
is
as the
detined
noise in the oscillator'
random
is defrned as
power
(a
carrler versus
of the
24 hours
SANTA CLARA
5301 Stevens
Santa
hours atter turn'on
Clara. CA
An observation
insignificanl
spectral
Creek Boulevard
from output
100 dB
mAtypical
be considered
details
DIVISION
40 mA
42
minimum
ohms
with 20
-01
60) or equivalent
251
Mates
x
2'71'16
the absolute
value is implied
twGsample
the single sideband
density)
phas€
either
A
95050 U S
from output
Vdc applied
time sufficiently
separately
(discrete side-
max
Steady-stale
(not
with Cablewave
14
in,
cu
1081'18
$900
$864
$828
$756
(magntude) ot
value
lractional
of
deviation
measurement
The
ph6e
ratio is analogous
This
modulation
power
supplied)
Systems,
in)
long to
Frequency
band-
noise-to-
sideband
re-
fre-
to
1981 iEWLETT,PACKARD JOURNAL
MARCH
29
New Temperature
Probe
Locates
Circuit
Hot
Use
some
Spots
it
with
any
HP
oscilloscopes
general-purpose
get
to
digital multimeter
readings
Celsius.
by
Marvin F. Estes
r
AST,
ACCURATE
are
F
I
new Model 10023A
to
temperature
Celsius
having
pencil-like
press-to-read
a
The
transducer with a
small ceramic
output of
each diode
grated-circuit
match each diode to its electronic compensating
The use
the entire electronics assembly,
packaged
output connector
ters including
tion 034/035
Measurement
from 0{)
-55T
cation
For
needed
nostic, and
provide
these measurements.
measurements
on any
input
an
probe
probe
is
substrate
1 mV/"C is
in
a
resistor
Hewlett-Packard
of
in
the
the
1700
+100"C
to
+4"C,
and
to
is
traceable
applications requiring relative rather
Fig. 1.
Model 10023A Temperature
tions of surf ace temperatures on many
tal multimeters and HP 17O0 Series ODtion O34lO35 Oscillo-
scopes.
and Donald
TEMPERATURE
in
a wide variety
testing applications. Hewlett-Packard's
Temperature Probe (Fig.
are
general-purpose
impedance
tip easily accesses
switch
a self-contained temperature-to-voltage
forward-biased
assured
precision
probe
is
compatible
built-in DMMs
Series Oscilloscopes.
accuracy of the temperature
-ztl
to the U.S.
of 10 megohms
makes measurements
in
the
by individually
thermal
network is then laser trimmed to
barrel. A
decreasing linearly
+150f. This
at
National Bureau
Zimmer,
of thermal design,
With
read directly in
digital multimeter (DMM)
small components
diode chip bonded to a
probe
integrated circuits
including
standard
A calibrated,
tip.
reference
with
most digital
Hewlett-Packard's Op-
on
Probe
general-purpose
Jr.
measurements
1) is
probe,
the
or more. The
easy.
characterizing
bath.
the battery, to be
dual banana
probe
12",
to
accuracy specifi-
of Standards.
than absolute
gives
and
directly in degrees
diag-
designed
surface
degrees
and
linear
An inte-
circuit.
permits
plug
voltme-
tZtl
is
-4t
at
fast indica-
digi-
Output
temperature
temperature
probe
Thermal
ceramic tip-
(watt-seconds/"C)
Thermal
from
outside ot tip
to
diode on inner side
of ceramic tip
Thermal resistance
trom
iunction
("C/W)
case
Transistor
Flg.2.
ing
measurement
short-term
By using
mass and a
surement surface
10023A
heating
conditions. This design
surements
Very fine
used for
pensating
This thermal isolation
tip to act as a heat
measured surface temperature. Minimum disturbance of
the operating environment by
portant
electronic components are needed.
The
electrically isolated
'HP
Application Note
ot
("C)
capacity
when accurate
ot
resistance
("C/W)
to
case
Sinplitied
the temperature
of
similar temperatures, the
repeatability
a temperature
geometry
(approximately
make measurements
can
cooling in
or
with very
wires, approximately 0.1.0 mm in
connecting the diode
circuits to achieve
263 contains typical
Vou,
R2
electrical analog of the
of a transistor with
10.3"C.
of
sensor
places
that
devices operating
also
low
thermal
reduces the tendency for the
sink or cooling fin and change the
temperature measurements of small
probe
with very
it very close to the mea-
0.25 mm or 0.010
quickly
permits
gradient
sensor to
very
probe
the
tip
performance
Temperature
probe
tip
Thermal resistance
trom
diode
wires
temperature
Ceramic tip
Temperature
intertace
case and
probe
Thermal
package
of
being
(watt-seconds/"C)
Heat
source
problem
probe
a
and
under
temperature
errors.*
the electronic com-
high thermal isolation.
particularly
is
permits
characteristics
measurements
along
to ambient
("C/w)
probe
of
at
of transistor
tempetature
("C/W)
capacity
measured
(watts)
of measur-
probe
has a
low thermal
in),
the
closely track
varying
diameter,
load
mea-
are
probe
im-
30 rrwlrrr-pncKARD
JoURNAL I\4ARCH 1es1
assembly
These
are
obvious
should
state,
temperature
loading.
stant
ature
the transistor
transistor
stants,
Probe Circuit
100234
the
Fig. 3. Simpllfied
Probe.
non-grounded
of
its collector
transistor
tip-to-ground
electrical
cuits.
The
does
adjustments.
repaired
pensating network.
Tip
especially
srnall
Therefore
centered
is
large, even
Iong time
temperature
capacity
alumina
chip
the
thermal
plastic barrel
the circuitry.
tance
t
This
resistance,
long a
this
divider
ambient.
thickness
resistance
This
the thermal
and
minimized
to
with
capacitance
loading
temperature
require
not
In
a new,
with
Heat Characteristics
The tip
Three
the
is the
one
objects
HP 10023A
the
around the
heat characteristics
thermal
(0.25
alumina.
Another
from the
is important
time constant
resistance
The third
is important
thereby
probe
the
capacity
if there are
reach a stable
to
of a small
low, the
2 mm
xO.25xO.O2
The alumina
capacity.
and
important
like too
the
with
The tip
the
of
important
from the
resistance
affect
by using
circuits
like transistors,
in diameter
schematic
components
thermal
when
probe is calibrated
periodic calibration.
event
the
precalibrated
important
most
designed
temperature
development
of
no
10023,{
mm)
A small
wires that
the
characteristic
measured
for two
much
when
can affect
thermal
resistance
alumina
resistance
heat
heat
because
from the
accuracy.
#38
by
and
of
the
as
such
the
common
of
tip damage,
of
to
are
the
heat leaks,
temperature
transistor.
tip
by 0'25
is bonded directly
contributes
amount
body to the
reasons.
thermal
a measurement
the
was minimized
substrate
sensor
it can act
AWGcopper
using
to
approximately
probing
There
and matching
tip
part
a temperature
of
measure
particularly
probe
is constructed
accuracy
characteristic
measured
the
diodes
probe's
a tip.
of
If the capacity
tip.
the
when
To keep
mm thick,
essentially
is added
connect
is the thermal
sensor
First, too
capacity,
from the
0.25
to
(diode
as a
resistance
This
wires
plastic barrel
a
Temperature
case of
case.
in high-speed
at
the
and
probe will
the
is
by acting
chip)
heat divider
body
a
very low
A
pF
0.5
factory
the
internal
no
are
probe is easily
temperature
packages'
IC
development
important.
measuring
thermal
the
piece of
a
of
and the
to the
all of
by
the
diode
or diode
much thermal
produces too
Second,
taken.
as
heat sensors
by reducing
mm'
is the
ambient'
to
to the
effect
from the
to hold
power
avoids
cir-
and
com-
probe,
of
One
is
too
take
the
diode
back
the
black
chip
resischip.
a heat
the
thermal
with
sensor
was
diode
the
very
chip
voltage across
where
through
Now,
Errors arise
and
error
shown
are the
the
temperature
ing
characteristics
Using this
a
ulator
and
calibrated
probe
calibration
of
or
calibration.
to
that
silver-oxide
The
to
together.
various thermal
in
shovm
R6
will be affected.
probe is touched
simplified
in the steady
that
be high
R1C1 and
to
the source
of
of the
C1 should
will be lowered
can charge
provide
transistor
be
RaCa.
Design
10023,t
The circuit of
simple.
as one
Consider
K1
the
if io is constant
because
curve
in
The temperature
power
microcircuit,
phase
one
in
laser trimmed.
tip
variable components,
All
the
of
measures
battery,
Fig.4. Typical
variations
the
It
consists
The temperature
leg.
one of
simple
the
K2 are constants,
and
and
diode,
because
of the
Fig.
information
the
matched
and substrate,
of the
probe
we do not
the simple
voltage out of
4.
probe's
supply
and
sensing
manufacture
of
each
of
microcircuit,
The microcircuit
probe and they
electronics
by 61 mm.
10
battery
which
(
shaded
capacities
elechical
state
good
should
much less
can
One
hot transistor
to a
capacitor
Temperature
bridge
of a
middle
the
diode
:
K1E-K2VD/T
IO
Vp is
T : Ks
then
diode
three
(battery),
probe
the
on the small
diode
individual
plus
the
pair.
Since
contain
probe
the
located on
nominal
has a
error
100234
band)
thermal
and
form
analog
R1 should
accuracy.
be much
be lowered
will
than C4
also see that
until the
C1. There
be low
Also
less than
or the
if
temperature
the
heat source
a-re two
Probe
with the sensor
is measured
resistors.
equation
forward current
is
io
the
voltage across
the
Vp, where
have a
equation
the
main
alumina
the
tip,
temperature-vs-current
the
value
the
resistor
these two
all
contain
does
are on
Power comes
the
curve
K3 is a constant.
perfect
is not exact'
temperature
circuit
which contains
ceramic
diode
of the
values are calculated
probe
and
components,
the circuits
no user
require
not
printed circuit
a
printed circuit
voltage of
possible
with
resistances
It is
Fig. 2.
in
R2
and
in
steady
the
R,
the
or
by thermal
con-
time
temper-
a cold
of
the
of
time con-
(Fig.
by sensing
the
current
components
substrate
chip.
are measured.
voltage
tip
that
adjustable
from a
3)
diode
the
diode.
source
The
probe is
with
Dur-
reg-
are now
affect
periodic
board
zincl
board'
is
1.5V,
unitlo-unit
is
the
the
a
a
MARCH
HEWLETT PACKABD
1981
.louRlar
31
years,
he's
latest
married, has
developed a trio
being
100234 Born
the
four
children, and
Colorado with a variety
goats
Besides
plications
Minnesota,
of
terests are
low-cost,
hearing
hours
of
Since
animals,
random walk
of
Don is
skiing,
tennis,
commercially
aids
and wristwatches.
probe
operation.
probe
the
electronics
housed in a plastic
Marvin F.
Estes
Marvin Estes received his
in
from
1965
MSEE
Technology.
graduate
and North
Before
magnetic
storage
tics
and
member
paper
named
way
of
As an
voltage
of
Purdue
in
1966 from
He's
work
Colorado
coming
effects and capacitive
with
the U S. National
Space Administration A
IEEE,
of
on coupled striplines and
inventor
producing
HP
circuit designer
and
in Warren, Pennsylvania, Marvin is
lives
on
five
of dogs, chickens, bees,
he's
also interested in
techniques
Donafd Zimmer,
Don
f rom the
and a BA
University
Springs in 1976 He
&
and worked
gineer
ment
coming
gineer
member
gineering
thick-film
lemperature
married
and has
jogging,
available
case, the
components
Zimmer
received a BSEE
University of Minnesota in
degree in
of
Colorado at
as a
years
for five
engineer for
process
a
in
thick-film
of the
group,
microcircuits for
Probe,
two
and reading
type
provides
It
are on
a
BSEE degree
University and his
Clarkson
also done
North
at
HP, he
to
Carolina
State
College
further
Universities
worked on
Aeronau-
he's
the author of a
on a
oatent on
artificial diamonds
for
in Black
cats,
probes,
rabbits,
temperature
acres
electromagnetic ap-
Jr.
chemistry
from
Colorado
joined
HP in
production
CRT
and
as a develop-
years
two
before be-
development
R&D.
Later, as a
thick-film
product
he
developed the
the 100234
and he's now
children, Amono
commonly
used in
an average
printed
circuit board
on the
board are
State
energy
is
a new
eight
the
Forest,
and
degree
1 966
the
1969
en-
en-
en-
his in-
of S0
of
TEASUFETENT
OUTPUT: l
SHORT-TERtr
ACCUFACY:
-zrc
+4tr,
tAXltUf,
TIP CAPACITAI{CE
THERTAL
1
00rc
temp€rature
Dllll INPUT
OPEFATING
p€rature,
planas
for
OPERAnNG
humidity (non-condensing),
as lhos€
OVEFALL
WEIGHT:
net 85
BATTERY
LOW-BATTERY
cation
ol a low-battary
plob€
tip at
ACCESSORIES
(1OO23-232O1\,
PRICE
lN
U.S.A.:
precalibrated
MANUFACTURING
susceptible
protecting
charge. Because
grounded,
not
of three
coating inside
drained
prevent
instrument.
Acknowledgments
We
wish
Rick
lames
helpful
his help
SPECIFICATIONS
HP
Model
-55r
RAI{GE:
mV/$
REPEATABTLTTY:
az"C
from
0"C to 100t,
at +150r,
VOLTAGE
FESPOI{SE:
lor
LENGTH:
LIFE:
and lowered
damage
suggestions.
AT TtP:
TO
GROUND:
<3
s to
change.
>10
R:
MO
EiIVIBONilENT (Fobo
-55t
to +150qC;
'15
min
each with
ENVtBONmEilT (probc
probs
g (3
Approx
INDICAT|ON:
a constant
SUPPLIED:
and
tip and matching
to static
them
to 95y" rstativo
tip.
Appror. 1.4 m (53
oz);
shipping,
50 hr
condition
temosrature
One reptacement
probe
one
Modet 1OO23A
OIVIS|ON:
discharge.
is
the 10023A
a different
capacitors
on the circuit
plastic
the
to the
to thank Larry
for finishing
during
the
final
l00rl3A
60O V
s€nle within
altitudo, to,t60O m (15,OOO
0.38 mm
(varies
probe
tip
compensation
COLORADO
1900
P.O.
Cotorado
to offer
Temperature
to +150t.
(minimum
aO.gt
decreasing tinearly
(dc + psak
approx.
O 5
2t of final
ilp
to approx 13
(0.015
body):
Tamp€ratuE
humidity
in).
g
(
91Z
t 1
with
ambiont
output indicates
is a
dscreasing
(OOS47-4OOO5).
cover
Temperature
SpRtNGS
cardsn
ol the
Box
2197
Springs,
a
is
method
,tg
of
ac)
pF
reading
mn
in)
axcursion,
at +4Ot;
oz)
temp€ratuE).
approx
indication
(420-0256!,
battery
prob€,
gl5o.
network.
DtVtStON
Gods Road
Colorado
The
conventional
ground
a floating
had
board
housing,
through
the
probe
temperature probe
We
Gamill
it,
are also
stages
for
and
Stan Lang for
grateful
of the
probe
hr).
-4tr
to
+2tr,
(liquid
measurement tor
(0.5
tt);
Orc to
p/N
10023-60001),
8090t
prcbe
In) ftom
vibration,
vibratod
10
to SS Hz.
(battory
@rc
attitude and
-70"C
on
OMM. First
ot 1.
to 2eclminuto
one
stiding tock
Replacoment
U.S.A
method
path
for
the
inshument
to be
devised. By
and
a conductive
the
static
charge is
and inshument
and
the attached
starting
this
his
to Don
Skarke for
project.
-sst
at
flp): Tem_
timitation);
vibration
(inctudos
Tip
g65
static
and is
project,
many
and
in three
samo
indi_
with
coilar
of
use
to
a
-
Hewlett-Packard
Road, Palo
Company 1501
AIto,
Calrlornia
94304
.'*-
Page
Mill
h
o?o
,
f,R
gHAYO
P_O
i
PENSACOLA
oo32
5 03
JULIAN A
S E EHA
HARRIS':
ELECTRONICS
BOX
2807
Ri'EJAOO
"
LTD
FL
325A3
Bulk
Rate
U S Postage
Paid
Hewlett-Packard
Company
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