Ideal for Backlighting and Light
Piping Applications
• Subminiature Dome Package
Nondiffused Dome for High
Brightness
• Wide Range of Drive
Currents
• Colors: 590 nm Amber,
615 nm Reddish-Orange
• Ideal for Space Limited
Applications
• Axial Leads
• Available with Lead
Configurations for Surface
Mount and Through Hole PC
Board Mounting
Description
Flat Top Package
The HLMX-PXXX flat top lamps
use an untinted, nondiffused,
truncated lens to provide a wide
radiation pattern that is necessary
for use in backlighting applications. The flat top lamps are also
ideal for use as emitters in light
pipe applications.
Dome Packages
The HLMX-QXXX dome lamps use
an untinted, nondiffused lens to
provide a high luminous intensity
within a narrow radiation pattern.
Lead Configurations
All of these devices are made by
encapsulating LED chips on axial
lead frames to form molded epoxy
subminiature lamp packages. A
variety of package configuration
options is available. These include
special surface mount lead
configurations, gull wing, yoke
lead, or Z-bend. Right angle lead
bends at 2.54 mm (0.100 inch)
and 5.08 mm (0.200 inch) center
spacing are available for through
hole mounting. For more information refer to Standard SMT and
Through Hole Lead Bend Options
for Subminiature LED Lamps data
sheet.
Technology
These subminiature solid state
lamps utilize one of the two newly
SunPower Series
HLMA-PH00HLMT-PH00
HLMA-PL00HLMT-PL00
HLMA-QH00 HLMT-QH00
HLMA-QL00HLMT-QL00
developed aluminum indium
gallium phosphide (AlInGaP) LED
technologies, either the absorbing
substrate carrier technology (AS
= HLMA-Devices) or the
transparent substrate carrier
technology (TS = HLMTDevices). The TS HLMT-Devices
are especially effective in very
bright ambient lighting conditions. The colors 590 nm amber
and 615 nm reddish-orange are
available with viewing angles of
15° for the domed devices and
125° for the flat top devices.
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
CATHODE
0.46
(0.018)
0.56
(0.022)
0.25 (0.010) MAX.
NOTE 2
0.23
0.76 (0.030) MAX.
(0.007)
(0.009)
(0.007)
(0.009)
2.03 (0.080)
1.78 (0.070)
0.79 (0.031)
0.53 (0.021)
1.91
2.16
1.91
2.16
(0.075)
(0.085)
(0.075)
(0.085)
0.63
0.38
0.76
0.89
(0.025)
(0.015)
(0.030)
(0.035)
2.08
2.34
R.
(0.082)
(0.092)
2.08
2.34
(0.082)
(0.092)
0.94
1.24
CATHODE
STRIPE
(0.037)
(0.049)
2.92 (0.115)
MAX.
CATHODE
STRIPE
1-162
Absolute Maximum Ratings at T
= 25°C
A
HLMA-QL00/QH00/PL00/PH00
Peak Forward Current
Average Forward Current (I
DC Forward Current
[2]
........................................................... 200 mA
= 200 mA)
[3,5,6]
PEAK
........................................................... 50 mA
[1,2]
......................... 45 mA
Power Dissipation .................................................................... 105 mW
HLMT-QL00/QH00/PL00/PH00
Peak Forward Current
Average Forward Current (I
DC Forward Current
[2]
........................................................... 100 mA
= 100 mA)
[3,5,6]
PEAK
........................................................... 50 mA
[1,2]
......................... 37 mA
Power Dissipation .................................................................... 120 mW
All Devices
Reverse Voltage (IR = 100 µA) ........................................................ 5 V
Transient Forward Current (10 µs Pulse)
[5]
.............................. 500 mA
Operating Temperature Range....................................... -40 to +100°C
Storage Temperature Range .......................................... -55 to +100°C
LED Junction Temperature .......................................................... 110°C
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body .......................... 260°C for 5 seconds
SMT Reflow Soldering Temperatures
Convective Reflow............. 235°C Peak, above 183°C for 90 seconds
Vapor Phase Reflow ........................................... 215°C for 3 minutes
Notes:
1. Maximum I
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 4.
4. The transient peak current is the maximum non-recurring peak current these devices
can withstand without damaging the LED die and wire bonds. Operation at currents
above Absolute Maximum Peak Forward Current is not recommended.
5. Drive currents between 5 mA and 30 mA are recommended for best long term
performance.
6. Operation at currents below 5 mA is not recommended, please contact your HewlettPackard sales representative.
at f = 1 kHz.
AVG
1-163
CATHODE
TAB
NO. ANODE DOWN.
Figure 1. Proper Right Angle Mounting to a PC Board to Prevent Protruding Cathode Tab from Shorting to Anode
Connection.
Optical Characteristics at T
= 25°C
A
YES. CATHODE DOWN.
LuminousColor,Viewing
IntensityTotal FluxPeakDominantAngleLuminous
PartIV (mcd)φV (mlm)WavelengthWavelength2 θ
Number@ 20 mA
[1]
@ 20 mA
[2]
λ
peak
(nm)λ
[3]
(nm)Degrees
d
1/2
[4]
Efficacy
HLMA-Min. Typ.Typ.Typ.Typ.Typ.(lm/w)
QL0013550025059259015480
QH0013550025062161515263
PL002375250592590125480
PH002275250621615125263
HLMT-
QL00300 80059259015480
1000
QH0029080080062161515263
PL0046150800592590125480
PH0035120800621615125263
[5]
η
v
Notes:
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern
may not be aligned with this axis.
2. φv is the total luminous flux output as measured with an integrating sphere.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.
4. θ
is the off-axis angle where the liminous intensity is 1/2 the peak intensity.
1/2
5. Radiant intensity, Iv, in watts/steradian, may be calculated from the equation Iv = Iv/ηv, where Iv is the luminous intensity in candelas
and ηv is the luminous efficacy in lumens/watt.
1-164
1.0
0.5
RELATIVE INTENSITY
0
550594 600650700
Figure 1. Relative Intensity vs. Wavelength. All Devices.