HP HLMA-DL00, HLMA-KH00, HLMA-KL00, HLMA-CH00, HLMA-CL00 Datasheet
...
1-37
H
Description
These untinted, non-diffused, solid
state lamps utilize the latest
absorbing/transparent substrate
aluminum indium gallium phosphide (AS/TS AlInGaP) LED technology. These materials have a very
high luminous efficiency, capable
of producing high light output over
a wide range of drive currents. In
addition, these LED lamps are at
wavelengths ranging from amber
to reddish orange and at viewing
angles ranging from 7 to 45
degrees.
Features
• Outstanding LED Material
Efficiency
• High Light Output over a
Wide Range of Currents
• Low Electrical Power
Dissipation
• CMOS/MOS Compatible
• Colors: 590/592 nm Amber,
615/617 nm and 622 nm
Reddish-Orange
• Variety of Packages Available
Applications
• Outdoor Message Boards
• Safety Lighting Equipment
• Signaling Applications
• Emitter for Emitter/
Detector Applications
• Changeable Message Signs
• Portable Equipment
• Medical Equipment
• Automotive Lighting
• Alternative to Incandescent
Lamps
SunPower Series
HLMA-CX00 Series
HLMA-DX00 Series
HLMA-KX00 Series
HLMT-CX00 Series
HLMT-DX00 Series
T-13/4 (5 mm), T-1 (3 mm), High
Performance AlInGaP LED
Lamps
Technical Data
5963-2323E
1-38
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE MILD STEEL, SOLDER DIPPED.
3. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 MM (0.040")
DOWN THE LEADS, UNLESS OTHERWISE NOTED.
Package Dimensions
0.89 (0.035)
0.64 (0.025)
6.10 (0.240)
5.59 (0.220)
5.08 (0.200)
4.57 (0.180)
25.40
(1.00)
MIN.
0.102 (0.004)
MAX. TYP.
1.27
(0.050)
NOM.
9.19 (0.362)
8.43 (0.332)
2.54
(0.100)
NOM.
0.46
(0.018)
SQUARE
NOMIMAL
CATHODE
LEAD
NOTE 1
A
B
3.18 (0.125)
2.67 (0.105)
25.40
(1.00)
MIN.
1.27
(0.050)
NOM.
1.02
(0.040)
6.35 (0.250)
5.58 (0.220)
0.45
(0.018)
SQUARE NOMINAL
CATHODE
2.54
(0.100)
NOM.
NOM.
4.70 (0.185)
4.19 (0.165)
3.43 (0.135)
2.92 (0.115)
C
0.89 (0.035)
0.64 (0.025)
6.10 (0.240)
5.59 (0.220)
5.08 (0.200)
4.57 (0.180)
23.0
(0.90)
MIN.
1.65 (0.065)
1.35 (0.053)
1.27
(0.050)
NOM.
9.19 (0.362)
8.43 (0.332)
2.54
(0.100)
NOM.
0.64
(0.025)
SQUARE
NOMIMAL
CATHODE
LEAD
12.70 (0.500)
11.94 (0.470)
1-39
Absolute Maximum Ratings at T
A
= 25°C
(T-13/4 Package)
DC Forward Current
[1,4,5]
........................................................... 50 mA
Peak Forward Current
[2]
........................................................... 200 mA
Time Average Input Power
[2]
................................................... 103 mW
Transient Forward Current
[3]
(10 µs Pulse) .............................. 500 mA
Reverse Voltage (IR = 100 µA)......................................................... 5 V
Operating Temperature Range .......................................... -40 to 100°C
Storage Temperature ......................................................... -40 to 120°C
Junction Temperature ................................................................. 130°C
Soldering Temperature .......................................... 260°C for 5 seconds
[1.59 mm (0.06 in.) below seating plane]
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the
Max Allowable Time Average Power as specified in Figure 5.
3. The transient peak current is the maximum nonrecurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive Currents between 10 and 30 mA are recommended for best long term
performance.
5. Operation at currents below 10 mA is not recommended, please contact your
Hewlett-Packard sales representative.
Absolute Maximum Ratings at T
A
= 25°C (T-1 Package)
DC Forward Current
[1,4,5]
........................................................... 50 mA
Peak Forward Current
[2]
........................................................... 200 mA
Time Average Input Power
[2]
................................................... 103 mW
Transient Forward Current
[3]
(10 µs Pulse) .............................. 500 mA
Reverse Voltage (IR = 100 µA)......................................................... 5 V
Operating Temperature Range .......................................... -40 to 100°C
Storage Temperature ......................................................... -40 to 100°C
Junction Temperature .................................................................. 110°C
Solder Temperature ................................................260°C for 5 seconds
[1.59 mm (0.06 in.) below seating plane]
Notes:
1. Derate linearly as shown in Figure 4.
2. Any pulsed operation cannot exceed the Absolute Max Peak Forward Current or the
Max Allowable Time Average Power as specified in Figure 5.
3. The transient peak current is the maximum nonrecurring peak current the device can
withstand without damaging the LED die and wire bonds.
4. Drive Currents between 10 mA and 30 mA are recommended for best long term
performance.
5. Operation at currents below 10 mA is not recommended, please contact your
Hewlett-Packard sales representative.
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