HP HFBR-5302, HFBR-5301 Datasheet
Fibre Channel 133 MBd and
266 MBd Transceivers in Low
Cost 1x9 Package Style
Technical Data
HFBR-5301 133 MBd
HFBR-5302 266 MBd
Features
• Full Compliance with ANSI
X3T11 Fibre Channel
Physical and Signaling
Interface
• Multisourced 1x9 Package
Style with Duplex SC
Connector
• Wave Solder and Aqueous
Wash Process Compatibility
• Compatible with Various
Manufacturers FC-0 and
FC-1 Circuits
Applications
• Fibre Channel 12.5 MB/s
12-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
• Fibre Channel 25 MB/s
25-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
Description
The HFBR-5301 and HFBR-5302
Fibre Channel Transceivers from
Hewlett-Packard provide the
system designer with products to
implement Fibre Channel designs
for use in multimode fiber (MMF)
applications. These include the
12.5 MB/sec 12-M6-LE-I interface
and the 25 MB/sec 25-M6-LE-I
interface for 1300 nm LED links.
The products are produced in the
new industry standard 1x9 SIP
package style with a duplex SC
connector interface as defined in
the Fiber Channel ANSI FC-PH
standard document.
The HFBR-5301 is a 1300 nm
transceiver specified for use in
133 MBd, 12.5 MB/s, 12-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
multimode fiber-optic cables.
The HFBR-5302 is a 1300 nm
transceiver specified for use in
266 MBd, 25 MB/s, 25-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
multimode fiber-optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5301 and HFBR-5302
utilize 1300 nm InGaAsP LEDs.
These LEDs are packaged in the
optical subassembly portion of
the transmitter section. They are
driven by a custom silicon IC
which converts PECL logic
signals, into an analog LED drive
current.
Receiver Sections
The receiver sections of the
HFBR-5301 and HFBR-5302
utilize InGaAs PIN photo diodes
coupled to a custom silicon
transimpedance preamplifier IC.
These are packaged in the optical
subassembly portion of the
receiver.
These PIN/preamplifier combinations are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The Data output is
differential. The Signal Detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL referenced (shifted) to a +5 volt
power supply.
Package
The overall package concept for
the HP Fibre Channel transceivers consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
with integral duplex SC connector interface. This is illustrated in
the block diagram in Figure 1.
5963-5608E (3/95)
215
DATA OUT
SIGNAL
DETECT
OUT
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
PREAMP IC
DUPLEX SC
RECEPTACLE
PIN
OPTICAL
SUBASSEMBLIES
The electrical subassembly consists of a high volume multilayer
printed circuit board to which the
IC chips and various surfacemount passive circuit elements
are attached.
DATA IN
DRIVER IC
TOP VIEW
LED
Figure 1. Block Diagram.
The package outline drawing and
pin out are shown in Figures 2
and 3. The details of this package
maximum height allowed for the
duplex SC connector over the
entire length of the package.
outline and pin out are compliant
with the multisource definition of
the 1x9 single in-line package
(SIP). The low profile of the
Hewlett-Packard transceiver
design complies with the
39.12
(1.540)
25.40
MAX.
(1.000)
HFBR-5XXX
DATE CODE (YYWW)
H
SINGAPORE
+ 0.08
0.75
3.30 ± 0.38
(0.130 ± 0.015)
23.55
(0.927)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. Package Outline Drawing.
(0.030
20.32
(0.800)
- 0.05
+ 0.003
)
- 0.002
[8x(2.54/.100)]
10.35
(0.407)
0.46
(0.018)
NOTE 1
(0.034)
2.92
(0.115)
(9x)ø
16.70
(0.657)
0.87
MAX.
23.24
(0.915)
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
4.14
(0.163)
12.70
(0.500)
AREA
RESERVED
FOR
PROCESS
PLUG
1.27
(0.050
+ 0.25
- 0.05
+ 0.010
- 0.002
NOTE 1
17.32
(0.682)
)
20.32
(0.800)
MAX.
18.52
(0.729)
15.88
(0.625)
12.70
(0.500)
23.32
(0.918)
The package includes internal
shields for the electrical and
optical subassemblies to insure
high immunity to external EMI
fields and low EMI emissions.
The outer housing, including the
duplex SC connector, is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts are isolated from the circuit
design of the transceiver, while
they can be connected to a
ground plane on the circuit
board, doing so will have no
impact on circuit performance.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the transceiver by mating with the duplex
SC connectored fiber cables.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your local
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
216
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
Figure 3. Pinout Diagram.
N/C
N/C
TOP VIEW
Compatibility with Fibre Channel FC-0/1 Chip Sets
The HFBR-5301 and HFBR-5302
transceivers are compatible with
various manufacturers FC-0 and
FC-1 integrated circuits. Evaluation boards, which include the
Hewlett-Packard transceivers, are
available from these manufacturers. The Applications Engineering
group in the Hewlett- Packard
Optical Communication Division
is available to assist you with
implementation details.
Transceiver Optical Power Budget vs. Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
The area under the curves
8
7
6
5
HFBR-5302, 62.5/125µm
4
3
2
HFBR-5302, 50/125µm
1
OPTICAL POWER BUDGET – dB
0
021.5
FIBER OPTIC CABLE LENGTH – km
Figure 4. Optical Power Budget vs.
Fiber Optic Cable Length.
HFBR-5301, 62.5/125µm
HFBR-5301,
50/125µm
0.5
1
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
losses.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging characteristics than normally associated
with these technologies in the
industry. The industry convention
is 1.5 dB aging for 1300 nm
LEDs. The HP LEDs will experience less than 1 dB of aging over
normal commercial equipment
mission life periods. Contact your
Hewlett-Packard sales representative for additional details.
Figure 4 was generated with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the Fibre
Channel optical parameters.
These parameters are reflected in
the specified performance of the
transceiver in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
X3T9.5 committee, to establish
the optical performance requirements for various fiber-optic
interface standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecommunications Cabling Standard
per SP-2840.
Transceiver Signaling Operating Rate Range and BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
encode the data (symbols/bit).
The specifications in this data
sheet have all been measured
using the standard Fibre Channel
symbol rates of 133 Mbd or
266 MBd.
The transceivers may be used for
other applications at signaling
rates different than specified in
this data sheet. Depending on the
actual signaling rate, there may
be some differences in optical
-2
1 x 10
-3
1 x 10
-4
1 x 10
-5
1 x 10
-6
1 x 10
-7
1 x 10
BIT ERROR RATE
-8
1 x 10
-9
1 x 10
-10
1 x 10
-11
1 x 10
-12
1 x 10
-6 20
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 133 & 266 MBd
2. PRBS 2
3. CENTER OF SYMBOL SAMPLING
4. T
5. V
6. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
Figure 5. HFBR-5301/5302 Bit Error
Rate vs. Relative Receiver Input
Optical Power.
= 25 °C
A
= 5 V
CC
-4
-2
7
-1
DC
217
power budget to do this. This is
primarily caused by a change of
receiver sensitivity.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
Transceiver Jitter Performance
The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system jitter
allocations stated in FC-PH
Annex A.4.3 and A.4.4.
The HP 1300 nm transmitters will
tolerate the worst case input
electrical jitter allowed, without
violating the worst case output
optical jitter requirements.
The HP 1300 nm receivers will
tolerate the worst case input
optical jitter allowed without
violating the worst case output
electrical jitter allowed.
The jitter specifications stated in
the following tables are derived
from the values in FC-PH Annex
A.4.3 and A.4.4. They represent
the worst case jitter contribution
that the transceivers are allowed
to make to the overall system
jitter without violating the
allowed allocation. In practice,
the typical contribution of the HP
transceivers is below these
maximum allowed amounts.
Recommended Handling Precautions
Hewlett-Packard recommends
that normal static precautions be
taken in handling and assembly
of these transceivers to prevent
damage and/or degradation which
may be induced by electrostatic
discharge (ESD). These transceivers are certified as MIL-STD-
These transceivers are compatible with industry standard wave
and hand solder processes.
883C Method 3015.4 Class 2
devices.
Shipping Container
The transceiver is packaged in a
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground.
Solder and Wash Process Compatibility
The transceivers are delivered
with a protective process plug
inserted into the duplex SC
connector receptacle. This
process plug protects the optical
subassemblies during wave solder
and aqueous wash processing and
acts as a dust cover during
shipping.
NO INTERNAL CONNECTION NO INTERNAL CONNECTION
HFBR-530X
TOP VIEW
Rx Rx Tx Tx
V
RD RD SD VCCVCCTD TD V
EE
123456789
C1 C2
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 ohms.
R2 = R3 = R5 = R7 = R9 = 82 ohms.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 6. Recommended Decoupling and Termination Circuits.
V
CC
R5 R7
R6 R8
C6
RD RD SD V
L1 L2
C3 C4
VCC FILTER
AT V
CC
TRANSCEIVER
R9
R10
PINS
CC
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout – Decoupling
Circuit and Ground Planes
You should take care in the layout
of your circuit board to achieve
optimum performance from these
transceivers. Figure 6 provides a
good example of a schematic for
a power supply decoupling circuit
that works well with these parts.
Hewlett-Packard further recom-
mends that a contiguous ground
EE
V
CC
R2 R3
R1 R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
TD TD
218
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