HP HFBR-5105T, HFBR-5105, HFBR-5104T, HFBR-5104, HFBR-5103T Datasheet
...
126
5965-9727E (5/97)
FDDI, 100 Mbps ATM, and
Fast Ethernet Transceivers
in Low Cost 1x9 Package Style
Technical Data
Description
The HFBR-5100 family of transceivers from Hewlett-Packard
provide the system designer with
products to implement a range of
FDDI and ATM (Asynchronous
Transfer Mode) designs at the
100 Mbps/125 MBd rate.
The transceivers are all supplied
in the new industry standard 1x9
SIP package style with either a
duplex SC or a duplex ST*
connector interface.
FDDI PMD, ATM and Fast
Ethernet 2000 m Backbone
Links
The HFBR-5103/-5103T are
1300 nm products with optical
performance compliant with the
FDDI PMD standard. The FDDI
PMD standard is ISO/IEC 9314-3:
1990 and ANSI X3.166 - 1990.
These transceivers for 2000 meter
multimode fiber backbones are
supplied in the small 1x9 duplex
SC or ST package style for those
designers who want to avoid the
larger MIC/R (Media Interface
Connector/Receptacle) defined in
the FDDI PMD standard.
Hewlett-Packard also provides
several other FDDI products
compliant with the PMD and SMPMD standards. These products
Features
• Full Compliance with the
Optical Performance
Requirements of the FDDI
PMD Standard
• Full Compliance with the
FDDI LCF-PMD Standard
• Full Compliance with the
Optical Performance
Requirements of the ATM
100 Mbps Physical Layer
• Full Compliance with the
Optical Performance
Requirements of
100 Base-FX Version of
IEEE 802.3u
• Very Low Cost 800 nm
Alternative with FDDI and
ATM Compliant Signaling
• Multisourced 1x9 Package
Style with Choice of Duplex
SC or Duplex ST*
Receptacle
• Wave Solder and Aqueous
Wash Process Compatible
• Manufactured in an ISO
9002 Certified Facility
Applications
• Multimode Fiber Backbone
Links
• Multimode Fiber Wiring
Closet to Desktop Links
• Very Low Cost Multimode
Fiber 800 nm Links from
Wiring Closet to Desktop
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
HFBR-5103/-5103T
1300 nm 2000 m
HFBR-5104/-5104T
800 nm 500 m
HFBR-5105/-5105T
1300nm 500 m
are available with MIC/R, ST© and
FC connector styles. They are
available in the 1x13 and 2x11
transceiver and 16 pin
transmitter/receiver package
styles for those designs that
require these alternate
configurations.
The HFBR-5103/-5103T is also
useful for both ATM 100 Mbps
interfaces and Fast Ethernet 100
Base-FX interfaces. The ATM
Forum User-Network Interface
(UNI) Standard, Version 3.0,
defines the Physical Layer for
100 Mbps Multimode Fiber
Interface for ATM in Section 2.3
to be the FDDI PMD Standard.
Likewise, the Fast Ethernet
Alliance defines the Physical
Layer for 100 Base-FX for Fast
Ethernet to be the FDDI PMD
Standard.
Note: The “T” in the product numbers
indicates a transceiver with a duplex ST
connector receptacle.
Product numbers without a “T” indicate
transceivers with a duplex SC connector
receptacle.
127
ATM applications for physical
layers other than 100 Mbps
Multimode Fiber Interface are
supported by Hewlett-Packard.
Products are available for both
the single mode and the multimode fiber SONET OC-3c
(STS-3c) ATM interfaces and the
155 Mbps/194 MBd multimode
fiber ATM interface as specified
in the ATM Forum UNI.
Contact your Hewlett-Packard
sales representative for information on these alternative FDDI
and ATM products.
Low Cost 500 m Desktop
Links
The HFBR-5105/-5105T are
1300 nm products which are fully
compliant with the requirements
of the FDDI LCF-PMD standard.
The FDDI LCF-PMD standard is
in the final approval stage as ISO/
IEC WD 9314-9 and ANSI LCFPMD Revision 1.3.
These multimode fiber transceivers can be used for 500 meter
backbone and desktop links for
FDDI, Fast Ethernet, or ATM 100
Mbps traffic.
The HFBR-5105 transceiver
utilizes the duplex SC connector
receptacle specified in the FDDI
LCF-PMD standard.
Alternative 800 nm Low Cost
500 m Desktop Links
The HFBR-5104/-5104T are very
low cost 800 nm alternative to
the HFBR-5105/-5105T for FDDI,
ATM or Fast Ethernet links from
the wiring closet to the desktop.
They comply with the performance requirements of the draft
FDDI LCF-PMD document as
translated by Hewlett-Packard to
the 800 nm wavelength. This
transceiver will transfer the full
range of FDDI signals at the
required 1x10
-12
Bit Error Rate
over distances up to 500 meters
using 62.5/125 µm multimode
fiber cables.
This product is intended for use
in cost sensitive applications
where the benefits of fiber optic
links are important.
Transmitter Sections
The transmitter sections of the
HFBR-5103 and HFBR-5105
series utilize 1300 nm Surface
Emitting InGaAsP LEDs and the
HFBR-5104 series uses a low cost
820 nm AlGaAs LED. These LEDs
are packaged in the optical
subassembly portion of the
transmitter section. They are
driven by a custom silicon IC
which converts differential PECL
logic signals, ECL referenced
(shifted) to a +5 Volt supply, into
an analog LED drive current.
Receiver Sections
The receiver sections of the
HFBR-5103 and HFBR-5105
series utilize InGaAs PIN photodiodes coupled to a custom
silicon transimpedance preamplifier IC. The HFBR-5104 series
uses the same preamplifier IC in
conjunction with an inexpensive
silicon PIN photodiode. These are
packaged in the optical subassembly portion of the receiver.
These PIN/preamplifier combinations are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The data output is differential. The signal detect output
is single-ended. Both data and
signal detect outputs are PECL
compatible, ECL referenced
(shifted) to a +5 Volt power
supply.
Package
The overall package concept for
the HP transceivers consists of
the following basic elements; two
optical subassemblies, an
electrical subassembly and the
housing as illustrated in Figure 1
and Figure 1a.
The package outline drawing and
pin out are shown in Figures 2,
2a and 3. The details of this
package outline and pin out are
compliant with the multisource
Figure 1. Block Diagram.
DATA OUT
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN PHOTODIODE
DUPLEX SC
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP IC
DIFFERENTIAL
SINGLE-ENDED
DIFFERENTIAL
128
DATA OUT
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN PHOTODIODE
DUPLEX ST
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP IC
DIFFERENTIAL
SINGLE-ENDED
DIFFERENTIAL
Figure 1a. ST Block Diagram.
Figure 2. Package Outline Drawing.
39.12
(1.540)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
25.40
(1.000)
MAX.
12.70
(0.500)
10.35
(0.407)
MAX.
+ 0.25
- 0.05
+ 0.010
- 0.002
3.30 ± 0.38
(0.130 ± 0.015)
2.92
(0.115)
18.52
(0.729)
4.14
(0.163)
20.32
(0.800)
[8x(2.54/.100)]
23.55
(0.927)
16.70
(0.657)
17.32
(0.682)
20.32
(0.800)
23.32
(0.918)
0.46
(0.018)
NOTE 1
(9x)ø
NOTE 1
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
HFBR-5103 fig 2
1.27
(0.050
+ 0.08
- 0.05
+ 0.003
- 0.002
0.75
(0.030
)
)
H
HFBR-5XXX
DATE CODE (YYWW)
SINGAPORE
129
Figure 3. Pin Out Diagram.
definition of the 1x9 SIP. The low
profile of the Hewlett-Packard
transceiver design complies with
the maximum height allowed for
the duplex SC connector over the
entire length of the package.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
The electrical subassembly consists of a high volume multilayer
printed circuit board on which
the IC chips and various surface-
Figure 2a. ST Package Outline Drawing.
25.4
(1.000)
MAX.
24.8
(0.976)
42
(1.654)
MAX.
5.99
(0.236)
12.7
(0.500)
12.0
(0.471)
MAX.
0.5
(0.020)
3.3 ± 0.38
(0.130) (± 0.015)
+ 0.08
- 0.05
+ 0.003
- 0.002
+ 0.25
- 0.05
+ 0.010
- 0.002
20.32
± 0.38
(± 0.015)
HFBR-5103T
DATE CODE (YYWW)
SINGAPORE
3.2
(0.126)
2.6
(0.102)
φ
22.86
(0.900)
20.32
(0.800)
[(8x (2.54/0.100)]
17.4
(0.685)
21.4
(0.843)
20.32
(0.800)
3.6
(0.142)
1.3
(0.051)
23.38
(0.921)
18.62
(0.733)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS
WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS IN MILLIMETERS (INCHES).
(
(
(
(
0.46
(0.022)
NOTE 1
φ
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
TOP VIEW
N/C
N/C
130
technologies in the industry. The
industry convention is 3 dB aging
for 800 nm and 1.5 dB aging for
1300 nm LEDs. The HP 1300 nm
LEDs will experience less than
1 dB of aging over normal commercial equipment mission life
periods. Contact your HewlettPackard sales representative for
additional details.
Figure 4 was generated with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the FDDI
PMD and LCF-PMD optical
parameters. These parameters
are reflected in the guaranteed
performance of the transceiver
specifications in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
X3T9.5 committee, to establish
the optical performance requirements for various fiber optic
interface standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801 docu-
mounted passive circuit elements
are attached.
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI emissions and high
immunity to external EMI fields.
The outer housing including the
duplex SC connector receptacle
or the duplex ST ports is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts of the Hewlett-Packard
design are isolated from the
circuit design of the transceiver
and do not require connection to
a ground plane on the circuit
board.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the transceiver by mating with duplex or
simplex SC or ST connectored
fiber cables.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
Transceiver Optical Power
Budget versus Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the three
transceiver series specified in this
data sheet at the Beginning of
Life (BOL). These curves
represent the attenuation and
chromatic plus modal dispersion
losses associated with the 62.5/
125 µm and 50/125 µm fiber
cables only. The area under the
curves represents the remaining
OPB at any link length, which is
available for overcoming nonfiber cable related losses.
Hewlett-Packard LED technology
has produced 800 nm LED and
1300 nm LED devices with lower
aging characteristics than
normally associated with these
Figure 4. Optical Power Budget at BOL versus
Fiber Optic Cable Length.
OPTICAL POWER BUDGET (dB)
4.0
14
0
FIBER OPTIC CABLE LENGTH (km)
0.5 1.5 2.0 2.5
12
10
8
6
4
3.5
2
1.0 3.00.15
HFBR-5103, 62.5/125 µm
HFBR-5103,
50/125 µm
HFBR-5105,
62.5/125 µm
HFBR-5104,
62.5/125 µm
HFBR-5105,
50/125 µm
HFBR-5104,
50/125 µm
131
TRANSCEIVER RELATIVE OPTICAL POWER BUDGET
AT CONSTANT BER (dB)
0 200
3.0
0
SIGNAL RATE (MBd)
25 75 100 125
2.5
2.0
1.5
1.0
175
0.5
50 150
CONDITIONS:
1. PRBS 2
7
-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10
-6
4. TA = 25° C
5. V
CC
= 5 V
dc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
ment and the EIA/TIA-568-A
Commercial Building Telecommunications Cabling Standard per
SP-2840.
The HFBR-5104 series 800 nm
transceiver curve in Figure 4 was
generated based on extensive
empirical test data of typical 800
nm transmitter and receiver
performance. The curve includes
the effect of typical fiber attenuation, plus receiver sensitivity loss
due to chromatic and metal
dispersion losses through the
fiber.
Transceiver Signaling
Operating Rate Range and
BER Performance
For purposes of definition, the
symbol (Baud) rate, also called
signaling rate, is the reciprocal of
the shortest symbol time. Data
rate (bits/sec) is the symbol rate
divided by the encoding factor
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
Transceiver Jitter
Performance
The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system jitter
allocations stated in Tables E1 of
Annexes E of the FDDI PMD and
LCF-PMD standards.
The HP 1300 nm transmitters will
tolerate the worst case input
electrical jitter allowed in these
tables without violating the worst
case output jitter requirements of
Sections 8.1 Active Output
Interface of the FDDI PMD and
LCF-PMD standards.
The HP 1300 nm receivers will
tolerate the worst case input
optical jitter allowed in Sections
8.2 Active Input Interface of the
used to encode the data (symbols/
bit).
When used in FDDI and ATM 100
Mbps applications the
performance of the 1300 nm
transceivers is guaranteed over
the signaling rate of 10 MBd to
125 MBd to the full conditions
listed in individual product
specification tables.
The transceivers may be used for
other applications at signaling
rates outside of the 10 MBd to
125 MBd range with some
penalty in the link optical power
budget primarily caused by a
reduction of receiver sensitivity.
Figure 5 gives an indication of
the typical performance of these
1300 nm products at different
rates.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 6
Figure 5. Transceiver Relative Optical Power Budget
at Constant BER vs. Signaling Rate.
Figure 6. Bit Error Rate vs. Relative Receiver Input
Optical Power.
BIT ERROR RATE
-6 4
1 x 10
-2
RELATIVE INPUT OPTICAL POWER – dB
-4 2-2
0
1 x 10
-4
1 x 10
-6
1 x 10
-8
2.5 x 10
-10
1 x 10
-11
HFBR-5103/-5104/-5105
CONDITIONS:
1. 125 MBd
2. PRBS 2
7
-1
3. CENTER OF SYMBOL SAMPLING.
4. T
A
= 25° C
5. V
CC
= 5 V
dc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
CENTER OF SYMBOL
1 x 10
-12
1 x 10
-7
1 x 10
-5
1 x 10
-3
SERIES
132
FDDI PMD and LCF-PMD
standards without violating the
worst case output electrical jitter
allowed in the Tables E1 of the
Annexes E.
The jitter specifications stated in
the following 1300 nm
transceiver specification tables
are derived from the values in
Tables E1 of Annexes E. They
represent the worst case jitter
contribution that the transceivers
are allowed to make to the overall
system jitter without violating the
Annex E allocation example. In
practice the typical contribution
of the HP transceivers is well
below these maximum allowed
amounts.
Recommended Handling
Precautions
Hewlett-Packard recommends
that normal static precautions be
taken in the handling and
assembly of these transceivers to
prevent damage which may be
induced by electrostatic
discharge (ESD). The HFBR5100 series of transceivers meet
MIL-STD-883C Method 3015.4
Class 2 products.
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground without proper current
limiting impedance.
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector receptacle.
This process plug protects the
optical subassemblies during
wave solder and aqueous wash
processing and acts as a dust
cover during shipping.
These transceivers are compatible with either industry standard
wave or hand solder processes.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout - Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
Figure 7. Recommended Decoupling and Termination Circuits
NO INTERNAL CONNECTION NO INTERNAL CONNECTION
HFBR-510X
TOP VIEW
V
EE
RD RD SD V
CCVCC
TD TD V
EE
123456789
C1 C2
L1 L2
R2 R3
R1 R4
C5
C3 C4
R9
R10
VCC FILTER
AT V
CC
PINS
TRANSCEIVER
R5 R7
R6 R8
C6
RD RD SD V
CC
TD TD
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
TERMINATION
AT TRANSCEIVER
INPUTS
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Rx Rx Tx Tx
V
CC
V
CC
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