Bluetooth is a trademark owned by its
proprietor and used by HP Inc. under license.
Intel is a trademark of Intel Corporation in the
U.S. and other countries. Windows is either a
registered trademark or trademark of
Microsoft Corporation in the United States
and/or other countries.
The information contained herein is subject to
change without notice. The only warranties for
HP products and services are set forth in the
express warranty statements accompanying
such products and services. Nothing herein
should be construed as constituting an
additional warranty. HP shall not be liable for
technical or editorial errors or omissions
contained herein.
First Edition: April 2018
Document Part Number: L14948-001
Product notice
This user guide describes features that are
common to most models. Some features may
not be available on your computer.
Not all features are available in all editions of
Windows. This computer may require upgraded
and/or separately purchased hardware, drivers
and/or software to take full advantage of
Windows functionality. Go to
http://www.microsoft.com for details.
Software terms
By installing, copying, downloading, or
otherwise using any software product
preinstalled on this computer, you agree to be
bound by the terms of the HP End User License
Agreement (EULA). If you do not accept these
license terms, your sole remedy is to return the
entire unused product (hardware and software)
within 14 days for a full refund subject to the
refund policy of your seller.
For any further information or to request a full
refund of the price of the computer, please
contact your seller.
Safety warning notice
WARNING! To reduce the possibility of heat-related injuries or of overheating the device, do not place
the device directly on your lap or obstruct the device air vents. Use the device only on a hard, at surface. Do
not allow another hard surface, such as an adjoining optional printer, or a soft surface, such as pillows or rugs
or clothing, to block airow. Also, do not allow the AC adapter to contact the skin or a soft surface, such as
pillows or rugs or clothing, during operation. The device and the AC adapter comply with the user-accessible
surface temperature limits dened by the International Standard for Safety of Information Technology
Equipment (IEC 60950-1).
iii
iv Safety warning notice
Table of contents
1 Product features ........................................................................................................................................... 1
HP Elite Slice for Meeting Rooms G2 features ....................................................................................................... 1
Top components .................................................................................................................................. 2
Side components ................................................................................................................................. 3
HP Video Ingest Module ......................................................................................................................................... 3
HP Wireless Display Module (optional) .................................................................................................................. 4
HP Optical Disc Drive (ODD) Module (optional) ...................................................................................................... 5
HP Slice VESA plate (optional) ............................................................................................................................... 5
Connecting or removing modules .......................................................................................................................... 5
Connecting AC power ............................................................................................................................................. 9
Regulatory information and serial number location .......................................................................................... 10
2 Illustrated parts catalog .............................................................................................................................. 11
Major components ............................................................................................................................................... 11
Solid-state drives (2.5-inch and M.2) .................................................................................................................. 14
3 Routine care, SATA drive guidelines, and disassembly preparation .................................................................. 15
Electrostatic discharge information .................................................................................................................... 15
Routine care ......................................................................................................................................................... 18
General cleaning safety precautions ................................................................................................ 18
Cleaning the computer case .............................................................................................................. 18
Cleaning the keyboard ....................................................................................................................... 18
v
Cleaning the monitor ......................................................................................................................... 19
Cleaning the mouse ........................................................................................................................... 19
Service considerations ......................................................................................................................................... 19
Tools and software requirements ..................................................................................................... 19
Base Module ......................................................................................................................................................... 30
Fan sink ................................................................................................................................................................ 37
M.2 PCIe solid state drive (SSD) ........................................................................................................................... 38
System board ....................................................................................................................................................... 41
Removing the system board ............................................................................................................. 41
Updating SMBIOS information .......................................................................................................... 43
System ID setup page ........................................................................................................................ 44
System board callouts, front ............................................................................................................. 45
System board callouts, rear .............................................................................................................. 46
Recovering the conguration settings ................................................................................................................ 58
6 Troubleshooting without diagnostics ............................................................................................................ 59
Safety and comfort .............................................................................................................................................. 59
Before you call for technical support .................................................................................................................. 59
Solving general problems .................................................................................................................................... 61
Solving power problems ...................................................................................................................................... 64
7 POST error messages and diagnostic front panel LEDs and audible codes ......................................................... 74
POST numeric codes and text messages ............................................................................................................. 74
Interpreting system validation diagnostic front panel LEDs and audible codes ................................................ 79
8 Password security and resetting CMOS .......................................................................................................... 82
Resetting the password jumper .......................................................................................................................... 82
Clearing and resetting the BIOS ........................................................................................................................... 84
9 Using HP PC Hardware Diagnostics ................................................................................................................ 86
Using HP PC Hardware Diagnostics Windows ..................................................................................................... 86
Downloading HP PC Hardware Diagnostics Windows ....................................................................... 86
Downloading the latest HP PC Hardware Diagnostics Windows version ....................... 87
Downloading HP Hardware Diagnostics Windows by product name or number
Using Remote HP PC Hardware Diagnostics UEFI settings (select products only) ............................................. 89
Downloading Remote HP PC Hardware Diagnostics UEFI ................................................................. 89
Downloading the latest Remote HP PC Hardware Diagnostics UEFI version ................. 89
Downloading Remote HP PC Hardware Diagnostics UEFI by product name or
number ............................................................................................................................ 89
Customizing Remote HP PC Hardware Diagnostics UEFI settings .................................................... 89
vii
10 Backing up, restoring, and recovering ......................................................................................................... 91
Using Windows tools ........................................................................................................................................... 91
Creating HP Recovery media (select products only) ........................................................................................... 91
Using HP Recovery Manager to create recovery media .................................................................... 92
Before you begin ............................................................................................................. 92
Creating the recovery media ........................................................................................... 92
Using the HP Cloud Recovery Download Tool to create recovery media .......................................... 93
Restoring and recovery ........................................................................................................................................ 93
Restoring, resetting, and refreshing using Windows tools .............................................................. 93
Restoring using HP Recovery Manager and the HP Recovery partition ........................................... 93
Recovering using HP Recovery Manager ........................................................................................... 93
Recovering using the HP Recovery partition (select products only) ................................................ 94
Recovering using HP Recovery media ............................................................................................... 94
Changing the computer boot order ................................................................................................... 95
Removing the HP Recovery partition (select products only) ............................................................ 95
Appendix A Power cord set requirements ......................................................................................................... 96
General Requirements ......................................................................................................................................... 96
Japanese Power Cord Requirements ................................................................................................................... 96
Questions and answers ..................................................................................................................................... 102
Using HP Sure Start (select models only) .......................................................................................................... 103
Appendix C Specications ............................................................................................................................. 104
Index ........................................................................................................................................................... 105
viii
1Product features
HP Elite Slice for Meeting Rooms G2 features
The Elite Slice G2 features Bang & Olufsen audio and wireless communication for Intel Unite or Microsoft
Skype Room System (SRS) conferencing software. Four speakers are on the Elite Slice G2, one in each corner
and four microphones are on the top.
HP Elite Slice for Meeting Rooms G2 features1
Top components
The Elite Slice G2 top components enable call control with capacitive touch buttons for conference calls.
ItemComponentItemComponent
1Answer/Call4Volume up
2Mute5Reject/Disconnect call
3Volume down
Rear components
ItemComponentItemComponent
1Power button5USB ports (2)
2Power jack6Dual-Mode DisplayPort (D++) port
3RJ-45 (network) jack7HDMI port
4USB type C port with Alt Mode8Security cable slot
2Chapter 1 Product features
Side components
ItemComponentItemComponent
1USB Type-C port
(disabled from factory, enabled through system BIOS)
HP Video Ingest Module
The Video Ingest Module is required for the Microsoft SRS. This module enables a video source to be
connected to the SRS.
The Video Ingest Module does not support Intel Unite software.
The Elite Slice G2 may be ordered with the optional Wireless Display Module. The wireless receiver transceiver
included with the module can be attached to a display. The Wireless Display Module can transmit a signal up
to 10 meters to the transceiver in the room.
TIP: For the best performance, be sure the line of sight between the wireless receiver transceiver and the
Wireless Display Module is optimal.
ItemComponentItemComponent
1Sync button3Security cable slot
2Sync LED
ItemComponentItemComponent
1HDMI port5Mounting plate release button
2USB Type A power connector6Security screw
3Sync LED7Wireless receiver transceiver
4Sync button8Wireless receiver transceiver VESA plate
4Chapter 1 Product features
HP Optical Disc Drive (ODD) Module (optional)
The ODD Module (available as an after-market option) may be ordered to add optical drive functionality.
Additional optical drive modules may be connected to an Elite Slice G2 conguration, depending upon the
power supply and the total number of powered modules.
The optional Slice VESA plate enables the Elite Slice G2 assembly to be mounted onto a table. The Elite Slide
G2 should not be mounted to a wall or under a desk.
ItemComponentItemComponent
1Quick release latch2Security cable slot
Connecting or removing modules
Additional modules may be connected to the Elite Slice G2. Modules should be attached to the Base Module in
the following order, from top to bottom:
●
Video Ingest Module (required for the Microsoft SRS only)
●
Wireless Display Module (optional)
●
ODD Module (optional)
●
VESA plate (optional)
HP Optical Disc Drive (ODD) Module (optional)5
Connecting modules
Connecting modules
CAUTION: Before connecting modules, turn o the Elite Slice G2 and disconnect it from any AC power
source.
Modules cannot be “hot-plugged” or “hot-swapped.”
1.Remove/disengage the security cable, if one is attached.
2.Remove all removable media, such as USB ash drives.
3.Turn o the Elite Slice G2 properly through the operating system, and then turn o any external devices.
4.Disconnect the AC power cord from the Elite Slice G2 and disconnect any external devices.
5.If the VESA plate is connected, slide the quick release latch to the unlocked position and remove the
VESA plate.
6.Align the module connection port on the underside of the Elite Slice G2 with the module expansion
connector on the new module and press the computer down rmly.
You should hear a quiet click when the modules lock together. The module locks into place and hides the
release latch of the module above it.
Repeat until all modules have been connected.
Connecting the optional Slice VESA plate
If the VESA plate is connected, the Elite Slice G2 can be mounted onto a table.
CAUTION: Before connecting the VESA plate, turn o the Elite Slice G2 and disconnect it from any AC power
source.
1.Slide the quick release latch on the VESA plate to the unlocked position. Position the connected modules
over the VESA plate.
The VESA plate does not have a module expansion connector. Be sure that the ports of the Elite Slice G2
and the quick release latch and security cable slot of the VESA plate are all on the same side.
6Chapter 1 Product features
2.Press the modules down onto the VESA plate.
3.Slide the quick release latch on the back of the VESA plate to the locked position to lock all modules
together.
CAUTION: There are four tabs in the VESA plate. When you position the Elite Slice G2 conguration
correctly onto the VESA plate and slide the quick release latch to the locked position, the four tabs lock
the VESA plate to the Elite Slice G2 assembly. If the VESA plate is not correctly oriented, the quick release
latch cannot be moved to the locked position and the modules are not secured.
4.Install a security cable in the VESA plate security cable slot to prevent the quick release latch from being
unlocked and the modules from being separated.
NOTE: The security cable is designed to act as a deterrent, but it may not prevent the computer from
being mishandled or stolen.
Connecting or removing modules7
Removing modules
CAUTION: Before disconnecting modules, turn o the Elite Slice G2 and disconnect it from any AC power
source.
Modules cannot be “hot-plugged” or “hot-swapped.”
Modules must be removed one at a time, starting at the bottom. Removing the Base Module exposes the
release latch of the module above it.
1.Remove/disengage the security cable, if one is attached.
2.Remove all removable media, such as USB ash drives.
3.Turn o the Elite Slice G2 properly through the operating system, and then turn o any external devices.
4.Disconnect the AC power cord from the Elite Slice G2 and disconnect any external devices.
5.If the VESA plate is connected, slide the quick release latch on the back of the VESA plate to the unlocked
position and lift the module stack o the VESA plate.
6.Beginning at the bottom, remove additional modules by pressing the release latch (1) on the underside
of each module until it releases the module (2) above it.
8Chapter 1 Product features
Connecting AC power
The Elite Slice G2 employs the HP Cable and Port Cover to supply power to the elements of the conferencing
solution.
1.Connect the Cable and Port Cover to the Elite Slice G2:
a.Pull the port cover down (1) to expose the cable connectors.
b.Pull the rst and last connectors out (2) to each side.
c.Beginning with the HDMI connector and nishing with the NIC connector, plug all middle connectors
into the rear ports (3) on the Elite Slice G2.
d.Connect side cables (4).
e.Push the port cover back over the cable connectors (5) to protect and secure the connectors.
2.Connect remaining equipment, such as a CoRC or a display, to the Cable and Port Cover.
3.Connect the AC power cord to the power adapter (1) and the other end to an AC outlet (2) .
4.Connect the power supply connector to the power connector on the Cable and Port Cover (3).
Connecting AC power9
Regulatory information and serial number location
Each computer has a unique serial number and a product ID number laser-etched on the base cover of the
Elite Slice G2. A copy of these labels is inside the case. Keep these numbers available for use when contacting
support for assistance.
ItemComponentItemComponent
1Regulatory label3Module connector
2Regulatory and service information
10Chapter 1 Product features
2Illustrated parts catalog
NOTE: HP continually improves and changes product parts. For complete and current information on
supported parts for your computer, go to http://partsurfer.hp.com, select your country or region, and then
follow the on-screen instructions.
Major components
ItemDescription
(1)Fan sink
(2)Speaker
(3)WLAN module:
Intel® Dual Band Wireless-AC 7265 NV
Intel Dual Band Wireless-AC 8260 + Bluetooth 4.0
Intel Dual Band Wireless-AC 8260 + Bluetooth 4.0 (non-vPro)
France-051People’s Republic of China -AA1Turkey-141
Germany-041Portugal-131United Kingdom-031
Greece-151Romania-271United States-001
Spare part
number
For use in country
or region
Spare part
number
For use in country
or region
Spare part
number
Hungary-211
12Chapter 2 Illustrated parts catalog
Modules (whole units)
Description
HP Slice G2 Base Module
HP Video Ingest Module
HP Wireless Display Module
Audio Module
Center of Room Module
Memory modules and processors
Description
Memory modules (DDR4-2400-MHz)
8-GB
4-GB
Intel Core processors
Intel Core i5-7500T, 2.7 GHz, 6-MB L2 cache, 35 W
Intel Core i5-7400T, 2.4 GHz, 6-MB L2 cache, 35 W
Intel Core i3-7100T, 3.4 GHz, 3-MB L2 cache, 35 W
Adapters
Description
DisplayPort to HDMI 1.4
DisplayPort to HDMI 2.0
DisplayPort to DVI
USB Type-C to VGA
USB Type-C to DisplayPort
USB Type-C to HDMI
USB Type-C to USB 3.0
USB -Type C to USB Type-A hub
Modules (whole units)13
Solid-state drives (2.5-inch and M.2)
Description
Solid-state drive, M.2
256 GB, PCIe, NVMe, TLC
256 GB, PCIe, NVMe, value
Solid-state drive, 2.5-inch
256 GB, SATA-3, TLC
128 GB, SATA-3, TLC
14Chapter 2 Illustrated parts catalog
3Routine care, SATA drive guidelines, and
disassembly preparation
This chapter provides general service information for the computer. Adherence to the procedures and
precautions described in this chapter is essential for proper service.
CAUTION: When the computer is plugged into an AC power source, voltage is always applied to the system
board. You must disconnect the power cord from the power source before opening the computer to prevent
system board or component damage.
Electrostatic discharge information
A sudden discharge of static electricity from your nger or other conductor can destroy static-sensitive
devices or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic device
exposed to electrostatic discharge (ESD) may not appear to be aected at all and can work perfectly
throughout a normal cycle. The device may function normally for a while, but it has been degraded in the
internal layers, reducing its life expectancy.
Networks built into many integrated circuits provide some protection, but in many cases, the discharge
contains enough power to alter device parameters or melt silicon junctions.
Generating static
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities. A product can be degraded by 700 volts.
●
Dierent activities generate dierent amounts of static electricity.
●
Static electricity increases as humidity decreases.
Relative Humidity
Event55%40%10%
Walking across carpet
Walking across vinyl oor
Motions of bench worker
Removing DIPs from plastic tube
Removing DIPs from vinyl tray
Removing DIPs from Styrofoam
Removing bubble pack from PCB
Packing PCBs in foam-lined box
7,500 V
3,000 V
400 V
400 V
2,000 V
3,500 V
7,000 V
5,000 V
15,000 V
5,000 V
800 V
700 V
4,000 V
5,000 V
20,000 V
11,000 V
35,000 V
12,000 V
6,000 V
2,000 V
11,500 V
14,500 V
26,500 V
21,000 V
Electrostatic discharge information15
Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
●
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
●
Protect all electrostatic-sensitive parts and assemblies with conductive or approved containers or
packaging.
●
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
●
Place items on a grounded surface before removing them from their containers.
●
Always be properly grounded when touching a sensitive component or assembly.
●
Avoid contact with pins, leads, or circuitry.
●
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
●
Wrist straps are exible straps with a maximum of one-megohm ± 10% resistance in the ground cords.
To provide proper ground, a strap must be worn snugly against bare skin. The ground cord must be
connected to the banana plug connector on the grounding mat or workstation and t snugly into it.
●
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
MethodVoltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
Grounding the work area
To prevent static damage at the work area, observe the following precautions:
●
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and use properly grounded tools and equipment.
●
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
●
Handle electrostatic-sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
●
Turn o power and input signals before inserting and removing connectors or test equipment.
1,500
7,500
15,000
●
Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
●
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
●
Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
16Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation
Recommended materials and equipment
The following grounding equipment is recommended to prevent electrostatic damage:
●
Antistatic tape
●
Antistatic smocks, aprons, or sleeve protectors
●
Conductive bins and other assembly or soldering aids
●
Conductive foam
●
Conductive tabletop workstations with ground cords of one-megohm +/- 10% resistance
●
Static-dissipative table or oor mats with hard ties to ground
●
Field service kits
●
Static awareness labels
●
Wrist straps and footwear straps providing one-megohm +/- 10% resistance
●
Material handling packages
●
Conductive plastic bags
●
Conductive plastic tubes
●
Conductive tote boxes
●
Opaque shielding bags
●
Transparent metallized shielding bags
●
Transparent shielding tubes
Operating guidelines
To prevent overheating and to help prolong the life of the computer:
●
Keep the computer away from excessive moisture, direct sunlight, and extremes of heat and cold.
●
Operate the computer on a sturdy, level surface. Leave a 10.2 cm (4-inch) clearance on all vented sides
of the computer and above the monitor to permit the required airow.
●
Never restrict the airow into the computer by blocking any vents or air intakes. Do not place the
keyboard, with the keyboard feet down, directly against the front of the desktop unit as this also
restricts airow.
●
Occasionally clean the air vents on all vented sides of the computer. Lint, dust, and other foreign matter
can block the vents and limit the airow. Be sure to unplug the computer before cleaning the air vents.
●
Never operate the computer with the cover or side panel removed.
●
Do not stack computers on top of each other or place computers so near each other that they are subject
to each other’s re-circulated or preheated air.
●
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be
provided on the enclosure, and the same operating guidelines listed above will still apply.
●
Keep liquids away from the computer and keyboard.
Operating guidelines17
●
Never cover the ventilation slots on the monitor with any type of material.
●
Install or enable power management functions of the operating system or other software, including
sleep states.
Routine care
General cleaning safety precautions
1.Never use solvents or ammable solutions to clean the computer.
2.Never immerse any parts in water or cleaning solutions; apply any liquids to a clean cloth and then use
the cloth on the component.
3.Always unplug the computer when cleaning with liquids or damp cloths.
4.Always unplug the computer before cleaning the keyboard, mouse, or air vents.
5.Disconnect the keyboard before cleaning it.
6.Wear safety glasses equipped with side shields when cleaning the keyboard.
Cleaning the computer case
Follow all safety precautions in General cleaning safety precautions on page 18 before cleaning the computer.
To clean the computer case, follow the procedures described below:
●
To remove light stains or dirt, use plain water with a clean, lint-free cloth or swab.
●
For stronger stains, use a mild dishwashing liquid diluted with water. Rinse well by wiping the surface
with a cloth or swab dampened with clear water.
●
For stubborn stains, use isopropyl (rubbing) alcohol. No rinsing is needed; alcohol will evaporate quickly
without leaving a residue.
●
After cleaning, always wipe the unit with a clean, lint-free cloth.
●
Occasionally clean the air vents on the computer. Lint and other foreign matter can block the vents and
limit the airow.
Cleaning the keyboard
Follow all safety precautions in General cleaning safety precautions on page 18 before cleaning the keyboard.
To clean the tops of the keys or the keyboard body, follow the procedures described in Cleaning the computer
case on page 18.
When cleaning debris from under the keys, review all rules in General cleaning safety precautions on page 18
before following these procedures:
CAUTION: Use safety glasses equipped with side shields before attempting to clean debris from under the
keys.
●
Visible debris underneath or between the keys may be removed by vacuuming or shaking.
●
Canned, pressurized air may be used to clean debris from under the keys. Caution should be used as too
much air pressure can dislodge lubricants applied under the wide keys.
18Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation
●
If you want to remove a key, use a specially designed key puller to prevent damage to the keys. This tool
is available through many electronics supply outlets.
CAUTION: Never remove a wide, level key (like the space bar) from the keyboard. If these keys are
improperly removed or installed, the keyboard may not function properly.
●
Cleaning under a key may be done with a swab moistened with isopropyl alcohol and then squeezed out.
Be careful not to wipe away lubricants necessary for proper key functions. Use tweezers to remove any
bers or dirt in conned areas. Allow the parts to air dry before reassembly.
Cleaning the monitor
●
Wipe the monitor screen with a towelette designed for cleaning monitors or with a clean cloth
moistened with water. Do not use sprays or aerosols directly on the screen; the liquid may seep into the
housing and damage a component. Never use solvents or ammable liquids on the monitor.
●
To clean the monitor body follow the procedures in Cleaning the computer case on page 18.
Cleaning the mouse
Before cleaning the mouse, ensure that the power to the computer is turned o.
●
Clean the mouse ball by rst removing the retaining plate and the ball from the housing. Pull out any
debris from the ball socket and wipe the ball with a clean, dry cloth before reassembly.
●
To clean the mouse body, follow the procedures in Cleaning the computer case on page 18.
Service considerations
Listed below are some of the considerations that you should keep in mind during the disassembly and
assembly of the computer.
Tools and software requirements
To service the computer, you need the following:
●
Torx T-15 screwdriver
●
Flat-bladed screwdriver (may sometimes be used in place of the Torx screwdriver)
●
Phillips #2 screwdriver
●
Diagnostics software
Screws
The screws used in the computer are not interchangeable. They may have standard or metric threads and may
be of dierent lengths. If an incorrect screw is used during the reassembly process, it can damage the unit. HP
strongly recommends that all screws removed during disassembly be kept with the part that was removed,
then returned to their proper locations.
CAUTION: Metric screws have a black nish. U.S. screws have a silver nish and are used on hard drives only.
CAUTION: As each subassembly is removed from the computer, it should be placed away from the work area
to prevent damage.
Service considerations19
Lithium coin cell battery
The battery that comes with the computer provides power to the real-time clock and has a minimum lifetime
of about three years.
See the appropriate removal and replacement chapter for the chassis you are working on in this guide for
instructions on the replacement procedures.
WARNING! This computer contains a lithium battery. There is a risk of re and chemical burn if the battery is
handled improperly. Do not disassemble, crush, puncture, short external contacts, dispose in water or re, or
expose it to temperatures higher than 140ºF (60ºC). Do not attempt to recharge the battery.
NOTE: Batteries, battery packs, and accumulators should not be disposed of together with general
household waste. In order to forward them for recycling or proper disposal, please use the public collection
system or return them to HP.
20Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation
4Removal and replacement procedures – HP
Elite Slice Base Module
Adherence to the procedures and precautions described in this chapter is essential for proper service. After
completing all necessary removal and replacement procedures, run the Diagnostics utility to verify that all
components operate properly.
NOTE: Not all features listed in this guide are available on all computers.
NOTE: HP continually improves and changes product parts. For complete and current information on
supported parts for your computer, go to http://partsurfer.hp.com, select your country or region, and then
follow the on-screen instructions.
Access panel
The Elite Slice G2 access panel must be removed to access internal components (see Removing modules
on page 8).
1.Remove the Elite Slice G2 from any additional modules.
2.Place the computer upside down on a at surface covered with a soft cloth to protect the computer from
scratches or other damage.
3.Loosen the four captive screws securing the access panel, and lift the panel o the computer.
To replace the access panel, reverse the removal procedures.
Access panel21
Memory
Description
Memory modules (PC4-2400-MHz)
8-GB
4-GB
The memory module slots on the system board can be populated with up to two industry-standard memory
modules. At least one small outline, dual inline memory module (SODIMM) is preinstalled. To achieve the
maximum memory support, you can populate the system board with up to 32 GB (16 GB x 2) of memory.
NOTE: Dual channel memory is recommended for Microsoft Skype Room Systems for better performance.
Memory module specications
For proper system operation, the SODIMMs must adhere to the following specications: