Technical Reference Guide
HP Compaq 8000 Elite Series
Business Desktop Computers
Document Part Number: 601197-001
December 2009
This document provides information on the design, architecture, function,
and capabilities of the HP Compaq 8000 Elite Series Business Desktop
Computers. This information may be used by engineers, technicians,
administrators, or anyone needing detailed information on the products
covered.
© Copyright 2009 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.
Microsoft, MS-DOS, Windows, Windows NT, Windows XP, Windows Vista, and Windows 7 are trademarks of
Microsoft Corporation in the U.S. and other countries.
Intel, Intel Core 2 Duo, Intel Core 2 Quad, Pentium Dual-Core, Intel Inside, and Celeron are trademarks of Intel
Corporation in the U.S. and other countries.
Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.
The only warranties for HP products and services are set forth in the express warranty statements accompanying
such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
This document contains proprietary information that is protected by copyright. No part of this document may be
photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard
Company.
Technical Reference Guide
HP Compaq 8000 Elite Series Business Desktop Computers
First Edition (December 2009)
Document Part Number: 601197-001
Contents
1Introduction
1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.3 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.4 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5.1 Special Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5.2 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
2 System Overview
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.3 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.3.1 Intel Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.3.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.3.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.6 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.10 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.11 HP ProtectTools Embedded Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
2.4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
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Contents
3 Processor/Memory Subsystem
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Intel Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.1 Intel Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.2 Processor Changing/Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4
3.3.1 Memory Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.2 Memory Mapping and Pre-allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
4 System Support
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10
4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
4.6.2 GPIO Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–16
5 Input/Output Interfaces
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.2 SATA/eSATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.2.1 SATA Inteerface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.5.2 eSATA Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3
5.3 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
5.4 Parallel Interface Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.4 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
5.5 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.5.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.5.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
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5.5.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
5.6 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.6.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.6.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
5.7 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
5.7.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.3 Audio Multistreaming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.4 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13
5.8 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
5.8.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.4 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16
5.8.5 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16
6 Integrated Graphics Subsystem
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
6.3 Display Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4
6.4 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.5 Monitor Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.5.1 Analog Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.5.2 DisplayPort Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–7
Contents
7 Power and Signal Distribution
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2 USDT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.3 SFF/CMT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.4 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4
7.4.1 Power Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4
7.4.2 Wake Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
7.5 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
7.6 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8
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Contents
8SYSTEM BIOS
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.4 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
8.4.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.4.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.5 SMBIOS support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.6 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
8.7 Management Engine Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
A Error Messages and Codes
Index
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1.1 A bo u t thi s Gu i d e
This guide provides technical information about HP Compaq 8000 Elite Business PC personal
computers that feature Intel processors and the Intel Q45 Express chipset. This document
describes in detail the system's design and operation for programmers, engineers, technicians,
and system administrators, as well as end-users wanting detailed information.
The chapters of this guide primarily describe the hardware and firmware elements and primarily
deal with the system board and the power supply assembly. The appendices contain general data
such as error codes and information about standard peripheral devices such as keyboards,
graphics cards, and communications adapters.
This guide can be used either as an online document or in hardcopy form.
1.1.1 O n li ne V i ew in g
Online viewing allows for quick navigating and convenient searching through the document. A
color monitor will also allow the user to view the color shading used to highlight differential
data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format
at the following URL:
www.hp.com
1
Introduction
Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe
Systems, Inc. at the following URL:
www.adobe.com
1.1. 2 H ar d c o py
A hardcopy of this guide may be obtained by printing from the .pdf file. The document is
designed for printing in an 8 ½ x 11-inch format.
1.2 Additional Information Sources
For more information on components mentioned in this guide refer to the indicated
manufacturers' documentation, which may be available at the following online sources:
■ HP Corporation: www.hp.com
■
Intel Corporation: www.intel.com
■
Serial ATA International Organization (SATA-IO): www.serialATA.org.
■
USB user group: www.usb.org
Technical Reference Guide www.hp.com 1-1
Introduction
1. 3 S e r ia l N um b e r
The serial number is located on a sticker placed on the exterior cabinet. The serial number is also
written into firmware and may be read with HP Diagnostics or Insight Manager utilities.
1.4 Notational Conventions
The notational guidelines used in this guide are described in the following subsections.
1.4.1 Special Notices
The usage of warnings, cautions, and notes is described as follows:
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily
Å
harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to
Ä
equipment or loss of information.
Text set off in this manner provides information that may be helpful.
✎
1.4.2 Values
Differences between bytes and bits are indicated as follows:
MB = megabytes
Mb = megabits
1.4.3 Ranges
Ranges or limits for a parameter are shown using the following methods:
Example A: Bits <7..4> = bits 7, 6, 5, and 4.
Example B: IRQ3-7, 9 = IRQ signals 3, 4, 5, 6, 7, and 9
1-2 www.hp.com Technical Reference Guide
1.5 Common Acronyms and Abbreviations
Table 1-1 lists the acronyms and abbreviations used in this guide.
Table 1-1
Acronyms and Abbreviations
Acronym or
Abbreviation Description
Aampere
AC alternating current
ACPI Advanced Configuration and Power Interface
A/D analog-to-digital
ADC Analog-to-digital converter
ADD or ADD2 Advanced digital display (card)
AGP Accelerated graphics port
AHCI SATA Advanced Host controller Interface
AMT Active Management Technology
Introduction
API application programming interface
APIC Advanced Programmable Interrupt Controller
APM advanced power management
AOL Alert- On-LAN™
ASIC application-specific integrated circuit
ASF Alert Standard Format
AT 1. attention (modem commands) 2. 286-based PC architecture
ATA AT attachment (IDE protocol)
ATAPI ATA w/packet interface extensions
AVI audio -video in terleave d
AVGA Advanc ed VGA
AWG American Wire Gauge (specification)
BAT Basic assurance test
BCD binary-coded decimal
BIOS basic input/output system
bis second/new revision
BNC Bayonet Neill-Concelman (connector type)
bps or b/s bits per second
BSP Bootstrap processor
BTO Built to order
CAS column address strobe
CD compact disk
CD-ROM compact disk read-only memory
Technical Reference Guide www.hp.com 1-3
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
CDS compact disk system
CGA color graphics adapter
Ch Channel, chapter
cm centimeter
CMC cache/memory controller
CMOS complimentary metal-oxide semiconductor (configuration memory)
Cntlr controller
Cntrl control
codec 1. coder/decoder 2. compressor/decompressor
CPQ Compaq
CPU central processing unit
CRIMM Continuity (blank) RIMM
CRT cathode ray tube
CSM 1. Compaq system management 2. Compaq server management
DAC digital-to-analog converter
DC direct current
DCH DOS compatibility hole
DDC Display Data Channel
DDR Double data rate (memory)
DIMM dual inline memory module
DIN Deutche IndustriNorm (connector type)
DIP dual inline package
DMA direct memory access
DMI Desktop management interface
dpi dots per inch
DRAM dynamic random access memory
DRQ data request
DVI Digital video interface
dword Double word (32 bits)
EDID extended display identification data
EDO extended data out (RAM type)
EEPROM electrically erasable PROM
EGA enhanced graphics adapter
EIA Electronic Industry Association
1-4 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
EISA extended ISA
EPP enhanced parallel port
EIDE enhanced IDE
ESCD Extended System Configuration Data (format)
EV Environmental Variable (data)
ExCA Exchangeable Card Architecture
FIFO first in/first out
FL flag (register)
FM frequency modulation
FPM fast page mode (RAM type)
FPU Floating point unit (numeric or math coprocessor)
FPS Frames per second
ft Foot/feet
Introduction
GB gigabyte
GMCH Graphics/memory controller hub
GND ground
GPIO general purpose I/O
GPOC general purpose open-collector
GART Graphics address re-mapping table
GUI graphic user interface
hhexadecimal
HDD hard disk drive
HW hardware
hex hexadecimal
Hz Hertz (cycles-per-second)
ICH I/O controller hub
IDE integrated drive element
IEEE Institute of Electrical and Electronic Engineers
IF interrupt flag
I/F interface
IGC integrated graphics controller
in inch
INT interrupt
I/O input/output
IOPS Input/output Operations Per Second
Technical Reference Guide www.hp.com 1-5
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
IPL initial program loader
IrDA Infrared Data Association
IRQ interrupt request
ISA industry standard architecture
Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)
Kb/s kilobits per second
kg kilogram
KHz kilohertz
kV kilovolt
lb pound
LAN local area network
LCD liquid crystal display
LED light-emitting diode
LPC Low pin count
LSI large scale integration
LSb/LSB least significant bit/least significant byte
LUN logical unit (SCSI)
m Meter
MCH Memory controller hub
MMX multimedia extensions
MPEG Motion Picture Experts Group
ms millisecond
MSb/MSB most significant bit/most significant byte
mux multiplex
MVA motion video acceleration
MVW motion video window
n variable parameter/value
NIC network interface card/controller
NiMH nickel-metal hydride
NMI non-maskable interrupt
NRZI Non-return-to-zero inverted
ns nanosecond
NT nested task flag
NTSC National Television Standards Committee
1-6 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
NVRAM non-volatile random access memory
ODD optical disk drive
OS operating system
PAL 1. programmable array logic 2. phase alternating line
PATA Parallel ATA
PC Personal computer
PCA Printed circuit assembly
PCI peripheral component interconnect
PCI-E PCI Express
PCM pulse code modulation
PCMCIA Personal Computer Memory Card International Association
PEG PCI express graphics
PFC Power factor correction
Introduction
PIN personal identification number
PIO Programmed I/O
PN Part number
POST power-on self test
PROM programmable read-only memory
PTR pointer
RAID Redundant array of inexpensive disks (drives)
RAM random access memory
RAS row address strobe
rcvr receiver
RDRAM (Direct) Rambus DRAM
RGB red/green/blue (monitor input)
RH Relative humidity
RMS root mean square
ROM read-only memory
RPM revolutions per minute
RTC real time clock
R/W Read/Write
SATA Serial ATA
SCSI small computer system interface
SDR Singles data rate (memory)
Technical Reference Guide www.hp.com 1-7
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
SDRAM Synchronous Dynamic RAM
SDVO Serial digital video output
SEC Single Edge-Connector
SECAM sequential colour avec memoire (sequential color with memory)
SF sign flag
SGRAM Synchronous Graphics RAM
SIMD Single instruction multiple data
SIMM single in-line memory module
SMART Self Monitor Analysis Report Technology
SMI system management interrupt
SMM system management mode
SMRAM system management RAM
SODIMM small outline DIMM
SPD serial presence detect
SPDIF Sony/Philips Digital Interface (IEC-958 specification)
SPN Spare part number
SPP standard parallel port
SRAM static RAM
SSD solid state disk (drive)
SSE Streaming SIMD extensions
STN super twist pneumatic
SVGA super VGA
SW software
TAD telephone answering device
TAFI Temperature-sensing And Fan control Integrated circuit
TCP tape carrier package, transmission control protocol
TF trap flag
TFT thin-film transistor
TIA Telecommunications Information Administration
TPE twisted pair ethernet
TPI track per inch
TPM Trusted Platform Module
TTL transistor-transistor logic
TV television
1-8 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
Abbreviation Description
TX transmit
UART universal asynchronous receiver/transmitter
UDMA Ultra DMA
UDIMM unregistered/unbuffered DIMM
URL Uniform resource locator
us/µs microsecond
USB Universal Serial Bus
UTP unshielded twisted pair
Vvolt
VAC Volts alternating current
VDC Volts direct current
VESA Video Electronic Standards Association
VGA video graphics adapter
Introduction
VLSI very large scale integration
VRAM Video RAM
Wwatt
WOL Wake -On-LAN
WRAM Windows RAM
ZF zero flag
ZIF zero insertion force (socket)
Technical Reference Guide www.hp.com 1-9
Introduction
1-10 www.hp.com Technical Reference Guide
2.1 Introduction
The HP Compaq 8000 Elite Business PC personal computers (Figure 2-1) deliver an outstanding
combination of manageability, serviceability, and compatibility for enterprise environments.
Based on the Intel processor with the Intel® Q45 Express chipset, these systems emphasize
performance along with industry compatibility. These models feature a similar architecture
incorporating both PCI 2.3 and PCIe 1.1 buses. All models are easily upgradeable and
expandable to keep pace with the needs of the office enterprise.
2
System Overview
HP 8000 Elite USDT
Figure 2-1. HP Compaq 8000 Elite Business PCs
This chapter includes the following topics:
■ Features (2.2)
■ System architecture (2.3)
■ Specifications (2.4)
Technical Reference Guide www.hp.com 2-1
HP 8000 Elite SFF
HP 8000 Elite CMT
System Overview
2.2 Features
The following standard features are included on all models unless otherwise indicated:
■ Intel processor in LGA775 (Socket T) package
■ Integrated graphics controller with dual monitor support:
❏ One VGA connector
❏ One DisplayPort (DP) connector with Multimode support
■ PC3-6400 and PC3-8500 (DDR3) DIMM support
■ Hard drive fault prediction
■ Ten externally-accessible USB 2.0-compliant ports
■ High definition (HD) audio processor with one headphone output, at least one microphone
input, one line output, and one line input
■ Network interface controller providing 10/100/1000Base T support
■ Plug 'n Play compatible (with ESCD support)
■ Intelligent Manageability support
■ PS/2 enhanced keyboard
■ PS/2 optical scroll mouse
■ Management/security features including:
❏ Flash ROM Boot Block
❏ Diskette drive disable, boot disable, write protect
❏ Power-on password
❏ Administrator password
❏ Serial port disable (SFF and CMT form factors only)
❏ Smart Cover (hood) Sense
❏ Smart Cover (hood) Lock (SFF and CMT form factors only)
❏ Tower stand (USDT form factor only)
❏ USB port disable
❏ Intel Standard Manageability support
❏ Intel vPro Technology
❏ HP Virtual Safe Browser
❏ HP ProtectTools Embedded Security
■ Energy Star compliancy met by all USDT form factors (Energy Star-qualified configurations
of SFF and CMT form factors are available).
2-2 www.hp.com Technical Reference Guide
System Overview
Table 2-1 shows the differences in features between the different PC series based on form factor:
Table 2-1
Feature Differences by Form Factor
USDT SFF CMT
Processor types supported Intel Celeron,
Pentium dual-core,
Core 2 Duo
Processor wattage (max) 65 W 95 W 95 W
Memory:
# & type of sockets
Maximum memory
Serial ports 0 1 std., 1 opt. [1] 1 std., 1 opt. [1]
Parallel ports 0 optional optional
Drive bays:
Externally accessible
Internal
Drive types supported 1 HDD,
PCIe slots:
x16 graphics (PCIe 2.0)
x1 connector (PCIe 1.1)
x4 x16 connector)
2 SODIMMs
8 GB
1 - 5.25”
1 - 2.5”
1 slimline ODD
0
0
0
Intel Celeron,
Pentium dua l-core,
Core 2 Duo,
Core 2 Quad
4 UDIMMs
16 G B
1 - 5.25”, 1 - 3.5”
1 - 3.5”
2 HDDs,
1ODD,
RAID1
1 [3, 4]
2[3]
0
Intel Celeron,
Pentium dual-core,
Core 2 Duo,
Core 2 Quad
4 UDIMMs
16 G B
3 - 5.25”
3 - 3.5”
2 HDDs,
2 ODDs,
RAID1
1
1
1
PCI 2.3 32-bit 5-V slots 0 1 [3, 5] 3 full-height
Power Supply Unit:
Module type
power rating
NOTES:
[1] 2nd serial port requires optional cable/bracket assembly.
[2] PCIe Mini Card slot.
[3] Supports low-profile card in standard configuration. Not accessible if PCI riser card field option
is installed.
[4] Accepts low-profile PCIe card: height = 2.5 in., length = 6.6 in.
[5] Full-height PCI slots require installation of PCI riser card field option (full-height dimensions: height
= 4.2 in., length = 6.875 in).
Technical Reference Guide www.hp.com 2-3
external
13 5 - w a t t
internal
240 -watt
internal
320 -watt
System Overview
2.3 System Architecture
The systems covered in this guide feature an architecture based on the Intel Q45 Express chipset
(Figure 2-2). All systems covered in this guide include the following key components:
■ Intel Pentium Dual-Core, Core™ 2 Duo, Core 2 Quad, or Celeron processor.
■ Intel Q45 Express chipset - Includes Q45 GMCH and 82801 ICH10-DO
■ Super I/O (SIO) controller supporting PS/2 keyboard and mouse peripherals
■ ALC261 audio controller supporting line in, line out, microphone in, and headphones out
■ Intel 82567LM GbE network interface controller
■ HP ProtectTools Embedded Security
The Q45 chipset provides a major portion of system functionality. Designed to complement the
latest Intel processors, the Q45 GMCH integrates with the processor through a
800/1066/1333-MHz Front-Side Bus (FSB) and communicates with the ICH10-DO component
through the Direct Media Interface (DMI). The integrated graphics controller of the Q45 on SFF
and CMT systems can be upgraded through a PCI Express (PCIe) x16 graphics slot. All systems
include a serial ATA (SATA) hard drive in the standard configuration.
Table 2-2 lists the differences between models by form factor.
Table 2-2.
Architectural Differences by Form Factor
Function USDT SFF CMT
Memory sockets 2 SODIMMs 4 UDIMMs 4 UDIMMs
PCIe 2.0 x16 graphics slots 0 1 [1] 1
PCIe x4 (x16 connector) slots 0 0 1
# of PCIe 1.1 x1 slots 0 1 [1] 1
# of PCI 2.3 slots 0 1 [3] 3
Serial port 0 1 [4] 1 [4]
Parallel ports 0 optional optonal
SATA interfaces 2 3 5
eSATA capability [2] No Yes Yes
Notes:
[1] Low-profile slot. Not accessible if PCI riser is installed.
[2] Requires optional bracket/cable assembly.
[3] Low-profile slot in standard configuration. 2 full-height slots supported with optional PCI riser.
[4] 2nd serial port possible with optional adapter.
2-4 www.hp.com Technical Reference Guide
Intel
Processor
800/1066/1333-MHz FSB
System Overview
Analog
VGA
Monitor
Digital
DisplayPort
Monitor
PCIe x16 (PEG) slot [2]
SATA
SATA
Hard Drive
Additional
SATA
SATA
Devices
SATA/eSATA
ALC261
Audio
Subsystem
HP ProtectTools
Embedded Security
System board
12 VDC [2]
19 VDC [5]
Switch [2]
Graphics
Cntlr.
SATA
I/F [1]
Audio I/F
NIC
I/F
SDRAM
Q45
GMCH
Cntlr
DMI
DMI
USB
I/F
82801
ICH10-D0
LPC I/F
PCI Cntlr.
PCI 2.3 slots [3]
PCIe 1.1 x1 slots [4]
PCIe 1.2 Mini-card slot [5]
Ch A DDR3
SDRAM
Ch B DDR3
SDRAM
USB 2.0
(6 rear ports,
4 front ports)
Serial I/F [2]
SIO Controller
Kybd-Mouse I/F
Keyboard
Parallel I/F [2]
Mouse
Power Supply
Notes:
[1] 2 SATA ports in USDT, 3 SATA ports in SFF, 4 SATA ports in CMT, and 1 eSATA port in SFF and CMT.
[2] SFF and CMT only
[3] 1 in SFF, 3 in CMT
[4] 2 in SFF, 1 in CMT
[5] USDT only
Figure 2-2. HP Compaq 8000 Elite Business PC Architecture, Block diagram
Technical Reference Guide www.hp.com 2-5
PCIe x4 (x16 conn.) [2]
System Overview
2.3.1 Intel Processor Support
The models covered in this guide are designed to support Intel Celeron single and dual core
processors, Intel Pentium Dual-Core processors, Intel Core2 Duo processors, and Intel Core2
Quad processors. These processors are backward-compatible with software written for earlier
x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for
enhancing 3D graphics and speech processing performance. Intel processors with vPro
Technology include hardware-based tools that allow corporate IT organizations to remotely
manage and protect systems.
The system board includes a zero-insertion-force (ZIF) Socket-T designed for mounting an
LGA775-type processor package.
CAUTION: The USDT form factor can support a processor rated up to 65 watts. The SFF and CMT form
Ä
factors can support a processor rated up to 95 watts. Exceeding these limits can result in system damage
and loss of data.
The processor heatsink/fan assembly mounting differs between form factors. Always use the
✎
same assembly or one of the same type when replacing the processor. Refer to the applicable
Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan
assembly and the processor.
2.3.2 Chipset
The Intel Q45 Express chipset consists of a Graphics Memory Controller Hub (GMCH) and an
enhanced I/O controller hub (ICH10-DO). Table 2-3 compares the functions provided by the
chipsets.
Components Function
Q45 GMCH Intel Graphics Media Accelerator 4500 (integrated graphics controller)
82801 ICH10-DO PCI 2.3 bus I/F
Table 2-3
Chipset Components and Functionality
PCIe 2.0 x16 graphics interface (1)
SDRAM controller supporting unbuffered, non-ECC DDR3 modules
FSB speed of 800-, 1066-, or 1333-MHz
PCIe bus I/F
LPC bus I/F
SMBus I/F
SATA I/F
HD audio interface
RTC/CMOS
IRQ controller
Power management logic
USB 1.1/2.0 controllers supporting 12 ports
Gigabit Ethernet controller
2-6 www.hp.com Technical Reference Guide
2.3.3 Support Components
Input/output functions not provided by the chipset are handled by other support components.
Some of these components also provide “housekeeping” and various other functions as well.
Table 2-4 shows the functions provided by the support components.
Support Component Functions
Component Name Function
WPCD376H SIO Controller Keyboard and pointing device I/F
Serial I/F (COM1and COM2) [2]
Parallel I/F (LPT1, LPT2, or LPT3) [3]
PCI reset generation
Interrupt (IRQ) serializer
Power button and front panel LED logic
GPIO ports
Processor over temperature monitoring
Fan control and monitoring
Power supply voltage monitoring
SMBus and Low Pin Count (LPC) bus I/F
System Overview
Table 2-4
Intel 82567LM Network Interface
Controller
ALC261 HD Audio Codec Audio mixer
NOTES:
[1] Not used in USDT form factor.
[2] Com1 supported only on SFF and CMT form factors. COM2 requires external bracket/cable
assembly.
[3] Supported only on SFF and CMT form factors, requires external bracket/cable assembly.
10/100/1000 Fast Ethernet network interface controller.
Two digital-to-analog stereo converters
Two analog-to-digital stereo converters
Analog I/O
Supports stereo (two-channel) audio streams
2.3.4 System Memory
These systems implement a dual-channel Double Data Rate (DDR3) memory architecture. All
models support DDR3 1333-, 1066, and 800-MHz memory modules. The USDT system
provides two SODIMM sockets supporting up to eight gigabytes of memory while the SFF and
CMT form factors provide four UDIMM sockets and support a total of 16 gigabytes of memory.
1333-MHz memory modules are clocked down to 1066 megahertz
✎
SODIMM and DIMM components are NOT interchangeable.
✎
Technical Reference Guide www.hp.com 2-7
System Overview
2.3.5 Mass Storage
All models support at least two mass storage devices, with one being externally accessible for
removable media. These systems provide the following interfaces for internal storage devices:
USDT: two SATA interfaces
SFF: three SATA interfaces (one eSATA port optional)
CMT: five SATA interfaces (one eSATA port optional)
These systems may be preconfigured or upgraded with a SATA hard drive and one removable
media drive such as a CD-ROM drive.
2.3.6 Serial Interface
The SFF and CMT form factors include a serial port accessible at the rear of the chassis. The SFF
and CMT form factors may be upgraded with a second serial port option. The serial interface is
RS-232-C/16550-compatible and supports standard baud rates up to 115,200 as well as two
high-speed baud rates of 230K and 460K.
2.3.7 Universal Serial Bus Interface
All models provide ten Universal Serial Bus (USB) ports. Two ports are accessible at the front of
the unit, six ports are accessible on the rear panel, and two ports are accessible through a header
on the system board. The SFF and CMT form factors support a media card reader module that
connects to the internal header. These systems support USB 1.1 and 2.0 functionality on all ports.
BIOS Setup allows for the disabling of USB ports individually or in groups. In order to secure
the system against a physical attack, ports may be disabled even if there is nothing physically
connected to them, such as the two front ports for the media card reader module when the
module is not present.
2.3.8 Network Interface Controller
All models feature an Intel gigabit Network Interface Controller (NIC) integrated on the system
board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or
1000BASE-T operation with a local area network and includes power-down, wake-up,
Alert-On-LAN (AOL), Alert Standard Format (ASF), and AMT features. An RJ-45 connector
with status LEDs is provided on the rear panel.
2-8 www.hp.com Technical Reference Guide
2.3.9 Graphics Subsystem
These systems use the Q45 GMCH component, which includes an integrated graphics controller
that can drive both an external VGA monitor and a DisplayPort digital display. The controller
implements Dynamic Video Memory Technology (DVMT 3.0) for video memory. Table 2-5
lists the key features of the integrated graphics subsystem.
Integrated Graphics Subsystem Statistics
Recommended for Hi 2D, Entry 3D
Bus Type Int. PCI Express
Memory Amount 32 MB pre-allocated
Memory Type DVMT 3.0
DAC Speed 400 MHz
System Overview
Table 2-5
Q45 GMCH
Integrated Graphics Controller
Maximum 2D Resolution 2048x1536 @ 85 Hz
Hardware Acceleration Quick Draw,
Outputs 1 VGA, 1 DisplayPort 1.1 [see text]
All systems include a legacy VGA connector and a DisplayPort connector and support dual
monitor operation. The DisplayPort includes a multimode feature that allows a DVI or VGA
adapter to be connected to the DisplayPort.
These systems also include two PCIe graphics slots (one x16, one x4/x16 connector) to ensure
full graphics upgrade capabilities.
2.3.10 Audio Subsystem
These systems use the integrated High Definition audio controller of the chipset and the ADI
ADL261 High Definition audio codec. HD audio provides enhanced audio performance with
higher sampling rates, refined signal interfaces, and audio processors with increased
signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and
multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an
internal speaker, which can be muted with the F10 BIOS control. All models include front
panel-accessible stereo microphone input and headphone output audio jacks.
DirectX 9,
Direct Draw,
Direct Show,
Open GL 1.45,
MPEG 1-2,
Indeo
Technical Reference Guide www.hp.com 2-9
System Overview
2.3.11 HP ProtectTools Embedded Security
HP ProtectTools Embedded Security is a hardware/software solution providing file and folder
encrypytion service that integrates with the operating system. The software component—the HP
ProtectTools Embedded Security Manager (preinstalled), controls the basic operation of the
hardware component—the Trusted Platform Module (TPM) security chip. These components are
compliant with the Trusted Computing Group (TCG) security standards organization.
HP ProtectTools Embedded Security includes the following features:
■ Enhanced Windows operating system files and folder encryption
■ Enhanced email encryption—built-in authentication for Outlook, Outlook Express, Lotus
Notes, Eudora
■ Strengthends defense against hacking, system attacks, denial of service and network attacks
■ “Embedded smart card” functionality
■ Strengthens authentication with LANs, WANs.
■ Works with/enhances third-party security solutions
HP ProtectTools Embedded Security Manager is acecssed through a Windows Control Panel
applet. The management functions are accessible thro;ugh establishlished protocols such as
DMI, SNMP, or WEBEM.
2.4 Specifications
This section includes the environmental, electrical, and physical specifications for the systems
covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications
are subject to change without notice.
Environmental Specifications (Factory Configuration)
Parameter Operating Non-operating
Ambient Air Temperature 50
Shock (w/o damage) 5 Gs [1] 20 Gs [1]
Vibration 0.000215 G
Humidity 10-90% Rh @ 28
Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]
NOTE:
[1] Peak input acceleration during an 11 ms half-sine shock pulse.
[2] Maximum rate of change: 1500 ft/min.
Table 2-6
o
to 95o F (10o to 35o C, max.
rate of change <
wet bulb temperature
10°C/Hr)
2
/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz
o
C max.
o
-22
to 140o F (-30o to 60o C, max.
rate of change <
5-95% Rh @ 38.7o C max.
wet bulb temperature
20°C/Hr)
2-10 www.hp.com Technical Reference Guide
Table 2-7
Power Supply Electrical Specifications
Parameter Value
Input Line Voltage:
Nominal:
Maximum
Input Line Frequency Range:
Nominal
Maximum
Energy Star 4.0 with 80Plus Bronze-level compliancy
USDT
SFF & CMT
Maximum Continuous Power:
USDT
SFF
CMT
100–240 VAC
90–264 VAC
50–60 Hz
47–63 Hz
Standard
Optional
135 w a t ts
240 watts
320 watts
System Overview
NOTE:
Energy Star 4.0 with 80Plus Bronze-level compliancy option available for SFF and CMT form factors.
Table 2-8
Physical Specifications
Parameter USDT [2] SFF [2] CMT [3]
Height 2.60 in
(6.60 cm)
Width 9.90 in
(25.15 cm)
Depth 10.0 in
(25.40 cm)
Weight [1] 7.0 lb
(3.18 kg)
NOTES:
[1] System configured with 1 hard drive, 1 optical media drive (SFF and CMT only), and no PCI cards.
[2] Desktop (horizontal) configuration.
[3] Minitower configuration. For desktop configuration, swap Height and Width dimensions.
[4] Applicable to unit in desktop orientation only and assumes reasonable type of load such as a monitor.
3.95 in
(10.03 c m)
13. 3 i n
(33.78 cm)
14.9 in
(37.85 cm)
16. 72 l b
(7.60 kg)
17. 6 3 i n
(44.8 cm)
7.0 i n
(16. 8 c m)
17.8 i n
(45.21 cm)
24.54 lb
(11.15 k g )
Technical Reference Guide www.hp.com 2-11
System Overview
2-12 www.hp.com Technical Reference Guide
3.1 Introduction
This systems support the Intel Pentium and Core processor families and use the Q45 chipset
(Figure 3-1). These systems support PC3-6400, PC3-8500, and PC3-10600 memory modules.
This chapter describes the processor/memory subsystem.
3
Processor/Memory Subsystem
Intel
Processor
FSB I/F
Intel
Q45
GMCH
Note:
[1] Not present on USDT form factor.
Figure 3-1. Processor/Memory Subsystem Architecture
DDR3
SDRAM
Cntrl
Channel A
Channel B
This chapter includes the following topics:
XMM1
DIMM
or
SODIMM
DIMM
or
SODIMM
XMM3
XMM2 [1]
DIMM
DIMM
XMM4 [1]
■ Intel processor (3.2)
■ Memory subsystem (3.3)
Technical Reference Guide www.hp.com 3-1
Processor/Memory Subsystem
3.2 Intel Processors
These systems each feature an Intel processor in a FC-LGA775 package mounted with a heat
sink in a zero-insertion force socket. The mounting socket allows the processor to be easily
changed for upgrading.
3.2.1 Intel Processor Overview
The models covered in this guide support Intel Celeron, Pentium, and Core 2 processors,
including the latest Intel Core 2 Duo, and Core 2 Quad processors.
Key features of supported Intel processors include:
■ Dual- or quad-core architecture—Provides full parallel processing.
■ Execution Trace Cache— A new feature supporting the branch prediction mechanism, the
trace cache stores translated sequences of branching micro-operations (ops) and is checked
when suspected re-occurring branches are detected in the main processing loop. This feature
allows instruction decoding to be removed from the main processing loop.
■ Rapid Execution Engine—Arithmetic Logic Units (ALUs) run at twice (2x) processing
frequency for higher throughput and reduced latency.
■ Up to 12-MB of L2 cache—Using a 32-byte-wide interface at processing speed, the large L2
cache provides a substantial increase.
■ Advanced dynamic execution—Using a larger (4K) branch target buffer and improved
prediction algorithm, branch mis-predictions are significantly reduced
■ Additional Streaming SIMD extensions (SSE2 and SSE3)—In addition to the SSE support
provided by earlier processors, the latest processors include additional MMX instructions
that enhance:
❏ Streaming video/audio processing
❏ Photo/video editing
❏ Speech recognition
❏ 3D processing
❏ Encryption processing
■ Quad-pumped Front Side Bus (FSB)—The FSB uses a 200-MHz clock for qualifying the
buses' control signals. However, address information is transferred using a 2x strobe while
data is transferred with a 4x strobe, providing a maximum data transfer rate that is four times
that of earlier processors.
The Intel processor increases processing speed by using higher clock speeds with
hyper-pipelined technology, therefore handling significantly more instructions at a time. The
Arithmetic Logic Units (ALUs) of all processors listed above run at twice the core speed.
3-2 www.hp.com Technical Reference Guide
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