HP ProLiant BL660c Gen8 Server Blade
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
August 2012
Edition: 1
© Copyright 2012 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Bluetooth® is a trademark owned by its proprietor and used by Hewlett-Packard Company under license.
Contents
Component identification ............................................................................................................... 6
Front panel components ............................................................................................................................. 6
Front panel LEDs and buttons ...................................................................................................................... 6
Drive LED definitions .................................................................................................................................. 7
System board components .......................................................................................................................... 8
Mezzanine connector definitions ....................................................................................................... 9
DIMM slot locations ......................................................................................................................... 9
Tool locations ......................................................................................................................................... 10
HP c-Class Blade SUV Cable..................................................................................................................... 10
Operations ................................................................................................................................. 12
Power up the server blade ........................................................................................................................ 12
Power down the server blade .................................................................................................................... 12
Remove the server blade .......................................................................................................................... 13
Remove the access panel.......................................................................................................................... 14
Remove a drive ....................................................................................................................................... 14
Removing DIMM baffles ........................................................................................................................... 14
Remove the center DIMM baffle ....................................................................................................... 14
Remove the left DIMM baffle ........................................................................................................... 15
Remove the right DIMM baffle ......................................................................................................... 16
Remove the front panel/drive cage assembly .............................................................................................. 16
Remove the FBWC capacitor pack ............................................................................................................ 17
Setup ......................................................................................................................................... 19
Installing an HP BladeSystem c-Class enclosure ........................................................................................... 19
Preparing the enclosure .................................................................................................................. 19
Installing interconnect modules .................................................................................................................. 22
Interconnect bay numbering and device mapping .............................................................................. 23
Connecting to the network ........................................................................................................................ 24
Installing server blade options ................................................................................................................... 24
Installing a server blade ........................................................................................................................... 24
Assembling a full height blank .................................................................................................................. 25
Completing the configuration .................................................................................................................... 26
Hardware options installation ....................................................................................................... 27
Introduction ............................................................................................................................................ 27
Drive option ........................................................................................................................................... 27
Processor option ...................................................................................................................................... 28
Memory options ...................................................................................................................................... 32
HP SmartMemory .......................................................................................................................... 33
Memory subsystem architecture ....................................................................................................... 33
Single-, dual-, and quad-rank DIMMs ............................................................................................... 34
DIMM identification ....................................................................................................................... 35
Memory configurations ................................................................................................................... 35
General DIMM slot population guidelines ......................................................................................... 37
Installing a DIMM .......................................................................................................................... 38
FBWC capacitor pack options .................................................................................................................. 39
Contents 3