HP BL460C G6 User Manual

HP ProLiant BL460c G6 Server Blade User Guide

Part Number 501274-001 March 2009 (First Edition)

© Copyright 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft, Windows, Windows NT, and Windows Server are U.S. registered trademarks of Microsoft Corporation. AMD Athlon is a trademark of Advanced Micro Devices, Inc. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Java is a US trademark of Sun Microsystems, Inc.

Intended audience

This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.

Component identification............................................................................................................... 6

Front panel components ............................................................................................................................. 6

Front panel LEDs ....................................................................................................................................... 7

SAS and SATA hard drive LEDs................................................................................................................... 8

SAS and SATA hard drive LED combinations ................................................................................................ 8

System board components.......................................................................................................................... 9

Mezzanine connector definitions ..................................................................................................... 10

DIMM slot locations .......................................................................................................................10

System maintenance switch............................................................................................................. 10

HP c-Class Blade SUV Cable..................................................................................................................... 11

Operations................................................................................................................................. 12

Power up the server blade........................................................................................................................ 12

Power down the server blade.................................................................................................................... 12

Remove the server blade .......................................................................................................................... 13

Remove the access panel.......................................................................................................................... 14

Install the access panel............................................................................................................................. 14

Remove the DIMM baffle.......................................................................................................................... 14

Setup......................................................................................................................................... 15

Overview ...............................................................................................................................................15

Installing an HP BladeSystem c-Class enclosure ...........................................................................................15

Installing server blade options................................................................................................................... 15

Installing interconnect modules.................................................................................................................. 15

Interconnect bay numbering and device mapping.............................................................................. 16

Connecting to the network........................................................................................................................ 18

Installing a server blade ........................................................................................................................... 18

Hardware options installation....................................................................................................... 21

Introduction ............................................................................................................................................ 21

Hard drive option.................................................................................................................................... 21

Processor option...................................................................................................................................... 22

Memory options...................................................................................................................................... 27

Memory subsystem architecture ....................................................................................................... 27

Single-, dual-, and quad-rank DIMMs ............................................................................................... 28

DIMM identification.......................................................................................................................28

Memory configurations................................................................................................................... 29

General DIMM slot population guidelines.........................................................................................30

Installing a DIMM.......................................................................................................................... 33

Mezzanine card option............................................................................................................................ 34

Cache module and battery pack option...................................................................................................... 35

HP Trusted Platform Module option ............................................................................................................ 39

Installing the Trusted Platform Module board ..................................................................................... 40

Retaining the recovery key/password .............................................................................................. 43

Enabling the Trusted Platform Module............................................................................................... 43

Cabling ..................................................................................................................................... 45

Contents 3

BBWC battery pack cabling .....................................................................................................................45

Using the HP c-Class Blade SUV Cable ...................................................................................................... 45

Connecting locally to a server blade with video and USB devices.................................................................. 45

Accessing a server blade with local KVM .........................................................................................46

Accessing local media devices........................................................................................................ 46

Software and configuration utilities ............................................................................................... 48

Server blade deployment tools .................................................................................................................. 48

Software drivers and additional components..................................................................................... 48

HP BladeSystem c-Class Advanced management ............................................................................... 48

Network-based PXE deployment ...................................................................................................... 49

Deployment methods...................................................................................................................... 51

Configuration tools.................................................................................................................................. 54

SmartStart software........................................................................................................................ 54

HP ROM-Based Setup Utility............................................................................................................ 55

Array Configuration Utility.............................................................................................................. 57

Option ROM Configuration for Arrays .............................................................................................57

Re-entering the server serial number and product ID........................................................................... 58

Management tools................................................................................................................................... 58

Automatic Server Recovery .............................................................................................................58

ROMPaq utility.............................................................................................................................. 59

Integrated Lights-Out 2 technology................................................................................................... 59

Erase Utility ..................................................................................................................................59

StorageWorks library and tape tools................................................................................................ 59

HP Systems Insight Manager........................................................................................................... 60

Management Agents...................................................................................................................... 60

HP ProLiant Essentials Virtualization Management Software ................................................................60

HP ProLiant Essentials Vulnerability and Patch Management Pack ........................................................60

HP Insight Server Migration software for ProLiant...............................................................................61

HP ProLiant Essentials Performance Management Pack .......................................................................61

HP Insight Control Environment Suites............................................................................................... 62

HP Insight Control Linux Edition ....................................................................................................... 62

Redundant ROM support ................................................................................................................ 62

USB support and functionality ......................................................................................................... 63

Diagnostic tools ...................................................................................................................................... 63

HP Insight Diagnostics.................................................................................................................... 63

HP Insight Diagnostics survey functionality ........................................................................................64

Integrated Management Log ...........................................................................................................64

Array Diagnostic Utility ..................................................................................................................64

Remote support and analysis tools............................................................................................................. 65

HP Insight Remote Support software ................................................................................................. 65

Keeping the system current ....................................................................................................................... 65

Drivers ......................................................................................................................................... 65

ProLiant Support Packs ................................................................................................................... 66

Operating system version support.................................................................................................... 66

HP Smart Update Manager............................................................................................................. 66

System Online ROM flash component utility ......................................................................................66

Change control and proactive notification ........................................................................................ 67

Care Pack ....................................................................................................................................67

Troubleshooting.......................................................................................................................... 68

Troubleshooting resources ........................................................................................................................68

Pre-diagnostic steps ................................................................................................................................. 68

Important safety information............................................................................................................ 69

Contents 4

Symptom information ..................................................................................................................... 70

Prepare the server for diagnosis ......................................................................................................70

Service notifications................................................................................................................................. 71

Loose connections ...................................................................................................................................71

Troubleshooting flowcharts .......................................................................................................................71

Start diagnosis flowchart ................................................................................................................72

General diagnosis flowchart ........................................................................................................... 73

Server blade power-on problems flowchart .......................................................................................75

POST problems flowchart ............................................................................................................... 77

OS boot problems flowchart ...........................................................................................................79

Server fault indications flowchart ..................................................................................................... 81

POST error messages and beep codes....................................................................................................... 83

Battery replacement .................................................................................................................... 84

Regulatory compliance notices ..................................................................................................... 86

Regulatory compliance identification numbers............................................................................................. 86

Federal Communications Commission notice............................................................................................... 86

FCC rating label............................................................................................................................ 86

Class A equipment......................................................................................................................... 86

Class B equipment......................................................................................................................... 86

Declaration of conformity for products marked with the FCC logo, United States only....................................... 87

Modifications.......................................................................................................................................... 87

Cables................................................................................................................................................... 87

Canadian notice (Avis Canadien).............................................................................................................. 88

European Union regulatory notice .............................................................................................................88

Disposal of waste equipment by users in private households in the European Union......................................... 88

Japanese notice ...................................................................................................................................... 89

BSMI notice............................................................................................................................................ 89

Korean notice ......................................................................................................................................... 89

Chinese notice ........................................................................................................................................ 90

Laser compliance .................................................................................................................................... 90

Battery replacement notice........................................................................................................................ 90

Taiwan battery recycling notice................................................................................................................. 91

Acoustics statement for Germany (Geräuschemission) .................................................................................. 91

Electrostatic discharge................................................................................................................. 92

Preventing electrostatic discharge.............................................................................................................. 92

Grounding methods to prevent electrostatic discharge.................................................................................. 92

Specifications............................................................................................................................. 93

Environmental specifications ..................................................................................................................... 93

Server blade specifications....................................................................................................................... 93

Technical support........................................................................................................................ 94

Before you contact HP.............................................................................................................................. 94

HP contact information............................................................................................................................. 94

Customer Self Repair ...............................................................................................................................94

Acronyms and abbreviations...................................................................................................... 102

Index....................................................................................................................................... 105

Contents 5

Component identification

Front panel components

Item Description

1 SUV connector* 2 Serial label pull tab 3 Release button 4 Server blade release lever 5 Power On/Standby button 6 Hard drive bay 1 7 Hard drive bay 2

*The SUV connector and the HP c-Class Blade SUV Cable are for some server blade configuration and diagnostic procedures.

Component identification 6

Front panel LEDs

Item Description Status

1 UID LED Blue = Identified

Blue flashing = Active remote management Off = No active remote management

2 Health LED Green = Normal

Flashing = Booting Amber = Degraded condition Red = Critical condition

3 Flex-10 NIC 1 LED* Green = Network linked

Green flashing = Network activity Off = No link or activity

4 Flex-10 NIC 2 LED* Green = Network linked

Green flashing = Network activity

Off = No link or activity 5 Reserved — 6 System power LED Green = On

Amber = Standby (auxiliary power available)

*Actual NIC numbers depend on several factors, including the operating system installed on the server blade.

Off = Off

Component identification 7

SAS and SATA hard drive LEDs

Item Description

1 Fault/UID LED (amber/blue) 2 Online LED (green)

SAS and SATA hard drive LED combinations

Online/activity LED (green)

On, off, or flashing Alternating amber

On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a

On Amber, flashing

On Off The drive is online, but it is not active currently. Flashing regularly

(1 Hz)

Flashing regularly (1 Hz)

Fault/UID LED

Interpretation

(amber/blue)

The drive has failed, or a predictive failure alert has been

and blue

regularly (1 Hz)

Amber, flashing regularly (1 Hz)

Off Do not remove the drive. Removing a drive may terminate the

received for this drive; it also has been selected by a management application.

management application. A predictive failure alert has been received for this drive. Replace the drive as soon as possible.

Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.

The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.

current operation and cause data loss. The drive is rebuilding, erasing, or it is part of an array that is

undergoing capacity expansion or stripe migration.

Component identification 8

Online/activity LED (green)

Flashing irregularly Amber, flashing

Fault/UID LED (amber/blue)

regularly (1 Hz)

Interpretation

The drive is active, but a predictive failure alert has been

received for this drive. Replace the drive as soon as possible. Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and

the controller has placed it offline. Replace the drive as soon as

possible. Off Amber, flashing

regularly (1 Hz)

A predictive failure alert has been received for this drive.

Replace the drive as soon as possible. Off Off The drive is offline, a spare, or not configured as part of an

array.

System board components

Item Description

1 System board thumbscrews (2) 2 SD card slot 3 Internal USB connector 4 Hard drive backplane connector 5 Processor 2 DIMM slots (6) 6 Processor socket 2 7 Mezzanine connector 1 (Type I mezzanine only) 8 Mezzanine connector 2 (Type I or Type II mezzanine) 9 System battery 10 Battery tray 11 Enclosure connector 12 Embedded NICs (2) 13 System maintenance switch 14 Processor 1 DIMM slots (6)

Component identification 9

Item Description

15 Processor socket 1 (populated) 16 TPM connector 17 Cache module connector

The symbols correspond to the symbols located on the interconnect bays. For more information, see the HP ProLiant BL460c G6 Server Blade Installation Instructions that ship with the server blade.

Mezzanine connector definitions

A PCIe x8 mezzanine connector supports x16 cards at up to x8 speeds.

Item PCIe

Mezzanine connector 1 x8, Type I mezzanine card only Mezzanine connector 2 x8, Type 1 or II mezzanine card

DIMM slot locations

DIMM slots are numbered sequentially (1 through 6) for each processor. The supported AMP modes use the letter assignments for population guidelines.

System maintenance switch

Position Function Default

1* iLO 2 security override Off 2 Configuration lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset configuration Off 7 Reserved Off 8 Reserved Off

*To access redundant ROM, set S1, S5, and S6 to ON.

Component identification 10

HP c-Class Blade SUV Cable

Item Connector Description

1 Server blade For connecting to the SUV connector on the

server blade front panel 2 Video For connecting a video monitor 3 USB For connecting up to two USB devices 4 Serial For trained personnel to connect a null modem

serial cable and perform advanced diagnostic

procedures

Component identification 11

Operations

Power up the server blade

The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the server blade:

• Use a virtual power button selection through iLO 2.

• Press and release the Power On/Standby button.

When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to green.

For more information about the Onboard Administrator, see the enclosure setup and installation guide on the HP website (http://www.hp.com/support

For more information about iLO 2, see "Integrated Lights-Out 2 technology (on page 59)."

Power down the server blade

Before powering down the server blade for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

Depending on the Onboard Administrator configuration, use one of the following methods to power down the server blade:

• Use a virtual power button selection through iLO 2.

This method initiates a controlled remote shutdown of applications and the OS before the server blade enter standby mode.

• Press and release the Power On/Standby button.

This method initiates a controlled shutdown of applications and the OS before the server blade enter standby mode.

• Press and hold the Power On/Standby button for more than 4 seconds to force the server blade to

enter standby mode. This method forces the server blade to enter standby mode without properly exiting applications and

the OS. It provides an emergency shutdown method in the event of a hung application.

• Execute one of the following commands using the Onboard Administrator CLI:

poweroff server all

poweroff server all force

The first command initiates a controlled shutdown of applications and the OS before the server blade enter standby mode. The second form of the command forces the server blade to enter standby mode without exiting applications and the OS. This is an emergency method to force a shutdown in the event of a hung application.

Operations 12

• Use the Onboard Administrator GUI to initiate a shutdown:

a. Select the Enclosure Information tab, then select the Overall checkbox in the Device Bays item. b. Initiate a shutdown from the Virtual Power menu:

— Select Momentary Press to initiate a controlled shutdown of applications and the OS. — Select Press and Hold to initiate an emergency shutdown of applications and the OS.

IMPORTANT: When the server blade are in standby mode, auxiliary power is still being

provided. To remove all power from the server blade, remove the server blade from the enclosure.

After initiating a virtual power down command, be sure that the server blade go into standby mode by observing that the system power LED is amber.

Remove the server blade

CAUTION: Do not use the server blade release lever to lift or carry the server blade. Always

support the weight of the server blade by handling the chassis directly. Improper use can

To remove the component:

1. Identify the proper server blade.

2. Power down the server blade (on page 12).

3. Remove the server blade.

damage the release lever and the server blade.

4. Place the server blade on a flat, level work surface.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server blade

before beginning any installation procedure. Improper grounding can cause ESD.

Operations 13

Remove the access panel

To remove the component:

1. Power down the server blade (on page 12).

2. Remove the server blade (on page 13).

3. Lift the access panel latch and slide the access panel to the rear.

4. Remove the access panel.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server blade

before beginning any installation procedure. Improper grounding can cause ESD.

Install the access panel

1. Place the access panel on top of the server blade with the hood latch open. Allow the panel to

extend past the rear of the server blade approximately 0.8 cm (0.2 in).

2. Engage the anchoring pin with the corresponding hole in the latch.

3. Push down on the hood latch. The access panel slides to a closed position.

Remove the DIMM baffle

To remove the component:

1. Power down the server blade (on page 12).

2. Remove the server blade (on page 13).

3. Remove the access panel (on page 14).

4. Remove the DIMM baffle.

Operations 14

Setup

Overview

Installation of a server blade requires the following steps:

1. Install and configure an HP BladeSystem c-Class enclosure.

2. Install any server blade options.

3. Install interconnect modules in the enclosure.

4. Connect the interconnect modules to the network.

5. Install a server blade.

6. Complete the server blade configuration.

For definitions of the acronyms used in this document, refer to "Acronyms and abbreviations" in the server blade user guide.

Installing an HP BladeSystem c-Class enclosure

Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure. The most current documentation for server blades and other HP BladeSystem components is available at

the HP website (http://www.hp.com/go/bladesystem/documentation Documentation is also available in the following locations:

• Documentation CD that ships with the enclosure

• HP Business Support Center website (http://www.hp.com/support)

• HP Technical Documentation website (http://docs.hp.com)

Installing server blade options

Before installing and initializing the server blade, install any server blade options, such as an additional processor, hard drive, or mezzanine card.

Installing interconnect modules

For specific steps to install interconnect modules, see the documentation that ships with the interconnect module.

Setup 15

Interconnect bay numbering and device mapping

• HP BladeSystem c7000 Enclosure

To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded NIC or mezzanine signals.

Server blade signal Interconnect bay Interconnect bay labels

Flex-10 NIC 1 (embedded)

Flex-10 NIC 2 (embedded)

Mezzanine 1 3 and 4 Mezzanine 2 5 and 6

7 and 8

For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeSystem enclosure setup and installation guide on the HP website (http://www.hp.com/go/bladesystem/documentation

Setup 16

• HP BladeSystem c3000 Enclosure and Tower Enclosure

Server blade signal Interconnect bay

number

Flex-10 NIC 1, 2

Interconnect bay label

Notes

—

(embedded) Mezzanine 1 2 Mezzanine 2 3,4

Four port cards connect to bay 2

• Four port cards

• Ports 1 and 3 connect to bay 3

• Ports 2 and 4 connect to bay 4

Setup 17

Connecting to the network

To connect the HP BladeSystem to a network, each enclosure must be configured with network interconnect devices to manage signals between the server blades and the external network.

Two types of interconnect modules are available for HP BladeSystem c-Class enclosures: Pass-Thru modules and switch modules. For more information about interconnect module options, see the HP website (http://www.hp.com/go/bladesystem/interconnects

IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru

module to a network device that supports Gigabit speed.

Installing a server blade

CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade

or the enclosure unless all hard drive and device bays are populated with either a component

1. Remove the device bay blank.

or a blank.

Setup 18

Remove the enclosure connector cover.

3. Prepare the server blade for installation.

Setup 19

Install the server blade.

Setup 20

Hardware options installation

Introduction

If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server before

beginning any installation procedure. Improper grounding can cause electrostatic discharge.

Hard drive option

The server blade supports up to two SAS or SATA drives.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade

or the enclosure unless all hard drive and device bays are populated with either a component

1. Remove the SAS hard drive blank.

or a blank.

Hardware options installation 21

Prepare the hard drive.

3. Install the hard drive.

4. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and

SATA hard drive LED combinations" on page 8).

Processor option

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To avoid damage to the system board:

• Do not touch the processor socket contacts.

• Always install the processor socket cover after removing the processor from the socket.

• Do not tilt or slide the processor when lowering the processor into the socket.

CAUTION: To avoid damage to the processor:

• Handle the processor only by the edges.

• Do not touch the bottom of the processor, especially the contact area.

Hardware options installation 22

CAUTION: To prevent possible server blade malfunction and damage to the equipment,

multiprocessor configurations must contain processors with the same part number.

CAUTION: To prevent possible server blade overheating, always populate processor socket 2

with a processor and a heatsink or a processor socket cover and a heatsink blank.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

IMPORTANT: When installing the heatsink, align the guide pins on the processor retention

bracket with the alignment holes in the heatsink.

IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the

server blade does not power up.

NOTE: Do not discard the processor protective cover. Always install the processor protective

cover if the processor is removed from the socket.

To install the component:

1. Update the system ROM using any standard ROM flash mechanism.

2. Power down the server blade (on page 12).

3. Remove the server blade (on page 13).

4. Remove the access panel (on page 14).

5. Remove all DIMM baffles ("Remove the DIMM baffle" on page 14).

6. Remove the heatsink blank. Retain the heatsink blank for future use.

7. Open the processor retaining latch and the processor socket retaining bracket.

Hardware options installation 23

Remove the processor socket protective cover.

IMPORTANT: Be sure the processor remains inside the processor installation tool.

9. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.

Hardware options installation 24

10.

Align the processor installation tool with the socket and install the processor.

11. Press down firmly until the processor installation tool clicks and separates from the processor, and

then remove the processor installation tool.

Hardware options installation 25

12.

Close the processor socket retaining bracket and the processor retaining latch.

13. Remove the thermal interface protective cover from the heatsink.

Hardware options installation 26

14.

Align and install the heatsink. Alternate tightening the screws until the heatsink is seated properly.

15. Install all DIMM baffles.

16. Install the access panel (on page 14).

Memory options

IMPORTANT: This server blade does not support mixing RDIMMs and UDIMMs. Attempting to

mix these two types causes the server to halt during BIOS initialization.

The memory subsystem in this server blade can support RDIMMs or UDIMMs. Both types are referred to as DIMMs when the information applies to both types. When specified as RDIMM or UDIMM, the information applies to that type only. All memory installed in the server blade must be the same type.

The server blade supports the following DIMM speeds:

• Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1333 and 1066 MHz

• Quad-rank PC3-8500 (DDR-1067) DIMMs operating at 1066 MHz

Depending on the processor model, the number of DIMMs installed, and whether UDIMMs or RDIMMs are installed, the memory clock speed may be reduced to 1066 or 800 MHz. For more information on

Memory subsystem architecture

the effect of DIMM slot population, see "General DIMM slot population guidelines (on page 30)."

The memory subsystem in this server blade is divided into channels. Each processor supports three channels, and each channel supports two DIMM slots, as shown in the following table.

Channel Slot Slot number

1 D A 1

2 E B 3

Hardware options installation 27

Channel Slot Slot number

3 F C 5

This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture also enables the Mirrored Memory and Lockstep memory modes. This server blade supports both Registered PC3 DIMMs (RDIMMs) and Unbuffered DIMMs (UDIMMs).

DIMM slots in this server are identified by number and by letter. Letters identify the slots to populate for specific AMP modes. Slot numbers are reported by ROM messages during boot and for error reporting.

Single-, dual-, and quad-rank DIMMs

To understand and configure memory protection modes properly, an understanding of single-, dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.

A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only one rank is accessible at a time. The server blade memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM.

Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4GB, and a quad-rank DIMM would be 8-GB.

DIMM identification

IMPORTANT: This server blade does not support mixing RDIMMs and UDIMMs. Attempting to

The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not supported. To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table.

mix these two types causes the server to halt during BIOS initialization.

Hardware options installation 28

Item Description Definition

1 Size — 2 Rank 1R = Single-rank

2R = Dual-rank 4R = Quad-rank

3 Data width x4 = 4-bit

x8 = 8-bit

4 Memory speed 10600 = 1333-MHz

8500 = 1067-MHz

5 DIMM type R = RDIMM (registered)

E = UDIMM (unbuffered with ECC)

For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com

Memory configurations

To optimize server blade availability, the server blade supports the following AMP modes:

• Advanced ECC—provides the greatest memory capacity for a given DIMM size, while providing up

to 8-bit error correction, depending on the specific DIMM type. This mode is the default option for this server blade.

• Mirrored Memory—provides maximum protection against failed DIMMs. Uncorrectable errors in one

channel are corrected by the mirror channel.

• Lockstep—provides enhanced protection while making all installed memory available to the

operating system. The server blade can continue to function if a single- or mulit-bit memory failure within a single DRAM device occurs.

Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server blade boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 55)."

For the latest memory configuration information, see the QuickSpecs on the HP website (http://www.hp.com

RDIMM maximum memory configurations

The following table lists the maximum memory configuration possible with 8-GB RDIMMs.

Rank Single-processor Dual-processor

Single-rank 48 GB 96 GB Dual-rank 48 GB 96 GB Quad-rank 32 GB 64 GB

UDIMM maximum memory configurations

The server blade supports a maximum of 12 GB with one processor and 24 GB with two processors using 2-GB single- or dual-rank UDIMMs.

Hardware options installation 29

Advanced ECC memory configuration

Advanced ECC memory is the default memory protection mode for this server blade. Standard ECC can correct single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected using Standard ECC, the error is signaled to the server blade and causes the server blade to halt.

Advanced ECC protects the server blade against some multi-bit memory errors. Advanced ECC can correct both single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.

Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain memory errors that would otherwise be uncorrected and result in a server blade failure. The server blade provides notification that correctable error events have exceeded a pre-defined threshold rate.

Mirrored memory configuration

Mirroring provides protection against uncorrected memory errors that would otherwise result in server blade downtime. Mirroring is performed at the channel level. Channels 1 and 2 are used; channel 3 is not populated.

Data is written to both memory channels. Data is read from one of the two memory channels. If an uncorrectable error is detected in the active memory channel, data is retrieved from the mirror channel. This channel becomes the new active channel, and the system disables the channel with the failed DIMM.

Lockstep memory configuration

Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device. Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each channel must have identical HP part numbers.

Lockstep mode uses channel 1 and channel 2. Channel 3 is not populated. Because channel 3 cannot be populated when using Lockstep mode, the maximum memory capacity is lower than Advanced ECC mode. Memory performance with Advanced ECC is also slightly higher.

General DIMM slot population guidelines

Observe the following guidelines for all AMP modes:

• Populate DIMM slots for a processor only if the processor is installed.

• To maximize performance in multi-processor configurations, distribute the total memory capacity

between all processors as evenly as possible.

• Do not mix Unbuffered and Registered PC3 DIMMs.

• Each channel supports up to two Unbuffered DIMMs.

• If quad-rank DIMMs are installed for a processor, a maximum of two DIMMs can be installed on

each channel for that processor. If a channel contains quad-rank DIMMs, the quad-rank DIMM must be installed first on that channel. DIMM speeds are supported as indicated in the following table.

Populated slots (per channel)

1 Single- or dual-rank 1333, 1066

Rank Speeds supported

(MHz)

Hardware options installation 30

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