Hp 8200 User Manual

Technical Reference Guide
HP Compaq 8200 Elite Series Business Desktop Computers
Document Part Number: 656770-001
March 2011
This document provides information on the design, architecture, function, and capabilities of the HP Compaq 8200 Elite Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.
© Copyright 2011 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. HP is not responsible for any omissions or errors contained herein.
Microsoft, MS-DOS, Windows, Windows NT, Windows XP, Windows Vista, and Windows 7 are trademarks of Microsoft Corporation in the U.S. and other countries.
Intel, Intel Core i3/i5/i7, Pentium Dual-Core, Intel Celeron, Intel vPro, and Intel Inside are trademarks of Intel Corporation in the U.S. and in other countries.
Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.
The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
This document contains proprietary information that is protected by copyright. No part of this document may be photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard Company.
Technical Reference Guide
HP Compaq 8200 Elite Series Business Desktop Computers
First Edition (March 2011) Document Part Number: 656770-001
Contents
1 Introduction
1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.3 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.4 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5.1 Special Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5.2 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.5 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
2 System Overview
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.3 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.3.1 Intel Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.3.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.3.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
2.3.5 Mass Storage Accomodations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.6 Legacy Input/Output Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
2.3.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.10 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.3.11 HP ProtectTools Embedded Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
2.4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
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Contents
3 Processor/Memory Subsystem
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Intel Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.1 Intel Processor Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.2 Processor Changing/Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4
3.3.1 Memory Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
3.3.2 Memory Mapping and Pre-allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
4 System Support
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9
4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11
4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12
4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13
4.6.2 GPIO Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
5 Input/Output Interfaces
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.2 SATA/eSATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.2.1 SATA Inteerface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.2.2 eSATA Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3
5.3 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
5.4 Parallel Interface Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
5.4.4 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
5.5 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.5.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
5.5.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
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5.5.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
5.6 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.6.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
5.6.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10
5.7 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
5.7.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.3 Audio Multistreaming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12
5.7.4 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13
5.8 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14
5.8.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.4 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15
5.8.5 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16
6 Integrated Graphics Subsystem
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.3 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.4 Monitor Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.5.1 Analog Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.5.2 DisplayPort Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
Contents
7 Power and Signal Distribution
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.2.1 USDT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.2.2 SFF/MT/CMT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.3 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5
7.3.1 Power Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5
7.3.2 Wake Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7
7.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7
7.5 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–9
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Contents
8 SYSTEM BIOS
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2
8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3
8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.4 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
8.4.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.4.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.5 SMBIOS support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.6 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.7 Management Engine Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
A Error Messages and Codes
A.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1
A.2 Beep/Powr LED Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1
A.3 Power-On Self Test Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2
A.4 System Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–6
A.5 Memory Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–7
A.6 Keyboard Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–8
A.7 Printer Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–9
A.8 Video (Graphics) Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–9
A.9 Diskette Drive Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–10
A.10 Serial Inteface Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–11
A.11 Modem Communications Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–12
A.12 System Status Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–13
A.13 Hard drive Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–14
A.14 Hard drive Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–16
A.15 Video (Graphics) Error Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–17
A.16 Audio Error Messages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–17
A.17 DVD/CD-ROM Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–18
A.18 Netowrk Interface Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–19
A.19 SCSI Interface Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–19
A.20 Pointing Device Interface Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–20
Index
vi www.hp.com Technical Reference Guide

1.1 About this Guide

This guide provides technical information about HP Compaq 8200 Elite Business PC personal computers that feature the Intel® Q67 Express chipset and support select Intel Celeron®, Pentium®, Core™ i3, Core i5, and Core i7 processors. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information.
This guide primarily describes the hardware and firmware elements and primarily deal with the system board and the power supply assembly. This guide can be used either as an online document or in hardcopy form.

1.1.1 Online Viewing

Online viewing allows for quick navigating and convenient searching through the document. A color monitor will also allow the user to view the color shading used to highlight differential data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format at the following URL:
www.hp.com
1
Introduction
Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe Systems, Inc. at the following URL:
www.adobe.com
1.1.2 Hardcopy
A hardcopy of this guide may be obtained by printing from the .pdf file. The document is designed for printing in an 8 ½ x 11-inch format.
1.2 Additional Information Sources
For more information on components mentioned in this guide refer to the indicated manufacturers' documentation, which may be available at the following online sources:
HP Corporation: www.hp.com
Intel Corporation: www.intel.com
Serial ATA International Organization (SATA-IO): www.serialATA.org.
USB user group: www.usb.org
Technical Reference Guide www.hp.com 1-1
Introduction

1.3 Serial Number

The serial number is located on a sticker placed on the exterior cabinet. The serial number is also written into firmware and may be read with HP Diagnostics or Insight Manager utilities.

1.4 Notational Conventions

The notational guidelines used in this guide are described in the following subsections.

1.4.1 Special Notices

The usage of warnings, cautions, and notes is described as follows:
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to equipment or loss of information.
Text set off in this manner provides information that may be helpful.

1.4.2 Values

Differences between bytes and bits are indicated as follows:
MB = megabytes
Mb = megabits
1-2 www.hp.com Technical Reference Guide

1.5 Common Acronyms and Abbreviations

Table 1-1 lists the acronyms and abbreviations used in this guide.
Table 1-1
Acronyms and Abbreviations
Acronym or Abbreviation Description
Aampere
AC alternating current
ACPI Advanced Configuration and Power Interface
A/D analog-to-digital
ADC Analog-to-digital converter
ADD or ADD2 Advanced digital display (card)
AHCI SATA Advanced Host controller Interface
AMT Active Management Technology
API application programming interface
Introduction
APIC Advanced Programmable Interrupt Controller
APM advanced power management
AOL Alert-On-L AN™
ASIC application-specific integrated circuit
ASF Alert Standard Format
AT 1. attention (modem commands) 2. 286-based PC architecture
ATA AT attachment (IDE protocol)
ATAPI ATA w/packet interface extensions
AVI audio -video interl eaved
AVGA Advanced VGA
AWG American Wire Gauge (specification)
BAT Basic assurance test
BCD binary-coded decimal
BIOS basic input/output system
bis second/new revision
BNC Bayonet Neill-Concelman (connector type)
bps or b/s bits per second
BSP Bootstrap processor
BTO Built to order
CAS column address strobe
CD compact disk
CD-ROM compact disk read-only memory
CDS compact disk system
Technical Reference Guide www.hp.com 1-3
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
CGA color graphics adapter
Ch Channel, chapter
cm centimeter
CMC cache/memory controller
CMOS complimentary metal-oxide semiconductor (configuration memory)
Cntlr controller
Cntrl control
codec 1. coder/decoder 2. compressor/decompressor
CPQ Compaq
CPU central processing unit
CRIMM Continuity (blank) RIMM
CRT cathode ray tube
CSM 1. Compaq system management 2. Compaq server management
DAC digital-to-analog converter
DC direct current
DCH DOS compatibility hole
DDC Display Data Channel
DDR Double data rate (memory)
DIMM dual inline memory module
DIN Deutche IndustriNorm (connector type)
DIP dual inline package
DMA direct memory access
DMI Direct Media Interface
DP DisplayPort
dpi dots per inch
DRAM dynamic random access memory
DRQ data request
DVI Digital video interface
dword Double word (32 bits)
EDID extended display identification data
EDO extended data out (RAM type)
EEPROM electrically erasable PROM
EIA Electronic Industry Association
EPP enhanced parallel port
1-4 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
EIDE enhanced IDE
eSATA external SATA
ESCD Extended System Configuration Data (format)
EV Environmental Variable (data)
ExCA Exchangeable Card Architecture
FDI Flexible Display Interface
FIFO first in/first out
FL flag (register)
FM frequency modulation
FPM fast page mode (RAM type)
FPU Floating point unit (numeric or math coprocessor)
FPS Frames per second
ft Foot/feet
Introduction
GB gigabyte
GMCH Graphics/memory controller hub
GND ground
GPIO general purpose I/O
GPOC general purpose open-collector
GART Graphics address re-mapping table
GUI graphic user interface
hhexadecimal
HDD hard disk drive
HW hardware
hex hexadecimal
Hz Hertz (cycles-per-second)
ICH I/O controller hub
IDE integrated drive element
IEEE Institute of Electrical and Electronic Engineers
IF interrupt flag
I/F interface
IGC integrated graphics controller
in inch
INT interrupt
I/O input/output
IOPS Input/output Operations Per Second
Technical Reference Guide www.hp.com 1-5
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
IrDA Infrared Data Association
IRQ interrupt request
ISA industry standard architecture
Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)
Kb/s kilobits per second
kg kilogram
KHz kilohertz
kV kilovolt
lb pound
LAN local area network
LCD liquid crystal display
LED light-emitting diode
LGA land grid array
LPC Low pin count
LSI large scale integration
LSb/LSB least significant bit/least significant byte
LUN logical unit (SCSI)
m Meter
MMX multimedia extensions
MPEG Motion Picture Experts Group
MXM Mobile PCI eXpress Module
ms millisecond
MSb/MSB most significant bit/most significant byte
mux multiplex
MVA motion video acceleration
MVW motion video window
n variable parameter/value
NIC network interface card/controller
NiMH nickel-metal hydride
NMI non-maskable interrupt
NRZI Non-return-to-zero inverted
ns nanosecond
NT nested task flag
NTSC National Television Standards Committee
1-6 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
NVRAM non-volatile random access memory
ODD optical disk drive
OS operating system
PAL 1. programmable array logic 2. phase alternating line
PATA Parallel ATA
PC Personal computer
PCA Printed circuit assembly
PCI peripheral component interconnect
PCI-E PCI Express
PCM pulse code modulation
PCMCIA Personal Computer Memory Card International Association
PCH Platform Controller Hub
PEG PCI express graphics
Introduction
PFC Power factor correction
PIN personal identification number
PIO Programmed I/O
PN Part number
POST power-on self test
PROM programmable read-only memory
PTR pointer
RAID Redundant array of inexpensive disks (drives)
RAM random access memory
RAS row address strobe
rcvr receiver
RDRAM (Direct) Rambus DRAM
RGB red/green/blue (monitor input)
RH Relative humidity
RMS root mean square
ROM read-only memory
RPM revolutions per minute
RTC real time clock
R/W Read/Write
SATA Serial ATA
SCSI small computer system interface
Technical Reference Guide www.hp.com 1-7
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
SDR Singles data rate (memory)
SDRAM Synchronous Dynamic RAM
SDVO Serial digital video output
SEC Single Edge-Connector
SECAM sequential colour avec memoire (sequential color with memory)
SF sign flag
SGRAM Synchronous Graphics RAM
SIMD Single instruction multiple data
SIMM single in-line memory module
SMART Self Monitor Analysis Report Technology
SMI system management interrupt
SMM system management mode
SMRAM system management RAM
SODIMM small outline DIMM
SPD serial presence detect
SPDIF Sony/Philips Digital Interface (IEC-958 specification)
SPN Spare part number
SPP standard parallel port
SRAM static RAM
SSD solid state disk (drive)
SSE Streaming SIMD extensions
STN super twist pneumatic
SVGA super VGA
SW software
TAD telephone answering device
TAFI Temperature-sensing And Fan control Integrated circuit
TCP tape carrier package, transmission control protocol
TF trap flag
TFT thin-film transistor
TIA Telecommunications Information Administration
TPE twisted pair ethernet
TPI track per inch
TPM Trusted Platform Module
TTL transistor-transistor logic
1-8 www.hp.com Technical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or Abbreviation Description
TV television
TX transmit
UART universal asynchronous receiver/transmitter
UDMA Ultra DMA
UDIMM unbuffered/unregistered DIMM
UEFI Unified Extensible Firmware Interface
URL Uniform resource locator us/s microsecond
USB Universal Serial Bus
UTP unshielded twisted pair
Vvolt
VAC Volts alternating current
VDC Volts direct current
Introduction
VESA Video Electronic Standards Association
VGA video graphics adapter
VLSI very large scale integration
VRAM Video RAM
Wwatt
WOL Wake -On-LAN
WRAM Windows RAM
ZF zero flag
ZIF zero insertion force (socket)
Technical Reference Guide www.hp.com 1-9
Introduction
1-10 www.hp.com Technical Reference Guide

2.1 Introduction

HP 8200 Elite CMT
HP 8200 Elite SFF
HP 8200 Elite MT
HP 8200 Elite USDT
The HP Compaq 8200 Elite Business PC personal computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise environments. Based on the the Intel Q67 Express chipset and supporting select Intel Celeron®, Pentium®, Core™ i3, Core i5, and Core i7 processors, these systems emphasize performance along with industry compatibility. All models feature a similar architecture incorporating both PCI 2.3 and PCIe 2.0 buses. All models are easily upgradeable and expandable to keep pace with the needs of the office enterprise.
2
System Overview
Technical Reference Guide www.hp.com 2-1
Figure 2-1. HP Compaq 8200 Elite Business PCs
This chapter includes the following topics:
Features (2.2)
System architecture (2.3)
Specifications (2.4)
System Overview

2.2 Features

The following standard features are included on all models unless otherwise indicated:
Intel Celeron, Intel Pentium, or Intel Core i3/i5/i7 processor (LGA1155 socket)
Independent dual monitor support:
One VGA connector
One DisplayPort (DP) connector with Multimode support
PC3-10600 and PC3-8500 DDR3 memorysupport
CAUTION: These products do not support Ultra Low voltage (1.25V) DIMM/SODIMM. Installation of ultra low voltage memory can cause damage to the system and/or memory.
Hard drive fault prediction
Ten externally-accessible USB 2.0-compliant ports (four front, six rear)
High definition (HD) audio processor with one headphone output, at least one microphone
input, one line output, and one line input
Network interface controller providing 10/100/1000Base T support
Plug 'n Play compatible (with ESCD support)
PS/2 keyboard
PS/2 optical scroll mouse
HP UEFI BIOS
Management/security features including:
Flash ROM Boot Block
Diskette drive disable, boot disable, write protect
Power-on password
Administrator password
Serial port disable
Smart Cover (hood) Lock (CMT, MT, SFF only)
Smart Cover (hood) Sense
USB port disable
Intel Standard Manageability support
Intel vPro Technology support (with selected processors)
HP Virtual Safe Browser
HP ProtectTools Embedded Security
2-2 www.hp.com Technical Reference Guide
System Overview
Table 2-1 shows the differences in features between the different PC series based on form factor.
Table 2-1
Feature Differences by Form Factor
USDT SFF MT CMT
Thermal Design Power (TPD) (processor)
# and type of memory sockets 2 DDR3
Serial ports 0 1 std.,
Parallel ports 0 optional optional optional
Drive bays:
Externally accessible
Internal
# of SATA/eSATA drives
supported:
MXM 3.0 slot? Yes No No No
PCIe slots:
2.0 x16 (graphics)
2.0 x4 (x16 connector)
2.0 x1 connector
1.2 Mini Card 1
65 W 95 W 95 W 95 W
4 DDR3
SODIMMs
1 [9]
1- 2.50”
23/14 5
UDIMMs
1 opt. [1]
1 - 5.25” 1 - 3.50” 1 - 3.50”
(all low profile)
1 [2] 1 [2] 1 [3]
0
4 DDR3
UDIMMs
1 std.,
1 opt. [1]
2 - 5.25” [7]
1 - 3.50”
2 - 3.50” [8]
(all full height)
1 [4] 1 [5] 1 [6]
0
4 DDR3
UDIMMs
1 std.,
1 opt. [1]
3 - 5.25” [7]
3 - 3.50” [8]
(all full height)
1 [4] 1 [5] 1 [6]
0
PCI 2.3 32-bit 5-V slot, 25-watt maximum
Power Supply Uni t:
Module type Power rati ng
NOTES:
[1] 2nd serial port requires optional cable/bracket assembly. [2] Low-profile, 25 W maximum. [3] Low profile, 10-watt maximum [4] Full-length;
75-watt maximum if PCIe x4 slot is not populated,
35-watt maximum if PCIe x4 slot is populated [5] 35-watt maximum [6] Half-height, half-length, 10-watt maximum [7] 3.5” devices supported with adapters [8] 2.5” solid state drives supprted with adapter brackets [9] Slimline bay
external
135- or180-watt
1 1 full-height 3 full-height
internal
240 -watt
internal
320 -watt
320-watt
internal
Technical Reference Guide www.hp.com 2-3
System Overview

2.3 System Architecture

The systems covered in this guide feature an architecture based on the Intel Celeron, Pentium and Intel Core i3/i5/17 processors and the Intel Q67 Express Platform Controller Hub (PCH) shown in Figure 2-2. All systems covered in this guide include the following key components:
Intel Pentium processor or Intel Core i3/i5/i7 processor
Intel Q67 Express PCH-DO chipset
Super I/O (SIO) controller supporting PS/2 keyboard and mouse peripherals
ALC261 audio controller supporting line in, line out, microphone in, and headphones out
Intel 82579LM GbE network interface controller
HP ProtectTools Embedded Security
The Q67 Express PCH provides a major portion of system functionality. Designed to complement 2nd generation Intel Core processors, the Q67 Express PCH communicates with the processor through the Flexible Display Interface (FDI) and the Direct Media Interface (DMI). All systems include a serial ATA (SATA) hard drive in the standard configuration.
Table 2-2 lists the differences between models by form factor.
Table 2-2.
Architectural Differences by Form Factor
Function USDT SFF MT CMT
# and type of memory sockets 2 SODIMMs 4 UDIMMs 4 UDIMMs 4 UDIMMs
Maximum amount of memory supported
MXM 3.0 slot 1 0 0 0
PCIe 2.0 x16 graphics slot 0 1 [1] 1 1
PCIe 2.0 x4 slot (x16 connector) 0 1 1 1
PCIe 2.0 x1 slot 0 1 [1] 1 1
PCIe Mini Card 1.2 slot 1 0 0 0
PCI 2.3 slot 0 1 [1] 1 3
SATA interface:
SATA 3.0 SATA 2.0 eSATA [2]
Notes:
[1] Low-profile slot. [2] Operates as SATA 2.0 internally, SATA 1.0 as eSATA
8 GB 16 GB 16 GB 16 GB
2 0 0
2 1 1
2 1 1
2 2 1
2-4 www.hp.com Technical Reference Guide
System Overview
Parallel I/F [4]
Intel
Processor
Q67
PCH-D0
Mem.
Cntlr.
PCIe 2.0
SATA
SATA
USB
I/F
Ch A DDR3
SDRAM
Ch B DDR3
SDRAM
SIO Controller
Cntlr.
VGA
Hard Drive
USB 2.0
Serial I/F [3]
Kybd-Mouse I/F
x16 slot (PEG) [1]
PCIe 2.0 x1 slot [4]
SATA
ALC261
Subsystem
PCI 2.3 slot [5]
Keyboard
NIC
I/F
Mouse
Audio I/F
LPC
PCI Cntlr.
Power Supply
Notes:
[5] 3 in CMT, 1 in MT and SFF
SATA
Devices
Graphics
Audio
Analog
Digital
DisplayPort
FDI
PCIe 2.0 x4 slot (x16 conn.) [4]
(6 rear ports, 4 front ports,
[3] 2 in CMT, MT, and SFF
I/F [1]
SATA
SATA/eSATA
Additional
12 VDC [1]
System board
Monitor
Monitor
HP ProtectTools
Embedded Security
DMI
I/F
LCI
4 internal ports in CMT/MT/SFF,
Display
I/F
1066/1333 MHz
1066/1333 MHz
MXM 3.0 [2]
[1] CMT, MT, SFF only
PCIe MiniCard Slot 1.2 [2]
[4] 1 in CMT, MT, and SFF only
Line In
Line Out
Mic In
Phones Out
BIOS
2 internal ports in USDT)
[2] USDT only
19.5 VDC [2]
Express
Technical Reference Guide www.hp.com 2-5
Figure 2-2. HP Compaq 8200 Elite Business PC Architecture, Block diagram
System Overview

2.3.1 Intel Processor Support

The models covered in this guide can each support an Intel Celeron, Pentium, Core i3, Core i5, or Core i7 processor. These processors are backward-compatible with software written for earlier x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and speech processing performance. Intel processors with vPro Technology include hardware-based tools that allow corporate IT organizations to remotely manage and protect systems.
The system board includes a zero-insertion-force (ZIF) H2 socket (LGA1155) designed for mounting an LGA1155-type processor package.
CAUTION: The CMT, MT, and SFF form factors can support a processor with a TPD rating of up to 95 watts. The USDT form factor can support a processor rated up to 65 watts. Exceeding these limits can result in system damage and loss of data.
These systems use processor sockets that support 2nd generation Intel Core i3, Core i5, and Core
i7 processors and are not compatible with earlier generations of those processors.
The processor heatsink/fan assembly mounting differs between form factors. Always use the
same assembly or one of the same type when replacing the processor. Refer to the applicable Maintenance & Service Guide for detailed removal and replacement procedures of the heatsink/fan assembly and the processor.

2.3.2 Chipset

The Intel Q67 Express PCH-D0 is a single component that provides the following functions:
PCI 2.3 bus controller
PCIe bus controller
LPC bus controller
SMBus interface
SATA interface
HD audio interface
RTC/CMOS function
IRQ controller
Serial Peripheral Device
Power management logic
USB 1.1/2.0 controllers supporting 14 ports
Gigabit Ethernet controller
2-6 www.hp.com Technical Reference Guide

2.3.3 Support Components

Input/output functions not provided by the chipset are handled by other support components. Some of these components also provide “housekeeping” and various other functions as well. Table 2-3 shows the functions provided by the support components.
Support Component Functions
Component Name Function
Nuvoton SIO11 Controller Keyboard and pointing device I/F
Serial I/F (COM1and COM2) [1] Parallel I/F (LPT1, LPT2, or LPT3) [2] PCI reset generation Interrupt (IRQ) serializer Power button and front panel LED logic GPIO ports Processor over temperature monitoring Fan control and monitoring Power supply voltage monitoring SMBus and Low Pin Count (LPC) bus I/F
System Overview
Table 2-3
Intel 82579 LOM Network Interface Controller
ALC261 HD Audio Codec Audio mixer
NOTE:
[1] COM2 requires external bracket/cable assembly. [2] Requires external bracket/cable assembly.

2.3.4 System Memory

These systems implement a dual-channel Double Data Rate (DDR3) memory architecture. All models support DDR3 1333-MHz (PC3-10600) and 1066-MHz (PC3-8500) memory modules. The CMT, MT, and SFF form factors provide four UDIMM sockets and support a maximum of 16 gigabytes of memory. The USDT form factor provides two SODIMM sockets and supports up to eight gigabytes of memory.
10/100/1000 Fast Ethernet network interface controller.
Two digital-to-analog stereo converters Two analog-to-digital stereo converters Analog I/O Supports stereo (two-channel) audio streams
Technical Reference Guide www.hp.com 2-7
System Overview

2.3.5 Mass Storage Accommodations

All models support at least two mass storage devices, with one being externally accessible for removable media. The storage device accommodations are as follows:
CMT: six bays total; three 5.25-inch externally accessible, three 3.5-inch internal
MT: five bays total; two 5.25-inch externally accessible, one 3.5-inch externally acessible, two
3.5-inch internal
SFF: three bays total; one 5.25-inch externally accessible, one 3.5-inch externally accessible, one
3.5-inch internal
USDT: two bays total; one 5.25-inch externally accessible (for slimline optical disk drive), one
2.5-inch internal
These systems may be preconfigured or upgraded with a SATA hard drive and one removable media drive such as a CD-ROM drive.

2.3.6 Legacy Input/Output Interfaces

PS/2 Port
All systems provide two PS/2 ports at the rear of the chassis for connection of a keyboard and mouse.
Serial port
The CMT, MT, and SFF form factors provide a serial port at the rear of the chassis and support a second serial port option. The serial interface is RS-232-C/16550-compatible and supports standard baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K.
Parallel port
The CMT, MT, and SFF form factors support a parallel port option.

2.3.7 Universal Serial Bus Interface

All models provide ten externally accessible Universal Serial Bus (USB) ports. Four ports are provided at the front of the unit, six ports are provided on the rear panel. Accessible through a header on the system board are two USB ports in the USDT form factor and four USB ports in the CMT, MT, and SFF form factors. These systems support a media card reader module that connects to the internal header. USB 1.1 and 2.0 functionality is available on all ports.
BIOS Setup allows for the disabling of USB ports individually or in groups. In order to secure the system against a physical attack, ports may be disabled even if there is nothing physically connected to them, such as the two front ports for the media card reader module when the module is not present.

2.3.8 Network Interface Controller

All models feature an Intel 82579 gigabit (GbE) Network Interface Controller (NIC) integrated on the system board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or 1000BASE-T operation with a local area network and includes power-down, wake-up, Alert-On-LAN (AOL), and AMT features. An RJ-45 connector with status LEDs is provided on the rear panel.
2-8 www.hp.com Technical Reference Guide

2.3.9 Graphics Subsystem

In the standard configuration, these systems use the integrated graphics controller (IGC) of the Intel processor. Intel Celeron, Pentium, Core i3, and most Core i5 and Core i7 processors feaure the HD Graphics 2000 IGC while select Core i5 and Core i7 processor feature the HD Graphics 3000 IGC.
The Intel HD Graphics 2000 uses six execution units providing high-performance 2D and casual 3D capabilities. The Intel HD Graphics 3000 uses 12 execution units providing high-performance 3D capabilities without the need for a separate graphics card.
All systems include a legacy analog video (VGA) connector and a DisplayPort connector and support dual monitor operation. The DisplayPort includes a multimode feature that allows a VGA, DVI, or HDMI adapter to be connected to the DisplayPort.
For upgrading the graphics controller, the CMT, MT, and SFF form factors provide a PCIe 2.0
x16 graphics slot while the USDT form factor provides an MXM 3.0 slot.

2.3.10 Audio Subsystem

These systems use the integrated High Definition audio controller of the chipset and the Realtek ADL261 High Definition audio codec. HD audio provides enhanced audio performance with higher sampling rates, refined signal interfaces, and audio processors with increased signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an internal speaker, which can be muted with the F10 BIOS control. All models include a front panel accessible stereo microphone input jack (re-taskable as a Line-In input) and a headphone output audio jack.
System Overview

2.3.11 HP ProtectTools Embedded Security

HP ProtectTools Embedded Security is a hardware/software solution providing file and folder encrypytion service that integrates with the operating system. The software component—the HP ProtectTools Embedded Security Manager (preinstalled), controls the basic operation of the hardware component—the Trusted Platform Module (TPM) security chip. These components are compliant with the Trusted Computing Group (TCG) security standards organization.
HP ProtectTools Embedded Security includes the following features:
Enhanced Windows operating system files and folder encryption
Enhanced email encryption—built-in authentication for Outlook, Outlook Express, Lotus
Notes, Eudora
Strengthens defense against hacking, system attacks, denial of service and network attacks
“Embedded smart card” functionality
Strengthens authentication with LANs, WANs.
Works with/enhances third-party security solutions
HP ProtectTools Embedded Security Manager is acecssed through a Windows Control Panel applet. The management functions are accessible through established protocols such as DMI, SNMP, or WEBEM.
Technical Reference Guide www.hp.com 2-9
System Overview

2.4 Specifications

This section includes the environmental, electrical, and physical specifications for the systems covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice.
Environmental Specifications (Factory Configuration)
Parameter Operating Non-operating
Table 2-4
Ambient Air Temperature 50
o
to 95o F (10o to 35o C, max.
rate of change <
10C/Hr)
o
-22
to 140o F (-30o to 60o C, max. rate of change <
Shock (w/o damage) 5 Gs [1] 20 Gs [1]
Vibration 0.000215 G
Humidity 10-90% Rh @ 28
wet bulb temperature
2
/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz
o
C max.
5-95% Rh @ 38.7o C max.
wet bulb temperature
Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]
NOTE:
[1] Peak input acceleration during an 11 ms half-sine shock pulse. [2] Maximum rate of change: 1500 ft/min.
Table 2-5
Power Supply Electrical Specifications
Parameter Value
Input Line Voltage: Nominal: Maximum
100–240 VAC
90–264 VAC
20C/Hr)
Input Line Frequency Range: Nominal Maximum
50–60 Hz
47–63 Hz
Maximum Continuous Power:
USDT SFF MT CMT
135 / 180 W
240 W 320 W 320 W
2-10 www.hp.com Technical Reference Guide
Table 2-6
Physical Specifications
Parameter USDT SFF [2] MT CMT [3]
System Overview
Height 2.60 in
(6.60 cm)
Width 9.90 in
(25.15 cm)
Depth 10.0 in
(25.40 cm)
Weight [1] 7.0 lb
(3.18 kg)
NOTES:
[1] System configured with 1 hard drive, 1 optical media drive, and no PCI cards. [2] Desktop (horizontal) configuration. [3] Minitower configuration. For desktop configuration, swap Height and Width dimensions.
3.95 in
(10.03 cm)
13.3 in
(33.78 cm)
14.9 in
(37.85 cm)
16.72 lb (7.6 kg)
14.5 in
(36.8 cm)
6.88 in
(17.5 cm)
16.31 in (41.1)
23.8 lb
(10.8 kg
17.63 in
(44.8 cm)
7.0 i n
(17.8 cm)
17.5 in
(44.5 cm)
26.2 lb
(11.5 kg)
Technical Reference Guide www.hp.com 2-11
System Overview
2-12 www.hp.com Technical Reference Guide

3.1 Introduction

Processor
Cntlr
SDRAM
XMM1
Channel B
DIMM
DIMM [2]
DIMM
DIMM [2]
XMM3
XMM4
XMM2
Intel
Channel A
or
SODIMM [1]
or
SODIMM [1]
DDR3
DMI
FDI
PCH
NOTES:
[1] USDT uses SODIMM sockets [2] CMT, MT, and SFF only
This systems provide an LGA 1155 (H2) socket supporting an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7 processor. These processors include an integrated dual-channel DDR3 memory controller (Figure 3-1) and support PC3-8500 and PC3-10600 memory modules. This chapter describes the processor/memory subsystem.
3
Processor/Memory Subsystem
Figure 3-1. Processor/Memory Subsystem Architecture
This chapter includes the following topics:
Intel processor(3.2)
Technical Reference Guide www.hp.com 3-1
Memory subsystem (3.3)
Processor/Memory Subsystem

3.2 Intel Processor

These systems support an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7 processor that mounts in a zero-insertion force LGA1155 (H2) socket.

3.2.1 Intel Processor Features

Table 3-1 provides the specifications of processors supported by these systems.
Specifications of Supported Intel Processors
Intel Series Model
Core i7 2600K 4 / 8 3.4 / 3.8 GHz 8 MB HD 3000 95 W
2600 HD 2000
2600S 2.8 / 3.8 GHz 65 W
Core i5 2500K 4 / 4 3.3 / 3.7 GHz 6 MB HD 3000 95 W
2500 3.3 / 3.7 GHz HD 2000 2500S 2.7 / 3.7 GHz 65 W 2500T 2.3 / 3.3 GHz 45 W
2400 3.1 / 3.4 GHz 95 W 2400S 2.5 / 3.3 GHz 65 W
2300 2.8 / 3.1 GHz 95 W 2390T 2 / 4 2.7 / 3.5 GHz 3 MB 35 W
Core i3 2120 2 / 4 3.3 / na GHz 3 MB HD 2000 65 W
2105 3.1 / na GHz
2100 3.1 / na GHz 2100T 2.5 / na GHz 35 W
Pentium G850 2 / 2 2.9 / na GHz 65 W
G840 2.8 / na GHz
G620 2.6 / na GHz
G620T 2.2 / na GHz 35 W
# Cores /
Threads
Table 3-1
CPU
Clock Rate
Base / Turbo
L3
Cache
Size
Graphics
Controller TDP
These processors include an integrated memory controller that supports 1333-MHz dual-channel DDR3 memory.
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