HP Compaq 8200 Elite Series
Business Desktop Computers
Document Part Number: 656770-001
March 2011
This document provides information on the design, architecture, function,
and capabilities of the HP Compaq 8200 Elite Series Business Desktop
Computers. This information may be used by engineers, technicians,
administrators, or anyone needing detailed information on the products
covered.
The information contained herein is subject to change without notice. HP is not responsible for any omissions or
errors contained herein.
Microsoft, MS-DOS, Windows, Windows NT, Windows XP, Windows Vista, and Windows 7 are trademarks of
Microsoft Corporation in the U.S. and other countries.
Intel, Intel Core i3/i5/i7, Pentium Dual-Core, Intel Celeron, Intel vPro, and Intel Inside are trademarks of Intel
Corporation in the U.S. and in other countries.
Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.
The only warranties for HP products and services are set forth in the express warranty statements accompanying
such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
This document contains proprietary information that is protected by copyright. No part of this document may be
photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard
Company.
Technical Reference Guide
HP Compaq 8200 Elite Series Business Desktop Computers
First Edition (March 2011)
Document Part Number: 656770-001
This guide provides technical information about HP Compaq 8200 Elite Business PC personal
computers that feature the Intel® Q67 Express chipset and support select Intel Celeron®,
Pentium®, Core™ i3, Core i5, and Core i7 processors. This document describes in detail the
system's design and operation for programmers, engineers, technicians, and system
administrators, as well as end-users wanting detailed information.
This guide primarily describes the hardware and firmware elements and primarily deal with the
system board and the power supply assembly. This guide can be used either as an online
document or in hardcopy form.
1.1.1 Online Viewing
Online viewing allows for quick navigating and convenient searching through the document. A
color monitor will also allow the user to view the color shading used to highlight differential
data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format
at the following URL:
www.hp.com
1
Introduction
Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe
Systems, Inc. at the following URL:
www.adobe.com
1.1.2 Hardcopy
A hardcopy of this guide may be obtained by printing from the .pdf file. The document is
designed for printing in an 8 ½ x 11-inch format.
1.2 Additional Information Sources
For more information on components mentioned in this guide refer to the indicated
manufacturers' documentation, which may be available at the following online sources:
■ HP Corporation: www.hp.com
■
Intel Corporation: www.intel.com
■
Serial ATA International Organization (SATA-IO): www.serialATA.org.
■
USB user group: www.usb.org
Technical Reference Guidewww.hp.com1-1
Introduction
1.3 Serial Number
The serial number is located on a sticker placed on the exterior cabinet. The serial number is also
written into firmware and may be read with HP Diagnostics or Insight Manager utilities.
1.4 Notational Conventions
The notational guidelines used in this guide are described in the following subsections.
1.4.1 Special Notices
The usage of warnings, cautions, and notes is described as follows:
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily
harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage
to equipment or loss of information.
Text set off in this manner provides information that may be helpful.
✎
1.4.2 Values
Differences between bytes and bits are indicated as follows:
MB = megabytes
Mb = megabits
1-2www.hp.comTechnical Reference Guide
1.5 Common Acronyms and Abbreviations
Table 1-1 lists the acronyms and abbreviations used in this guide.
Table 1-1
Acronyms and Abbreviations
Acronym or
AbbreviationDescription
Aampere
ACalternating current
ACPIAdvanced Configuration and Power Interface
A/Danalog-to-digital
ADCAnalog-to-digital converter
ADD or ADD2Advanced digital display (card)
AHCISATA Advanced Host controller Interface
AMTActive Management Technology
APIapplication programming interface
Introduction
APICAdvanced Programmable Interrupt Controller
APMadvanced power management
AOLAlert-On-L AN™
ASICapplication-specific integrated circuit
ASFAlert Standard Format
AT1. attention (modem commands) 2. 286-based PC architecture
PAL1. programmable array logic 2. phase alternating line
PATAParallel ATA
PCPersonal computer
PCAPrinted circuit assembly
PCIperipheral component interconnect
PCI-EPCI Express
PCMpulse code modulation
PCMCIAPersonal Computer Memory Card International Association
PCHPlatform Controller Hub
PEGPCI express graphics
Introduction
PFCPower factor correction
PINpersonal identification number
PIOProgrammed I/O
PNPart number
POSTpower-on self test
PROMprogrammable read-only memory
PTRpointer
RAIDRedundant array of inexpensive disks (drives)
RAMrandom access memory
RASrow address strobe
rcvrreceiver
RDRAM(Direct) Rambus DRAM
RGBred/green/blue (monitor input)
RHRelative humidity
RMSroot mean square
ROMread-only memory
RPMrevolutions per minute
RTCreal time clock
R/WRead/Write
SATASerial ATA
SCSIsmall computer system interface
Technical Reference Guidewww.hp.com1-7
Introduction
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
AbbreviationDescription
SDRSingles data rate (memory)
SDRAMSynchronous Dynamic RAM
SDVOSerial digital video output
SECSingle Edge-Connector
SECAMsequential colour avec memoire (sequential color with memory)
SFsign flag
SGRAMSynchronous Graphics RAM
SIMDSingle instruction multiple data
SIMMsingle in-line memory module
SMARTSelf Monitor Analysis Report Technology
SMIsystem management interrupt
SMMsystem management mode
SMRAMsystem management RAM
SODIMMsmall outline DIMM
SPDserial presence detect
SPDIFSony/Philips Digital Interface (IEC-958 specification)
SPNSpare part number
SPPstandard parallel port
SRAMstatic RAM
SSDsolid state disk (drive)
SSEStreaming SIMD extensions
STNsuper twist pneumatic
SVGAsuper VGA
SWsoftware
TADtelephone answering device
TAFITemperature-sensing And Fan control Integrated circuit
TCPtape carrier package, transmission control protocol
TFtrap flag
TFTthin-film transistor
TIATelecommunications Information Administration
TPEtwisted pair ethernet
TPItrack per inch
TPMTrusted Platform Module
TTLtransistor-transistor logic
1-8www.hp.comTechnical Reference Guide
Table 1-1 (Continued)
Acronyms and Abbreviations
Acronym or
AbbreviationDescription
TVtelevision
TXtransmit
UARTuniversal asynchronous receiver/transmitter
UDMAUltra DMA
UDIMMunbuffered/unregistered DIMM
UEFIUnified Extensible Firmware Interface
URLUniform resource locator
us/smicrosecond
USBUniversal Serial Bus
UTPunshielded twisted pair
Vvolt
VACVolts alternating current
VDCVolts direct current
Introduction
VESAVideo Electronic Standards Association
VGAvideo graphics adapter
VLSIvery large scale integration
VRAMVideo RAM
Wwatt
WOLWake -On-LAN
WRAMWindows RAM
ZFzero flag
ZIFzero insertion force (socket)
Technical Reference Guidewww.hp.com1-9
Introduction
1-10www.hp.comTechnical Reference Guide
2.1 Introduction
HP 8200 Elite CMT
HP 8200 Elite SFF
HP 8200 Elite MT
HP 8200 Elite USDT
The HP Compaq 8200 Elite Business PC personal computers (Figure 2-1) deliver an outstanding
combination of manageability, serviceability, and compatibility for enterprise environments.
Based on the the Intel Q67 Express chipset and supporting select Intel Celeron®, Pentium®,
Core™ i3, Core i5, and Core i7 processors, these systems emphasize performance along with
industry compatibility. All models feature a similar architecture incorporating both PCI 2.3 and
PCIe 2.0 buses. All models are easily upgradeable and expandable to keep pace with the needs of
the office enterprise.
2
System Overview
Technical Reference Guidewww.hp.com2-1
Figure 2-1. HP Compaq 8200 Elite Business PCs
This chapter includes the following topics:
■ Features (2.2)
■ System architecture (2.3)
■ Specifications (2.4)
System Overview
2.2 Features
The following standard features are included on all models unless otherwise indicated:
❏ One DisplayPort (DP) connector with Multimode support
■ PC3-10600 and PC3-8500 DDR3 memorysupport
CAUTION: These products do not support Ultra Low voltage (1.25V) DIMM/SODIMM. Installation of
ultra low voltage memory can cause damage to the system and/or memory.
■ Hard drive fault prediction
■ Ten externally-accessible USB 2.0-compliant ports (four front, six rear)
■ High definition (HD) audio processor with one headphone output, at least one microphone
input, one line output, and one line input
■ Network interface controller providing 10/100/1000Base T support
❏ Intel vPro Technology support (with selected processors)
❏ HP Virtual Safe Browser
❏ HP ProtectTools Embedded Security
2-2www.hp.comTechnical Reference Guide
System Overview
Table 2-1 shows the differences in features between the different PC series based on form factor.
Table 2-1
Feature Differences by Form Factor
USDTSFFMTCMT
Thermal Design Power (TPD)
(processor)
# and type of memory sockets2 DDR3
Serial ports01 std.,
Parallel ports0optionaloptionaloptional
Drive bays:
Externally accessible
Internal
# of SATA/eSATA drives
supported:
MXM 3.0 slot?YesNoNoNo
PCIe slots:
2.0 x16 (graphics)
2.0 x4 (x16 connector)
2.0 x1 connector
1.2 Mini Card1
65 W95 W95 W95 W
4 DDR3
SODIMMs
1 [9]
1- 2.50”
23/14 5
UDIMMs
1 opt. [1]
1 - 5.25”
1 - 3.50”
1 - 3.50”
(all low profile)
1 [2]
1 [2]
1 [3]
0
4 DDR3
UDIMMs
1 std.,
1 opt. [1]
2 - 5.25” [7]
1 - 3.50”
2 - 3.50” [8]
(all full height)
1 [4]
1 [5]
1 [6]
0
4 DDR3
UDIMMs
1 std.,
1 opt. [1]
3 - 5.25” [7]
3 - 3.50” [8]
(all full height)
1 [4]
1 [5]
1 [6]
0
PCI 2.3 32-bit 5-V slot,
25-watt maximum
Power Supply Uni t:
Module type
Power rati ng
NOTES:
[1] 2nd serial port requires optional cable/bracket assembly.
[2] Low-profile, 25 W maximum.
[3] Low profile, 10-watt maximum
[4] Full-length;
75-watt maximum if PCIe x4 slot is not populated,
35-watt maximum if PCIe x4 slot is populated
[5] 35-watt maximum
[6] Half-height, half-length, 10-watt maximum
[7] 3.5” devices supported with adapters
[8] 2.5” solid state drives supprted with adapter brackets
[9] Slimline bay
external
135- or180-watt
11 full-height3 full-height
internal
240 -watt
internal
320 -watt
320-watt
internal
Technical Reference Guidewww.hp.com2-3
System Overview
2.3 System Architecture
The systems covered in this guide feature an architecture based on the Intel Celeron, Pentium and
Intel Core i3/i5/17 processors and the Intel Q67 Express Platform Controller Hub (PCH) shown
in Figure 2-2. All systems covered in this guide include the following key components:
■ Intel Pentium processor or Intel Core i3/i5/i7 processor
■ Intel Q67 Express PCH-DO chipset
■ Super I/O (SIO) controller supporting PS/2 keyboard and mouse peripherals
■ ALC261 audio controller supporting line in, line out, microphone in, and headphones out
■ Intel 82579LM GbE network interface controller
■ HP ProtectTools Embedded Security
The Q67 Express PCH provides a major portion of system functionality. Designed to
complement 2nd generation Intel Core processors, the Q67 Express PCH communicates with the
processor through the Flexible Display Interface (FDI) and the Direct Media Interface (DMI).
All systems include a serial ATA (SATA) hard drive in the standard configuration.
Table 2-2 lists the differences between models by form factor.
Table 2-2.
Architectural Differences by Form Factor
FunctionUSDTSFFMTCMT
# and type of memory sockets2 SODIMMs4 UDIMMs4 UDIMMs4 UDIMMs
Maximum amount
of memory supported
MXM 3.0 slot1000
PCIe 2.0 x16 graphics slot01 [1]11
PCIe 2.0 x4 slot (x16 connector)0111
PCIe 2.0 x1 slot01 [1]11
PCIe Mini Card 1.2 slot1000
PCI 2.3 slot01 [1]13
SATA interface:
SATA 3.0
SATA 2.0
eSATA [2]
Notes:
[1] Low-profile slot.
[2] Operates as SATA 2.0 internally, SATA 1.0 as eSATA
8 GB16 GB16 GB16 GB
2
0
0
2
1
1
2
1
1
2
2
1
2-4www.hp.comTechnical Reference Guide
System Overview
Parallel I/F [4]
Intel
Processor
Q67
PCH-D0
Mem.
Cntlr.
PCIe 2.0
SATA
SATA
USB
I/F
Ch A DDR3
SDRAM
Ch B DDR3
SDRAM
SIO Controller
Cntlr.
VGA
Hard Drive
USB 2.0
Serial I/F [3]
Kybd-Mouse I/F
x16 slot (PEG) [1]
PCIe 2.0 x1 slot [4]
SATA
ALC261
Subsystem
PCI 2.3 slot [5]
Keyboard
NIC
I/F
Mouse
Audio I/F
LPC
PCI Cntlr.
Power Supply
Notes:
[5] 3 in CMT, 1 in MT and SFF
SATA
Devices
Graphics
Audio
Analog
Digital
DisplayPort
FDI
PCIe 2.0 x4 slot (x16 conn.) [4]
(6 rear ports, 4 front ports,
[3] 2 in CMT, MT, and SFF
I/F [1]
SATA
SATA/eSATA
Additional
12 VDC [1]
System board
Monitor
Monitor
HP ProtectTools
Embedded Security
DMI
I/F
LCI
4 internal ports in CMT/MT/SFF,
Display
I/F
1066/1333 MHz
1066/1333 MHz
MXM 3.0 [2]
[1] CMT, MT, SFF only
PCIe MiniCard Slot 1.2 [2]
[4] 1 in CMT, MT, and SFF only
Line In
Line Out
Mic In
Phones Out
BIOS
2 internal ports in USDT)
[2] USDT only
19.5 VDC [2]
Express
Technical Reference Guidewww.hp.com2-5
Figure 2-2. HP Compaq 8200 Elite Business PC Architecture, Block diagram
System Overview
2.3.1 Intel Processor Support
The models covered in this guide can each support an Intel Celeron, Pentium, Core i3, Core i5, or
Core i7 processor. These processors are backward-compatible with software written for earlier
x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for
enhancing 3D graphics and speech processing performance. Intel processors with vPro
Technology include hardware-based tools that allow corporate IT organizations to remotely
manage and protect systems.
The system board includes a zero-insertion-force (ZIF) H2 socket (LGA1155) designed for
mounting an LGA1155-type processor package.
CAUTION: The CMT, MT, and SFF form factors can support a processor with a TPD rating of up to 95
watts. The USDT form factor can support a processor rated up to 65 watts. Exceeding these limits can
result in system damage and loss of data.
These systems use processor sockets that support 2nd generation Intel Core i3, Core i5, and Core
✎
i7 processors and are not compatible with earlier generations of those processors.
The processor heatsink/fan assembly mounting differs between form factors. Always use the
✎
same assembly or one of the same type when replacing the processor. Refer to the applicable
Maintenance & Service Guide for detailed removal and replacement procedures of the
heatsink/fan assembly and the processor.
2.3.2 Chipset
The Intel Q67 Express PCH-D0 is a single component that provides the following functions:
■ PCI 2.3 bus controller
■ PCIe bus controller
■ LPC bus controller
■ SMBus interface
■ SATA interface
■ HD audio interface
■ RTC/CMOS function
■ IRQ controller
■ Serial Peripheral Device
■ Power management logic
■ USB 1.1/2.0 controllers supporting 14 ports
■ Gigabit Ethernet controller
2-6www.hp.comTechnical Reference Guide
2.3.3 Support Components
Input/output functions not provided by the chipset are handled by other support components.
Some of these components also provide “housekeeping” and various other functions as well.
Table 2-3 shows the functions provided by the support components.
Support Component Functions
Component NameFunction
Nuvoton SIO11 ControllerKeyboard and pointing device I/F
Serial I/F (COM1and COM2) [1]
Parallel I/F (LPT1, LPT2, or LPT3) [2]
PCI reset generation
Interrupt (IRQ) serializer
Power button and front panel LED logic
GPIO ports
Processor over temperature monitoring
Fan control and monitoring
Power supply voltage monitoring
SMBus and Low Pin Count (LPC) bus I/F
These systems implement a dual-channel Double Data Rate (DDR3) memory architecture. All
models support DDR3 1333-MHz (PC3-10600) and 1066-MHz (PC3-8500) memory modules.
The CMT, MT, and SFF form factors provide four UDIMM sockets and support a maximum of
16 gigabytes of memory. The USDT form factor provides two SODIMM sockets and supports up
to eight gigabytes of memory.
10/100/1000 Fast Ethernet network interface controller.
Two digital-to-analog stereo converters
Two analog-to-digital stereo converters
Analog I/O
Supports stereo (two-channel) audio streams
Technical Reference Guidewww.hp.com2-7
System Overview
2.3.5 Mass Storage Accommodations
All models support at least two mass storage devices, with one being externally accessible for
removable media. The storage device accommodations are as follows:
CMT: six bays total; three 5.25-inch externally accessible, three 3.5-inch internal
MT: five bays total; two 5.25-inch externally accessible, one 3.5-inch externally acessible, two
3.5-inch internal
SFF: three bays total; one 5.25-inch externally accessible, one 3.5-inch externally accessible, one
3.5-inch internal
USDT: two bays total; one 5.25-inch externally accessible (for slimline optical disk drive), one
2.5-inch internal
These systems may be preconfigured or upgraded with a SATA hard drive and one removable
media drive such as a CD-ROM drive.
2.3.6 Legacy Input/Output Interfaces
PS/2 Port
All systems provide two PS/2 ports at the rear of the chassis for connection of a keyboard and
mouse.
Serial port
The CMT, MT, and SFF form factors provide a serial port at the rear of the chassis and support a
second serial port option. The serial interface is RS-232-C/16550-compatible and supports
standard baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K.
Parallel port
The CMT, MT, and SFF form factors support a parallel port option.
2.3.7 Universal Serial Bus Interface
All models provide ten externally accessible Universal Serial Bus (USB) ports. Four ports are
provided at the front of the unit, six ports are provided on the rear panel. Accessible through a
header on the system board are two USB ports in the USDT form factor and four USB ports in
the CMT, MT, and SFF form factors. These systems support a media card reader module that
connects to the internal header. USB 1.1 and 2.0 functionality is available on all ports.
BIOS Setup allows for the disabling of USB ports individually or in groups. In order to secure
the system against a physical attack, ports may be disabled even if there is nothing physically
connected to them, such as the two front ports for the media card reader module when the
module is not present.
2.3.8 Network Interface Controller
All models feature an Intel 82579 gigabit (GbE) Network Interface Controller (NIC) integrated
on the system board. The controller provides automatic selection of 10BASE-T, 100BASE-TX,
or 1000BASE-T operation with a local area network and includes power-down, wake-up,
Alert-On-LAN (AOL), and AMT features. An RJ-45 connector with status LEDs is provided on
the rear panel.
2-8www.hp.comTechnical Reference Guide
2.3.9 Graphics Subsystem
In the standard configuration, these systems use the integrated graphics controller (IGC) of the
Intel processor. Intel Celeron, Pentium, Core i3, and most Core i5 and Core i7 processors feaure
the HD Graphics 2000 IGC while select Core i5 and Core i7 processor feature the HD Graphics
3000 IGC.
The Intel HD Graphics 2000 uses six execution units providing high-performance 2D and casual
3D capabilities. The Intel HD Graphics 3000 uses 12 execution units providing
high-performance 3D capabilities without the need for a separate graphics card.
All systems include a legacy analog video (VGA) connector and a DisplayPort connector and
support dual monitor operation. The DisplayPort includes a multimode feature that allows a
VGA, DVI, or HDMI adapter to be connected to the DisplayPort.
For upgrading the graphics controller, the CMT, MT, and SFF form factors provide a PCIe 2.0
✎
x16 graphics slot while the USDT form factor provides an MXM 3.0 slot.
2.3.10 Audio Subsystem
These systems use the integrated High Definition audio controller of the chipset and the Realtek
ADL261 High Definition audio codec. HD audio provides enhanced audio performance with
higher sampling rates, refined signal interfaces, and audio processors with increased
signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and
multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an
internal speaker, which can be muted with the F10 BIOS control. All models include a front
panel accessible stereo microphone input jack (re-taskable as a Line-In input) and a headphone
output audio jack.
System Overview
2.3.11 HP ProtectTools Embedded Security
HP ProtectTools Embedded Security is a hardware/software solution providing file and folder
encrypytion service that integrates with the operating system. The software component—the HP
ProtectTools Embedded Security Manager (preinstalled), controls the basic operation of the
hardware component—the Trusted Platform Module (TPM) security chip. These components are
compliant with the Trusted Computing Group (TCG) security standards organization.
HP ProtectTools Embedded Security includes the following features:
■ Enhanced Windows operating system files and folder encryption
■ Enhanced email encryption—built-in authentication for Outlook, Outlook Express, Lotus
Notes, Eudora
■ Strengthens defense against hacking, system attacks, denial of service and network attacks
■ “Embedded smart card” functionality
■ Strengthens authentication with LANs, WANs.
■ Works with/enhances third-party security solutions
HP ProtectTools Embedded Security Manager is acecssed through a Windows Control Panel
applet. The management functions are accessible through established protocols such as DMI,
SNMP, or WEBEM.
Technical Reference Guidewww.hp.com2-9
System Overview
2.4 Specifications
This section includes the environmental, electrical, and physical specifications for the systems
covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications
are subject to change without notice.
Maximum Altitude10,000 ft (3048 m) [2]30,000 ft (9144 m) [2]
NOTE:
[1] Peak input acceleration during an 11 ms half-sine shock pulse.
[2] Maximum rate of change: 1500 ft/min.
Table 2-5
Power Supply Electrical Specifications
ParameterValue
Input Line Voltage:
Nominal:
Maximum
100–240 VAC
90–264 VAC
20C/Hr)
Input Line Frequency Range:
Nominal
Maximum
50–60 Hz
47–63 Hz
Maximum Continuous Power:
USDT
SFF
MT
CMT
135 / 180 W
240 W
320 W
320 W
2-10www.hp.comTechnical Reference Guide
Table 2-6
Physical Specifications
ParameterUSDTSFF [2]MTCMT [3]
System Overview
Height 2.60 in
(6.60 cm)
Width9.90 in
(25.15 cm)
Depth10.0 in
(25.40 cm)
Weight [1]7.0 lb
(3.18 kg)
NOTES:
[1] System configured with 1 hard drive, 1 optical media drive, and no PCI cards.
[2] Desktop (horizontal) configuration.
[3] Minitower configuration. For desktop configuration, swap Height and Width dimensions.
3.95 in
(10.03 cm)
13.3 in
(33.78 cm)
14.9 in
(37.85 cm)
16.72 lb
(7.6 kg)
14.5 in
(36.8 cm)
6.88 in
(17.5 cm)
16.31 in
(41.1)
23.8 lb
(10.8 kg
17.63 in
(44.8 cm)
7.0 i n
(17.8 cm)
17.5 in
(44.5 cm)
26.2 lb
(11.5 kg)
Technical Reference Guidewww.hp.com2-11
System Overview
2-12www.hp.comTechnical Reference Guide
3.1 Introduction
Processor
Cntlr
SDRAM
XMM1
Channel B
DIMM
DIMM [2]
DIMM
DIMM [2]
XMM3
XMM4
XMM2
Intel
Channel A
or
SODIMM [1]
or
SODIMM [1]
DDR3
DMI
FDI
PCH
NOTES:
[1] USDT uses SODIMM sockets
[2] CMT, MT, and SFF only
This systems provide an LGA 1155 (H2) socket supporting an Intel Celeron, Pentium Dual-Core,
Core i3, Core i5, or Core i7 processor. These processors include an integrated dual-channel
DDR3 memory controller (Figure 3-1) and support PC3-8500 and PC3-10600 memory modules.
This chapter describes the processor/memory subsystem.
These systems support an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7
processor that mounts in a zero-insertion force LGA1155 (H2) socket.
3.2.1 Intel Processor Features
Table 3-1 provides the specifications of processors supported by these systems.
Specifications of Supported Intel Processors
Intel
SeriesModel
Core i72600K4 / 83.4 / 3.8 GHz8 MBHD 300095 W
2600HD 2000
2600S2.8 / 3.8 GHz65 W
Core i52500K4 / 43.3 / 3.7 GHz6 MBHD 300095 W
25003.3 / 3.7 GHzHD 2000
2500S2.7 / 3.7 GHz65 W
2500T2.3 / 3.3 GHz45 W
24003.1 / 3.4 GHz95 W
2400S2.5 / 3.3 GHz65 W
23002.8 / 3.1 GHz95 W
2390T2 / 42.7 / 3.5 GHz3 MB35 W
Core i321202 / 43.3 / na GHz3 MBHD 200065 W
21053.1 / na GHz
21003.1 / na GHz
2100T2.5 / na GHz35 W
PentiumG8502 / 22.9 / na GHz65 W
G8402.8 / na GHz
G6202.6 / na GHz
G620T2.2 / na GHz35 W
# Cores /
Threads
Table 3-1
CPU
Clock Rate
Base / Turbo
L3
Cache
Size
Graphics
ControllerTDP
These processors include an integrated memory controller that supports 1333-MHz dual-channel
DDR3 memory.
3-2www.hp.comTechnical Reference Guide
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