This technical reference and BIOS document for the HP e-pc contains
summary information only. More detailed information on system hardware is
available in the Technical Reference Manual - HP PC Technology.
On ICH chip. 2 USB connectors, 1 serial port and 1 parallel port, 2 PS/2 (keyboard, mouse), 1 15-pin VGA connector, audio ports (stereo-in,
stereo-out, microphone in)
On ICH chip. 2 IDE Ports (Ultra ATA 66)
Intel® 810E integrated graphics with Direct AGP and Dynamic Video Memory Technology.
As an ENERGY STAR partner, HP has determined that this product meets the
ENERGY STAR guidelines for energy efficiency (standard base models).
Power Consumption
(PC running Windows98)
Operating with input/output:38W
Operating without input/output:21W
Suspend: 15W
Automatic Sleep Mode:4.1W
Off:2.2W
These are “typical” values given for the standard base models.
NOTEWhen the PC is turned off with the power button on the front panel, the power
consumption falls below 5 Watts, but is not zero. The special on/off method
used by this PC extends the lifetime of the power supply. To reach zero power
consumption in “off” mode, unplug the AC adapter from the power outlet or
unplug the AC adapter from the HP e-pc. If the PC is turned off, the time
settings are maintained by the battery indefinitely (until the battery runs out
of power).
The values are given for the standard configuration as shipped and can vary
depending on the actual components used.
6
Sound Power
(Average)
Sound Power
(ISO 9296)
Sound Pressure
(ISO 9296)
1 system overview
specifications
environmental specifications
Environmental Specifications (System Processing Unit, with Hard Disk)
o
Operating Temperature5
Storage Temperature-40
Operating Humidity15% to 80% (relative)
Storage Humidity8% to 85% (relative), non-condensing at 40°C (104°F)
Acoustic Noise Emission:(as defined ISO 7779)
Operating Altitude10000 ft (3100m) max
Storage Altitude15000ft (4600m) max
Operating temperature and humidity ranges may vary depending upon the
mass storage devices installed. High humidity levels can cause improper
operation of disk drives. Low humidity levels can aggravate static electricity
problems and cause excessive wear of the disk surface.
C - 35oC
o
C to 70oC
Sound level (LwA) ≤ 37 db (operating)
7
1 system overview
specifications
8
2
system features
This chapter describes core components of the HP e-pc such as processors,
chip set, mass storage devices, graphics controller, audio controller, network
features and input devices.
Audio
Line
OUT
2 system features
hp e-pc system board layout
hp e-pc system board layout
All HP e-pc system boards have a Celeron/Pentium III processor slot.
system board
2 stacked USB
connectors
Line
IN
Mic IN
IDE connector
CMOS/Password
Switch
Keyboard
LAN
mouse
LAN
The parallel port is located
above Serial Port and VGA
connector
HDD Power Connector
Battery Socket
Power Connector
CD-ROM connector
810E chipset with
embedded graphics
Memory
slot
10
Processor Socket
Status panel
connector
Power Fan
connector
hp e-pc PCI mapping
2 system features
hp e-pc system board layout
HP e-pc PCI Mapping Table
BusDevicePCI Device
00MCH chip
01VGA
030ICH chip: PCI bridge
031ICH chip
031Integrated audio (CoDec)
12Integrated LAN
11
2 system features
architectural view
architectural view
Display
LAN
CS4299
AUDIO AC97
Celeron or Pentium III
GMCH
Intel
82810e
PCI 33
ICH
Intel
82801AA
FWH
INTEL 82802AB(4M)
Processor
System Bus
(66/133MHz)
266 MB/s
LPC Bus
System Memory
64bit
(66/100MHz)
ATA33/66
Super
USB
HDD and CDD
I/O
PS/2 KB and MS
Serial and //
12
2 system features
main memory
main memory
There is one 168-pin DIMM slot on the system board for installing main
memory. All HP e-pc models are supplied with a memory module of at least
64 MB non-ECC SDRAM. Only HP memory modules are supported. Memory
upgrades are not supported.
processors
The HP e-pc is equipped with either a single Socket 370 Intel Celeron or
socket 370 Intel Pentium III processor. Socket 370 is a conversion of Slot 1
(used previously by Celerons and Pentium Is) to a socket, running at the
same bus protocol as the Pentium II (the GTL+ bus protocol). The processor
is connected to the system board through a Plastic Pin Grid Array (PPGA)
370 Socket. The reduction in size achieved by the Socket 370 Celeron is due
to the integration of the L2 cache on the processor die. Like the Celeron
processor, the Pentium III comes in a 370-pin socket (PGA370) package.
To find out more about Socket 370 Celeron technology, refer to the Te ch n i ca l Reference Manual - HP PC Technology.
13
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