HP 450 G1 User Manual
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicabl e.]
HP ProBook 450 G1 Notebook PC
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
With a surface greater than 10 sq cm
Function Board
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries Main battery, RTC battery
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries NO
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Panel
1
Cathode Ray Tubes (CRT)
NO
0
Capacitors / condensers (Containing PCB/PCT)
NO
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
NO
0
External electrical cables and cords
NO
0
Gas Discharge Lamps
NO
0
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
NO
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NO
0
Components and waste containing asbestos
NO
0
Components, parts and materials containing
NO
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Assemblies (PCA)
weighing > 25 grams (not including PCBs or PCAs
Mother Board, SD Board, USB Boar d, ODD board,
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template a r e a vailable at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
NO
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #1 Cross screwdriver
#1
Description #2 P1 screwdriver
#1
Description #3
Description #4
Description #5
3.0 Product Disassembly Proc ess
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take off the battery package from system bottom side.
2. Release DIMM/HDD door knob and take off DIMM/HDD door.
3. Loose HDD & ODD module screws and take off HDD & ODD module from system.
4. Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from system.
5. Loose KB module screw, and then take off KB module.
6. Loose L-case to U-case screws on bottom side & U-case to L-case screw on top side, and take off U-case from
system.
7. Loose the screw of the speaker ,power board, function board, touchpad module, FPR, SD board ,and USB board then
take off them.
8. Loose screw of hinge to L-case, take off LCD module from L-case.
9. Loose screw of MB to U-case, take off MB. Loose screw of thermal module from MB, take off thermal module
10. Loose screw and screw mylar, take off hinge cover and lcd bezel.
11. Loose LCD & Hinge screw, take off LCD , hinge and panel.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template a r e a vailable at EL-MF877-01
Disassembly Process-1
Take off the battery package from system bottom side. Release DIMM/HDD door
knob and take off DIMM/HDD door.
+
Loose HDD & ODD module screws and take off HDD & ODD module from system.
Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from
system.
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