(MOD), ANSI/UL
60950-1 (VDE‡ 0805-1):2011-01 DIN EN 60950-1/A12 (VDE
0805-1/A12):2011-08 EN 60950-1:2006 + A11:2009 +
A1:2010 + A12:2011 IEC 60950-1:2005 (2nd Edition);
am1:2009
CE mark meets 2006/95/EC directive
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3
standards
**
ISO
9001 and ISO 14001 certified manufacturing facilities
#
60950-1-2011, December 19, 2011; DIN EN
o,nom
§
¤
PoE
Description
The SHHD005A0F Hammerhead series power modules are isolated dc-dc converters that operate over an ultra-wide input voltage
range of 18 Vdc -75Vdc and provide a single precisely regulated output voltage at 3.3Vdc. This series is a low cost, smaller size
alternative to the existing LW/LAW/LC/SC/SW with enhanced performance parameters. The output is fully isolated from the input,
allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency of 87.5% typical at full
load. Built-in filtering for both input and output minimizes the need for external filtering. The module is fully self-protected with
output over-current and over-voltage, over-temperature and input under voltage shutdown control. Optional features include
negative or positive on/off logic and SMT connections.
* Trademark of General Electric Company
#
UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Associat ion.
‡
VDE is a trademark of Verband Deutscher Elektrotechnik er e.V.
§ This product is intended for integration into end- user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the Internat ional Organization of Standards.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage (Continuous) All V
Transient (100ms) All V
Operating Ambient Temperature All T
(see Thermal Considerations section)
Storage Temperature All T
Altitude* All
I/O Isolation Voltage (100% factory Hi-Pot tested) All
IN
IN, trans
A
stg
* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
(5Hz to 20MHz, 12μH source impedance; V
see Test configuration section)
Input Ripple Rejection (120Hz) All 60 dB
EMC, EN55022 See EMC Considerations section
) All I
O, max
=0V to 75Vdc, IO= I
IN
Omax
;
All I
All 30 mA
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of
complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 3 A
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Turn-On Delay and Rise Times
(IO=80% of I
Case 1: Input power is applied for at least 1second, and then the
On/Off input is set from OFF to ON (T
V
Case 2: On/Off input is set to Module ON, and then input power is
applied (T
Output voltage Rise time (time for Vo to rise from 10%
of V
Output Voltage Overshoot
(IO=80% of I
Output Overvoltage Protection
Input Undervoltage Lockout
to V
IN, min
Logic Low - Remote On/Off Current (V
; open collector or equivalent,
IN, max
terminal)
IN-
= -0.7Vdc) All I
on/off
Logic Low - On/Off Voltage All V
Logic High Voltage (I
= 0Adc) All V
on/off
Logic High maximum allowable leakage current All I
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Characteristic Curves
The following figures provide typical characteristics for the SHHD005A0F (3.3V, 5A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.
(A)
IN
EFFICIENCY, (%)
OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VIN (V)
Figure 1. Converter Efficiency versus Output Current.
(V) (100mV/div)
O
OUTPUT VOLTAGE
V
TIME, t (2s/div)
Figure 3. Typical output ripple and noise (I
E
LTA
V
(V) (2V/div)
n
On/Off
o
= I
o,max
).
INPUT CURRENT, I
Figure 2. Converter Input Current versus Input Voltage.
(V) (100mV/div)
O
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) V
TIME, t (1ms/div)
Figure 4. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=24V,
C
>100μF
O
(V) (20V/div)
IN
E
LTA
(V) (1V/div) V
(V) (1V/div) V
O
UTPUT V
V
TIME, t (5ms/div) TIME, t (5ms/div)
Figure 5.Typical Start-up Using Remote On/Off, negative
logic version shown (V
Figure 6. Typical Start-up Using Input Voltage (V
I
o,max
).
IN
= 48V, I
o
=
GE
Data Sheet
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Test Configurations
Vout+
Vout-
CURRENT PROBE
33μF
SC O P E
R
V
O
R
x 100 %
Vin+
Vin-
RESI STI V E
LO A D
contact Rdistribution
R
contact Rdistribution
LOAD
TO OSCILLOSCOPE
L
TEST
12μH
CS 220μF
BATTERY
NOTE: Measure input reflected ripple current with a simulated
E.S.R.<0.1
@ 20°C 100kHz
source inductance (L
possible battery impedance. Measure current as shown
above.
) of 12μH. Capacitor CS offsets
TEST
Figure 7. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V
(+)
O
1uF .
V
( – )
O
NOTE: All voltage measurements to be take n at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
10uF
GROUND PLANE
Figure 8. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Vin+
V
IN
Vin-
Figure 9. Output Voltage and Efficiency Test Setup.
. I
V
O
Efficiency
=
VIN. I
O
IN
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 33μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e., UL 60950-1-3, CSA
C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be
true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One V
pin and one V
IN
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
output pins and ground.
The power module has extra-low voltage (ELV) outputs when
all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal to
–75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as TNV-2
in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 3A
time-delay fuse in the ungrounded lead.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the on/off pin,
and off during a logic low. Negative logic remote on/off, device
code suffix “1”, turns the module off during a logic high and on
during a logic low.
Vin+
I
on/off
V
on/off
Figure 10. Circuit configuration for using Remote On/Off
Implementation.
To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage
) between the ON/OFF terminal and the VIN(-) terminal.
(V
on/off
Logic low is 0V ≤ V
logic low is 1mA, the switch should be maintain a logic low
level whilst sinking this current.
During a logic high, the typical V
is 2.4V, and the maximum allowable leakage current at V
2.4V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V
ON/OFF
Vin-
≤ 0.8V. The maximum I
on/off
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back into
its specified range. The average output current during hiccup
is 10% I
O, max
.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is
equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point Tref (Figure 16),
exceeds 125
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module will automatically
restart upon cool-down to a safe temperature.
o
C (typical), but the thermal shutdown is not
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only begin
to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V
operating, the module will continue to operate until the input
Vout+
TRIM
Vout-
during a
on/off
generated by the module
on/off
(-).
IN
. Once
UV/ON
on/off
voltage is taken below the undervoltage turn-off threshold,
.
V
UV/OFF
Over Voltage Protection
The output overvoltage protection consists of circuitry that
independently monitors the output voltage, and shuts the
module down if the output voltage exceeds specified limits.
The module shall contain hiccup restart capability.
Output Voltage Programming
Trimming allows the user to increase or decrease the output
voltage set point of the module. This is accomplished by
connecting an external resistor between the TRIM pin and
either the Vout+ pin or the Vout- pin.
Trim Down – Decrease Output Voltage
By connecting an external resistor between the TRIM pin and
Vout+ pin (Radj-down), the output voltage set point decreases
(see figure 11). The following equation determines the external
resistor value to obtain an output voltage change from V
to the desired V
R
downadj
H
Note: Values for G and H are defined in Table 1.
Module G H K
SHHD005A0F 5110 2050 0.8
Table 1. Trim Constants SHHD series
=
Vin+
ON/OFF
Vin-
Figure 11. Circuit Configuration to Decrease Output Voltage.
:
o,adj
adjo
,
Vout+
TRIM
Vout-
)5.2(
VV
adjonomo
,,
GV
)(
R
adj-down
Trim Up – Increase Output Voltage
By connecting an external resistor between the TRIM pin and
Vout- pin (Radj-up), the output voltage set point increases (see
figure 12). The following equation determines the external
resistor value to obtain an output voltage change from V
to the desired V
upadj
H
R
Note: Values for G, H and K are defined in Table 1.
The combination of the output voltage adjustment and the
output voltage initial tolerance must not exceed the allowable
trim range of 90% to 110% of the nominal output voltage as
measured between the Vout+ and Vout- pins.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Feature Descriptions
(continued)
Vin+
ON/OFF
Vin-
Figure 12. Circuit Configuration to Increase Output Voltage.
The SHHD power modules have a fixed current-limit set point.
Therefore, as the output voltage is adjusted down, the
available output power is reduced.
Trim Examples
For SHHD005A0F, nominal 3.3V module. To trim module down
to 3.10V:
downadj
R
downadj
R
Vout+
R
TRIM
R
adj-up
Vout-
5110)5.21.3(
)1.33.3(
280,13
2050
LOAD
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability.
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature, the
module output power is increased, until one (or more) of the
components reaches its maximum derated operating
temperature, as defined in IPC-9592A. This procedure is then
repeated for a different airflow or ambient temperature until a
family of module output derating curves is obtained.
Figure 13. Thermal Test Setup .
(A)
O
OUTPUT CURRENT, I
LOCAL AMBIENT TEMPERATURE, TA (C)
Figure 14. Output Current Derating for the Open Frame
SHHD005A0F in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 24V.
(A)
O
OUTPUT CURRENT, I
LOCAL AMBIENT TEMPERATURE, TA (C)
Figure 15. Output Current Derating for the Open Frame
SHHD005A0F in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 48V.
The thermal reference point, T
shown in Figure 16. For reliable operation this temperature
should not exceed 111
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Figure 16. T
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Derating figures showing the maximum output
current that can be delivered by each module versus local
ambient temperature (T
3m/s (600 ft./min) are shown in the respective Characteristics
Curves section.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
EMC Requirements
Figure 17 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.
Temperature Measurement Location.
ref
) for natural convection and up to
A
Figure 18. EMC signature using above filter, SHHDA.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The SHHD power module series are low profile in order to be
used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The SHHD family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
Figure 17. Suggested Configuration for EN55022 Class B.
Ref Des Filter
C1 , C2, C3 2.2uF/100V
C4, C5 33nF Y cap
L1 4mH CM choke
L2 10uH inductor
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant finish that is compatible with both Pb and Pbfree wave soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. The Through
Hole module is also compatible with paste-in-hole reflow
soldering. Refer to the Reflow Soldering Information section for
process details. If additional information is needed, please
consult with your GE representative for more details.
Surface Mount Information
Pick and Place
The SHHD-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.
The SHHD-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Note: All dimensions in mm [in].
Figure 19. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.
The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is
6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used
within the space available.
For further information please contact your local GE Technical
Sales Representative.
Reflow Soldering Information
These power modules are large mass, low thermal
resistance devices and typically heat up slower than other
SMT components. It is recommended that the customer
review data sheets in order to customize the solder reflow
profile for each application board assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.
There are several types of SMT reflow technologies currently
used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb solder is
shown in Figure 20 and 21. For reliable soldering the solder
reflow profile should be established by accurately
measuring the modules CP connector temperatures.
300
250
200
150
10 0
REFLOW TEMP (C)
50
0
Pe ak Temp 235oC
Heat zone
oCs-1
max 4
Soak zone
30-240s
P reheat zone
oCs-1
max 4
REFLOW TIME (S)
T
205
lim
Cooling
zo ne
1- 4
above
o
C
oCs-1
Figure 20. Recommended Reflow Profile for Sn/Pb solder.
240
235
230
225
220
215
210
MAX TEMP SOLDER (C)
205
200
0 10203040 5060
TIME LIMIT (S)
Figure 21. Time Limit, T
, Curve Above 205oC Reflow .
lim
Lead Free Soldering
The –Z version SMT modules of the SHHD series are lead-free
(Pb-free) and RoHS compliant and are compatible in a Pb-free
soldering process. Failure to observe the instructions below
may result in the failure of or cause damage to the modules
and can adversely affect long-term reliability.
300
Per J-STD-020 Rev. C
250
200
150
Heating Zone
1°C/Second
100
Reflow Temp (°C)
50
0
Peak Te mp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Reflow Time (Seconds)
Cooling
Zone
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The SHHD001A3B series SMT modules have a MSL rating of 2a.
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Surface Mount Information (continued)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.
Layout Recommendations
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished circuit
board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Packaging Details
The SHHD005A0F-SR series SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown
below. Modules are shipped in quantities of 150 modules per reel.
Tape Dimensions
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
The SHHD005A0F - series Through Hole versions are supplied in trays as standard. Details of tray dimensions are shown
below. Modules are shipped in quantities of 75 modules per box.
Tray Dimensions
Dimensions are in millimeters.
Tolerances: x.x mm 0.5 mm (unless otherwise indicated)
x.xx mm 0.25 mm
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Mechanical Outline for SHHD005A0F Surface-Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Mechanical Outline for SHHD005A0F Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
SHHD005A0F Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 3.3Vdc, 5A, 15W Output
Mechanical Outline for SHHD005A0F6-35 Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]