GE VR11, VP11 Reference Manual
GE
Intelligent Platforms
Hardware Reference Manual
VR11, VP11
Intel® Core™2 Duo / Intel® Core™ Duo
6U VME SBC
Second Edition
Publication No. HRMVR112E
Document History
Copyright©2010GEIntelligentPlatforms,Inc.
Allrightsreserved.
TheVR11,VP11HardwareReferenceManualappliestotheVR11,VP116U
VMESingleBoardComputerrevision1.0andabove,untilsuperseded.
Edition Date By BoardArtworkRevision
Second 01Apr2010 HHS All
HHS Adjustlayouttonewstyle
HHS Changesupportchapter;addsalesaddresses
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 2
Legal Information
Legal Disclaimers
© 2010 GE Intelligent Platforms, Inc. All rights reserved.
The information in this manual is proprietary to and is the confidential
information of GE Intelligent Platforms, Inc. and may not be reproduced in
whole or in part, for any purpose, in any form or by any means, electronic,
mechanical, recording, or otherwise, without written consent of GE Intelligent
Platforms, Inc. Use, disclosure, and reproduction is permitted only under the
terms of a GE Intelligent Platforms license agreement or explicit written
permission of GE Intelligent Platforms. You are not authorized to use this
document or its contents until you have read and agreed to the applicable
license agreement. Receipt of this publication is considered acceptance of these
conditions.
All information contained in this document has been carefully checked and is
believed to be entirely reliable and consistent with the product that it describes.
However, no responsibility is assumed for inaccuracies. GE Intelligent
Platforms assumes no liability due to the application or use of any product or
circuit described herein; no liability is accepted concerning the use of GE
Intelligent Platforms products in life support systems. GE Intelligent Platforms
reserves the right to make changes to any product and product documentation
in an effort to improve performance, reliability, or design.
THIS DOCUMENT AND ITS CONTENTS ARE PROVIDED AS IS, WITH
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used only in connection with a GE Intelligent Platforms hardware product.
Even if this code or software is merged with any other code or software
program, it remains subject to the terms and conditions of this license. If you
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GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 3
GE Intelligent Platforms shall have no liability with respect to the infringement
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Please see the applicable software license agreement for full disclaimer or
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This disclaimer of warranty extends to GE Intelligent Platforms’ licensees, to
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GE Intelligent Platforms and the GE Intelligent Platforms logo are trademarks
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GE Intelligent Platforms, Inc., 2500 Austin Drive, Charlottesville, VA 22911,
U.S.A.
Regulatory compliance
Products sold or transferred between companies or operated on company
premises (factory floor, laboratory) do not need CE, FCC or equivalent
certification. Boards or subsystems which cannot provide a useful function on
their own do not need certification.
Certification can only be granted to complete and operational systems. There
are authorized testing agencies, regulatory organizations and laboratories who
will issue certificates of compliance after system testing.
GE Intelligent Platforms designs and tests all their products for EMI/EMC
conformance. Where GE Intelligent Platforms supplies a complete/functional
system for use by end users a certificate will be cited in the manuals/documents
which are provided with the products.
Products manufactured by GE Intelligent Platforms should normally be suitable
for use in properly designed and produced customer equipment (system boxes
or operational systems) without any major redesign or additional filtering.
However, the systems might not conform to specific regulations once
assembled and used. The system integrator or installer must test for compliance
as required in his country or by the intended application and certify this to the
end user.
ESD/EMI issues
ESD (Electro-Static Discharge) and EMI (Electro-Magnetic Interference) issues
may show up in complete and operational systems. There are many ways to
avoid problems with these issues.
Any operational system with cables for I/O signals, connectivity or peripheral
devices provides an entry point for ESD and EMI. If GE Intelligent Platforms
does not manufacture the complete system, including enclosure and cables, it is
the responsibility of the system integrator and end user to protect their system
against potential problems. Filtering, optical isolation, ESD gaskets and other
measures might be required at the physical point of entry (enclosure wall of box
or rack). For example it is state-of-the-art that protection can not be done at the
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 4
internal connector of an RTM if a cable is attached and routed outside the
enclosure. It has to be done at the physical entry point as specified above.
Products manufactured by GE Intelligent Platforms should normally be suitable
for use in properly designed and produced customer equipment (system boxes
or operational systems) without any major redesign. However, the systems
might be subject to problems and issues once assembled, cabled and used. The
end user, system integrator or installer must test for possible problems and in
some cases show compliance to local regulations as required in his country or
by the intended application.
Waste Disposal
The mark or symbol on any electrical or electronic product shows that this
product may not be disposed off in a trash bin. Such goods have to be returned
to the original vendor or to a properly authorized collection point.
Electric waste disposal symbol with black bar as explained below
The black bar underneath the waste bin symbol shows that the product was
placed on the market after 13 August 2005. Alternatively the date of ‘placed on
the market’ is shown in place of the bar symbol.
CE conformance declaration
CE certification is required in EU countries for equipment which is used or
operated by the end user. Products sold or transferred between companies or
operated on company premises (factory floor, laboratory) do not need CE
certification.
CE certification can only be granted to complete and operational systems.
Boards or subsystems which cannot provide a useful function on their own do
not need CE certification.
GE Intelligent Platforms designs and tests all their products for EMI/EMC
conformance. Products manufactured by GE Intelligent Platforms should
normally be suitable for use in properly designed and produced customer
equipment (system boxes or operational systems) without any major redesign
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 5
Corporate addresses
Regional headquarters
or additional filtering. The system integrator or installer must, in any case, test
for CE compliance and certify this to the end user.
Where GE Intelligent Platforms supplies a complete/functional system for use
by end users in EU countries a CE certificate will be cited in the
manuals/documents which are provided with the products. The CE (and year of
certification) symbol is shown on the equipment, typically on the type or S/N
label or close to the power cable entry.
GE Intelligent Platforms have tested their boards using their own card cages
(chassis). Test results of these tests are available upon request.
Corporate headquarters
GE Intelligent Platforms Inc.
2500 Austin Drive
Charlottesville, VA 22911
U.S.A.
Phone: +1-800-322-3616
Web: www.ge-ip.com
US Germany
Americas & Pacific Rim (Japan,
Korea, China, Philippines, AUS, NZ)
GE Intelligent Platforms, Inc. GE Intelligent Platforms GmbH &
2500 Austin Drive Memminger Str. 14
Charlottesville, VA 22911 86159 Augsburg
U.S.A. Germany
Phone: +1-800-322-3616 Phone: +49-821-5034-0
Fax: +1- Fax: +49-821-5034-119
Web: www.ge-ip.com Email: sales.augsburg.ip@ge.com
GE Intelligent Platforms on the Web: http://www.ge-ip.com
For contact and other information (service, warranty, support etc.) see address
list in chapter: ‘Support, Service’.
Germany
Co. KG
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 6
Introduction Welcome
The VR11, VP11 VME Single Board Computer is a fully IBM-AT compatible
stand-alone PC equipped with numerous functions and add-on features on a
minimal board foot print. This technical manual is designed to provide
information regarding the general usage and application of the VR11, VP11
VME Single Board Computer. It also details the hardware and software
methodologies. Programming information is also provided.
Chapter 1 gives a brief overview over the functions, features and devices of the
VR11 and VP11.
Chapter 2 and 3 illustrate unpacking and installation procedures.
Chapter 4 contains important information for 'Getting started'
Chapter 5 describes all onboard and panel interfaces with pin assignments.
Chapter 6 contains notes on system resources.
Chapter 7 describes the functional blocks.
Chapter 8 details electrical and environmental specifications.
Appendix A describes the VME Transition Module VTM22.
Appendix B shows details of the PMC sockets.
Appendix C explains the Vx9 and Vx11 compatibility.
Appendix D describes support and warranty conditions and procedures.
Please observe all safety instructions when handling GE Intelligent Platforms
products as given in the unpacking and installation chapters.
The following document also covers items relevant to the VR11 and the VP11
VME Single Board Computer. It is also included under Technical Product
Information on our Product CD-ROM.
• User’s Manual for AMIBIOS8 Setup
• Board Specific Hardware Programmer’s Manual
• AMIBIOS8 Check Point and Beep Code List
• AMIBIOS8 Error Messages
• Thermal Report TR-HW-012
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 7
Product Properties
Typographic Conventions
This manual uses the following notation conventions:
• Italics (sometimes additional in blue color) emphasize words in text or
documentation or chapter titles or web addresses if underlined.
• Hexadecimal values (base 16) are represented as digits followed by 'h', for
example: 0Ch.
• Hexadecimal values (base 16) are represented as digits preceded by 'H', for
example: H0C.
• Hexadecimal values (base 16) are represented as digits preceded by '$', for
example: $0C.
• Binary values (base 2) are represented as digits followed by 'b', for
example 01b
• The use of a '#' (hash) suffix to a signal name indicates an active low
signal. The signal is either true when it is at logic zero level (voltage close
to 0 V) or the signal initiates actions on a high-to-low transition.
• The use of a '\' (backslash) prefix to a signal name indicates an active low
signal. The signal is either true when it is at logic zero level (voltage close
to 0 V) or the signal initiates actions on a high-to-low transition.
• Text in Courier font indicates a command entry or output from a GE
Intelligent Platforms embedded PC product using the built-in character set.
• Notes, warning symbols and cautions call attention to essential
information.
Certification
The product or products described in this technical manual cannot be operated
by themselves. They are components for integration into operational systems or
add-ons to such systems. The products have been designed to meet relevant
regulatory standards like FCC and CE. As mandated by these standards
conformance to these standards can only be certified for complete operational
systems. This has to be done by the end-user or by the systems integrator in
their operational systems. GE Intelligent Platforms have tested some products
in their own systems. Upon request information is available which products
have been tested and about the specific environment under which GE
Intelligent Platforms has tested these components.
Altitude
Altitude, air pressure and ambient temperature influence the thermal operation
of the components described in this manual. They have been developed and
tested at about 500 m (1650 ft.) above sea level at a typical ambient
temperature of 20 °C (68 °F). Because of only marginal variations within a
limited range of altitudes these products operate as specified within altitudes
from sea level to 1000 m (3300 ft.). This is with reference to temperature
ranges of air-cooled versions. GE Intelligent Platforms can assist the user of
these components in planning operation outside this altitude range upon
request.
Options
This manual describes the basic product plus all options. Your product may not
have all options implemented. Please verify with your purchase contract which
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 8
options are implemented. Descriptions of options which are not implemented
obviously do not apply to your product.
Support, Service and Warranty
The manufacturer grants the original purchaser of GE Intelligent Platforms
products a warranty of 24 months from the date of delivery. For details
regarding this warranty refer to Terms & Conditions of the initial sale.
Please see chapter 'Support, Service, and Warranty Information' for further
details on repairs and product support.
For support on the web and product information, visit our website at
http://www.ge-ip.com
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 9
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 10
Introduction Contents
Contents
Legal Information 3
Legal Disclaimers 3
Regulatory compliance 4
ESD/EMI issues 4
Waste Disposal 5
CE conformance declaration 5
Corporate addresses 6
INTRODUCTION WELCOME 7
Typographic Conventions 8
Product Properties 8
Certification 8
Altitude 8
Options 8
Support, Service and Warranty 9
INTRODUCTION CONTENTS 11
CHAPTER 1 INTRODUCTION 19
Board Design 20
Design Features 22
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 11
CHAPTER 2 UNPACKING AND INSPECTION 27
Delivery Volume 27
Available Options 27
ESD 28
Warning 28
Initial Inspection 29
Unpacking 29
Handling 30
CHAPTER 3 INSTALLATION 33
Installation preparation 33
General advice 33
Advice on VMEbus products 34
Advice on Batteries 34
Required items 34
Backplane and Power Supply 34
Keyboard and Mouse 34
Video Monitor 35
Minimum System Requirements 35
THE POST TEST 35
Installation of a plug-in board 36
Installation of the Rear Transition Module (VTM22) 36
Initial Power-On Operation 36
Entering the BIOS SETUP 37
CHAPTER 4 GETTING STARTED 39
Power Supply 39
Status indicator, Postcode and Beeps 40
Booting 40
Setup 41
Unexpected Resets 41
CHAPTER 5 INTERFACES 43
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 12
Front Panel Interfaces 44
VR11 Connectors 45
PMC options 45
VMEbus Connector P1 (P7301) 45
VMEbus Connector P2 (P7302) 46
VMEbus Connector P0 (P7300) with partial PMC-I/O 47
VMEbus Connector P0 (P7300) with full PMC-I/O 49
IDE Connector (P1800) 50
Ethernet Interface (U5600 and U5650) 53
Fast Ethernet Interface U5102 54
Serial Port COM1 (P2200) 54
RJ45 cable (optional) 55
VGA Interface (P4200) 56
USB Interfaces (P1680, P1681) 57
PMC1 Connectors (P6201, P6202, and P6203) 58
PMC2 Connectors (P7201, P7202) 59
PMC-I/O Connector (P6204 and P7204) 61
Transition Module 61
CHAPTER 6 RESOURCES 63
Memory Map 63
Register Set 63
Standard Register Set 64
Plug and Play Devices 64
Interrupts 65
APIC Controller 66
CHAPTER 7 FUNCTION BLOCKS 67
Processor 67
Memory Controller 67
Interrupt Controller 67
Timer 68
Real Time Clock 69
Keyboard and Mouse 69
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EIDE Interface 69
Serial Interface 69
Graphics Controller 70
Software Installation 70
PMC Interface 70
Ethernet Interface 70
Software Installation 70
Additional devices 71
SMBus devices 71
Temperature Sensor LM86 71
Serial EEPROM 71
Geographic Addressing 72
GPIO (0...7) 72
Watchdog, Powerfail Monitor 72
Programmable Timer 72
LED 72
Reset Button 73
Speaker 73
CHAPTER 8 SPECIFICATIONS 76
Power Consumption 76
Onboard Lithium Battery 78
Not powered by the system 78
Powered by the system 79
Battery removal and replacement 80
+5VSTDBY 80
Environment Conditions 81
Card edge temperatures for VR11 style 8 83
Electrical Characteristics 83
Supply voltage range 84
GPIO 0...7 84
Isolation 84
Board layout drawings 85
Placement Plan Component Side VR11 (V0) 86
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 14
Placement Plan Bottom Side VR11 (V0) 87
Placement Plan Component Side VR11 (V1) 88
Placement Plan Bottom Side VR11 (V1) 89
APPENDIX A TRANSITION MODULE VTM22 91
VTM22 Interfaces 93
VGA Interface (P4001) 96
DVI-I connector (P4100) 97
USB connectors (P1600, P1601) 98
Miscellaneous connector (P2000) 99
PMC I/O connectors 100
VGA 2 connector 102
SATA connectors 102
Headphone Out connector 103
SPDIF connector 103
Audio connector 104
CD IN connector 104
Line IN connector 104
Placement Plan VTM22V0 105
APPENDIX B PCI MEZZANINE CARD (PMC) SLOT 107
Electrical characteristics 107
Mounting of PMC module 108
Secondary Thermal Interface 109
APPENDIX C VX11 AND VX9 COMPATIBILITY 111
Basic compatibility: 111
Front I/O: 111
Rear I/O 112
APPENDIX D SUPPORT, SERVICE AND WARRANTY 115
Error Report 116
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 15
FIGURES
Figure 1: VR11 board................................................................................................................................................19
Figure 2: VR11 Block diagram.................................................................................................................................21
Figure 3: Board packaging........................................................................................................................................30
Figure 4: Handling the 6U VME board.....................................................................................................................31
Figure 5: 6U board insertion into VMEbus system box............................................................................................36
Figure 6: VR11 board with PMC sockets .................................................................................................................44
Figure 7: Front panel on single slot board.................................................................................................................44
Figure 8: Front panel on dual slot board ...................................................................................................................45
Figure 9: IDE connector............................................................................................................................................51
Figure 10: Ethernet connectors .................................................................................................................................53
Figure 11: Ethernet connector pin assignment ..........................................................................................................53
Figure 12: Fast Ethernet connector layout.................................................................................................................54
Figure 13: COM1 location ........................................................................................................................................55
Figure 14: VGA interface..........................................................................................................................................56
Figure 15: USB .........................................................................................................................................................57
Figure 16: USB pin assignment ................................................................................................................................57
Figure 17: Battery current versus temperature..........................................................................................................78
Figure 18: Battery current versus time......................................................................................................................79
Figure 19: Battery removal .......................................................................................................................................80
Figure 20: Air temperature vs. air speed ...................................................................................................................82
Figure 21: Component side of VR11 (V0)................................................................................................................86
Figure 22: Bottom side of VR11 (V0).......................................................................................................................87
Figure 23: Component side of VR11 (V1)................................................................................................................88
Figure 24: Bottom side of VR11 (V0).......................................................................................................................89
Figure 25: VTM22 Transition Module......................................................................................................................92
Figure 26: Ethernet connector pin assignment ..........................................................................................................94
Figure 27: DVI-I connector layout ............................................................................................................................97
Figure 28: Placement plan VTM22, V0 ..................................................................................................................105
Figure 29: Mounting of PMC module on VR11 .....................................................................................................108
Figure 30: Mounting of Secondary Thermal Interface on PMC module.................................................................109
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 16
TABLES
Table 1: Styles available ...........................................................................................................................................25
Table 2: BIOS ID coding ..........................................................................................................................................37
Table 3: Boot sequence.............................................................................................................................................41
Table 4: VMEbus connector P1 ................................................................................................................................46
Table 5: VMEbus connector P2 ................................................................................................................................47
Table 6: VMEbus connector P0 with partial I/O and HD Interface ..........................................................................48
Table 7: VMEbus connector P0 with partial I/O, HD interface, SATA, Audio........................................................49
Table 8: VMEbus connector P0 with full I/O ...........................................................................................................50
Table 9: IDE connector .............................................................................................................................................52
Table 10: Ethernet 1/2 connectors.............................................................................................................................53
Table 11: LEDs on Ethernet connector .....................................................................................................................54
Table 12: COM1 pin assignments.............................................................................................................................55
Table 13: RJ45 converter cable pin assignments ......................................................................................................56
Table 14: VGA connector pin assignments...............................................................................................................57
Table 15: USB pin assignments ................................................................................................................................58
Table 16: PMC1 connector pin assignments.............................................................................................................59
Table 17: PMC2 connector pin assignments.............................................................................................................60
Table 18: Memory map.............................................................................................................................................63
Table 19: Standard register set..................................................................................................................................64
Table 20: Interrupt assignments................................................................................................................................65
Table 21: Interval timer functions.............................................................................................................................68
Table 22: Software interfaces....................................................................................................................................70
Table 23: Additional devices.....................................................................................................................................71
Table 24: BIOS power up status ...............................................................................................................................73
Table 25: Power consumption CPU dependent.........................................................................................................77
Table 26: Power consumption DRAM dependent.....................................................................................................77
Table 27: Environment conditions............................................................................................................................81
Table 28: Shock & vibration parameters...................................................................................................................81
Table 29: Maximum height usage.............................................................................................................................82
Table 30: Card edge temperatures for style 8............................................................................................................83
Table 31: Supply voltages .........................................................................................................................................83
Table 32: Supply voltage range.................................................................................................................................84
Table 33: GPIO IN signal levels ...............................................................................................................................84
Table 34: GPIO OUT signal levels ...........................................................................................................................84
Table 35: VTM22 IDE connector .............................................................................................................................93
Table 36: VTM22 Ethernet connectors.....................................................................................................................94
Table 37: VTM22 LEDs ...........................................................................................................................................94
Table 38: VTM22 TMDS connector.........................................................................................................................95
Table 39: VTM22 COM1..........................................................................................................................................96
Table 40: VTM22 COM2..........................................................................................................................................96
Table 41: VTM22 VGA............................................................................................................................................97
Table 42: VTM22 DVI-I connector digital pin assignments.....................................................................................98
Table 43: VTM22 DVI-I connector analog pin assignments ....................................................................................98
Table 44: VTM22 USB0...........................................................................................................................................99
Table 45: VTM22 USB1...........................................................................................................................................99
Table 46: VTM22 Miscellaneous Connector............................................................................................................99
Table 47: PMC I/O connectors................................................................................................................................100
Table 48: PMC I/O header ......................................................................................................................................101
Table 49: VTM22 VGA 2.......................................................................................................................................102
Table 50: VTM22 SATA 0 .....................................................................................................................................102
Table 51: VTM22 SATA 1 .....................................................................................................................................102
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 17
Table 52: VTM22 SATA HD direct........................................................................................................................103
Table 53: VTM22 Headphone Out..........................................................................................................................103
Table 54: VTM22 SPDIF........................................................................................................................................103
Table 55: VTM22 Audio.........................................................................................................................................104
Table 56: VTM22 CD IN........................................................................................................................................104
Table 57: VTM22 LINE IN ....................................................................................................................................104
Table 58: Electrical characteristics..........................................................................................................................107
Table 59: Rear I/O pin assignments for Vx9 & Vx11.............................................................................................112
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 18
CHAPTER 1 Introduction
Chapter Scope
This chapter describes features, capabilities and compatibilities of the VR11
and VP11 VME Single Board Computer. Both boards are based on the same
PCB. All further occurrences of the board’s names will be referred to as the
VR11. Any further specification in this document referring to VR11 can be
applied to VR11 and VP11 unless otherwise noted.
Figure 1: VR11 board
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 19
Board Design
The VR11 is a fully IBM-AT compatible stand-alone PC. It is equipped with
many functions a conventional Personal Computer can only offer after the
installation of several add-in cards. Extension boards can be connected via the
VME interface. The minimal board size and the large number of I/Os and
functions allow the VR11 to be used in many applications. See the following
block diagram for the boards design.
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 20
Figure 2: VR11 Block diagram
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 21
Design Features
The VR11 VME Single Board Computer features:
Microprocessor
Intel® Core™ 2 Duo processor 1.5 GHz (4 MB Level2 cache)
Intel® Core™ Duo processor 1.66 GHz or 2.0 GHz (2 MB Level2 cache)
Chipset
Intel E7520/E6300ESB
667 MHz front side bus (FSB)
with 6300ESB and a 6700PXH
PCIexpress
Four PCIexpress links onboard, XMC slot
SDRAM
2 GB to 4 GB DDR2 400 MHz with ECC
Flash BIOS
Easy updating, in-system programmable Flash ROM, automatic system
configuration
AMI BIOS Core 8
Integrated VGA, SATA RAID and Ethernet PXE ROM BIOS
USB mass storage support, password protection, headless support
remote console via serial port
EEPROM (Serial)
512 Kbit for user data
CMOS RAM
242 byte non-volatile RAM for BIOS configuration storage
Hard/Flash Disk
Onboard mountable 2.5” UDMA5 (100 MB/s) hard disk or FlashDrive.
Keyboard/Mouse
On USB connector, with PS/2 style emulation
USB
Two front (not in conduction cooled style) and 2 rear USB 2.0 ports
Watchdog
Watchdog implemented in Intel 6300ESB
High Resolution Timer
High-Precision Event Timer (HPET) allows 'Real Time Functions'
implemented in 6300ESB chipset, legacy PC-AT timer.
Realtime clock
RTC 146818 compatible, Li battery (not with conduction cooled style 8)
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 22
Audio codec
Line In, CD In, SPDIF out, headphone
AC97 link with codec
VGA and DVI
ATI Mobile X300 controller, 1280 x 1024, rear DVI-I up to 1280 x 1024, 32
MB RAM
256 bit 3D & 2D graphics accelerator, on-chip up to 32 MB frame buffer
PCIe x4 interface
Single channel DVI-I PanelLink for TFTs up to 1280 x 1024
Front I/O not with conduction cooled style 8
Gigabit Ethernet (GigE)
Two 10/100/1000BaseT Ethernet channels (with x4 PCIe interface) either front
(not with conduction cooled style 8) or rear, compliant to ANSI/VITA 31.12003
Fast Ethernet
One front channel (not with conduction cooled style 8), 10/100BaseT
SATA
Two SATA, RAID 0/1 capable
EIDE/ATAPI
UDMA 100 EIDE/ATAPI interface with two IDE channels
secondary IDE (ATA 33) onboard and primary IDE rear
transfer rate up to 100 MB/s or 16 MB/s in PIO mode 4 and bus master IDE
for two external devices and one onboard 2.5” hard/flash disk.
Important note:
The primary IDE signals are shared with some PMC2IO signals.
The primary IDE is only available in the configuration with partial PMC-IO or
without PMC2. In the configuration with partial PMC-IO PMC2IO31 to
PMC2IO60, PMC2IO63 and PMC2IO64 are not available.
Make sure, that the PMC-IO pins on the PMC-module don’t conflict with the
IDE-signals!
Floppy
Via USB
Serial I/O
Two asynchronous 16550 compatible full duplex channels with 16 byte FIFO at
rear I/O, transfer rates up to 115.2 KBaud, user selectable RS232/422/485 in
BIOS setup.
COM1 (only RS232) optionally available at front (not with conduction cooling
style 8)
Important note:
On the front panel there is an RJ45 type connector for COM1 signals. This
limits the front panel connector to RS232 operation (without Ring Indicator).
RS422/485 can only be used with rear panel connectors
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 23
GPIO
8 GPIO in or out (pins shared with DVI-I; GPIO and DVI-I exclude each
other), software configurable
PMC slots
PMC1 with 64 bit/133 MHz PCI-X (3.3 V IO voltage signaling only) and
PMC2 with 32 bit/33 MHz (5 V IO voltage signaling only); PCI mezzanine
connector for standard PMC with front and rear IO. IO signals are available at
the rear connectors.
Compliant to ANSI/VITA 20-2001
PMC2 not available with Front VGA, GigE on front or onboard IDE
Non-Monarch option compliant to ANSI/VITA 32-2003
PMC front I/O not available in style 8
XMC slot
One XMC slot optional in PMC1 location
Important note:
Some PMC2IO signals are shared with the primary IDE signals.
All PMC2IO signals are only available in the configuration with full PMC-IO.
In the partial PMC-IO configuration PMC2IO31 to PMC2IO60, PMC2IO63
and PMC2IO64 are not available.
Make sure that the PMC-IO pins on the PMC module do not conflict with the
IDE signals!
VMEbus
PCI bus to VMEbus controller, up to 60 MByte/s transfer rates
FIFOs for write posting, DMA controller with linked list support
Geographical addressing
VMEbus system controller
Master (including RMW) and Slave (including RETRY*) transfer modes:
BLT, ADOH, RMW, RETRY
A64 / A32 / A24 / A16
D32 / D16 / D8 (SCT, BLT)
D64 (MBLT , 2eVME, 2eSST)
Temperature Sensors
This sensor measures the temperatures of the CPU die and on an onboard
location. The sensors are software readable in 1 °C increments from -55 °C to
+125 °C.
Front panel I/O
2 x GigE, Fast Ethernet, VGA, PMC1 or XMC, PMC2, USB 1-2, Reset, COM1
on RJ45 style connector only for RS232 (without RI),
ST LED for ACPI indication red/amber/green (not with conduction cooled style
8). The other (unnamed) LED location is not used on Vx11 boards
For restrictions or conditions see appropriate chapters in this manual
Rear I/O
Via Transition Module VTM22
DVI-I, VGA, LED, IDE (ATA 100), SATA 1-2,COM1-2, USB 3-4, PMC1 or
XMC, PMC2, Audio, Reset, GPIO [0...7], 2x GigE, ResetO
For restrictions or conditions see appropriate chapters in this manual
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 24
Software
Windows, Linux, VxWorks, Solaris, Integrity (on request)
Mechanical
6U, 1 slot (4 HP), conduction cooled is IEEE 1101.2-1992 compliant (VR11)
6U, 2 slots (8 HP), air cooled (VP11)
Shock and vibration
Stiffener bars and wedge locks depending on style
Designed to meet ANSI/VITA 47 classes EAC1, EAC3, EAC6 and ECC4
Conformal coating
Optional
RoHS
Compliant
MTBF
Calculations are available in accordance with MIL-HDBK-217
Safety
Designed to meet standard UL1950, CE class A, FCC-A
Styles available
Table 1: Styles available
VR11 (RoHS) 1 3 6 8
Front panel yes yes yes
Extended temp. yes yes yes
Parts soldered yes yes
Front stiffener yes
Middle stiffener yes yes
Wedge locks yes
Conformal coating yes yes
Conduction cooling yes
Lithium battery yes yes
Onboard speaker yes yes
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 25
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 26
CHAPTER 2 Unpacking and Inspection
Chapter Scope
This chapter covers the suggested inspection and preparation considerations
and background information necessary prior to using the VR11. Unpacking,
initial inspection, and first-time operation of the VR11 are covered. Following
the procedures given in the chapter is recommended, since they will verify
proper operation after shipping and before the product is integrated into your
system.
Delivery Volume
Please check that the delivered package contains the following items:
Qty. Item Purpose
1 VR11 or VP11 VME Single Board Computer
1 CD-ROM Technical Product Information with driver
software and manuals in Adobe Acrobat (PDF)
format:
The manual files are also available through the World Wide Web from our
Web-Server:
http://www.ge-ip.com
Available Options
The following table lists accessories (options) which are available for the
VR11:
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 27
ESD
Item Purpose
VTM22 Transition module, 4U x 4HE/HP
VGA2DVI DVI to standard VGA converter
YLR015RS RJ45 to 9-pin Sub-D cable
Please contact the GE Intelligent Platforms sales department or your sales
representative for latest information on options and accessories.
Accessories are subject to change without notice.
Electrostatic Discharge Notice
The discharge of static electricity, known as Electro Static Discharge or ESD, is
a major cause of electronic component failure. The VR11 has been packed in a
static-safe bag which protects the board from ESD while the board is in the bag.
Before removing the VR11 or any other electronic product from its static-safe
bag, be prepared to handle it in a static-safe environment.
Warning
You should wear a properly-functioning anti static strap and ensure you are
fully grounded. Any surface upon which you place the unprotected VR11
should be static-safe, usually facilitated by the use of anti-static mats. From the
time the board is removed from the anti-static bag until it is in the card cage
and functioning properly, extreme care should be taken to avoid 'zapping' the
board with ESD. You should be aware that you could 'zap' the board without
you knowing it; a small discharge, imperceptible to the eye and touch, can often
be enough to damage electronic components. Extra caution should be taken in
cold and dry weather when static easily builds up.
Only after ensuring that both you and the surrounding area are protected from
ESD, carefully remove the board or module from the shipping carton by
grasping it by the front panel and the connectors. Place the board, in its
antistatic bag, flat down on a suitable surface. You may then remove the board
from the anti static bag by tearing the ESD warning labels.
This is a Class A product. In a domestic environment, this product may cause
radio interference in which case the user may be required to take adequate
measures.
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 28
Initial Inspection
Unpacking
Notes:
Drain static electricity before you install or remove any parts. Installing or
removing modules without observing this precaution could result in damage to
this and/or other modules in your system.
After unpacking the VR11, you should inspect it for visible damage that could
have occurred during shipping or unpacking. If damage is observed (usually in
the form of bent component leads or loose socketed components), contact GE
Intelligent Platforms for additional instructions. Depending on the severity of
the damage, it may necessary to return the product to the factory for repair.
DO NOT apply power to the board if it has visible damage.
Doing so may cause further, possibly irreparable damage, as well as introduce a
fire or shock hazard.
Please read the manual carefully before unpacking the board or module or
fitting the device into your system. Also adhere to the following:
• Please read this manual carefully before unpacking the module or fitting it
into your system. This will certainly save time and avoid trouble.
• Observe all precautions for electrostatic sensitive modules
• If the product contains batteries, please do not place the board on
conductive surfaces, antistatic plastic, or sponge, which can cause shocks
and lead to battery or board trace damage.
• Please do not exceed the specified operational temperatures. Note that
batteries and storage devices might also have temperature restrictions.
• Keep all original packaging material for future storage or warranty
shipments of the board.
Although the VR11 is carefully packaged to protect it against the rigors of
shipping, it is still possible that shipping damages can occur. Careful inspection
of the shipping carton should reveal some information about how the package
was handled by the shipping service. If evidence of damage or rough handling
is found, you should notify the shipping service and GE Intelligent Platforms as
soon as possible.
Retain all packing material in case of future need.
Note
Before installing or removing any board, please ensure that the system power
and external supplies have been turned off.
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 29
Handling
Figure 3: Board packaging
Proper handling of the board or module is critical to ensure proper operation
and long-term reliability. When unpacking the board, and whenever handling it
thereafter, be sure to hold the board by the front panel as shown. Do not hold
the board by the circuit card edges, the heat sink, or the connectors.
GE Intelligent Platforms – VR11, VP11 Hardware Reference Manual, Second Edition Page 30
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