FUJITSU MBF200 Service Manual

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MBF200

Solid State Fingerprint Sensor

Overview

The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct
contact, fingerprint acquisition device. It is a high performance,
low power, low cost, capacitive sensor composed of a two­dimensional array of metal electrodes in the sensing array.
Each metal electrode acts as one plate of a capacitor and the
contacting finger acts as the second plate. A passivation layer on the
device surface forms the dielectric between these two plates. Ridges
and valleys on the finger yield varying capacitor values across the
array, and the resulting varying discharge voltages are read to form
an image of the fingerprint.

The MBF200 is manufactured in standard CMOS technology.
The 256 X 300 sensor array has a 50 µm pitch and yields a 500-dpi
image. The sensor surface is protected by a patented, ultra-hard,
abrasion and chemical resistant coating.

Features

• Capacitive solid-state device

Packages

Applications

• Secure access for databases, networks, local storage

• 500-dpi resolution (50 µm pitch)

• 1.28 cm x 1.50 cm (0.5” x 0.6”) sensor area

• 256 x 300 sensor array

• Smart Cards

• 3.3V to 5V operating range

• Exceptionally hard protective coating

• Integrated 8-bit analog to digital converter

• One of three bus interfaces:
8-bit microprocessor bus interface
Integrated USB Full-Speed Interface
Integrated Serial Peripheral Interface

• Standard CMOS technology

• Low power, less than 70 mW operating at 5V

• Automatic finger detection

• Portable fingerprint acquisition

• Smart Cards

• Identity verification for ATM transactions

• Cellular phone-based security access

• Access control and monitoring (home, auto, office, etc.)

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MBF200

Table of Contents

Chip Operation .....................................................................................................................................................................1

Block Diagram......................................................................................................................................................................1

Connection Diagram..............................................................................................................................................................2

Pin List................................................................................................................................................................................3

Pin Descriptions....................................................................................................................................................................4

Device Bus Operation.............................................................................................................................................................7

Microprocessor Bus Interface............................................................................................................................................7

Serial Peripheral Bus Interface (SPI) Slave ................................................................................................................................8

SPI Bus Mode.................................................................................................................................................................8

SPI Slave Mode...............................................................................................................................................................8

Register Read Command in SPI Slave Mode ........................................................................................................................8

Register Write Command for SPI Slave Mode......................................................................................................................8

USB Interface Mode, Using Internal ROM ................................................................................................................................8

Endpoint 0 ....................................................................................................................................................................8

Endpoint 1 ....................................................................................................................................................................8

Endpoint 2 ....................................................................................................................................................................8

USB Interface Mode, Using External ROM ...............................................................................................................................8

SPI Master Mode ............................................................................................................................................................9

Function Register Descriptions ...............................................................................................................................................9

Function Register Map...........................................................................................................................................................9

RAH 0x00 .....................................................................................................................................................................9

RAL 0x01....................................................................................................................................................................10

CAL 0x02....................................................................................................................................................................10

REH 0x03....................................................................................................................................................................10

REL 0x04....................................................................................................................................................................10

CEL 0x05 ....................................................................................................................................................................10

DTR 0x06....................................................................................................................................................................11

DCR 0x07....................................................................................................................................................................11

CTRLA 0x08 ...............................................................................................................................................................11

CRTLB 0x09................................................................................................................................................................13

CTRLC 0x0A ...............................................................................................................................................................14

SRA 0x0B....................................................................................................................................................................14

PGC 0x0C ...................................................................................................................................................................15

ICR 0x0D ....................................................................................................................................................................15

ISR 0x0E.....................................................................................................................................................................16

THR 0x0F ...................................................................................................................................................................16

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Solid State Fingerprint Sensor

CIDH 0x10 ................................................................................................................................................................. 17

CIDL 0x11.................................................................................................................................................................. 17

TST 0x12.................................................................................................................................................................... 17

Sensor Initialization............................................................................................................................................................ 18

Image Retrieval .................................................................................................................................................................. 18

Microprocessor Interface ............................................................................................................................................... 18

Get Row ............................................................................................................................................................... 18

Get Whole Image ................................................................................................................................................... 19

Get Sub-Image ...................................................................................................................................................... 20

Serial Peripheral Interface ...................................................................................................................................... 21

Get Image............................................................................................................................................................. 21

USB Interface........................................................................................................................................................ 22

Get Image............................................................................................................................................................. 22

Absolute Maximum Ratings ................................................................................................................................................. 23

Operating Range ................................................................................................................................................................ 23

DC Characteristics .............................................................................................................................................................. 23

Power Supply Consumption ................................................................................................................................................. 24

AC Characteristics .............................................................................................................................................................. 25

Microprocessor Bus Mode.............................................................................................................................................. 25

Read Cycle............................................................................................................................................................ 25

Write Cycle........................................................................................................................................................... 25

SPI Slave Mode...................................................................................................................................................... 26

SPI Master............................................................................................................................................................ 26

Timing Diagrams................................................................................................................................................................ 27

Physical Dimensions............................................................................................................................................................ 31

Recommended Land Pattern................................................................................................................................................. 32

Array Orientation............................................................................................................................................................... 33

Appendix A ........................................................................................................................................................................ 34

Recommended Power and Ground Connections ................................................................................................................ 34

Appendix B........................................................................................................................................................................ 35

Recommended MBF200 Sensor Orientation..................................................................................................................... 35

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MBF200

Chip Operation

The sensor array includes 256 columns and 300 rows of sensor plates.
Associated with each column are two sample-and-hold circuits.
A fingerprint image is sensed or captured one row at a time. This
“row capture” occurs in two phases. In the first phase, the sensor
plates of the selected row are pre-charged to the VDD voltage.
During this pre-charge period, an internal signal enables the first
set of sample-and-hold circuits to store the pre-charged plate
voltages of the row.

In the second phase, the row of sensor plates is discharged with a
current source. The rate at which a cell is discharged is proportional

Block Diagram

P0

P1

D[7:0]

DATA

REGISTER

to the “discharge current.” After a period of time (referred to as
the “discharge time”), an internal signal enables the second set
of sample-and-hold circuits to store the final plate voltages.
The difference between the precharged and discharged plate voltages
is a measure of the capacitance of a sensor cell. After the row capture,
the cells within the row are ready to be digitized.

The sensitivity of the chip is adjusted by changing the discharge
current and discharge time. The nominal value of the current source
is controlled by an external resistor connected between the ISET pin
and ground. The current source is controlled from the Discharge
Current Register (DCR). The discharge time is controlled by the
Discharge Time Register (DTR).

A0

RD

WR

WAIT

CS0

CS1

MOSI

MISO

DP

DM

EXTINT

INTR

TEST

INDEX

REGISTER

CONTROL

SPI

USB

FUNCTION

REGISTERS

SAMPLE AND HOLD

A/D CONVERTER

ANALOG

MULTI-

VIBRATOR

256 X 300

SENSOR

ARRAY

AIN

ISET

FSET

MODE1

MODE0

XTAL

OSC

XTAL1

XTAL2

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Solid State Fingerprint Sensor

Connection Diagram

VDDA1

VSSA1

ISET

AIN

FSET

VSSA2

VDDA2

TEST

P0

P1

D7

D6

D5

D4

VSS1

VDD1

D3

D2

D1

D0

A0

RD

WR

VSS2

VDD2

XTAL2

XTAL1

INTR

WAIT

EXTINT

CS1/SCLK

CS0/SCS

MOSI

MISO

MODE1

MODE0

DM

DP

VDD3

VSS3

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

MBF200

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

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Pin List

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MBF200

Pin

Number

1 VDDA1 PWR Analog Power Supply

2 VSSA1 GND Analog Ground

3 ISET O Sets Reference Current

4 AIN I Analog Input

5 FSET O Sets Internal Multi-vibrator Frequency

6 VSSA2 GND Analog Ground

7 VDDA2 PWR Analog Power Supply

8 TEST I Test Mode Enable

9 P0 O 8mA 4mA Output Port 0

10 P1 O 8mA 4mA Output Port 1

11 D7 I/O 8mA 4mA Data Bit 7

12 D6 I/O 8mA 4mA Data Bit 6

13 D5 I/O 8mA 4mA Data Bit 5

14 D4 I/O 8mA Data Bit 4

15 VSS1 GND Digital Ground

16 VDD1 PWR Digital Power Supply

17 D3 I/O 8mA 4mA Data Bit 3

18 D2 I/O 8mA 4mA Data Bit 2

19 D1 I/O 8mA 4mA Data Bit 1

20 D0 I/O 8mA 4mA Data Bit 0

21 A0 I Address Input

22 RD I 8mA 4mA Read Enable, Active Low

23 WR I 8mA 4mA Write Enable, Active Low

24 VSS2 GND Digital Ground

25 VDD2 PWR Digital Power Supply

26 XTAL2 O Internal Oscillator Output

27 XTAL1 I Internal Oscillator Input

28 INTR

29 WAIT O 8mA Wait, Active Low

30 EXTINT I External Interrupt Input

31 CS1/SCLK I/O Chip Select, Active High

32 CS0/SCS I/O Chip Select, Active Low

33 MOSI I/O 8mA 4mA SPI Master Output / Slave Input

34 MISO I/O 8mA 4mA SPI Master Input / Slave Output

35 MODE1 I Mode Select 1

36 MODE0 I Mode Select 0

37 DM I/O USB D-

38 DP I/O USB D+

39 VDD3 PWR Digital Power Supply

40 VSS3 GND Digital Ground

[41:80] N/C No Connect

Name Type IOL (5.0 V) IOH (5.0 V) Description

O 8mA Interrupt Output, Active Low

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Solid State Fingerprint Sensor

Pin Descriptions

VDDA1, VDDA2 (Pins 1 and 7)

Power Supply to the analog section of the sensor. VDDA1 powers the array, row drivers, column receivers, A/D converter, and sample/hold
amplifier. VDDA2 powers the multi-vibrator and bias circuits.

VSSA1, VSSA2 (Pins 2 and 6)

Ground for the analog section of the sensor. VSSA1 is the ground return for the array, row drivers, column receivers, A/D converter, and
sample hold amplifier. VSSA2 is the ground return for the multi-vibrator and bias circuits.

VDD1, VDD2, VDD3 ( Pins 25, 16, and 39)

Power supply to the digital logic and I/O drivers. VDD2 powers the core digital logic, oscillators, phase-locked loops, and digital inputs.
VDD1 and VDD3 supply power to the digital output circuits and USB transceivers.

VSS1, VSS2, VSS3 (Pins 24, 15, and 40)

Ground for the digital logic and I/O drivers.

VSS2 is the ground connection for the core digital logic, oscillators, phase-locked loops, and digital inputs. VSS1 and VSS3 are the ground
connections for the digital outputs and USB transceivers.

ISET (Pin 3)

Connect a 200k ohm resistor between ISET and analog ground VSSA1 to set the internal reference current. The discharge current is a scalar
function of the internal reference current.

AIN (Pin 4)

Alternate analog input to the A/D converter. Set the AINSEL bit in register CTRLA to select AIN as the input to the A/D converter. Pull this
pin to ground, preferably with a resistor.

FSET (Pin 5)

Connect a resistor between FSET and ground to set the internal multi-vibrator and automatic finger detection frequency. Use a 56k ohm
resistor for standard 12 MHz (±20%) multi-vibrator operation and 120KHz (±20%) automatic finger detection sampling rate.

XTAL1 (Pin 27)

Input to the internal oscillator. To use the internal oscillator, connect a crystal circuit to this pin. If an external oscillator is used, connect its
output to this pin.

XTAL2 (Pin 26)

Output from the internal oscillator. To use the internal oscillator, connect a crystal circuit to this pin. If an external oscillator is used, leave this
pin unconnected.

D[7:0] (Pins 11-14, 17-20)

Bi-directional data bus. D[7:0] have weak latches that hold the bus’s state when not being driven. These pins may be left unconnected in SPI or
USB mode.

A0 (Pin 21)

Address input. Drive A0 low to select the address index register. Drive A0 high to select the data buffer. A0 has a weak latch that holds the pin
state when not being driven. This pin may be left unconnected in SPI or USB mode.

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(Pin 22)

RD

Read enable, active low. To read from the chip, drive RD
resistor and may be left unconnected in SPI or USB mode.

(Pin 23)

WR

Write enable, active low. To write to the chip, drive WR
and may be left unconnected in SPI or USB mode.

/ SCS (Pin 32)

CS0

Chip select, active low. The CS0
USB mode if not using an external serial ROM. The function of the CS0

MODE[1:0] = 00b (Microprocessor Bus Interface Mode)

/SCS functions as an active-low chip select input. Drive CS0/SCS low while CS1 is high to select the chip.

CS0

/SCS pin has a weak latch that holds the pin’s state when not being driven. CS0/SCS may be left unconnected in

low while WR is high and the chip is selected. RD has an internal, weak pull-up

low while RD is high and the chip is selected. WR has an internal, weak pull-up resistor

MBF200

/SCS pin depends on the MODE1 and MODE0 pins.

MODE[1:0] = 01b (SPI Slave Mode)

CS0

/SCS functions as an active-low slave chip select input. Connect a pull-up resistor between CS0/SCS and VDD.

MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)

CS0

/SCS has no function.

MODE[1:0] = 11b (USB Interface Mode, Using External ROM)

CS0

/SCS functions as the master chip select output, active low to the slave serial ROM chip select. Connect a pullup resistor between
/SCS and VDD.

CS0

CS1 / SCLK (Pin 31)

Chip select, active high. The CS1/SCLK pin has a weak latch that holds the pin’s state when not being driven. CS1/SCLK may be left
unconnected in USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0 pins.

MODE[1:0] = 00b (Microprocessor Bus Interface Mode)

CS1/SCLK functions as an active-high chip select input. Drive CS1/SCLK high while CS0-/CSC- is low to select the chip.

MODE[1:0] = 01b (SPI Slave Mode)

CS1/SCLK functions as the slave serial clock input.

MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)

CS1/SCLK has no function.

MODE[1:0] = 11b (USB Interface Mode, Using External ROM)

CS1/SCLK functions as the master serial clock output to the slave serial ROM clock input. Connect a pull-up resistor between
CS1/SCLK and VDD.

EXTINT (Pin 30)

External Interrupt input. This pin can be programmed to be edge or level sensitive, active-high or active-low. EXTINT has a weak pull-up and
may be left unconnected in MCU, SPI, or USB mode.

INTR

(Pin 28)

Interrupt output, active low. INTR
be enabled if the sensor is in MCU or SPI mode. In USB mode leave this pin unconnected.

is high impedance when it is not active and is driven low when an enabled interrupt event occurs. INTR can

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Solid State Fingerprint Sensor

AIT (Pin 29)

W

Wait output, active low. W
an A/D conversion is in progress. W

MOSI (Pin 33)

SPI Master Output/Slave input. The MOSI pin has a weak latch that holds the pin’s state when not being driven. MOSI may be left
unconnected in MCU mode or USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0
pins.

MODE[1:0] = 00b (Microprocessor Bus Interface Mode)

MOSI has no function.

MODE[1:0] = 01b (SPI Slave Mode)

MOSI functions as the slave serial input.

AIT is driven low when active and high-impedance when not active. WAIT goes low if the A/D converter is read while

AIT will remain low until the A/D conversion is completed.

MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)

MOSI has no function.

MODE[1:0] = 11b (USB Interface Mode, Using External ROM)

MOSI functions as the master serial data output to the slave serial ROM data input. Unlike standard SPI, MOSI is actively driven high
and low when transmitting data and is high impedance when idle. Connect a pull-up resistor between MOSI and VDD to pull MOSI
high when idle.

MISO (Pin 34)

SPI Master Input/Slave Output. The MISO pin has a weak latch that holds the pin’s state when not being driven. MISO may be left
unconnected in MCU mode or USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0
pins.

MODE[1:0] = 00b (Microprocessor Bus Interface Mode)

MISO has no function.

MODE[1:0] = 01b (SPI Slave Mode)

MISO functions as the slave serial data output. Unlike standard SPI, the MISO connection is actively driven high and low when
transmitting data and is high impedance when idle. Connect a pull-up resistor between MISO and VDD to pull MISO high when idle.

MODE1/MODE0 = 10b (USB Interface Mode, Using Internal ROM)

MISO has no function.

MODE1/MODE0 = 11b (USB Interface Mode, Using External ROM)

MISO functions as the master serial data input from the slave serial ROM data output.

P0 (Pin 9)

Port Output 0. This output is controlled by bit 0 of the CTRLC register.

P1 (Pin 10)

Port Output 1. This output is controlled by bit 1 of the CTRLC register.

DP (Pin 38)

USB D+ data line. In USB mode, connect a 1.5k ohm resistor between DP and VDD3, which must be between 3.3V and 3.6V in this mode.
Use a 43 ohm series resistor. In MCU or SPI mode, either pull-up this pin with a resistor or tie it to ground.

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DM (Pin 37)

USB D- data line. Use 43 ohm series resistor. In MCU or SPI mode, either pull-up this pin with a resistor or tie it to ground.

MODE[1:0] (Pins 35 and 36)

Mode Select pins. MODE[1:0] select one of four operating modes.

MBF200

MODE[1:0]

00b Microprocessor Bus Mode

01b SPI Bus Mode

10b USB Mode, Using Internal ROM

11b USB Mode, Using External ROM

Description

TEST (Pin 8)

Test Mode Enable. It is intended for factory use only. Connect this pin to VSS.

No Connect (Pins 41-80)

Unconnected pins.

Device Bus Operation

Microprocessor Bus Interface

The microprocessor bus interface mode uses the following pins:
D[7:0], A0, RD
the internal multi-vibrator or the XTAL1/XTAL2 oscillator can be
selected to provide the clock to the chip. The SPI and USB interfaces
are disabled.

The fingerprint sensor chip uses an indexed addressing scheme to
access its function registers. The chip has eight data lines (D[7:0]) and
one address line (A0). The address line selects between the index
register and the data register. Drive A0 low to select the index
register. Drive A0 high to access the function register selected by the
index register. The index register retains its value until it is rewritten
or the chip is reset.

, WR, CS0, CS1, EXTINT, INTR, and WAIT. Either

The chip has four control inputs: CS0
low and CS1 high to select the chip. Data is latched on the rising edge
of WR-.

The chip has two status lines: INTR
asserted when an interrupt event occurs. The W
when the A/D converter is read while an A/D conversion is in
progress. The W
conversion is completed. Both the W
impedance when they are not active. As a result, they can be active­low WIRE-ORed in conjunction with other interrupts or wait
signals.

The SPI and USB interfaces are disabled when the microprocessor
bus interface is selected. A truth table for the microprocessor bus
interface is shown below:

, CS1, RD, and WR. Drive CS0

and WAIT. The INTR signal is

AIT signal goes low

AIT signal will be high impedance when the A/D

AIT and INTR outputs are high

Truth Table for the Microprocessor Bus Interface

CS0

H X X X X De-selected High Impedance

X L X X X De-selected High Impedance

L H X H H Standby High Impedance

L H L L H Read Index Register Output

L H L H L Write Index Register Input

L H H L H Read Data Register Output

L H H H L Write Data Register Input

CS1 A0 RD WR Mode Data Lines

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Solid State Fingerprint Sensor

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Serial Peripheral Bus Interface (SPI)
Slave

SPI Bus Mode

SPI (Slave) bus mode uses the following pins: SCLK, SCS
MISO, and EXTINT. Either the internal multivibrator or the
XTAL1/XTAL2 oscillator can be selected to provide the clock to the
chip. The microprocessor bus and USB interface are disabled.

SPI Slave Mode

In SPI Slave Mode, the sensor can operate in either SPI mode (0, 0)
where CPOL = 0 and CPHA = 0 or SPI mode (1, 1) where CPOL = 1
and CPHA = 1. T he SPI Master may clock in commands and clock out
data up to 12 Mbits per second. The SPI Master can write and read the
registers of the sensor even when the internal 12 MHz multivibrator or
XTAL1/XTAL2 oscillator is halted.

• MOSI bits are sampled on the rising edge of SCK

• MISO bits change on the falling edge of SCK

• SCK can be idle in either a high or low state

• The most significant bits are shifted out first

, MOSI,

USB Interface Mode, Using Internal
ROM

This USB mode uses the following pins: DP, DM, EXTINT, XTAL1,
and XTAL2. XTAL1 must be driven from a 12 MHz source or XTAL1
and XTAL2 must be connected to a 12 MHz crystal circuit. The
internal 12 MHz multivibrator, the microprocessor bus, and SPI
interface are disabled. The internal USB descriptor ROM will be
accessed in response to a USB GET_DESCRIPTOR command.

The sensor’s USB interface uses three endpoints:

Endpoint 0

Endpoint 0 is a control endpoint used for device enumeration and
configuration. The sensor function registers are written and read
using control transfers of vendor specific commands to endpoint 0.

Endpoint 1

Endpoint 1 is a bulk-in endpoint specifically for reading the CTRLA
register, which is the output buffer of the A/D converter. Data is
transmitted in 64-byte packets except for the last packet of a
GETROW operation which may be 64-bytes or less, depending on
the row length.

Register Read Command in SPI Slave Mode

The Register Read command includes a command byte and address
byte. The command sequence begins when the SPI master drives SCS
low and sends the Read Command byte (encoded as 0x03) on the
MOSI pin. Following the command byte, the master sends the
address byte, which is the index to the register to be read. After
receiving the least significant bit (LSB) of the address byte, the SPI
slave sensor sends the contents of the selected register on the MISO
pin. Finally, the master drives SCS
of the data byte. When reading the A/D converter, the Master may
keep SCS
row. A new Register Read command must be issued to read the next
row. The SPI Master must drive SCS
command.

low to read consecutive pixels up to the end of the current

high after it has sampled the LSB

high before beginning another

Register Write Command for SPI Slave Mode

The Register Write command includes a command byte and address
byte followed by the data to be written. The command sequence
begins when the SPI Master drives SCS
Command byte (encoded as 0x02) on the MOSI pin. Then the master
sends the address byte, which is the index to the register to be
written. Finally, the master sends the data byte and thereafter drives

high.

SCS

low and sends the Write

Endpoint 2

Endpoint 2 is an interrupt endpoint. In the event of an interrupt,
the contents of the ISR (Interrupt Status Register) are transfered to
endpoint 2.

USB Interface Mode, Using External
ROM

This USB mode the uses following pins: DP, DM, SCLK, SCS
MOSI, MISO, EXTINT, XTAL1, and XTAL2. XTAL1 must be
driven from a 12 MHz source or a 12 MHz crystal circuit must be
connected to XTAL1 and XTAL2. The internal 12 MHz multi­vibrator and the microprocessor bus are disabled.

The SPI interface is enabled as an SPI Master. The external SPI serial
ROM will be accessed in response to a USB GET_DESCRIPTOR
command. The internal USB descriptor ROM is disabled. This mode
allows an external serial ROM to override the internal descriptor ROM.

Note: When the MBF200 is directly connected to USB in either of
the modes above, the VDD and VDDA pins must be powered
between 3.3V and 3.6V so that the MBF200 DP and DM pins do
not drive the USB beyond 3.6V.

,

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MBF200

SPI Master Mode

In SPI Master Mode the sensor operates in SPI mode (1,1) where
CPOL = 1, and CPHA = 1. SCK is limited to 1 MHz.

• MOSI bits change on the falling edge of SCK

• MISO bits are sampled on the rising edge of SCK

• SCK is idle in the high state

• The most significant bits are shifted out first

Function Register Map

Index

0x00 RAH Row Address, High R/W

0x01 RAL Row Address, Low R/W

0x02 CAL Column Address, Low R/W

0x03 REH Row Address End, High R/W

0x04 REL Row Address End, Low R/W

0x05 CEL Column Address End, Low R/W

0x06 DTR Discharge Time Register R/W

0x07 DCR Discharge Current Register R/W

0x08 CTRLA Control Register A R/W

0x09 CTRLB Control Register B R/W

0x0A CTRLC Control Register C R/W

0x0B SRA Status Register A R

0x0C PGC Programmable Gain Control Register R/W

0x0D ICR Interrupt Control Register R/W

0x0E ISR Interrupt Status Register R/W

0x0F THR Threshold Register R/W

0x10 CIDH Chip Identification, High R

0x11 CIDL Chip Identification, Low R

0x12 TST Test Mode Register R/W

Name Description Read/Write Access

Function Register Descriptions

The function registers are accessed by indexed addressing. Write the
index register to select a function register. Read or write the data
register to access the contents of the function register. All registers
can be read and written except as noted in the following
descriptions.

Note: In the following descriptions, “sub-image” means a rectangular region of the sensor array, up to and including the entire array.

RAH 0x00

Row Address Register High.
Reset State: 0x00

This register holds the high order bit of the address of the first row of a sub-image.

Bit Number

[7:1] - Reserved. Write 0 to these bits.

0 RA[8] Most Significant Bit of Row Address Register

Bit Name Function

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