Fujitsu MCE3130AP, MCF3064AP, MCE3064AP User Manual

5 (1)

C156-E142-02EN

MCE3130AP, MCE3064AP,

MCF3064AP

OPTICAL DISK DRIVES

PRODUCT MANUAL

The contents of this manual is subject to change without prior notice.

All Rights Reserved. Copyright ! 2001 FUJITSU LIMITED

Fujitsu MCE3130AP, MCF3064AP, MCE3064AP User Manual

 

 

REVISION RECORD

 

 

 

Edition

Date published

Revised contents

 

 

 

01

February, 2000

 

 

 

 

02

March, 2001

 

 

 

 

 

 

 

Specification No.: C156-E142-**EN

C156-E142-02EN

i

PREFACE

This manual describes the MCE3130AP, MCE3064AP and MCF3064AP 90mm(3.5-inch) optical disk drives.

This manual explains the specifications of the above optical disk drive (ODD) and function of the ATAPI that interfaces to the user's system.

The manual is intended for users who have a basic understanding of optical disk drives and their use in computer systems.

See "Manual Organization" for details on the organization of manuals related to the optical disk drives and the scope of this manual. Use the other manuals shown in "Manual Organization" as well as this manual if necessary.

This manual is organized as follows:

Chapter 1 GENERAL DESCRIPTION

This chapter introduces the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives and describes their standard features, system configuration, and drive configuration.

Chapter 2 SPECIFICATIONS

This chapter describes the specifications of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives, ATAPI function specifications, and optical disk cartridge specifications.

Chapter 3 INSTALLATION REQUIREMENTS

This chapter describes basic installation requirements (environment, mounting, power supply, and connection) for the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives.

Chapter 4 HOST INTERFACE

This chapter describes host interface of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives.

Chapter 5 OPERATION AND CLEANING

This chapter describes the operation and cleaning of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives, outlines optical disk cartridges, and describes how to clean the cartridges.

Chapter 6 DIAGNOSIS AND MAINTENANCE

This chapter describes the self-diagnostic functions and maintenance of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives.

C156-E142-02EN

iii

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation likely to result in serious personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in personal injury if the user does not perform the procedure correctly.

This indicates a hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property, may occur if the user does not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

Before moving the drive, remove the optical disk cartridge to avoid head or disk damage

The main alert messages in the text are also listed in the “Important Alert Items.”

iv

C156-E142-02EN

DISCLAIMER

Failure of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives are defined as a failure requiring adjustment, repair, or replacement. Fujitsu is not responsible for failure due to misuse, operation outside the specified environment conditions, power line trouble, controller problems, cable failure, or other failure not caused by the optical disk drive itself.

C156-E142-02EN

v

Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazardous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property, may occur if the user does not perform the procedure correctly.

 

Task

 

Alert message

Page

 

 

 

 

Operation

 

Low temperature burns

3-1

 

 

The surface temperatures of some ICs on the printed circuit board

 

 

 

unit in the optical disk drive exceed 55°C while operating. Be

 

 

 

careful of low tenperature burns.

 

 

 

 

 

Installation

 

Device damage

3-17

 

 

1)

Shock or vibration applied to the drive that exceeds the values

 

 

 

 

defined in the standard damage the drive. Use care when

 

 

 

 

unpacking.

 

 

 

2)

Do not leave the drive in dirty or contaminated environments.

 

 

 

3)

Since static discharge may destroy the CMOS devices in the

 

 

 

 

drive, pay attention to the following points after unpacking:

 

 

 

 

• Use an antistatic mat and wrist strap when handling the

 

 

 

 

drive.

 

 

 

 

• Hold the mounting frame when handling the drive. Do

 

 

 

 

not touch the PCA except when setting the switches.

 

 

 

4)

When handling the drive, hold both sides of the mounting

 

 

 

 

frame. When touching other than both sides of the mounting

 

 

 

 

frame, avoid putting force.

 

 

 

5)

Do not forcibly push up the end of the header pin of the printed

 

 

 

 

circuit board unit when handling or setting the drive.

 

 

 

 

 

 

vi

C156-E142-02EN

Task

Alert message

Page

 

 

 

Installation

Device Damage

3-18

 

Be sure to turn on the power supply before inserting your cartridge

 

 

for the first time. It releases the device from transport protection

 

 

and enables you to insert the cartridge.

 

 

The device may be damaged if you insert the cartridge without

 

 

releasing the protection. From the next time, you don’t need to

 

 

turn on the power supply beforehand.

 

 

Before moving the drive, remove the optical disk cartridge. If the

 

 

drive is moved with the optical disk cartridge loaded in it, the head

 

 

may move back and forth in the drive to damage the head or disk

 

 

and reading the data may fail.

 

 

1) Make sure that the system power is off.

3-20

 

2) Do not connect or disconnect any cable when the power is on.

 

 

Device Damage

3-22

 

Before demounting the optical disk drive, turn off the system power.

 

 

Do not remove screws securing the cables and drive when the

 

 

power is on.

 

 

 

 

Cleaning cartridge

Device Damage

5-6

 

Be sure to use the dedicated head cleaner described above.

 

 

Damage for disk medium

5-10

 

Use the cleaning solution and cleaning cloth specified in Table 5.2.

 

 

If other than the specified items is used, disk media surface may be

 

 

damaged.

 

 

Damage for date medium

 

 

Do not use this cleaning kit for the floppy disk or the optical disk

 

 

cartridge used for other optical disk drive.

 

 

Damage for disk medium

5-11

 

 

 

Clean the cartridge at clean place. Put a disposable groves at

 

 

cleaning so that the fingerprint does not put on the disk media

 

 

(recommendation).

 

 

Damage for disk medium

5-12

 

At setting the cartridge to the setting case, do not apply the heavy

 

 

 

shock and push hardly.

 

 

Eye inflammation

 

 

In case of contact with eyes, immediately flush eyes with water.

 

 

 

 

Maintenance and Repair

Data loss

6-3

 

In case of regular repair, the optical disk cartridge should not be

 

 

attached except where the cartridge causes the error. And before

 

 

having the drive repaired, save the data in the cartridge. Fujitsu is

 

 

not responsible for data last during maintenance or repair.

 

 

 

 

C156-E142-02EN

vii

MANUAL ORGANIZATION

MCE3130AP,

MCE3064AP and MCF3064AP OPTICAL DISK DRIVE PRODUCT MANUAL

(C156-E142) <This manual>

MCE3130AP,

MCE3064AP and MCF3064AP OPTICAL DISK DRIVE MAINTENANCE MANUAL

GENERAL DESCRIPTION

SPECIFICATIONS

INSTALLATION REQUIREMENTS

HOST INTERFACE

OPERATION AND CLEANING

DIAGNOSIS AND MAINTENANCE

MAINTENANCE AND DIAGNOSIS

FAULT ANALYSIS

REMOVAL AND REPLACEMENT PROCEDURES

PRINCIPLES OF OPERATION

CLEANING

viii

C156-E142-02EN

REFERENCED STANDARDS

 

Item

 

Number

Name

Organization

 

 

 

 

 

 

 

1

 

X3T13/1321D

AT Attachment with Packet Interface-5

American National

 

 

 

Revision 2

(ATA/ATAPI-5)

Standards Institute

 

 

 

 

 

(ANSI)

 

 

 

 

 

 

 

2

 

SFF-8070I

ATAPI Removable Rewritable Media

Small Form Factor

 

 

 

Revision 1.2

 

Committee (SFF)

 

 

 

 

 

 

 

3

 

ISO/IEC 10090

90 mm optical disk cartridges, rewritable

ISO/IEC

 

 

 

 

and read only, for data interchange

 

 

 

 

 

 

 

 

4

 

ISO/IEC 13963

Data interchange on 90 mm optical disk

ISO/IEC

 

 

 

 

cartridges,

 

 

 

 

 

– Capacity: 230 megabytes per cartridge

 

 

 

 

 

 

 

 

5

 

ISO/IEC 15041

Data interchange on 90 mm optical disk

ISO/IEC JTC1*

 

 

 

 

cartridges,

 

 

 

 

 

– Capacity: 640 megabytes per cartridge

 

 

 

 

 

 

 

 

6

 

Cherry Book

GIGAMO 1.3 GB 90 mm Magneto-

FUJITSU LIMITED

 

 

 

Version 1.0

Optical Disk System

SONY

 

 

 

 

 

CORPORATION

 

 

 

 

 

*Note: ISO = International Organization for Standardization

 

 

IEC = International Electrical Commission

 

 

JTC1 =

Joint Technical Committee 1

 

C156-E142-02EN

ix

CONTENTS

 

 

 

page

CHAPTER 1

GENERAL DESCRIPTION ................................................................................

1 - 1

1.1

Features.................................................................................................................................

 

1

- 1

1.1.1

Performance ..........................................................................................................................

1

- 2

1.1.2

Reliability..............................................................................................................................

1

- 3

1.1.3

Maintainability/operability....................................................................................................

1

- 3

1.1.4

Adaptability...........................................................................................................................

1

- 3

1.1.5

Interface

................................................................................................................................

1

- 4

1.2

Drive Configuration ..............................................................................................................

1

- 6

1.2.1

Drive model ..........................................................................................................................

1

- 6

1.2.2

Configuration ........................................................................................................................

1

- 7

1.2.3

Mechanical sections ..............................................................................................................

1

- 7

1.2.4

Control circuit section...........................................................................................................

1

- 8

1.3

System Configuration............................................................................................................

1

- 10

CHAPTER 2

SPECIFICATIONS ..............................................................................................

2 - 1

2.1

Optical Disk Drive Specifications.........................................................................................

2

- 1

2.1.1

Model and product number ...................................................................................................

2

- 1

2.1.2

Drive specifications...............................................................................................................

2

- 3

2.1.3

Environmental and power requirements................................................................................

2

- 7

2.1.4

Error rate...............................................................................................................................

2

- 8

2.1.5

Reliability..............................................................................................................................

2

- 9

2.2

Optical Disk Cartridge Specifications...................................................................................

2

- 10

2.2.1

Recommended optical disk cartridge specifications..............................................................

2 - 10

2.2.2

Optical disk cartridge ............................................................................................................

2

- 11

2.2.3

Disk specifications ................................................................................................................

2

- 13

2.3

Defect Management ..............................................................................................................

2

- 14

2.3.1

Defect management schematic diagram ................................................................................

2 - 14

CHAPTER 3

INSTALLATION REQUIREMENTS ................................................................

3

- 1

3.1

Environmental Requirements ................................................................................................

3

- 1

3.1.1

Temperature measurement point ...........................................................................................

3

- 1

3.1.2

Temperature requirements and measuring method................................................................

3 - 3

C156-E142-02EN

xi

3.1.3

Air flow

.................................................................................................................................

3

- 3

3.1.4

Temperature ............................................................................rise under several conditions

3

- 4

3.1.5

Air purity...............................................................................................................................

3

- 4

3.2

Mounting ........................................................................................................Requirements

3

- 5

3.2.1

External ..............................................................................................................dimensions

3

- 5

3.2.2

Installation .............................................................................................................direction

3

- 7

3.2.3

Centers of ..................................................................................................................gravity

3

- 8

3.2.4

Notes on ................................................................................................................mounting

3

- 9

3.3

Power Supply .................................................................................................Requirements

3

- 11

3.4

Cable Connections ................................................................................................................

3

- 12

3.4.1

Drive connectors ...................................................................................................................

3

- 12

3.4.2

Cable connector ..............................................................................................specifications

3

- 13

3.4.3

Drive connection...................................................................................................................

3

- 13

3.5

Jumper Settings .....................................................................................................................

3

- 14

3.5.1

Jumper settings .......................................................................................at factory shipping

3

- 14

3.5.2

Mode setting..........................................................................................................................

3

- 14

3.6

Notes on ......................................................................................................Drive Handling

3

- 17

3.7

Mounting...............................................................................................................................

3

- 20

3.7.1

Checks before .........................................................................................mounting the drive

3

- 20

3.7.2

Mounting ..............................................................................................................procedure

3

- 20

3.8

Cable Connections ................................................................................................................

3

- 20

3.9

Operation ......................................Confirmation and Preparation for Use after Installation

3 - 21

3.9.1

Confirming ................................................................................................initial operations

3

- 21

3.9.2

Connection ..................................................................................................................check

3

- 22

3.10

Dismounting ................................................................................................................Drive

3

- 22

CHAPTER 4 .............................................................................................

HOST INTERFACE

4

- 1

4.1

Pin Assignment .....................................................................................................................

4

- 2

4.2

Signal Description.................................................................................................................

4

- 4

4.3

Interface .................................................................................................................Registers

4

- 5

4.3.1

I/O registers...........................................................................................................................

4

- 5

4.3.1.1

Alternate ........................................................................................................Status register

4

- 6

4.3.1.2

ATA Command ........................................................................................................register

4

- 6

4.3.1.3

Data register ..........................................................................................................................

4

- 6

4.3.1.4

Device Control .........................................................................................................register

4

- 6

4.3.1.5

Drive Address ...........................................................................................................register

4

- 7

xii

C156-E142-02EN

4.3.1.6

ATAPI Byte Count register...................................................................................................

4

- 7

4.3.1.7

ATAPI Block Device Select register ....................................................................................

4

- 8

4.3.1.8

Error register .........................................................................................................................

4

- 8

4.3.1.9

ATA Features register ...........................................................................................................

4

- 9

4.3.1.10

ATAPI Features register .......................................................................................................

4

- 9

4.3.1.11

ATA Sector Count register....................................................................................................

4

- 9

4.3.1.12

ATAPI Interrupt Reason register ..........................................................................................

4

- 9

4.3.1.13

Sector Number register .........................................................................................................

4

- 10

4.3.1.14

ATAPI Status register ...........................................................................................................

4

- 10

4.4

Various Processes .................................................................................................................

4

- 12

4.4.1

Reset response.......................................................................................................................

4

- 12

4.4.2

Defect sector management ....................................................................................................

4

- 13

4.4.3

Automatic alternate sector assignment function....................................................................

4

- 13

4.4.4

Data error detection criteria ..................................................................................................

4

- 14

4.4.5

Cache function ......................................................................................................................

4

- 15

4.4.5.1

Data buffer ............................................................................................................................

4

- 15

4.4.5.2

Read cache ............................................................................................................................

4

- 15

4.4.5.3

MO write cache....................................................................................................................

4

- 16

4.4.6

Media status notification function.........................................................................................

4

- 17

4.4.7

Power management function .................................................................................................

4

- 17

4.4.7.1

Power mode ..........................................................................................................................

4

- 18

4.4.7.2

Active mode ..........................................................................................................................

4

- 18

4.4.7.3

Pre-idle mode ........................................................................................................................

4

- 18

4.4.7.4

Idle mode ..............................................................................................................................

4

- 18

4.4.7.5

Standby mode........................................................................................................................

4

- 18

4.4.7.6

Sleep mode............................................................................................................................

4

- 19

4.4.7.7

Standby timer ........................................................................................................................

4

- 19

4.4.7.8

Power mode transition...........................................................................................................

4

- 19

4.4.8

LED Indications ....................................................................................................................

4

- 20

4.5

ATA Commands ...................................................................................................................

4

- 21

4.5.1

IDENTIFY PACKET DEVICE (X'A1') ...............................................................................

4

- 22

4.5.2

PACKET (X'A0') ..................................................................................................................

4

- 27

4.5.3

DEVICE RESET (X'80').......................................................................................................

4

- 28

4.5.4

CHECK POWER MODE (X'98'/X'E5')................................................................................

4

- 28

4.5.5

EXECUTE DEVICE DIAGNOSTIC (X'90')........................................................................

4 - 29

4.5.6

GET MEDIA STATUS (X'DA') ...........................................................................................

4

- 30

C156-E142-02EN

xiii

4.5.7

IDLE IMMEDIATE (X'95'/X'E1') ........................................................................................

4 - 31

4.5.8

NOP (X'00')...........................................................................................................................

4 - 32

4.5.9

SERVICE (X'A2') (Not supported).......................................................................................

4 - 32

4.5.10

SET FEATURES (X'EF')......................................................................................................

4 - 33

4.5.11

SLEEP (X'99'/X'E6') .............................................................................................................

4 - 35

4.5.12

STANDBY IMMEDIATE (X'94'/X'E0') ..............................................................................

4 - 36

4.6

Packet Commands.................................................................................................................

4 - 37

4.6.1

Logical Unit Number ............................................................................................................

4 - 38

4.6.2

ERASE command .................................................................................................................

4 - 38

4.6.3

FORMAT UNIT command...................................................................................................

4 - 39

4.6.4

INQUIRY command .............................................................................................................

4 - 40

4.6.5

MODE SELECT command...................................................................................................

4 - 42

4.6.5.1

Drive operation mode page ...................................................................................................

4 - 44

4.6.5.2

Read-Write error recovery page............................................................................................

4 - 45

4.6.5.3

Flexible disk page .................................................................................................................

4 - 47

4.6.5.4

Caching page.........................................................................................................................

4 - 49

4.6.5.5

Removable block access capabilities page............................................................................

4 - 50

4.6.5.6

Timer & protect page ............................................................................................................

4 - 51

4.6.6

MODE SENSE command .....................................................................................................

4 - 53

4.6.7

PREVENT/ALLOW MEDIUM REMOVAL command.......................................................

4 - 55

4.6.8

READ (10) command ...........................................................................................................

4 - 56

4.6.9

READ (12) command ...........................................................................................................

4 - 56

4.6.10

READ CAPACITY command ..............................................................................................

4 - 57

4.6.11

READ FORMAT CAPACITIES command..........................................................................

4 - 58

4.6.12

READ DEFECT DATA command .......................................................................................

4 - 59

4.6.13

READ LONG command .......................................................................................................

4 - 61

4.6.14

RECEIVE DIAGNOSTIC RESULTS command..................................................................

4 - 61

4.6.15

REQUEST SENSE command...............................................................................................

4 - 62

4.6.16

SEND DIAGNOSTIC command ..........................................................................................

4 - 66

4.6.17

SEEK command....................................................................................................................

4 - 67

4.6.18

START/STOP UNIT command............................................................................................

4 - 67

4.6.19

SYNCHRONIZE CACHE command....................................................................................

4 - 68

4.6.20

TEST UNIT READY command ...........................................................................................

4 - 69

4.6.21

VERIFY command................................................................................................................

4 - 69

4.6.22

WRITE (10) command..........................................................................................................

4 - 70

4.6.23

WRITE (12) command..........................................................................................................

4 - 70

xiv

C156-E142-02EN

4.6.24

WRITE AND VERIFY command ........................................................................................

4

- 71

4.6.25

WRITE BUFFER command .................................................................................................

4

- 72

4.6.26

WRITE LONG command .....................................................................................................

4

- 74

4.7

Timing...................................................................................................................................

4

- 75

4.7.1

Register/PIO data transfer timing..........................................................................................

4

- 75

4.7.2

Multiword DMA data transfer timing ...................................................................................

4

- 77

4.7.3

Power-on and Reset Timing..................................................................................................

4

- 79

CHAPTER 5 OPERATION AND CLEANING ........................................................................

5

- 1

5.1

Operating Optical Disk Drive ...............................................................................................

5

- 1

5.1.1

Optical disk drive..................................................................................................................

5

- 1

5.1.2

Note.......................................................................................................................................

5

- 2

5.1.3

Inserting cartridge .................................................................................................................

5

- 2

5.1.4

Ejecting (removing) cartridge ...............................................................................................

5

- 4

5.2

Cleaning Drive ......................................................................................................................

5

- 6

5.3

Optical Disk Cartridge Operation .........................................................................................

5

- 7

5.3.1

Optical disk cartridge ............................................................................................................

5

- 7

5.3.2

Write protect tab ...................................................................................................................

5

- 8

5.3.3

Notes .....................................................................................................................................

5

- 9

5.4

Cleaning Optical Disk Cartridge ...........................................................................................

5

- 9

5.4.1

Cleaning tool.........................................................................................................................

5

- 9

5.4.2

Cleaning procedure ...............................................................................................................

5

- 10

CHAPTER 6 DIAGNOSIS AND MAINTENANCE.................................................................

6

- 1

6.1

Diagnosis...............................................................................................................................

6

- 1

6.1.1

Initial self-diagnosis ..............................................................................................................

6

- 2

6.1.2

Diagnostic command.............................................................................................................

6

- 2

6.1.3

Test program .........................................................................................................................

6

- 2

6.2

Maintenance Information ......................................................................................................

6

- 3

6.2.1

Maintenance requirements ....................................................................................................

6

- 3

6.2.2

Revision number ...................................................................................................................

6

- 4

GLOSSARY.......................................................................................................................................

GL - 1

ABBREVIATIONS ...........................................................................................................................

AB - 1

C156-E142-02EN

xv

FIGURES

 

 

page

1.1

Outer view (with panel).........................................................................................................

1

- 6

1.2

Outer view (without panel)....................................................................................................

1

- 6

1.3

Optical disk drive configuration............................................................................................

1

- 7

1.4

Control circuit section block diagram ...................................................................................

1

- 8

1.5

System configuration with one optical disk drive .................................................................

1

- 10

1.6

System configuration with two optical disk drives................................................................

1

- 10

2.1

Optical disk cartridge ............................................................................................................

2

- 11

2.2

Algorithms for alternate processing ......................................................................................

2

- 14

2.3

Example of alternate processing............................................................................................

2

- 15

3.1

Surface temperature measurement points..............................................................................

3

- 2

3.2

Dimensions............................................................................................................................

3

- 5

3.3

Dimensions (without panel) ..................................................................................................

3

- 6

3.4

Installation directions............................................................................................................

3

- 7

3.5

Centers of gravity..................................................................................................................

3

- 8

3.6

Mounting frame structure......................................................................................................

3

- 9

3.7

Service clearance...................................................................................................................

3

- 10

3.8

Current waveform (+5 VDC) ................................................................................................

3

- 11

3.9

Connector and terminal locations..........................................................................................

3

- 12

3.10

Cable connection diagram.....................................................................................................

3

- 13

3.11

Jumper settings at factory shipping .......................................................................................

3

- 14

3.12

Master device setting.............................................................................................................

3

- 14

3.13

Slave device setting...............................................................................................................

3

- 15

3.14

Cable select mode setting......................................................................................................

3

- 15

3.15

Cable select examples ...........................................................................................................

3

- 16

3.16

Individual packaging style.....................................................................................................

3

- 19

3.17

Gathered packaging style ......................................................................................................

3

- 19

4.1

Power mode ..........................................................................................................................

4

- 19

4.2

Register/PIO data transfer .....................................................................................................

4

- 75

4.3

Multiword DMA data transfer...............................................................................................

4

- 77

4.4

Power-on and reset timing.....................................................................................................

4

- 79

5.1

Optical disk drive front view (with panel).............................................................................

5

- 1

5.2

Inserting cartridge .................................................................................................................

5

- 4

xvi

C156-E142-02EN

5.3

Removing cartridge...............................................................................................................

5

- 5

5.4

Optial disk cartridge..............................................................................................................

5

- 7

5.5

Write protect tab ...................................................................................................................

5

- 8

5.6

Cleaning procedure (1)..........................................................................................................

5

- 11

5.7

Cleaning procedure (2)..........................................................................................................

5

- 11

5.8

Cleaning procedure (3)..........................................................................................................

5

- 12

5.9

Cleaning procedure (4)..........................................................................................................

5

- 13

6.1

Revision label........................................................................................................................

6

- 4

6.2

Revision number indication...................................................................................................

6

- 4

C156-E142-02EN

xvii

TABLES

 

 

page

2.1

Model and order number.......................................................................................................

2

- 1

2.2

Specifications........................................................................................................................

2

- 3

2.3

Environmental and power requirements................................................................................

2

- 7

2.4

Recommended optical disk cartridge specifications..............................................................

2

- 10

2.5

Disk specifications ................................................................................................................

2

- 13

3.1

Temperature requirements at measurement points ................................................................

3

- 3

3.2

Temperature at each measuring point (Reference)................................................................

3

- 4

3.3

Cable connector specifications..............................................................................................

3

- 13

4.1

Differences in Host Interface Specifications of Each Model. ...............................................

4

- 1

4.2

Connector pin assignments....................................................................................................

4

- 2

4.3

Signal description..................................................................................................................

4

- 4

4.4

I/O port functions and mapping.............................................................................................

4

- 5

4.5

Bit definitions of Alternate Status register ............................................................................

4

- 6

4.6

Bit definitions of Device Control register .............................................................................

4

- 6

4.7

Bit definitions of Drive Address register...............................................................................

4

- 7

4.8

Bit definitions of ATAPI Byte Count register.......................................................................

4

- 7

4.9

Bit definitions of ATAPI Block Device Select register ........................................................

4

- 8

4.10

Bit definitions of Error register .............................................................................................

4

- 8

4.11

Bit definitions of ATAPI Features register ...........................................................................

4

- 9

4.12

Bit definitions of ATAPI Interrupt Reason register ..............................................................

4

- 9

4.13

IO and Cod............................................................................................................................

4

- 10

4.14

Bit definitions of ATAPI Status register ...............................................................................

4

- 10

4.15

Alternate sector assignment criteria ......................................................................................

4

- 13

4.16

ID error and read error detection criteria and error handling ................................................

4

- 14

4.17

LED indications ....................................................................................................................

4

- 20

4.18

Command codes and parameters...........................................................................................

4

- 21

4.19

IDENTIFY PACKET DEVICE command............................................................................

4

- 22

4.20

Device parameter information (1/5) ......................................................................................

4

- 23

4.21

PACKET command ..............................................................................................................

4

- 27

4.22

DEVICE RESET command ..................................................................................................

4

- 28

4.23

CHECK POWER MODE command.....................................................................................

4

- 28

4.24

Power mode indication..........................................................................................................

4

- 29

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C156-E142-02EN

4.25

EXECUTE DEVICE DIAGNOSTIC command ...................................................................

4 - 29

4.26

Self-diagnosis detailed code..................................................................................................

4 - 30

4.27

GET MEDIA STATUS command ........................................................................................

4 - 30

4.28

Error register .........................................................................................................................

4 - 31

4.29

IDLE IMMEDIATE command .............................................................................................

4 - 31

4.30

NOP command......................................................................................................................

4 - 32

4.31

SERVICE command .............................................................................................................

4 - 32

4.32

SET FEATURES command..................................................................................................

4 - 33

4.33

FR register setting value........................................................................................................

4 - 33

4.34

Transfer setting values in the SC register..............................................................................

4 - 34

4.35

Cylinder High register...........................................................................................................

4 - 35

4.36

SLEEP command ..................................................................................................................

4 - 35

4.37

STANDBY IMMEDIATE command ...................................................................................

4 - 36

4.38

Packet command codes and parameters ................................................................................

4 - 37

4.39

ERASE command .................................................................................................................

4 - 38

4.40

FORMAT UNIT command...................................................................................................

4 - 39

4.41

FORMAT UNIT parameter list.............................................................................................

4 - 39

4.42

Defect list header ..................................................................................................................

4 - 39

4.43

Format descriptor ..................................................................................................................

4 - 40

4.44

INQUIRY command .............................................................................................................

4 - 40

4.45

INQUIRY data ......................................................................................................................

4 - 41

4.46

MODE SELECT command...................................................................................................

4 - 42

4.47

Mode parameters...................................................................................................................

4 - 42

4.48

Mode parameter list ..............................................................................................................

4 - 43

4.49

Mode parameter header.........................................................................................................

4 - 43

4.50

Page descriptor......................................................................................................................

4 - 43

4.51

Drive operation mode page ...................................................................................................

4 - 44

4.52

Changeable values in drive operation mode page .................................................................

4 - 44

4.53

Default values for the drive operation mode page.................................................................

4 - 44

4.54

Read-Write error recovery page............................................................................................

4 - 45

4.55

Changeable values in the read-write recovery page ..............................................................

4 - 46

4.56

Default values for the read-write recovery page....................................................................

4 - 46

4.57

Flexible disk page .................................................................................................................

4 - 47

4.58

Changeable values in flexible disk page................................................................................

4 - 48

4.59

Default values in flexible disk page ......................................................................................

4 - 48

4.60

Caching page.........................................................................................................................

4 - 49

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xix

4.61

Changeable values in the caching page .................................................................................

4 - 49

4.62

Default values for the cashing page.......................................................................................

4 - 49

4.63

Removable block access capabilities page............................................................................

4 - 50

4.64

Changeable values in the removable block access capabilities page.....................................

4 - 50

4.65

Default values for the removable block access capabilities page..........................................

4 - 50

4.66

Timer & protect page ............................................................................................................

4 - 51

4.67

Inactivity Time Multiplier value ...........................................................................................

4 - 51

4.68

Changeable values for the timer & protect page ...................................................................

4 - 52

4.69

Default values for the timer & protect page ..........................................................................

4 - 52

4.70

MODE SENSE command .....................................................................................................

4 - 53

4.71

Page Control field .................................................................................................................

4 - 53

4.72

Mode parameter list ..............................................................................................................

4 - 53

4.73

Mode parameter header.........................................................................................................

4 - 54

4.74

Page descriptor......................................................................................................................

4 - 54

4.75

PREVENT/ALLOW MEDIUM REMOVAL command.......................................................

4 - 55

4.76

Response to Prevent/Allow/Eject..........................................................................................

4 - 55

4.77

READ command ...................................................................................................................

4 - 56

4.78

READ command ...................................................................................................................

4 - 56

4.79

READ CAPACITY command ..............................................................................................

4 - 57

4.80

READ CAPACITY data (PMI = 0) ......................................................................................

4 - 57

4.81

READ CAPACITY data (PMI = 1, MO media, FROM media) ...........................................

4 - 57

4.82

READ CAPACITY data (PMI = 1, PROM media) ..............................................................

4 - 58

4.83

READ FORMAT CAPACITIES command..........................................................................

4 - 58

4.84

READ FORMAT CAPACITIES data format .......................................................................

4 - 58

4.85

Capacity list header...............................................................................................................

4 - 58

4.86

Current/Maximum capacity descriptor..................................................................................

4 - 59

4.87

Descriptor code definition.....................................................................................................

4 - 59

4.88

READ DEFECT DATA command .......................................................................................

4 - 59

4.89

Defect list formats.................................................................................................................

4 - 60

4.90

Defect descriptor...................................................................................................................

4 - 60

4.91

Defect list header ..................................................................................................................

4 - 60

4.92

READ LONG command .......................................................................................................

4 - 61

4.93

RECEIVE DIAGNOSTIC RESULTS command..................................................................

4 - 61

4.94

REQUEST SENSE command...............................................................................................

4 - 62

4.95

Request sense data ................................................................................................................

4 - 62

4.96

Error code .............................................................................................................................

4 - 63

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C156-E142-02EN

4.97

Sense key...............................................................................................................................

4

- 63

4.98

Logical block address format ................................................................................................

4

- 64

4.99

ASC/ASCQ list (1/2).............................................................................................................

4

- 64

4.100

Format Progress Indication Bytes .........................................................................................

4

- 66

4.101

SEND DIAGNOSTIC command ..........................................................................................

4

- 66

4.102

SEEK command....................................................................................................................

4

- 67

4.103

START/STOP UNIT command............................................................................................

4

- 67

4.104

START/STOP/EJECT processing ........................................................................................

4

- 68

4.105

SYNCHRONIZE CACHE command....................................................................................

4 - 68

4.106

TEST UNIT READY command ...........................................................................................

4

- 69

4.107

VERIFY command................................................................................................................

4

- 69

4.108

WRITE (10) command..........................................................................................................

4

- 70

4.109

WRITE (12) command..........................................................................................................

4

- 70

4.110

WRITE AND VERIFY command ........................................................................................

4 - 71

4.111

WRITE BUFFER command .................................................................................................

4

- 72

4.112

Code-ID ................................................................................................................................

4

- 73

4.113

WRITE LONG command .....................................................................................................

4

- 74

4.114

Register/PIO data transfer timing parameters .......................................................................

4

- 76

4.115

Multiword DMA data transfer timing parameters .................................................................

4

- 78

4.116

Power-on and reset timing.....................................................................................................

4

- 80

5.1

Head cleaner..........................................................................................................................

5

- 6

5.2

Cleaning kit ...........................................................................................................................

5

- 9

5.3

Packaged items (cleaning kit)................................................................................................

5

- 10

6.1

Self-diagnostic function ........................................................................................................

6

- 1

C156-E142-02EN

xxi

CHAPTER 1 GENERAL DESCRIPTION

1.1Features

1.2Drive Configuration

1.3System Configuration

This chapter describes the features and configuration of the optical disk drives.

The MCE3130AP, MCE3064AP, MCF3064AP (hereafter optical disk drives) is disk that maintain the compatibility and intend high speed as the succeed drive of the MCE3130AP, MCE3064AP, MCF3064AP.

The MCE3130AP, MCE3064AP, MCF3064AP is high-performance, 90mm(3.5-inch) commutative rewritable optical disk drive which incorporates an ATAPI controller.

The interface connecting the MCE3130AP, MCE3064AP, MCF3064AP drives to the host system complies with the ATA/ATAPI-4.

The flexibility and expandability through ATAPI I/F, the high performance of the MCE3130AP, MCE3064AP, MCF3064AP optical disk drives, and the drive's commands set enable the user to construct high-reliability, high-performance disk subsystems with advanced functions and large-scale storage.

1.1Features

This section describes the following drive features:

!Performance

!Reliability

!Maintainability/operability

!Adaptability

!Interface

C156-E142-02EN

1 - 1

1.1.1Performance

(1)Half-height standard 90mm(3.5-inch) size (25.4 mm height)

The ATAPI controller can be directly connected to the system EIDE bus. The controller meets the specifications of the standard 25.4 mm height 90mm(3.5-inch) fixed disk drive form factor.

(2)High-speed data transfer

The speed of the MCE3130AP disk medium is 3,214 rpm when a 1.3 GB disk medium is used. When other media are used, the speed is 4,558 revolutions per minute.

The speed of the MCE3064AP disk medium is 3600 revolutions per minute.

In the disk unit, high-speed data transfers at rates of 3.46 to 5.92 MB/s (1.3 GB) are realized. The data transfer rate on the EIDE bus is 16.6 MB/s in PIO mode 4 and 16.6 MB/s in Multi-word DMA Mode 2.

The EIDE bus high-speed data transfer capacity can be used effectively through the optical disk unit’s large capacity data buffer (with read-ahead cache).

(3)High-speed mean seek time

This drive features a linear voice-coil motor for high-speed head positioning. The average seek time is the average of 1,000 random seeks and is 23 ms. (However, this does not include command overhead or address check.)

(4)Compatible with international standards (media interchangeability)

90mm(3.5 inch) type 1.3 GB format optical disks as well as ISO standards compatible 128 MB, 230 MB, 540 MB and 640 MB format optical disk media can be used in the MCE3130AP Optical Disk Unit.

ISO standards compatible 128 MB, 230 MB, 540 MB and 640 MB format optical disks can be used in the MCE3064AP and MCF3064AP optical disk units.

(5)Direct-overwrite medium support

The drive can use an optic modulation direct-overwrite disk that does not read an erase operation; 230-MB disk, 540-MB disk with the ISO standard.

(6)Dust resistance

The optical disk drive needs class 5 millions or less of the dust particles.

(7)Lower power consumption

The power consumption of the MCE3130AP optical disk drive is 5.5 W and that of the MCE3064AP, and MCF3064AF optical disk drives is 5.3 W. (These power consumption values are typical values during read and write operation.) These drives do not use a fan.

The minimum power consumption is 0.65 W during power save.

1 - 2

C156-E142-02EN

(8)Automatic spindle stop function

If access is not made within a certain time, this function stops disk rotation to minimize dust accumulation on the disk. This function can be set that time by the MODE SELECT command.

1.1.2Reliability

(1)Mean time between failure (MTBF)

This drive features a 120,000 hour MTBF.

(2)Error recovery

For the error depending on the optical disk drive, recovery process is made by a suitable retry. This drive features Reed-Solomon error correction (ECC) to assure error-free operation.

(3)Automatic allocation of alternate data blocks

This drive features a function which automatically allocates alternate data blocks to defective data blocks detected while data is being read from or written to an optical disk.

1.1.3Maintainability/operability

(1)Diagnostic function

This drive has a diagnostic function to check optical disk drive operations. The diagnostic function facilitates test and restoration.

(2)Five year service life (no overhaul)

This drive will not require overhaul within the first five years of installation if appropriately handled, maintained, and cleaned as recommended.

(3)Mean time to repair (MTTR)

The MTTR is 30 minutes or less, if repaired by a specialized maintenance staff member.

1.1.4Adaptability

(1)Wide operating environment

An LSI circuits reduce power consumption to 5.3 W (read/write). This drive features a wide operating environment (5 to 45°C, general office environment). Dust particles are class 5 millions or less.

C156-E142-02EN

1 - 3

(2)Low noise and low vibration

This drive operates quietly 26 dB or less (A character) even during seek operations and will not degrade the office environment. Rubber vibration isolators support the drive and minimize vibration. (Low noise and low vibration features are available except while an MO cartridge is being ejected.)

(3)Vibration resistance (shock resistance)

Rubber vibration isolators protect the drive against external shock or vibration.

(4)Safety standards

!UL1950 (U.S.A., safety)

!CDRH class 1 (U.S.A., laser)

!CSA C22.2 No. 950 (Canada, safety)

!EN60950 (Europe, safety)

!EN60825 Class 1 (Europe, laser)

(5)Various radio wave standards

This optical disk device is installed in a host system, and meets the following standards:

!EN55022 class B, EN55024 (European wave standards)

!AS/NZS3548 class B (Australian wave standards)

!CNS13438 (Taiwanese radio interference standard, except MCE3023AP)

1.1.5Interface

(1)ATA/ATAPI-4

This drive supports the basic ATA/ATAPI-4 specifications.

ATAPI commands enable operation using logical block addresses that are independent of the physical attributes of the drive, enabling software flexibility in terms of system expansion.

Supports PIO Mode 4 and Multi-word DMA Mode 2.

(2)Continuous block processing

Logical block addresses are used for data block addressing. Without consideration of the physical attributes of track boundaries, the initiator can access data by specifying a block number in logically continuous data space.

1 - 4

C156-E142-02EN

(3)Data buffer

1,844 KB buffer is used to transfer data between the EIDE bus and disk. Since data is stored in this buffer, the host can execute input-output processing effectively by using the high-speed data transfer capability of the EIDE bus without regard to the data transfer rate of the optical disk drive.

(4)Read-ahead cache feature

The read-ahead cache feature enables high-speed sequential data access as follows:

After executing a command to read data from the disk, the drive automatically reads the next data block and stores it in the data buffer (pre-reading). If the next command requests this data, the data is transferred from the buffer without another disk access.

(5)Write cache feature

When the host system issues the write command to the optical disk drive, a command complete is usually responded after completion of the write and verify operations. By using the write cache feature, a command complete is responded after completion of the data transfer to the data buffer without waiting the completion of the write and verify operations then the write and verify operations are made asynchronously with the interface operation. Therefore, the apparent write command processing time measured at the host system is reduced and the I/O performance of the host system is improved.

The write cache feature is enabled or disabled by MODE SELECT command.

When the write cache feature is enabled, a write error is reported at the completion status of next command. At a system so that the host retries the command, a retry process may be failed.

(6)Defective block slipping

When a disk is initialized, logical data blocks are reallocated in a physical sequence by slipping defective data blocks. This enables high-speed continuous data block processing without rotational delay due to defective data blocks.

(7)Device driver software (1.3 GB optical disk media)

The optical disk drive requires more extended processing time than conventional optical device drives because of higher density. Consequently, a processing time timeout when using the OS can occur and this requires special device driver software.

C156-E142-02EN

1 - 5

1.2Drive Configuration

1.2.1Drive model

Figures 1.1 and 1.2 show the outer view.

Figure 1.1 Outer view (with panel)

Figure 1.2 Outer view (without panel)

1 - 6

C156-E142-02EN

1.2.2Configuration

Figure 1.3 shows the drive configuration.

The drive consists of mechanical sections, a fixed optics section, actuator, and a control circuit section. The mechanical sections include the spindle motor, actuator section, bias magnet, and the cartridge folder vertical motion mechanism.

The fixed optics section consists of the optical components, position detector, and LD controller. The control circuit sections include the drive control circuit section and ATAPI controller section.

Optical disk cartridge

Control circuit section

 

 

 

 

Spindle motor

Actuator section

Fixed optics section

Figure 1.3 Optical disk drive configuration

1.2.3Mechanical sections

(1)Optical disk cartridge load/eject

The system includes a cartridge mechanism which lowers the optical disk cartridge and mounts (loads) it on the spindle motor automatically when the optical disk cartridge is fully inserted in the optical disk drive’s disk slot, and a mechanism which automatically ejects the cartridge when the Eject button on the front panel is pressed.

(2)Spindle motor

Optical disk cartridge hubs are linked through magnetic clamps to minimize slippage between the spindle motor shaft and disk. The spindle motor is the direct drive type which rotates the disk at the same speed as the spindle motor shaft. A DC brushless spindle motor is used. The spindle motor rotates at 4,558 rpm ± 0.1%.

(3)Actuator section

The positioner moves (seeks) a head actuator radically across the disk surface.

The positioner is driven by a linear voice coil motor. A pulse-width modulation (PWM) is adopted as a driving system and realizes low power consumption and high-speed access.

C156-E142-02EN

1 - 7

(4)Separate optical sections

The optical head section is separated in such a way that the fixed optics section is separated from the moving optics section to minimize seek time and positioning error. (See Subsection 1.2.4 for the fixed optical section.) This reduces the weight of the moving parts.

The fixed optics section consists of the laser diodes, collimator lens, and optical detector.

The fixed optics section includes a laser diode for recording and playback, and transmits one laser beam to the head actuator.

(5)Panel

The central part of the panel is hollowed out deeply to provide pushing finger space for inserting the cartridge, thereby facilitating the insertion.

The panel is also simply designed by making the eject button and LED light emitting part integral with each other.

1.2.4Control circuit section

Figure 1.4 is the block diagram of the control circuit section.

 

Main control

 

 

DE

 

MPU

 

 

 

 

 

 

 

Head

 

 

ODC

 

 

 

ATAPI I/F

DSP

 

 

Laser Diode

 

 

User Logic

 

 

Photo Diode

 

 

LSI i/f

 

 

APC Amp

 

 

 

 

 

 

LPC Amp

 

 

 

 

 

 

Head Amp

 

 

 

F-ROM

 

 

 

 

 

 

 

 

 

 

 

 

 

Actuator

 

 

 

D-RAM

 

 

 

 

 

 

 

Focus Act.

 

 

 

 

 

 

Track Act.

 

 

 

 

 

 

Spindle Motor

 

 

Drive

 

 

 

 

 

 

Temperature Sensor

 

 

Read Amp

 

 

 

 

 

 

 

 

 

Power Amp

 

 

 

 

 

 

 

Bias Coil

 

 

Filter

 

 

 

 

Sensor

 

 

Eject Motor

 

 

Motor Driver

 

 

Cartridge Sensor

 

 

 

 

 

 

 

 

Figure 1.4 Control circuit section block diagram

1 - 8

C156-E142-02EN

The control circuit section is divided into two parts: an ATAPI controller section which deals with control between the ATAPI interface and drive interface, and a drive circuit section which controls the drive.

(1)ATAPI controller circuit section

The ATAPI controller circuit's reliability is improved by large-scale integrated circuit technology. The high-speed microprocessor (MPU) handles ATAPI interface control and drive control such as drive read-and-write control and single-beam control.

(2)Drive circuit section

The drive circuit section consists of the following circuits:

!Laser diode control circuit

!Signal reproduction circuit

!Servo/seek control circuit

!Rotation control circuit

!Drive miscellaneous control circuit

The DSP (digital signal processor) is used for the servo/seek control circuit to reduce the circuit amount, therefore this circuit is a simple configuration.

The drive circuit section executes operations such as seek, erase, record, and playback while the MPU controls the focus-tracking of the beam.

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