FUJITSU MB88152A, MB88152A-100, MB88152A-101, MB88152A-102, MB88152A-110 DATA SHEET

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FUJITSU MICROELECTRONICS

DATA SHEET

DS04-29125-2Ea

Spread Spectrum Clock Generator MB88152A

MB88152A-100/101/102/110/111/112

■ DESCRIPTION

MB88152A is a clo ck generator for EMI (Electro Magnetic Interference) red uction. The peak of unnecess ary radiation noise (EM I) can be attenuated by mak ing the osci llation frequen cy slightly m odulate per iodically wit h the internal modula tor. It corresponds to bot h of the ce nter sprea d which m odulate s input fre quency a s Middle Centered and down spread which modulates so as not to exceed input frequency.

■ FEATURES

• Input frequency : 16.6 MHz to 134 MHz

• Output frequency : 16.6 MHz to 134 MHz

• Modulation rate : ± 0.5%, ± 1.5% (Center spread), − 1.0%, − 3.0% (Down spread)

• Equipped with oscillation circuit: Range of oscillation 16.6 MHz to 48 MHz

• Modulation clock output Duty : 40% to 60%

• Modulation clock Cycle-Cycle Jitter : Less than 100 ps

• Low current consumption by CMOS process : 5.0 mA (24 MHz : Typ-sample, no load)

• Power supply voltage : 3.3 V ± 0.3 V

• Operating temperature : − 40 °C to +85 °C

• Package : SOP 8-pin

2007.6

MB88152A

■ PRODUCT LINE-UP

MB88152A has th ree kinds of inpu t frequency, and two kinds of modulat ion type (cen ter/down sp read), tota l six line-

ups.

Product Input/Output Frequency Modulation type Modulation enable pin

MB88152A-100 16.6 MHz to 134 MHz

No MB88152A-101 16.6 MHz to 67 MHz MB88152A-102 40 MHz to 134 MHz MB88152A-110 16.6 MHz to 134 MHz MB88152A-111 16.6 MHz to 67 MHz MB88152A-112 40 MHz to 134 MHz

■ PIN ASSIGNMENT

TOP VIEW

XIN

XOUT

SEL

MB88152A-101

MB88152A-102 MB88152A-111

MB88152A-112

FPT-8P-M02

8 7 6 5

XENS FREQ

V CKOUT

Down spread

Center spread

XIN

XOUT

SEL

MB88152A-100 MB88152A-110

FPT-8P-M02

8 7 6 5

FREQ1 FREQ0

V CKOUT

Yes

■ PIN DESCRIPTION

Pin name I/O Pin no. Description

XIN I 1 Crystal resonator connec ti on pin/cl oc k inp ut pin

XOUT O 2 Cryst al resonator connection pin

SS  3 GND pin

SEL I 4 Modulation rate setting pin

CKOUT O 5 Modulated clock output pin

DD  6 Power supply voltage pin

FREQ/FREQ0 I 7 Frequency setting pin XENS/FREQ1 I 8 Modulation enable setting pin/frequency setting pin

■ I/O CIRCUIT TYPE

Pin Circuit type Remarks

CMOS hysteresis input

SEL

FREQ FREQ0 FREQ1

XENS

• CMOS output

OL = 4 mA

•I

MB88152A

CKOUT

Note : For XIN and XOUT pins, refer to “■OSCILLATION CIRCUIT”.

MB88152A

■ HANDLING DEVICES

Preventi n g Latch-up

A latch-up can occur if, on this device, (a) a voltage higher than V input or output pin or (b) a voltage higher than the rating is applied between V occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use this device, be very careful not to exceed the maximum rating.

Handling unused pins

Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or pull-down resistor.

Unused output pin should be opened.

The attention when the external clock is used

Input the clock to XIN pin, and XOUT pin should be opened when you use the external clock. Please pay attention so that an overshoot and an undershoot do not occur to an input clock of XIN pin.

Power supply pins

Please design connecting the power supply pin of this device by as low impedance as possible from the current supply source.

We recommend connecting electrolyti c capacitor (about 10 µF) and the ceramic capacitor (ab out 0.01 µF) in parallel between V

SS and VDD pins near the device, as a bypass capacitor.

DD or a voltage lower than VSS is applied to an

DD and VSS pins. The la tc h-up, if it

Oscillation Circuit

Noise near the XIN and XOUT pins may cause the device to malfunction. Design printed circuit boards so that electric wiring of XIN or XOUT pin and resonator (or ceramic oscillator) do not intersect other wiring.

Design the printed circuit board that surrounds the XIN and XOUT pins with ground.

■ BLOCK DIAGRAM

MB88152A

VDD

SEL

FREQ/FREQ0

XENS/FREQ1

XOUT

XIN

Modulation rate setting

Frequency setting

Modulation enable / Frequency setting

Reference clock

Rf = 1 MΩ

PLL block

Clock output

CKOUT

Reference clock

A glitchless IDAC (current output D/A converter) provides precise modulation, thereby dramatically reducing EMI.

−

Phase

compare

−

Charge

pump

V/I

conversion

Loop filter

MB88152A PLL block

IDAC ICO

Modulation logic

Modulation clock output

Modulation rate setting/ Modulation enable setting

MB88152A

■ PIN SETTING

When changing the pin setting, the stabilization wait time for the modulation clock is required. The stabilization wait time for the modulation clock takes the maximum value of Lock-Up time in “■ ELECTRICAL CHARACTERISTICS • AC characteristics Lock-Up time”.

Modulation enable setting

XENS Modulation

L Modulation

H No modulation

Note : MB88152A-100 and MB88152A-110 do not have XENS pin.

SEL modulation rate setting

SEL Modulation rate R emarks

± 0.5%

− 1.0%

MB88152A-110, MB88152A-111,

MB88152A-112

MB88152A-100, MB88152A-101,

MB88152A-102

MB88152A-101, MB88152A -102,

MB88152A-111, MB88152A-112

Center spread

Down spread

MB88152A-110,

± 1.5%

− 3.0%

Note : The modulation rate can be changed at the level of the terminal.

Frequency setting

FREQ Frequency

Note : MB88152A-100 and MB88152A-110 do not have FREQ pin.

Frequency setting

FREQ1

L L 16.6 MHz to 40 MHz

FREQ0 Frequency

16.6 MHz to 40 MHz MB88152A-101, MB88152A-111 40 MHz to 80 MHz MB88152A-102, MB88152A-112 33 MHz to 67 MHz MB88152A-101, MB88152A-111

66 MHz to 134 MHz MB88152A-102, MB88152A-112

MB88152A-111,

MB88152A-112

MB88152A-100, MB88152A-101,

MB88152A-102

Center spread

Down spread

L H 33 MHz to 67 MHz H L 40 MHz to 80 MHz H H 66 MHz to 134 MHz

Note : MB88152A-101, MB88152A-111, MB88152A-102 and MB88152A-112 have neither FREQ0 pin nor FREQ1

pin.

MB88152A-100, MB88152A-110

• Center spread Spectrum is spread (modulated) by centering on the input frequency.

3.0% modulation width

Radiation level

−1.5% +1.5%

Input frequency

Center spread example of ± 1.5% Modulation rate

• Down spread

MB88152A

Frequency

Spectrum is spread (modulated) below the input frequency.

3.0% modulation width

Radiation level

−3.0%

Input frequency

Down spread example of − 3.0% Modulation rate

Frequency

MB88152A

■ ABSOLUTE MAXIMUM RATINGS

Parameter Symbol

Unit

Min Max

Rating

Power supply voltage* V Input voltage* V Output voltage* V Storage temperature T Operation junction temperature T Output current I Overshoot V Undershoot V

DD − 0.5 + 4.0 V

I VSS − 0.5 VDD + 0.5 V

O VSS − 0.5 VDD + 0.5 V

ST − 55 + 125 °C

J − 40 + 125 °C

O − 14 + 14 mA

IOVER  VDD + 1.0 (tOVER ≤ 50 ns) V

IUNDER VSS − 1.0 (tUNDER ≤ 50 ns)  V

* : The parameter is based on VSS = 0.0 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,

temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.

Overshoot/Undershoot

UNDER ≤ 50 ns

IOVER ≤ VDD + 1.0 V

Input pin

OVER ≤ 50 ns

IUNDER ≤ VSS − 1.0 V

■ RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Pin Conditions

MB88152A

(VSS = 0.0 V)

Value

Unit

Min Typ Max

Power supply voltage V

“H” level input voltage V

“L” level input voltage V

Input clock duty cycle

DD VDD  3.0 3.3 3.6 V

SEL,

FREQ/FREQ0,

 V

DD × 0.8  VDD + 0.3 V

XENS/FREQ1

Input through rate

3 V / ns

DD × 0.8  VDD + 0.3 V

16.6 MHz to 100 MHz

XIN

Input through rate 3 V / ns

DD × 0.9  VDD + 0.3 V

100 MHz to 134 MHz

SEL,

FREQ/FREQ0,

 V

SS  VDD × 0.2 V

XENS/FREQ1

Input through rate

3 V / ns

SS  VDD × 0.2 V

16.6 MHz to 100 MHz

XIN

Input through rate 3 V / ns

SS  VDD × 0.1 V

100 MHz to 134 MHz

16.6 MHz to 100 MHz 40 50 60

DCI XIN

100 MHz to 134 MHz 45 50 55

Operating temperature

Ta −40  + 85 °C

WARNING: The recommended operating conditions are required in order to ensure the normal operation of the

semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges.

Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure.

No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand.

Input clock duty cycle (tDCI = tb/ta)

XIN

1.5 V

MB88152A

■ ELECTRICAL CHARACTERISTICS

• DC Characteristics

Parameter

Sym-

bol

Pin Conditions

(Ta = −40 °C to + 85 °C, V

Min Typ Max

DD = 3.3 V ± 0.3 V, VSS = 0.0 V)

Value

Unit

Power supply current I

Output voltage

Output impedance Z

Input capacitance C

Load capacitance C

CC VDD

24 MHz output

No load capacitance

“H” level output

OH = − 4 mA

 5.0 7.0 mA

DD − 0.5  VDD V

CKOUT

O CKOUT 16.6 MHz to 134 MHz  45 Ω

“L” level output

OL = 4 mA

SS  0.4 V

XIN,

SEL,

FREQ/

FREQ0,

XENS/

Ta = + 25 °C

DD = VI = 0.0 V

f = 1 MHz

16 pF

FREQ1

16.6 MHz to 67 MHz 15

L CKOUT

pF67 MHz to 100 MHz 10

100 MHz to 134 MHz 7

• AC Characteristics

Parameter

Sym-

bol

(Ta = −40 °C to + 85 °C, V

Pin Conditions

MB88152A

DD = 3.3 V ± 0.3 V, VSS = 0.0 V)

Value

Unit

Min Typ Max

Oscillation frequenc y f

Input frequency f

Output frequency f

in XIN

OUT CKOUT

XIN,

XOUT

Output slew rate SR CKOUT Output clock duty cycle t

Modulation frequency

(Number of input clocks

per modulation

)

DCC CKOUT 1.5 V 40  60 %

fMOD

(nMOD)

CKOUT

Fundamental oscill ati on 16.6  40

3rd over tone 40  48

MB88152A-100/110 16.6  134

MB88152A-102/112 40  134 MB88152A-100/110 16.6  134

MB88152A-102/112 40  134

0.4 V to 2.4 V

Load capacitance 15 pF

MB88152A-100/110

FRRQ[1 : 0] = (00)

MB88152A-100/110

FRRQ[1 : 0] = (01)

MB88152A-100/110

FRRQ[1 : 0] = (10)

MB88152A-100/110

FRRQ[1 : 0] = (11)

MB88152A-101/111

FRRQ = 0

MB88152A-101/111

FRRQ = 1

0.4  4.0 V/ns

fin/2640

(2640)

fin/4400

(4400)

fin/5280

(5280)

fin/8800

(8800)

fin/2640

(2640)

fin/4400

(4400)

fin/2280

(2280)

fin/3800

(3800)

fin/4560

(4560)

fin/7600

(7600)

fin/2280

(2280)

fin/3800

(3800)

fin/1920

(1920)

fin/3200

(3200)

fin/3840

(3840)

fin/6400

(6400)

fin/1920

(1920)

fin/3200

(3200)

MHz

MHzMB88152A-101/111 16.6  67

kHz

(clks)

Lock-Up time t

Cycle-cycle jitter t

LK CKOUT

JC CKOUT

MB88152A-102/112

FRRQ = 0

MB88152A-102/112

FRRQ = 1

16.6 MHz to 80 MHz 80 MHz to 134 MHz

No load capacitance,

Ta = + 25 °C,

DD = 3.3 V

fin/5280

(5280)

fin/8800

(8800)



fin/4560

(4560)

fin/7600

(7600)

25 38

100

fin/3840

(3840)

fin/6400

(6400)

ps-

rms

MB88152A

f (Output frequency)

Modulation wave form

MOD

(Min) f

MOD

(Max)

Clock count

MOD (Max)

Clock count

MOD (Min)

MB88152A contains the modulation period to realize the efficient EMI reduction. The modulation period f Furthermore, the average value of f

MOD depends on the input frequency and changes between fMOD (Min) and fMOD (Max) .

MOD equals the typical value of the electrical characteristics.

■ OUTPUT CLOCK DUTY CYCLE (tDCC = tb/ta)

CKOUT

MB88152A

1.5 V

■ INPUT FREQUENCY (f

XIN

in = 1/tin)

■ OUTPUT SLEW RATE (SR)

CKOUT

Note : SR = (2.4−0.4) /tr, SR = (2.4−0.4) /tf

tin

0.8 VDD

2.4 V

0.4 V

■ CYCLE-CYCLE JITTER (t

CKOUT

JC = | tn − tn + 1 |)

tn+1tn

Note : Cycle-cycle jitter is defined the difference between a certain cycle and immediately after

(or, immediately before) .

MB88152A

■ MODULATION WAVEFORM

• ±1.5% modulation rate, Example of center spread

CKOUT output frequency

+ 1.5 %

Frequency at modulation OFF

− 1.5 %

MOD

Time

• −1.0% modulation rate, Example of down spread

CKOUT output frequency

Frequency at modulation OFF

− 0.5 %

− 1.0 %

MOD

Time

■ LOCK-UP TIME

MB88152A

3.0 V

Internal clock

stabilization wait time

XIN

Setting pin

VIH

SEL

FREQ1/XENS

FREQ0/FREQ

(lock-up time )

CKOUT

If the setting pin is fixed at the “H” or “L” level, the maximum time after the power is turned on until the set clock signal is output from CKOUT pin is (the stabilization wait time of input clock to XIN pin) + (the lock-up time “t

LK”).

For the input clock stabilization time, check the characteristics of the resonator or oscillator used.

XIN

VIH

XENS

tLK

(lock-up time )

VIL

(lock-up time )

CKOUT

For modulation enable control using the XENS pin during normal operation, the set clock signal is output from CKOUT pin at most the lock-up time (t

LK) after the level at the XENS pin is determined.

Note : When the pin setting is changed, the CKOUT pin output clock stabilization time is required. Until the output

clock signal becomes stable, the output frequency, output clock duty cycle, modulation period, and cyclecycle jitter cannot be guaranteed. It is therefore advisable to perform processing such as cancelling a reset of the device at the succeeding stage after the lock-up time.

MB88152A

■ OSCILLATION CIRCUIT

The left side of figures below shows the connection example about general resonator. The oscillation circuit has the built-in feedback resistance (1 MΩ). The value of capacity (C suitable value of an individual resonator. The right side of fig ures below shows the example of conn ecting for the 3rd over-tone reson ator. The value of capacity (C resonator. The most suitable value is different by individual resonator. Please refer to the resonator manufacturer which you use for the most suitable value. When an external clock is used (the resonator is not used), input the clock to XIN pin and do not connect anything with XOUT pin.

• When using the resonator

XIN Pin XOUT Pin XIN Pin XOUT Pin

1, C2 and C3) and inductanc e (L1) is needed adjusti ng to the most su itable value of an individual

MB88152A Internal

Rf (1 MΩ)

1 and C2) is required adjusti ng to the most

Rf (1 MΩ)

Fundamental resonator 3rd over tone resonator

• When using an external clock

XIN Pin

External clock

MB88152A External

2 C1

Rf (1 MΩ)

MB88152A LSI Internal

XOUT Pin

MB88152A LSI External

OPEN

Note : Note that a jitter characteristic of an input clock may cause an affect a cycle-cycle jitter

characteristic.

■ INTERCONNECTION CIRCUIT EXAMPLE

MB88152A

XENS/FREQ1

1 C2

1 2

MB88152A

3 4

SEL

8 7 6 5

C4 C3

FREQ/FREQ0

C1, C2 : Oscillation stabilization capacitance (refer to "■ OSCILLATION CIRCUIT”.) C

3 : Capacitor of 10 µF or higher

4 : Capacitor about 0.01 µF (connect a capacitor of good high frequency

property (ex. laminated ceramic capacitor) to close to this device.)

1 : Impedance matching resistor for board pattern

MB88152A

■ EXAMPLE CHARACTERISTICS

The condition of the examples of the characteristics is shown as follows : Input frequency = 20 MHz (Output frequency = 20 MHz : Use for MB88152A-111) Power-supply voltage Spectrum analyzer HP4396B is connected with CKOUT. The result of the measurement with, RBW

−6 dB

) .

= 3.3 V, None load capacity, Modulati on ra te = ±1.5% (center spread) .

CH B Spectrum 10 dB /REF 0 dBm

No modulation

−7.44 dBm

Avg

±1.5% modulation

−25.75 dBm

= 1 kHz (ATT use for

RBW# 1 kH CENTER 20 MH

Z VBW 1 kHZ ATT 6 dB

SWP 2.505 s

SPAN 4 MH

■ ORDERING INFORMATION

MB88152A

Part number

MB88152APNF-G-100-JNE1 16.6 MHz to 134 MHz Down spread No MB88152APNF-G-101-JNE1 16.6 MHz to 67 MHz Down spread Yes MB88152APNF-G-102-JNE1 40 MHz to 134 MHz Down spread Yes MB88152APNF-G-110-JNE1 16.6 MHz to 134 MHz Center spread No MB88152APNF-G-111-JNE1 16.6 MHz to 67 MHz Center spread Yes MB88152APNF-G-112-JNE1 40 MHz to 134 MHz Center spread Yes MB88152APNF-G-100-JNEFE1 16.6 MHz to 134 MHz Down spread No MB88152APNF-G-101-JNEFE1 16.6 MHz to 67 MHz Down spread Yes MB88152APNF-G-102-JNEFE1 40 MHz to 134 MHz Down spread Yes MB88152APNF-G-110-JNEFE1 16.6 MHz to 134 MHz Center spread No MB88152APNF-G-111-JNEFE1 16.6 MHz to 67 MHz Center spread Yes MB88152APNF-G-112-JNEFE1 40 MHz to 134 MHz Center spread Yes MB88152APNF-G-100-JNERE1 16.6 MHz to 134 MHz Down spread No MB88152APNF-G-101-JNERE1 16.6 MHz to 67 MHz Down spread Yes MB88152APNF-G-102-JNERE1 40 MHz to 134 MHz Down spread Yes MB88152APNF-G-110-JNERE1 16.6 MHz to 134 MHz Center spread No MB88152APNF-G-111-JNERE1 16.6 MHz to 67 MHz Center spread Yes MB88152APNF-G-112-JNERE1 40 MHz to 134 MHz Center spread Yes

Input/Output

Frequency

Modulation

type

Modulation

enable pin

Package Remarks

8-pin plastic

SOP

(FPT-8P-M02)

8-pin plastic

SOP

(FPT-8P-M02)

8-pin plastic

SOP

(FPT-8P-M02)

Emboss

taping

(EF type)

Emboss

taping

(ER type)

MB88152A

■ PACKAGE DIMENSION

8-pin plastic SOP Lead pitch 1.27 mm

8-pin plastic SOP

(FPT-8P-M02)

+0.25

–0.20

5.05

(FPT-8P-M02)

+.010 –.008

.199

Pac kage width

package length

3.9 × 5.05 mm

Lead shape Gullwing

Sealing method Plastic mold

Mounting height 1.75 mm MAX

Weight 0.06 g

Note 1)*1 : These dimensions include resin protrusion. Note 2)*2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.

0.22 .009

+0.03 –0.07

+.001 –.003

3.90±0.30 6.00±0.40

(.154±.012) (.236±.016)

0.40(.016)

1.27(.050)

0.10(.004)

2002 FUJITSU LIMITED F08004S-c-4-7

0.44±0.08

(.017±.003)

0.13(.005)

Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/

45˚

Details of "A" part

1.55±0.20

(.061±.008)

"A"

Dimensions in mm (inches). Note: The values in parentheses are reference values.

0~8

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.25(.010)

(Mounting height)

0.15±0.10

(.006±.004)

(Stand off)

MEMO

MB88152A

MEMO

MB88152A

FUJITSU MICROELECTRONICS LIMITED

Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387

http://jp.fujitsu.com/fml/en/

For further information please contact:

North and South America

FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999

http://www.fma.fujitsu.com/

Europe

FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122

http://emea.fujitsu.com/microelectronics/

Korea

FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111

http://www.fmk.fujitsu.com/

Asia Pacific

FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220

http://www.fujitsu.com/sg/services/micro/semiconductor/

FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605

http://cn.fujitsu.com/fmc/

FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269

http://cn.fujitsu.com/fmc/tw

The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

Edited Strategic Business Development Dept.

FUJITSU MB88152A, MB88152A-100, MB88152A-101, MB88152A-102, MB88152A-110 DATA SHEET

Specifications and Main Features

Frequently Asked Questions

User Manual

■ DESCRIPTION

■ FEATURES

■ PRODUCT LINE-UP

■ PIN ASSIGNMENT

■ PIN DESCRIPTION

■ I/O CIRCUIT TYPE

■ HANDLING DEVICES

■ BLOCK DIAGRAM

■ PIN SETTING

■ ABSOLUTE MAXIMUM RATINGS

■ RECOMMENDED OPERATING CONDITIONS

■ ELECTRICAL CHARACTERISTICS

■ OUTPUT SLEW RATE (SR)

■ MODULATION WAVEFORM

■ LOCK-UP TIME

■ OSCILLATION CIRCUIT

■ INTERCONNECTION CIRCUIT EXAMPLE

■ EXAMPLE CHARACTERISTICS

■ ORDERING INFORMATION

■ PACKAGE DIMENSION