BECAUSE THIS PRODUCTIS RoHS LEAD-FREE COMPLIANT, USE THE DESIG-
NATED AFTER-SELES PARTS AND THE DESIGNATED LEAD-FREE SOLDER WHEN
PERFORMING REPAIRS. (Refer to page 3 to page 5)
WARNING
THE COMPONENTS IDENTIFIED WITH THE MARK “ ” ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST ARE CRITICAL FOR SAFETY.
PLEASE REPLACE ONLY WITH THE COMPONENTS SPECIFIED ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST.
IF YOU USE PARTS NOT SPECIFIED, IT MAY RESULT IN A FIRE AND AN
ELECTRICAL SHOCK.
FUJI PHOTO FILM CO., LTD.
Ref.No.:ZM00636-100
Printed in Japan 2006.05
FinePix F30 Service Manual
SAFETY CHECK-OUT
After correcting the original problem, perform the following
safety check before return the product to the customer.
1. Check the area of your repair for unsoldered or poorly
soldered connections. Check the entire board surface
for solder splasher and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.
Point them out to the customer and recommend their
replacement.
4. Look for parts which, though functioning, show obvious
signs of deterioration. Point them out to the customer
and recommend their replacement.
5. Check the B + voltage to see it is at the values
specified.
6. Make leakage - current measurements to determine
that exposed parts are acceptably insulated from the
supply circuit before returning the product to the
customer.
7.CAUTION: FOR CONTINUED
PROTECTION AGAINST FIRE
HAZARD, REPLACE ONLY WITH
SAME TYPE 2.5 AMPERES 125V
FUSE.
2.5A 125V
2.5A 125V
8.WARNING:
RISK OF FIREREPLACE FUSE
AS MARKED
ATTENTION: AFIN D'ASSURER
UNE PROTECTION
PERMANENTE CONTRE LES
RISQUES D'INCENDIE,
REMPLACER UNIQUEMENT
PAR UN FUSIBLE DE MEME,
TYPE 2.5 AMPERES, 125 VOLTS.
TO REDUCE THE ELECTRIC
SHOCK, BE CAREFUL TO
TOUCH THE PARTS.
WARNING!
HIGH VOLTAGE
2
FinePix F30 Service Manual
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder
when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and
component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.
*1: Excluded items (list of the main lead-related items)
• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes
• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)
• Lead in ceramic electronic parts (piezo-electronic devices)
• Mercury contained in fluorescent tubes is also excluded.
*2: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Reference>
RoHS:The name of a directive issued by the European Parliament aimed at restricting the use of
certain designated hazardous substances included in electrical and electronic equipment.
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional
solder (eutectic) and lead-free solder.
Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown
below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.
Accordingly, the soldering techniques used must take that into account.
Difference
The solder starts melting later.
1
Poor wetting
2
Solder feed rate is difficult to control.
3
Wetting the insides of through holes is especially
4
difficult.
5
During repairs (or modifications) removing solder
from inside through holes is difficult.
6
There is serious carbonization of the soldering iron.
The surface is not glossy.
7
The initial melting point of lead-free solder is high, so you
have to get used to it.
Move the tip of the soldering iron around to heat the entire
connection to the melting temperature and assist wetting.
Use the solder (wire) diameter and soldering iron that are
best suited to connection being soldered.
First apply solder to the area immediately around the
through hold and then feed the solder into the hole.
Use a suitable wicking wire (with a suitable method and
heating) and a suction tool.
Either put solder onto the soldering iron tip after completing
the work, or turn the iron off frequently.
Learn to recognize the appearance of the surface.
Countermeasure
3
FinePix F30 Service Manual
Setting temperature during lead-free soldering
• Lead-free solder melting temperature
The melting point of eutectic (Sn-Pb) solder is 183°C, while the melting point of lead-free solder (Sn-Ag-Cu) is 30°C higher
at 220°C.
• Soldering iron tip temperature
The temperature setting for the soldering iron used should be such that the tip of the soldering iron is at the correct
bonding temperature for the connection. This temperature is normally set at around 100°C higher than the melting point of
the solder.
However, the actual temperature should take into account the shape and size of the soldering iron tip, the heat tolerance
of the connection and the workability of that temperature.
• Correct bonding temperature
The correct bonding temperature refers not to the temperature of the heat source, but to the bonding temperature that will
give the best bond strength.
Precautions when soldering with lead-free solder
• Soldering iron maintenance
Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to
the tip of the soldering iron.
(1) Always cover the tip of the soldering iron with solder when it is not being used.
(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.
• Uniform heating of the board and components
To ensure that the lead-free solder wets the entire surface of the pattern and the lands despite its poor wetting
characteristics, you must move the tip of the soldering iron over a wide area to raise the temperature of the entire
connection.
Soldering iron
A soldering iron with a temperature control is best.
4
FinePix F30 Service Manual
Solder wire (thread)
Use the lead-free solders specified below.
Solder type: Sn96.5Ag3Cu0.5 (Displayed symbol: SnAgCu)
Wire diameter: 0.6, 0.8 or 1.0 mm
z A/V cable for FinePix F30 (1) Including plug to pin-plug
z USB cable for FinePix F30 (1)
z CD-ROM (1) Software for FinePix CX
z Owner’s Manual (1)
Optional accessoriesz xD-Picture Card
16MB/32MB/64MB/128MB/256MB/512MB/1GB
z Battery Charger BC-65S
z Rechargeable Battery NP-95 (1800 mAh)
z AC Power Adapter AC-5VX
z Soft Case SC-FXF30
z Image Memory Card Reader DPC-R1
• Compatible with xD-Picture Card of 16 MB to 512 MB, and SmartMedia of 3.3 V,
4 MB to 128 MB.
z PC Card Adapter DPC-AD
• Compatible with xD-Picture Card of 16 MB to 512 MB, and SmartMedia of 3.3 V,
2 MB to 128 MB.
z CompactFlash Card Adapter DPC-CF
z Waterproof Case WP-FXF30
FinePix F30 Service Manual
×
2
Standard number of available frames/recording time per xD-Picture Card and internal memory
The number of available
that the divergence between standard number of
xD-Picture Cards with higher capacities.
Quality setting
Number of recorded pixels
Image data size
Internal memory (approx. 10 MB)
16 MB
32 MB
64 MB
128 MB
256 MB
512 MB
1 GB
, recording time or file size varies slightly depending on the subjects photographed. Note also
frames
frames
2136
1.5 MB
10
20
42
84
169
339
N
30242016 20481536 16001200
1.5 MB
6
61215 77
10
20
42
84
169
339
F
2848
3.0 MB
3
5
10
21
42
85
170
341680680130516397995
and the actual number of
640480 640480 320240
780 KB
19
40
81
162
325
651
630 KB
25
50
101
204
409
818
130 KB
1997
3993
12
247
497
997
frames
(30 fps)(30 fps)
2
13 sec.
27 sec.
55 sec.
111 sec.
223 sec.
7.4 min.
14.9 min.29.3 min.
is greater for
8 sec.16 sec.
26 sec.
54 sec.
109 sec.
219 sec.
7.3 min.
14.6 min.
10
FinePix F30 Service Manual
1. General
1-2.Explanation of Terms
EV:A number denotes Exposure Value. The EV is determined by the brightness of the subject
and sensitivity (speed) of the film or CCD. The number is larger for bright subjects and
smaller for dark subjects. As the brightness of the subject changes, a digital camera
maintains the amount of light hitting the CCD at a constant level by adjusting the aperture
and shutter speed.
When the amount of light striking the CCD doubles, the EV increases by 1. Likewise, when
the light is halved, the EV decreases by 1.
Frame rate (fps):The frame rate refers to the number of images (frames) that are photographed or played
back per second. For example, when 10 frames are continuously photographed in a 1-
second interval, the frame rate is expressed as 10 fps.
For reference, TV images are displayed at 30 fps (NTSC).
JPEG:Joint Photographic Experts Group
A file format used for compressing and saving color images. The higher the compression
rate, the greater the loss of quality in the decompressed (restored) image.
Motion JPEG:A type of AVI (Audio Video Interleave) file format that handles images and sound as a
single file. Images in the file are recorded in JPEG format. Motion JPEG can be played
back by QuickTime 3.0 or later.
Smear:A phenomenon specific to CCDs whereby white streaks appear on the image when there
is a very strong light source, such as the sun or reflected sunlight, in the photography
screen.
WAVEA standard format used on Windows systems for saving audio data. WAVE files have the
“.WAV” file extension and the data can be saved in either compressed or uncompressed
format. Uncompressed recording is used on this camera.
WAVE files can be played back on a personal computer using the following software:
Windows: MediaPlayer
Macintosh: QuickTime Player
* QuickTime 3.0 or later
White Balance:Whatever the kind of the light, the human eye adapts to it so that a white object still looks
white. On the other hand, devices such as digital cameras see a white subject as white by
first adjusting the color balance to suit the color of the ambient light around the subject.
This adjustment is called matching the white balance.
Exif Print:Exif Print Format is a newly revised digital camera file format that contains a variety of
shooting information for optimal printing.
11
1. General
1-3.Names of External Components
FinePix F30 Service Manual
POWER button
Shutter button
Mode dial
Lens (lens cover)
A/V OUT (Audio/
Visual output) socket
USB socket
DC IN 5V socket
Flash
AF-assist illuminator
Self-timer lamp
Terminal cover
Microphone
Indicator lamp
4-direction
( ) button
LCD monitor
Speaker
Tripod mount
xD-Picture Card slot
W (Wide zoom) button
T (Tele zoom) button
(Playback) button
Photo mode ( ) button
Strap mount
MENU/OK button
Exposure compensation
button
DISP (Display)/BACK button
Battery compartment
Battery cover
Battery release catch
12
FinePix F30 Service Manual
2.Disassembly
2-1.Names of internal Components
GUM KEY
KEY FPC
2. Disassembly
R PANEL ASSY
LCD CONST
FRAME REAR
BATTERY HOLDER ASSY
SPEAKER ASSY
OPE UNIT
MAIN PWB ASSY
FLASH CONST
LENS ASSY
LED
E CAP
F PANEL ASSY
MIC ASSY
13
2. Disassembly
2-2.Removing the R PANEL CONST
(1) Remove the 2 special screws (M1.7 x 2.5).
(2) Remove the 3 screws (M1.7 x 3.0).
(3) Remove the 2 screws (M1.7 x 4.0).
(4) Lift off the R PANEL CONST in the direction of the
arrow.
FinePix F30 Service Manual
4
2
(5) Remove the 2 FPC from the connectors in the
direction of the arrow.
3
5
5
1
[Notes on Assembly]
Take care not to trap or pinch the LCD FPC during
assembly.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
14
FinePix F30 Service Manual
6
6
6
2-3.Disassembling the R PANEL CONST
2. Disassembly
(1) Peel off the EMI SHEET.
(2) Peel off the UL TAPE.
(3) Peel off the TR SHEET.
(4) Remove the 8 screws (M1.4 x 2.5).
(5) Remove the REAR FRAME.
(6) Remove the KEY FPC, KEY GUM and LCD CONST.
1
2
4
3
5
[Notes on Assembly]
Take care not to trap or pinch the BACK LIGHT FPC
during assembly.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
15
2. Disassembly
2-4.Removing the MAIN PWB ASSY
(1) Remove the SHEET (PWB).
(2) Discharge the main capacitor.
Take care not to touch the main capacitor terminals
before discharging the capacitor.
FinePix F30 Service Manual
1
2
(3) Unlock the connector and remove the LENS FPC.
(4) Unlock the connector and remove the OPE UNIT
FPC.
(5) Unlock the connector and remove the CCD FPC.
(6) Remove the wire harness (SPEAKER) from the
connector.
(7) Remove the wire harness (MIC) from the connector.
(8) Remove the screw (M1.7 x 3.0).
(9) Remove the 3 screws (M1.7 x 4.0).
(10) Remove the PLATE L.
(11) Open the BATTERY COVER.
(12) Remove the MAIN PWB ASSY in the direction of the
arrow.
[Notes on Assembly]
With the JACK COVER pulled off, fit the MAIN PWB ASSY
and assemble so that the wiring runs between the FLASH
CONST and the MAIN PWB ASSY.
10
9
12
3
4
5
7
6
11
8
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
16
FinePix F30 Service Manual
2-5.Removing the FLASH CONST
(1) Remove the solder on the MAIN PWB ASSY (2
locations) and remove the LED.
(2) Remove the solder on the MAIN PWB ASSY (2
locations) and remove the LEAD C.CAP.
(3) Remove the solder on the MAIN PWB ASSY (3
locations) and remove the FLASH CONST.
2. Disassembly
3
1
2
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
* When replacing the LED, cut the leads to a length
between 9.5 and 10.5 mm for installation.
2-6.Removing the LENS ASSY
(1) Remove the 3 screws (M1.7 x 7.0).
(2) Remove the LENS ASSY in the direction of the arrow.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
9.5mm~10.5mm
1
K
2
17
2. Disassembly
2-7.Removing the BATTERY HOLDER ASSY
FinePix F30 Service Manual
(1) Remove the BATTERY HOLDER ASSY in the
direction of the arrow.
[Notes on Assembly]
Run the SPEAKER ASSY • MIC ASSY leads along the
BATTERY HOLDER groove.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
1
2-8.Removing the OPE UNIT
(1) Remove the screw (M1.4 x 1.6).
(2) Remove the OPE UNIT in the direction of the arrow.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
2
1
18
FinePix F30 Service Manual
2. Disassembly
2-9.Specifications for the sheet component attachment locations
2-9-1.Affixing the SHEET (PWB) to the MAIN PWB ASSY.
Affix the sheet so that it completely covers the specified area,
with the top and left sides securely folded back and stuck in
place.
2-9-2.Affixing the TR SHEET, EMI SHEET and UL TAPE to the R PANEL CONST
Affix the TR SHEET so that the alumite butts against the
laser-ablated section and stick a piece of UL TAPE cut to a
size of 19 mm x 13 ± 2 mm as shown in the figure on the
right so that it completely covers the TR SHEET.
19
2. Disassembly
2-9-3.Affixing the UL TAPE to the LEAD E.CAP.
Cut the UL TAPE to a size of 19 mm x 13 ± 2 mm and stick it
onto the LEAD E.CAP so that it covers the section adjacent
to the metal terminals for the DC-JACK on the MAIN PWB
ASSY.
FinePix F30 Service Manual
13 2mm
20
FinePix F30 Service Manual
3. Schematics
3.Schematics
3-1.Cautions
<Cautions when replacing parts>
• Do not reuse removed parts. Always use new parts.
• Note that the negative side of tantalum condensers is readily damaged by heat.
• Except for chemical condensers and tantalum condensers, voltage is not displayed on condensers with a voltage
resistance of 50V or less.
• Resistors not marked are 1/16W chip resistors.
•KΩ = 1000Ω, MΩ = 1000KΩ
• B characteristics of variable resistors and semi-fixed resistors are not displayed.
MOTOR BLOCKShutter/Iris/AF/Zoom Drive (IC151)
AUDIO BLOCKAudio IN/OUT(IC701)
LCD BLOCKLCD Output CN, Back Light Control
DC/DC BLOCKPower Supply Generation (IC451), Power Control
PMG BLOCKPower Control, LED Driver, Flash Charge Control (IC551)
VIDEO BLOCKVideo Output (IC651)
FLASH BLOCKFlash Charge, Flash Firing
KEY BLOCKConnection with the Key SW
PROCESS BLOCK (IO)Image Signal Processing (IC201: 1/3)
PROCESS BLOCK (PW)Power Input (IC201: 2/3)
PROCESS BLOCK (SYS)System Control, USB Communications (IC201: 3/3)
CHG BLOCKBattery Charge Control (IC501)
IO BLOCKUSB Signal IN/OUT, AV Signal Output
LED BLOCKAF_LED Output, Indicator Lamp Output
MEDIA BLOCKMedia Data IN/OUT
21
3. Schematics
FinePix F30 Service Manual
3-3.Description of Main Block Functions
3-3-1.Technical Overview
The new 6th Generation Super CCD HR captures more light from the superb Fujinon lens more efficiently with less light loss,
and sends the image to the processor with less noise. The new RP Processor II featuring enhanced double noise reduction
lets users take full advantage of the phenomenal ISO 3200 sensitivity of the FinePix F30. Other improvements include
“Intelligent Flash” and upgraded signal processing for more accurate color reproduction.
All these enhancements add up to more stunning photos every time you press the shutter.
CCD signal processing/Camera circuit section
Analog signals output from the 1/1.7 type Super-CCD Honeycom VI HR (IC951), with an effective pixel count of 6.3
mega-pixels, undergo false color compensation processing, adaptive interpolation processing, amplification (AGC) and
signal mixing inside the CCD signal processing IC “BCS_MCM (IC102)” before being converted to 14-bit digital signals
(A/D) and sent to the signal processing LSI “NCS_L (IC201)”.
The CCD drive circuit, H drive, and V drive are installed in [BCS_MCM (IC102)].
Motor Circuit Section
The signal processing LSI “NCS_L (IC201)” that has received various operating switch commands manages the motor
drive IC (IC151) and controls the AF, SHUTTER, ZOOM and IRIS motors.
Imaging and Signal Processing Section
Input data from the CCD
14-bit digital image data (corresponding to 1H) that has been output from the imaging section (CCD/Camera Block) is
sent to the signal processing LSI “NCS_L (IC201)”, converted to 32-bit (16-bit x 2) data by the [internal buffer] inside this
LSI, and the image data for one frame (2848 x 2136 pix) is stored temporarily in [SD-RAM]. It is also integrated in the
[AUTO operation section] using the 32-bit the signal processing LSI “NCS_L (IC201)” image data and sent to the
BCS_MCM (IC102) to obtain the appropriate AE/AF/AWB.
Record processing to xD Card
Image data stored in SD-DRAM is sent one frame at a time to the internal [signal processing section] in the signal
processing LSI “NCS_L (IC201)”. In a process called unpacking, “32-bit to 12-bit conversion” and “pre-processing
including digital clamp, white balance and noise reduction processing, linear matrix processing, gamma correction and R/
G/B 14-bit to R/G/B 8-bit conversion” to “8-bit digital R/G/B signals to Y:Cb:Cr = 4:2:2 YC processing” are implemented in
this [signal processing section] and 8-bit Y/Cb/Cr image data are sent to the [internal buffer].
The “rearrangement of data in a format in which 8-bit Y/Cb/Cr signals are easily compressed” is done in the [internal
buffer] and after passing through the [JPEG operation block] to the [media controller], they are recorded on the xD card.
Reproduction of images from xD card
Compressed image data from the xD card is sent as 8-bit image data to the signal processing LSI “NCS_L (IC201)” then
it is sent to the [media control section], the [DMA unit] and the SD-DRAM and then it is sent to the [media controller], to
the [JPEG operation section] and to the [signal processing section].
In the [signal processing section], 8-bit Y/Cb/Cr signals are converted to 8-bit R/G/B signals and at the same time,
lettering display signals are weighted and passed through the [LCD controller to the LCD unit and displayed.
Image capture system adjustment data are stored in the Flash ROM.
LCD Unit
Digital signals sent from the signal processing LSI “NCS_L (IC201)” are sent directly to the LCD.
Power Supply Section
Power supply circuits constructed in the core of the DC IC (IC300) create the following power supplies, which are