FUJIFILM FinePix 6800 SHEMATICS
DIGITAL CAMERA
FinePix6800Zoom
SCHEMATICS
U/E/EG Model
WARNING
THE COMPONENTS INDENTIFIED BY THE MARK ON THE SCHEMATHIC DIAGRAM AND
IN THE PARTS LIST ARE CRITICAL FOR SAFETY.
PREASE REPLACE ONLY BY THE COMPORNENTS SPECIFIED ON THE SCHEMATHIC DIAGRAM
AND IN THE PARTS LIST.
IF YOU USE WITH PART NUMBER UN-SPECIFIED, IT MAY RESULT IN A FIRE AND AN
ELECTORICAL SHOCK.
FUJI PHOTO FILM CO.,LTD.
Printed in Japan 2001.03(M.A)
Ref.No.:ZM00357-200
SAFETY CHECK-OUT
After correcting the original problem, perform the following safety
check before return the product to the costomer.
FinePix6800Zoom(U/E/EG) SCHEMATICS
1.Check the area of your repair for unsoldered or
poorly soldered connections. Check the entire
board surface for solder splasher and bridges.
2. Check the interboard wiring to ensure that no
wires are ìpinchedî or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors, that were installed during a
previous repair. Point them out to the customer
and recommend their replacement.
4. Look for parts which, though functioning, show
obvious signs of deterioration. Point them out to
the customer and recommend their replacement.
5. Check the B + voltage to see it is at the values
specified.
6. Make leakage - current measurements to determine that exposed parts are acceptably insulated
from the supply circuit before returning the product
to the customer.
7. CAUTION: FOR CONTINUED
PROTECTION AGAINST FIRE
HAZARD, REPLACE ONLY WITH
SAME TYPE 2.5 AMPERES 125V
FUSE.
ATTENTION: AFIN D'ASSURER
UNE PROTECTION PERMANENTE
CONTRE LES RISQUES
D'INCENDIE, REMPLACER
UNIQUEMENT PAR UN FUSIBLE
DE MEME, TYPE 2.5 AMPERES,
125 VOLTS.
2.5A125V
2.5A125V
RISK OF FIREREPLACE FUSE
AS MARKED
8. WARNING:
TO REDUCE THE ELECTRIC
WARNING!
HIGH VOLTAGE
SHOCK, BE CAREFUL TO TOUCH
THE PARTS.
2
FinePix6800Zoom(U/E/EG) SCHEMATICS
TABLE OF CONTENTS
1. Notes on Schematics ......................................... 4
2. Basic Block Diagram
2-1.Overview of Function of Each Circuit ................................ 4
2-2.Block Function ..................................................................... 5
2-3.Block Diagram ..................................................................... 6
3.Schematics
3-1.Overall Connections ............................................................ 7
3-2.Main Board
3-2-1.Main Board Component Location(A)........................... 8
3-2-2.Main Board Component Location(B)........................... 9
3-2-3.Camera Block Schematics......................................... 10
3-2-4.Process Block Schematics(U_MODEL).................... 11
3-2-5.Process Block Schematics(E/EG_MODEL) ............. 12
3-2-6.Audio Block Schematics ............................................ 13
3-2-7.LCD Block Schematics .............................................. 14
3-3.DC Board
3-3-1.DC Board Component Location ................................ 15
3-3-2.DC Block Schematics................................................. 16
3-4.CCD Board
3-4-1.CCD Board Component Location.............................. 17
3-4-2.CCD Block Schematics .............................................. 18
3-5.ST Board
3-5-1.ST Board Component Location ................................. 19
3-5-2.Flash Block Schematics............................................. 20
3-6.XE Board
3-6-1.XE Board Component Location ................................. 21
3-6-2.XE Block Schematics ................................................. 22
3-7.KEY Board
3-7-1.KEY Board Component Location .............................. 23
3-7-2.KEY Block Schematics .............................................. 24
TABLE OF CONTENTS
page
3
1.Notes on Schematics Diagrams
1.Notes on Schematics Diagrams
Other neccessary notes are shown in each block.
1-1.Cautions
Caution when replaceing chip (leadless) parts.
Do not re-use the removed parts, but use new parts.
Be careful that the negativ side of the tantalum capacitors are susceptible to heat.
Voltage indications are omitted for capacitors other than chemical and tantalum capacitors with a
dielectric strength of 50 V or less.All units are F (p shows pF).
Chip resistors without indication are 1/10 W.
k =1000 , M =1000k
Variable resistors and semi-variable resistor are abbreviated the specification of B characteristic.
2.Basic Block
2-1.Overview of Functions of Each Circuit.
FinePix6800Zoom(U/E/EG) SCHEMATICS
Board Name Circuit Diagram Name Circuit Functions
MAIN Board CAM Block Schematic A/D conversion of CCD output Signal circuit
CCD Driver circuit
Lens/Shutter/IRIS driving circuit
PROCESS Block Schematic System control circuit / Video Signal circuit
Image signal process /USB communication circuit
LCD Block Schematic Control of LCD panel
AUDIO Block Schematics Voice Signal circuit
DC Board DC Block Schematic Power Supply/LCD Back Light
CCD Board CCD Block Schematic CCD circuit
ST Boaed ST Block Schematic Control of Flash
XE Board XE Block Schematics Luminescence
KEY Board KEY Block Schematic Operation SW circuit
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FinePix6800Zoom(U/E/EG) SCHEMATICS
2.Basic Block Diagram
2-2. Explanation of Block Functions
2-2-1. New Technology
1. The newly developed CCD (1/1.7" honeycomb array CCD sensor, approximately 3.3 million pixels, employing RGB
filters), in combination with honeycomb signal processing, allows the creation of 6 million pixel-equivalent image files.
2. Development of a new IC (SCS3D_IC) provides high-resolution image quality with 6 million pixel-output, with coring
settings optimized to brightness to reduce noise at low brightness levels without loss of resolution at high brightness
levels.
3. Use of a camera cradle connected to the PC via a USB interface, and to the AC adapter, simplifies uploading of images
and charging.
2-2-2. Main Board
(1) Imaging Circuit (cam block)
The analog video signal from the CCD (1/1.7" honeycomb array, 3.3 million pixels) is amplified, mixed with other
signal, pseudo color-corrected, and interpolation optimized in the SCS3A_IC (IC107: CSP_IC), and converted to a
12-bit digital signal which is then sent to the single-chip SCS2D_IC (IC305: CSP_IC).
(CSP_IC - Chip Size Package IC)
(2) Image Signal Processing Circuit (process block)
O Data input from the CCD
The 12-bit digital image data (1H equivalent) from the imaging section (cam block) is sent to the SCS2D_IC where
it is buffered and converted to 32-bit (16-bit x 2) data. The 32-bit image data is sent from the DMA unit within the
SCS2D_IC to the SCS3D_IC (IC304: CSP_IC), and stored in the SDRAM_IC (IC307, IC310: 128MBit). The equivalent of a single frame (2400 pixels x 900 lines) of image data is temporarily stored in the SDRAM_IC. At the same
time, AE is computed in the AUTO processing unit based on the 12-bit image data previously sent to the SCS2D_IC,
and the necessary data for AE, AWB, and AF sent to the on-board DRAM. The data is transferred to the SCS3A_IC
in serial format to ensure that the appropriate AE, AWB, and AF are available in the on-board DRAM.
O Recording image data in the SSFDC
The image data stored in the SDRAM_IC is converted from 32-bit to 12-bit data one line at a time in the internal
buffer of the SCS2D_IC, and sent to the signal processor. The 12-bit image data is converted to 8-bit Y and C
signals in the signal processing unit, and again sent to the on-board buffer. Each 8-bit Y and C signal is converted
to 8-bit Y, Y, Cb and Cr signals which are then sent to the SDRAM_IC. The image data stored in the SDRAM_IC is
compressed in the JPEG processing unit in the SCS2D_IC, and again saved in the SDRAM_IC. Following compression, the image data is recorded sequentially to the SSFDC via the media controller in the SCS2D_IC.
O Reproducing image data from the SSFDC
The compressed image data from the SSFDC is sent to the SCS2D_IC and stored in the SDRAM_IC via the media
controller. This data is decompressed in the JPEG processing unit and again stored in the SDRAM_IC. The decompressed image data is sent to the signal processing unit via the on-board buffer. The 8-bit Y, Y, Cb and Cr
signals in the image data are then converted to brightness and color difference signals in the signal processing
unit, sent from the VRAM controller to the encoder and D/A converter for conversion to analog signals, weightings
added for the character generator, and finally output as analog RGB signals (the B signal also contains the VBS
signal).
O Movies
The 12-bit digital image data output from the imaging circuits (cam block) is sent from the SCS2D_IC on-board
buffer to the signal processing unit where it is converted to 8-bit Y and C signals and sent to the VRAM (1MB) in the
VRAM controller. The image data in the VRAM is sent to the SDRAM_IC, compressed in the SCS2D_IC JPEG
processing unit, and again stored in the SDRAM_IC. The compressed data is then sent sequentially to the SSFDC
via the media controller in the SCS2D_IC.
O Image adjustment data is stored in the EEPROM IC (IC314).
(3) LCD Controller (LCD block)
O The 6-bit signal from the image signal processor IC (SCS2D_IC) is output directly to the LCD panel. The LCD
monitor (2" Type , 130,000 pixels) is the same as that used in the FinePix 4700Z (low-temperature polysilicon TFT).
2-2-3. Power Circuit (DCST board)
O The power circuit generates 16V and -8V (CCD drive), 2.5V (SCS2D_IC voltage), 3.3V (SCS3A_IC, SCS2D_IC,
SDRAM, ROM, USB, LED, keys), 5V (lens drive, strobe, LCD backlighting), 12V and 15V (LCD controller), and the
CPU_UNREG signal.
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